CN116266567A - Lead frame structure - Google Patents
Lead frame structure Download PDFInfo
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- CN116266567A CN116266567A CN202111550500.9A CN202111550500A CN116266567A CN 116266567 A CN116266567 A CN 116266567A CN 202111550500 A CN202111550500 A CN 202111550500A CN 116266567 A CN116266567 A CN 116266567A
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- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 13
- 239000005022 packaging material Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A leadframe structure, comprising: a substrate comprising opposing first and second faces, the substrate comprising: a plurality of chip loading areas; and lead areas around each chip loading area, wherein each lead area comprises a plurality of protruding lead parts, grooves extending from the first surface to the second surface are arranged between adjacent lead parts and between the lead parts and the chip loading area, each groove is provided with a narrowest part and a widest part which are distributed along the direction vertical to the surface of the substrate, and the distance between the narrowest part and the surface of the first surface of the substrate is smaller than the distance between the widest part and the surface of the first surface of the substrate. The structure can improve the reliability of the device after plastic packaging.
Description
Technical Field
The present invention relates to the field of semiconductor packaging, and in particular, to a leadframe structure.
Background
In recent years, as the size and volume of semiconductor devices continue to be miniaturized, packaging requirements in the later stages of semiconductor fabrication are becoming more and more demanding. In order to meet such a demand, various Quad Flat No-leads Package (QFN) type semiconductor devices have been proposed, which are configured by sealing a semiconductor element mounted on a mounting surface thereof with a sealing resin using a lead frame and exposing a part of a lead to the back surface.
The existing packaging processes also need to be improved continuously to meet the higher requirements.
Disclosure of Invention
The invention solves the technical problem of providing a lead frame structure so as to meet the packaging technology with higher requirements.
In order to solve the above technical problems, the present invention provides a leadframe structure, including: a substrate comprising opposing first and second faces, the substrate comprising: a plurality of chip loading areas; and lead areas around each chip loading area, wherein each lead area comprises a plurality of protruding lead parts, grooves extending from the first surface to the second surface are arranged between adjacent lead parts and between the lead parts and the chip loading area, each groove is provided with a narrowest part and a widest part which are distributed along the direction vertical to the surface of the substrate, and the distance between the narrowest part and the surface of the first surface of the substrate is smaller than the distance between the widest part and the surface of the first surface of the substrate.
Optionally, the groove comprises a first subsection and a second subsection positioned at the bottom of the first subsection, the top of the second subsection is communicated with the bottom of the first subsection, and the side wall surface of the second subsection is a concave surface.
Optionally, the narrowest portion is a bottom of the first portion and a top of the second portion, the top of the first portion in a first direction and a second direction parallel to the leadframe surface has a first dimension, the narrowest portion in the first direction and the second direction has a second dimension, a maximum dimension of the widest portion in the first direction and the second direction is a third dimension, the first direction and the second direction are perpendicular, the first dimension is greater than the second dimension, and the second dimension is less than the third dimension.
Optionally, the bottom surface of the second subsection is a concave surface, or the bottom surface of the second subsection is a plane.
Optionally, the cross section of the groove in a direction perpendicular to the surface of the lead frame is an axisymmetric pattern, and the third dimension is greater than the second dimension on one side by more than 10 micrometers.
Optionally, the groove further includes: and the top of the third part is communicated with the bottom of the second part, and the side wall surface of the third part is a concave surface.
Optionally, the bottom of the second subsection in the first direction and the second direction and the top of the third subsection in the first direction and the second direction have a fourth dimension, the largest dimension of the third subsection in the first direction being the third dimension of the widest part, the fourth dimension being smaller than the third dimension, the fourth dimension being larger than the second dimension.
Optionally, the cross section of the groove in a direction perpendicular to the surface of the lead frame is an axisymmetric pattern, and the range of the third dimension single side larger than the fourth dimension is larger than 10 micrometers.
Optionally, the bottom surface of the third subsection is a concave surface, or the bottom surface of the third subsection is a plane.
Optionally, the projected pattern of the chip loading area on the surface of the substrate is rectangular.
Optionally, the lead area includes a plurality of circles of sub-areas, the plurality of circles of sub-areas are concentrically distributed around the chip loading area, and a plurality of mutually separated lead parts are arranged in any circle of sub-areas.
Optionally, the central axes of the two adjacent circles of lead parts are not coincident.
Optionally, the substrate further includes a plurality of through holes penetrating from the first surface to the second surface of the substrate, where the through holes are located between a portion of the lead regions, or the through holes are located between a portion of the chip loading region and the lead regions.
Optionally, the substrate further includes: and a plurality of openings extending from the second face toward the first face and communicating with the recess.
Optionally, the material of the substrate includes a metal, and the metal includes copper, copper alloy or iron-nickel alloy with a nickel content of 42%.
Optionally, the dimension of the center point of the adjacent lead portion between the first direction or the second direction is 0.4 mm or more.
Optionally, the size range of the narrowest part of the groove is more than or equal to 0.1 millimeter; the depth of the groove is 50% -70% of the thickness of the substrate.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
according to the technical scheme, grooves extending from the first surface to the second surface are formed between adjacent lead parts of the lead frame structure and between the lead parts and the chip loading area, the grooves are provided with narrowest parts and widest parts which are distributed along the direction perpendicular to the surface of the substrate, and the distance between the narrowest parts and the surface of the first surface of the substrate is smaller than the distance between the widest parts and the surface of the first surface of the substrate. Therefore, the size of the groove along the direction perpendicular to the surface of the lead frame is irregularly changed, so that the plastic packaging material filled in the groove and the groove can realize a physical clamping structure during plastic packaging, the binding force of the plastic packaging material and the side wall of the groove is improved, and the reliability of a device after plastic packaging can be improved.
Further, the groove includes a first portion having a first dimension at a top in a first direction parallel to the leadframe surface and a second portion at a bottom of the first portion having a second dimension at a bottom of the first portion and a top of the second portion in the first direction, the largest dimension of the second portion in the first direction being a third dimension, the first dimension being greater than the second dimension, the second dimension being less than the third dimension. The second size is smaller than the third size, so that the plastic package material filled in the groove and the groove can realize a physical clamping structure, the binding force between the plastic package material and the side wall of the groove is improved, and the reliability of the device after plastic package is improved.
Drawings
FIGS. 1 and 2 are schematic cross-sectional views illustrating a package structure forming process according to an embodiment;
fig. 3 to 5 are schematic views of a leadframe structure according to an embodiment of the invention;
FIG. 6 is a schematic view of a leadframe structure according to another embodiment of the invention;
FIG. 7 is a schematic view of a leadframe structure according to another embodiment of the invention;
FIG. 8 is a schematic view of a leadframe structure according to another embodiment of the invention;
FIG. 9 is a schematic view of a leadframe structure according to another embodiment of the invention;
fig. 10 is a schematic view of a leadframe structure according to another embodiment of the invention.
Detailed Description
As mentioned in the background, the existing packaging process needs to be improved continuously to meet the higher requirements. The analysis will now be described with reference to specific examples.
Fig. 1 and 2 are schematic cross-sectional views illustrating a package structure forming process in an embodiment.
Referring to fig. 1, a lead frame 100 is provided, the lead frame 100 includes a pad region (not labeled), a lead portion (not labeled), and a groove 101 between the pad region and the lead portion; providing a chip 102, and fixing the chip 102 on a bonding pad area; leads 103 are provided which electrically connect the chip 102 and the lead portions.
Referring to fig. 2, a molding layer 104 is formed on the leadframe 100, the chip 102 and the leads 103 are located in the molding layer 104, and the molding layer 104 is also located in the groove 101.
The package structure, the plastic sealing layer 104 is located in the groove 101, so that the contact area between the plastic sealing layer 104 and the surface of the lead frame 100 is increased, and the bonding force between the plastic sealing layer 104 and the lead frame 100 is increased, which is beneficial to improving the reliability of the package structure.
However, since the recess 101 is a bowl-shaped structure with a wide top and a narrow bottom, the plastic layer 104 and the lead frame 100 are bonded together by a surface bonding force, and when a temperature change or an external force is encountered, delamination of the plastic layer 104 and the lead frame 100 easily occurs, so that the chip fails.
In order to solve the above-mentioned problems, the present invention provides a lead frame structure, wherein grooves extending from a first surface to a second surface are provided between adjacent lead portions of the lead frame structure and between the lead portions and a chip loading area, the grooves have narrowest portions and widest portions distributed in a direction perpendicular to a surface of a substrate, and a space between the narrowest portions and the first surface of the substrate is smaller than a space between the widest portions and the first surface of the substrate. Therefore, the size of the groove along the direction perpendicular to the surface of the lead frame is irregularly changed, so that the plastic packaging material filled in the groove and the groove can realize a physical clamping structure during plastic packaging, the binding force of the plastic packaging material and the side wall of the groove is improved, and the reliability of a device after plastic packaging can be improved.
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
Fig. 3 to 5 are schematic views of a leadframe structure according to an embodiment of the invention.
Referring to fig. 3 to 5, fig. 3 is a top view of fig. 4 and 5, fig. 4 is a schematic structural view of fig. 3 along a section line AA1, and fig. 5 is a schematic structural view of fig. 3 along a section line BB1, the leadframe structure includes:
a substrate 200, the substrate 200 comprising opposing first and second faces 201, 202, the substrate 200 comprising:
a plurality of chip loading areas I;
the lead areas around each chip loading area I include a plurality of protruding lead portions 204, and grooves 205 extending from the first surface 201 to the second surface 202 are provided between adjacent lead portions 204 and between the lead portions 204 and the chip loading area I, the grooves 205 having narrowest portions and widest portions distributed in a direction perpendicular to the surface of the substrate 200, and a distance between the narrowest portions and the surface of the first surface 201 of the substrate 200 is smaller than a distance between the widest portions II and the surface of the first surface 201 of the substrate 200.
The lead frame structure has grooves 205 extending from the first surface 201 to the second surface 202 between adjacent lead portions 204 and between the lead portions 204 and the chip loading area I, the grooves 205 have narrowest portions and widest portions distributed in a direction perpendicular to the surface of the substrate 200, and the spacing between the narrowest portions and the surface of the first surface 201 of the substrate 200 is smaller than the spacing between the widest portions and the surface of the first surface 201 of the substrate 200. Therefore, the dimensions of the grooves 205 along the direction perpendicular to the surface of the lead frame are irregularly changed, so that the plastic packaging material filled in the grooves 205 and the grooves 205 can realize a physical clamping structure during plastic packaging, the binding force between the plastic packaging material and the side walls of the grooves 205 is improved, and the reliability of the device after plastic packaging can be improved.
In this embodiment, the material of the substrate 200 includes a metal including copper, a copper alloy, or an iron-nickel alloy (42 alloy) having a nickel content of 42%.
In the present embodiment, the dimension range of the center point of the adjacent lead portion 204 between the first direction X or the second direction Y is 0.4 mm or more.
In other embodiments, the substrate further includes a plurality of through holes extending from the first side to the second side of the substrate, the through holes being located between a portion of the lead regions, or the through holes being located between a portion of the chip loading region and the lead regions.
With continued reference to fig. 3 to 5, in the present embodiment, the projected pattern of the chip loading area I on the surface of the substrate 200 is rectangular.
In this embodiment, the lead area includes a plurality of circles of sub-areas II, the circles of sub-areas II are concentrically distributed around the chip loading area I, and any circle of sub-areas I has a plurality of mutually separated lead portions 204 therein.
In this embodiment, the central axes of the lead portions 204 in the adjacent two circles of sub-regions II do not coincide. So that a multi-layered wire is subsequently implemented between the wire portion 204 and the chip loading area I.
With continued reference to fig. 3 to 5, in this embodiment, the groove 205 includes a first portion 206 and a second portion 207 located at the bottom of the first portion 206, where the top of the second portion 207 is in communication with the bottom of the first portion 206, and the sidewall surface of the second portion 207 is a concave surface.
The narrowest part is the bottom of the first subsection 206 and the top of the second subsection 207, the first subsection 206 has a first dimension d1 on the top in a first direction X and a second direction Y parallel to the surface of the lead frame, the narrowest part has a second dimension d2 in the first direction X and the second direction Y, the maximum dimension of the widest part in the first direction X and the second direction Y is a third dimension d3, the first dimension d1 is larger than the second dimension d2, the second dimension d2 is smaller than the third dimension d3, and the first direction X and the second direction Y are perpendicular to each other.
Such that the dimension of the groove 205 in the direction perpendicular to the leadframe surface is irregularly varied, the first dimension d1 being larger than the second dimension d2, the second dimension d2 being smaller than the third dimension d3. The plastic packaging material filled in the groove 205 and the narrowest part of the groove 205 can realize a physical clamping structure during plastic packaging, so that the bonding force between the plastic packaging material and the side wall of the groove 205 is improved, and the reliability of the device after plastic packaging can be improved.
In this embodiment, the bottom surface of the second section 207 is a concave surface.
In other embodiments, the bottom surface of the second subsection is planar.
In this embodiment, the cross section of the groove 205 in the direction perpendicular to the surface of the lead frame is an axisymmetric pattern, and the third dimension d3 is greater than the second dimension d2 on one side and is greater than 10 micrometers. To ensure that the plastic package material filled in the groove 205 later, the plastic package material in the second part 207 and the narrowest part of the groove 205 can realize a physical clamping structure, thereby improving the bonding force between the plastic package material and the side wall of the groove 205.
In this embodiment, the narrowest portion of the groove 205 has a size range of 0.1 mm or more; the depth of the groove 205 is 50% -70% of the thickness of the substrate.
Fig. 6 is a schematic view of a leadframe structure according to another embodiment of the invention.
Referring to fig. 6, fig. 6 is a schematic structural diagram consistent with the view angle of fig. 4, in this embodiment, the groove 205 includes a first portion 306 and a second portion 307 located at the bottom of the first portion 306, the top of the second portion 307 is communicated with the bottom of the first portion 306, and the sidewall surface of the second portion 307 is a concave surface.
The structure shown in fig. 6 differs from the structure shown in fig. 4 in that the bottom surface of the second subsection 307 is planar.
Fig. 7 is a schematic view of a leadframe structure according to another embodiment of the invention.
Referring to fig. 7, fig. 7 is a schematic structural diagram consistent with the view angle of fig. 4, in this embodiment, the groove 205 includes a first portion 406 and a second portion 407 located at the bottom of the first portion 406, the top of the second portion 407 is communicated with the bottom of the first portion 406, and the sidewall surface of the second portion 407 is a concave surface.
In this embodiment, the groove 205 further includes: a third section 408 located at the bottom of the second section 407, wherein the top of the third section 408 is in communication with the bottom of the second section 407, and the side wall surface of the third section 408 is a concave surface.
The narrowest part is the bottom of the first subsection 406 and the top of the second subsection 407, the first subsection 406 has a first dimension d1 at the top in a first direction X and a second direction Y parallel to the surface of the lead frame, the narrowest part has a second dimension d2 in the first direction X and the second direction Y, the maximum dimension of the widest part in the first direction X and the second direction Y is a third dimension d3, the first dimension d1 is larger than the second dimension d2, and the second dimension d2 is smaller than the third dimension d3.
The bottom of the second subsection 407 in the first direction X and the second direction Y and the top of the third subsection 408 in the first direction X and the second direction Y have a fourth dimension d4, the largest dimension of the third subsection 408 in the first direction being the widest part of the third dimension d3, the fourth dimension d4 being smaller than the third dimension d3, the fourth dimension d4 being larger than the second dimension d2.
The dimensions of the groove 205 in the direction perpendicular to the surface of the lead frame are irregularly varied, the first dimension d1 is larger than the second dimension d2, the second dimension d2 is smaller than the third dimension d3, the fourth dimension d4 is smaller than the third dimension d3, and the fourth dimension d4 is larger than the second dimension d2. The plastic packaging material filled in the groove 205 and the narrowest part of the groove 205 can realize a physical clamping structure during plastic packaging, so that the bonding force between the plastic packaging material and the side wall of the groove 205 is improved, and the reliability of the device after plastic packaging can be improved.
In this embodiment, the cross section of the groove 205 in the direction perpendicular to the surface of the lead frame is an axisymmetric pattern, and the third dimension d3 is greater than the fourth dimension d4 on one side and is greater than 10 micrometers.
In this embodiment, the bottom surface of the third section 408 of the groove 205 is a concave surface.
In other embodiments, the bottom surface of the third subsection is planar.
Fig. 8 is a schematic view of a leadframe structure according to another embodiment of the invention.
Referring to fig. 8, fig. 8 is a schematic structural diagram consistent with the view angle of fig. 7, in this embodiment, the groove 205 includes a first portion 506 and a second portion 507 located at the bottom of the first portion 506, the top of the second portion 507 is communicated with the bottom of the first portion 506, and the sidewall surface of the second portion 507 is a concave surface; the groove 205 further includes a third section 508 located at the bottom of the second section 507, the top of the third section 508 communicates with the bottom of the second section 507, and the sidewall surface of the third section 508 is a concave surface.
The structure shown in fig. 8 differs from the structure shown in fig. 7 in that the bottom surface of the third subsection 508 is planar.
Fig. 9 is a schematic view of a leadframe structure according to another embodiment of the invention.
Referring to fig. 9, fig. 9 is a schematic structural diagram based on fig. 4, and the structure of fig. 9 is different from that of fig. 4 in that the substrate 200 further includes: a plurality of openings 620 extend from the second face 202 toward the first face 201 and are in communication with the recess 205.
The opening 620 is communicated with the bottom of the groove 205, so that the opening 620 can be filled with the subsequent plastic packaging material, and the plastic packaging material in the opening 620 plays a further role in isolation when the multilayer lead is realized between the lead part 204 and the chip loading area I, thereby being beneficial to realizing the multilayer lead.
Fig. 10 is a schematic view of a leadframe structure according to another embodiment of the invention.
Referring to fig. 10, fig. 10 is a schematic structural diagram based on fig. 7, and the structure of fig. 10 is different from that of fig. 7 in that the substrate 200 further includes: a plurality of openings 720 extending from the second face 202 toward the first face 201 and communicating with the recess 205.
The opening 720 is communicated with the bottom of the groove 205, so that the opening 720 can be filled with the subsequent plastic packaging material, and the plastic packaging material in the opening 720 plays a further isolating role when the multilayer lead is realized between the lead part 204 and the chip loading area I, thereby being beneficial to realizing the multilayer lead.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (17)
1. A leadframe structure, comprising:
a substrate comprising opposing first and second faces, the substrate comprising:
a plurality of chip loading areas;
and lead areas around each chip loading area, wherein each lead area comprises a plurality of protruding lead parts, grooves extending from the first surface to the second surface are arranged between adjacent lead parts and between the lead parts and the chip loading area, each groove is provided with a narrowest part and a widest part which are distributed along the direction vertical to the surface of the substrate, and the distance between the narrowest part and the surface of the first surface of the substrate is smaller than the distance between the widest part and the surface of the first surface of the substrate.
2. The leadframe structure of claim 1, wherein the recess comprises a first section and a second section at a bottom of the first section, a top of the second section being in communication with a bottom of the first section, a sidewall surface of the second section being a recessed surface.
3. The leadframe structure of claim 2, wherein the narrowest portion is a bottom of a first section and a top of a second section, the first section having a first dimension in a first direction and a top of a second direction parallel to the leadframe surface, the narrowest portion having a second dimension in the first direction and the second direction, a largest dimension of the widest portion in the first direction and the second direction being a third dimension, the first direction and the second direction being perpendicular, the first dimension being greater than the second dimension, the second dimension being less than the third dimension.
4. The leadframe structure of claim 2, wherein the bottom surface of the second section is a concave surface or the bottom surface of the second section is a planar surface.
5. A leadframe structure according to claim 3, wherein the grooves have an axisymmetric pattern in cross-section in a direction perpendicular to the leadframe surface, and the third dimension is greater than the second dimension on one side by more than 10 microns.
6. The leadframe structure of claim 3, wherein the recess further comprises: and the top of the third part is communicated with the bottom of the second part, and the side wall surface of the third part is a concave surface.
7. The leadframe structure of claim 6, wherein the bottom of the second section in the first and second directions and the top of the third section in the first and second directions have a fourth dimension, the largest dimension of the third section in the first direction being the third dimension of the widest portion, the fourth dimension being less than the third dimension, the fourth dimension being greater than the second dimension.
8. The leadframe structure of claim 7, wherein the grooves have an axisymmetric pattern in cross-section in a direction perpendicular to the leadframe surface, the third dimension being greater than the fourth dimension on one side by a range of greater than 10 microns.
9. The leadframe structure of claim 6, wherein the bottom surface of the third section is a concave surface or the bottom surface of the third section is a planar surface.
10. The leadframe structure of claim 1, wherein the projected pattern of the chip loading area on the substrate surface is rectangular.
11. The leadframe structure of claim 10, wherein the lead area comprises a plurality of circles of sub-areas, the plurality of circles of sub-areas being concentrically distributed around the chip loading area, each circle of sub-areas having a plurality of mutually discrete lead portions therein.
12. The leadframe structure of claim 11, wherein the central axes of adjacent turns of the lead portions do not coincide.
13. The leadframe structure of claim 1, wherein the substrate further comprises a plurality of through holes extending from the first side of the substrate to the second side, the through holes being located between portions of the lead areas or between portions of the chip loading area and the lead areas.
14. The leadframe structure of claim 1, wherein the substrate further comprises: and a plurality of openings extending from the second face toward the first face and communicating with the recess.
15. The leadframe structure of claim 1, wherein the material of the substrate comprises a metal comprising copper, a copper alloy, or an iron-nickel alloy having a nickel content of 42%.
16. The leadframe structure of claim 1, wherein the center points of adjacent lead portions have a dimension in a range of 0.4 millimeters or more between the first direction or the second direction.
17. The leadframe structure of claim 3, wherein the narrowest portion of the recess has a dimension in the range of 0.1 mm or more; the depth of the groove is 50% -70% of the thickness of the substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111550500.9A CN116266567A (en) | 2021-12-17 | 2021-12-17 | Lead frame structure |
| TW111147056A TWI834421B (en) | 2021-12-17 | 2022-12-07 | Lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111550500.9A CN116266567A (en) | 2021-12-17 | 2021-12-17 | Lead frame structure |
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|---|---|
| CN116266567A true CN116266567A (en) | 2023-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111550500.9A Pending CN116266567A (en) | 2021-12-17 | 2021-12-17 | Lead frame structure |
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| CN (1) | CN116266567A (en) |
| TW (1) | TWI834421B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6319644B2 (en) * | 2013-10-01 | 2018-05-09 | 大日本印刷株式会社 | Lead frame, manufacturing method thereof, and manufacturing method of semiconductor device |
| EP3128539B1 (en) * | 2014-03-27 | 2020-01-08 | Renesas Electronics Corporation | Semiconductor device manufacturing method and semiconductor device |
| US9508634B2 (en) * | 2014-06-24 | 2016-11-29 | Ibis Innotech Inc. | Package structure |
| JP2017103365A (en) * | 2015-12-02 | 2017-06-08 | 新光電気工業株式会社 | Lead frame, electronic component device, and manufacturing method thereof |
| US9917039B2 (en) * | 2016-04-20 | 2018-03-13 | Amkor Technology, Inc. | Method of forming a semiconductor package with conductive interconnect frame and structure |
| JP7182374B2 (en) * | 2017-05-15 | 2022-12-02 | 新光電気工業株式会社 | Lead frame and manufacturing method thereof |
| TWI675424B (en) * | 2018-01-16 | 2019-10-21 | 鈺橋半導體股份有限公司 | Wiring substrate and stackable semiconductor assembly using the same and method of making the same |
| US11450596B2 (en) * | 2019-11-22 | 2022-09-20 | Advanced Semiconductor Engineering, Inc. | Lead frame, package structure and method for manufacturing the same |
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2021
- 2021-12-17 CN CN202111550500.9A patent/CN116266567A/en active Pending
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2022
- 2022-12-07 TW TW111147056A patent/TWI834421B/en active
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| Publication number | Publication date |
|---|---|
| TWI834421B (en) | 2024-03-01 |
| TW202326993A (en) | 2023-07-01 |
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