CN116259618A - Laminated light-emitting unit, preparation method thereof and display panel - Google Patents
Laminated light-emitting unit, preparation method thereof and display panel Download PDFInfo
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Abstract
本发明实施例公开的一种叠层发光单元,包括:第一发光组件,具有相对的顶面和底面,以及位于顶面和底面之间的多个侧面;第二发光组件,堆叠于第一发光组件的顶面;共电极,设置在多个侧面中的第一侧面,分别电连接第一发光组件和第二发光组件的负极,共电极延伸至底面;第二电极,设置在多个侧面中的第二侧面,第一侧面和第二侧面分别为不同的侧面,第二电极电连接第二发光组件的正极且与第一发光组件绝缘,第二电极延伸至底面;第一电极,与共电极和第二电极间隔设置,第一电极电连接第一发光组件的正极且与第二发光组件绝缘。本发明公开的叠层发光单元具有提高显示分辨率、窄视角显示和低色偏等特点。
A laminated light-emitting unit disclosed in an embodiment of the present invention includes: a first light-emitting component having opposite top and bottom surfaces, and a plurality of side surfaces located between the top and bottom surfaces; a second light-emitting component stacked on the first The top surface of the light-emitting component; the common electrode is arranged on the first side of the multiple sides, and is electrically connected to the negative electrodes of the first light-emitting component and the second light-emitting component respectively, and the common electrode extends to the bottom surface; the second electrode is arranged on the multiple sides In the second side, the first side and the second side are respectively different sides, the second electrode is electrically connected to the anode of the second light-emitting component and insulated from the first light-emitting component, and the second electrode extends to the bottom surface; the first electrode is connected to the common The electrode and the second electrode are spaced apart, and the first electrode is electrically connected to the anode of the first light-emitting component and insulated from the second light-emitting component. The laminated light-emitting unit disclosed by the invention has the characteristics of improved display resolution, narrow viewing angle display, low color shift and the like.
Description
技术领域technical field
本发明涉及显示技术领域,尤其涉及一种叠层发光单元、一种叠层发光单元制备方法和一种显示面板。The invention relates to the field of display technology, in particular to a laminated light-emitting unit, a method for preparing a laminated light-emitting unit and a display panel.
背景技术Background technique
由于具有自发光无需背光源的特性,越来越多的显示面板选择采用例如Micro-LED(Micro Light-Emitting Diode,微米发光二极管)显示和OLED(Organic Light-Emitting Diode,有机发光二极管)显示等新型显示技术。这类显示技术中每一个发光单元都会变成一个子像素点,现有的例如RGB彩色显示面板中,每个像素点中包括R(红色)、G(绿色)和B(蓝色)三种颜色的发光单元,分别对应R/G/B三色子像素,通过控制各个子像素对应的发光单元可实现全彩效果,即现有的RGB三色显示面板中每个像素点需要由三个灯点(发光单元)组成,如果是四色显示等更多颜色的显示面板,则每个像素点需要由更多的灯点组成,每个像素点所占用的面积也较大,并且这种结构在显示面板的窄视角应用中会存在较大的色偏。Due to the characteristics of self-illumination without backlight, more and more display panels choose to use such as Micro-LED (Micro Light-Emitting Diode, micron light-emitting diode) display and OLED (Organic Light-Emitting Diode, organic light-emitting diode) display, etc. New display technology. In this type of display technology, each light-emitting unit will become a sub-pixel. In the existing RGB color display panel, for example, each pixel includes R (red), G (green) and B (blue). The light-emitting units of the colors correspond to the R/G/B three-color sub-pixels, and the full-color effect can be realized by controlling the light-emitting units corresponding to each sub-pixel, that is, each pixel in the existing RGB three-color display panel needs to be composed of three If it is a display panel with more colors such as four-color display, each pixel needs to be composed of more light points, and the area occupied by each pixel is also larger, and this The structure will have a large color shift in the narrow viewing angle application of the display panel.
因此,亟需提供一种新的显示面板,以改善现有显示面板的显示效果。Therefore, it is urgent to provide a new display panel to improve the display effect of the existing display panel.
发明内容Contents of the invention
因此,为克服现有技术中的至少部分缺陷,本发明实施例提供了一种叠层发光单元、一种叠层发光单元制备方法和一种显示面板,具有提高显示分辨率、窄视角显示和低色偏等特点。Therefore, in order to overcome at least some of the defects in the prior art, embodiments of the present invention provide a laminated light-emitting unit, a method for manufacturing a laminated light-emitting unit, and a display panel, which have the advantages of improved display resolution, narrow viewing angle display and Features such as low color cast.
具体地,一方面,本发明一个实施例提供一种叠层发光单元,包括:第一发光组件,具有相对的顶面和底面,以及位于所述顶面和所述底面之间的多个侧面;第二发光组件,堆叠于所述第一发光组件的所述顶面;共电极,设置在所述多个侧面中的第一侧面,分别电连接所述第一发光组件和所述第二发光组件的负极,所述共电极延伸至所述底面;第二电极,设置在所述多个侧面中的第二侧面,所述第一侧面和所述第二侧面分别为不同的侧面,所述第二电极电连接所述第二发光组件的正极且与所述第一发光组件绝缘,所述第二电极延伸至所述底面;第一电极,与所述共电极和所述第二电极间隔设置,所述第一电极电连接所述第一发光组件的正极且与所述第二发光组件绝缘。Specifically, in one aspect, an embodiment of the present invention provides a laminated light-emitting unit, comprising: a first light-emitting component having opposite top surfaces and bottom surfaces, and a plurality of side surfaces located between the top surface and the bottom surface ; a second light emitting component, stacked on the top surface of the first light emitting component; a common electrode, disposed on the first side of the plurality of sides, electrically connected to the first light emitting component and the second light emitting component respectively The negative electrode of the light-emitting component, the common electrode extends to the bottom surface; the second electrode is arranged on the second side of the plurality of sides, the first side and the second side are respectively different sides, so The second electrode is electrically connected to the anode of the second light-emitting component and is insulated from the first light-emitting component, and the second electrode extends to the bottom surface; the first electrode is connected to the common electrode and the second electrode The first electrodes are arranged at intervals, and the first electrodes are electrically connected to the anode of the first light-emitting component and insulated from the second light-emitting component.
在本发明的一个实施例中,所述叠层发光单元还包括:第三发光组件,堆叠于所述第二发光组件远离所述第一发光组件的一侧;第三电极,与所述第一电极、所述第二电极和所述共电极间隔设置,设置在所述多个侧面中的第三侧面,所述第三侧面与所述第一侧面为不同的侧面;所述第三电极电连接所述第三发光组件的正极,所述第三电极与所述第一发光组件和所述第二发光组件绝缘,且延伸至所述底面。所述共电极电连接所述第三发光组件的负极;所述第一电极和所述第二电极与所述第三发光组件绝缘;所述第一电极设置在所述底面上。In an embodiment of the present invention, the stacked light-emitting unit further includes: a third light-emitting component stacked on a side of the second light-emitting component away from the first light-emitting component; a third electrode connected to the first light-emitting component An electrode, the second electrode, and the common electrode are arranged at intervals, and are arranged on a third side of the plurality of sides, and the third side is a different side from the first side; the third electrode Electrically connected to the anode of the third light emitting component, the third electrode is insulated from the first light emitting component and the second light emitting component, and extends to the bottom surface. The common electrode is electrically connected to the negative electrode of the third light-emitting component; the first electrode and the second electrode are insulated from the third light-emitting component; the first electrode is arranged on the bottom surface.
在本发明的一个实施例中,所述第一发光组件和所述第二发光组件均为无机发光结构,所述第一电极设置在所述第二侧面且延伸至所述底面或设置在所述底面;或者,所述第二发光组件为无机发光结构,所述第一发光组件为有机发光结构,所述第一电极设置在所述底面。In one embodiment of the present invention, both the first light-emitting component and the second light-emitting component are inorganic light-emitting structures, and the first electrode is arranged on the second side and extends to the bottom surface or is arranged on the the bottom surface; or, the second light-emitting component is an inorganic light-emitting structure, the first light-emitting component is an organic light-emitting structure, and the first electrode is disposed on the bottom surface.
在本发明的一个实施例中,所述第一发光组件、所述第二发光组件和所述第三发光组件均为无机发光结构。In one embodiment of the present invention, the first light-emitting component, the second light-emitting component and the third light-emitting component are all inorganic light-emitting structures.
在本发明的一个实施例中,所述第二发光组件和所述第三发光组件为无机发光结构,所述第一发光组件为有机发光结构。In an embodiment of the present invention, the second light-emitting component and the third light-emitting component are inorganic light-emitting structures, and the first light-emitting component is an organic light-emitting structure.
在本发明的一个实施例中,所述第一发光组件为红色发光组件、所述第二发光组件为绿色发光组件,所述第三发光组件为蓝色发光组件。In an embodiment of the present invention, the first light emitting component is a red light emitting component, the second light emitting component is a green light emitting component, and the third light emitting component is a blue light emitting component.
在本发明的一个实施例中,所述第二电极延伸至与所述第二侧面相邻的侧面且延伸至所述第一发光组件与所述第二发光组件之间和所述第二发光组件与所述第三发光组件之间;所述第三电极延伸至与所述第三侧面相邻的侧面且延伸至所述第一发光组件与所述第二发光组件之间和所述第二发光组件与所述第三发光组件之间。In one embodiment of the present invention, the second electrode extends to the side adjacent to the second side and extends between the first light-emitting component and the second light-emitting component and the second light-emitting component. Between the component and the third light emitting component; the third electrode extends to the side adjacent to the third side and extends between the first light emitting component and the second light emitting component and the first light emitting component Between the second light-emitting component and the third light-emitting component.
在本发明的一个实施例中,所述第一电极通过欧姆接触材料与所述第一发光组件的正极电连接,所述第二电极通过欧姆接触材料与所述第二发光组件的正极电连接,所述共电极通过欧姆接触材料与所述第一发光组件和所述第二发光组件的负极电连接。In one embodiment of the present invention, the first electrode is electrically connected to the anode of the first light-emitting component through an ohmic contact material, and the second electrode is electrically connected to the anode of the second light-emitting component through an ohmic contact material , the common electrode is electrically connected to the negative electrodes of the first light-emitting component and the second light-emitting component through an ohmic contact material.
另一方面,本发明另一个实施例提供一种叠层发光单元制备方法,包括:提供多个发光芯片,每个所述发光芯片分别包括:发光组件,具有相对的顶面和底面,以及位于所述顶面和所述底面之间的多个侧面,负电极,电连接所述发光组件的负极,设置在所述发光组件的多个侧面中的第一侧面;正电极,电连接所述发光组件的正极;所述多个发光芯片包括第一发光芯片和第二发光芯片,所述第一发光芯片还包括第一连接电极,设置在所述多个侧面中的第二侧面,所述第一侧面和所述第二侧面为不同的侧面,所述第一连接电极与所述第一发光芯片的第一发光组件绝缘,所述第一发光芯片的正电极延伸至所述第一发光芯片的底面;On the other hand, another embodiment of the present invention provides a method for manufacturing a laminated light-emitting unit, including: providing a plurality of light-emitting chips, each of which includes: a light-emitting component having opposite top and bottom surfaces, and a Multiple sides between the top surface and the bottom surface, the negative electrode is electrically connected to the negative electrode of the light-emitting component, and is arranged on the first side of the multiple sides of the light-emitting component; the positive electrode is electrically connected to the negative electrode of the light-emitting component. The anode of the light-emitting component; the plurality of light-emitting chips include a first light-emitting chip and a second light-emitting chip, and the first light-emitting chip also includes a first connection electrode, which is arranged on the second side of the plurality of sides, and the The first side and the second side are different sides, the first connection electrode is insulated from the first light-emitting component of the first light-emitting chip, and the positive electrode of the first light-emitting chip extends to the first light-emitting the bottom surface of the chip;
将所述第二发光芯片堆叠于所述第一发光芯片的所述顶面上,使所述第一发光芯片的所述负电极与所述第二发光芯片的所述负电极抵接并电连接,形成共电极;以及使所述第二发光芯片的所述正电极与所述第一发光芯片的所述第一连接电极抵接并电连接,形成第二电极。Stacking the second light-emitting chip on the top surface of the first light-emitting chip, making the negative electrode of the first light-emitting chip abut against the negative electrode of the second light-emitting chip and electrically connecting to form a common electrode; and abutting and electrically connecting the positive electrode of the second light-emitting chip to the first connection electrode of the first light-emitting chip to form a second electrode.
在本发明的一个实施例中,所述多个发光芯片还包括第三发光芯片,所述第一发光芯片还包括与所述第一连接电极间隔设置的第二连接电极,所述第二连接电极与所述第一发光芯片的所述第一发光组件绝缘且延伸至所述第一发光芯片的所述底面,所述第二发光芯片还包括与所述第二连接电极对齐的第三连接电极,所述第三连接电极与所述第二发光芯片的所述第二发光组件绝缘,所述叠层发光单元的制备方法还包括:将所述第三发光芯片堆叠于所述第二发光芯片远离所述第一发光芯片的一侧,使所述第二连接电极、所述第三连接电极与所述第三发光芯片的所述正电极依次叠层,形成第三电极,且使所述第三发光芯片的所述负电极与所述第二发光芯片的所述负电极抵接并电连接。In one embodiment of the present invention, the plurality of light-emitting chips further include a third light-emitting chip, the first light-emitting chip further includes a second connection electrode spaced apart from the first connection electrode, and the second connection electrode An electrode is insulated from the first light-emitting component of the first light-emitting chip and extends to the bottom surface of the first light-emitting chip, and the second light-emitting chip further includes a third connection aligned with the second connection electrode electrode, the third connection electrode is insulated from the second light-emitting component of the second light-emitting chip, and the preparation method of the laminated light-emitting unit further includes: stacking the third light-emitting chip on the second light-emitting unit On the side of the chip away from the first light-emitting chip, the second connection electrode, the third connection electrode and the positive electrode of the third light-emitting chip are sequentially stacked to form a third electrode, and the The negative electrode of the third light-emitting chip abuts and is electrically connected to the negative electrode of the second light-emitting chip.
在本发明的一个实施例中,所述第一发光芯片为有机发光芯片,所述第二发光芯片为无机发光芯片,所述叠层发光单元制备方法包括:在基板上蒸镀所述第一发光芯片;将制备好的第二发光芯片转移并连接至所述第一发光芯片的所述顶面上,以使所述第二发光芯片堆叠于所述第一发光芯片。In one embodiment of the present invention, the first light-emitting chip is an organic light-emitting chip, the second light-emitting chip is an inorganic light-emitting chip, and the method for preparing the laminated light-emitting unit includes: vapor-depositing the first Light-emitting chip: transferring and connecting the prepared second light-emitting chip to the top surface of the first light-emitting chip, so that the second light-emitting chip is stacked on the first light-emitting chip.
另一方面,本发明另一个实施例提供一种显示面板,包括:阵列基板;前述任一实施例所述的叠层发光单元,设置在所述阵列基板上,且电连接所述阵列基板。On the other hand, another embodiment of the present invention provides a display panel, comprising: an array substrate; the laminated light-emitting unit described in any one of the foregoing embodiments is disposed on the array substrate and electrically connected to the array substrate.
在本发明的一个实施例中,所述显示面板还包括聚光透镜,所述聚光透镜与所述阵列基板相对设置,且所述叠层发光单元位于所述聚光透镜和所述阵列基板之间、与所述聚光透镜对应设置。In an embodiment of the present invention, the display panel further includes a condensing lens, the condensing lens is arranged opposite to the array substrate, and the stacked light-emitting unit is located between the condensing lens and the array substrate. between them, corresponding to the condenser lens.
由上可知,本发明上述实施例可以达成以下一个或多个有益效果:将多个发光组件依次堆叠,并形成对应的电连接关系,使得多个发光组件可以位于同位置发光,且能独立控制发光,因此减少了发光单元的占用面积,可实现高分辨率显示,且能实现窄发光低色偏的效果。It can be seen from the above that the above-mentioned embodiments of the present invention can achieve one or more of the following beneficial effects: stacking multiple light-emitting components in sequence and forming a corresponding electrical connection relationship, so that multiple light-emitting components can emit light at the same position and can be independently controlled Light emitting, so the occupied area of the light emitting unit is reduced, high resolution display can be realized, and the effect of narrow light emission and low color shift can be realized.
通过以下参考附图的详细说明,本发明的其它方面和特征变得明显。但是应当知道,该附图仅仅为解释的目的设计,而不是作为本发明的范围的限定。还应当知道,除非另外指出,不必要依比例绘制附图,它们仅仅力图概念地说明此处描述的结构和流程。Other aspects and features of the present invention will become apparent from the following detailed description with reference to the accompanying drawings. It should be understood, however, that the drawings are designed for the purpose of illustration only, and not as limiting the scope of the present invention. It should also be understood that, unless otherwise indicated, the drawings are not necessarily drawn to scale and are merely intended to conceptually illustrate the structures and processes described herein.
附图说明Description of drawings
下面将结合附图,对本发明的具体实施方式进行详细的说明。The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.
图1为本发明一个实施例提供的一种叠层发光单元的仰视结构示意图。FIG. 1 is a schematic bottom view of a laminated light-emitting unit provided by an embodiment of the present invention.
图2为图1的1-1剖面图;Fig. 2 is 1-1 sectional view of Fig. 1;
图3为图1的2-2剖面图;Fig. 3 is the 2-2 sectional view of Fig. 1;
图4为图1的1-1剖面图的另一种实施例;Fig. 4 is another embodiment of 1-1 sectional view of Fig. 1;
图5为本发明一个实施例中第二发光芯片的俯视结构示意图;5 is a schematic top view of a second light-emitting chip in an embodiment of the present invention;
图6为图5的3-3剖面图;Fig. 6 is the 3-3 sectional view of Fig. 5;
图7为图5的4-4剖面图;Fig. 7 is a sectional view of 4-4 of Fig. 5;
图8为本发明一个实施例中第一发光芯片的仰视结构示意图;Fig. 8 is a schematic bottom view of the first light-emitting chip in an embodiment of the present invention;
图9为图8的5-5剖面图;Fig. 9 is a sectional view of 5-5 of Fig. 8;
图10为本发明一个实施例中第三发光芯片的俯视结构示意图;Fig. 10 is a schematic top view of a third light-emitting chip in an embodiment of the present invention;
图11为本发明一个实施例提供的一种显示面板的结构示意图。FIG. 11 is a schematic structural diagram of a display panel provided by an embodiment of the present invention.
【附图标记说明】[Description of Reference Signs]
100:叠层发光单元;101:顶面;102:底面;103:侧面;1031:第一侧面;100: laminated light-emitting unit; 101: top surface; 102: bottom surface; 103: side surface; 1031: first side surface;
1032:第二侧面;1033:第三侧面;10:第一发光组件;20:第二发光组件;30:第三发光组件;40:共电极;50:第一电极;60:第二电极;70:第三电极;200:发光芯片;210:发光组件;220:负电极;230:正电极;240:第一连接电极;250:第二连接电极;260:第三连接电极;201:第一发光芯片;202:第二发光芯片;203:第三发光芯片;300:显示面板;301:阵列基板;302:聚光透镜。1032: second side; 1033: third side; 10: first light emitting component; 20: second light emitting component; 30: third light emitting component; 40: common electrode; 50: first electrode; 60: second electrode; 70: third electrode; 200: light-emitting chip; 210: light-emitting component; 220: negative electrode; 230: positive electrode; 240: first connection electrode; 250: second connection electrode; 260: third connection electrode; 201:
具体实施方式Detailed ways
为使本发明的上述目的、特征和优点能够更加明显易懂,下面结合附图对本发明的具体实施方式做详细的说明。In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
为了使本领域普通技术人员更好地理解本发明的技术方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described implementation Examples are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
需要说明的是,本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应当理解这样使用的术语在适当情况下可以互换,以便这里描述的本发明实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其他步骤或单元。It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.
还需要说明的是,本发明中多个实施例的划分仅是为了描述的方便,不应构成特别的限定,各种实施例中的特征在不矛盾的情况下可以相结合,相互引用。It should also be noted that the division of multiple embodiments in the present invention is only for the convenience of description, and should not constitute a special limitation, and features in various embodiments can be combined and referred to each other if there is no contradiction.
【第一实施例】【The first embodiment】
如图1所示,其为本发明一个实施例提供的一种叠层发光单元100的仰视结构示意图,图2为图1的1-1剖面图,图3为图1的2-2剖面图,本发明一个实施例提供的一种叠层发光单元100包括第一发光组件10、第二发光组件20、共电极40、第一电极50和第二电极60。第一发光组件10具有相对的顶面101和底面102以及位于顶面101和底面102之间的多个侧面103。第二发光组件20堆叠于第一发光组件10的顶面101上,共电极40设置在多个侧面103的第一侧面1031,分别连接并导通第一发光组10和第二发光组件20的负极。第二电极60设置在多个侧面103的第二侧面1032,第一侧面1031和第二侧面1032为不同的侧面,第二电极60电连接第二发光组件20的正极且与第一发光组件10绝缘,第二电极60延伸至第一发光组件10的底面102。以下参照图1、图2和图3对本实施例提供的叠层发光单元100进行进一步的描述。As shown in FIG. 1 , it is a schematic bottom view of a stacked light-emitting
例如参照图1、图2和图3,第一发光组10件为六面体结构,具有四个侧面103,例如参照图2第一侧面1031为第一发光组件10右边的侧面103,第二侧面1032为第一发光组件10左边的侧面103,第一侧面1031和第二侧面1032为相对的两个侧面。当然在另一些实施例中,第一侧面1031和第二侧面1032例如可以是相邻的侧面,具体的例如第一侧面1031为右边的侧面103,第二侧面1032为前面或后面的侧面103,本实施例并不限制。For example, referring to FIG. 1 , FIG. 2 and FIG. 3 , the first light-emitting
第一发光组件10和第二发光组件20例如用于发出不同颜色的光,包括发光功能层和包围发光功能层的绝缘保护层,例如图2、图3中第一发光组件10无填充部分为发光功能层,单斜线填充部分为绝缘保护层,通过绝缘保护层可以实现第二电极60和第一发光组件10绝缘,以及第一电极50和第二发光组件20绝缘(第一电极50位于侧面103时),绝缘保护层上分别对应第一发光组件10和第二发光组件20的正极和负极位置设置有开口,使得共电极40通过开口实现与第一发光组件10和第二发光组件20的负极电连接、第一电极50与第一发光组件10的正极连接和第二电极60与第二发光组件20的正极连接。其中第一发光组件10例如可以是无机发光结构也可以是有机发光结构,第二发光组件20例如为无机发光结构,第一发光组件10或第二发光组件20例如为无机发光结构时,其发光功能层包括依次叠层的N掺杂半导体层、量子阱层和P掺杂半导体层,其中P掺杂半导体层即为第一发光组件10的正极,N掺杂半导体层即为第一发光组件10的负极。P掺杂半导体层和N掺杂半导体层上例如还设置有ITO膜层作为欧姆接触材料以形成欧姆接触连接。第一发光组件10例如为有机发光结构时,其发光功能层包括依次叠层的空穴注入层(HIL)、空穴传输层(HTL)、发光层(EML)、电子传输层(ETL)和电子注入层(EIL),其中空穴注入层则为第一发光组件10的正极,电子注入层则为第一发光组件10的负极,参照图4,其为第一发光组件10为有机发光结构时1-1剖面图,图2为第一发光组件10为无机发光结构的1-1剖面示意图,第一发光组件10为倒装结构。当然此处为对第一发光组件10结构的一些举例说明,并不能作为理解本实施例的限制条件。The first light-emitting
共电极40、第一电极50和第二电极60例如可以为Ni(镍)、Pt(铂)、Au(金)等常用金属电极材料,可以是单层也可以是多层,本实施例并不限制。第一电极50例如可以是如图2和图3所示的位于第一发光组件10的底面102,也可以位于侧面103(未示出),本实施例并不限制。例如图2和图3所示的结构为三层叠层的结构,本实施例的第一发光组件10和第二发光组件20分别为该三层叠层结构从下至上的第一层和第二层,当然,在本发明的其他实施例中,第一发光组件10和第二发光组件20可以参考图3所示该三层叠层结构从下至上的第二层和第三层,本实施例并不限制。当然本实施例也不限制叠层发光单元100的叠层数量,其还可以包括如图2、图3所示的三层叠层,甚至四层等更多叠层。共电极40、第一电极50和第二电极60均延伸至第一发光组件10的底面102,有利于叠层发光单元100的焊接。The
本实施例提供的叠层发光单元100中,第一发光组件10和第二发光组件20例如用于发出不同颜色的光,举例而言,例如第一发光组件10例如发红光,第二发光组件20发绿光。本实施例的叠层发光单元100工作时,可以使共电极40和第一电极50通电,第二电极60不通电,则第一发光组件10通电发出红光,第二发光组件20不发光,叠层发光单元100可发出红光。或者,使共电极40和第二电极60通电,第一电极50不通电,则第一发光组件10不发光,第二发光组件20发出绿光,叠层发光单元100发绿光。再或者使第一电极50和第二电极60都与共电极40通电,则第一发光组件10发出的红光和第二发光组件20发出的绿光混合使得叠层发光单元100发出红绿混合的光。当然以上只是举例说明,本实施例并不限制第一发光组件10和第二发光组件20的具体发光颜色。本实施例通过将第一发光组件10和第二发光组件20叠层的结构,且第一发光组件10和第二发光组件20可单独通电发光,使得每一个叠层发光单元100均能实现多种发光方式,相比于传统发光结构而言可缩小每个芯片在显示面板上占用的面积,有利于实现高分辨率显示。In the stacked light-emitting
进一步的,在一个实施例中,叠层发光单元100例如还包括第三发光组件30和第三电极70,第三发光组件30堆叠于第二发光组件20远离第一发光组件10的一侧。第三电极70与第一电极50、第二电极60和共电极40均间隔设置,设置在多个侧面103中的第三侧面1033,第三侧面1033与第一侧面1031为不同的侧面。第三电极70电连接第三发光组件30的正极,共电极40连接第三发光组件30的负极。第三电极70与第一发光组件10和第二发光组件20绝缘且延伸至第一发光组件10的底面102。第三侧面1033与第二侧面1032可以是相同的侧面也可以是不同的侧面,例如如图2和图3所示,第三侧面1033与第二侧面1032同为第一发光组件10的左边的侧面,参照图1的方位,第二电极60例如位于图1的左下角,第三电极70例如位于图1的左上角。在本发明其他的一些实施例中,也可以是例如第一侧面1031为第一发光组件10右边的侧面,第二侧面1032为第一发光组件10前边的侧面,第三侧面1033为第一发光组件10后边的侧面,本实施例并不限制。第一电极50例如设置在第一发光组件10的底面102,当然也还可以设置在与第一侧面1031不同的侧面,只需要满足与第二电极60和第三电极70间隔设置即可。其中第三发光组件70例如为无机发光结构,可参考上述第一发光组件10和第二发光组件20为无机发光结构的描述,第三发光组件70例如用于发出与第一发光组件10、第二发光组件20不同颜色的光。具体的,例如应用于RGB三色全彩显示面板中时,第一发光组件10、第二发光组件20和第三发光组件70三者各自对应发出红光、蓝光和绿光中的一种,当然也可以是其他颜色组合。由于红色无机发光结构一般采用砷化镓半导体,透光性较差,因此RGB组合中优选第一发光组件10为红色发光组件、第二发光组件20为绿色发光组件,第三发光组件70为蓝色发光组件,以保证叠层发光单元100的光出射效果。将本实施例的叠层发光单元100应用于RGB三色显示的显示面板中,对应原来RGB三个子像素灯点位置只需要设置一个层叠发光单元100,相当于每个像素位置占用的面积缩小到原来的三分之一左右,分辨率则相应的提高,有利于实现高分辨率显示。且每个像素中RGB三色的光从同一个灯点位置发出,有利于改善现有显示中RGB三色的光从不同位置发出造成的色偏现象。本发明提供的叠层发光单元100为四层或者更多层叠层结构时也可参考本实施例。Further, in one embodiment, the stacked
进一步的,在一个实施例中,参照图1、图2和图3,第二电极60延伸至与第二侧面1032相邻的侧面103,且延伸至第一发光组件10与第二发光组件20之间,和第二发光组件20与第三发光组件30之间,还可延伸至第三发光组件30远离第二发光组件20的一侧。第三电极70延伸至与第三侧面1033相邻的侧面,且延伸至第一发光组件10与第二发光组件20之间和第二发光组件20与第三发光组件30之间。共电极40例如也延伸至第一发光组件10与第二发光组件20之间和第二发光组件20与第三发光组件30之间。第二侧面1032例如为第一发光组件10左边(图1左下)的侧面103,则第二电极60还延伸至与左边相邻的的侧面103(例如图1中的上边,对应图2即为前面),第三侧面1033例如为第一发光组件10左边(图1左上)的侧面103,则第三电极70还延伸至与左边相邻的侧面103(图1中的下边,对应图3的后面)。本实施例可以增大共电极40、第二电极60和第三电极70的面积,导电效果更佳。需要注意的是,第一电极50例如也设置在侧面103时,可采用与第二电极60或第三电极70类似的延伸方式,本实施例不再赘述。Further, in one embodiment, referring to FIG. 1 , FIG. 2 and FIG. 3 , the
【第二实施例】【Second Embodiment】
本发明第二实施例提供一种叠层发光单元制备方法,例如包括:The second embodiment of the present invention provides a method for preparing a laminated light-emitting unit, for example, including:
步骤S1:提供多个发光芯片;例如为图5或图8所示的发光芯片200,每个发光芯片200分别包括发光组件210,负电极220和正电极230。发光组件210具有相对的顶面101底面102,以及位于顶面101和底面102之间的多个侧面103。负电极220电连接发光组件210的负极,设置在多个侧面103中的第一侧面1031。正电极230电连接发光组件210的正极。其中多个发光芯片200包括第一发光芯片201和第二发光芯片202,第一发光芯片201还包括第一连接电极240,第一连接电极240设置在多个侧面103中的第二侧面1032,第二侧面1032和第一侧面1031为不同的侧面,第一连接电极240与第一发光芯片201的第一发光组件10绝缘,第一发光芯片201的正电极230延伸至第一发光芯片201的第一发光组件10的底面102;Step S1: Provide a plurality of light-emitting chips; for example, the light-emitting
步骤S2:将第二发光芯片202堆叠于第一发光芯片201的顶面101上,使第一发光芯片201的负电极220与第二发光芯片202的负电极220抵接并电连接,形成共电极40,以及使第二发光芯片202的正电极230与第一发光芯片201的第一连接电极240抵接并电连接,形成第二电极60。Step S2: Stack the second light-emitting
请参照图8,其为本发明一个实施例提供的第一发光芯片201的仰视结构示意图,图9为图8中的5-5剖视图(或者6-6剖视图),图5为本发明一个实施例提供的第二发光芯片202的俯视结构示意图,图6为图5的3-3剖视图,图7为图5的4-4剖视图。可以看出第一发光芯片201的正电极230例如设置在第一发光组件10的底面102上,而第二发光芯片202的正电极230例如设置在第二侧面1032,当然,本实施例并不限制,在一些实施例中第一发光芯片201的正电极230例如也可以设置在侧面103上。本实施例提供的叠层发光单元制备方法,可以用于制备如第一实施例中所述的叠层发光单元100,关于第一发光组件10、第二发光组件20、共电极40、第二电极60的描述可以参照第一实施例中的描述,在此不再赘述,本实施例制备方法中第一发光芯片201的正电极230例如设置在第一发光组件10的底面102上,则第一发光芯片201的正电极230相当于叠层发光单元100中的第一电极50。第一发光芯片201的正电极230例如设置在第一发光组件10的侧面103上时,其可以与第二发光芯片202上对应位置电极材料共同形成叠层发光单元100的第一电极50,当然第一电极50与第二发光组件20绝缘。Please refer to FIG. 8, which is a schematic bottom view of the first light-emitting
进一步的,在一个实施例中,多个发光芯片200例如还包括第三发光芯片203,第一发光芯片201还包括与第一连接电极240间隔设置的第二连接电极250,第二连接电极250与第一发光芯片201的第一发光组件10绝缘,且延伸至第一发光芯片201的底面102,第二发光芯片202例如还包括与第二连接电极250对齐的第三连接电极260,第三连接电极260与第二发光芯片202的第二发光组件20绝缘,叠层发光单元的制备方法还包括步骤S3:将第三发光芯片203堆叠于第二发光芯片202远离第一发光芯片201的一侧,使第二连接电极250、第三连接电极260与第三发光芯片203的正电极230依次叠层,形成第三电极70,且使第三发光芯片203的负电极220与第二发光芯片202的负电极220抵接并电连接。例如参照图10,其为本发明一个实施例中第三发光芯片203的俯视结构示意图,可以看出,其正电极230与第二发光芯片202中的第三连接电极260对齐设置。Further, in one embodiment, for example, the plurality of
进一步的,本发明的一些实施例中,第一发光芯片201可以为有机发光芯片例如OLED芯片,也可以为无机发光芯片例如Micro-LED芯片,第二发光芯片202和第三发光芯片203例如为无机发光芯片,则该叠层发光单元制备方法包括:Further, in some embodiments of the present invention, the first light-emitting
步骤S11:在基板上蒸镀第一发光芯片;Step S11: evaporating the first light-emitting chip on the substrate;
步骤S21:将制备好的第二发光芯片转移并连接至第一发光芯片的顶面上,以使第二发光芯片堆叠于第一发光芯片。Step S21: Transfer and connect the prepared second light-emitting chip to the top surface of the first light-emitting chip, so that the second light-emitting chip is stacked on the first light-emitting chip.
例如还可以包括步骤S31:将制备好的第三发光芯片转移并连接至第二发光芯片远离第一发光芯片的顶面上,以使第三发光芯片堆叠于第二发光芯片。For example, step S31 may also be included: transferring and connecting the prepared third light-emitting chip to the top surface of the second light-emitting chip away from the first light-emitting chip, so that the third light-emitting chip is stacked on the second light-emitting chip.
步骤S11中的基板例如为显示面板的阵列基板,其上设置有用于驱动叠层发光单元发光的驱动电路层,第一发光芯片的第一发光组件例如为有机发光组件,包括依次叠层的空穴注入层(HIL)、空穴传输层(HTL)、发光层(EML)、电子传输层(ETL)和电子注入层(EIL),可通过蒸镀工艺依次形成。The substrate in step S11 is, for example, an array substrate of a display panel, on which a driving circuit layer for driving the stacked light-emitting units to emit light is arranged. The hole injection layer (HIL), hole transport layer (HTL), light emitting layer (EML), electron transport layer (ETL) and electron injection layer (EIL) can be formed sequentially by evaporation process.
本发明第二实施例可用于制备如第一实施例所述的叠层发光单元100,其具有与第一实施例相同的有益效果,且工艺简单。The second embodiment of the present invention can be used to prepare the laminated light-emitting
【第三实施例】[Third embodiment]
参照图11,本发明提供一种显示面板300,包括阵列基板301和叠层发光单元100,叠层发光单元100可以是上述第一实施例中的任意一种,设置在阵列基板301上且电连接阵列基板301。阵列基板301上例如设置有用于驱动叠层发光单元100的驱动电路层,驱动电路层例如可包括走线(例如数据线、扫描线)、TFT(Thin Film Transistor)薄膜晶体管以及电容等其它合适的元件。参照图11,示出了设置在衬底基板301上的三个叠层发光单元100,当然,本实施例仅为举例说明,并不限制叠层发光单元100的数量。叠层发光单元100设置在阵列基板301上时,安装方向例如为第一发光组件10与阵列基板301相邻,第二发光组件10位于第一发光组件10远离阵列基板301的一侧,叠层发光单元100通过共电极40、第一电极50和第二电极60延伸至第一发光组件10底面102的部分分别电连接阵列基板301上的驱动电路层,例如第一电极50和第二电极60分别电连接至不同的TFT薄膜晶体管,共电极40连接至驱动电路层上的公共电极,以实现对第一发光组件10和第二发光组件20的分别控制驱动。叠层发光单元100还具有第三发光组件30和第三电极70时,第三电极70延伸至第一发光组件10底面102的部分电连接阵列基板301上的驱动电路层上另一个不同的TFT薄膜晶体管上,以实现第一发光组件10、第二发光组件20和第三发光组件30的分别控制驱动。具体的,以RGB显示为例,在一个实施例中,例如第一发光组件10为红色发光组件、第二发光组件20为绿色发光组件以及第三发光组件30为蓝色发光组件,如此对应显示面板300上每一个叠层发光单元100位置,通过独立控制不同的发光组件分别发光可实现红光、绿光、蓝光、红绿混合光、蓝绿混合光、红蓝混合光、白光等多种颜色效果。对于现有RGB显示面板每个像素位置需要设置R、G、B三个灯点而言,本实施例提供的显示面板300每个像素位置只需要设置一个叠层发光单元100即可实现RGB全彩效果,每个像素位置的灯点占用面积约为原来的三分之一,可实现更高分辨率显示。并且,现有RGB显示面板每个像素位置分别从三个位置发出三种颜色光的结构,在不同视角(偏左、偏右或者居中)下三种颜色光的混合效果不同,色偏较大。而本发明实施例提供的显示面板300三种颜色光从同一位置发出,可大大降低色偏。当然,本发明实施例中并不限制叠层发光单元100的层数,层数更多也可实现更小的占用面积和更高的分辨率。Referring to FIG. 11 , the present invention provides a
进一步的,在本发明另一个实施例中,显示面板300还包括聚光透镜302,如图11所示,聚光透镜302与阵列基板301相对设置,且叠层发光单元100位于聚光透镜302和阵列基板301之间、与聚光透镜302对应设置。例如图11中示出的三个叠层发光单元100位置分别对应一个聚光透镜302,通过聚光透镜302可进一步限制叠层发光单元100的发光角度,实现窄发光效果。Furthermore, in another embodiment of the present invention, the
本发明第三实施例采用第一实施例提供的叠层发光单元100,至少具有与第一实施例相同的有益效果,在此不再赘述。The third embodiment of the present invention adopts the laminated light-emitting
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes, but as long as they do not depart from the technical solution of the present invention, the Technical Essence Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.
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