CN116230588B - Continuous conveying type cleaning machine for semiconductor silicon wafers - Google Patents
Continuous conveying type cleaning machine for semiconductor silicon wafers Download PDFInfo
- Publication number
- CN116230588B CN116230588B CN202310073118.6A CN202310073118A CN116230588B CN 116230588 B CN116230588 B CN 116230588B CN 202310073118 A CN202310073118 A CN 202310073118A CN 116230588 B CN116230588 B CN 116230588B
- Authority
- CN
- China
- Prior art keywords
- groups
- guide
- cleaning
- silicon wafers
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 70
- 235000012431 wafers Nutrition 0.000 title claims abstract description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 57
- 239000010703 silicon Substances 0.000 title claims abstract description 57
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 18
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 230000001360 synchronised effect Effects 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 241000252254 Catostomidae Species 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of wafer cleaning, in particular to a continuous conveying type cleaning machine for semiconductor silicon wafers, which realizes automatic cleaning of the silicon wafers and improves the cleaning efficiency of the silicon wafers; the ultrasonic cleaning device comprises a driving box, wherein two groups of supporting frames are symmetrically and fixedly arranged on the driving box, four groups of cleaning baskets are rotatably arranged on the driving box along the axial direction, an ultrasonic cleaning box is fixedly arranged in the middle of the driving box, and the driving box drives the four groups of cleaning baskets to synchronously and intermittently rotate; and each group of supporting frames is fixedly provided with a driving mechanism and a sheet placing frame, each group of driving mechanisms is provided with a sucker, and the sucker is used for feeding and discharging silicon wafers which are transferred to the two groups of driving mechanisms.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a continuous conveying type cleaning machine for semiconductor silicon chips.
Background
The wafer is the basic material for manufacturing semiconductor chips, and the most important raw material of semiconductor integrated circuits is silicon, so that the wafer is the corresponding silicon wafer. Silicon is widely present in the form of silicate or silicon dioxide in the nature in rock and gravel, and the manufacture of silicon wafers can be generalized to three basic steps, silicon refining and purification, single crystal silicon growth, and silicon wafer formation.
In the process of forming the silicon wafer, the silicon wafer needs to be subjected to cutting, photoetching, etching and other processes, wherein the photoetching and etching processes are all required to be cleaned, the existing cleaning equipment is simple in structure, and the wafer needs to be fed and discharged manually, so that the cleaning efficiency is affected.
Disclosure of Invention
In order to solve the technical problems, the invention provides a semiconductor silicon wafer continuous conveying type cleaning machine which can realize automatic cleaning of silicon wafers and improve the cleaning efficiency of the silicon wafers.
The invention relates to a continuous conveying type cleaning machine for semiconductor silicon wafers, which comprises a driving box, wherein two groups of supporting frames are symmetrically and fixedly arranged on the driving box, four groups of cleaning baskets are rotatably arranged on the driving box along the axial direction, an ultrasonic cleaning box is fixedly arranged in the middle of the driving box, and the driving box drives the four groups of cleaning baskets to synchronously and intermittently rotate; each group of the supporting frames are fixedly provided with a driving mechanism and a sheet placing frame, each group of the driving mechanisms is provided with a sucker, and the sucker is used for feeding and discharging silicon wafers transferred to the two groups of the driving mechanisms.
Preferably, the driving box comprises a shell fixedly installed on two groups of supporting frames, an outer guide plate is coaxially and fixedly installed on the shell, a connecting shaft is fixedly installed inside the shell, an inner guide plate is fixedly installed on the connecting shaft, a guide groove is formed between the inner wall of the outer guide plate and the outer wall of the inner guide plate, connecting rods are fixedly installed on each group of cleaning basket, a first guide pillar is rotatably installed on each connecting rod, and the first guide pillars are slidably installed in the guide grooves.
Preferably, the guide groove is formed by communicating an arc groove with the lower groove.
Preferably, the cross is installed in coaxial rotation on the connecting axle, be circumference array and run through and be provided with four first bar grooves of group on the cross, four groups first guide pillar slidable mounting respectively in four first bar grooves of group, fixed mounting has first servo motor on the shell, the driving gear is installed to first servo motor's output, coaxial fixed mounting has driven gear on the cross, driving gear and driven gear meshing are connected, wherein cross, driving gear and driven gear all are located the shell inside.
Preferably, a plurality of groups of arc grooves are arranged on the cleaning basket and the sheet placing frame and used for clamping the silicon wafer.
Preferably, the driving mechanism comprises a base fixedly mounted on the supporting frame, a vertical plate is slidably mounted on the base, a U-shaped groove and a vertical groove are formed in the vertical plate in a penetrating mode, the top end of the vertical groove coincides with the circle center of the arc of the U-shaped groove, a first guide shaft and a second guide shaft are slidably mounted in the U-shaped groove and the vertical groove respectively, one ends of the first guide shaft and the second guide shaft are fixedly provided with supporting arms, and the other ends of the first guide shaft and the second guide shaft are fixedly provided with fixing plates, and the suckers are fixedly mounted on the supporting arms.
Preferably, two groups of belt wheels are rotatably mounted on the vertical plate, a synchronous belt is sleeved on the two groups of belt wheels in a tensioning mode, a second guide post is fixedly mounted on the synchronous belt, a second strip-shaped groove is formed in the fixed plate in a penetrating mode, the second guide post is slidably mounted in the second strip-shaped groove, a second servo motor is fixedly mounted on the vertical plate, and the second servo motor is used for driving one group of belt wheels to rotate.
Preferably, the screw is rotatably arranged on the base, the screw nut is sleeved on the screw, the screw nut is fixedly connected with the vertical plate, a sliding rail parallel to the screw is further arranged on the base, a sliding block is slidably arranged on the sliding rail, the sliding block is fixedly connected with the screw nut, a third servo motor is fixedly arranged on the base, and the third servo motor drives the screw to rotate along the axis of the third servo motor by means of a transmission pair.
Preferably, the outer wall of the cleaning basket is also provided with draining holes.
Preferably, the two groups of pulleys are positioned at two ends of the vertical groove, and the connecting line of the circle centers between the two groups of pulleys is parallel to the vertical groove.
Compared with the prior art, the invention has the beneficial effects that: the silicon wafers to be cleaned are orderly stored on a left sheet placing frame, then a driving box drives four groups of cleaning baskets to synchronously rotate for 90 degrees, so that the cleaning baskets rotating to the twelve-o' clock direction of the driving box sink into an ultrasonic cleaning box, the ultrasonic cleaning box is used for carrying out ultrasonic cleaning on the silicon wafers, at the moment, the left cleaning basket is aligned with the left sheet placing frame, and the silicon wafers on the left sheet placing frame are transferred to the left cleaning basket one by one through a driving mechanism; after the ultrasonic cleaning box is used for cleaning, the driving box drives the four groups of cleaning baskets to rotate 90 degrees again, and then the right side driving mechanism transfers the cleaned silicon wafers from the right side cleaning baskets to the right side sheet placing frame, so that automatic cleaning of the silicon wafers is realized, and the cleaning efficiency of the silicon wafers is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a left side view of the structure of the present invention;
FIG. 3 is an enlarged schematic view of the structural connection of the housing to the outer guide plate or the like;
FIG. 4 is an enlarged schematic view of the structure of the interior of the housing;
FIG. 5 is an enlarged schematic view of the structure of the cross;
FIG. 6 is an enlarged schematic view of the structure of the cleaning basket;
FIG. 7 is an enlarged schematic view of the structural connection of the support frame to the drive mechanism and the like;
FIG. 8 is an enlarged schematic view of the structure of the drive mechanism;
FIG. 9 is an enlarged schematic view of a structural axis of the drive mechanism;
the reference numerals in the drawings: 1. a drive box; 2. a support frame; 3. an ultrasonic cleaning box; 4. a cleaning basket; 5. a silicon wafer; 6. a driving mechanism; 7. a suction cup; 8. a sheet holder; 9. a housing; 10. an outer guide plate; 11. a connecting shaft; 12. an inner guide plate; 13. an arc groove; 14. a lower groove; 15. a connecting rod; 16. a first guide post; 17. a cross; 18. a first bar-shaped groove; 19. a first servo motor; 20. a drive gear; 21. a driven gear; 22. an arc groove; 23. a draining hole; 24. a base; 25. a vertical plate; 26. a U-shaped groove; 27. a vertical groove; 28. a support arm; 29. a first guide shaft; 30. a second guide shaft; 31. a fixing plate; 32. a second bar-shaped groove; 33. a belt wheel; 34. a synchronous belt; 35. a second guide post; 36. a second servo motor; 37. a screw rod; 38. a lead screw nut; 39. a slide rail; 40. a slide block; 41. a third servo motor; 42. and a transmission pair.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be noted that the directions or positional relationships indicated as being "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are directions or positional relationships based on the drawings are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, or may be internal communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art. This example was written in a progressive manner.
As shown in fig. 1 to 2, the continuous conveying type cleaning machine for semiconductor silicon wafers comprises a driving box 1, wherein two groups of supporting frames 2 are symmetrically and fixedly arranged on the driving box 1, four groups of cleaning baskets 4 are rotatably arranged on the driving box 1 along the axial direction, an ultrasonic cleaning box 3 is fixedly arranged in the middle of the driving box 1, and the driving box 1 drives the four groups of cleaning baskets 4 to synchronously and intermittently rotate; each group of support frames 2 is fixedly provided with a driving mechanism 6 and a sheet placing frame 8, each group of driving mechanisms 6 is provided with a sucker 7, and the sucker 7 is used for feeding and discharging silicon wafers 5 transferred to the positions of the two groups of driving mechanisms 6;
specifically, the four groups of cleaning baskets 4 rotate clockwise, the wafer placing frame 8 on the left side supporting frame 2 is used for storing silicon wafers 5 which are not cleaned, the wafer placing frame 8 on the right side supporting frame 2 is used for storing the cleaned silicon wafers 5, the cleaning basket 4 rotating to the twelve o' clock direction of the driving box 1 sinks into the ultrasonic cleaning box 3, the driving box 1 drives the four groups of cleaning baskets 4 to rotate for 90 degrees each time and stops for a certain time after rotating, and the cleaning basket is used for cleaning the silicon wafers 5 on the cleaning basket 4 in the ultrasonic cleaning box 3, feeding the left side cleaning basket 4 and discharging the right side cleaning basket 4;
when the ultrasonic cleaning device is used, silicon wafers 5 to be cleaned are orderly stored on the left sheet frame 8, then the driving box 1 drives the four groups of cleaning baskets 4 to synchronously rotate by 90 degrees, so that the cleaning baskets 4 rotating to the twelve-o' clock direction of the driving box 1 sink into the ultrasonic cleaning box 3, the ultrasonic cleaning box 3 is used for ultrasonic cleaning of the silicon wafers 5, at the moment, the left cleaning baskets 4 are aligned with the left sheet frame 8, and the silicon wafers 5 on the left sheet frame 8 are transferred onto the left cleaning baskets 4 one by one through the driving mechanism 6; after the ultrasonic cleaning box 3 is cleaned, the driving box 1 drives the four groups of cleaning baskets 4 to rotate 90 degrees again, then the right driving mechanism 6 transfers the cleaned silicon wafers 5 from the right cleaning basket 4 to the right sheet placing frame 8, automatic cleaning of the silicon wafers 5 is realized, and cleaning efficiency of the silicon wafers is improved.
How to drive the four groups of cleaning baskets 4 to move on the driving box 1, as shown in fig. 3 to 6, the driving box 1 comprises a shell 9 fixedly installed on the two groups of supporting frames 2, an outer guide plate 10 is coaxially and fixedly installed on the shell 9, a connecting shaft 11 is fixedly installed inside the shell 9, an inner guide plate 12 is fixedly installed on the connecting shaft 11, a guide groove is formed between the inner wall of the outer guide plate 10 and the outer wall of the inner guide plate 12, and the guide groove is formed by communicating an arc groove 13 with a lower groove 14; a connecting rod 15 is fixedly arranged on each group of cleaning baskets 4, a first guide pillar 16 is rotatably arranged on the connecting rod 15, and the first guide pillar 16 is slidably arranged in the guide groove; the synchronous driving of the four groups of cleaning baskets 4 can be realized by driving the four groups of first guide posts 16 to synchronously rotate, and when the first guide posts 16 rotate to the lower grooves 14, the silicon wafers 5 on the cleaning baskets 4 can be just completely immersed in the cleaning liquid of the ultrasonic cleaning box 3;
further, a cross 17 is coaxially and rotatably arranged on the connecting shaft 11, four groups of first strip-shaped grooves 18 are formed in the cross 17 in a circumferential array penetrating manner, four groups of first guide posts 16 are respectively and slidably arranged in the four groups of first strip-shaped grooves 18, a first servo motor 19 is fixedly arranged on the shell 9, a driving gear 20 is arranged at the output end of the first servo motor 19, a driven gear 21 is coaxially and fixedly arranged on the cross 17, the driving gear 20 is in meshed connection with the driven gear 21, and the cross 17, the driving gear 20 and the driven gear 21 are all positioned in the shell 9; in this embodiment, by starting the first servo motor 19, the first servo motor 19 drives the cross 17 to rotate, and under the dual guiding effect of the four groups of first strip-shaped grooves 18 and the guiding grooves, the four groups of first guide posts 16 are driven to synchronously rotate, so that the driving control is facilitated.
In order to be convenient for deposit silicon wafer 5, be provided with multiunit arc groove 22 on washing basket 4 and the frame 8 of putting for carry out the clamping to silicon wafer 5, still be provided with on the outer wall of washing basket 4 and drip hole 23 for supply the washing liquid to get into to wash basket 4 inside and wash silicon wafer 5.
How the driving mechanism 6 drives the suction cup 7 to transfer the silicon wafer 5 specifically, as shown in fig. 7 to 9, the driving mechanism 6 comprises a base 24 fixedly mounted on the support frame 2, a vertical plate 25 is slidably mounted on the base 24, a U-shaped groove 26 and a vertical groove 27 are arranged on the vertical plate 25 in a penetrating manner, the top end of the vertical groove 27 coincides with the circle center of the arc of the U-shaped groove 26, a first guide shaft 29 and a second guide shaft 30 are slidably mounted in the U-shaped groove 26 and the vertical groove 27 respectively, one ends of the first guide shaft 29 and the second guide shaft 30 are fixedly mounted with a support arm 28, the other ends of the first guide shaft 29 and the second guide shaft 30 are fixedly mounted with a fixed plate 31, and the suction cup 7 is fixedly mounted on the support arm 28; by driving the vertical plate 25 to move left and right, the suction cup 7 can coaxially suck the silicon wafer 5 on the opposite sheet frame 8 or the cleaning basket 4; the first guide shaft 29 and the second guide shaft 30 are driven to slide in the U-shaped groove 26 and the vertical groove 27 respectively, so that the support arm 28 can be controlled to drive the sucker 7 and the silicon wafer 5 to rise firstly, then rotate 180 degrees along the top end of the vertical groove 27 and then descend; wherein the raising is for taking out the silicon wafer 5 vertically from the arc groove 22 of the cleaning basket 4, and the lowering is for storing the silicon wafer 5 in the arc groove 22 of the wafer holder 8;
further, two groups of belt wheels 33 are rotatably mounted on the vertical plate 25, the two groups of belt wheels 33 are positioned at two ends of the vertical groove 27, a circle center connecting line between the two groups of belt wheels 33 is parallel to the vertical groove 27, a synchronous belt 34 is arranged on the two groups of belt wheels 33 in a tensioning sleeve mode, a second guide post 35 is fixedly mounted on the synchronous belt 34, a second strip-shaped groove 32 is arranged on the fixing plate 31 in a penetrating mode, the second guide post 35 is slidably mounted in the second strip-shaped groove 32, a second servo motor 36 is fixedly mounted on the vertical plate 25, and the second servo motor 36 is used for driving one group of belt wheels 33 to rotate; the second servo motor 36 is controlled to start and stop, so that the two groups of belt wheels 33 drive the synchronous belt 34 to rotate, the fixed plate 31 is driven to rise under the guiding action of the second guide post 35 and the second strip-shaped groove 32, and when the fixed plate rises to the top end of the vertical groove 27, the second guide post 35 continuously rotates, so that the whole fixed plate 31 and the supporting arm 28 are driven to rotate along the axis of the second guide shaft 30, the supporting arm 28 drives the sucking disc 7 and the silicon wafer 5 to rotate, then the second guide post 35 drives the fixed plate 31 and the supporting arm 28 to horizontally descend, and the feeding and discharging travelling route of the silicon wafer 5 is conveniently controlled.
Further, a screw rod 37 is rotatably mounted on the base 24, a screw rod nut 38 is sleeved on the screw rod 37 in a threaded manner, the screw rod nut 38 is fixedly connected with the vertical plate 25, a sliding rail 39 parallel to the screw rod 37 is further arranged on the base 24, a sliding block 40 is slidably mounted on the sliding rail 39, the sliding block 40 is fixedly connected with the screw rod nut 38, a third servo motor 41 is fixedly mounted on the base 24, and the third servo motor 41 drives the screw rod 37 to rotate along the axis of the base by means of a transmission pair 42; the third servo motor 41 is controlled to rotate positively and negatively to drive the screw rod 37 to rotate positively and reversely, so that the screw rod nut 38 drives the vertical plate 25 to reciprocate leftwards and rightwards, and the screw rod nut pair is adopted to drive the vertical plate 25 to reciprocate leftwards and rightwards, thereby improving the feeding precision.
The continuous conveying type cleaning machine for the semiconductor silicon wafers is a common mechanical mode in the installation mode, the connection mode or the setting mode, and can be implemented as long as the beneficial effects of the continuous conveying type cleaning machine can be achieved.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the technical principles of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (5)
1. The continuous conveying type cleaning machine for the semiconductor silicon wafers is characterized by comprising a driving box (1), wherein two groups of supporting frames (2) are symmetrically and fixedly arranged on the driving box (1), four groups of cleaning baskets (4) are rotatably arranged on the driving box (1), an ultrasonic cleaning box (3) is fixedly arranged in the middle of the driving box (1), and the driving box (1) drives the four groups of cleaning baskets (4) to synchronously and intermittently rotate; each group of the supporting frames (2) is fixedly provided with a driving mechanism (6) and a sheet placing frame (8), each group of the driving mechanisms (6) is provided with a sucker (7), and the suckers (7) are used for feeding and discharging silicon wafers (5) which are transferred to the two groups of the driving mechanisms (6);
the driving box (1) comprises a shell (9) fixedly installed on two groups of supporting frames (2), an outer guide plate (10) is fixedly installed on the shell (9), a connecting shaft (11) is fixedly installed inside the shell (9), an inner guide plate (12) is fixedly installed on the connecting shaft (11), a guide groove is formed between the inner wall of the outer guide plate (10) and the outer wall of the inner guide plate (12), a first guide pillar (16) is rotatably installed on each group of cleaning baskets (4), and the first guide pillar (16) is slidably installed in the guide groove; wherein the guide groove is formed by communicating an arc groove (13) with a lower groove (14);
the novel intelligent automatic transmission device is characterized in that a cross (17) is coaxially and rotatably arranged on the connecting shaft (11), four groups of first strip-shaped grooves (18) are formed in the cross (17) in a penetrating mode, four groups of first guide posts (16) are respectively and slidably arranged in the four groups of first strip-shaped grooves (18), a first servo motor (19) is fixedly arranged on the shell (9), a driving gear (20) is arranged at the output end of the first servo motor (19), a driven gear (21) is coaxially and fixedly arranged on the cross (17), and the driving gear (20) is in meshed connection with the driven gear (21);
the driving mechanism (6) comprises a base (24) fixedly arranged on the supporting frame (2), a vertical plate (25) is slidably arranged on the base (24), a U-shaped groove (26) and a vertical groove (27) are formed in the vertical plate (25) in a penetrating mode, a first guide shaft (29) and a second guide shaft (30) are slidably arranged in the U-shaped groove (26) and the vertical groove (27) respectively, one ends of the first guide shaft (29) and the second guide shaft (30) are fixedly provided with a supporting arm (28), and the other ends of the first guide shaft (29) and the second guide shaft (30) are fixedly provided with a fixing plate (31), and the sucker (7) is fixedly arranged on the supporting arm (28);
two groups of pulleys (33) are rotatably mounted on the vertical plate (25), synchronous belts (34) are fixedly mounted on the two groups of pulleys (33) in a tensioning sleeve mode, second guide columns (35) are fixedly mounted on the synchronous belts (34), second strip-shaped grooves (32) are formed in the fixed plate (31) in a penetrating mode, the second guide columns (35) are slidably mounted in the second strip-shaped grooves (32), second servo motors (36) are fixedly mounted on the vertical plate (25), and the second servo motors (36) are used for driving one group of pulleys (33) to rotate.
2. A continuous conveyor type cleaning machine for semiconductor silicon wafers as claimed in claim 1, characterized in that the cleaning basket (4) and the wafer holder (8) are provided with a plurality of groups of arc grooves (22) for clamping the silicon wafers (5).
3. A continuous conveyor type cleaning machine for semiconductor silicon wafers as claimed in claim 1, characterized in that a screw (37) is rotatably mounted on the base (24), a screw nut (38) is screwed on the screw (37), the screw nut (38) is fixedly connected with the vertical plate (25), a slide rail (39) parallel to the screw (37) is further arranged on the base (24), a slide block (40) is slidably mounted on the slide rail (39), the slide block (40) is fixedly connected with the screw nut (38), a third servo motor (41) is fixedly mounted on the base (24), and the third servo motor (41) drives the screw (37) to rotate.
4. A continuous conveyor type cleaning machine for semiconductor silicon wafers as claimed in claim 2, characterized in that the outer wall of the cleaning basket (4) is further provided with water draining holes (23).
5. A continuous conveyor cleaning machine for semiconductor silicon wafers as claimed in claim 1, characterized in that the two sets of pulleys (33) are located at both ends of the vertical groove (27), and the line of the center of the circle between the two sets of pulleys (33) is parallel to the vertical groove (27).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310073118.6A CN116230588B (en) | 2023-02-07 | 2023-02-07 | Continuous conveying type cleaning machine for semiconductor silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310073118.6A CN116230588B (en) | 2023-02-07 | 2023-02-07 | Continuous conveying type cleaning machine for semiconductor silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116230588A CN116230588A (en) | 2023-06-06 |
| CN116230588B true CN116230588B (en) | 2024-03-19 |
Family
ID=86577974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310073118.6A Active CN116230588B (en) | 2023-02-07 | 2023-02-07 | Continuous conveying type cleaning machine for semiconductor silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116230588B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH113926A (en) * | 1997-06-12 | 1999-01-06 | Sony Corp | Leaf semiconductor wafer processor |
| KR20040029578A (en) * | 2002-10-01 | 2004-04-08 | 주식회사 실트론 | A device for cleaning wafer by a megasonic cleaner |
| KR20120056483A (en) * | 2010-11-25 | 2012-06-04 | 코리아테크노(주) | Wafer transfer apparatus for purge system |
| KR20180060059A (en) * | 2016-11-28 | 2018-06-07 | 에스케이실트론 주식회사 | Apparatus for wafer cleaning |
| JP2019083302A (en) * | 2017-10-30 | 2019-05-30 | 株式会社Ｅｃｐ | Wafer cleaning device and wafer cleaning method |
| CN110948384A (en) * | 2019-12-31 | 2020-04-03 | 浙江芯晖装备技术有限公司 | a cleaning device |
| CN111883468A (en) * | 2020-08-12 | 2020-11-03 | 赣州市业润自动化设备有限公司 | Silicon wafer cleaning device |
| CN112736001A (en) * | 2020-12-31 | 2021-04-30 | 至微半导体(上海)有限公司 | High-efficiency wafer box conveying device of wet cleaning equipment |
| CN216501040U (en) * | 2021-11-30 | 2022-05-13 | 安徽微芯长江半导体材料有限公司 | Energy-efficient carborundum wafer belt cleaning device |
| WO2023274008A1 (en) * | 2021-06-29 | 2023-01-05 | 北京北方华创微电子装备有限公司 | Wafer cleaning device and wafer transfer apparatus thereof |
-
2023
- 2023-02-07 CN CN202310073118.6A patent/CN116230588B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH113926A (en) * | 1997-06-12 | 1999-01-06 | Sony Corp | Leaf semiconductor wafer processor |
| KR20040029578A (en) * | 2002-10-01 | 2004-04-08 | 주식회사 실트론 | A device for cleaning wafer by a megasonic cleaner |
| KR20120056483A (en) * | 2010-11-25 | 2012-06-04 | 코리아테크노(주) | Wafer transfer apparatus for purge system |
| KR20180060059A (en) * | 2016-11-28 | 2018-06-07 | 에스케이실트론 주식회사 | Apparatus for wafer cleaning |
| JP2019083302A (en) * | 2017-10-30 | 2019-05-30 | 株式会社Ｅｃｐ | Wafer cleaning device and wafer cleaning method |
| CN110948384A (en) * | 2019-12-31 | 2020-04-03 | 浙江芯晖装备技术有限公司 | a cleaning device |
| CN111883468A (en) * | 2020-08-12 | 2020-11-03 | 赣州市业润自动化设备有限公司 | Silicon wafer cleaning device |
| CN112736001A (en) * | 2020-12-31 | 2021-04-30 | 至微半导体(上海)有限公司 | High-efficiency wafer box conveying device of wet cleaning equipment |
| WO2023274008A1 (en) * | 2021-06-29 | 2023-01-05 | 北京北方华创微电子装备有限公司 | Wafer cleaning device and wafer transfer apparatus thereof |
| CN216501040U (en) * | 2021-11-30 | 2022-05-13 | 安徽微芯长江半导体材料有限公司 | Energy-efficient carborundum wafer belt cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116230588A (en) | 2023-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108274489B (en) | Medical auxiliary manipulator | |
| CN117153765B (en) | Wafer rotary spraying cleaning device | |
| CN220367892U (en) | Wafer cleaning device | |
| CN113894634A (en) | High-precision numerical control polycrystalline silicon double-end-face grinding machine | |
| CN116230588B (en) | Continuous conveying type cleaning machine for semiconductor silicon wafers | |
| CN114068344A (en) | Cleaning and etching apparatus | |
| CN115430654A (en) | Ultrasonic silicon wafer cleaning machine | |
| CN217479567U (en) | Chemical solution liquid level sweeps device | |
| CN216631793U (en) | Spraying device of wafer cleaning equipment | |
| CN117584022A (en) | Monocrystalline silicon wafer liquid polishing device and method | |
| KR100288085B1 (en) | Scalar Type Robot for Substrate Transfer | |
| CN116845139B (en) | Solar cell etching equipment and production line | |
| CN216606403U (en) | Silicon wafer open washing device for semiconductor production | |
| TWI744988B (en) | A device for cleaning and etching | |
| CN215278836U (en) | Cleaning tank convenient for cleaning monocrystalline silicon wafer | |
| CN212145917U (en) | Ultra-thin quartz glass wafer polishing device | |
| CN211017031U (en) | Flower basket for cleaning battery piece | |
| CN220439565U (en) | Automatic wafer double-sided cleaning device | |
| CN215092509U (en) | Silica barred body circle sleeving equipment | |
| CN216389294U (en) | Wafer processing carrier | |
| CN221211002U (en) | Motor terminal box processing is with deckle edge processing device convenient to location | |
| CN218887124U (en) | Wafer cleaning machine for integrated circuit packaging | |
| CN222190697U (en) | Wafer carrying device | |
| CN221086559U (en) | Shaking mechanism of wafer cleaning tank | |
| CN222358898U (en) | Silicon block cleaning and containing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |