Disclosure of Invention
The invention discloses a copper-based metal cutting knife for cutting aluminum oxide ceramic and a preparation method thereof, wherein copper powder is used as a base, tin powder and silver powder are used as metal modifiers, potassium oxalate is added, and the blade prepared by the formula is used for cutting a ceramic substrate with a glue layer, and has the characteristics of good cutting quality and long service life.
The invention adopts the following technical scheme:
a copper-based metal cutting knife for cutting aluminum oxide ceramics is prepared by mixing copper powder, tin powder, silver powder, potassium oxalate and diamond, and then cold pressing and sintering. Preferably, conventional machining is performed after sintering to obtain the copper-based metal cutting blade for cutting aluminum oxide ceramics.
Preferably, firstly, mixing copper powder and tin powder, then adding silver powder and potassium oxalate for mixing, and then adding diamond for mixing to obtain a material; then the materials are put in 3.2 to 5 tons/cm 2 Cold pressing for 5-7 seconds, then heating to 550-650 ℃ from room temperature at a heating rate of 40-55 ℃/min, preserving heat for 10-30 minutes, then cooling along with a furnace, and performing conventional machining to obtain the copper-based metal cutting knife for cutting the aluminum oxide ceramic, wherein the conventional machining is inner hole and outer circle machining and double-end-face thinning machining.
In the invention, copper powder, tin powder, silver powder and potassium oxalate form a metal matrix, and the mass percentages of the components are as follows:
20 to 30 percent of tin powder
Silver powder 5-10%
Potassium oxalate 0.1-1.0%
Copper powder balance
Preferably, the mass percentages of the components are as follows:
22-27% of tin powder
Silver powder 7-9%
Potassium oxalate 0.3-0.8%
Copper powder balance
In the invention, the volume of the metal matrix and the diamond is 100 percent, and the concentration of the diamond is 25 to 50 percent, preferably 30 to 40 percent; the granularity of the diamond is 800# -400#.
The invention discloses an application of a copper-based metal cutting knife for cutting aluminum oxide ceramics in cutting aluminum oxide ceramics.
The invention discloses a method for cutting aluminum oxide ceramics by using the copper-based metal cutting knife for cutting aluminum oxide ceramics, which comprises the following steps of fixing the aluminum oxide ceramics and cutting by using the copper-based metal cutting knife for cutting aluminum oxide ceramics.
In the present invention, alumina ceramics are preferably alumina ceramics with a glue layer.
In the prior art, potassium oxalate is used for polishing, the reactivity of the potassium oxalate and a processed workpiece is mainly utilized, for example, an artificial stone mirror polishing grinding tool and a preparation method thereof, one or more than two of potassium tetraoxalate, potassium hydrogen oxalate and oxalic acid are combined as an acidic additive, and the artificial stone polishing grinding tool capable of obtaining a high-gloss mirror surface is obtained after heating and curing. For example, a fixed abrasive polishing pad and a deliquescent KDP crystal dry polishing method are provided, wherein reactant potassium oxalate in the polishing pad and KDP crystal are subjected to solid phase chemical reaction, and a generated transition layer is removed under the mechanical action of abrasive particles to obtain a smooth surface. For example, a solidified abrasive polishing pad and a dry polishing method of deliquescent crystal lanthanum bromide are provided, wherein a potassium oxalate reactant and lanthanum bromide crystals react in a solid phase under the action of a catalyst to generate a transition layer, and the transition layer is removed under the mechanical action of abrasive particles and the polishing pad to obtain a smooth surface. The invention adopts a new technical thought, the addition of potassium oxalate can improve the wear resistance, especially avoids the ceramic materials from being adhered to the surface of a metal binding agent in the cutting process, and simultaneously, the potassium oxalate does not influence the high-temperature sintering of a metal matrix, which is a different technical thought from the existing polishing which utilizes the reaction of potassium oxalate and a processing object.
Detailed Description
The aluminum oxide ceramic has higher hardness, the cutting quality of the aluminum oxide ceramic can be ensured only by keeping higher cutting force in the cutting process of the dicing blade, the surface quality of the existing cutter is inferior to that of a metal cutter prepared by adding potassium oxalate, the cutting force is reduced due to the fact that the cutting edge of the blade is adhered with aluminum oxide powder in the long-distance cutting process, the cutting quality of the aluminum oxide ceramic is affected, and the surface of the blade added with potassium oxalate is smooth, so that the adhesion of the aluminum oxide powder can be effectively reduced, the cutting force of long-distance cutting is improved, and the cutting quality is improved. The raw materials of the invention are all commercial products, and meet the conventional requirements of cutting blades, the specific preparation operation and cutting processing of the invention are conventional techniques, and the granularity of diamond is 800# -600#.
An embodiment is a copper-based metal cutting knife for cutting alumina ceramics, which comprises the following metal matrix components in percentage by mass:
66.5% copper powder
Tin powder 25%
Silver powder 8%
Potassium oxalate 0.5%
(1) Mixing: according to the formula proportion, a conventional mixer is adopted, firstly copper powder and tin powder are added for mixing for 1 hour, then silver powder and potassium oxalate are added for mixing for 0.5 hour, finally diamond is added for mixing for 1 hour, so that a material is obtained, 1Kg of a metal matrix is obtained, the volumes of the metal matrix and the diamond are 100%, and the concentration of the diamond is 35%;
(2) Cold press molding: sieving the material in the step (1) with a 200-mesh screen for 5 times, taking undersize material, feeding at room temperature, pressing, and applying pressure of 4 tons/cm 2 The pressure maintaining time is 6 seconds, and a cold-pressed blank body is obtained;
(3) Sintering and forming: placing the cold pressed compact in the step (2) together with a die into a sintering furnace, heating up to the final sintering temperature of 600 ℃ at the temperature of 50 ℃/min, preserving heat for 30 minutes, cooling to the room temperature along with the furnace, taking out, and removing burrs for later use;
(4) Inner hole and excircle processing: placing the sintered blank in a tool, setting the feeding speed of an internal grinding machine at 1 mu m/S, setting the rotating speed of a grinding machine by self, setting the feeding speed of an external grinding machine at 5 mu m/S, processing until the drawing requires dimensional accuracy, and then removing the electric processing burrs by using oilstones;
(5) Thinning the double end faces: placing the blank body subjected to the inner and outer circle processing in a double-end-face thinning machine, fixing a tool clamp, selecting a proper pressure, a proper rotating speed and a proper grinding wheel disc for thinning, and processing until the drawing requires dimensional accuracy to obtain a 54mm (O.D) X0.1 mm (T) X40 mm (I.D) dicing cutter.
In the above method, deburring and steps (4) and (5) are conventional techniques.
The thickness of the alumina ceramic material is 0.6mm, the alumina ceramic material is 0.4mm, the adhesive layer is 0.2mm, and the cutting speed is 7mm/s. Cutting depth is thoroughly cut.
Example one processing result: the cutter blade has no adhesive alumina powder, good quality and no obvious edge and corner breakage after cutting for 100 meters, see figure 1.
CN114472889a discloses an ultra-thin ultra-fine cutting knife of metal bond, which is used for the same cutting process, and when 72 meters are cut, a photo of a cutting angle is found, and the angle is 71 μm, see fig. 2.
On the basis of the first embodiment, potassium oxalate is omitted, the rest is unchanged, and the cutting force of the blade is reduced and the cutting quality is poor due to the fact that the blade is adhered with alumina powder in the cutting process of the dicing blade.
On the basis of the first embodiment, the potassium oxalate is replaced by ammonium bicarbonate, and the rest is unchanged, so that the dicing blade is obtained. For the same cutting process described above, only 68 meters can be cut; the added bicarbonate can not obviously improve the surface quality of the blade, and meanwhile, the ammonium bicarbonate can volatilize carbon dioxide, ammonia gas and other gases at high temperature to form air holes in the blade, so that the overall compactness of the blade is affected, and the cutting quality and the service life of the blade are affected.
Based on the first embodiment, the silver powder is replaced by nickel powder, and the rest is unchanged, so that the dicing blade is obtained, and in the cutting process, the temperature of the blade is too high to cause burn of the adhesive layer of the ceramic material.
Comparative example
A copper-based metal cutting knife for cutting alumina ceramics comprises the following metal matrix components in percentage by mass:
65.5% copper powder
Tin powder 25%
Silver powder 8%
Potassium oxalate 1.5%
The rest is the same as the example, and a dicing blade is obtained. And after too much potassium oxalate is added, the strength of the metal knife bonding agent is reduced, the cutting life of the blade is reduced, and the cutting is less than 80 meters.
The formula adopts a copper-based formula, the self-sharpening property and the chip removal capability of the dicing blade can be improved by adding oxalate, meanwhile, the copper bonding agent is modified by adopting silver powder, the strength of the dicing blade can be improved by adding silver powder, meanwhile, the dicing blade manufactured according to the formula has good heat conductivity, and the dicing blade has excellent cutting quality, can replace a resin dicing blade to be used for cutting a ceramic substrate with a glue layer, and has the characteristic of long service life of the metal dicing blade.