[go: up one dir, main page]

CN116193793A - Photoelectric sensor and assembly method thereof - Google Patents

Photoelectric sensor and assembly method thereof Download PDF

Info

Publication number
CN116193793A
CN116193793A CN202211724550.9A CN202211724550A CN116193793A CN 116193793 A CN116193793 A CN 116193793A CN 202211724550 A CN202211724550 A CN 202211724550A CN 116193793 A CN116193793 A CN 116193793A
Authority
CN
China
Prior art keywords
circuit board
knob
photoelectric sensor
positioning
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211724550.9A
Other languages
Chinese (zh)
Inventor
徐斌
钟林鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Boe Sensing Technology Co ltd
Original Assignee
Suzhou Boe Sensing Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Boe Sensing Technology Co ltd filed Critical Suzhou Boe Sensing Technology Co ltd
Priority to CN202211724550.9A priority Critical patent/CN116193793A/en
Publication of CN116193793A publication Critical patent/CN116193793A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/941Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0247Electrical details of casings, e.g. terminals, passages for cables or wiring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/064Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/18Construction of rack or frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)

Abstract

The invention relates to the technical field of photoelectric sensors, in particular to a photoelectric sensor and an assembly method thereof, wherein a potentiometer is arranged on a first circuit board, a second circuit board is arranged vertically to the first circuit board, the first circuit board is firstly arranged, then a first knob is arranged, and then the second circuit board is arranged, so that shielding of the second circuit board to the sight is avoided when the first knob is arranged, further visual assembly of the first knob and the potentiometer is realized, an operator can clearly observe the state of matching with the first knob, the assembly accuracy of the first knob is greatly improved, meanwhile, the damage probability of the first knob or the potentiometer caused by blind assembly is greatly reduced, the assembly procedure is optimized, and the assembly efficiency is improved.

Description

一种光电传感器及其装配方法Photoelectric sensor and assembly method thereof

技术领域technical field

本发明涉及光电传感器技术领域,具体涉及一种光电传感器及其装配方法。The invention relates to the technical field of photoelectric sensors, in particular to a photoelectric sensor and an assembly method thereof.

背景技术Background technique

光电传感器,也叫反射型光电开关,是一种集发射器和接收器于一体的光电传感器。当有被检测物体经过时,物体会将光电传感器发射器发射的足够量的光线反射到接收器上,接收器收到光信号,输出一个开关控制信号。A photoelectric sensor, also called a reflective photoelectric switch, is a photoelectric sensor that integrates a transmitter and a receiver. When a detected object passes by, the object will reflect a sufficient amount of light emitted by the photoelectric sensor transmitter to the receiver, and the receiver will receive the light signal and output a switch control signal.

为了调整光电传感器的灵敏度,通常在光电传感器中设置可调的电位器,并通过一调节旋钮对电位器进行转动调节,由于电位器直接固定在传感器的主电路板上,为了安装电位器必须要同时安装主电路板,这将会导致在安装调节旋钮时,主电路板会遮挡操作人员的视线,使得调节旋钮的安装处于盲装的状态,往往不能够一次性装配成功,装配效率低,而且经过多次尝试对位装配会加大调节旋钮和电位器的损坏概率。In order to adjust the sensitivity of the photoelectric sensor, an adjustable potentiometer is usually set in the photoelectric sensor, and the potentiometer is adjusted through an adjustment knob. Since the potentiometer is directly fixed on the main circuit board of the sensor, it must be installed in order to install the potentiometer. Install the main circuit board at the same time, which will cause the main circuit board to block the operator's sight when the adjustment knob is installed, so that the installation of the adjustment knob is in a state of blind installation, which often cannot be assembled successfully at one time, and the assembly efficiency is low. After many attempts to align the assembly, the probability of damage to the adjustment knob and potentiometer will increase.

发明内容Contents of the invention

因此,本发明要解决的技术问题在于克服现有技术中的上述缺陷,从而提供一种光电传感器及其装配方法。Therefore, the technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art, so as to provide a photoelectric sensor and an assembly method thereof.

为解决上述技术问题,本发明采用的技术方案如下:In order to solve the problems of the technologies described above, the technical scheme adopted in the present invention is as follows:

本发明提供一种光电传感器,其包括:透镜支架,其包括支架本体;接收透镜,所述接收透镜安装于所述支架本体上;第一电路板,其安装于所述透镜支架上,所述第一电路板位于所述支架本体外部;电位器,安装于所述第一电路板上;第一旋钮,与所述电位器位置相对应;第二电路板,其位于所述透镜支架上方,所述第二电路板与所述第一电路板相垂直。The present invention provides a photoelectric sensor, which includes: a lens bracket, which includes a bracket body; a receiving lens, where the receiving lens is installed on the bracket body; a first circuit board, which is installed on the lens bracket, the The first circuit board is located outside the bracket body; the potentiometer is installed on the first circuit board; the first knob corresponds to the position of the potentiometer; the second circuit board is located above the lens bracket, The second circuit board is perpendicular to the first circuit board.

本发明提供的光电传感器,还包括电缆卡扣,所述电缆卡扣包括:电缆,其包括内部导线,以及包绕所述内部导线的外套;封壳,其与所述外套注塑为一体;所述内部导线穿设于所述封壳,并向所述封壳内侧延伸。The photoelectric sensor provided by the present invention also includes a cable buckle, and the cable buckle includes: a cable, which includes an inner wire, and a jacket surrounding the inner wire; a casing, which is integrally molded with the jacket; The internal wires pass through the casing and extend toward the inside of the casing.

本发明提供的光电传感器,还包括壳体,所述壳体内设置有若干第一定位柱和若干导向板,所述第二电路板上设有若干与所述第一定位柱相对应的第一定位孔,所述导向板与所述支架本体抵接;所述壳体上设有容纳所述封壳的容置槽。The photoelectric sensor provided by the present invention also includes a housing, in which a number of first positioning columns and a number of guide plates are arranged, and a number of first positioning columns corresponding to the first positioning columns are arranged on the second circuit board. The positioning hole, the guide plate abuts against the bracket body; the housing is provided with a receiving groove for receiving the enclosure.

本发明提供的光电传感器,所述封壳的至少一个侧壁上具有锁定凸块或锁定凹槽,所述容置槽的内侧壁具有与所述锁定凸块或锁定凹槽相对应的锁定结构,所述容置槽通过一开口与所述壳体的内腔连通,所述内部导线通过该开口伸入至所述壳体的内腔。In the photoelectric sensor provided by the present invention, at least one side wall of the enclosure has a locking projection or a locking groove, and the inner side wall of the accommodating groove has a locking structure corresponding to the locking projection or the locking groove , the accommodating groove communicates with the inner cavity of the housing through an opening, and the internal wire extends into the inner cavity of the housing through the opening.

本发明提供的光电传感器,所述第一电路板的顶部具有向上延伸的凸块,所述第二电路板具有与所述凸块相配合的第一插槽。In the photoelectric sensor provided by the present invention, the top of the first circuit board has an upwardly extending bump, and the second circuit board has a first slot matched with the bump.

本发明提供的光电传感器,还包括第三电路板和第四电路板,所述第三电路板位于所述第二电路板上方,所述第四电路板连接于所述第二电路板的侧端面和所述第三电路板的侧端面;所述壳体内设置有至少一个第二定位柱,所述第二电路板上设有至少一个与所述第二定位柱相对应的第二定位孔。The photoelectric sensor provided by the present invention also includes a third circuit board and a fourth circuit board, the third circuit board is located above the second circuit board, and the fourth circuit board is connected to the side of the second circuit board The end face and the side end face of the third circuit board; at least one second positioning post is provided in the housing, and at least one second positioning hole corresponding to the second positioning post is provided on the second circuit board .

本发明提供的光电传感器,所述第二电路板和所述第三电路板之间设有屏蔽电路板,所述屏蔽电路板上设有与所述凸块相配合的第二插槽。In the photoelectric sensor provided by the present invention, a shielding circuit board is provided between the second circuit board and the third circuit board, and a second slot matching the protrusion is provided on the shielding circuit board.

本发明提供的光电传感器,所述屏蔽电路板为FPC,其末端沿所述第二电路板的侧面弯折延伸并固定于所述第二电路板的下表面。In the photoelectric sensor provided by the present invention, the shielding circuit board is an FPC, the end of which is bent and extended along the side of the second circuit board and fixed on the lower surface of the second circuit board.

本发明提供的光电传感器,还包括铜片,所述铜片呈U字形,其包括铜底板和位于所述铜底板两侧的铜侧板,所述铜底板位于所述第二电路板的下方,两侧的所述铜侧板分别位于所述第二电路板的两侧且分别延伸至所述第三电路板的上方,其中一侧的所述铜侧板位于所述第四电路板的外侧。The photoelectric sensor provided by the present invention further includes a copper sheet, the copper sheet is U-shaped, and includes a copper base plate and copper side plates located on both sides of the copper base plate, and the copper base plate is located below the second circuit board , the copper side plates on both sides are respectively located on both sides of the second circuit board and extend to the top of the third circuit board respectively, wherein the copper side plates on one side are located on the fourth circuit board outside.

本发明提供的光电传感器,所述透镜支架还包括至少两个弹性臂,所述弹性臂于所述支架本体的一外侧壁向外延伸,所述弹性臂具有向内延伸的定位部,所述定位部头部具有定位面;所述第一旋钮具有一杆状主体,所述杆状主体位于所述弹性臂的所述定位面之间。In the photoelectric sensor provided by the present invention, the lens bracket further includes at least two elastic arms, the elastic arms extend outward from an outer wall of the bracket body, the elastic arms have a positioning portion extending inward, the The head of the positioning part has a positioning surface; the first knob has a rod-shaped main body, and the rod-shaped main body is located between the positioning surfaces of the elastic arm.

本发明提供的光电传感器,所述定位部面向所述支架本体的一侧具有第一止退面,所述杆状主体中部具有一凸肩外圈,所述凸肩外圈的第一端具有与所述第一止退面相配合的第二止退面。In the photoelectric sensor provided by the present invention, the side of the positioning part facing the bracket body has a first anti-retraction surface, the middle part of the rod-shaped main body has a shoulder outer ring, and the first end of the shoulder outer ring has a A second anti-retraction surface matched with the first anti-retraction surface.

本发明提供的光电传感器,还包括盖体;所述盖体盖设于所述壳体上方,所述盖体上安装有第二旋钮。The photoelectric sensor provided by the present invention further includes a cover; the cover is arranged above the housing, and a second knob is installed on the cover.

本发明提供的光电传感器,还包括发射透镜,所述发射透镜安装在所述壳体上。The photoelectric sensor provided by the present invention further includes a emitting lens, and the emitting lens is installed on the casing.

本发明还提供了一种光电传感器的装配方法,包括如下步骤:The present invention also provides a method for assembling a photoelectric sensor, comprising the following steps:

S1、将所述接收透镜安装在所述支架本体上,然后将所述透镜支架安装到传感器的壳体内;S1. Install the receiving lens on the bracket body, and then install the lens bracket into the housing of the sensor;

S2、将安装有所述电位器的所述第一电路板安装在所述透镜支架上;S2. Install the first circuit board on which the potentiometer is installed on the lens holder;

S3、将所述第一旋钮穿过所述壳体与所述电位器对准装配;S3. Align and assemble the first knob through the housing with the potentiometer;

S4、将所述第二电路板安装到所述壳体内,并将其置于所述透镜支架的上方。S4. Install the second circuit board into the casing, and place it above the lens bracket.

本发明还提供了一种光电传感器的装配方法,包括如下步骤:The present invention also provides a method for assembling a photoelectric sensor, comprising the following steps:

S10、将所述接收透镜安装在所述支架本体上,然后将所述透镜支架沿着所述导向板安装到所述壳体内;S10. Install the receiving lens on the bracket body, and then install the lens bracket into the casing along the guide plate;

S20、将安装有所述电位器的所述第一电路板安装在所述透镜支架上;S20. Install the first circuit board on which the potentiometer is installed on the lens holder;

S30、将所述第一旋钮穿过所述壳体与所述电位器对准装配;S30. Align and assemble the first knob through the housing with the potentiometer;

S40、将所述第二电路板穿过所述第一定位柱,进而将所述第二电路板安装在所述透镜支架的上方;S40. Pass the second circuit board through the first positioning column, and then install the second circuit board above the lens holder;

S50、将所述第三电路板穿过所述第二定位柱,进而将所述第三电路板安装在所述第二电路板的上方;S50. Pass the third circuit board through the second positioning column, and then install the third circuit board above the second circuit board;

S60、将所述封壳的所述锁定凸块或锁定凹槽与所述容置槽的所述锁定结构相配合,从而将所述电缆卡扣安装在所述壳体上。S60. Match the locking protrusion or the locking groove of the casing with the locking structure of the receiving groove, so as to buckle and install the cable on the housing.

本发明提供的光电传感器的装配方法,所述步骤S40进一步包括:通过所述凸块与所述第一插槽相配合,从而将所述第一电路板和所述第二电路板插接。In the method for assembling a photoelectric sensor provided by the present invention, the step S40 further includes: fitting the first circuit board with the second circuit board through the protrusion fitting with the first slot.

本发明提供的光电传感器的装配方法,所述步骤S30中,先在所述第一旋钮的杆状主体上套装第一密封圈,然后将所述第一旋钮的所述凸肩外圈穿过所述至少两个弹性臂的所述定位面,进而将所述第一旋钮与所述电位器对准装配。In the assembly method of the photoelectric sensor provided by the present invention, in the step S30, the first sealing ring is first fitted on the rod-shaped body of the first knob, and then the outer ring of the shoulder of the first knob is passed through The positioning surfaces of the at least two elastic arms align and assemble the first knob and the potentiometer.

本发明提供的光电传感器的装配方法,所述步骤S30和所述步骤S40之间,还包括步骤S31:将所述铜片安装到所述透镜支架上,所述铜片的铜底板置于所述透镜支架的上表面;所述步骤S40中,将所述第二电路板安装在所述铜底板的上方。The assembly method of the photoelectric sensor provided by the present invention, between the step S30 and the step S40, further includes a step S31: installing the copper sheet on the lens holder, and placing the copper base plate of the copper sheet on the The upper surface of the lens holder; in the step S40, the second circuit board is installed above the copper base plate.

本发明提供的光电传感器的装配方法,所述步骤S50进一步包括步骤:In the assembly method of the photoelectric sensor provided by the present invention, the step S50 further includes the steps of:

S510、将所述屏蔽电路板安装在所述第二电路板的上方;S510. Install the shielding circuit board above the second circuit board;

S520、将所述第四电路板连接在所述第二电路板的侧端面;S520. Connect the fourth circuit board to the side end surface of the second circuit board;

S530、将所述第三电路板的侧端面与所述第四电路板相连接。S530. Connect the side end surface of the third circuit board to the fourth circuit board.

本发明提供的光电传感器的装配方法,所述步骤S510中,将所述屏蔽电路板的第二插槽与所述凸块插接,并将所述屏蔽电路板的所述末端通过焊接的方式固定在所述第二电路板的下表面。In the method for assembling a photoelectric sensor provided by the present invention, in the step S510, the second slot of the shielded circuit board is plugged into the bump, and the end of the shielded circuit board is soldered fixed on the lower surface of the second circuit board.

本发明提供的光电传感器的装配方法,所述步骤S520和所述步骤S530中,所述第四电路板与所述第二电路板的侧端面、所述第三电路板的侧端面均采用焊接连接。In the assembly method of the photoelectric sensor provided by the present invention, in the step S520 and the step S530, the side end faces of the fourth circuit board and the second circuit board, and the side end faces of the third circuit board are all welded connect.

本发明提供的光电传感器的装配方法,所述步骤S520与所述步骤S530之间还包括步骤S521、将所述第一定位柱凸出于所述第二电路板的顶端进行热熔,从而将所述第二电路板固定在所述壳体内;所述步骤S530之后还包括步骤S540、将所述第二定位柱凸出于所述第三电路板的顶端进行热熔,从而将所述第三电路板固定在所述壳体内。The assembly method of the photoelectric sensor provided by the present invention further includes step S521 between the step S520 and the step S530, protruding the first positioning post from the top of the second circuit board for thermal fusion, so that the The second circuit board is fixed in the housing; after the step S530, a step S540 is further included: protruding the second positioning post from the top of the third circuit board for thermal fusion, so that the first Three circuit boards are fixed in the casing.

本发明提供的光电传感器的装配方法,所述步骤S60进一步包括:将所述内部导线穿过所述开口并伸入到所述壳体的内腔。In the assembly method of the photoelectric sensor provided by the present invention, the step S60 further includes: passing the internal wire through the opening and extending into the inner cavity of the housing.

本发明提供的光电传感器的装配方法,所述步骤S60之后还包括步骤:The assembly method of the photoelectric sensor provided by the present invention further includes steps after the step S60:

S70、将所述第四电路板、所述铜片的铜侧板、所述电缆的内部导线分别与所述第三电路板进行焊接;S70. Solder the fourth circuit board, the copper side plate of the copper sheet, and the inner wire of the cable with the third circuit board respectively;

S80、向所述容置槽内填充密封胶;S80, filling the accommodating tank with sealant;

S90、将装有所述第二旋钮的所述盖体盖设在所述壳体上,在所述壳体的底部通槽处安装盖板,并将所述盖体、所述盖板与所述壳体的连接处进行焊接。S90. Install the cover with the second knob on the housing, install a cover at the bottom through groove of the housing, and connect the cover, the cover and the The joints of the housing are welded.

本发明提供的光电传感器的装配方法,所述步骤S70和S90中的焊接为超声波焊接;在所述步骤S90之前,包括将所述第二旋钮预先安装好第二密封圈和卡簧,以及将所述发射透镜预先通过点胶的方式安装在所述壳体内。In the assembly method of the photoelectric sensor provided by the present invention, the welding in the steps S70 and S90 is ultrasonic welding; before the step S90, it includes pre-installing the second sealing ring and the snap ring on the second knob, and The emitting lens is pre-installed in the housing by dispensing glue.

本发明提供的技术方案,具有如下优点:The technical scheme provided by the invention has the following advantages:

1、本发明提供的光电传感器及其装配方法,其适用于反射型光电传感器,也可以适用于其他类型的光电传感器,例如光电发射器或光电接收器;在以往电位器直接固定在传感器的主电路板上的基础上,分开设计了第一电路板和第二电路板,第一电路板作为转接板,将电位器安装在第一电路板上,第二电路板与第一电路板垂直设置,改变了以往的须先安装主电路板再安装第一旋钮的装配方式,本发明实现了先安装第一电路板,再安装第一旋钮,后安装第二电路板,避免在安装第一旋钮时第二电路板对视线的遮挡,进而实现了第一旋钮与电位器的可视化装配,操作人员能够清晰地观察到定位器与第一旋钮的配合状态,大大提高了第一旋钮的装配准确率,同时也大大降低了第一旋钮或电位器由于盲装而导致的损坏几率。1. The photoelectric sensor provided by the present invention and its assembly method are suitable for reflective photoelectric sensors, and can also be applied to other types of photoelectric sensors, such as photoelectric transmitters or photoelectric receivers; in the past, the potentiometer was directly fixed on the main body of the sensor. On the basis of the circuit board, the first circuit board and the second circuit board are designed separately, the first circuit board is used as an adapter board, the potentiometer is installed on the first circuit board, and the second circuit board is perpendicular to the first circuit board The setting has changed the previous assembly method in which the main circuit board must be installed first and then the first knob. When the knob is turned, the second circuit board blocks the line of sight, thereby realizing the visual assembly of the first knob and the potentiometer, and the operator can clearly observe the matching state of the positioner and the first knob, which greatly improves the assembly accuracy of the first knob The rate is also greatly reduced, and the probability of damage to the first knob or potentiometer due to blind installation is also greatly reduced.

2、本发明提供的光电传感器及其装配方法,基于第一电路板和第二电路板的设计,从而将第二电路板和第三电路板的装配工序后置,进而使得电缆的穿线和焊接工序后置,只需在装配盖体之前进行穿线、点胶、焊接的工序,从而优化了装配工序,提高了装配效率,避免了在前期装配中就要安装好电路板以及焊接好电缆,从而在后续的整个装配过程中都需要拉着电缆,不利于在生产线上的输送的弊端。2. The photoelectric sensor and its assembly method provided by the present invention are based on the design of the first circuit board and the second circuit board, so that the assembly process of the second circuit board and the third circuit board is rearranged, so that the threading and welding of the cables The post-processing process only needs to be threaded, glued, and welded before assembling the cover, thereby optimizing the assembly process and improving assembly efficiency, avoiding the need to install circuit boards and solder cables in the early assembly, thereby The cable needs to be pulled during the entire subsequent assembly process, which is not conducive to the disadvantages of transportation on the production line.

3、本发明提供的光电传感器及其装配方法,其电缆卡扣的封壳与电缆外套注塑为一体,可以保证电缆与封壳之间没有间隙,可以提高电缆周圈的密封效果;封壳的至少一个侧壁上具有锁定凸块或锁定凹槽的锁定结构,适于与传感器外壳相匹配锁定,从而提高装配精度;传感器壳体具有容纳封壳的容置槽,容置槽作为一个单独的腔体,其通过一个开口与壳体的内腔连通,引导内部导线的穿入,该容置槽的内部可以完全填充满密封胶,并密封开口,提高光电传感器的密封效果,并避免了现有的单独穿线后点胶,存在点胶不均匀,密封性下降的问题。3. In the photoelectric sensor and its assembly method provided by the present invention, the casing of the cable buckle and the cable jacket are injection molded as one, which can ensure that there is no gap between the cable and the casing, and can improve the sealing effect of the cable circumference; At least one side wall has a locking projection or a locking groove locking structure, which is suitable for matching and locking with the sensor housing, thereby improving the assembly accuracy; The cavity communicates with the inner cavity of the housing through an opening to guide the penetration of the internal wires. The interior of the accommodating groove can be completely filled with sealant and seal the opening to improve the sealing effect of the photoelectric sensor and avoid Some glues are dispensed after threading alone, and there are problems of uneven dispensing and decreased sealing performance.

4、本发明提供的光电传感器及其装配方法,在安装接收透镜的支架本体外延伸出弹性臂,第一旋钮直接穿过弹性臂的定位部即可实现对第一旋钮的定位,无需单独设置一道卡装卡簧的工序,从而简化了装配,并且,也节省了制作卡簧的人工成本和材料成本。4. In the photoelectric sensor and its assembly method provided by the present invention, the elastic arm is extended outside the bracket body on which the receiving lens is installed, and the first knob can be positioned directly through the positioning part of the elastic arm without separate setting A process of clamping and installing the circlip simplifies the assembly, and also saves the labor cost and material cost of making the circlip.

5、本发明提供的光电传感器及其装配方法,第一旋钮的杆状主体具有一凸肩外圈,凸肩外圈在穿过定位部的过程中,因凸肩外圈的宽度较大,对定位部产生挤压力,使得弹性臂向外扩张,凸肩外圈穿过之后,弹性臂在弹性回复力的作用下向内收拢,从而将第一旋钮定位,操作简单;弹性臂的定位部具有第一止退面,第一旋钮的凸肩外圈具有与所述第一止退面相配合的第二止退面,凸肩外圈穿过定位部之后,通过第一止退面和第二止退面的配合能够避免第一旋钮的脱落,第一旋钮无论是被旋转还是被外力拉动,由于第一止退面的阻挡作用,第一旋钮都不会从定位部被拉出。5. In the photoelectric sensor and its assembly method provided by the present invention, the rod-shaped main body of the first knob has a shouldered outer ring. When the shouldered outer ring passes through the positioning part, due to the larger width of the shouldered outer ring, Extrusion force is generated on the positioning part, so that the elastic arm expands outward. After the outer ring of the shoulder passes through, the elastic arm is retracted inward under the action of the elastic restoring force, thereby positioning the first knob, and the operation is simple; the positioning of the elastic arm The part has a first backstop surface, and the shoulder outer ring of the first knob has a second backstop surface matched with the first backstop surface. After the shoulder outer ring passes through the positioning part, it passes through the first backstop surface and The cooperation of the second anti-retraction surface can prevent the first knob from falling off. No matter whether the first knob is rotated or pulled by external force, the first knob will not be pulled out from the positioning part due to the blocking effect of the first anti-retraction surface.

附图说明Description of drawings

为了更清楚地说明本发明具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the specific implementation of the present invention or the technical solutions in the prior art, the following will briefly introduce the accompanying drawings that need to be used in the specific implementation or description of the prior art. Obviously, the accompanying drawings in the following description The drawings show some implementations of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

图1为本发明实施例中提供的光电传感器的示意图一;Fig. 1 is a schematic diagram 1 of a photoelectric sensor provided in an embodiment of the present invention;

图2为本发明实施例中提供的光电传感器的示意图二;2 is a second schematic diagram of the photoelectric sensor provided in the embodiment of the present invention;

图3为本发明实施例中提供的光电传感器的内部部分结构示意图一;FIG. 3 is a schematic diagram of the internal structure of the photoelectric sensor provided in the embodiment of the present invention;

图4为本发明实施例中提供的光电传感器的内部部分结构示意图二;FIG. 4 is a second schematic diagram of the internal structure of the photoelectric sensor provided in the embodiment of the present invention;

图5为本发明实施例中提供的光电传感器的内部部分结构示意图三;Fig. 5 is a schematic diagram of the internal structure of the photoelectric sensor provided in the embodiment of the present invention III;

图6为本发明实施例中提供的光电传感器的内部部分结构示意图四;FIG. 6 is a fourth schematic diagram of the internal structure of the photoelectric sensor provided in the embodiment of the present invention;

图7为本发明实施例中提供的光电传感器的内部部分结构示意图五;FIG. 7 is a schematic diagram of the internal structure of the photoelectric sensor provided in the embodiment of the present invention (5);

图8为本发明实施例中提供的光电传感器的内部部分结构示意图六;Fig. 8 is a schematic diagram six of the internal structure of the photoelectric sensor provided in the embodiment of the present invention;

图9为本发明实施例中提供的光电传感器的内部部分结构示意图七;FIG. 9 is a schematic diagram of the internal structure of the photoelectric sensor provided in the embodiment of the present invention VII;

图10为本发明实施例中提供的光电传感器的内部部分结构示意图八;FIG. 10 is a schematic diagram eight of the internal structure of the photoelectric sensor provided in the embodiment of the present invention;

图11为本发明实施例中提供的光电传感器的内部部分结构示意图九;Fig. 11 is a schematic diagram of the internal structure of the photoelectric sensor provided in the embodiment of the present invention (9);

图12为本发明实施例中提供的第一电路板和第二电路板的连接示意图;Fig. 12 is a schematic diagram of the connection between the first circuit board and the second circuit board provided in the embodiment of the present invention;

图13为本发明实施例中提供的铜片与第二电路板、第三电路板、第四电路板的安装示意图;Fig. 13 is a schematic diagram of the installation of the copper sheet and the second circuit board, the third circuit board, and the fourth circuit board provided in the embodiment of the present invention;

图14为本发明实施例中提供的光电传感器的壳体示意图一;Fig. 14 is a first schematic diagram of the housing of the photoelectric sensor provided in the embodiment of the present invention;

图15为本发明实施例中提供的光电传感器的壳体示意图二;Figure 15 is a second schematic diagram of the housing of the photoelectric sensor provided in the embodiment of the present invention;

图16为本发明实施例中提供的电缆卡扣的示意图;Fig. 16 is a schematic diagram of a cable buckle provided in an embodiment of the present invention;

图17为本发明实施例中提供的第一旋钮的示意图一;Fig. 17 is a first schematic diagram of the first knob provided in the embodiment of the present invention;

图18为本发明实施例中提供的第一旋钮的示意图二。Fig. 18 is a second schematic diagram of the first knob provided in the embodiment of the present invention.

附图标记说明:Explanation of reference signs:

1-盖体,2-壳体,21-第一定位柱,22-导向板,23-安装槽,24-光孔,25-锁定凹槽,26-容置槽,27-第二定位柱,28-盖板,29-开口,3-电缆卡扣,31-封壳,311-锁定凸块,4-接收透镜,5-发射透镜,6-支架本体,61-边肋,62-中间肋,7-第二电路板,71-第一定位孔,72-光源,73-第一插槽,8-第一旋钮,81-凸肩外圈,811-第二止退面,812-第二导向斜面,82-第一密封圈,9-弹性臂,91-定位面,92-第一止退面,93-第一导向斜面,94-弹性支耳,10-第三电路板,101-第二定位孔,11-屏蔽电路板,12-第四电路板,13-铜片,131-铜底板,132-铜侧板,14-第一电路板,141-凸起,15-电位器,16-第二旋钮,161-第二密封圈,162-卡簧。1-cover, 2-housing, 21-first positioning column, 22-guide plate, 23-installation groove, 24-light hole, 25-locking groove, 26-accommodating groove, 27-second positioning column , 28-cover plate, 29-opening, 3-cable buckle, 31-shell, 311-locking protrusion, 4-receiving lens, 5-transmitting lens, 6-bracket body, 61-side rib, 62-middle Rib, 7-second circuit board, 71-first positioning hole, 72-light source, 73-first slot, 8-first knob, 81-shoulder outer ring, 811-second anti-retraction surface, 812- The second guide slope, 82-the first sealing ring, 9-the elastic arm, 91-the positioning surface, 92-the first stop surface, 93-the first guide slope, 94-the elastic lug, 10-the third circuit board, 101-second positioning hole, 11-shielding circuit board, 12-fourth circuit board, 13-copper sheet, 131-copper bottom plate, 132-copper side plate, 14-first circuit board, 141-protrusion, 15- Potentiometer, 16-the second knob, 161-the second sealing ring, 162-circlip.

具体实施方式Detailed ways

下面将结合附图对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性。In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention. Unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be interpreted in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, or an internal communication between two components. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

此外,下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

实施例1Example 1

本实施例提供一种光电传感器,需要说明的是,其适用于反射型光电传感器,也可以适用于其他类型的光电传感器,例如光电发射器或光电接收器等。为方便介绍,本实施例以反射型光电传感器为例进行说明。如图1-18所示,该光电传感器包括盖体1,壳体2以及电缆卡扣3,所述盖体1盖设于壳体2的顶部,电缆卡扣3位于壳体2的侧壁,由盖体1、壳体2、电缆卡扣3形成一个密封的光电传感器外壳,其内安装有其他零部件。This embodiment provides a photoelectric sensor. It should be noted that it is applicable to reflective photoelectric sensors, and may also be applicable to other types of photoelectric sensors, such as photoelectric transmitters or photoelectric receivers. For the convenience of introduction, this embodiment takes a reflective photoelectric sensor as an example for illustration. As shown in Figure 1-18, the photoelectric sensor includes a cover 1, a housing 2 and a cable buckle 3, the cover 1 is set on the top of the housing 2, and the cable buckle 3 is located on the side wall of the housing 2 , A sealed photoelectric sensor housing is formed by the cover 1, the housing 2 and the cable buckle 3, and other components are installed in it.

本实施例提供的光电传感器,如图3所示,其包括透镜支架、接收透镜4、发射透镜5,其中,透镜支架包括支架本体6,接收透镜4安装在支架本体6上,其中,支架本体6和接收透镜4之间可为卡接连接,例如,在接收透镜4的边部设置有卡扣,支架本体6上设置有与卡扣相对应的卡槽,从而实现了支架本体6和接收透镜4的卡接;或者,在支架本体6上设置卡扣以及在接收透镜4上设置相对应的卡槽;发射透镜5并没有通过支架安装的形式进行安装,而是采用点胶的手段直接集成在壳体2内部,如此能够降低壳体2在结构上的复杂程度,进而降低生产模具的复杂程度,便于制造;当然,在其他可选的实施例中,发射透镜5也可以采用支架安装的手段安装于壳体2内;可选地,支架本体6的整体结构可呈方形体。The photoelectric sensor provided by this embodiment, as shown in Figure 3, includes a lens holder, a receiving lens 4, and a transmitting lens 5, wherein the lens holder includes a holder body 6, and the receiving lens 4 is installed on the holder body 6, wherein the holder body 6 and the receiving lens 4 can be snap-in connection, for example, a buckle is provided on the edge of the receiving lens 4, and a slot corresponding to the buckle is provided on the bracket body 6, thereby realizing the bracket body 6 and the receiving lens The clamping of the lens 4; or, a buckle is set on the bracket body 6 and a corresponding slot is set on the receiving lens 4; the transmitting lens 5 is not installed in the form of bracket installation, but directly by means of dispensing. Integrating inside the shell 2 can reduce the structural complexity of the shell 2, thereby reducing the complexity of the production mold and making it easy to manufacture; of course, in other optional embodiments, the emitting lens 5 can also be installed with a bracket The means are installed in the housing 2; optionally, the overall structure of the bracket body 6 can be in the shape of a square.

需要说明的是,在其他类型的光电传感器中,透镜的设置会存在不同,例如,在光电发射器中只有发射透镜,则只需在支架本体上安装发射透镜即可;而在光电接收器中只有接收透镜,则只需在支架本体上安装接收透镜即可。It should be noted that in other types of photoelectric sensors, the setting of the lens will be different. For example, if there is only a transmitting lens in the photoelectric transmitter, it is only necessary to install the transmitting lens on the bracket body; while in the photoelectric receiver If there is only a receiving lens, it is only necessary to install the receiving lens on the bracket body.

本实施例提供的光电传感器,如图6-9所示,其透镜支架还包括至少两个弹性臂9,弹性臂9设置于支架本体6的一外侧壁(如图6-9中显示为左侧壁),弹性臂9于该外侧壁向外延伸,弹性臂9具有向内延伸的定位部,多个弹性臂9相聚拢从而形成了一个整体的弹性定位爪结构,该向内延伸是指弹性臂9向聚拢侧延伸;可选地,弹性臂9的数量为两个,在其他可替换的实施例中,弹性臂的数量可以为三个或更多个;可选的,弹性臂9的材质可以是塑料,例如,ABS塑料或PC塑料;弹性臂9与支架本体6可以是一体注塑成型,如此能够节省装配工序。The photoelectric sensor provided in this embodiment, as shown in Figure 6-9, its lens bracket also includes at least two elastic arms 9, and the elastic arms 9 are arranged on an outer side wall of the bracket body 6 (shown as the left side wall in Figure 6-9 side wall), the elastic arm 9 extends outward on the outer wall, the elastic arm 9 has a positioning portion extending inward, and a plurality of elastic arms 9 gather together to form an integral elastic positioning claw structure, and the inward extension refers to Elastic arm 9 extends toward gathering side; Optionally, the quantity of elastic arm 9 is two, and in other alternative embodiments, the quantity of elastic arm can be three or more; Optionally, elastic arm 9 The material of the frame can be plastic, for example, ABS plastic or PC plastic; the elastic arm 9 and the bracket body 6 can be integrally injection-molded, which can save the assembly process.

本实施例提供的光电传感器,其还包括第一旋钮8,第一电路板14和电位器15,电位器15能够调节传感器的灵敏度,第一旋钮8与电位器15相配合,通过旋转第一旋钮8带动电位器15旋转,从而实现调节;如图7-8所示,弹性臂9的定位部在其聚拢方向的头部具有定位面91,第一旋钮8具有一头部和一杆状主体,该杆状主体穿过该定位面91且位于多个定位面91之间;第一电路板14位于所述杆状主体与所述外侧壁之间,电位器15安装于所述第一电路板14上并面向所述杆状主体,电位器15的位置对应于杆状主体的位置;可选地,杆状主体的调节端部设有一个或多个调节凸起,电位器15上设有与调节凸起相对应的调节凹槽,优选地,如图18所示,杆状主体的调节端部设有十字状的调节凸起,从而与电位器15上的十字状调节凹槽相配合。The photoelectric sensor provided in this embodiment also includes a first knob 8, a first circuit board 14 and a potentiometer 15, the potentiometer 15 can adjust the sensitivity of the sensor, the first knob 8 cooperates with the potentiometer 15, and by rotating the first Knob 8 drives potentiometer 15 to rotate, thereby realizes adjustment; As shown in Figure 7-8, the head of the positioning part of elastic arm 9 has positioning surface 91 in its gathering direction, and first knob 8 has a head and a rod-shaped The main body, the rod-shaped main body passes through the positioning surface 91 and is located between multiple positioning surfaces 91; the first circuit board 14 is located between the rod-shaped main body and the outer wall, and the potentiometer 15 is installed on the first On the circuit board 14 and facing the rod-shaped main body, the position of the potentiometer 15 corresponds to the position of the rod-shaped main body; optionally, the adjustment end of the rod-shaped main body is provided with one or more adjustment protrusions, and the position of the potentiometer 15 is An adjustment groove corresponding to the adjustment protrusion is provided. Preferably, as shown in FIG. match.

本实施例提供的光电传感器,在支架本体6外延伸出弹性臂9,第一旋钮8直接穿过弹性臂9的定位部即可实现对第一旋钮8的定位,无需单独设置一道卡装卡簧的工序,从而简化了装配,并且,也节省了制作卡簧的人工成本和材料成本。In the photoelectric sensor provided in this embodiment, the elastic arm 9 is extended outside the bracket body 6, and the first knob 8 can be positioned directly through the positioning part of the elastic arm 9, without the need for a separate clamp. The process of the spring simplifies the assembly, and also saves the labor cost and material cost of making the circlip.

本实施例提供的光电传感器,如图17-18所示,其第一旋钮8的杆状主体上具有一段径向宽度增大的凸肩外圈81;可选地,杆状主体的整体形状呈圆柱形,凸肩外圈81的整体形状也呈圆柱形,凸肩外圈81相对于杆状主体的直径增大;在其他可替换的实施例中,杆状主体和凸肩外圈81也可以呈方形柱体、三角形柱体等形状;凸肩外圈81在穿过定位部的过程中,因其宽度较大从而对定位部产生挤压力,使得弹性臂9向外扩张,凸肩外圈81穿过之后,弹性臂9在弹性回复力的作用下向内收拢,从而将第一旋钮8定位,操作简单;并且,弹性臂9的定位部具有第一止退面92,第一旋钮8的凸肩外圈81的第一端具有与所述第一止退面92相配合的第二止退面811,凸肩外圈81穿过定位部之后,通过第一止退面92和第二止退面811的配合能够避免第一旋钮8的脱落,第一旋钮8无论是被旋转还是被外力拉动,由于第一止退面的阻挡作用,其都不会从定位部被拉出。In the photoelectric sensor provided in this embodiment, as shown in Figures 17-18, the rod-shaped body of the first knob 8 has a shoulder outer ring 81 with an enlarged radial width; optionally, the overall shape of the rod-shaped body It is cylindrical, and the overall shape of the shoulder outer ring 81 is also cylindrical, and the diameter of the shoulder outer ring 81 is increased relative to the rod-shaped main body; in other alternative embodiments, the rod-shaped main body and the shoulder outer ring 81 It can also be in the shape of a square cylinder, a triangular cylinder, etc.; when the shoulder outer ring 81 passes through the positioning part, because of its large width, it will generate a pressing force on the positioning part, so that the elastic arm 9 expands outward, and the convex After the shoulder outer ring 81 passes through, the elastic arm 9 is retracted inward under the action of the elastic restoring force, thereby positioning the first knob 8, and the operation is simple; and, the positioning part of the elastic arm 9 has a first backstop surface 92, the second The first end of the shouldered outer ring 81 of a knob 8 has a second backstopping surface 811 matched with the first backstopping surface 92, and the shouldered outer ring 81 passes through the first backstopping surface after passing through the positioning part. 92 and the second anti-retraction surface 811 can prevent the first knob 8 from falling off. No matter whether the first knob 8 is rotated or pulled by an external force, it will not be pulled from the positioning part due to the blocking effect of the first anti-retraction surface. pull out.

本实施例提供的光电传感器,如图6,11-12所示,还包括第二电路板7,所述第二电路板7与所述第一电路板14相垂直,所述第一电路板14的顶部具有向上延伸的凸块141,所述第二电路板7具有与所述凸块141相配合的第一插槽73;通过凸块141和第一插槽73的插接配合实现了第一电路板14和第二电路板7之间的定位;相较于现有的将电位器直接安装在第二电路板上的方式,本实施例中单独设置了与第二电路板7相垂直的第一电路板14来安装电位器15,第一电路板14实质上起到了转接板的作用,由此,在装配过程中,可以先装配第一电路板14和电位器15,然后再安装第一旋钮8,此时没有了第二电路板在顶部对视线的遮挡,第一旋钮8能够在可视化状态下与电位器15相配合装配,在第一旋钮8装配完成后再对第二电路板7进行装配;上述装配方式避免了需要先安装整体的第二电路板和电位器,再安装第一旋钮的盲装弊端,操作人员能够清晰地观察到定位器与第一旋钮的配合状态,大大提高了第一旋钮的装配准确率,同时也大大降低了第一旋钮或电位器由于盲装而导致的损坏几率。The photoelectric sensor provided by this embodiment, as shown in Figure 6, 11-12, also includes a second circuit board 7, the second circuit board 7 is perpendicular to the first circuit board 14, and the first circuit board The top of 14 has a protrusion 141 extending upwards, and the second circuit board 7 has a first slot 73 matched with the protrusion 141; The positioning between the first circuit board 14 and the second circuit board 7; Compared with the existing method of directly installing the potentiometer on the second circuit board, in this embodiment, the second circuit board 7 is separately arranged. Vertical first circuit board 14 is installed potentiometer 15, and first circuit board 14 has played the effect of adapter board substantially, thus, in assembly process, can first assemble first circuit board 14 and potentiometer 15, and then Install the first knob 8 again. At this time, there is no second circuit board at the top to block the line of sight. The first knob 8 can be assembled with the potentiometer 15 in a visualized state. After the first knob 8 is assembled, the second The second circuit board 7 is assembled; the above-mentioned assembly method avoids the disadvantages of blind installation that need to install the whole second circuit board and potentiometer first, and then install the first knob, and the operator can clearly observe the cooperation between the positioner and the first knob state, which greatly improves the assembly accuracy of the first knob, and also greatly reduces the probability of damage to the first knob or potentiometer due to blind assembly.

由于在光电传感器中,需要安装的芯片等电学元器件繁多,若均搭载在第二电路板上未免过于拥挤,而即使为了避免拥挤从而将第二电路板的面积设计的更大,这种情况下也会导致光电传感器整体尺寸的不合理加大,本发明提供的反射型光电传感器,如图4-5所示,还包括第三电路板10,第三电路板10位于所述第二电路板7上方,具体地,第三电路板10平行设置于所述第二电路板7上方;在第二电路板7上方设置了单独的第三电路板10,在占用空间尽可能小的前提下搭载了更多的元器件,在高度方向上加了一层电路板,并未在长度或宽度方向上额外占用太大空间,使得传感器整体尺寸紧凑小巧。当然,本领域技术人员能够理解的是,第三电路板并非必须,当第二电路板能够满足搭载要求时,可以不设置第三电路板。Because in the photoelectric sensor, there are many electrical components such as chips that need to be installed, if they are all mounted on the second circuit board, it will be too crowded, and even if the area of the second circuit board is designed to be larger in order to avoid crowding, in this case It will also lead to an unreasonable increase in the overall size of the photoelectric sensor. The reflective photoelectric sensor provided by the present invention, as shown in Figure 4-5, also includes a third circuit board 10, and the third circuit board 10 is located in the second circuit Above the board 7, specifically, the third circuit board 10 is arranged in parallel above the second circuit board 7; a separate third circuit board 10 is arranged above the second circuit board 7, under the premise of occupying as little space as possible Equipped with more components, a layer of circuit board is added in the height direction, and does not take up too much space in the length or width direction, making the overall size of the sensor compact and small. Of course, those skilled in the art can understand that the third circuit board is not necessary, and the third circuit board may not be provided when the second circuit board can meet the loading requirements.

本实施例提供的光电传感器,还包括第四电路板12,如图5所示,所述第四电路板12连接于所述第二电路板7的侧端面和所述第三电路板10的侧端面;第四电路板12作为一块连接板,将第二电路板7和第三电路板10电性连接,实现了第二电路板7和第三电路板10的电路连通。需要说明的是,在不需要设置第三电路板10的情况下,相应的,则不需要设置第四电路板12。The photoelectric sensor provided by this embodiment also includes a fourth circuit board 12. As shown in FIG. Side surface; the fourth circuit board 12 is used as a connecting board to electrically connect the second circuit board 7 and the third circuit board 10 to realize the circuit communication between the second circuit board 7 and the third circuit board 10 . It should be noted that, if the third circuit board 10 does not need to be provided, correspondingly, the fourth circuit board 12 does not need to be provided.

本实施例提供的光电传感器,如图16所示,电缆卡扣包括电缆32和封壳31,电缆32包括内部导线以及包绕所述内部导线的外套,封壳31与所述外套注塑为一体,所述内部导线穿设于所述封壳31,并向所述封壳31内侧延伸;如图15所示,所述壳体2上设有容纳所述封壳31的容置槽26,所述封壳31的至少一个侧壁上具有锁定凸块311,所述容置槽26的内侧壁具有与所述锁定凸块311相对应的锁定凹槽25,从而提高装配精度;在一个可替换的实施例中,还可以在封壳31的侧壁上设置锁定凹槽,在容置槽26的内侧壁上设置锁定凸块。所述容置槽26通过一开口29与所述壳体2的内腔连通,向所述封壳31内侧延伸的内部导线通过该开口29伸入至所述壳体2的内腔。所述容置槽26内填充有密封胶,所述密封胶封堵所述开口29。容置槽29作为一个单独的腔体,其通过一个开口29与壳体2的内腔连通,引导内部导线的穿入,该容置槽26的内部可以完全填充满密封胶,并密封开口29,提高光电传感器的密封效果。并避免了现有的单独穿线后点胶,存在点胶不均匀,密封性下降的问题。The photoelectric sensor provided in this embodiment, as shown in Figure 16, the cable buckle includes a cable 32 and a casing 31, the cable 32 includes an inner wire and a jacket surrounding the inner wire, and the casing 31 and the jacket are injection molded as one , the internal wires pass through the enclosure 31 and extend toward the inside of the enclosure 31; as shown in FIG. At least one side wall of the casing 31 has a locking protrusion 311, and the inner side wall of the accommodating groove 26 has a locking groove 25 corresponding to the locking protrusion 311, thereby improving the assembly accuracy; In an alternative embodiment, a locking groove may also be provided on the side wall of the enclosure 31 , and a locking protrusion may be provided on the inner side wall of the accommodating groove 26 . The accommodating groove 26 communicates with the inner cavity of the housing 2 through an opening 29 , and the internal wire extending to the inner side of the enclosure 31 extends into the inner cavity of the housing 2 through the opening 29 . The accommodating groove 26 is filled with sealant, and the sealant blocks the opening 29 . The accommodating groove 29 is a separate cavity, which communicates with the inner cavity of the housing 2 through an opening 29 to guide the penetration of the internal wires. The inside of the accommodating groove 26 can be completely filled with sealant and seal the opening 29 , Improve the sealing effect of the photoelectric sensor. It also avoids the problems of uneven glue dispensing and decreased sealing performance in the existing separate threading and glue dispensing.

本实施例提供的光电传感器,如图3-5所示,所述第二电路板7和所述第三电路板10之间设有屏蔽电路板11,具体地,该屏蔽电路板11的屏蔽面平行设置于所述第二电路板7和所述第三电路板10之间,其用于屏蔽所述第二电路板7和所述第三电路板10之间的信号干扰;所述屏蔽电路板11上设有与所述凸块141相配合的第二插槽,从而便于所述屏蔽电路板11的定位和安装;可选地,屏蔽电路板11可以是FPC,具有较好的弯折性能,其末端沿所述第二电路板7的侧面弯折延伸并固定在所述第二电路板7的下表面,如此较好地实现了对屏蔽电路板11的安装固定,其中,FPC的末端可通过焊接的方式固定在所述第二电路板7的下表面;在其他可选的实施例中,FPC的末端还可以固定于第二电路板7的其他位置,例如,第二电路板7的上表面或侧面等位置。需要说明的是,在不需要设置第三电路板10的情况下,相应的,则不需要设置屏蔽电路板11。For the photoelectric sensor provided in this embodiment, as shown in Figure 3-5, a shielding circuit board 11 is provided between the second circuit board 7 and the third circuit board 10, specifically, the shielding of the shielding circuit board 11 The plane is arranged in parallel between the second circuit board 7 and the third circuit board 10, which is used to shield the signal interference between the second circuit board 7 and the third circuit board 10; the shielding The circuit board 11 is provided with a second slot matched with the bump 141, thereby facilitating the positioning and installation of the shielded circuit board 11; optionally, the shielded circuit board 11 can be an FPC, which has a better bending Its end is bent and extended along the side of the second circuit board 7 and fixed on the lower surface of the second circuit board 7, so that the installation and fixation of the shielding circuit board 11 is better realized, wherein the FPC The end of the FPC can be fixed on the lower surface of the second circuit board 7 by welding; in other optional embodiments, the end of the FPC can also be fixed on other positions of the second circuit board 7, for example, the second circuit board 7 The upper surface or side of the plate 7 and other positions. It should be noted that, if the third circuit board 10 does not need to be provided, correspondingly, the shielding circuit board 11 does not need to be provided.

本实施例提供的光电传感器,如图3-4所示,所述反射型光电传感器还包括铜片13,具体地,如图13所示,所述铜片13呈U字形,其包括铜底板131和位于所述铜底板131两侧的铜侧板132,所述铜底板131位于所述第二电路板7的下方,两侧的所述铜侧板132分别位于所述第二电路板7的两侧且分别延伸至所述第三电路板10的上方,其中一侧的所述铜侧板132位于所述第四电路板12的外侧,铜片13作为所述第二电路板7和所述第三电路板10的屏蔽板,能够避免第二电路板7和第三电路板10受到外界的电磁干扰。The photoelectric sensor provided in this embodiment, as shown in Figure 3-4, the reflective photoelectric sensor also includes a copper sheet 13, specifically, as shown in Figure 13, the copper sheet 13 is U-shaped, which includes a copper base plate 131 and copper side plates 132 on both sides of the copper base plate 131, the copper base plate 131 is located below the second circuit board 7, and the copper side plates 132 on both sides are respectively located on the second circuit board 7 and extend to the top of the third circuit board 10 respectively, wherein the copper side plate 132 on one side is located outside the fourth circuit board 12, and the copper sheet 13 serves as the second circuit board 7 and The shielding plate of the third circuit board 10 can prevent the second circuit board 7 and the third circuit board 10 from being subjected to external electromagnetic interference.

本实施例提供的光电传感器,如图7-8所示,其弹性臂9的定位面91为沿所述杆状主体轴向延伸的内凹面,所述内凹面与所述凸肩外圈81的形状相适配,以保证凸肩外圈81能够顺利通过该内凹面;可选地,在凸肩外圈81为圆柱形的情况下,该内凹面可以设计为圆弧面。In the photoelectric sensor provided in this embodiment, as shown in Figures 7-8, the positioning surface 91 of the elastic arm 9 is an inner concave surface extending axially along the rod-shaped main body, and the inner concave surface is in contact with the outer ring 81 of the shoulder. To ensure that the shoulder outer ring 81 can pass through the inner concave surface smoothly; optionally, when the shoulder outer ring 81 is cylindrical, the inner concave surface can be designed as an arc surface.

本实施例提供的光电传感器,如图8所示,其弹性臂9的定位部还具有自所述定位面91向背对所述支架本体6的一侧延伸的第一导向斜面93,所述凸肩外圈81的第二端具有与所述第一导向斜面93相配合的第二导向斜面812,通过导向斜面的设计能够使得凸肩外圈81在穿过定位部的过程中更加容易。In the photoelectric sensor provided in this embodiment, as shown in FIG. 8 , the positioning portion of the elastic arm 9 also has a first guide inclined surface 93 extending from the positioning surface 91 to the side facing away from the bracket body 6 . The second end of the shoulder outer ring 81 has a second guide slope 812 matched with the first guide slope 93 , the design of the guide slope can make it easier for the shoulder outer ring 81 to pass through the positioning portion.

本实施例提供的光电传感器,如图6-9所示,其弹性臂9设有向外延伸的弹性支耳94,即弹性支耳94向弹性臂9的扩张侧延伸,弹性支耳94能够与壳体2的内壁抵接,从而为弹性臂9提供一定的弹性支撑力;可选的,弹性支耳94的材质可以是塑料,例如,ABS塑料或PC塑料;弹性臂9和弹性支耳94可以是一体注塑成型,从而方便装配;弹性臂9的形状可以为弯钩状,也可以是直线形状、波浪状等。In the photoelectric sensor provided in this embodiment, as shown in Figure 6-9, its elastic arm 9 is provided with an outwardly extending elastic lug 94, that is, the elastic lug 94 extends toward the expansion side of the elastic arm 9, and the elastic lug 94 can Abut against the inner wall of the housing 2, thereby providing a certain elastic support force for the elastic arm 9; optionally, the material of the elastic lug 94 can be plastic, such as ABS plastic or PC plastic; the elastic arm 9 and the elastic lug 94 can be integrally injection-molded to facilitate assembly; the shape of the elastic arm 9 can be a hook shape, a straight line shape, a wave shape, etc.

本实施例提供的光电传感器,如图6-7所示,在其弹性臂9的根部具有用于对所述第一电路板14进行限位的限位面,限位面顶部还设有倒角,从而便于第一电路板14的安装;所述支架本体6的所述外侧壁设置有至少两个边肋61,所述边肋61与所述第一电路板14相抵接且与所述限位面相对设置,所述第一电路板14夹设在所述限位面和所述边肋61之间,通过限位面和边肋61实现了对第一电路板14的有效定位。The photoelectric sensor provided in this embodiment, as shown in Figure 6-7, has a limiting surface for limiting the first circuit board 14 at the root of its elastic arm 9, and an inverted surface is also provided on the top of the limiting surface. angle, so as to facilitate the installation of the first circuit board 14; the outer wall of the bracket body 6 is provided with at least two side ribs 61, and the side ribs 61 abut against the first circuit board 14 and are connected to the The limiting surfaces are oppositely arranged, and the first circuit board 14 is interposed between the limiting surface and the side rib 61 , and the effective positioning of the first circuit board 14 is realized through the limiting surface and the side rib 61 .

本实施例提供的光电传感器,在其支架本体6的所述外侧壁还设置有至少一个中间肋62,所述中间肋62位于所述边肋61之间,所述中间肋62的位置与所述电位器15的位置对应,其中,如图9所示,所述中间肋62的凸出深度小于所述边肋61的凸出深度;由于在将第一旋钮8装配至电位器15上以及转动第一旋钮8来调节电位器15等过程中,不可避免会对第一电路板14产生一定的挤压力,上述边肋61与中间肋62之间的凸出深度之差能够允许第一电路板14在挤压力的作用下产生一定的挠度缓冲,避免第一电路板14受力过大而遭到损坏;可选地,第一电路板14可以是FPC,如此能够允许一定程度的变形,且便于与其他部件之间的装配配合;可选地,中间肋62的数量为一个,边肋61的数量为两个,两个边肋61分别位于中间肋的两侧。The photoelectric sensor provided in this embodiment is also provided with at least one intermediate rib 62 on the outer wall of the bracket body 6, the intermediate rib 62 is located between the side ribs 61, and the position of the intermediate rib 62 is consistent with the The position of the potentiometer 15 corresponds, wherein, as shown in FIG. 9 , the protruding depth of the middle rib 62 is smaller than the protruding depth of the side rib 61; In the process of turning the first knob 8 to adjust the potentiometer 15, etc., it is inevitable that a certain extrusion force will be generated on the first circuit board 14, and the difference in the protruding depth between the side rib 61 and the middle rib 62 can allow the first Circuit board 14 produces certain deflection buffer under the effect of extruding force, avoids that first circuit board 14 is stressed and is damaged; Optionally, first circuit board 14 can be FPC, can allow certain degree like this deformation, and facilitate the assembly and cooperation with other components; optionally, the number of the middle rib 62 is one, and the number of side ribs 61 is two, and the two side ribs 61 are respectively located on both sides of the middle rib.

本实施例提供的光电传感器,所述边肋61和所述中间肋62均沿所述外侧壁纵向延伸,所述边肋61和所述中间肋62的端部均为弧形,从而与第一电路板14形成线接触,相对于面接触来说,线接触能够更加便于第一电路板14的安装。In the photoelectric sensor provided in this embodiment, both the side ribs 61 and the middle rib 62 extend longitudinally along the outer wall, and the ends of the side ribs 61 and the middle rib 62 are arc-shaped, so as to be consistent with the first A circuit board 14 forms a line contact. Compared with a surface contact, the line contact can facilitate the installation of the first circuit board 14 .

本实施例提供的光电传感器,如图14所示,其在壳体2内设置有若干第一定位柱21、至少一个第二定位柱27、若干导向板22,第一定位柱21穿过第二电路板7,第二定位柱27穿过第三电路板10,第二电路板7上开设有与第一定位柱21相对应的第一定位孔71,通过第一定位柱21和第一定位孔71实现对第二电路板7的装配导向和定位,第三电路板10上开设有与第二定位柱27相对应的第二定位孔101,通过第二定位柱27和第二定位孔101实现对第三电路板10的装配导向和定位,导向板22与所述支架本体6抵接以实现对支架本体6的装配导向和定位;其中,第一定位柱21、第二定位柱27均为热熔柱,一方面起到导向定位的作用,另一方面,当将第二电路板7、第三电路板10安装好之后,将第一定位柱21、第二定位柱27进行热熔以实现第一定位柱21、第二定位柱27与壳体之间的固定;本实施例中,第二电路板8和透镜支架均以壳体15为定位基准,从而有效保证了第二电路板8和透镜支架之间的装配精度,避免误差;可选的,第一定位柱21和第一定位孔71数量为3个,其中两个第一定位孔71设于所述第二电路板7的一侧的两端,与位于所述第二电路板7另一侧中部的一个第一定位孔71形成三角形分布结构,从而形成稳固的定位;可选的,第二定位柱27和第二定位孔101为1个,设于所述第三电路板10的一角,由于第二电路板7已经被稳固定位,第三电路板10通过第四电路板12与第二电路板7连接,因此,第三电路板10采用一个定位孔即可实现导向定位;可选的,导向板22的数量为4个,分别设置在所述壳体2内部的四角。需要说明的是,在不需要设置第三电路板10的情况下,相应的,也不需要设置第二定位孔以及第二定位柱。The photoelectric sensor provided by this embodiment, as shown in Figure 14, is provided with several first positioning columns 21, at least one second positioning column 27, and several guide plates 22 in the housing 2, and the first positioning column 21 passes through the first positioning column. Two circuit boards 7, the second positioning column 27 passes through the third circuit board 10, the second circuit board 7 is provided with the first positioning hole 71 corresponding to the first positioning column 21, through the first positioning column 21 and the first The positioning hole 71 realizes the assembly guide and positioning of the second circuit board 7, and the third circuit board 10 is provided with a second positioning hole 101 corresponding to the second positioning column 27, through which the second positioning column 27 and the second positioning hole 101 realizes the assembly guidance and positioning of the third circuit board 10, and the guide plate 22 abuts against the bracket body 6 to realize the assembly guidance and positioning of the bracket body 6; wherein, the first positioning column 21, the second positioning column 27 They are all hot-melt posts, which play the role of guiding and positioning on the one hand. On the other hand, after the second circuit board 7 and the third circuit board 10 are installed, the first positioning post 21 and the second positioning post 27 are heated. Melt to realize the fixation between the first positioning post 21, the second positioning post 27 and the housing; The assembly accuracy between the circuit board 8 and the lens holder avoids errors; optionally, the number of the first positioning posts 21 and the first positioning holes 71 is three, and two of the first positioning holes 71 are located in the second circuit Both ends of one side of the board 7 form a triangular distribution structure with a first positioning hole 71 located in the middle of the other side of the second circuit board 7, thereby forming a stable positioning; optionally, the second positioning column 27 and There is one second positioning hole 101, which is located at a corner of the third circuit board 10. Since the second circuit board 7 has been stably fixed, the third circuit board 10 is connected to the second circuit board 7 through the fourth circuit board 12. , therefore, the third circuit board 10 can realize guiding and positioning by using one positioning hole; optionally, the number of guiding plates 22 is four, which are respectively arranged at the four corners inside the housing 2 . It should be noted that, in the case where the third circuit board 10 does not need to be provided, correspondingly, the second positioning hole and the second positioning post do not need to be provided.

本实施例提供的光电传感器,如图12所示,第二电路板7下表面还安装有对应于所述发射透镜5的光源72,如图14所示,所述壳体2内设有用于容置所述光源72的安装槽24,所述安装槽24上开设有用于光源72的光透过的光孔24。当然,本领域技术人员能够知晓的是,在光电发射器或光电接收器等光电传感器中,对光源的设置会存在不同,例如,在光电发射器中,光源、安装槽、光孔的位置需要对应于发射透镜的位置进行适应性调整,在光电接收器中,则不需要设置光源及安装槽、光孔。In the photoelectric sensor provided in this embodiment, as shown in FIG. 12, a light source 72 corresponding to the emitting lens 5 is installed on the lower surface of the second circuit board 7. As shown in FIG. 14, the housing 2 is provided with a The installation slot 24 for accommodating the light source 72 is provided with a light hole 24 for the light of the light source 72 to pass through. Of course, those skilled in the art can know that in photoelectric sensors such as photoelectric transmitters or photoelectric receivers, there will be differences in the setting of light sources. For example, in photoelectric transmitters, the positions of light sources, installation grooves, and optical holes need to be Adaptive adjustment is made corresponding to the position of the transmitting lens, and in the photoelectric receiver, there is no need to set a light source, installation groove, and light hole.

本实施例提供的光电传感器,如图2所示,其在盖体1上安装有第二旋钮16,第二旋钮16作为功能切换旋钮,将传感器在接收到信号时进行输出的状态以及在接收到信号时进行关闭的状态之间切换;第二旋钮16的杆身外侧卡设有卡簧161。The photoelectric sensor provided by this embodiment, as shown in Figure 2, is equipped with a second knob 16 on the cover body 1, and the second knob 16 is used as a function switching knob to output the state of the sensor when it receives a signal and when it receives a signal. When the signal is received, switch between the closed state; the outside of the second knob 16 is clamped with a retaining spring 161 .

本实施例提供的光电传感器,在第一旋钮8的杆状主体外侧设有第一密封圈82,在第二旋钮16的杆身外侧设有第二密封圈162,从而保证传感器的密封效果;壳体2的底部设有一通槽,通槽上安装有盖板28,从而便于壳体内部零部件的装配,盖板28在装配后期进行焊接密封。In the photoelectric sensor provided in this embodiment, a first sealing ring 82 is provided outside the rod-shaped main body of the first knob 8, and a second sealing ring 162 is provided outside the shaft of the second knob 16, thereby ensuring the sealing effect of the sensor; The bottom of the housing 2 is provided with a through groove, and a cover plate 28 is installed on the through groove, so as to facilitate the assembly of the internal parts of the housing. The cover plate 28 is welded and sealed in the later stage of assembly.

实施例2Example 2

在实施例1的光电传感器的结构基础上,本实施例提供一种光电传感器的装配方法,需要说明的是,其适用于反射型光电传感器,也可以适用于其他类型的光电传感器,例如光电发射器或光电接收器等。为方便介绍,本实施例以反射型光电传感器为例进行说明。On the basis of the structure of the photoelectric sensor in Embodiment 1, this embodiment provides a photoelectric sensor assembly method. It should be noted that it is applicable to reflective photoelectric sensors, and can also be applied to other types of photoelectric sensors, such as photoelectric emission device or photoelectric receiver, etc. For the convenience of introduction, this embodiment takes a reflective photoelectric sensor as an example for illustration.

所述装配方法包括如下步骤:Described assembly method comprises the steps:

S10、将所述接收透镜4安装在所述支架本体6上,然后将所述透镜支架沿着所述导向板22安装到所述壳体2内;S10, install the receiving lens 4 on the bracket body 6, and then install the lens bracket into the housing 2 along the guide plate 22;

S20、将安装有所述电位器15的所述第一电路板14安装在所述透镜支架上;S20, installing the first circuit board 14 on which the potentiometer 15 is installed on the lens holder;

S30、将所述第一旋钮8穿过所述壳体2与所述电位器15对准装配;S30, passing the first knob 8 through the housing 2 and aligning and assembling the potentiometer 15;

S40、将所述第二电路板7穿过所述第一定位柱21,进而将所述第二电路板7安装在所述透镜支架的上方;S40, passing the second circuit board 7 through the first positioning column 21, and then installing the second circuit board 7 above the lens bracket;

S50、将所述第三电路板10穿过所述第二定位柱27,进而将所述第三电路板10安装在所述第二电路板7的上方;S50, passing the third circuit board 10 through the second positioning column 27, and then installing the third circuit board 10 above the second circuit board 7;

S60、将所述封壳31的所述锁定凸块或锁定凹槽与所述容置槽26的所述锁定结构相配合,从而将所述电缆卡扣3安装在所述壳体2上。S60 , match the locking protrusion or the locking groove of the casing 31 with the locking structure of the accommodating groove 26 , so as to install the cable buckle 3 on the housing 2 .

本实施例提供的反射型光电传感器的装配方法,改变了以往电位器直接固定在传感器的主电路板上,须先安装主电路板再安装第一旋钮的装配方式,本实施例实现了先安装第一电路板,再安装第一旋钮,后安装第二电路板,避免在安装第一旋钮时第二电路板对视线的遮挡,进而实现了第一旋钮与电位器的可视化装配,操作人员能够清晰地观察到定位器与第一旋钮的配合状态,大大提高了第一旋钮的装配准确率,同时也大大降低了第一旋钮或电位器由于盲装而导致的损坏几率;并且,基于第一电路板和第二电路板的设计,从而将第二电路板和第三电路板的装配工序后置,进而使得电缆的穿线和焊接工序后置,只需在装配盖体之前进行穿线、点胶、焊接的工序,从而优化了装配工序,提高了装配效率,避免了在前期装配中就要安装好电路板以及焊接好电缆,从而在后续的整个装配过程中都需要拉着电缆,不利于在生产线上的输送的弊端。The assembly method of the reflective photoelectric sensor provided in this embodiment has changed the previous assembly method in which the potentiometer is directly fixed on the main circuit board of the sensor, and the main circuit board must be installed first, and then the first knob must be installed. The first circuit board, then install the first knob, and then install the second circuit board, to avoid the second circuit board blocking the line of sight when installing the first knob, and then realize the visual assembly of the first knob and the potentiometer, and the operator can Clearly observe the matching state of the locator and the first knob, which greatly improves the assembly accuracy of the first knob, and also greatly reduces the damage probability of the first knob or potentiometer due to blind installation; and, based on the first The design of the circuit board and the second circuit board, so that the assembly process of the second circuit board and the third circuit board is rearranged, so that the cable threading and welding processes are rearranged, and only threading and dispensing are required before the cover is assembled , Welding process, thereby optimizing the assembly process, improving assembly efficiency, avoiding the need to install circuit boards and solder cables in the early assembly, so that cables need to be pulled during the entire subsequent assembly process, which is not conducive to Disadvantages of conveying on the production line.

可选地,所述步骤S40进一步包括:通过所述凸块141与所述第一插槽73相配合,从而将所述第一电路板14和所述第二电路板7插接。Optionally, the step S40 further includes: fitting the first circuit board 14 with the second circuit board 7 through the protrusion 141 mating with the first slot 73 .

可选地,所述步骤S30中,先在所述第一旋钮8的杆状主体上套装第一密封圈82,然后将所述第一旋钮8的所述凸肩外圈81穿过所述至少两个弹性臂9的所述定位面91,进而将所述第一旋钮8与所述电位器15对准装配;具体地,操作人员在上方能够直接观察到定位器15与第一旋钮8的配合状态,将第一旋钮8的十字状调节凸起对准电位器15的十字状调节凹槽,对位之后再旋转一定角度,以保证装配到位。Optionally, in the step S30, the first sealing ring 82 is fitted on the rod-shaped body of the first knob 8, and then the shoulder outer ring 81 of the first knob 8 is passed through the The positioning surfaces 91 of at least two elastic arms 9, and then align and assemble the first knob 8 and the potentiometer 15; specifically, the operator can directly observe the positioner 15 and the first knob 8 from above Align the cross-shaped adjustment protrusion of the first knob 8 with the cross-shaped adjustment groove of the potentiometer 15, and then rotate a certain angle after alignment to ensure that the assembly is in place.

可选地,在步骤S10中,透镜支架的弹性支耳94与壳体2的内壁抵接,从而为弹性臂9提供一定的弹性支撑力,在步骤S30中第一旋钮穿过弹性臂的所述定位面时,弹性支耳94能够使得弹性臂9快速回弹实现定位。Optionally, in step S10, the elastic lug 94 of the lens holder abuts against the inner wall of the housing 2, thereby providing a certain elastic supporting force for the elastic arm 9, and in step S30, the first knob passes through all the elastic arms. When the positioning surface is mentioned above, the elastic lug 94 can make the elastic arm 9 rebound quickly to realize positioning.

可选地,在步骤S20中,将第一电路板7沿着弹性臂9根部的限位面插入到所述限位面以及所述边肋61之间,从而实现第一电路板14在所述透镜支架上的安装定位。Optionally, in step S20, the first circuit board 7 is inserted between the limiting surface and the side rib 61 along the limiting surface at the root of the elastic arm 9, so that the first circuit board 14 is positioned between the limiting surface and the side rib 61. The installation and positioning on the above-mentioned lens holder.

可选地,所述步骤S30和所述步骤S40之间,还包括步骤S31:将所述铜片13安装到所述透镜支架上,所述铜片13的铜底板131置于所述透镜支架的上表面;所述步骤S40中,将所述第二电路板7安装在所述铜底板131的上方。Optionally, between the step S30 and the step S40, a step S31 is also included: installing the copper sheet 13 on the lens holder, and the copper base plate 131 of the copper sheet 13 is placed on the lens holder the upper surface of the upper surface; in the step S40, the second circuit board 7 is installed above the copper base plate 131 .

可选地,所述步骤S50进一步包括步骤:Optionally, said step S50 further includes the steps of:

S510、将所述屏蔽电路板11安装在所述第二电路板7的上方;S510, installing the shielding circuit board 11 above the second circuit board 7;

S520、将所述第四电路板12连接在所述第二电路板7的侧端面;S520. Connect the fourth circuit board 12 to the side end surface of the second circuit board 7;

S530、将所述第三电路板10的侧端面与所述第四电路板12相连接。S530. Connect the side surface of the third circuit board 10 to the fourth circuit board 12 .

可选地,所述步骤S510中,将所述屏蔽电路板11的第二插槽与所述凸块141插接,并将所述屏蔽电路板11的所述末端通过焊接的方式固定在所述第二电路板7的下表面。Optionally, in the step S510, insert the second slot of the shielded circuit board 11 into the bump 141, and fix the end of the shielded circuit board 11 on the The lower surface of the second circuit board 7 is described.

可选地,所述步骤S520和所述步骤S530中,所述第四电路板12与所述第二电路板7的侧端面、所述第三电路板10的侧端面均采用焊接连接。Optionally, in the step S520 and the step S530, the fourth circuit board 12 is connected to the side end surface of the second circuit board 7 and the side end surface of the third circuit board 10 by welding.

可选地,所述步骤S520与所述步骤S530之间还包括步骤S521、将所述第一定位柱21凸出于所述第二电路板7的顶端进行热熔,从而将所述第二电路板7固定在所述壳体2内;所述步骤S530之后还包括步骤S540、将所述第二定位柱27凸出于所述第三电路板10的顶端进行热熔,从而将所述第三电路板10固定在所述壳体2内。Optionally, step S521 is further included between the step S520 and the step S530, protruding the first positioning column 21 from the top end of the second circuit board 7 for thermal melting, so that the second circuit board 7 The circuit board 7 is fixed in the housing 2; after the step S530, a step S540 is also included, wherein the second positioning post 27 is protruded from the top of the third circuit board 10 for thermal fusion, so that the The third circuit board 10 is fixed in the housing 2 .

可选地,所述步骤S60进一步包括:将所述内部导线穿过所述开口29并伸入到所述壳体2的内腔。Optionally, the step S60 further includes: passing the internal wire through the opening 29 and extending into the inner cavity of the housing 2 .

可选地,所述步骤S60中,具体是将所述封壳31的锁定凸块311与所述容置槽26的锁定凹槽25相配合,从而将所述电缆卡扣3安装在所述壳体2上;在可替换的实施例中,还可采用将所述封壳31的锁定凹槽与所述容置槽26的锁定凸块相配合。Optionally, in the step S60, specifically, the locking protrusion 311 of the casing 31 is matched with the locking groove 25 of the accommodating groove 26, so that the cable buckle 3 is installed on the In an alternative embodiment, the locking groove of the casing 31 can also be used to match the locking protrusion of the accommodating groove 26 .

可选地,所述步骤S60之后还包括步骤:Optionally, after the step S60, the step further includes:

S70、将所述第四电路板12、所述铜片13的铜侧板132、所述电缆32的内部导线分别与所述第三电路板10进行焊接;S70, welding the fourth circuit board 12, the copper side plate 132 of the copper sheet 13, and the inner wire of the cable 32 to the third circuit board 10 respectively;

S80、向所述容置槽26内填充密封胶;S80, filling the accommodating groove 26 with sealant;

S90、将装有所述第二旋钮16的所述盖体1盖设在所述壳体2上,在所述壳体2的底部通槽处安装盖板28,并将所述盖体1、所述盖板28与所述壳体2的连接处进行焊接。S90. Cover the cover body 1 equipped with the second knob 16 on the casing 2, install a cover plate 28 at the bottom through groove of the casing 2, and place the cover body 1 , The joint between the cover plate 28 and the housing 2 is welded.

可选地,所述步骤S70和S90中的焊接为超声波焊接;在所述步骤S90之前,可将所述第二旋钮16预先安装好第二密封圈162和卡簧161,该预装过程可与所述步骤S90之前的步骤并行操作;此外,在所述步骤S90之前,还包括将所述发射透镜5预先通过点胶的方式安装在所述壳体2内,该过程也可与所述步骤S90之前的步骤并行操作,根据生产线的实际情况灵活操作即可。Optionally, the welding in the steps S70 and S90 is ultrasonic welding; before the step S90, the second knob 16 can be pre-installed with the second sealing ring 162 and the snap ring 161, and the pre-installation process can be It is operated in parallel with the steps before the step S90; in addition, before the step S90, it also includes pre-installing the emitting lens 5 in the housing 2 by dispensing, and this process can also be combined with the The steps before step S90 are operated in parallel, and can be operated flexibly according to the actual situation of the production line.

可选地,在步骤S90中,进行超声波焊接之前,采用气枪吹走壳体内腔中的灰尘,尤其是附着在发射透镜和接收透镜上的灰尘,由于超声波焊接是将传感器密封的最后步骤,应保证内部的清洁,从而保证传感器的精度。Optionally, in step S90, before performing ultrasonic welding, use an air gun to blow away the dust in the inner cavity of the casing, especially the dust attached to the transmitting lens and the receiving lens. Since ultrasonic welding is the last step of sealing the sensor, it should be Ensure the cleanliness of the interior, thereby ensuring the accuracy of the sensor.

需要说明的是,上述步骤中,对于某些类型的光电传感器来说,第三电路板10并非必须,当第二电路板7能够满足搭载要求时,可以不设置第三电路板,在此情况下,则无需安装第三电路板的步骤S50,也无需安装屏蔽电路板和第四电路板的步骤S510和S520,在后续的步骤S70中,将铜片的铜侧板、电缆的内部导线焊接在第二电路板7上。It should be noted that, in the above steps, for some types of photoelectric sensors, the third circuit board 10 is not necessary, and when the second circuit board 7 can meet the loading requirements, the third circuit board may not be provided. In this case Next, there is no need for the step S50 of installing the third circuit board, nor for the steps S510 and S520 of installing the shielded circuit board and the fourth circuit board. In the subsequent step S70, the copper side plate of the copper sheet and the inner wire of the cable are welded on the second circuit board 7 .

需要说明的是,在其他类型的光电传感器中,透镜的设置会存在不同,例如,在光电发射器中只有发射透镜,则只需在支架本体上安装发射透镜即可;而在光电接收器中只有接收透镜,则只需在支架本体上安装接收透镜即可。因此,上述步骤在适用于光电发射器或光电接收器中时,对透镜的安装需要进行适应性的调整,只需要安装一个发射透镜或接收透镜即可,例如,对于光电发射器,在步骤S10中,将发射透镜安装在支架本体上;对于光电接收器,在步骤S10中,将接收透镜安装在支架本体上。It should be noted that in other types of photoelectric sensors, the setting of the lens will be different. For example, if there is only a transmitting lens in the photoelectric transmitter, it is only necessary to install the transmitting lens on the bracket body; while in the photoelectric receiver If there is only a receiving lens, it is only necessary to install the receiving lens on the bracket body. Therefore, when the above steps are applicable to photoelectric transmitters or photoelectric receivers, the installation of the lens needs to be adjusted adaptively, and only one transmitting lens or receiving lens needs to be installed. For example, for the photoelectric transmitter, in step S10 , the transmitting lens is installed on the bracket body; for the photoelectric receiver, in step S10, the receiving lens is installed on the bracket body.

显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。Apparently, the above-mentioned embodiments are only examples for clear description, rather than limiting the implementation. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. And the obvious changes or changes derived therefrom are still within the scope of protection of the present invention.

Claims (25)

1. A photoelectric sensor, comprising:
a lens holder including a holder body;
the receiving lens is arranged on the bracket body;
a first circuit board mounted on the lens holder, the first circuit board being located outside the holder body;
the potentiometer is arranged on the first circuit board;
a first knob corresponding to the potentiometer position;
and the second circuit board is positioned above the lens bracket and is perpendicular to the first circuit board.
2. The optoelectronic sensor of claim 1, further comprising a cable clasp comprising:
a cable comprising an inner conductor and a jacket surrounding the inner conductor;
A capsule injection molded integrally with the outer jacket; the inner lead penetrates through the sealing shell and extends to the inner side of the sealing shell.
3. The photoelectric sensor according to claim 2, further comprising a housing, wherein a plurality of first positioning columns and a plurality of guide plates are arranged in the housing, a plurality of first positioning holes corresponding to the first positioning columns are formed in the second circuit board, and the guide plates are abutted with the bracket body; the shell is provided with a containing groove for containing the envelope.
4. A photoelectric sensor according to claim 3, wherein at least one side wall of the enclosure has a locking projection or a locking groove, and the inner side wall of the receiving groove has a locking structure corresponding to the locking projection or the locking groove, and the receiving groove communicates with the inner cavity of the housing through an opening through which the inner wire extends into the inner cavity of the housing.
5. The photosensor of claim 4, wherein the top of the first circuit board has an upwardly extending tab and the second circuit board has a first slot that mates with the tab.
6. The photosensor according to claim 5, further comprising a third circuit board and a fourth circuit board, the third circuit board being located above the second circuit board, the fourth circuit board being connected to a side end face of the second circuit board and a side end face of the third circuit board; at least one second positioning column is arranged in the shell, and at least one second positioning hole corresponding to the second positioning column is formed in the second circuit board.
7. The photoelectric sensor of claim 6, wherein a shielding circuit board is disposed between the second circuit board and the third circuit board, and a second slot is disposed on the shielding circuit board and is matched with the bump.
8. The photoelectric sensor according to claim 7, wherein the shielding circuit board is an FPC, and a distal end thereof is bent and extended along a side surface of the second circuit board and fixed to a lower surface of the second circuit board.
9. The photoelectric sensor of claim 8, further comprising a copper sheet, wherein the copper sheet is U-shaped and comprises a copper bottom plate and copper side plates positioned at two sides of the copper bottom plate, wherein the copper bottom plate is positioned below the second circuit board, the copper side plates at two sides are respectively positioned at two sides of the second circuit board and respectively extend to the upper side of the third circuit board, and wherein the copper side plate at one side is positioned at the outer side of the fourth circuit board.
10. The photoelectric sensor of claim 9, wherein the lens holder further comprises at least two elastic arms extending outwardly from an outer sidewall of the holder body, the elastic arms having inwardly extending positioning portions, the positioning portion heads having positioning surfaces; the first knob is provided with a rod-shaped main body, and the rod-shaped main body is positioned between the positioning surfaces of the elastic arms.
11. The photoelectric sensor of claim 10, wherein a side of the positioning portion facing the bracket body has a first retaining surface, the middle portion of the rod-shaped body has a shoulder outer ring, and a first end of the shoulder outer ring has a second retaining surface that mates with the first retaining surface.
12. The photosensor according to claim 11, further comprising a cover; the cover body is covered and arranged above the shell body, and a second knob is arranged on the cover body.
13. The photosensor according to claim 12, further comprising an emitter lens mounted on the housing.
14. A method of assembling a photoelectric sensor according to claim 1, comprising the steps of:
S1, mounting the receiving lens on the bracket body, and then mounting the lens bracket into a shell of a sensor;
s2, mounting the first circuit board provided with the potentiometer on the lens bracket;
s3, enabling the first knob to penetrate through the shell and be aligned and assembled with the potentiometer;
and S4, mounting the second circuit board into the shell and placing the second circuit board above the lens bracket.
15. A method of assembling a photoelectric sensor according to claim 13, comprising the steps of:
s10, mounting the receiving lens on the bracket body, and then mounting the lens bracket into the shell along the guide plate;
s20, mounting the first circuit board provided with the potentiometer on the lens bracket;
s30, enabling the first knob to penetrate through the shell and be aligned and assembled with the potentiometer;
s40, enabling the second circuit board to pass through the first positioning column, and then installing the second circuit board above the lens bracket;
s50, the third circuit board passes through the second positioning column, and then the third circuit board is installed above the second circuit board;
And S60, matching the locking convex blocks or the locking grooves of the sealing shell with the locking structures of the containing grooves, so that the cable is buckled and mounted on the shell.
16. The method of assembling as claimed in claim 15, wherein said step S40 further comprises: the first circuit board and the second circuit board are spliced by matching the convex blocks with the first slots.
17. The assembling method according to claim 15, wherein in the step S30, a first sealing ring is first sleeved on the rod-shaped main body of the first knob, and then the shoulder outer ring of the first knob passes through the positioning surfaces of the at least two elastic arms, so that the first knob and the potentiometer are assembled in alignment.
18. The method of assembling of claim 15, further comprising step S31 between said step S30 and said step S40: mounting the copper sheet on the lens support, wherein a copper bottom plate of the copper sheet is arranged on the upper surface of the lens support; in the step S40, the second circuit board is mounted above the copper base plate.
19. The method of assembling as claimed in claim 18, wherein said step S50 further comprises the steps of:
S510, mounting the shielding circuit board above the second circuit board;
s520, connecting the fourth circuit board to the side end surface of the second circuit board;
and S530, connecting the side end surface of the third circuit board with the fourth circuit board.
20. The assembly method according to claim 19, wherein in the step S510, the second slot of the shielding circuit board is plugged into the bump, and the end of the shielding circuit board is fixed to the lower surface of the second circuit board by soldering.
21. The method according to claim 19, wherein in step S520 and step S530, the fourth circuit board is soldered to the side end surface of the second circuit board and the side end surface of the third circuit board.
22. The assembly method according to claim 19, further comprising a step S521 of heat-fusing the first positioning post protruding from the top end of the second circuit board to fix the second circuit board in the housing between the step S520 and the step S530; step S540 is further included after step S530, in which the second positioning post protrudes from the top end of the third circuit board to perform heat fusion, so as to fix the third circuit board in the housing.
23. The method of assembling as claimed in claim 19, wherein said step S60 further comprises: the inner wire is passed through the opening and extends into the interior cavity of the housing.
24. The method of assembling as claimed in claim 23, wherein said step S60 further comprises the steps of:
s70, respectively welding the fourth circuit board, the copper side plate of the copper sheet and the inner lead of the cable with the third circuit board;
s80, filling sealant into the accommodating groove;
and S90, covering the cover body provided with the second knob on the shell, installing a cover plate at the bottom through groove of the shell, and welding the connection parts of the cover body, the cover plate and the shell.
25. The method of assembly of claim 24, wherein the welding in steps S70 and S90 is ultrasonic welding; before the step S90, the method includes pre-installing a second sealing ring and a clamping spring on the second knob, and pre-installing the emission lens in the shell by dispensing.
CN202211724550.9A 2022-12-30 2022-12-30 Photoelectric sensor and assembly method thereof Pending CN116193793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211724550.9A CN116193793A (en) 2022-12-30 2022-12-30 Photoelectric sensor and assembly method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211724550.9A CN116193793A (en) 2022-12-30 2022-12-30 Photoelectric sensor and assembly method thereof

Publications (1)

Publication Number Publication Date
CN116193793A true CN116193793A (en) 2023-05-30

Family

ID=86431954

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211724550.9A Pending CN116193793A (en) 2022-12-30 2022-12-30 Photoelectric sensor and assembly method thereof

Country Status (1)

Country Link
CN (1) CN116193793A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213842198U (en) * 2020-12-01 2021-07-30 深圳市华怡丰科技有限公司 Photoelectric sensor convenient to adjust
CN113243102A (en) * 2018-11-13 2021-08-10 Lg伊诺特有限公司 Camera module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113243102A (en) * 2018-11-13 2021-08-10 Lg伊诺特有限公司 Camera module
CN213842198U (en) * 2020-12-01 2021-07-30 深圳市华怡丰科技有限公司 Photoelectric sensor convenient to adjust

Similar Documents

Publication Publication Date Title
USRE48778E1 (en) Optical module and assembly method thereof
CN1129978C (en) Modular electrical connector assemblies with magnetic filter and/or visual indicator
CN102200614B (en) Optical module with optical axis bent perpendicularly within package
CN105301733A (en) Lens moving apparatus
US20070116323A1 (en) Speaker apparatus and terminal member
WO2008015817A1 (en) Connector for connecting electronic component
WO2004010686A1 (en) Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module
CN100380924C (en) Camera module, holder for use in camera module, camera system and method of manufacturing camera module
WO2008015862A1 (en) Connector for connecting electronic component
CN110277722A (en) A kind of package assembling of laser, light source module group and laser projection
US20190293882A1 (en) Transistor outline package and method for producing a transistor outline package
KR20170108668A (en) Lens barrel assembly and lens module including thereof
CN115473949B (en) Image pickup device, terminal equipment and assembly method of image pickup device
KR101803477B1 (en) Power applyting module and backlight assembly
CN116193793A (en) Photoelectric sensor and assembly method thereof
CN107516759A (en) A kind of low frequency radiating element
US8093710B2 (en) Non-uniform feedthrough and lead configuration for a transistor outline package
CN115166915B (en) Packaging structure of photoelectric module and photoelectric module using packaging structure
CN219301646U (en) Reflection type photoelectric sensor
CN113193439B (en) A kind of interface unit
CN216848429U (en) Infrared camera plug-in
CN219980808U (en) Novel photoelectric switch
KR20200076347A (en) Camera Module
CN213635134U (en) Terminal
TWI782715B (en) Distance sensor package structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination