CN116168954B - Electrolytic capacitor - Google Patents
Electrolytic capacitor Download PDFInfo
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- CN116168954B CN116168954B CN202111411832.9A CN202111411832A CN116168954B CN 116168954 B CN116168954 B CN 116168954B CN 202111411832 A CN202111411832 A CN 202111411832A CN 116168954 B CN116168954 B CN 116168954B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 126
- 239000002184 metal Substances 0.000 claims abstract description 55
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000003989 dielectric material Substances 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
本发明电解电容器包含电容本体及底座本体，电容本体包含封装体、电容及至少两引脚，电容设置于封装体中并由该封装体包覆密封，至少两引脚分别具有内端及外端，各内端与电容电连接，各外端自该电容穿出；底座本体设置于引脚穿出电容处，包含有底座及至少两金属层，底座具有至少两设置口，其中各引脚分别穿入各设置口并与各金属层电连接；封装体直接包覆电容替代习知的壳体与弹性密封体，能提升电解电容器的密合度，而金属层替代习知技术中引脚弯折的部分作为引脚与外界电连接的媒介，有利于制程的简化。
The electrolytic capacitor of the present invention comprises a capacitor body and a base body, wherein the capacitor body comprises a packaging body, a capacitor and at least two pins, wherein the capacitor is arranged in the packaging body and is covered and sealed by the packaging body, wherein the at least two pins respectively have an inner end and an outer end, wherein each inner end is electrically connected to the capacitor, and each outer end passes through the capacitor; wherein the base body is arranged at a position where the pin passes through the capacitor, and comprises a base and at least two metal layers, wherein the base has at least two setting openings, wherein each pin passes through each setting opening and is electrically connected to each metal layer; wherein the packaging body directly covers the capacitor instead of the conventional shell and elastic sealing body, thereby improving the closeness of the electrolytic capacitor, and wherein the metal layer replaces the bent portion of the pin in the conventional technology as a medium for electrically connecting the pin with the outside world, thereby facilitating the simplification of the manufacturing process.
Description
技术领域Technical Field
一种电解电容器，尤指能改善壳体与弹性密封体间密封度的一种电解电容器。An electrolytic capacitor, especially an electrolytic capacitor that can improve the sealing between the shell and the elastic sealing body.
背景技术Background Art
电解电容器为电子电路装置中常见的电子元件，其具有广泛的用途，例如储存电能、改善功率因子、滤波及共振等功能。一般的电解电容器的制作过程是经由将电容素子分别与化成液、氧化剂与单体材料等进行化成、聚合及老化反应以形成一电容，然后将处理后的该电容置于一壳体中，再由一弹性密封体密封于该壳体的开口端，使该壳体内部形成一密闭空间，该电容则位于该密闭空间内，借此与外部的水气与空气隔绝。Electrolytic capacitors are common electronic components in electronic circuit devices, and they have a wide range of uses, such as storing electrical energy, improving power factor, filtering, and resonance. The general manufacturing process of electrolytic capacitors is to form a capacitor by subjecting the capacitor element to chemical reaction, polymerization, and aging reaction with chemical solution, oxidant, and monomer materials, and then placing the processed capacitor in a shell, and then sealing the opening end of the shell with an elastic seal to form a closed space inside the shell. The capacitor is located in the closed space, thereby isolating it from external moisture and air.
然而，现有的电解电容器中，由于该弹性密封体与该壳体内壁的连结性不佳，使得该弹性密封体与该壳体不容易密合而有间隙，该弹性密封体与该壳体的密合度不佳会导致外界的水气从间隙进入电解电容器内部，进而影响电解电容器的效能及寿命。However, in the existing electrolytic capacitor, due to the poor connection between the elastic seal and the inner wall of the shell, the elastic seal and the shell are not easy to fit tightly and there is a gap. The poor fit between the elastic seal and the shell will cause external moisture to enter the electrolytic capacitor through the gap, thereby affecting the performance and life of the electrolytic capacitor.
另一方面，由于电子商品逐渐趋向小型化发展，使得表面黏着技术(SurfaceMount Technology,SMT)成为现今电子元件的安装主流，电解电容器也为其中之一。为将表面黏着技术应用于电解电容器，电解电容器的两引脚必须与一底座结合，先借由将该两引脚穿入该底座的两连接孔与该底座连接，再进一步将穿入该两连接孔的该两引脚向该底座弯折，使该两引脚贴合于该底座的底面，以便贴焊于电子装置中，虽然与该底座连接时电解电容器能应用表面黏着技术，但亦增加电解电容器的制程及时间，造成制作成本上升。On the other hand, as electronic products gradually develop towards miniaturization, surface mount technology (SMT) has become the mainstream installation method for electronic components, and electrolytic capacitors are one of them. In order to apply surface mount technology to electrolytic capacitors, the two pins of the electrolytic capacitor must be combined with a base. First, the two pins are inserted into the two connection holes of the base to connect with the base, and then the two pins inserted into the two connection holes are further bent toward the base so that the two pins fit the bottom surface of the base so as to be soldered in the electronic device. Although the electrolytic capacitor can apply surface mount technology when connected to the base, it also increases the process and time of the electrolytic capacitor, resulting in an increase in production costs.
因此，需要针对现有的电解电容器进行改良，简化电容本体与该底座连接的制程，并改善壳体与弹性密封体间密封度不佳的问题。Therefore, it is necessary to improve the existing electrolytic capacitors, simplify the process of connecting the capacitor body and the base, and improve the problem of poor sealing between the shell and the elastic sealing body.
发明内容Summary of the invention
有鉴于此，本发明的主要目的在于提出一种电解电容器，以期提升电解电容器的密合度，以及简化电解电容器与底座连接的制程。In view of this, the main purpose of the present invention is to provide an electrolytic capacitor, so as to improve the tightness of the electrolytic capacitor and simplify the process of connecting the electrolytic capacitor with the base.
为达成前述目的，本发明电解电容器包含有：To achieve the above-mentioned object, the electrolytic capacitor of the present invention comprises:
一电容本体，包含：A capacitor body, comprising:
一封装体；a packaging body;
一电容，设置于该封装体中，并由该封装体包覆密封；A capacitor is disposed in the package and is encapsulated and sealed by the package;
至少两引脚，分别具有一内端及一外端，该至少两引脚的各该内端与该电容电连接，该至少两引脚各该外端则自该电容穿出；以及At least two pins, each having an inner end and an outer end, wherein the inner ends of the at least two pins are electrically connected to the capacitor, and the outer ends of the at least two pins are extended out of the capacitor; and
一底座本体，设置于该至少两引脚穿出该电容处，包含有一底座及至少两金属层，且该底座包含分别对应于该至少两金属层的至少两设置口，该至少两金属层分别包含有一第一连接部及一第二连接部，各该第一连接部设置于各该设置口，各该第二连接部分别贴合于该底座的一底面；A base body, arranged at the place where the at least two pins pass through the capacitor, comprises a base and at least two metal layers, and the base comprises at least two setting openings corresponding to the at least two metal layers respectively, and the at least two metal layers respectively comprise a first connecting portion and a second connecting portion, each of the first connecting portions is arranged at each of the setting openings, and each of the second connecting portions is respectively attached to a bottom surface of the base;
其中，该至少两引脚分别与该至少两金属层电连接。The at least two pins are electrically connected to the at least two metal layers respectively.
本发明电解电容器中，由一体成形的该封装体包覆并密封该电容，以该封装体替代过去的壳体与弹性密封体，借此避免电容因与空气接触而劣化的情形发生。另一方面，该至少两金属层的各该第一连接部分别与各该引脚电连接，各该第二连接部则延伸至该底座的一底面，与习知电解电容器相比，本发明只需通过该至少两引脚分别与各该金属层焊接，即可借由各该金属层位于该底座的该底面的部分，以表面黏着技术(Surface MountTechnology,SMT)与电路板连接，不须如先前技术额外将两引脚弯折至底座的底面，简化本发明电容本体与底座连接的流程，降低电解电容器的制作时间及成本。In the electrolytic capacitor of the present invention, the capacitor is covered and sealed by the integrally formed package body, and the package body replaces the previous shell and elastic seal body, thereby preventing the capacitor from deteriorating due to contact with air. On the other hand, each of the first connecting parts of the at least two metal layers is electrically connected to each of the pins, and each of the second connecting parts extends to a bottom surface of the base. Compared with the conventional electrolytic capacitor, the present invention only needs to weld the at least two pins to each of the metal layers respectively, and can connect to the circuit board through the portion of each metal layer located on the bottom surface of the base by surface mounting technology (SMT), without the need to additionally bend the two pins to the bottom surface of the base as in the previous technology, simplifying the process of connecting the capacitor body of the present invention with the base, and reducing the production time and cost of the electrolytic capacitor.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1：本发明电解电容器其第一实施例的仰视立体示意图。FIG. 1 is a bottom perspective schematic diagram of a first embodiment of an electrolytic capacitor of the present invention.
图2：本发明电解电容器其第一实施例的俯视立体示意图。FIG. 2 is a top perspective schematic diagram of a first embodiment of an electrolytic capacitor of the present invention.
图3：本发明电解电容器其第一实施例的仰视平面示意图。FIG. 3 is a bottom plan view of a first embodiment of an electrolytic capacitor according to the present invention.
图4：本发明电解电容器其第一实施例的剖面侧视示意图。FIG. 4 is a schematic cross-sectional side view of a first embodiment of an electrolytic capacitor of the present invention.
图5：本发明电解电容器其第二实施例的仰视立体示意图。FIG. 5 is a bottom perspective schematic diagram of a second embodiment of an electrolytic capacitor of the present invention.
图6：本发明电解电容器其第二实施例的俯视立体示意图。FIG. 6 is a top perspective schematic diagram of a second embodiment of an electrolytic capacitor of the present invention.
图7：本发明电解电容器其第二实施例的仰视平面示意图。FIG. 7 is a bottom plan view of a second embodiment of an electrolytic capacitor according to the present invention.
具体实施方式DETAILED DESCRIPTION
以下配合图式及本发明的较佳实施例，进一步阐述本发明为达成预定发明目的所采取的技术手段。The following is a detailed description of the technical means used by the present invention to achieve the intended purpose of the invention with reference to the drawings and preferred embodiments of the present invention.
请参看图1至图4所示，第一实施例中，本发明电解电容器包含有一电容本体10及一底座本体20，该电容本体10包含一封装体11、一电容13、一保护层14及至少两引脚15，其中，该电容本体10设置于该底座本体20上。Please refer to Figures 1 to 4. In the first embodiment, the electrolytic capacitor of the present invention includes a capacitor body 10 and a base body 20. The capacitor body 10 includes a packaging body 11, a capacitor 13, a protective layer 14 and at least two pins 15, wherein the capacitor body 10 is disposed on the base body 20.
如图4所示，该封装体11包覆该电容13并将该电容13密封于该底座本体20上，提供该电容13保护功能，以防止该电容13与外界的水气及空气接触，避免该电容13发生氧化、电流外泄或介电材料溢出的现象，其中，该封装体11可由胶体固化后形成，于本实施例中该封装体11为方形封装体。As shown in FIG. 4 , the package body 11 covers the capacitor 13 and seals the capacitor 13 on the base body 20, providing a protection function for the capacitor 13 to prevent the capacitor 13 from contacting with external moisture and air, thereby preventing the capacitor 13 from being oxidized, leaking current, or overflowing dielectric material. The package body 11 can be formed by curing a colloid. In this embodiment, the package body 11 is a square package body.
该电容13设置于该封装体11中，且该电容13包含一电容素子与结合于该电容素子的介电材料，该电容素子由一阳极膜、一阴极膜及多个隔离层交替设置卷绕而成，各该隔离层设置于该阳极膜及该阴极膜间，用以防止该阳极膜及该阴极膜于卷绕时因接触而导致短路，且该电容素子可与不同的介电材料结合而构成液态、固态或固液态电容，液态电容中使用的介电材料为电解液，固态电容中使用的介电材料为导电高分子，固液态电容中使用的介电材料则为电解液及导电高分子两者所构成。The capacitor 13 is arranged in the package body 11, and the capacitor 13 includes a capacitor element and a dielectric material combined with the capacitor element. The capacitor element is formed by an anode film, a cathode film and a plurality of isolation layers alternately arranged and wound. Each isolation layer is arranged between the anode film and the cathode film to prevent the anode film and the cathode film from short-circuiting due to contact during winding. The capacitor element can be combined with different dielectric materials to form a liquid, solid or solid-liquid capacitor. The dielectric material used in the liquid capacitor is an electrolyte, the dielectric material used in the solid capacitor is a conductive polymer, and the dielectric material used in the solid-liquid capacitor is composed of both an electrolyte and a conductive polymer.
该保护层14设于该电容13与该封装体11之间，用以防止注胶形成该封装体11时，成型材料流入该电容13其阳极膜及阴极膜间的间隙内，影响该电容13运作。The protection layer 14 is disposed between the capacitor 13 and the package body 11 to prevent molding material from flowing into the gap between the anode film and the cathode film of the capacitor 13 when the package body 11 is formed by injection molding, thereby affecting the operation of the capacitor 13 .
本实施例以该至少两引脚15为两引脚15为例，各该引脚15具有一内端151及一外端152，各该引脚15的内端151分别伸入该电容13中与该电容13电连接，外端152则自该电容13穿出，该两引脚15中，其中的一引脚15的该内端151连接于该电容13的该阳极膜，视为正极引脚，另一引脚15的该内端151连接于该电容13的该阴极膜，视为负极引脚。In this embodiment, the at least two pins 15 are taken as two pins 15 as an example, each of the pins 15 has an inner end 151 and an outer end 152, the inner end 151 of each of the pins 15 respectively extends into the capacitor 13 and is electrically connected to the capacitor 13, and the outer end 152 passes through the capacitor 13. Among the two pins 15, the inner end 151 of one of the pins 15 is connected to the anode film of the capacitor 13, which is regarded as a positive pin, and the inner end 151 of the other pin 15 is connected to the cathode film of the capacitor 13, which is regarded as a negative pin.
该底座本体20设置于该至少两引脚15穿出该电容13处，该底座本体20包含有一底座21、至少两金属层22，于本实施例中，以该至少两金属层22为两金属层22为例，该底座21可为一绝缘底座，该底座21包含一第一侧面211、一第二侧面212、一第三侧面213、一第四侧面214、一顶面215、一底面216及至少两设置口218，该至少两设置口218的数量与该至少两引脚15的数量相同，于本实施例中，以该至少两设置口218为两设置口218为例，该第一侧面211相对于该第三侧面213，该第二侧面212相对于该第四侧面214，该至少两引脚15穿出该电容13处设置于该底座21的该底面216，各该设置口218可贯穿该底座21的该顶面215与该底面216。该两金属层22可为两铜镀层，经由电镀形成于该底座21上，其中，如图4所示，各该金属层22包含一第一连接部221与一第二连接部222，该第一连接部221形成于该底座21的各该设置口218的壁面并延伸至该顶面215，且具有一穿孔223，该穿孔223贯穿该底座21的顶面215及底面216，其中一金属层22贴合于该底面216及该第一侧面211上，且该第二连接部222的末端延伸至该顶面215的边缘，使该第二连接部222于该第一侧面211及该顶面215的边缘形成倒勾型的一固定结构，以防止该金属层22自该底座21脱落，而该金属层22的该第二连接部222的末端嵌入该第一侧面211，使该第二连接部222的末端未突出该第一侧面211，并与该第一侧面211齐平，同样地，另一金属层22贴合于该底面216及该第三侧面213上，该第二连接部222的末端延伸至该顶面215的边缘，使该第二连接部222于该第三侧面213及该顶面215的边缘形成倒勾型的一固定结构，而另一该金属层22的该第二连接部222的末端嵌入该第三侧面213，使该第二连接部222的末端未突出该第三侧面213，并与该第三侧面213齐平。The base body 20 is disposed at the place where the at least two pins 15 pass through the capacitor 13. The base body 20 includes a base 21 and at least two metal layers 22. In this embodiment, the at least two metal layers 22 are two metal layers 22. For example, the base 21 can be an insulating base. The base 21 includes a first side surface 211, a second side surface 212, a third side surface 213, a fourth side surface 214, a top surface 215, a bottom surface 216 and at least two setting openings 218. The number of the at least two setting openings 218 is the same as the number of the at least two pins 15. In this embodiment, taking the at least two setting openings 218 as two setting openings 218 as an example, the first side surface 211 is relative to the third side surface 213, the second side surface 212 is relative to the fourth side surface 214, and the at least two pins 15 pass through the capacitor 13 and are set on the bottom surface 216 of the base 21. Each setting opening 218 can pass through the top surface 215 and the bottom surface 216 of the base 21. The two metal layers 22 may be two copper-plated layers formed on the base 21 by electroplating, wherein, as shown in FIG. 4 , each of the metal layers 22 includes a first connection portion 221 and a second connection portion 222, wherein the first connection portion 221 is formed on the wall surface of each of the setting openings 218 of the base 21 and extends to the top surface 215, and has a through hole 223, wherein the through hole 223 penetrates the top surface 215 and the bottom surface 216 of the base 21, wherein a metal layer 22 is attached to the bottom surface 216 and the first side surface 211, and the end of the second connection portion 222 extends to the edge of the top surface 215, so that the second connection portion 222 forms a hook-shaped fixing structure at the edge of the first side surface 211 and the top surface 215 to prevent the metal layer 22 The metal layer 22 is provided with a second connection portion 222 which is provided at the bottom surface 216 and the third side surface 213, and the second connection portion 2 ...
于本实施例中，该底座本体20进一步包含有一绝缘层24，该绝缘层24设置于该底座21与该电容本体10之间，并覆盖该顶面215及设置于该顶面215的各该第二连接部222上，防止该电容本体10的该壳体11与延伸至该顶面215的各该金属层22电性连接。In this embodiment, the base body 20 further includes an insulating layer 24, which is arranged between the base 21 and the capacitor body 10 and covers the top surface 215 and each of the second connecting portions 222 arranged on the top surface 215, thereby preventing the shell 11 of the capacitor body 10 from being electrically connected to each of the metal layers 22 extending to the top surface 215.
于本实施例中，该底座本体20进一步设有两凹槽25，该两凹槽25贯通该底座本体20的该顶面215及该底面216，一凹槽25设于该底座本体20的该第一侧面211，且该第一侧面211上的该金属层22的该第二连接部222设于该凹槽25处，并沿该凹槽25的壁面设置，其中该第二连接部222未突出该凹槽25位于该第一侧面211及该顶面215的边缘，另一凹槽25设于该底座本体20的该第三侧面216上，且该第三侧面213上的该金属层22的该第二连接部222设于该凹槽25处，并沿该凹槽25的壁面设置，其中该第二连接部222未突出该凹槽25位于该第三侧面213及该顶面215的边缘。当不同的电解电容器因封装或配置问题需要相互连接时，可通过各该凹槽25的位置相互对齐，于本实施例中，各该凹槽25为方形凹槽，不同的电解电容器的各该凹槽25可通过相互接触而形成方形孔洞，外部电子设备即可通过导线于各该凹槽25所形的方形孔洞与不同的电解电容器电连接。In this embodiment, the base body 20 is further provided with two grooves 25, which pass through the top surface 215 and the bottom surface 216 of the base body 20. One groove 25 is provided on the first side surface 211 of the base body 20, and the second connection portion 222 of the metal layer 22 on the first side surface 211 is provided at the groove 25 and is provided along the wall surface of the groove 25, wherein the second connection portion 222 does not protrude from the edge of the groove 25 located on the first side surface 211 and the top surface 215. The other groove 25 is provided on the third side surface 216 of the base body 20, and the second connection portion 222 of the metal layer 22 on the third side surface 213 is provided at the groove 25 and is provided along the wall surface of the groove 25, wherein the second connection portion 222 does not protrude from the edge of the groove 25 located on the third side surface 213 and the top surface 215. When different electrolytic capacitors need to be connected to each other due to packaging or configuration issues, they can be aligned with each other through the positions of the grooves 25. In this embodiment, each groove 25 is a square groove, and the grooves 25 of different electrolytic capacitors can form square holes by contacting each other. External electronic devices can be electrically connected to different electrolytic capacitors through wires in the square holes formed by the grooves 25.
除此之外，该封装体11连接该底座21其第一侧面211的一侧面上，可设有与该第一侧面211上的该凹槽25连通的一槽道111，同样地，该封装体11连接该底座21其第三侧面213的一侧面上，可设有与该第三侧面213上的该凹槽25连通的另一槽道111。In addition, a groove 111 communicating with the groove 25 on the first side 211 may be provided on a side surface of the package body 11 connected to the base 21. Similarly, another groove 111 communicating with the groove 25 on the third side 213 may be provided on a side surface of the package body 11 connected to the base 21.
该电容本体10通过该两引脚15与该底座本体20的该两金属层22电连接，其中，该两引脚15的两外端152分别穿入该两金属层22的第一连接部221的穿孔223，且各该引脚15其外端152的外周面与该两金属层22间设置有一焊料层23，各该焊料层23覆盖各该引脚15的两外端152，各该焊料层23由锡、铜、银、金等导电金属材料所构成，各该引脚15的外周面通过各该焊料层23连接各该第一连接部221，使该两引脚15分别与该两金属层22固定电连接，其中该两引脚15未突出该底座21的该底面26，该两引脚15的该两外端152可通过该两焊料层23与该两金属层22的第一连接部221经由焊接电连接及固定，该两引脚15与该两金属层22稳固电性连接。当电解电容器与电路板连接时，位于该底座21的该底面26的该两金属层22(即：各该第二连接部222)可经由表面黏着技术与电路板上相对应的脚位电连接。The capacitor body 10 is electrically connected to the two metal layers 22 of the base body 20 through the two pins 15, wherein the two outer ends 152 of the two pins 15 are respectively inserted into the through holes 223 of the first connecting parts 221 of the two metal layers 22, and a solder layer 23 is arranged between the outer peripheral surface of the outer end 152 of each pin 15 and the two metal layers 22, and each solder layer 23 covers the two outer ends 152 of each pin 15, and each solder layer 23 is made of a conductive metal such as tin, copper, silver, or gold. The outer circumference of each pin 15 is connected to each first connection portion 221 through each solder layer 23, so that the two pins 15 are respectively fixedly electrically connected to the two metal layers 22, wherein the two pins 15 do not protrude from the bottom surface 26 of the base 21, and the two outer ends 152 of the two pins 15 can be electrically connected and fixed to the first connection portions 221 of the two metal layers 22 through the two solder layers 23 by welding, and the two pins 15 are firmly electrically connected to the two metal layers 22. When the electrolytic capacitor is connected to the circuit board, the two metal layers 22 (i.e., each second connection portion 222) located on the bottom surface 26 of the base 21 can be electrically connected to the corresponding pins on the circuit board through the surface mounting technology.
请参看图5至图7所示，第二实施例与第一实施例的差别在于，贴合于该底面216及该第一侧面211上的其中一金属层22中，该第二连接部222贴合该底面216的部分其一侧边向该底面216与该第二侧面212的交界处延伸，但未延伸至该底面216与该第二侧面212的交界线，另一侧边向该底面216与该第四侧面214的交界处延伸，但未延伸至该底面216与该第四侧面214的交界线，使该金属层22于该底面呈现T字形结构，增加该底面216上该金属层22的设置面积。Please refer to Figures 5 to 7. The difference between the second embodiment and the first embodiment is that, in one of the metal layers 22 adhered to the bottom surface 216 and the first side surface 211, one side of the portion of the second connecting portion 222 adhered to the bottom surface 216 extends toward the junction of the bottom surface 216 and the second side surface 212, but does not extend to the boundary line between the bottom surface 216 and the second side surface 212, and the other side extends toward the junction of the bottom surface 216 and the fourth side surface 214, but does not extend to the boundary line between the bottom surface 216 and the fourth side surface 214, so that the metal layer 22 presents a T-shaped structure on the bottom surface, thereby increasing the setting area of the metal layer 22 on the bottom surface 216.
同样地，贴合于该底面216及该第三侧面213上的另一金属层22中，该第二连接部222贴合该底面216的部分其一侧边向该底面216与该第二侧面212的交界处延伸，但未延伸至该底面216与该第二侧面212的交界线，另一侧边向该底面216与该第四侧面214的交界处延伸，但未延伸至该底面216与该第四侧面214的交界线，使该金属层22于该底面呈现T字形结构，增加该底面216上该金属层22的设置面积。Similarly, in another metal layer 22 adhered to the bottom surface 216 and the third side surface 213, one side of the portion of the second connecting portion 222 adhered to the bottom surface 216 extends toward the junction of the bottom surface 216 and the second side surface 212, but does not extend to the boundary line between the bottom surface 216 and the second side surface 212, and the other side extends toward the junction of the bottom surface 216 and the fourth side surface 214, but does not extend to the boundary line between the bottom surface 216 and the fourth side surface 214, so that the metal layer 22 presents a T-shaped structure on the bottom surface, thereby increasing the setting area of the metal layer 22 on the bottom surface 216.
于一较佳实施例中，该电容本体10可进一步包含有一印刷层，该印刷层可为一电镀层，设置于该封装体11的外表面上用以供油墨附着，以将电解电容器的元件编号、电容量等信息印刷于该电容本体10的外表面上，方便使用者辨识电解电容器的品项与规格。In a preferred embodiment, the capacitor body 10 may further include a printing layer, which may be an electroplating layer, disposed on the outer surface of the package body 11 for ink to adhere to, so as to print the component number, capacitance and other information of the electrolytic capacitor on the outer surface of the capacitor body 10, so as to facilitate users to identify the items and specifications of the electrolytic capacitor.
于一较佳实施例中，该两金属层22中，设置有其中一金属层22的该底座21的一侧可形成有两斜角，举例而言，该第一侧面211形成有两斜角，且该第一侧面211连接该封装体11的一侧面亦形成有两斜角，可通过斜角的设置分辨电解电容器的正负极。In a preferred embodiment, one side of the base 21 on which one of the two metal layers 22 is disposed may be formed with two oblique angles. For example, the first side surface 211 is formed with two oblique angles, and a side surface of the first side surface 211 connected to the package body 11 is also formed with two oblique angles. The positive and negative poles of the electrolytic capacitor can be distinguished by the setting of the oblique angles.
综上所述，本发明电解电容器通过一体成形的该封装体11直接包覆该电容13，以该封装体11替代过去的壳体与弹性密封体，能够避免习知技术中因壳体与弹性密封体分离进而影响电解电容器密封性的状况发生，另一方面，当该电容本体10与该底座21连接时，只需将该两引脚15穿入相对应的各该设置口218，并将该两引脚15与位于该两设置口218的该两金属层22通过该两焊料层23进行焊接，使该两引脚15分别与该两金属层22电性连接，与习知电解电容器相比，减少电容本体与底座连接后各引脚需要进一步弯折的步骤，简化电容本体与底座连接所需要的制程，进而降低电解电容器的制作及时间成本。In summary, the electrolytic capacitor of the present invention directly covers the capacitor 13 through the integrally formed packaging body 11, and the packaging body 11 replaces the previous shell and elastic seal, which can avoid the situation in the conventional technology that the shell and the elastic seal are separated and thus affect the sealing of the electrolytic capacitor. On the other hand, when the capacitor body 10 is connected to the base 21, it is only necessary to insert the two pins 15 into the corresponding setting openings 218, and weld the two pins 15 and the two metal layers 22 located at the two setting openings 218 through the two solder layers 23, so that the two pins 15 are electrically connected to the two metal layers 22 respectively. Compared with the conventional electrolytic capacitor, the step of further bending each pin after the capacitor body is connected to the base is reduced, the process required for connecting the capacitor body and the base is simplified, and the production and time cost of the electrolytic capacitor are reduced.
以上所述仅是本发明的优选实施例而已，并非对本发明做任何形式上的限制，虽然本发明已以优选实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案的范围内，当可利用上述揭示的技术内容做出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案的内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments of equivalent changes without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.
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