CN116160516A - Chip implantation production equipment for a plate - Google Patents
Chip implantation production equipment for a plate Download PDFInfo
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- CN116160516A CN116160516A CN202310007614.1A CN202310007614A CN116160516A CN 116160516 A CN116160516 A CN 116160516A CN 202310007614 A CN202310007614 A CN 202310007614A CN 116160516 A CN116160516 A CN 116160516A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000002513 implantation Methods 0.000 title claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 34
- 238000004080 punching Methods 0.000 claims abstract description 16
- 238000003860 storage Methods 0.000 claims description 34
- 238000005553 drilling Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 16
- 238000009434 installation Methods 0.000 abstract description 11
- 239000003292 glue Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 238000009412 basement excavation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27C—PLANING, DRILLING, MILLING, TURNING OR UNIVERSAL MACHINES FOR WOOD OR SIMILAR MATERIAL
- B27C3/00—Drilling machines or drilling devices; Equipment therefor
- B27C3/02—Stationary drilling machines with a single working spindle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27C—PLANING, DRILLING, MILLING, TURNING OR UNIVERSAL MACHINES FOR WOOD OR SIMILAR MATERIAL
- B27C9/00—Multi-purpose machines; Universal machines; Equipment therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G65/00—Loading or unloading
- B65G65/30—Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
- B65G65/32—Filling devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
技术领域technical field
本申请涉及板材加工生产技术领域,尤其是涉及一种板材的芯片植入生产设备。The present application relates to the technical field of sheet material processing and production, in particular to a sheet material chip implantation production equipment.
背景技术Background technique
木制品家具,作为家具主流产品之一,被大多家庭广泛的运用,其中对于木制品家具实用状态以及生产信息追踪,已经成为木制品家具走向高端行业的一个必经之路。Wooden furniture, as one of the mainstream furniture products, is widely used by most families. Among them, tracking the practical status and production information of wooden furniture has become the only way for wood furniture to go to the high-end industry.
在生产木制家具的过程中,可以先在制作家具的板材内安装射频芯片,例如NFC芯片、RFRD芯片等,在生产过程中或后续维护过程中,通过识别读取芯片的型号,匹配数据库中芯片型号对应的数据库信息,以便于达到生产管理和后续家具维护的目的。In the process of producing wooden furniture, radio frequency chips, such as NFC chips, RFRD chips, etc., can be installed in the furniture board first. During the production process or subsequent maintenance process, the model of the read chip can be identified and matched with the database. The database information corresponding to the chip model, in order to achieve the purpose of production management and subsequent furniture maintenance.
但在使用过程中,缺乏将芯片安装于板材中的工具,通过人工安装的方式较为繁琐,同时将芯片安装于板材的效率较低。However, in the process of use, there is a lack of tools for installing the chip on the board, and the method of manual installation is relatively cumbersome, and the efficiency of installing the chip on the board is low.
发明内容Contents of the invention
为了便于将芯片安装于板材中,本申请提供一种板材的芯片植入生产设备。In order to facilitate the installation of chips in boards, the present application provides a chip implantation production equipment for boards.
本申请提供的一种板材的芯片植入生产设备采用如下的技术方案:The chip implantation production equipment provided by this application adopts the following technical scheme:
一种板材的芯片植入生产设备,包括工作台板材,所述工作台固定连接有安装架,所述板材放置于所述工作台上;所述安装架上设置有用于按压板材的按压机构,所述工作台上固定连接有挡板,所述板材与挡板相抵,所述工作台上还安装有在板材上打孔的打孔机构,所述工作台上还安装有用于将芯片移送至板材上凹槽处的输送机构。A chip implantation production equipment for a plate, comprising a workbench plate, the workbench is fixedly connected with a mounting frame, the plate is placed on the workbench; a pressing mechanism for pressing the plate is provided on the mounting frame, A baffle is fixedly connected to the workbench, and the plate is offset against the baffle, and a punching mechanism for punching holes in the plate is also installed on the workbench, and a device for transferring chips to Conveying mechanism at the groove on the sheet.
通过采用上述技术方案,为了便于将芯片安装于板材中,需要工作人员先将板材移动至工作台上,并使板材与挡板相抵,接着再驱动按压机构,使得按压机构按压板材,然后通过打孔机构在板材上钻出用于安装芯片的凹槽,接下来在通过输送机构将芯片移送至板材上的凹槽处,已完成对板材上芯片的初步安装,紧接着工人只需在板材的凹槽处添加固定芯片的胶水,即可达到便于芯片安装于板材内的目的。By adopting the above-mentioned technical solution, in order to facilitate the installation of chips in the board, it is necessary for the staff to move the board to the workbench first, and make the board and the baffle resist, and then drive the pressing mechanism so that the pressing mechanism presses the board, and then press the The hole mechanism drills a groove on the board for installing the chip, and then the chip is transferred to the groove on the board by the conveying mechanism, and the preliminary installation of the chip on the board has been completed, and then the worker only needs to place the chip on the board. Adding glue to fix the chip at the groove can achieve the purpose of facilitating the chip to be installed in the board.
优选的,所述按压机构包括按压气缸、液压缓冲器以及抵接板,所述按压气缸固定安装于所述安装架上,所述液压缓冲器固定安装于所述按压气缸的活塞杆上;所述抵接板固定连接于所述液压缓冲器的输出轴上,所述抵接板与放置于工作台上的板材相抵。Preferably, the pressing mechanism includes a pressing cylinder, a hydraulic buffer and an abutment plate, the pressing cylinder is fixedly installed on the installation frame, and the hydraulic buffer is fixedly installed on the piston rod of the pressing cylinder; The abutment plate is fixedly connected to the output shaft of the hydraulic buffer, and the abutment plate abuts against the plate placed on the workbench.
通过采用上述技术方案,当板材放置工作台上之后,启动按压气缸使得按压气缸的输出轴带动液压缓冲器和抵接板移动;同时在抵接板与板材相接触的过程中,抵接板在液压缓冲器的缓冲作用下,降低损坏板材表面的可能性。By adopting the above-mentioned technical scheme, after the plate is placed on the workbench, the pressing cylinder is activated so that the output shaft of the pressing cylinder drives the hydraulic buffer and the abutment plate to move; at the same time, when the abutment plate is in contact with the plate, the abutment plate Under the buffering effect of the hydraulic buffer, the possibility of damaging the surface of the plate is reduced.
优选的,所述抵接板上固定连接有引度板,所述引度板从靠近所述挡板的一侧到远离所述挡板的一侧倾斜向上弯曲设置。Preferably, an indexing plate is fixedly connected to the abutting plate, and the indexing plate is bent upwards obliquely from a side close to the baffle to a side far away from the baffle.
通过采用上述技术方案,利用引度板,以使得更换或推移板材过程中,板材直接与抵接板产生磕碰的可能性。By adopting the above-mentioned technical solution and using the indexing plate, the plate may directly collide with the abutting plate during the process of replacing or moving the plate.
优选的,所述打孔机构包括移动台、钻孔电机、钻杆以及支撑气缸,所述工作台上开设有移动孔,所述移动台能够穿过移动孔设置,所述钻孔电机安装于移动台上,所述钻杆固定连接于所述钻孔电机的输出轴上,所述支撑气缸安装于用于支撑的地面上,所述支撑气缸的活塞杆与所述移动台固定连接;所述移动台上还设置有用于驱动钻孔电机移动的移动组件。Preferably, the punching mechanism includes a mobile table, a drilling motor, a drill rod and a supporting cylinder, and a moving hole is provided on the workbench, and the moving table can be set through the moving hole, and the drilling motor is installed on the On the mobile platform, the drill rod is fixedly connected to the output shaft of the drilling motor, the support cylinder is installed on the ground for support, and the piston rod of the support cylinder is fixedly connected to the mobile platform; The mobile platform is also provided with a moving assembly for driving the drilling motor to move.
通过采用上述技术方案,在将板材固定于工作台上之后,启动支撑气缸,使得移动钻孔电机移动至合适的高度,接着在通过移动组件移动钻孔电机,与此同时启动钻孔电机,使得钻孔电机的输出轴带动钻杆转动,以便于在板材上钻出用于安装芯片的凹槽。By adopting the above technical solution, after the plate is fixed on the workbench, start the support cylinder, so that the mobile drilling motor moves to a suitable height, and then move the drilling motor through the moving assembly, and at the same time start the drilling motor, so that The output shaft of the drilling motor drives the drill rod to rotate, so as to drill grooves for installing chips on the plate.
优选的,所述移动组件包括滑移台、第一电机、第一螺杆、第二电机、第二螺杆以及移动把手,所述滑移台滑动安装于移动台上,所述第一电机固定安装于移动台上,所述第一螺杆固定连接于所述第一电机的输出轴上,所述第一螺杆与所述滑移台螺纹连接;Preferably, the moving assembly includes a sliding platform, a first motor, a first screw, a second motor, a second screw and a moving handle, the sliding platform is slidably installed on the mobile platform, and the first motor is fixedly installed On the mobile platform, the first screw is fixedly connected to the output shaft of the first motor, and the first screw is screwed to the sliding platform;
所述第二电机固定安装于所述滑移台上,所述第二螺杆固定连接于所述第二电机的输出轴上,所述钻孔电机滑动安装于滑移台上,所述移动把手固定连接于所述钻孔电机上,所述第二螺杆与所述移动把手螺纹连接。The second motor is fixedly installed on the sliding table, the second screw is fixedly connected to the output shaft of the second motor, the drilling motor is slidably installed on the sliding table, and the moving handle It is fixedly connected to the drilling motor, and the second screw rod is screwed to the moving handle.
通过采用上述技术方案,在需要在移动台上移动钻孔电机,只需分别启动第一电机和第二电机,第一电机的输出轴转动带动第一螺杆转动,以便于驱动滑移台移动,第二电机的输出轴带动第二螺杆转动,驱动滑移台上的钻孔电机移动,从而达到便于驱动钻孔电机在移动台上移动的目的。By adopting the above technical solution, when the drilling motor needs to be moved on the mobile table, only the first motor and the second motor need to be started respectively, and the output shaft of the first motor rotates to drive the first screw to rotate, so as to drive the sliding table to move. The output shaft of the second motor drives the second screw to rotate, and drives the drilling motor on the sliding table to move, thereby achieving the purpose of driving the drilling motor to move on the mobile table.
优选的,所述输送机构包括移动气缸、储物盒、输送管道以及夹爪,所述移动气缸安装于所述工作台上,所述移动气缸的活塞杆与所述储物盒固定连接,所述芯片放置与所述储物盒中,所述输送管道固定连接于所述储物盒上,所述夹爪安装于所述输送管道上;Preferably, the conveying mechanism includes a moving cylinder, a storage box, a conveying pipe and grippers, the moving cylinder is installed on the workbench, and the piston rod of the moving cylinder is fixedly connected to the storage box, so The chip is placed in the storage box, the delivery pipeline is fixedly connected to the storage box, and the gripper is installed on the delivery pipeline;
所述储物盒内还设置有用于将芯片推送至所述输送管道内的第一推送组件,所述输送管道内还设置有用于进一步推动芯片移动的第二推送组件,所述夹爪上还设置有用于夹紧并移动芯片的第三推送组件。The storage box is also provided with a first push assembly for pushing the chip into the delivery pipeline, and a second push assembly for further pushing the chip to move is also provided in the delivery pipeline. A third pushing component for clamping and moving the chip is provided.
通过采用上述技术方案,当钻孔机构在板材上钻出合适于放置芯片的凹槽之后,启动移动气缸将储物盒、输送管道移动夹爪移动至合适的位置,接着再依次启动第一推送组件、第二推送组件以及第三推送组件,将存储储物盒内的芯片移动至板材的凹槽内。By adopting the above technical solution, after the drilling mechanism drills a groove suitable for placing chips on the plate, the moving cylinder is activated to move the storage box and the moving jaws of the conveying pipeline to a suitable position, and then the first push is started in sequence The components, the second pushing component and the third pushing component move the chips stored in the storage box into the grooves of the plate.
优选的,所述储物盒上开设有连接通孔,所述第一推送组件包括第一推送气缸和推送板,所述第一推送气缸固定安装于所述储物盒的内侧壁上,所述推送板固定连接于所述第一推送气缸的活塞杆上,所述芯片能够穿过所述连接通孔移动至所述输送管道内。Preferably, the storage box is provided with a connection through hole, the first push assembly includes a first push cylinder and a push plate, and the first push cylinder is fixedly installed on the inner wall of the storage box, so The pushing plate is fixedly connected to the piston rod of the first pushing cylinder, and the chip can move into the conveying pipeline through the connecting through hole.
通过采用上述技术方案,在多个芯片放置于储物盒内之后,启动第一推送气缸,使得第一推送气缸的活塞杆带动推送板移动,推送板移动将芯片通过连接通孔推送移动,以便于将芯片推移至输送管道内。By adopting the above technical solution, after a plurality of chips are placed in the storage box, the first push cylinder is activated, so that the piston rod of the first push cylinder drives the push plate to move, and the movement of the push plate pushes the chips through the connection through hole to move, so that To push the chip into the delivery pipeline.
优选的,所述第二推送组件包括固定框、移动板以及第二推送气缸,所述固定框滑动连接于所述输送管道的内侧壁上,所述芯片能够固定于所述固定框内;Preferably, the second push assembly includes a fixed frame, a moving plate and a second push cylinder, the fixed frame is slidably connected to the inner side wall of the delivery pipeline, and the chip can be fixed in the fixed frame;
所述移动板固定连接于所述固定框上,所述第二推送气缸安装于储物盒内,所述第二推送气缸的输出轴与所述移动板固定连接。The moving plate is fixedly connected to the fixed frame, the second pushing cylinder is installed in the storage box, and the output shaft of the second pushing cylinder is fixedly connected to the moving plate.
通过采用上述技术方案,芯片通过第一推送组件通过连接通孔移送至固定框内,接着再启动第二推送气缸,使得第二推送气缸的活塞杆推动移动板、固定框以及固定框内的芯片移动,从而便于将固定框内的芯片推送至夹爪处。By adopting the above technical solution, the chip is transferred to the fixed frame through the connecting through hole through the first push component, and then the second push cylinder is activated, so that the piston rod of the second push cylinder pushes the moving plate, the fixed frame and the chip in the fixed frame Move, so that it is convenient to push the chip in the fixed frame to the gripper.
优选的,所述固定框内固定有橡胶垫。Preferably, a rubber pad is fixed inside the fixing frame.
通过采用上述技术方案,利用橡胶垫,便于增强芯片安装于固定框内的稳定性。By adopting the above technical solution and using the rubber pad, it is convenient to enhance the stability of the chip installed in the fixed frame.
优选的,所述夹爪包括夹板一和夹板二,所述第三推送组件包括第三推送气缸和夹持气缸,所述第三推送气缸固定连接于所述输送管道上,所述第三推送气缸的活塞杆与所述夹板二固定连接;所述夹持气缸固定连接于夹板二上,所述夹持气缸的活塞杆与所述夹板一固定连接。Preferably, the jaws include splint 1 and splint 2, the third pushing assembly includes a third pushing cylinder and a clamping cylinder, the third pushing cylinder is fixedly connected to the delivery pipeline, and the third pushing The piston rod of the air cylinder is fixedly connected with the second splint; the clamping cylinder is fixedly connected with the second splint, and the piston rod of the clamping cylinder is fixedly connected with the first splint.
通过采用上述技术方案,在固定框推送芯片移动至夹爪处之后,先启动夹持气缸,使得夹板一向靠近夹板二的一侧移动,并夹紧固定框上的芯片,接着再启动第三推送气缸,使得夹板二带动芯片和夹板一移动,进而便于将芯片移动至板材的凹槽处。By adopting the above-mentioned technical solution, after the fixed frame pushes the chip to move to the jaws, start the clamping cylinder first, so that the splint moves toward the side of the second splint, and clamps the chip on the fixed frame, and then starts the third push The cylinder makes splint 2 drive the chips and splint 1 to move, thereby facilitating the chip to move to the groove of the plate.
综上所述,本申请包括以下至少一种有益技术效果:In summary, the present application includes at least one of the following beneficial technical effects:
1.为了便于将芯片安装于板材中,需要工作人员先将板材移动至工作台上,并使板材与挡板相抵,接着再驱动按压机构,使得按压机构按压板材,然后通过打孔机构在板材上钻出用于安装芯片的凹槽,接下来在通过输送机构将芯片移送至板材上的凹槽处,已完成对板材上芯片的初步安装,紧接着工人只需在板材的凹槽处添加固定芯片的胶水,即可达到便于芯片安装于板材内的目的;1. In order to facilitate the installation of the chip in the board, the staff needs to move the board to the workbench first, and make the board touch the baffle, and then drive the pressing mechanism so that the pressing mechanism presses the board, and then through the punching mechanism on the board The groove for installing the chip is drilled on the upper surface, and then the chip is transferred to the groove on the board by the conveying mechanism, and the preliminary installation of the chip on the board has been completed, and then the worker only needs to add it to the groove of the board. The glue for fixing the chip can achieve the purpose of facilitating the chip to be installed in the board;
2.在将板材固定于工作台上之后,启动支撑气缸,使得移动钻孔电机移动至合适的高度,接着在通过移动组件移动钻孔电机,与此同时启动钻孔电机,使得钻孔电机的输出轴带动钻杆转动,以便于在板材上钻出用于安装芯片的凹槽;2. After the plate is fixed on the workbench, start the supporting cylinder to move the drilling motor to a suitable height, then move the drilling motor through the moving component, and start the drilling motor at the same time, so that the drilling motor The output shaft drives the drill rod to rotate, so as to drill the groove for installing the chip on the plate;
3.钻孔机构在板材上钻出合适于放置芯片的凹槽之后,启动移动气缸将储物盒、输送管道移动夹爪移动至合适的位置,接着再依次启动第一推送组件、第二推送组件以及第三推送组件,将存储储物盒内的芯片移动至板材的凹槽内。3. After the drilling mechanism drills a groove suitable for placing chips on the plate, it starts the moving cylinder to move the storage box and the moving jaws of the conveying pipeline to a suitable position, and then starts the first pushing component and the second pushing component in turn. The component and the third pushing component move the chips in the storage box to the groove of the plate.
附图说明Description of drawings
图1是本申请实施例的整体结构示意图。FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present application.
图2是本申请实施例凸显打孔机构的结构示意图。Fig. 2 is a schematic structural diagram highlighting the punching mechanism of the embodiment of the present application.
图3是本申请实施例中凸显输送机构的结构示意图。Fig. 3 is a schematic structural view of the highlighted conveying mechanism in the embodiment of the present application.
图4是本申请实施例中凸显第二推送组件和第三推送组件的结构示意图。Fig. 4 is a schematic structural diagram highlighting the second pushing component and the third pushing component in the embodiment of the present application.
附图标记说明:1、工作台;11、移动孔;12、挡板;13、安装架;2、板材;21、芯片;3、按压机构;31、按压气缸;32、液压缓冲器;33、抵接板;34、引度板;4、打孔机构;41、移动台;42、钻孔电机;43、钻杆;44、支撑气缸;45、移动组件;451、滑移台;452、第一电机;453、第一螺杆;454、第二电机;455、第二螺杆;456、移动把手;457、第一定位块;458、第二定位块;5、输送机构;51、移动气缸;52、储物盒;521、连接通孔;53、输送管道;531、让位槽;532、条形孔;54、夹爪;541、夹板一;542、夹板二;6、第一推送组件;61、第一推送气缸;62、推送板;63、垫板;64、遮挡框;7、第二推送机构;71、固定框;72、移动板;73;第二推送气缸;74、橡胶垫;8、第三推送机构;81、第三推送气缸;82、夹持气缸。Explanation of reference numerals: 1. Workbench; 11. Moving hole; 12. Baffle plate; 13. Mounting frame; 2. Plate; 21. Chip; 3. Pressing mechanism; 31. Pressing cylinder; 32. Hydraulic buffer; 33 , abutment plate; 34, index plate; 4, punching mechanism; 41, mobile platform; 42, drilling motor; 43, drill rod; 44, supporting cylinder; 45, mobile component; , the first motor; 453, the first screw; 454, the second motor; 455, the second screw; 456, the moving handle; 457, the first positioning block; 458, the second positioning block; 5, the conveying mechanism; 51, moving Cylinder; 52, storage box; 521, connecting through hole; 53, conveying pipeline; 531, give way groove; 532, strip hole; 54, jaw; 541, splint one; 542, splint two; Push assembly; 61, first push cylinder; 62, push plate; 63, backing plate; 64, shielding frame; 7, second push mechanism; 71, fixed frame; 72, moving plate; 73; second push cylinder; 74 , rubber pad; 8, the third pushing mechanism; 81, the third pushing cylinder; 82, clamping cylinder.
具体实施方式Detailed ways
以下结合附图1-4对本申请作进一步详细说明。The present application will be described in further detail below in conjunction with accompanying drawings 1-4.
本申请实施例公开一种板材2的芯片21植入生产设备。参照图1,板材2的芯片21植入生产设备包括工作台1和板材2,板材2放置与工作台1上,工作台1上固定连接有安装架13。安装架13上安装用于按压板材2的按压机构3。The embodiment of the present application discloses a
同时固定台上还固定连接有两个挡板12,两个挡板12之间设置有间隙,板材2同时与两个挡板12相抵接,工作台1上还安装有用于在板材2上打孔的打孔机构4,打孔机构4通过两个挡板12之间的间隙对板材2进行打孔,以便于在板材2上开挖出用于放置安装芯片21的凹槽。工作台1上还设置有用于将芯片21移送至板材2凹槽处的输送机构5。At the same time, two
如图1所示,按压机构3包括按压气缸31、液压缓冲器32、抵接板33以及引度板34,按压气缸31固定连接于安装架13上,液压缓冲器32固定安装于按压气缸31的活塞杆上。抵接板33固定连接于液压缓冲器32的输出轴上,抵接板33与放置于工作台1上的板材2相抵。抵接板33与引度板34上一体成型设置,引度板34从靠近挡板12的一侧到远离挡板12的一侧倾斜向上弯曲设置。As shown in Figure 1, the pressing mechanism 3 includes a
在将板材2放置工作台1上之后,启动按压气缸31,使得按压气缸31的输出轴带动液压缓冲器32和抵接板33移动,以便于通过抵接板33按压木板,降低木板在工作台1上移动的可能性。After the plate 2 is placed on the workbench 1, start the
如图1和图2所示,工作台1上开设有移动孔11,打孔机构4包括移动台41、钻孔电机42、钻杆43、支撑气缸44以及移动组件45。As shown in FIGS. 1 and 2 , a moving
支撑气缸44位于工作台1的下方,支撑气缸44固定安装于地面上,移动台41固定连接于支撑气缸44的活塞杆上,移动台41能够穿过移动孔11移动至工作台1的上方。钻孔电机42安装移动台41上,钻杆43固定连接于钻孔电机42的输出轴上。
移动组件45包括滑移台451、第一电机452、第一螺杆453、第一定位块457、第二电机454、第二螺杆455、移动把手456以及第二定位块458。The moving
第一电机452固定安装于移动台41上,第一螺杆453与第一电机452的输出轴固定连接。第一定位块457有两个,两个第一定位块457均固定连接于移动台41上,第一螺杆453的两端分别于两个第一定位块457转动连接。The
滑移台451滑动安装于移动台41上,第一螺杆453贯穿滑移台451设置,且滑移台451与第一螺杆453螺纹连接。第二电机454固定安装于滑移台451上,第二螺杆455的固定连接于第二电机454的输出轴上,第二定位块458有两个,两个第二定位块458均固定连接于滑移台451上,第二螺杆455的两端分别于两个第二定位块458转动连接。移动把手456固定连接于钻孔电机42上,第二螺杆455穿设于移动把手456设置,且第二螺杆455与移动把手456螺纹连接。The sliding
如图1和图2所示,在将板材2固定于工作台1上之后,启动支撑气缸44,将移动台41移动至合适的位置,接着分别启动第一电机452和第二电机454,第一电机452的输出轴转动带动第一螺杆453转动,以便于驱动滑移台451移动,第二电机454的输出轴带动第二螺杆455转动,驱动滑移台451上的钻孔电机42移动,同时启动钻孔电机42,从而达到便于板材2上挖掘处用于放置芯片21的凹槽。As shown in Figures 1 and 2, after the plate 2 is fixed on the workbench 1, the
如图1和图3所示,输送机构5包括移动气缸51、储物盒52、输送管道53以及夹爪54,移动气缸51位于安装架13远离板材2的一侧,安装板上开设有供储物盒52移动的让位孔,储物盒52与移动气缸51的活塞杆固定连接,且储物盒52穿过让位孔位于安装板靠近板材2的一侧。输送管道53固定连接于储物盒52上,夹爪54安装于输送管道53上。储物盒52上开设有与输送管道53相连通的连接通孔521。As shown in Figures 1 and 3, the
储物盒52内设置有用于将芯片21推送至输送管道53内的第一推送组件6,输送管道53内设置有用于进一步推动芯片21移动的第二推送组件,夹爪54上还设置有用于夹紧并移动芯片21的第三推送组件。The
如图3和图4所示,第一推送组件6包括第一推送气缸61、推送板62、遮挡框64以及垫板63,遮挡框64固定连接储物盒52的内侧壁上,芯片21磊放于遮挡框64内,遮挡框64相对的两侧壁上均开设有推送通孔。As shown in Figures 3 and 4, the first pushing assembly 6 includes a first pushing
垫板63固定连接于储物盒52的内侧壁上,第一推送气缸61固定安装于储物盒52的内侧壁上,推送板62固定连接于第一推送气缸61的活塞杆上,推送板62与垫板63滑动连接,推送板62能够穿过遮挡框64的两个推送通孔,将芯片21通过连通通孔推动至输送管道53内。Backing
如图3和图4所示,输送管道53的内壁上开设有条形孔532,第二推送组件包括固定框71、移动板72、第二推送气缸73以及橡胶垫74。As shown in FIG. 3 and FIG. 4 , a strip-shaped
固定框71滑动连接于输送管道53的内侧壁上,芯片21能够固定于固定框71内,橡胶垫74有两个,两个橡胶垫74固定连接于固定框71的上下两侧壁上,且芯片21同时与两个橡胶垫74相抵。The fixed
移动板72固定连接于固定框71上,且移动板72的一端穿过条形孔532位于输送管道53的外侧;第二推送气缸73安装于储物盒52内,第二推送气缸73的输出轴与移动板72固定连接。The
如图3和图4所示,夹爪54包括夹板一541和夹板二542,第三推送组件包括第三推送气缸81和夹持气缸82,第三推送气缸81固定连接于输送管道53上,第三推送气缸81的活塞杆与夹板二542固定连接;夹持气缸82固定连接于夹板二542上,夹持气缸82的活塞杆与夹板一541固定连接。As shown in Figure 3 and Figure 4,
如图3和图4所示,在多个芯片21放置于储物盒52内之后,启动第一推送气缸61,使得第一推送气缸61的活塞杆带动推送板62移动,推送板62移动将芯片21通过连接通孔521推送移动固定框71内。As shown in Figures 3 and 4, after a plurality of
接着再启动第二推送气缸73,使得第二推送气缸73的活塞杆推动移动板72、固定框71以及固定框71内的芯片21移动。Then start the
在固定框71推送芯片21移动至夹爪54处之后,先启动夹持气缸82,使得夹板一541向靠近夹板二542的一侧移动,并夹紧固定框71上的芯片21,接着再启动第三推送气缸81,使得夹板二542带动芯片21和夹板一541移动,进而便于将芯片21移动至板材2的凹槽处。After the fixed
本申请实施例一种板材2的芯片21植入生产设备的实施原理为:为了便于将芯片21安装于板材2中,需要工作人员先将板材2移动至工作台1上,并使板材2与挡板12相抵,接着再驱动按压机构3,使得按压机构3按压板材2,然后通过打孔机构4在板材2上钻出用于安装芯片21的凹槽,接下来在通过输送机构5将芯片21移送至板材2上的凹槽处,已完成对板材2上芯片21的初步安装,紧接着工人只需在板材2的凹槽处添加固定芯片21的胶水,即可达到便于芯片21安装于板材2内的目的。The implementation principle of implanting the
以上均为本申请的较佳实施例,并非依此限制本申请的保护范围,故:凡依本申请的结构、形状、原理所做的等效变化,均应涵盖于本申请的保护范围之内。All of the above are preferred embodiments of the application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made according to the structure, shape, and principle of the application should be covered by the protection scope of the application. Inside.
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