CN116123208A

CN116123208A - Electronic equipment

Info

Publication number: CN116123208A
Application number: CN202310081470.4A
Authority: CN
Inventors: 蔡永发
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2023-02-03
Filing date: 2023-02-03
Publication date: 2023-05-16
Also published as: WO2024160198A1

Abstract

The application discloses electronic equipment belongs to beta structure technical field. Wherein, this electronic equipment includes: a first housing and a second housing rotatably connected to switch the electronic device between an unfolded state and a folded state; the first shell is provided with a first bracket, and the first bracket is provided with a first magnetic piece; a second bracket is arranged on the second shell, and a second magnetic piece is arranged on the second bracket; the shape of the first bracket can be changed along with the temperature change, and in a first temperature range, the first bracket is in a first form, and when the electronic equipment is in a folding state, the distance between the first magnetic piece and the second magnetic piece is a first distance; in the second temperature range, the first bracket is in a second form, and the distance between the first magnetic piece and the second magnetic piece is a second distance when the electronic equipment is in a folded state, wherein the first distance is smaller than the second distance.

Description

Electronic equipment

Technical Field

The application belongs to the technical field of folding structures, and particularly relates to electronic equipment.

Background

In general, a torque hinge and a magnet can be arranged in the foldable device, and the torsion of the hinge provided by the torque hinge and the torque generated by the attraction of the magnet and the magnet can offset the rebound moment of a screen of the foldable device, so that the whole machine of the foldable device can be normally closed and opened.

However, due to the temperature change, especially when the temperature difference change is large, the rebound moment of the screen of the foldable equipment can be caused to fluctuate greatly, so that the whole machine of the foldable equipment cannot be normally closed and opened.

Therefore, the problem that the foldable device cannot be normally closed or opened under the condition of large temperature variation is caused.

Disclosure of Invention

The embodiment of the application aims to provide electronic equipment, which can solve the problem that foldable equipment cannot be normally closed and opened under the condition of large temperature change.

In a first aspect, an embodiment of the present application provides an electronic device, including: a first housing and a second housing rotatably connected to switch the electronic device between an unfolded state and a folded state; the first shell is provided with a first bracket, and the first bracket is provided with a first magnetic piece; a second bracket is arranged on the second shell, and a second magnetic piece is arranged on the second bracket; the shape of the first bracket can be changed along with the temperature change, and in a first temperature range, the first bracket is in a first form, and when the electronic equipment is in a folding state, the distance between the first magnetic piece and the second magnetic piece is a first distance; in the second temperature range, the first bracket is in a second form, and the distance between the first magnetic piece and the second magnetic piece is a second distance when the electronic equipment is in a folded state, wherein the first distance is smaller than the second distance.

In this application embodiment, this electronic equipment is including rotating first casing and this second casing of connection for electronic equipment can expand and fold, and is provided with first support on this first casing, is provided with first magnetism spare on this first support, is provided with the second support on this second casing, is provided with the second magnetism spare on this second support. Because the shape of the first bracket can be changed along with the temperature change, in the first temperature range, the first bracket is in a first form, and the distance between the first magnetic piece and the second magnetic piece is a first distance when the electronic equipment is in a folded state; in a second temperature range, the first bracket is in a second form, when the electronic equipment is in a folded state, the distance between the first magnetic piece and the second magnetic piece is a second distance, and the first distance is smaller than the second distance, so that when the electronic equipment is in the first temperature range with a lower temperature value, the distance between the first magnetic piece and the second magnetic piece is smaller, and the generated magnetic attraction force is larger to offset the increased screen resilience force of the electronic equipment in the first temperature range, so that the electronic equipment can be normally closed; when the electronic equipment is in a second temperature range with a higher temperature value, the distance between the first magnetic piece and the second magnetic piece is larger, and the generated magnetic attraction force is smaller so as to balance the reduced screen resilience force of the electronic equipment in the second temperature range, so that the electronic equipment can be normally opened, and the electronic equipment can be normally closed and opened under the condition of larger temperature change.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is one of the schematic views of a first bracket provided in an embodiment of the present application;

FIG. 3 is a second schematic view of a first bracket according to an embodiment of the present disclosure;

FIG. 4 is a third schematic view of a first bracket according to an embodiment of the present disclosure;

FIG. 5 is one of the side cross-sectional schematic views of the electronic device provided in the embodiments of the present application;

FIG. 6 is a second schematic side view of an electronic device according to an embodiment of the present disclosure;

FIG. 7 is one of the explosion diagrams of the electronic device provided in the embodiments of the present application;

FIG. 8 is a third schematic side view in cross section of an electronic device provided in an embodiment of the present application;

FIG. 9 is a second schematic explosion diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 10 is a schematic structural view of a first bracket according to an embodiment of the present disclosure;

FIG. 11 is a second schematic structural view of a first bracket according to an embodiment of the present disclosure;

FIG. 12 is a third exploded view of an electronic device according to an embodiment of the present disclosure;

FIG. 13 is a fourth schematic explosion diagram of an electronic device provided in an embodiment of the present application;

FIG. 14 is a fourth schematic side cross-sectional view of an electronic device provided in an embodiment of the present application;

FIG. 15 is a third schematic structural view of the first bracket according to the embodiment of the present application;

FIG. 16 is a fourth schematic structural view of a first bracket according to an embodiment of the present disclosure;

fig. 17 is a fifth schematic structural view of the first bracket according to the embodiment of the present application.

The first shell-1, the second shell-2, the first bracket-3, the first magnetic piece-4, the second bracket-5, the second magnetic piece-6, the torque hinge-7, the first assembling groove-8, the second assembling groove-9, the accommodating groove-10, the first plate-shaped bracket-11, the first fixing part-12, the second fixing part-13, the first deformation part-14, the first anti-wrapping arm-15, the first C-shaped anti-wrapping arm-16, the first edge-17, the second edge-18, the third fixing part-19, the fourth fixing part-20, the second deformation part-21, the U-shaped bracket-22, the fifth fixing part-23, the sixth fixing part-24, the third deformation part-25, the clamping piece-26, the second C-shaped anti-wrapping arm-27, the first position-28 and the second position-29.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The features of the terms "first", "second", and the like in the description and in the claims of this application may be used for descriptive or implicit inclusion of one or more such features. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the design of the existing foldable equipment, the electronic equipment can be folded and closed because the torque hinge and the magnetic piece are arranged in the electronic equipment, and when the torque generated by the torque of the hinge and the magnetic attraction of the magnetic piece is larger than the resilience force of the screen of the electronic equipment, the electronic equipment can be normally closed. However, when the environmental temperature of the electronic device changes, especially when the temperature difference changes greatly, the rebound moment of the screen of the foldable device will fluctuate greatly, so that the whole machine of the foldable device cannot be normally closed or opened. For example: when the environment temperature of the electronic equipment is reduced from 25 ℃ to-10 ℃, the rebound moment of the screen is increased by about 100N mm, as the hinge torque is not changed along with the change of temperature, namely the hinge torque is the same under different temperature environments, the distance between the magnetic pieces is constant, namely the magnetic attraction force is not changed along with the change of temperature, at the moment, the foldable equipment cannot be normally closed, otherwise, when the electronic equipment is closed, the environment temperature of the electronic equipment is increased from-10 ℃ to 25 ℃, the rebound moment of the screen is reduced, and at the moment, the foldable equipment cannot be normally opened.

In order to solve the technical problem, the embodiment of the application adopts the following technical scheme.

An electronic device provided in an embodiment of the present application is described below with reference to the accompanying drawings.

Fig. 1 shows a possible schematic structural diagram of an electronic device provided in an embodiment of the present application, as shown in fig. 1, where the electronic device includes: a first housing 1 and a second housing 2, the first housing 1 and the second housing 2 being rotatably connected to switch the electronic device between an unfolded state and a folded state; the first shell 1 is provided with a first bracket 3, and the first bracket 3 is provided with a first magnetic piece 4; a second bracket 5 is provided on the second housing 2, and a second magnetic member 6 is provided on the second bracket 5. Optionally, in the embodiment of the present application, the electronic device may specifically be any one of the following: foldable devices, wearable devices, cell phones, tablet computers, notebook computers, palm computers, vehicle-mounted electronic devices, mobile internet appliances (mobile internet device, MID), augmented reality (augmented reality, AR)/Virtual Reality (VR) devices, robots, ultra-mobile personal computer, UMPC, netbooks or personal digital assistants (personal digital assistant, PDA), etc., and may also be servers, network attached storage (network attached storage, NAS), personal computers (personal computer, PC), televisions (TVs), teller machines or self-service machines, etc.

Wherein the foldable device may be any one of the following: folding mobile phone, folding tablet personal computer, folding intelligent glasses, folding palm computer, etc.

Fig. 1 is an illustration of an electronic device as a foldable device (for example, a foldable mobile phone).

Alternatively, in the embodiment of the present application, as shown in fig. 1, the electronic device may be configured to fold the electronic device by providing a torque hinge 7 between the first housing 1 and the second housing 2, so that the electronic device may be switched between an unfolded state and a folded state.

In this embodiment, as shown in fig. 1, the first housing 1 is further provided with a first assembly groove 8, and the second housing 2 is further provided with a second assembly groove 9; when the electronic equipment is in a folded state, the first assembly groove 8 and the second assembly groove 9 are opposite; the first bracket 3 is disposed in the first fitting groove 8, and the second bracket 5 is disposed in the second fitting groove 9.

Alternatively, in the embodiment of the present application, the first fitting groove 8 and the second fitting groove 9 may be provided at a portion of the middle frame of the electronic device that is symmetrical with respect to the torque hinge 7, for example, a portion near an edge of the middle frame of the electronic device, so that the first fitting groove 8 and the second fitting groove 9 may be completely opposed or partially opposed in a case where the electronic device is in a folded state.

Alternatively, in the embodiment of the present application, the shape and size of the first fitting groove 8 and the second fitting groove 9 may be the same or different; the shape of the first fitting groove 8 and the second fitting groove 9 may be any one of the following: cuboid, cube, cylinder, elliptic cylinder, etc.

It is understood that when the first fitting groove and the second fitting groove are identical in shape and size and symmetrical with respect to the torque hinge, the first fitting groove and the second fitting groove may be diametrically opposed in a case where the electronic device is in a folded state; when the first fitting groove and the second fitting groove are symmetrical about the torque hinge but are different in shape and size, the first fitting groove and the second fitting groove are partially opposed in a state where the electronic apparatus is folded.

Alternatively, in this embodiment, as shown in fig. 1, a receiving groove 10 may be disposed at the notch of the first assembling groove 8, where the receiving groove 10 is far away from the bottom of the first assembling groove 8, and the depth of the receiving groove 10 is smaller than that of the first assembling groove 8, and the shape and size of the receiving groove 10 are adaptively set according to the shape and size of the first bracket 3.

It can be understood that the accommodating groove is used for arranging the first bracket, and the first bracket is fixedly arranged behind the accommodating groove, and the first bracket does not protrude out of the plane where the middle frame of the electronic equipment is located, so that the first bracket protrudes out of the plane where the middle frame of the electronic equipment is located, and the assembly of other components (such as a screen) of the electronic equipment is prevented from being influenced.

Alternatively, in the embodiment of the present application, the first bracket 3 is a shape memory alloy member.

Further alternatively, in an embodiment of the present application, the shape memory alloy member may be deformed according to a change in temperature of an environment in which the shape memory alloy member is located.

Alternatively, in the embodiment of the present application, the manner in which the first bracket 3 is fixedly disposed in the accommodating groove 10 may be any one of the following: laser welding, locking screw fixing, double-sided adhesive bonding, adhesive dispensing bonding and the like.

Optionally, in this embodiment, the first magnetic member 4 is disposed on a surface of the first bracket 3 proximate to the first assembly slot 8, so as to be movable in a receiving cavity defined by the first bracket 3 and the first assembly slot 8.

Alternatively, in the embodiment of the present application, the first magnetic member 4 may be any one of the following: metals having a primary magnet structure (e.g., iron, nickel, cobalt, partial alloys, etc.), permanent magnets (e.g., magnets, magnetites, etc.), electromagnets, etc.

Optionally, in this embodiment of the present application, the first magnetic member 4 is fixedly connected with the first support 3 through an adhesive, or the first magnetic member 4 is fixedly connected with the first support 3 through a clamping structure.

In one example, the first support 3 is made of an alloy material, the first magnetic member 4 is adsorbed on the first support 3, and when the first support 3 deforms according to the change of the temperature of the environment, the first magnetic member 4 can be driven to move in a containing cavity surrounded by the first support 3 and the first assembly groove 8.

In another example, a double-sided adhesive tape is disposed on the first support 3, and the first magnetic member 4 may be adhered to the first support 3 by the double-sided adhesive tape, so that when the first support 3 deforms according to a change of a temperature of an environment where the first support 3 is located, the first magnetic member 4 may be driven to move in a containing cavity surrounded by the first support 3 and the first assembly groove 8.

In yet another example, the first bracket 3 is provided with a clamping member, where the clamping member is used to clamp the first magnetic member 4, and when the first bracket 3 deforms according to a change of a temperature of an environment where the first bracket 3 is located, the first magnetic member 4 can be driven to move in a containing cavity surrounded by the first bracket 3 and the first assembly groove 8.

In this embodiment of the present application, the shape of the first support 3 may change with a temperature change, and in the first temperature range, the first support 3 is in the first state, and when the electronic device is in the folded state, the distance between the first magnetic element 4 and the second magnetic element 6 is the first distance; in the second temperature range, the first holder 3 is in the second configuration, and the distance between the first magnetic element 4 and the second magnetic element 6 is a second distance, which is smaller than the second distance, when the electronic device is in the folded state.

Optionally, in this embodiment of the present application, when the first bracket 3 deforms according to a change of a temperature of an environment where the first bracket is located, the first magnetic element 4 may be driven to move in a direction of a receiving cavity surrounded by the first deformation element 3 and the first assembly groove 8 toward or away from a groove bottom of the first assembly groove 8, and may further be driven to move in the receiving cavity along a direction of a plane where a notch of the first assembly groove 8 is located, so as to change a distance between the first magnetic element 4 and the second magnetic element 6.

Alternatively, in the embodiment of the present application, the second temperature range is a temperature range with a higher temperature value (for example, 25±5 ℃), and the first temperature range is a temperature range with a lower temperature value (for example, -10±5 ℃).

Alternatively, in the embodiment of the present application, the first configuration and the second configuration are two different configurations, and may be any of the following configurations: an extended state, a contracted state, bending in a certain direction, and the like.

It can be understood that, in the first temperature range, when the first bracket is in the first configuration, the distance between the first magnetic element and the second magnetic element disposed on the first bracket is a first distance L1; in the second temperature range, when the first bracket is in the second form, the distance between the first magnetic piece and the second magnetic piece arranged on the first bracket is a second distance L2, wherein L1 is smaller than L2, so that the magnetic attraction between the first magnetic piece and the second magnetic piece in the first temperature range is larger than the magnetic attraction between the first magnetic piece and the second magnetic piece in the second temperature range.

Alternatively, in one possible implementation of the embodiment of the present application, the first bracket 3 may be a plate-shaped bracket in particular. Wherein, this platy support can be: a stent made from a memory alloy material (e.g., a two-way shape memory alloy (e.g., titanium-nickel alloy, gold-cadmium alloy, copper-zinc alloy)) that exhibits a different morphology in different temperature environments, the stent exhibiting a first morphology when the stent is in a first temperature range (e.g., -10 ℃), such as: an extended state, a state of bending in a certain direction, and the like; when the plate-like support is in a second temperature range (e.g., 25 ℃), the plate-like support assumes a second configuration, such as: a contracted state, a state of bending in the other direction, etc., so that the plate-like support can be deformed in a different temperature environment of the electronic device, so that the plate-like support can drive the first magnetic member 4 to move toward or away from the second magnetic member 6.

For example, as shown in fig. 2, the first bracket 3 is a plate-shaped bracket, which has different forms in different temperature environments, and as shown in fig. 2 (a), when the plate-shaped bracket is in an environment of-10 ℃, the plate-shaped bracket is in an extended state; as shown in fig. 2 (b), the plate-shaped bracket is bent downward when the plate-shaped bracket is in an environment of 25 ℃.

Referring to fig. 2, as shown in fig. 3, when the electronic device is in an environment of-10 ℃, the first bracket 3 is in an extended state, at this time, a distance between the first magnetic element 4 and the second magnetic element 6, which are disposed on the first bracket 3, is L1, and a magnetic attraction force between the first magnetic element 4 and the second magnetic element 6 is a first magnetic attraction force; alternatively, as shown in fig. 4, when the electronic device is in an environment of 25 ℃, the first bracket 3 is bent downward, and at this time, a distance between the first magnetic element 4 and the second magnetic element 6 provided on the first bracket 3 is L2, and a magnetic attraction force between the first magnetic element 4 and the second magnetic element 6 is a second magnetic attraction force. Since L1 is smaller than L2, the first attractive magnetic force is greater than the second attractive magnetic force.

It can be understood that the electronic device is in different temperature environments, so that the first bracket can be alternately in different states, and thus the distance between the first magnetic piece and the second magnetic piece can be changed, and the magnetic attraction between the first magnetic piece and the second magnetic piece can be changed, so that the fluctuation of screen resilience force generated by temperature change of the screen of the electronic device is balanced and adapted.

Alternatively, in another possible implementation manner of the embodiment of the present application, the first bracket 3 may be a U-shaped bracket. Wherein, this U type support can be: a stent made from a memory alloy material, such as a two-way shape memory alloy (e.g., titanium-nickel alloy, gold-cadmium alloy, copper-zinc alloy), the U-shaped stent including a clamping structure for clamping a first magnetic member. As shown in fig. 5, when the electronic device is in an environment of-10 ℃, the first bracket 3 is in an extended state, and at this time, the distance between the first magnetic element 4 and the second magnetic element 6 provided on the first bracket 3 is L1, and the magnetic attraction between the first magnetic element 4 and the second magnetic element 6 is the first magnetic attraction; alternatively, as shown in fig. 6, when the electronic device is in an environment of 25 ℃, the first stand 3 is in a folded state, and at this time, a working distance between the first magnetic element 4 and the second magnetic element 6 provided on the first stand 3 is L2, and a magnetic attraction force between the first magnetic element 4 and the second magnetic element 6 is a second magnetic attraction force. Since L1 is smaller than L2, the first attractive magnetic force is greater than the second attractive magnetic force.

It can be understood that the electronic device is in different temperature environments, so that the first bracket can be alternately in different states, so that the acting area between the first magnetic piece and the second magnetic piece can be changed, and the magnetic attraction between the first magnetic piece and the second magnetic piece can be changed, so that the fluctuation of screen resilience force generated by temperature change of the screen of the electronic device is balanced and adapted.

In the embodiment of the application, the shape of the first bracket 3 can be automatically adjusted according to the temperature change, and no external force or other power source is needed, so that the cost and the durability of the electronic equipment are saved.

In this application embodiment, electronic equipment is including rotating first casing and this second casing of connection, makes electronic equipment can expand and fold, and is provided with first support on this first casing, is provided with first magnetism spare on this first support, is provided with the second support on this second casing, is provided with the second magnetism spare on this second support. Because the shape of the first bracket can be changed along with the temperature change, in the first temperature range, the first bracket is in a first form, and the distance between the first magnetic piece and the second magnetic piece is a first distance when the electronic equipment is in a folded state; in a second temperature range, the first bracket is in a second form, when the electronic equipment is in a folded state, the distance between the first magnetic piece and the second magnetic piece is a second distance, and the first distance is smaller than the second distance, so that when the electronic equipment is in the first temperature range with a lower temperature value, the distance between the first magnetic piece and the second magnetic piece is smaller, and the generated magnetic attraction force is larger to offset the increased screen resilience force of the electronic equipment in the first temperature range, so that the electronic equipment can be normally closed; when the electronic equipment is in a second temperature range with a higher temperature value, the distance between the first magnetic piece and the second magnetic piece is larger, and the generated magnetic attraction force is smaller so as to balance the reduced screen resilience force of the electronic equipment in the second temperature range, so that the electronic equipment can be normally opened, and the electronic equipment can be normally closed and opened under the condition of larger temperature change.

The first bracket will be specifically exemplified by a plate-like bracket.

Example one,

Alternatively, in the embodiment of the present application, as shown in fig. 7 in conjunction with fig. 1, the first bracket may be a first plate-shaped bracket 11.

Alternatively, in this embodiment of the present application, the first plate-shaped bracket 11 may be a two-way shape memory alloy plate made of a memory alloy material, where the first plate-shaped bracket 11 presents different forms in different temperature environments: when the first plate-like support 11 is in the first temperature range, it takes on a first configuration, for example: an extended state, a state of bending in a certain direction, and the like; when the first plate-like support 11 is in the second temperature range, it takes on a second form, for example: a contracted state, a state of bending toward the other direction, and the like.

Optionally, in this embodiment of the present application, the first plate-shaped bracket 11 is fixedly disposed in the accommodating groove 10 at the notch of the first assembly groove 8, and the first magnetic member 4 may be fixed on a surface of the first plate-shaped bracket 11 adjacent to the first assembly groove 8 by adhesive glue, or may be clamped and fixed on a surface of the first plate-shaped bracket 11 adjacent to the first assembly groove 8 by a clamping structure; the second magnetic member 6 is fixedly disposed in the second fitting groove 9.

The shape of the first magnetic element 4 and the second magnetic element 6 may be any of the following: the shapes of the first magnetic member 4 and the second magnetic member 6 may be the same or different, such as a rectangular parallelepiped, a square, a cylinder, an elliptic cylinder, or the like.

Optionally, in this embodiment, the depth of the first fitting groove 8 is greater than the height of the first magnetic element 4, and a gap is left between the first magnetic element 4 and the first fitting groove 8, so that the first magnetic element 4 can move in the first fitting groove 8 in a direction toward or away from the groove bottom of the first fitting groove 8.

In the embodiment of the application, in the process of changing the first plate-shaped bracket 11 from the first shape to the second shape, the first plate-shaped bracket 11 drives the first magnetic piece 4 to move towards the bottom of the first assembly groove 1; during the change of the first plate-like support 11 from the second configuration to the first configuration, the first plate-like support 11 drives the first magnetic member 4 to move away from the bottom of the first fitting groove 8.

Alternatively, in the embodiment of the present application, the first configuration of the first plate-like support 11 may be specifically an extended state; the second shape of the first plate-like holder 11 may be a state of being bent toward the groove bottom direction of the first fitting groove 8.

For example, as shown in fig. 8 (a), when the first plate-like support 11 is at the first temperature-10 ℃ (the first temperature is a temperature value within the first temperature range), the first plate-like support 11 is in an extended state, as shown in fig. 8 (b), when the first plate-like support 11 is at the second temperature 25 ℃ (the second temperature is a temperature value within the second temperature range), the first plate-like support 11 is in a state of being bent toward the bottom of the first fitting groove 8, and when the environmental temperature in which the electronic device is located is changed from the first temperature to the second temperature, the first plate-like support 11 drives the first magnetic member 4 to move toward the bottom of the first fitting groove 8 in the course of changing from the first form to the second form; when the environmental temperature of the electronic equipment is changed from the second temperature to the first temperature, the first plate-shaped bracket 11 drives the first magnetic piece 4 to move away from the bottom of the first assembly groove 8 in the process of changing the second shape of the first plate-shaped bracket 11 to the first shape of the first plate-shaped bracket.

Therefore, as the electronic equipment is in different temperature environments, the first bracket can drive the first magnetic piece to move towards or away from the groove bottom of the first assembly groove, so that the distance between the first magnetic piece and the second magnetic piece is changed, the magnetic attraction between the first magnetic piece and the second magnetic piece is changed, fluctuation of screen resilience force generated by temperature change of the screen of the electronic equipment is balanced and adapted, and the electronic equipment can be normally opened and closed in different temperature environments.

The structure of the first plate-like holder 11 will be specifically described below.

Alternatively, in the embodiment of the present application, with reference to fig. 7, as shown in fig. 9, the first bracket 3 includes: the first fixing part 12, the second fixing part 13 and the first deformation part 14, the first fixing part 12 and the second fixing part 13 are respectively fixedly connected with the groove wall of the first assembly groove 8, the first deformation part 14 is arranged between the first fixing part 12 and the second fixing part 13, and the first magnetic piece 4 is arranged on one side of the first deformation part 14 facing the groove bottom of the first assembly groove 8.

Alternatively, in the embodiment of the present application, the first fixing portion 12 and the second fixing portion 13 are used to fix both ends of the first plate-like bracket 11 at the notch of the first fitting groove 8, respectively.

Specifically, the first fixing portion 12 and the second fixing portion 13 may be fixed on the groove wall of the accommodating groove provided at the notch of the first fitting groove 8 by laser welding, and the shape of the first fixing portion 12 and the second fixing portion 13 may be adaptively set according to the shape and size of the accommodating groove.

Optionally, in this embodiment of the present application, when the temperature of the environment where the first plate-shaped support 11 is located changes, the first deformation portion 14 body deforms, and the first deformation portion 14 and the first magnetic member 4 are fixedly disposed together.

In one example, the first deformation portion 14 may be fixedly disposed with the first magnetic member 4 by dispensing or disposing double sided adhesive tape on a side proximate to the first fitting groove 8.

In another example, the first deformation portion 14 may be fixedly disposed with the first magnetic member 4 by providing a snap-fit member on a side proximate to the first fitting groove 8.

Alternatively, in the embodiment of the present application, the first deformation portion 14 may be integrally formed with the first fixing portion 12 and the second fixing portion 13, or may be an element portion made of a material different from that of the first fixing portion 12 and the second fixing portion 13, and specifically, the material of the first deformation portion 14 may be a shape memory alloy material.

In the embodiment of the present application, in the process of changing the first bracket 3 from the first form to the second form, the first deformation portion 14 deforms toward the groove bottom of the first fitting groove 8; in the process of changing the first bracket 3 from the second form to the first form, the first deforming portion 14 deforms in a direction away from the bottom of the first fitting groove 8.

Therefore, the first fixing part and the second fixing part of the first bracket are respectively and fixedly connected with the groove wall of the first assembly groove, so that the first bracket can be more firmly connected with the first assembly groove, a first deformation part is arranged between the first fixing part and the second fixing part, and a first magnetic piece is further arranged on one surface, close to the first assembly groove, of the first deformation part, so that the first bracket can drive the first magnetic piece to move through the first deformation part when the temperature changes.

In order to enable the first support to be connected with the first magnetic piece more firmly, a clamping piece can be arranged on the first support, and the clamping piece is taken as an anti-wrapping arm for example to be specifically described.

Alternatively, in the embodiment of the present application, as shown in fig. 10, in conjunction with fig. 9, the first plate-shaped bracket 11 further includes: at least one first turn-up arm 15, the at least one first turn-up arm 15 being provided on a face of the first deforming portion 14 proximate to the first fitting groove 8.

In this embodiment, the at least one first wrapping arm 15 and the first deforming portion 14 enclose a receiving space for receiving the first magnetic member 4.

Alternatively, in this embodiment of the present application, the material of the at least one first wrapping arm 15 may be the same as or different from that of the first deformation portion 14, and the at least one first wrapping arm 15 may be integrally manufactured with the first deformation portion 14; the shape and material of each first turnup arm 15 in the at least one first turnup arm 15 may be the same or different; specifically, the shape of the at least one first turn-up arm 15 may be C-shaped, L-shaped, or the like.

Alternatively, in this embodiment of the present application, the at least one first wrapping arm 15 may be disposed on the first edge of the first deformation portion 14, which is close to the side of the first assembly groove 8, or may be disposed on the second edge of the first deformation portion 14, which is close to the side of the first assembly groove 8, or may be disposed on the first edge and the second edge of the first deformation portion 14, which are close to the side of the first assembly groove 8, respectively. Wherein the first edge and the second edge are opposite edges of the first deforming part 14 proximate to one face of the first fitting groove 8.

In one example, the at least one first turn-up arm 15 comprises two C-shaped turn-up arms arranged at a first edge of the first deformation 14 proximate to one face of the first fitting groove 8. Wherein, the two C-shaped anti-wrapping arms and the first deformation portion 14 enclose a containing space for containing the first magnetic element 4.

In another example, as shown in fig. 11, the at least one first turn-up arm 15 includes two first C-shaped turn-up arms 16, wherein one first C-shaped turn-up arm 16 is disposed at a first edge 17 of the first deformation portion 14 proximate to one side of the first fitting groove 8, and the other first C-shaped turn-up arm 16 is disposed at a second edge 18 of the first deformation portion 14 proximate to one side of the first fitting groove 8. The two first C-shaped anti-wrapping arms 16 and the first deforming portion 14 enclose a receiving space for receiving the first magnetic member 4.

Therefore, the first bracket comprises at least one first anti-wrapping arm, and the at least one first anti-wrapping arm and the first deformation part are surrounded to form a containing space for containing the first magnetic piece, so that the first bracket can firmly fix the first magnetic piece.

Of course, two brackets may be further disposed on the middle frame of the electronic device, so that when the electronic device is in an environment with a large temperature change, the fluctuation of the screen resilience force generated by the screen of the electronic device due to the temperature change can be well balanced and adapted, and the specific explanation will be described below.

Alternatively, in this embodiment of the present application, as shown in fig. 12, the second bracket 5 is disposed at the notch of the second assembly groove 9, and the second magnetic member 6 is disposed on the side of the second bracket 5 adjacent to the second assembly groove 9.

Alternatively, in the embodiment of the present application, the second bracket 5 may be a second plate-shaped bracket, which is symmetrically disposed with respect to the torque hinge 7 in the middle of the electronic device with respect to the first plate-shaped bracket 11.

In the embodiment of the application, when the electronic device is in the first temperature range, the second bracket 5 is in the third state, and when the electronic device is in the folded state, the distance between the first magnetic element 4 and the second magnetic element 6 is the third distance; in the second temperature range, the second stand 5 is in the fourth configuration, and the distance between the first magnetic member 4 and the second magnetic member 6 is a fourth distance when the electronic device is in the folded state, the third distance being smaller than the fourth distance.

Optionally, in the embodiment of the present application, the third aspect may specifically be an extended state; the fourth aspect may specifically be: and is bent toward the bottom of the second fitting groove 9.

In the embodiment of the application, in the process of changing the second bracket 5 from the third form to the fourth form, the second bracket 5 drives the second magnetic piece 6 to move towards the bottom of the second assembly groove 9; during the change of the second bracket 5 from the fourth configuration to the third configuration, the second bracket 5 drives the second magnetic member 6 to move away from the bottom of the second fitting groove 9.

It can be appreciated that the second bracket is in an extended state when it is in an environment with a lower temperature value; when the temperature of the environment where the electronic equipment is positioned is changed from a lower temperature to a higher temperature, the second deformation plate bracket is in a state of bending towards the bottom of the second assembly groove, and when the temperature of the environment where the electronic equipment is positioned is changed from a third form to a fourth form, the second bracket drives the second magnetic piece to move towards the bottom of the second assembly groove; when the environmental temperature of the electronic equipment is changed from a higher temperature to a lower temperature, the second bracket drives the second magnetic piece to move away from the bottom of the second assembly groove in the process of changing the fourth form of the second bracket into the third form of the second bracket.

Therefore, as the electronic equipment is in different temperature environments, the second bracket can drive the second magnetic piece to move towards or away from the groove bottom of the second assembly groove, so that the distance between the second magnetic piece and the first magnetic piece is changed, the magnetic attraction between the second magnetic piece and the first magnetic piece is changed, fluctuation of screen resilience force generated by temperature change of a screen of the electronic equipment is balanced and adapted, and the electronic equipment can be normally opened and closed in different temperature environments.

Of course, the second bracket and the first bracket may have the same structure, which will be described in detail below.

Optionally, in an embodiment of the present application, referring to fig. 12, as shown in fig. 13, the second bracket 5 further includes: the third fixing portion 19, the fourth fixing portion 20 and the second deformation portion 21, the third fixing portion 19 and the fourth fixing portion 20 are respectively fixedly connected with the groove wall of the second assembly groove 9, the second deformation portion 21 is disposed between the third fixing portion 19 and the fourth fixing portion 20, and the second magnetic member 6 is disposed on one side of the second deformation portion 21 facing the groove bottom of the second assembly groove 9.

Alternatively, in the embodiment of the present application, the third fixing portion 19 and the fourth fixing portion 20 are used to fix the two ends of the second bracket 5 at the notch of the second fitting groove 9, respectively.

Specifically, the third fixing portion 19 and the fourth fixing portion 20 may be fixed on the groove wall of the accommodating groove 10 provided at the notch of the second fitting groove 9 by laser welding, and the shape of the third fixing portion 19 and the fourth fixing portion 20 may be adaptively set according to the shape and size of the accommodating groove.

Optionally, in this embodiment, when the temperature of the environment where the second bracket 5 is located changes, the second deformation portion 21 body deforms, and the second deformation portion 21 and the second magnetic member 6 are fixedly disposed together.

In one example, the second deformation portion 21 may be fixedly provided together with the second magnetic member by dispensing or providing double-sided adhesive tape on a side proximate to the second fitting groove 9.

In another example, the second deformation portion 21 may be fixedly disposed with the second magnetic member 6 by providing a snap-fit member on a side proximate to the second fitting groove 9.

Alternatively, in the embodiment of the present application, the second deformation portion 21 may be an element portion integrally formed with the third fixing portion 19 and the fourth fixing portion 20, or may be an element portion having a material different from that of the third fixing portion 19 and the fourth fixing portion 20, and specifically, the material of the second deformation portion 21 may be a shape memory alloy material.

In the embodiment of the present application, in the process of changing the second bracket 5 from the third form to the fourth form, the second deformation portion 21 is deformed toward the groove bottom of the second fitting groove 9; in the process of changing the second bracket 5 from the fourth form to the third form, the second deforming part 21 deforms in a direction away from the bottom of the second fitting groove.

Therefore, the third fixing part and the fourth fixing part of the second bracket are respectively fixedly connected with the groove wall of the first assembly groove, so that the second bracket can be more firmly connected with the second assembly groove, a second deformation part is arranged between the third fixing part and the fourth fixing part, and a second magnetic piece is further arranged on one surface, close to the second assembly groove, of the second deformation part, so that the second bracket can drive the second magnetic piece to move through the second deformation part when the temperature changes.

In order to enable the second support to be connected with the second magnetic piece more firmly, a clamping piece can be arranged on the second support, and the clamping piece is taken as an anti-wrapping arm for example to be specifically described.

Optionally, in this embodiment of the present application, the second bracket 5 further includes: at least one second turnup arm provided on a face of the second deformation portion 21 proximate to the second fitting groove 9.

In this embodiment, the at least one second wrapping arm and the second deformation portion 21 enclose a receiving space for receiving the second magnetic element 4.

Alternatively, in this embodiment of the present application, the material of the at least one second wrapping arm may be the same as or different from the material of the second deformation portion 21, and the at least one second wrapping arm may be integrally manufactured with the second deformation portion 21; the shape and the material of each second wrapping arm in the at least one second wrapping arm can be the same or different; specifically, the shape of the at least one second turnup arm may be C-shaped, L-shaped, or the like.

It should be noted that, the arrangement and shape of the at least one second wrapping arm may refer to the above description of the arrangement and shape of the at least one first wrapping arm 15, which is not described herein.

Therefore, the second bracket comprises at least one second anti-wrapping arm, and the at least one second anti-wrapping arm and the second deformation part enclose a containing space for containing the second magnetic piece, so that the second bracket can firmly fix the second magnetic piece.

The first bracket is taken as a U-shaped bracket, and specific examples will be given below.

Example two,

Alternatively, in the embodiment of the present application, the first bracket 3 may be a U-shaped bracket;

specifically, the U-shaped bracket may be a bendable bracket made of a shape memory alloy material, and the U-shaped bracket has different forms in different temperature environments: when the U-shaped bracket is in a first temperature range, the U-shaped bracket takes a first form, such as: an extended state; when the U-shaped bracket is in the second temperature range, the U-shaped bracket takes a second shape, such as: a contracted state.

Optionally, in this embodiment of the present application, the U-shaped bracket is fixedly disposed on a groove wall of the accommodating groove at the notch of the first assembly groove 8, and the first magnetic member 4 may be adsorbed and fixed on a surface of the U-shaped bracket, which is close to the first assembly groove 8, by magnetic attraction, or may be clamped and fixed on a surface of the U-shaped bracket, which is close to the first assembly groove 8, by a clamping structure; the second magnetic member 6 is fixedly disposed in the second fitting groove 9.

Optionally, in this embodiment, the area of the bottom slot of the first assembly slot 8 is larger than the area of the surface of the first magnetic element 4 parallel to the bottom slot of the first assembly slot 8, and a gap is left between the first magnetic element 4 and the first assembly slot 8, so that the first magnetic element 4 can move in the first assembly slot 8 along a plane parallel to the notch of the first assembly slot 8.

In this embodiment, during the process of changing the first bracket 3 from the first configuration to the second configuration, the first bracket 3 drives the first magnetic member 4 to move along the first direction, so that the first magnetic member 4 and the second magnetic member 6 are dislocated; during the change of the first bracket 3 from the second form to the first form, the first bracket 3 drives the first magnetic member 4 to move along the second direction so that the first magnetic member 4 and the second magnetic member 6 are opposite; the first direction and the second direction are parallel to the first plane, and the first direction and the second direction are opposite; the first plane is a plane where the notch of the first fitting groove is located.

Alternatively, in the embodiment of the present application, the first direction may be a direction parallel to a plane where the notch of the first fitting groove 1 is located and facing the middle torque hinge of the electronic device; the second direction may be a direction parallel to a plane in which the notch of the first fitting groove 1 is located and away from the electronic device middle torque hinge 7.

It should be noted that, the "misalignment of the first magnetic member and the second magnetic member" may be understood as: the center points of the action surfaces (namely the overlapped surfaces of the vertical projection) between the first magnetic piece and the second magnetic piece are not opposite; the above-mentioned "the first magnetic member and the second magnetic member are opposed" can be understood as: the center point of the active surface (i.e., the overlapping surface of the perpendicular projection) between the first magnetic member and the second magnetic member is opposite.

For example, as shown in fig. 14 (a), the first bracket 3 is a U-shaped bracket 22, and the U-shaped bracket 22 is in an extended state when the U-shaped bracket 22 is in the environment of a first temperature of-10 ℃ (the first temperature is a temperature value within a first temperature range). As shown in fig. 14 (b), when the U-shaped bracket 22 is in the environment of the second temperature of 25 ℃ (the second temperature is a temperature value within the second temperature range), the U-shaped bracket 12 is in a contracted state, and when the environment temperature of the electronic device is changed from the first temperature to the second temperature, the U-shaped bracket 22 drives the first magnetic member 4 to move along a direction parallel to the plane where the notch of the first assembly slot 8 is located and toward the torque hinge 7 in the middle of the electronic device during the process that the U-shaped bracket 22 is changed from the first form to the second form; when the environmental temperature of the electronic device is changed from the second temperature to the first temperature, the U-shaped bracket 22 drives the first magnetic member 4 to move along a direction parallel to the plane of the notch of the first assembly slot 8 and away from the torque hinge 7 in the middle of the electronic device during the process of changing the second shape of the U-shaped bracket 22 from the first shape of the U-shaped bracket.

Therefore, as the electronic equipment is in different temperature environments, the first bracket can drive the first magnetic part to move towards or away from the direction of the torque hinge in the middle of the electronic equipment, so that the acting area between the first magnetic part and the second magnetic part is changed, the magnetic attraction between the first magnetic part and the second magnetic part is changed, and the fluctuation of screen resilience force generated by temperature change of the screen of the electronic equipment is balanced and adapted, so that the electronic equipment can be normally opened and closed in different temperature environments.

The structure of the first bracket is specifically described below.

Optionally, in this embodiment of the present application, as shown in fig. 15, the first bracket 3 further includes: a fifth fixing portion 23, a sixth fixing portion 24 and a third deformation portion 25, wherein the fifth fixing portion 23 is fixedly connected with the groove wall of the first assembly groove 8, and a first magnetic member 4 is arranged on one surface of the sixth fixing portion 24 close to the first assembly groove 8; the third deforming portion 25 is provided between the fifth fixing portion 23 and the sixth fixing portion 24.

Alternatively, in the embodiment of the present application, the fifth fixing portion 23 is used to fix the first bracket 3 at the notch of the first assembly groove 8, specifically, the fifth fixing portion 23 may be fixed on the groove wall of one accommodating groove 10 disposed at the notch of the first assembly groove 8 by laser welding, and the shape of the fifth fixing portion 23 may be adaptively set according to the shape and size of the accommodating groove.

Alternatively, in the embodiment of the present application, the sixth fixing portion 24 is used to fix the first magnetic member 4.

In one example, the sixth fixing portion 24 may be fixedly disposed with the first magnetic member 4 by dispensing or disposing double-sided adhesive tape on a side proximate to the first fitting groove 8.

In another example, the sixth fixing portion 24 may be fixedly disposed with the first magnetic member 4 by providing a snap-fit member on a side proximate to the first fitting groove 8.

Optionally, in this embodiment of the present application, when the environmental temperature where the first bracket 3 is located changes, the third deformation portion 25 is deformed.

Alternatively, in the embodiment of the present application, the third deformation portion 25 may be an element portion integrally formed with the fifth fixing portion 23 and the sixth fixing portion 24, or may be an element portion different from the constituent materials of the fifth fixing portion 23 and the sixth fixing portion 24, and specifically, the material of the third deformation portion 25 may be a shape memory alloy material.

In the embodiment of the present application, in the process of changing the first bracket 3 from the first configuration to the second configuration, the third deformation portion 25 contracts in the first direction; the third deformation portion 25 is stretched in the second direction during the change of the first bracket 3 from the second configuration to the first configuration.

It can be understood that the third deformation part is in a contracted form at a second temperature with a higher temperature value, and when the environment where the electronic equipment is located is changed from the first temperature to the second temperature, the third deformation part drives the first magnetic part to move along a plane parallel to the notch of the first assembly groove and towards the direction of the torque hinge in the middle of the electronic equipment in the process that the third deformation part is changed from the extended form to the contracted form; when the environment where the electronic equipment is located is changed from the second temperature to the first temperature, the third deformation part drives the first magnetic part to move along the direction parallel to the plane where the notch of the first assembly groove is located and far away from the torque hinge in the middle of the electronic equipment in the process that the third deformation part is changed from the contracted form to the expanded form.

Therefore, the fifth fixing part of the first bracket is fixedly connected with the groove wall of the first assembly groove, so that the first bracket can be firmly connected with the first assembly groove, and the third deformation part is arranged between the fifth fixing part and the sixth fixing part, so that when the temperature changes, the first bracket can drive the first magnetic piece arranged on the sixth fixing part to move through the third deformation part.

Likewise, in order to make the first bracket be more firmly connected with the first magnetic member, a clamping member may be further disposed on the first bracket, and the following specific description will be given by taking the clamping member as an anti-wrapping arm.

Alternatively, in this embodiment of the present application, as shown in fig. 16 in conjunction with fig. 15, the first bracket 3 further includes: at least one clamping piece 26, the at least one clamping piece 26 is arranged on one end of the sixth fixing portion 24 far away from the fifth fixing portion 23.

In this embodiment, the first magnetic member 4 is fixedly connected to the first bracket 3 through at least one clamping member 26.

Optionally, in this embodiment of the present application, the at least one fastening member 26 may be at least one third wrapping arm, and the material of the at least one third wrapping arm may be the same as or different from that of the third deformation portion 25, and the at least one third wrapping arm may be an element portion integrally manufactured with the third deformation portion 25; the shape and the material of each third turnup arm in the at least one third turnup arm can be the same or different; specifically, the shape of the at least one third cam arm may be C-shaped, L-shaped, etc.

For example, as shown in fig. 17, the at least one clamping member 26 includes two second C-shaped anti-wrapping arms 27, wherein one second C-shaped anti-wrapping arm 27 is disposed at a first position 28 on an end of the sixth fixing portion 24 away from the fifth fixing portion 23, and the other second C-shaped anti-wrapping arm 27 is disposed at a second position 29 on an end of the sixth fixing portion 24 away from the fifth fixing portion 23. The two second C-shaped anti-wrapping arms 27 and the sixth fixing portion 24 enclose a receiving space for receiving the first magnetic member 4.

Therefore, the first bracket comprises at least one clamping piece, and the at least one clamping piece and the sixth fixing part are surrounded to form a containing space for containing the first magnetic piece, so that the first bracket can firmly fix the first magnetic piece.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.

Claims

1. An electronic device, the electronic device comprising:

a first housing and a second housing rotatably connected to switch the electronic device between an unfolded state and a folded state;

a first bracket is arranged on the first shell, and a first magnetic piece is arranged on the first bracket;

a second bracket is arranged on the second shell, and a second magnetic piece is arranged on the second bracket;

the shape of the first bracket can be changed along with the change of temperature, in a first temperature range, the first bracket is in a first form, and when the electronic equipment is in a folding state, the distance between the first magnetic piece and the second magnetic piece is a first distance; in a second temperature range, the first bracket is in a second state, a distance between the first magnetic piece and the second magnetic piece is a second distance when the electronic equipment is in a folded state, and the first distance is smaller than the second distance.

2. The electronic device of claim 1, wherein the first housing is further provided with a first assembly slot and the second housing is further provided with a second assembly slot;

when the electronic equipment is in a folded state, the first assembly groove is opposite to the second assembly groove; the first support is arranged in the first assembly groove, and the second support is arranged in the second assembly groove.

3. The electronic device of claim 2, wherein the first bracket comprises: the first magnetic part is arranged on one side of the first deformation part, which faces the bottom of the first assembly groove;

wherein, in the process of changing the first bracket from the first shape to the second shape, the first deformation part deforms towards the bottom of the first assembly groove;

in the process of changing the second form of the first bracket into the first form, the first deformation part deforms in the direction away from the bottom of the first assembly groove.

4. The electronic device according to claim 2, wherein the second bracket is disposed at a notch of the second fitting groove, and the second magnetic member is disposed on a face of the second bracket proximate to the second fitting groove;

wherein, when the electronic equipment is in the first temperature range, the second bracket is in a third state, and when the electronic equipment is in a folded state, the distance between the first magnetic piece and the second magnetic piece is a third distance; in a second temperature range, the second bracket is in a fourth state, and when the electronic equipment is in a folded state, the distance between the first magnetic piece and the second magnetic piece is a fourth distance, and the third distance is smaller than the fourth distance.

5. The electronic device of claim 4, wherein the second bracket further comprises:

the second magnetic piece is arranged on one side of the second deformation part, which faces the bottom of the second assembly groove;

Wherein the second deformation part deforms towards the bottom of the second assembly groove in the process of changing the second bracket from the third form to the fourth form;

in the process of changing the second bracket from the fourth form to the third form, the second deformation part deforms in the direction away from the bottom of the second assembly groove.

6. The electronic device of claim 1, wherein the first support is a shape memory alloy member.

7. The electronic device of claim 1, wherein the first magnetic member is fixedly connected to the first bracket by an adhesive, or wherein the first magnetic member is fixedly connected to the first bracket by a clamping structure.

8. The electronic device of claim 1, wherein during the transition of the first mount from the first configuration to the second configuration, the first mount drives the first magnetic member in a first direction to cause misalignment of the first magnetic member and the second magnetic member;

during the process of changing the first bracket from the second form to the first form, the first bracket drives the first magnetic piece to move along a second direction so that the first magnetic piece and the second magnetic piece are opposite;

The first direction and the second direction are parallel to a first plane, and the first direction and the second direction are opposite; the first plane is a plane where the notch of the first assembly groove is located.

9. The electronic device of claim 8, wherein the first bracket further comprises:

the first magnetic piece is arranged on one surface of the sixth fixing part, which is close to the first assembly groove; the third deformation part is arranged between the fifth fixing part and the sixth fixing part;

wherein the third deformation portion contracts in the first direction in the process of changing the first shape of the first bracket from the first shape to the second shape;

the third deformation portion extends in the second direction during the change of the first stent from the second configuration to the first configuration.

10. The electronic device of claim 9, wherein the first bracket further comprises:

the clamping piece is arranged at one end, far away from the fifth fixing part, of the sixth fixing part;

The first magnetic piece is fixedly connected with the first bracket through the at least one clamping piece.