CN116114924A - Atomization core, electronic atomization device and preparation method of atomization core - Google Patents

Abstract

The invention provides an atomizing core, an electronic atomization device and a method for preparing the atomizing core. The method for preparing the atomizing core includes the following steps: forming two electrodes on the atomizing surface of the substrate; A first heating layer with two electrodes electrically connected; a first protection layer is formed on the surface of the first heating layer away from the substrate. The invention provides an atomizing core, an electronic atomizing device and a method for preparing the atomizing core without affecting the appearance, resistance, consistency, and the like of the heating layer due to electrode sintering.

Description

Atomization core, electronic atomization device and preparation method of atomization core

technical field

The invention relates to the field of electronic atomization, in particular to an atomization core, an electronic atomization device and a method for preparing the atomization core.

Background technique

The electronic atomization device is a device that atomizes the substrate to be atomized into an aerosol, and is widely used in daily life. The key component of the electronic atomization device is the atomization core, which can heat and atomize the substance to be atomized and release the aerosol for users to use.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an existing atomizing core 10 , which is mainly composed of a substrate 11 , a metal heating layer 12 , an inorganic protective layer 13 and an electrode 14 . During preparation, physical vapor deposition technology is usually used to deposit a conductive metal film on the surface of the porous ceramic substrate 11 to form a metal heating layer 12; the protective layer 13 is usually an oxide, which is used to prevent the metal in the metal heating layer 12 film from being oxidized by air, and the electrode 14 An external current is introduced into the heat generating layer 12 , and Joule heat is generated when the external current passes through the heat generating layer 12 .

In the existing process, when preparing the atomizing core 10 , the metal heating layer 12 is prepared first, and then the electrode 14 is prepared. After the electrode 14 is sintered, the protective layer 13 is provided on the metal heating layer 12 and the electrode 14 . However, the inventor found through experiments that, as shown in Figure 2a and Figure 2b and the table below, Figure 2a shows the atomization core 10 sintered at 380°C for 30 minutes in an air atmosphere, and Figure 2b shows the atomization core 10 sintered at 450°C for 30 minutes in an air atmosphere 10. The following table shows the change of metal appearance and resistance value of the composite metal film with 0.2 μm aluminum film deposited on the surface of 2.0 μm molybdenum film in Figure 2a and Figure 2b at different sintering temperatures. From the experimental results, it can be found that when using different electrodes 14 to prepare the atomizing core 10, the sintering temperatures of different electrodes 14 are different, which will lead to changes in the degree of oxidation and resistance of the metal heating layer 12, and the thin film of the heating layer 12 is easy to oxidize , cracks and shedding, and the sintering at different temperatures affects the consistency of the manufactured atomizing core 10 .

Measuring position 30min in air at 380°C 30min in air at 450℃ a-a 0.56Ω 4.2Ω b-b 0.95Ω 1.9Ω c-c 0.008Ω 0.015Ω d-d 0.05Ω 2.5Ω

Therefore, it is necessary to optimize the preparation method of the atomizing core to improve the above defects.

Contents of the invention

The atomization core, the electronic atomization device and the preparation method of the atomization core of the present invention can solve the problems of oxidation, cracks, shedding and poor consistency of the heating layer affected by electrode sintering.

In order to solve the above technical problems, the first technical solution provided by this application is to provide a method for preparing an atomizing core, which includes the following steps:

Form two electrodes on the atomizing surface of the substrate;

forming a first heating layer electrically connected to the two electrodes on the atomizing surface;

A first protective layer is formed on the surface of the first heat generating layer away from the substrate.

In one embodiment, after the step of forming the first heat generating layer electrically connected to the two electrodes on the atomizing surface, before the step of forming the first protective layer on the surface of the first heat generating layer away from the substrate, the steps further include:

Perform graphic processing on the first heating layer according to the preset graphics.

In one embodiment, the step of patterning the heat generating layer according to a preset pattern includes:

A laser etching process is used to scribe a line on the first heat generating layer, and divide the first heat generating layer into a central area located in the middle and an edge area located at the side.

In one embodiment, the process parameters of the laser etching process are: the laser wavelength is 1064 nm, the power is 60 W, and the laser diameter is 50 μm.

In one embodiment, the step of forming a first heating layer electrically connected to the two electrodes on the atomizing surface further includes:

forming a second heat generating layer connected to the first heat generating layer on the surfaces of the two electrodes;

The step of forming the first protective layer on the surface of the first heat generating layer away from the substrate also includes:

A second protective layer is formed on the surface of the second heat generating layer.

In one embodiment, a magnetron sputtering process is used to prepare the first heating layer and the second heating layer; the steps of the magnetron sputtering process are: first deposit the first The metal layer, and then deposit the second metal layer under the second sputtering power and the second sputtering pressure; the first sputtering power is less than the second sputtering power, and the first sputtering pressure is greater than the second sputtering pressure.

In one embodiment, the first protective layer and the second protective layer are prepared by reactive magnetron sputtering process.

In one embodiment, the step of forming two electrodes on both sides of the atomizing surface of the substrate comprises:

Continuously screen-print silver paste on both sides of the atomized surface of the substrate for multiple times, dry at 80°C-140°C for 20min-40min, and sinter in an air atmosphere of 400°C-500°C for 20min-40min, forming a thickness of The two electrodes are 80 μm-120 μm.

In order to solve the above technical problems, the second technical solution provided by the present application is to provide an atomizing core, which is prepared by the method for preparing the atomizing core mentioned in any one of the above.

In order to solve the above technical problems, the third technical solution provided by this application is to provide an electronic atomization device, including a liquid storage component, a battery component, and an atomizing core. The liquid storage component is used to store an aerosol-generating substrate. The core is used to atomize the aerosol-generating substrate in the liquid storage assembly, and the battery component is used to supply power to the atomizing core to enable the atomizing core to work, wherein the atomizing core is the aforementioned atomizing core.

In the preparation method of the atomizing core, the electronic atomization device and the atomizing core provided by the present invention, two electrodes are firstly formed on the atomizing surface of the substrate, and then a first electrode electrically connected to the two electrodes is formed on the atomizing surface. Therefore, the problems of film oxidation, cracks and shedding of the heat-generating layer caused by the high-temperature oxidation and sintering environment of the electrode are eliminated, and the problem of poor consistency of the first heat-generating layer will not occur without electrodes being sintered at different temperatures.

Description of drawings

Fig. 1 is a schematic structural diagram of an existing atomizing core;

Figure 2a shows the atomizing core sintered for 30 minutes at 380°C in an air atmosphere;

Figure 2b shows the atomizing core sintered for 30 minutes at 450°C in an air atmosphere;

Fig. 3 is a schematic diagram of an explosion structure of the atomization core provided by the present application;

Fig. 4 is a flow chart of a preparation method of an atomizing core provided by the present application;

Fig. 5 is a schematic diagram of another explosion structure of the atomizing core provided by the present application;

Fig. 6 is a flow chart of another method for preparing an atomizing core provided by the present application;

Fig. 7 is an atomizing core prepared by the method for preparing the atomizing core in Fig. 6;

Figure 8 is the appearance of the laser-etched scribed area obtained by patterned etching of the atomization core after the preparation of the protective layer;

Fig. 9 is another structural schematic diagram of the atomizing core provided by the present application;

Fig. 10 is a heat distribution diagram of the atomizing core after graphic processing;

Fig. 11 is a flowchart of another method for preparing an atomizing core provided by the present application;

Fig. 12 is an atomization core prepared by using the method for preparing the atomization core in Fig. 11 .

Detailed ways

The present invention will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. Wherein, similar elements in different implementations adopt associated similar element numbers. In the following implementation manners, many details are described for better understanding of the present application. However, those skilled in the art can readily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the application are not shown or described in the description, this is to avoid the core part of the application being overwhelmed by too many descriptions, and for those skilled in the art, it is necessary to describe these operations in detail Relevant operations are not necessary, and they can fully understand the relevant operations according to the description in the specification and general technical knowledge in the field.

In addition, the characteristics, operations or characteristics described in the specification can be combined in any appropriate manner to form various embodiments. At the same time, the steps or actions in the method description can also be exchanged or adjusted in a manner obvious to those skilled in the art. Therefore, the various sequences in the specification and drawings are only for clearly describing a certain embodiment, and do not mean a necessary sequence, unless otherwise stated that a certain sequence must be followed.

The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified.

The present application provides an electronic atomization device, which can be used for atomizing an aerosol-generating substrate. The electronic atomization device includes an atomization component and a battery component, and the atomization component and the battery component are electrically connected.

The battery assembly has a battery, and the battery is used to supply power to the atomizing core 20 in the atomizing assembly, so that the atomizing assembly can atomize the aerosol generating substrate to form an aerosol. The atomization component and the battery component can be integrated or detachably connected, and can be designed according to specific needs.

Atomization components can be used in different fields, such as medical atomization, electronic atomization, etc. The atomization assembly includes a liquid storage chamber and an atomization core 20. The liquid storage chamber is used to store the aerosol generating substrate, and the atomizing core 20 is used to atomize the aerosol generating substrate to generate an aerosol. In a specific embodiment, the atomization The component is a pod, and the atomizing core 20 atomizes the smoke oil and generates smoke for the user to inhale; in other embodiments, the atomizing component can also be applied to a hairspray device to atomize for hair styling hairspray; or medical equipment used in the treatment of upper and lower respiratory diseases to aerosolize medical drugs.

Please refer to FIG. 3 , which is a schematic diagram of an exploded structure of the atomizing core 20 provided in the present application. The present application also provides an atomizing core 20, which can atomize an aerosol-generating substrate to generate an aerosol after being energized, and the atomizing core 20 can be applied to the aforementioned atomizing components and electronic atomizing devices.

The atomizing core 20 includes a base 21 , a first heating layer 22 , a first protection layer 23 and two electrodes 24 . The material of the base body 21 can be a porous material, and the micropores in the base body 21 can effectively absorb and divert the liquid aerosol generating substrate, and guide the aerosol generating substrate to the first heating layer 22 for atomization. The material of the matrix 21 can be a porous ceramic matrix 21, for example, the material is one or a combination of titanium oxide, silicon oxide, aluminum oxide, and zirconium oxide.

Wherein, the first heating layer 22 is used to generate heat when the current passes through, and it can be a metal film on the substrate 21 by physical vapor deposition technology, and the material of the first heating layer 22 can be molybdenum, titanium, zirconium, niobium, titanium Aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy and other alloy materials.

The first protective layer 23 is used to protect the first heating layer 22 against oxidation, and can be formed by physical vapor deposition. The material of the first protective layer 23 can be aluminum oxide, silicon oxide, zirconium oxide and other materials.

The two electrodes 24 are used to introduce an external current into the first heating layer 22 , and Joule heat will be generated when the external current passes through the first heating layer 22 , so that the atomizing core 20 heats the aerosol generating substrate.

In one embodiment, as shown in FIG. 3 , a first heating layer 22 and two electrodes 24 are provided on the atomizing surface of the substrate 21 , and a protective layer is provided on the side of the first heating layer 22 away from the substrate 21 . Core 20 is prepared by the following method:

Please refer to FIG. 4 . FIG. 4 is a flowchart of a manufacturing method of the atomizing core 20 provided in the present application. The present application provides a method for preparing the atomizing core 20, including:

Step S11: forming two electrodes on the atomizing surface of the substrate;

Wherein, the substrate 21 may be a porous ceramic substrate 21, and the two electrodes 24 are respectively located at two ends of the atomizing surface. The material of the electrode 24 can be a material with good conductivity, such as silver paste. During production, the silver paste can be continuously screen-printed on the atomized surface of the substrate 21 for several times at both ends of the atomized surface, dried at 80°C-140°C for 20min-40min, and dried in air at 400°C-500°C. Sintering in the atmosphere for 20min-40min to form the two electrodes 24 with a thickness of 80μm-120μm.

Step S12: forming a first heating layer electrically connected to the two electrodes on the atomizing surface;

Before forming the first heating layer 22 electrically connected to the two electrodes 24, the two electrodes 24 can be covered with a mask, and then the first heating layer is formed on the atomized surface of the substrate 21 between the two electrodes 24 twenty two. The first heating layer 22 may be formed by magnetron sputtering technology.

In one embodiment, the steps of the magnetron sputtering process are: first deposit the first metal layer under the first sputtering power and the first sputtering gas pressure, and then deposit the first metal layer under the second sputtering power and the second sputtering gas pressure Deposit the second metal layer, the first sputtering power is less than the second sputtering power, the first sputtering pressure is greater than the second sputtering pressure, because the physical properties (such as thermal expansion coefficient) of the ceramic substrate 21 are different from those of the metal layer, It is easy to fall off when heated. By setting the transition layer to deposit the first heat generating layer 22 in the above way, the adhesion and electrical conductivity of the heat generating layer can be improved, and the phenomenon that the first heat generating layer 22 is easy to fall off when heated can be prevented.

Among them, in a specific embodiment, the metal target of the magnetron sputtering process can be molybdenum metal, and firstly deposit it under the first sputtering power of 400W-700W and the first sputtering pressure of 0.4Pa-0.6Pa. The first metal layer of molybdenum metal with a thickness of 0.8μm-1.2μm, then increase the sputtering power to the second sputtering power of 2000W-3000W, reduce the chamber pressure to the second sputtering pressure of 0.1Pa-0.3Pa, and then A second metal layer of molybdenum metal with a thickness of 0.8 μm-1 μm is deposited, and finally a metal heating layer with a thickness of 1.6 μm-2.0 μm is prepared on the surface of the porous ceramic substrate 21 .

Step S13: forming a first protective layer on the surface of the first heat generating layer away from the substrate.

Wherein, the preparation method of the first protective layer 23 may be reactive magnetron sputtering technology. For example, in a specific embodiment, the material of the first protective layer 23 can be aluminum oxide, an aluminum metal target can be sputtered in an oxygen atmosphere, the inert gas is argon, and the content ratio of argon to oxygen is 5:1 ~20:1; It can also be prepared in a vacuum environment, the vacuum pressure is 0.2Pa-1.5Pa. The starting power of reactive magnetron sputtering coating equipment is 700W~900W, the pre-sputtering is 0.5 hours, the coating power is 1500W~2500W, the coating pressure is controlled at 0.2Pa~1.5Pa, and finally a layer of 0.18μm- 0.2μm aluminum oxide protective layer.

Compared with the method of directly preparing aluminum oxide foil film by radio frequency magnetron sputtering, or preparing aluminum oxide foil film by DC magnetron sputtering (first DC magnetron sputtering to prepare aluminum coating, and then oxidizing the aluminum coating to aluminum oxide foil at high temperature), The aluminum oxide film is prepared by reactive sputtering technology, the target material is cheap, the sputtering parameters are low, and the sputtering yield is high.

The atomizing core 20 is prepared by the above-mentioned method. Firstly, two electrodes 24 are formed on the atomizing surface of the substrate 21, and then the first heating layer 22 electrically connected to the two electrodes 24 is formed on the atomizing surface. Compared with the existing The technology first forms the first heating layer 22, and then forms the preparation method of the two electrodes 24, which eliminates the problems of film oxidation, cracks and shedding of the first heating layer 22 caused by the high-temperature oxidation and sintering environment of the electrodes 24. The first heating layer The surface morphology of 22 is excellent, which improves the stability of the resistance value of the metal heating layer, and the problem of poor consistency of the first heating layer 22 will not occur without using the electrodes 24 for sintering at different temperatures. The prepared first heating layer The consistency of layer 22 is better.

In one embodiment, please refer to FIG. 5 , which is a schematic diagram of another exploded structure of the atomizing core 20 provided by the present application.

The atomizing core 20 also includes a second heating layer 25 and a second protective layer 26 . Two electrodes 24 and a first heating layer 22 are formed on the atomizing surface of the substrate 21, the two electrodes 24 are respectively the first electrode 24 and the second electrode 24, and the first heating layer 22 is arranged on the first electrode 24 and the second electrode 24. Between the electrodes 24. The number of the second heating layer 25 is two, wherein a part of the second heating layer 25 is arranged on the part surface of the first electrode 24 away from the substrate 21, and the other part of the second heating layer 25 is arranged on the first electrode 24 facing the first heating layer. The side of the layer 22 is connected to one end of the first heating layer 22; another part of the second heating layer 25 is set on the part surface of the second electrode 24 away from the substrate 21, and another part of the second heating layer 25 is set on the second The electrode 24 faces the side of the first heating layer 22 and is connected to the other end of the first heating layer 22 . That is, the first heat generating layer 22 may be electrically connected to the two electrodes 24 through the two second heat generating layers 25 . Correspondingly, the first protective layer 23 is provided on the surface of the first heat generating layer 22 away from the base 21 , and the second protective layer 26 is provided on the surface of the second heat generating layer 25 .

By disposing the second heat generating layer 25 on the electrode 24, compared with only disposing the first heat generating layer 22, the contact area between the heat generating layer and the electrode 24 is larger, and the contact between the two is more stable.

Please refer to FIG. 6 . FIG. 6 is a flow chart of another manufacturing method of the atomizing core 20 provided by the present application.

The method for preparing the atomizing core 20 is used to prepare the atomizing core 20 shown in FIG. 5 , which includes:

Step S21: forming two electrodes on the atomizing surface of the substrate;

Specifically, the specific implementation process of step S21 is the same or similar to the specific implementation process of step S11, and can achieve the same or similar technical effect. For details, please refer to the above, and will not repeat them here.

Step S22: forming a first heating layer electrically connected to the two electrodes on the atomizing surface, and forming a second heating layer connected to the first heating layer on the surfaces of the two electrodes;

Before forming the first heating layer 22 and the second heating layer 25 electrically connected to the two electrodes 24, a part of the two electrodes 24 can be covered with a mask, and then the electrodes 24 and the electrodes 24 that are not covered by the mask can be covered. A first heating layer 22 and a second heating layer 25 are formed on the surface of the substrate 21 between the two electrodes 24 . The formation method of the first heating layer 22 and the second heating layer 25 can use magnetron sputtering technology.

The steps of the magnetron sputtering technology of the first heating layer 22 and the second heating layer 25 can refer to the specific implementation process of step S12, and can achieve the same or similar technical effects. The details can be referred to above, and will not be repeated here.

Step S23: forming a first protective layer on the surface of the first heat-generating layer away from the substrate, and forming a second protective layer on the surface of the second heat-generating layer.

The preparation method of the first protection layer 23 and the second protection layer 26 may be reactive magnetron sputtering technology. The steps of the reactive magnetron sputtering technology for the first protective layer 23 and the second protective layer 26 can refer to the specific implementation process of step S13, and can achieve the same or similar technical effects. For details, please refer to the above, and will not repeat them here. .

Please refer to Fig. 7, Fig. 7 shows the coated atomizing core 20 prepared by using the method of preparing the atomizing core 20 in Fig. 6, it can be seen that the atomizing core 20 is prepared by preparing the electrode 24 first and then preparing the heating layer The surface form of the electrode 24 is continuous and smooth, which solves the problem of cracks and shedding on the surface of the heating layer due to the sintering of the electrode 24.

During the experiment, the inventors also found that the patterned etching process after the heat generating layer was prepared would damage the thin film of the inorganic protective layer. As shown in Figure 8, Figure 8 is the appearance of the laser-etched scribe area in the patterned etching after the preparation of the protective layer. It can be seen that the patterned etching after the preparation of the protective layer will see the For the metal heating layer film, it can be seen that the laser etching process destroys the completeness of the protective layer film, exposing part of the metal heating layer film, which is not conducive to the complete protection of the metal heating layer film by the protective layer.

In order to solve the above problems, the present invention also provides an atomizing core 20 , please refer to FIG. 9 , which is another structural schematic diagram of the atomizing core 20 provided in this application. The difference between this atomizing core 20 and the atomizing core 20 with the structure shown in FIG. 5 is that the first heat generating layer 22 is patterned.

By patterning the first heat-generating layer 22, the shape of the first heat-generating layer 22 can be adjusted to adjust the resistance value of the first heat-generating layer 22 and the distribution of electric heat generation, construct a better heating temperature gradient, and make the surface power As the density increases, the high-temperature area of the first heating layer 22 increases, and the aerosol generated by atomization has greater sweetness and aroma, and a stronger sense of stimulation, which can effectively improve the taste of the aerosol.

In one embodiment, please refer to FIG. 9 , the patterning process can divide the first heat generating layer 22 into a central region 221 located in the middle, and an edge region 222 located on the side, and the edge region 222 is located on the opposite side of the central region 221. sides. You can refer to FIG. 10, which is the heat distribution diagram of the atomizing core 20 after patterning. It can be seen that through such patterning, the heat in the central region 221 can be concentrated, and the electrical and thermal conduction in the edge region 222 is relatively weak. Therefore, The heat in the central region 221 is increased. In other embodiments, the shape of the patterned first heat generating layer 22 is not limited to the shape mentioned in this embodiment, and may also be other shapes.

Please refer to FIG. 11 . FIG. 11 is a flow chart of another manufacturing method of the atomizing core 20 provided by the present application. The preparation method of the atomization core 20 is used to prepare the atomization core 20 shown in FIG. 9 , and the preparation method of the atomization core 20 includes:

Step S31: forming two electrodes on the atomizing surface of the substrate;

Step S32: forming a first heating layer 22 electrically connected to the two electrodes on the atomizing surface;

Specifically, the specific implementation process of step S31 and step S32 is the same or similar to the specific implementation process of step S11 and step S12, and can achieve the same or similar technical effect. For details, please refer to the above, and will not repeat them here.

Step S33: Graphically process the first heating layer according to the preset graphics;

Specifically, laser etching technology can be used to scribe lines on the first heating layer 22, and the heating layer is divided into a central region 221 located in the middle and an edge region 222 located at the side, so that the temperature of the heating layer is concentrated in the central region. 221. Compared with the film-coated board process and the laser hollowing process, the laser etching process has a small etching workload and flexible etching lines, which can improve the efficiency of patterning processing and make the resistance of the heating layer more consistent. The technological parameters of the laser etching process may be as follows: the laser wavelength is 1064nm, the power is 60W, and the laser diameter is 50μm.

Step S34: forming a first protective layer on the surface of the first heat generating layer away from the substrate.

Specifically, the specific implementation process of step S34 is the same or similar to the specific implementation process of step S13, and can achieve the same or similar technical effect. Details can be found above, and will not be repeated here.

Please refer to Fig. 12, Fig. 12 is the atomizing core 20 prepared by using the method of preparing the atomizing core 20 in Fig. 22 for patterning treatment, and then form the first protective layer 23 on the surface of the first heat generating layer 22 away from the substrate 21, compared to the scheme of first forming the first protective layer 23 on the first heat generating layer 22, and then performing patterning treatment , can eliminate the damage to the film of the first protective layer 23 caused by the patterning process, so that the first protective layer 23 can completely and uniformly cover the surface of the first heat generating layer 22, which is beneficial to reduce the oxidation of the film of the heat generating layer. In addition, the four processes of the manufacturing method of the atomizing core 20 have little influence on each other, which reduces the complexity of the manufacturing process of the atomizing core 20 and is beneficial to reducing the manufacturing cost of the atomizing core 20 .

The above uses specific examples to illustrate the present invention, which is only used to help understand the present invention, and is not intended to limit the present invention. For those skilled in the technical field to which the present invention belongs, some simple deduction, deformation or replacement can also be made according to the idea of the present invention.

Claims (10)

1. A method of preparing an atomizing core, comprising the steps of:

forming two electrodes on the atomizing surface of the substrate;

forming a first heating layer electrically connected with the two electrodes on the atomization surface;

and forming a first protective layer on the surface of the first heating layer, which faces away from the substrate.

2. The method of producing an atomizing core according to claim 1, wherein after the step of forming a first heat generating layer electrically connected to the two electrodes on the atomizing face, the step of forming a first protective layer on a surface of the first heat generating layer facing away from the base body is preceded by the step of:

and carrying out graphical processing on the first heating layer according to a preset graph.

3. The method of manufacturing an atomized core according to claim 2, wherein the step of patterning the heat generating layer according to a predetermined pattern includes:

and scribing the first heating layer by adopting a laser etching process, and dividing the first heating layer into a middle area positioned in the middle and an edge area positioned at the side edge.

4. A method of preparing an atomized core as claimed in claim 3, wherein the laser etching process has the following process parameters: the laser wavelength was 1064nm, the power was 60W and the laser diameter was 50. Mu.m.

5. The method of producing an atomizing core according to any one of claims 1 to 4, characterized in that the step of forming a first heat generating layer electrically connected to the two electrodes on the atomizing face further comprises:

forming a second heating layer connected with the first heating layer on the surfaces of the two electrodes;

the step of forming a first protective layer on the surface of the first heating layer facing away from the substrate further comprises:

and forming a second protective layer on the surface of the second heating layer.

6. The method of producing an atomized core according to claim 5, wherein the first heat generating layer and the second heat generating layer are produced by a magnetron sputtering process; the magnetron sputtering process comprises the following steps: depositing a first metal layer under a first sputtering power and a first sputtering air pressure, and then depositing a second metal layer under a second sputtering power and a second sputtering air pressure; the first sputtering power is smaller than the second sputtering power, and the first sputtering air pressure is larger than the second sputtering air pressure.

7. The method of preparing an atomized core as claimed in claim 5, wherein the first protective layer and the second protective layer are prepared using a reactive magnetron sputtering process.

8. The method of preparing an atomizing core as set forth in claim 1, wherein the step of forming two electrodes on both sides of the atomizing face of the base includes:

screen printing silver paste on both sides of the atomized surface of the substrate successively at 80deg.C

-drying at 140 ℃ for 20min-40min, sintering in an air atmosphere at 400 ℃ -500 ℃ for 20min-40min, forming the two electrodes with thickness of 80-120 μm.

9. An atomizing core, characterized in that the atomizing core is prepared by the process for preparing an atomizing core according to any one of claims 1 to 8.

10. An electronic atomizing device comprising a liquid storage assembly for storing an aerosol-generating substrate, a battery assembly for supplying power to the atomizing core to enable the atomizing core to operate, and an atomizing core for atomizing the aerosol-generating substrate in the liquid storage assembly, wherein the atomizing core is as claimed in claim 9.

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