CN116056338A - Secondary positioning processing technology for routing slot of printed circuit board - Google Patents

Abstract

The invention belongs to the technical field of printed circuit boards, in particular to a secondary positioning processing technology for a routing slot of a printed circuit board, which comprises the following steps: step one, selecting a printed circuit board, wherein the edge of the printed circuit board is required to be smooth and flat, and no flash or burr exists; step two, positioning pins are arranged on the edge of the printed circuit board, and the printed circuit board is installed in the gong machine; marking the center of the gong groove by laser; step four, drilling explosion-proof holes at two ends of the gong groove respectively; according to the invention, the secondary positioning method is adopted to process the gong grooves, the resistance facing the running of the gong is gradually reduced in the process, the center positioning is adopted, the phenomenon that the gong is shifted in the running process is avoided, the side-by-side type irregular size and shape of the gong grooves can be effectively solved, meanwhile, the center position and the accuracy are relatively high, the same base plate piece can be processed at one time, the method is suitable for batch production, and meanwhile, the secondary precision gong is adopted for the gong grooves, so that the gong groove accuracy is provided.

Description

A secondary positioning process for printed circuit board gongs and grooves

technical field

The invention belongs to the technical field of printed circuit boards, and in particular relates to a secondary positioning process for gongs and grooves of printed circuit boards.

Background technique

For some PCB boards with large size and thickness, the precision requirements for gong groove are not particularly high. However, with the development of electronic products in the direction of thin, small, and micro, the requirements for the groove accuracy of PCB are also higher. Since the PCB board is formed by lamination of multi-layer plates, it is easy to cause the printed circuit board to burst and damage the printed circuit board when forming the one-time groove. The defective rate increases the cost of printed circuit board grooves.

Contents of the invention

In order to solve the problems raised in the above-mentioned background technology. The invention provides a secondary positioning processing technology for gong grooves of printed circuit boards.

In order to achieve the above object, the present invention provides the following technical solution: a secondary positioning process for printed circuit board gongs and grooves, comprising the following steps:

Step 1, the selection of the printed circuit board, the edge of the printed circuit board is required to be smooth and flat, without flashing burrs;

Step 2, setting up positioning pins on the edge of the printed circuit board, and installing the printed circuit board in the gong board machine;

Step 3: mark the center of the gong groove by laser;

Step four, drill an explosion-proof hole at both ends of the gong groove;

Step 5: Make the first groove on the printed circuit board through the punching machine to form the prototype of the groove. The length, width, and height of the primary groove are 0.1mm smaller than the length, width, and height of the predetermined groove. Specifically: use a pre-grooving knife From the explosion-proof hole at one end of the gong groove, cutting along the length of the gong groove to the centerline toward the explosion-proof hole at the other end of the gong groove to form the prototype of the gong groove;

Step 6: Carry out the second groove on the printed circuit board through the board machine. The second groove adopts the fine groove method, and the reserved 0.1mm is grooved. The explosion-proof hole at one end of the slot is cut along the length of the gong slot to the centerline toward the explosion-proof hole at the other end of the gong slot;

Step 7: Verify the gong groove, check whether the gong board has multiple gongs, missing gongs, scratches on the board surface, and copper leakage, etc. If the above situations occur, the technical staff will re-correct the parameters before re-routing;

Step 8, depositing a copper layer on the hole wall surface of the gong groove, making the outer circuit and the outer circuit ring on the surface of the printed circuit board, the outer circuit ring is arc-shaped and surrounds the outside of the gong groove forming area; wherein, A distance of 0.05 mm to 0.1 mm exists between the end of the outer circuit ring and the edge of the gong groove forming area by copper cutting.

As an optimal technical solution for the secondary positioning process of the printed circuit board gongs and grooves of the present invention, in step 3, the length and width data of the printed circuit board need to be input into the laser marking machine, and the data of the gongs and grooves of the circuit board should be input, and the laser The marking machine produces the center point of the gong groove to mark the center of the printed circuit side.

As an optimal technical solution of the secondary positioning process of the gong groove of a printed circuit board of the present invention, in step 4, the depth of the explosion-proof hole is 1/2 of the depth of the gong groove, and the inner diameter of the explosion-proof hole is 0.05mm.

As a preferred technical solution for the secondary positioning process of the gong groove of a printed circuit board of the present invention, in step 5, the rotational speed of the gong head of the first gong groove is 150krpm, the feed speed is 50mm/s, and the advancing speed is 0.05mm/s. s, control the boundary size at 0.05mm. In step 6, the rotation speed of the gong head of the second gong groove is 300krpm, the feed speed is 50mm/s, the travel speed is 0.005mm/s, and the boundary size is controlled at 0.005mm.

As an optimal technical solution for the secondary positioning process of the gong groove of a printed circuit board of the present invention, in step 6, use the first precision gong knife to perform the first time clockwise on the gong groove along the forming line of the gong groove. Finishing, in which the fine gong knife cuts outwards from the hole wall of the gong groove in an oblique manner, and uses the second fine gong knife along the forming line of the gong groove to carry out the second finishing of the gong groove in a counterclockwise direction , in which the fine gong knife cuts outwards from the wall of the gong slot at an oblique angle.

As a preferred technical scheme of the secondary positioning processing technology of a printed circuit board gong groove of the present invention, the first finishing gong knife is a five-edged rotary knife with a blade diameter of 0.8mm, and the first finishing gong knife is clockwise at an oblique The corner is cut outward from the hole wall of the gong groove.

As a preferred technical scheme of the secondary positioning processing technology of a printed circuit board gong groove of the present invention, the second finishing gong knife is a five-edged rotary knife with a blade diameter of 0.5 mm, and the second finishing gong knife is inclined counterclockwise. The corner is cut outward from the hole wall of the gong groove.

As an optimal technical solution for the secondary positioning process of the printed circuit board gong groove of the present invention, the explosion-proof hole is a round hole; the farthest distance between the two explosion-proof holes at both ends of the gong groove is equal to the length of the gong groove.

Compared with the prior art, the beneficial effect of the present invention is: the present invention adopts the secondary positioning method to process the gong groove, gradually reduces the resistance faced by the gong knife during the process, and adopts the center positioning to avoid the gong knife from being moved in the process of advancing. The occurrence of center offset can effectively solve the irregular size and shape of side-by-side gong grooves. At the same time, the center position and precision are relatively high. The same substrate can be processed at one time, which is suitable for mass production. At the same time, the gong groove adopts secondary precision Gong, which is beneficial to provide precision of gong groove.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Example

The present invention provides a technical solution: a secondary positioning process for printed circuit board gong grooves, including the following steps:

Step 1, the selection of the printed circuit board, the edge of the printed circuit board is required to be smooth and flat, without flashing burrs;

Step 2, setting up positioning pins on the edge of the printed circuit board, and installing the printed circuit board in the gong board machine;

Step 3: mark the center of the gong groove by laser;

Step four, drill an explosion-proof hole at both ends of the gong groove;

Step 5: Make the first groove on the printed circuit board through the punching machine to form the prototype of the groove. The length, width, and height of the primary groove are 0.1mm smaller than the length, width, and height of the predetermined groove. Specifically: use a pre-grooving knife From the explosion-proof hole at one end of the gong groove, cutting along the length of the gong groove to the centerline toward the explosion-proof hole at the other end of the gong groove to form the prototype of the gong groove;

Step 6: Carry out the second groove on the printed circuit board through the board machine. The second groove adopts the fine groove method, and the reserved 0.1mm is grooved. The explosion-proof hole at one end of the slot is cut along the length of the gong slot to the centerline toward the explosion-proof hole at the other end of the gong slot;

Step 7: Verify the gong groove, check whether the gong board has multiple gongs, missing gongs, scratches on the board surface, and copper leakage, etc. If the above situations occur, the technical staff will re-correct the parameters before re-routing;

Step 8, depositing a copper layer on the hole wall surface of the gong groove, making the outer circuit and the outer circuit ring on the surface of the printed circuit board, the outer circuit ring is arc-shaped and surrounds the outside of the gong groove forming area; wherein, A distance of 0.05 mm to 0.1 mm exists between the end of the outer circuit ring and the edge of the gong groove forming area by copper cutting.

Specifically, in step 3, the length and width data of the printed circuit board need to be input in the laser marking machine, and the data of the groove of the circuit board is input, and the center point of the groove produced by the laser marking machine is marked on the edge of the printed circuit.

Specifically, in step 4, the depth of the explosion-proof hole is half of the depth of the gong groove, and the inner diameter of the explosion-proof hole is 0.05 mm.

Specifically, in step five, the rotational speed of the gong head of the first gong groove is 150krpm, the feed speed is 50mm/s, the travel speed is 0.05mm/s, and the boundary size is controlled at 0.05mm. In step six, the second time The rotation speed of the gong head of the gong groove is 300krpm, the feed speed is 50mm/s, the travel speed is 0.005mm/s, and the boundary size is controlled at 0.005mm.

Specifically, in step six, use the first precision gong knife to carry out the first refinement on the gong groove in a clockwise direction along the forming line of the gong groove, wherein the fine gong gong knife is adjusted by the angle of the gong groove Cut the hole wall outwards, and use the second precision gong knife to carry out the second fine finishing on the gong groove along the forming line of the gong groove in the counterclockwise direction, in which the fine gong gong knife goes out from the hole wall of the gong groove at an oblique angle cutting.

Specifically, the first finishing gong knife is a five-edged rotary knife with a blade diameter of 0.8 mm, and the first finishing gong knife cuts outwards from the hole wall of the gong groove in a clockwise direction at an oblique angle.

Specifically, the second finishing gong knife is a five-edged rotary knife with a blade diameter of 0.5 mm, and the second finishing gong knife cuts outwards from the hole wall of the gong groove in a counterclockwise direction at an oblique angle.

Specifically, the explosion-proof hole is a round hole; the farthest distance between the two explosion-proof holes at both ends of the gong slot is equal to the length of the gong slot.

Finally, it should be noted that: the above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still The technical solutions recorded in the foregoing embodiments may be modified, or some technical features thereof may be equivalently replaced. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (8)

1. A secondary positioning processing technology for a routing groove of a printed circuit board is characterized in that: the method comprises the following steps:

step one, selecting a printed circuit board, wherein the edge of the printed circuit board is required to be smooth and flat, and no flash or burr exists;

step two, positioning pins are arranged on the edge of the printed circuit board, and the printed circuit board is installed in the gong machine;

marking the center of the gong groove by laser;

step four, drilling explosion-proof holes at two ends of the gong groove respectively;

step five, carrying out first time slot milling on the printed circuit board through a board milling machine to form a slot milling embryonic form, wherein the length, width and height of the slot milling is preset to be 0.1mm, and the slot milling embryonic form is specifically as follows: cutting from the explosion-proof hole at one end of the milling groove position by using a pre-milling cutter along the length of the milling groove position to the direction of the explosion-proof hole at the other end of the milling groove position along the central line to form a milling groove embryonic form;

step six, carry out the secondary gong groove to the printed circuit board through the gong trigger, the secondary gong groove adopts the mode of smart gong, carries out gong groove to reserved 0.1mm, specifically does: cutting from the explosion-proof hole at one end of the milling groove position by using a fine milling cutter along the length of the milling groove position to the direction of the explosion-proof hole at the other end of the milling groove position along the central line;

step seven, checking the gong grooves, checking whether the gong plates are more, the gong is leaked, the surface of the board is scratched, copper is leaked and the like, and if the conditions exist, carrying out gong again after the parameters are revised by technicians;

step eight, depositing a copper layer on the surface of the hole wall of the gong groove, and manufacturing an outer layer circuit and an outer layer circuit hole ring on the surface of the printed circuit board, wherein the outer layer circuit hole ring is arc-shaped and surrounds the exterior of the gong groove forming area; wherein, the interval between the end of the outer layer circuit hole ring and the edge of the gong groove forming area is 0.05 mm-0.1 mm by copper cutting.

2. The secondary positioning processing technology for routing a printed circuit board according to claim 1, wherein: and thirdly, inputting length and width data of the printed circuit board in a laser marking machine, inputting data of a routing slot of the circuit board, and carrying out center marking on the roadside of the printed circuit by using a center point of the routing slot produced by the laser marking machine.

3. The secondary positioning processing technology for routing a printed circuit board according to claim 1, wherein: in the fourth step, the depth of the explosion-proof hole is one half of the depth of the gong groove, and the inner diameter of the explosion-proof hole is 0.05mm.

4. The secondary positioning processing technology for routing a printed circuit board according to claim 1, wherein: in the fifth step, the rotation speed of the milling head of the first milling groove is 150krpm, the feeding speed is 50mm/s, the advancing speed is 0.05mm/s, the size of the boundary is controlled to be 0.05mm, in the sixth step, the rotation speed of the milling head of the second milling groove is 300krpm, the feeding speed is 50mm/s, the advancing speed is 0.005mm/s, and the size of the boundary is controlled to be 0.005mm.

5. The secondary positioning processing technology for routing a printed circuit board according to claim 1, wherein: in the sixth step, a first finishing operation is performed on the gong groove along the forming line of the gong groove by using a first finishing operation, wherein the finishing operation is performed from the hole wall of the gong groove to the outer cutting operation in a bevel manner by using a second finishing operation along the forming line of the gong groove by using a second finishing operation, and the gong groove is subjected to a second finishing operation in a anticlockwise direction by using the finishing operation in a bevel manner from the gong groove hole wall to the outer cutting operation.

6. The secondary positioning processing technology for routing a printed circuit board according to claim 5, wherein: the first finishing gong is a five-edge rotary knife with the edge diameter of 0.8mm, and the first finishing gong is externally tangent from the hole wall of the gong groove in a clockwise oblique angle mode.

7. The secondary positioning processing technology for routing a printed circuit board according to claim 1, wherein: the second finishing gong is a five-edge rotary knife with the edge diameter of 0.5mm, and the second finishing gong is externally tangent from the hole wall of the gong groove in a bevel manner in a anticlockwise direction.

8. The secondary positioning processing technology for routing a printed circuit board according to claim 1, wherein: the explosion-proof hole is a round hole; the farthest distance between the two explosion-proof holes arranged at the two ends of the gong groove is equal to the length of the gong groove.