CN116052966A - A surface mount overcurrent protection component - Google Patents
A surface mount overcurrent protection component Download PDFInfo
- Publication number
- CN116052966A CN116052966A CN202211720643.4A CN202211720643A CN116052966A CN 116052966 A CN116052966 A CN 116052966A CN 202211720643 A CN202211720643 A CN 202211720643A CN 116052966 A CN116052966 A CN 116052966A
- Authority
- CN
- China
- Prior art keywords
- conductive
- overcurrent protection
- electrode
- protection element
- end electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229920003023 plastic Polymers 0.000 claims abstract description 21
- 239000004033 plastic Substances 0.000 claims abstract description 21
- 239000011162 core material Substances 0.000 claims abstract description 19
- 230000007613 environmental effect Effects 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 229920000642 polymer Polymers 0.000 claims description 27
- 239000011888 foil Substances 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 14
- 238000003466 welding Methods 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 229920001903 high density polyethylene Polymers 0.000 claims description 5
- 239000004700 high-density polyethylene Substances 0.000 claims description 5
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 2
- 239000005022 packaging material Substances 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 5
- 238000009413 insulation Methods 0.000 claims 3
- 238000002955 isolation Methods 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 229920002521 macromolecule Polymers 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000002277 temperature effect Effects 0.000 abstract description 9
- 239000002356 single layer Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 38
- -1 polyethylene Polymers 0.000 description 8
- 239000002861 polymer material Substances 0.000 description 7
- 239000011135 tin Substances 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 238000003490 calendering Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 101000669528 Homo sapiens Tachykinin-4 Proteins 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- AZUZXOSWBOBCJY-UHFFFAOYSA-N Polyethylene, oxidized Chemical class OC(=O)CCC(=O)C(C)C(O)CCCCC=O AZUZXOSWBOBCJY-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OKUGPJPKMAEJOE-UHFFFAOYSA-N S-propyl dipropylcarbamothioate Chemical compound CCCSC(=O)N(CCC)CCC OKUGPJPKMAEJOE-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 102100039365 Tachykinin-4 Human genes 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229920001912 maleic anhydride grafted polyethylene Polymers 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
本发明公开一种表面贴装过流保护元件,其至少一个电阻正温度效应导电复合材料芯材,且电阻正温度效应导电复合材料芯材两面需覆有金属电极;至少有一面有导电端子,与电阻正温度效应导电符合材料芯材金属电极形成电气导通;所述导电复合材料芯材四个侧面或者四个侧面和一个正面均被塑封包覆,与外界环境隔绝。本发明公开的表面贴装过流保护元件便于实现批量生产,且满足单层电阻正温度效应导电复合材料芯材和多层电阻正温度效应导电复合材料芯材并联结构的正常生产,同时元件具有极高的环境性能和结构的稳定性能。
The invention discloses a surface-mounted overcurrent protection element, which has at least one positive resistance temperature effect conductive composite material core material, and the two sides of the resistance positive temperature effect conductive composite material core material need to be covered with metal electrodes; at least one side has a conductive terminal, It is electrically connected with the metal electrode of the positive temperature effect conductive composite material core material of resistance; the four sides or four sides and one front side of the conductive composite material core material are covered by plastic packaging, and are isolated from the external environment. The surface-mounted overcurrent protection element disclosed by the invention is convenient for mass production, and satisfies the normal production of a single-layer resistance positive temperature effect conductive composite material core material and a multilayer resistance positive temperature effect conductive composite material core material in parallel structure, and at the same time, the element has High environmental performance and structural stability.
Description
技术领域technical field
本发明涉及一种用于电子线路中,作为过流过温的器件,具体说就是一种可表面贴装的过流保护元件。The invention relates to an over-current and over-temperature device used in electronic circuits, specifically a surface mountable over-current protection element.
背景技术Background technique
具有电阻电阻正温度效应的导电复合材料制备的表面贴装型元件(SMD)广泛的应用于电子线路中,在电子线路中起着过流过温保护的作用。SMD PTC元件因其小尺寸、易加工等优点已广泛应用。但随着电子设备的智能化,多功能化,功率化的需求发展,更小尺寸、更大通流能力、更优秀的环境性能,是现阶段SMD产品的一项技术难题。Surface mount components (SMD) made of conductive composite materials with positive temperature effect of resistance and resistance are widely used in electronic circuits, and play the role of over-current and over-temperature protection in electronic circuits. SMD PTC components have been widely used because of their small size and easy processing. However, with the development of intelligent, multi-functional, and power-oriented electronic equipment, smaller size, greater flow capacity, and better environmental performance are technical problems for SMD products at this stage.
现有SMD PTC元件主要通过PCB加工完成,大尺寸规格(0603封装及以上)采用PCB中传统的钻孔、蚀刻等工艺制备的SMD PTC元件在回流焊后仍有足够结构强度和可靠的电芯。但该规格的SMD PPTC由于产品四个侧面裸露在空气中,产品的环境可靠性是一项需要解决的难题。Existing SMD PTC components are mainly completed by PCB processing, large-size specifications (0603 package and above) SMD PTC components prepared by traditional drilling, etching and other processes in PCB still have sufficient structural strength and reliable batteries after reflow soldering . However, because the four sides of the SMD PPTC of this specification are exposed to the air, the environmental reliability of the product is a problem that needs to be solved.
发明内容Contents of the invention
本发明所要解决的技术问题在于提供一种表面贴装过流过温保护元件,该表面贴装元件可实现不同的尺寸封装,产品结构更加稳定,环境性能更加可靠的特性。The technical problem to be solved by the present invention is to provide a surface mount over-current and over-temperature protection component, which can be packaged in different sizes, has more stable product structure and more reliable environmental performance.
本发明所述一种表面贴装过流保护元件,包含至少一个芯材,两个端电极、两个导电端子和塑封层。其中芯材具有电阻正温度系数特性:1.保护元件侧面和一个正面具有塑封层,也可以将保护元件的六个面全部塑封,仅留出两个导电电极,使元件高分子材料基材与空气环境隔离,从而使元件具备较高的环境可靠性;2.起电气连接作用的导电构件位于具有电阻正温度系数特性芯材的两侧,充分保证了元件具有良好的焊接可操作性,又使元件具备良好的环境性能;3.本发明可正常生产单层PTC芯片产品、双层PTC芯片和多层PTC芯片产品,此种方案产品具有单焊接面结构,塑封至少包裹所述导电复合材料芯材的四个侧面和一个正面或者导电复合材料芯材的六个面,仅露出导电端子作为焊盘使用。The surface mounting overcurrent protection component of the present invention comprises at least one core material, two terminal electrodes, two conductive terminals and a plastic sealing layer. Among them, the core material has the characteristics of positive temperature coefficient of resistance: 1. The side and one front side of the protective element have a plastic sealing layer, and all six sides of the protective element can be plastic-sealed, leaving only two conductive electrodes, so that the polymer material substrate of the element is in contact with the The air environment is isolated, so that the components have high environmental reliability; 2. The conductive components for electrical connection are located on both sides of the core material with positive temperature coefficient of resistance characteristics, which fully ensures that the components have good welding operability, and Make the components have good environmental performance; 3. The present invention can normally produce single-layer PTC chip products, double-layer PTC chip products and multi-layer PTC chip products. The product of this scheme has a single welding surface structure, and the plastic packaging at least wraps the conductive composite material The four sides and one front side of the core material or the six sides of the core material of the conductive composite material only expose the conductive terminals to be used as pads.
在上述方案的基础上,所述的塑封材料为热固成型的液态环氧树脂、酚醛树脂、聚酰亚胺、或无机填料改性环氧树脂、玻璃纤维或有环氧树脂与其他填料的混合物。On the basis of the above scheme, the plastic sealing material is thermosetting liquid epoxy resin, phenolic resin, polyimide, or inorganic filler modified epoxy resin, glass fiber or epoxy resin and other fillers. mixture.
在上述方案的基础上,所述塑封包裹导电复合材料芯材的至少四个侧面,采用塑封成型、压塑成型、模压成型、注塑成型、转注成型、热固成型中的一种。On the basis of the above solution, at least four sides of the conductive composite core material are plastic-wrapped by one of plastic sealing molding, compression molding, compression molding, injection molding, transfer molding, and thermosetting molding.
在上述方案的基础上,所述导电端子可以是一金属导电结构组件,或是由金属电极箔、金属镀层、合金或是镀层金属组成。On the basis of the above solution, the conductive terminal may be a metal conductive structural component, or be composed of metal electrode foil, metal plating, alloy or plating metal.
在上述方案的基础上,所述表面贴装过流保护元件的包裹的塑封材料为非导电材料,且具有阻隔空气及水汽的性能。On the basis of the above solution, the plastic packaging material of the surface mount overcurrent protection component is a non-conductive material, and has the performance of blocking air and water vapor.
在上述方案的基础上,所述表面贴装过流保护元件为单面焊盘设计或者双面焊盘设计。On the basis of the above solution, the surface mount overcurrent protection component is designed with single-sided pads or double-sided pads.
在上述方案的基础之上,所述的具有电阻正温度系数特性的芯材,其中高分子材料选自聚乙烯、氯化聚乙烯、氧化聚乙烯、聚氯乙烯、丁二烯-丙烯腈共聚物、丙烯腈-丁二烯-苯乙烯共聚物、聚苯乙烯、聚碳酸酯、聚酰胺、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚苯醚、聚苯硫醚、聚甲醛、酚醛树脂、聚四氟乙烯、四氟乙烯-六氟丙烯共聚物、聚三氟乙烯、聚氟乙烯、马来酸酐接枝聚乙烯、聚丙烯、聚偏氟乙烯、环氧树脂、乙烯-醋酸乙烯共聚物、聚甲基丙烯酸甲酯、乙烯-丙烯酸共聚物中的一种及其混合物。On the basis of the above scheme, the core material with positive temperature coefficient of resistance, wherein the polymer material is selected from polyethylene, chlorinated polyethylene, oxidized polyethylene, polyvinyl chloride, butadiene-acrylonitrile copolymer Acrylonitrile-butadiene-styrene copolymer, polystyrene, polycarbonate, polyamide, polyethylene terephthalate, polybutylene terephthalate, polyphenylene ether, poly Phenyl sulfide, polyoxymethylene, phenolic resin, polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, polytrifluoroethylene, polyvinyl fluoride, maleic anhydride grafted polyethylene, polypropylene, polyvinylidene fluoride, One of epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-acrylic acid copolymer and a mixture thereof.
在上述方案的基础之上,所述的具有电阻正温度系数特性的芯材,其中导电材料选自碳黑、石墨、碳纤维、碳纳米管、金属粉末、导电陶瓷粉末中的一种及其混合物。所述金属粉末选自:铜、镍、钴、铁、钨、锡、铅、银、金、铂或其合金中的一种及其混合物。所述的导电陶瓷粉末选自:金属氮化物、金属碳化物、金属硼化物、金属硅化物之中的一种或几种的混合物。On the basis of the above scheme, the core material with positive temperature coefficient of resistance, wherein the conductive material is selected from one of carbon black, graphite, carbon fiber, carbon nanotube, metal powder, conductive ceramic powder and a mixture thereof . The metal powder is selected from one of copper, nickel, cobalt, iron, tungsten, tin, lead, silver, gold, platinum or alloys thereof and a mixture thereof. The conductive ceramic powder is selected from one or a mixture of metal nitrides, metal carbides, metal borides and metal silicides.
本发明的电阻正温度效应复合材料以及由该导电复合材料制备的电阻正温度效应芯材可按下述方法进行制备:The resistance positive temperature effect composite material of the present invention and the resistance positive temperature effect core material prepared by the conductive composite material can be prepared according to the following method:
将高分子材料、导电填料、其他助剂或辅助填料加入到混合设备,在高于高分子材料熔融温度以上的温度下进行捏合。混合设备可以是密炼机、开炼机、单螺杆挤出机或双螺杆挤出机。然后将熔融混合好的聚合物加工成为片材,也可以通过挤出成型、模压成型或开练机薄通拉片来实现。一般来说,聚合物片材的厚度为0.10~0.55mm,优选为0.15~0.45mm,为了加工的方便更优为0.20~0.40mm。Add polymer materials, conductive fillers, other additives or auxiliary fillers to the mixing equipment, and knead at a temperature higher than the melting temperature of the polymer materials. The mixing equipment can be internal mixer, open mill, single screw extruder or twin screw extruder. The melt-mixed polymer is then processed into a sheet, which can also be achieved by extrusion, compression molding, or milling. Generally, the thickness of the polymer sheet is 0.10-0.55 mm, preferably 0.15-0.45 mm, more preferably 0.20-0.40 mm for the convenience of processing.
所述芯材通常可借助交联或热处理的方法来提高PTC芯片性能的稳定性。The core material can generally improve the performance stability of the PTC chip by means of cross-linking or heat treatment.
交联可以是化学交联或辐照交联,例如可利用交联促进剂、电子束辐照或Co60辐照来实现。PTC元件所需的辐照剂量一般小于100Mrad,优选为1~50Mrad,更优为1~20Mrad。The cross-linking can be chemical cross-linking or radiation cross-linking, for example, it can be realized by using a cross-linking accelerator, electron beam irradiation or Co 60 irradiation. The radiation dose required by the PTC element is generally less than 100 Mrad, preferably 1-50 Mrad, more preferably 1-20 Mrad.
热处理可以是退火、热循环、高低温交变,例如80℃/-40℃高低温交变。所述退火的温度环境可以是PTC材料层基材分解温度以下的任何温度,例如高于导电复合材料基材熔融温度的高温退火和低于导电复合材料基材熔融温度的低温退火;The heat treatment can be annealing, thermal cycle, high and low temperature alternating, for example, 80°C/-40°C high and low temperature alternating. The temperature environment of the annealing can be any temperature below the decomposition temperature of the PTC material layer base material, such as high temperature annealing higher than the melting temperature of the conductive composite material base material and low temperature annealing lower than the melting temperature of the conductive composite material base material;
由上述生产的电阻正温度系数效应的复合材料片材和紧密贴覆于上述高分子材料基层两面的第一导电电极和第二导电电极形成复合片材,对复合片材通过内层图形转移蚀刻技术使复合片材的导电电极蚀刻出绝缘槽,然后,将两绝缘层叠放于完成蚀刻的复合片材两表面,并分别覆盖金属箔,进行高温压合,之后将压合后的基板经过后续的外层金属箔镀锡、蚀刻外层图形、印刷阻焊油墨、固化阻焊油墨、钻孔、沉铜、镀铜工艺等步骤工艺,得到具有两个端电极的高分子PTC过流保护元件。后续通过焊接工艺,将带有两个端电极的高分子过流保护元件通过焊接工艺焊接在导电端子上,在通过注塑工艺将产品的四个侧面和一个上表面进行塑封,得到一个具有优异环境稳定性的高分子过流保护元件。The composite material sheet produced by the above-mentioned positive temperature coefficient of resistance and the first conductive electrode and the second conductive electrode closely attached to the two sides of the above-mentioned polymer material base layer form a composite sheet, and the composite sheet is transferred and etched through the inner layer pattern The technology enables the conductive electrodes of the composite sheet to etch out insulating grooves, and then, two insulating layers are stacked on both surfaces of the etched composite sheet, and covered with metal foil respectively, and then pressed at high temperature, and then the pressed substrate is subjected to subsequent Tinning the outer layer metal foil, etching the outer layer pattern, printing solder resist ink, curing solder resist ink, drilling, sinking copper, copper plating process and other steps to obtain a polymer PTC overcurrent protection component with two terminal electrodes . Subsequent welding process, the polymer overcurrent protection element with two terminal electrodes is welded on the conductive terminal by welding process, and the four sides and one upper surface of the product are plastic-sealed by injection molding process to obtain an excellent environment. Stable polymer overcurrent protection element.
附图说明Description of drawings
图1为一表面贴装过流过温保护元件的结构示意图;Figure 1 is a schematic structural view of a surface mount overcurrent and overtemperature protection component;
图2 为实施例一的表面贴装过流过温保护元件的结构示意图;Fig. 2 is the structural representation of the surface mount overcurrent and overtemperature protection element of embodiment one;
图3 为实施例二的表面贴装过流过温保护元件的结构示意图;Fig. 3 is the structural representation of the surface mount overcurrent and overtemperature protection element of embodiment two;
图4 为实施例三的表面贴装过流过温保护元件的结构示意图;Fig. 4 is the structural representation of the surface mount overcurrent and overtemperature protection element of embodiment three;
图5 为实施例四的表面贴装过流过温保护元件的结构示意图。Fig. 5 is a schematic structural view of the surface mount overcurrent and overtemperature protection element of the fourth embodiment.
具体实施方式Detailed ways
以下通过具体的实施例对本发明作进一步的详细说明。The present invention will be described in further detail below through specific examples.
PTC芯材的制备过程如下:The preparation process of PTC core material is as follows:
按电阻正温度效应复合材料层所使用的高分子材料及导电填料按表一所示进行配比,然后,将混合物组分在180℃温度下于双螺杆造粒机造粒,经冷却,粉碎后经单螺杆挤出机挤出,后在压延机的压延后上下两层附上电极铜箔,得到厚度为0.20~0.40mm的导电复合材料,也即所述的芯材;According to the ratio of polymer materials and conductive fillers used in the composite material layer according to the resistance positive temperature effect as shown in Table 1, the mixture components are granulated in a twin-screw granulator at a temperature of 180 ° C, cooled, and pulverized Extrude through a single-screw extruder, and then attach electrode copper foil to the upper and lower layers after calendering to obtain a conductive composite material with a thickness of 0.20-0.40 mm, that is, the core material;
根据实际工艺需求,将制成两面覆有金属铜箔的PTC的板材经过16Mrad辐照,并经过120℃、30min热处理后进行PCB加工;According to the actual process requirements, the PTC board made of metal copper foil on both sides is irradiated at 16Mrad, and processed after 120°C and 30min heat treatment;
通过PCB加工工艺,制成表面贴装型高分子PTC过电流保护元件,后经过划切,焊接导电端子,塑封工序,制造过程中,对该过电流保护元件的四个侧面、五个面或者六个面增加塑封层,使元件高分子材料基层与空气环境隔离,从而提高了产品的环境可靠性能。Through the PCB processing technology, the surface mount type polymer PTC overcurrent protection component is made, and then it is cut, welded with conductive terminals, and plastic sealing process. During the manufacturing process, the four sides, five sides or The plastic sealing layer is added on the six sides to isolate the base layer of the polymer material of the component from the air environment, thereby improving the environmental reliability of the product.
实施例一Embodiment one
一种有一个焊接面、环境可靠性高的表面贴装过流过温保护元件,如图2所示,按下述步骤制备:A surface mount overcurrent and overtemperature protection component with a soldering surface and high environmental reliability, as shown in Figure 2, is prepared according to the following steps:
将高密度聚乙烯、金属碳化钨按一定比例在高速混合器中混合30min后,将混合物组分在180℃温度下于双螺杆造粒机造粒,经冷却,粉碎后经单螺杆挤出机挤出,后在压延机的压延后上下两层附上电极箔4、6,压制成面积400平方厘米,厚0.3mm高分子复合材料基层5,即得到两面复合电极箔的高分子PTC复合片材;在真空烘箱中120℃热处理0.5小时后,用γ射线(Co60)辐照,剂量为16Mrad,之后通过PCB加工技术,将复合片材通过PCB蚀刻技术使第一导电电极4和第二导电电极6分别蚀刻出绝缘槽,然后将一绝缘层3叠加于第一导电电极4和一金属箔之间,同时,将另一绝缘层3(a)叠加于第二导电电极6和另一金属箔之间,然后进行高温压合,压合后的基板通过端电极镀锡、外层图形蚀刻,印刷阻焊油墨等步骤,形成第一端电极1和第二端电极2;然后经过后续的钻孔、沉铜、镀锡,形成两个导电构件,分别为第一导电构件7和第二导电构件8;后续将PCB加工后的产品经过回流焊焊接两个导电端子9,10,之后通过塑封工艺,将上述的过流保护元件四个侧面及上表面进行塑封11,从而制备出具有一个焊接面、环境可靠性高的高分子PTC过电流保护元件。After mixing high-density polyethylene and metal tungsten carbide in a high-speed mixer in a certain proportion for 30 minutes, the mixture components are granulated in a twin-screw granulator at a temperature of 180 ° C, cooled, crushed, and passed through a single-screw extruder Extrude, and then attach
实施例二Embodiment two
一种具有一个焊接面、环境可靠性高的高分子PTC过电流保护元件,如图3所示,按下述步骤制备:A polymer PTC overcurrent protection element with a welding surface and high environmental reliability, as shown in Figure 3, is prepared according to the following steps:
将高密度聚乙烯、金属碳化钨按一定比例在高速混合器中混合30min后,将混合物组分在180℃温度下于双螺杆造粒机造粒,经冷却,粉碎后经单螺杆挤出机挤出,后在压延机的压延后上下两层附上电极箔,压制成面积400平方厘米,厚0.3mm高分子复合材料基层5;即得到附有双面电极箔4、6的高分子PTC复合片材,在真空烘箱中120℃热处理0.5小时后,用γ射线(Co60)辐照,剂量为16Mrad;之后通过PCB加工技术,将复合片材通过PCB蚀刻技术使第一导电电极4和第二导电电极6分别蚀刻出绝缘槽,然后将一绝缘层3叠加于第一导电电极6和一金属箔之间,同时将另一绝缘层3(a)叠加于第二导电电极6和另一金属箔之间,然后进行高温压合,压合后的基板通过端电极镀锡、外层图形蚀刻,印刷阻焊油墨等步骤,形成第一端电极1和第二端电极2;然后经过后续的钻孔、沉铜、镀锡,形成两个导电构件,分别为第一导电构件7和第二导电构件8;后续将PCB加工后的产品经过回流焊焊接两个导电端子9、10,之后通过塑封工艺,将上述的过流保护元件四个侧面进行塑封11,从而制备出具有一个焊接面、环境可靠性高的高分子PTC过电流保护元件。After mixing high-density polyethylene and metal tungsten carbide in a high-speed mixer in a certain proportion for 30 minutes, the mixture components are granulated in a twin-screw granulator at a temperature of 180 ° C, cooled, crushed, and passed through a single-screw extruder After extruding, after calendering, the upper and lower layers of the electrode foil are attached, and pressed to form an area of 400 square centimeters and a thickness of 0.3mm. The polymer composite
实施例三Embodiment three
一种具有一个焊接面、环境可靠性高的高分子PTC过电流保护元件,如图4所示,按下述步骤制备:A polymer PTC overcurrent protection element with a welding surface and high environmental reliability, as shown in Figure 4, is prepared according to the following steps:
将高密度聚乙烯、金属碳化钨按一定比例在高速混合器中混合30min后,将混合物组分在180℃温度下于双螺杆造粒机造粒,经冷却,粉碎后经单螺杆挤出机挤出,后在压延机的压延后上下两层附上电极箔,压制成面积400平方厘米,厚0.3mm高分子复合材料基层5,5a;即得到高分子PTC复合片材(4、5、6和4a、5a、6a),在真空烘箱中120℃热处理0.5小时后,用γ射线(Co60)辐照,剂量为16Mrad,之后通过PCB加工技术,将复合片材通过PCB蚀刻技术使第一导电电极4、4a和第二导电电极6、6a分别蚀刻出绝缘槽,然后将一绝缘层3叠加于第一导电电极4和一金属箔之间,同时将另一绝缘层3(a)叠加于第二导电电极6(a)和另一金属箔之间,将另一层绝缘层叠加于二层高分子PTC复合片材之间,然后进行高温压合,压合后的基板通过端电极镀锡、外层图形蚀刻,印刷阻焊油墨等步骤,形成第一端电极1和第二端电极2;然后经过后续的钻孔、沉铜、镀锡,形成两个导电构件,分别为第一导电构件7和第二导电构件8的过流保护元件,使二层;后续将PCB加工后的过流保护元件经过回流焊焊接两个导电端子9、10,之后通过塑封工艺,将上述的过流保护元件四个侧面及上表面进行塑封,从而制备出具有一个焊接面、环境可靠性高的高分子PTC过电流保护元件。(参考图4)。After mixing high-density polyethylene and metal tungsten carbide in a high-speed mixer in a certain proportion for 30 minutes, the mixture components are granulated in a twin-screw granulator at a temperature of 180 ° C, cooled, crushed, and passed through a single-screw extruder After extruding, the upper and lower layers of the electrode foil are attached to the upper and lower layers of the calender after calendering, and pressed into an area of 400 square centimeters and a thickness of 0.3mm. 6 and 4a, 5a, 6a), after heat treatment in a vacuum oven at 120°C for 0.5 hours, irradiated with γ-rays (Co60) at a dose of 16Mrad, and then through PCB processing technology, the composite sheet was made by PCB etching technology to make the first The conductive electrodes 4, 4a and the second conductive electrodes 6, 6a are respectively etched with insulating grooves, and then an insulating layer 3 is stacked between the first conductive electrode 4 and a metal foil, and another insulating layer 3 (a) is stacked at the same time Between the second conductive electrode 6 (a) and another metal foil, another layer of insulating layer is superimposed between two layers of polymer PTC composite sheets, and then high-temperature pressing is carried out, and the pressed substrate passes through the terminal electrode Tin plating, outer layer pattern etching, printing solder resist ink and other steps to form the first terminal electrode 1 and the second terminal electrode 2; and then through subsequent drilling, copper sinking, and tin plating to form two conductive components, respectively The overcurrent protection element of the first conductive member 7 and the second conductive member 8 has two layers; the overcurrent protection element after PCB processing is subsequently soldered to the two conductive terminals 9, 10 by reflow soldering, and then the above-mentioned The four sides and the upper surface of the overcurrent protection component are plastic-sealed, so that a polymer PTC overcurrent protection component with one welding surface and high environmental reliability is prepared. (Refer to Figure 4).
实施例四Embodiment four
一种具有一个焊接面、环境可靠性高的高分子PTC过电流保护元件,如图5所示,按下述步骤制备:A polymer PTC overcurrent protection element with a welding surface and high environmental reliability, as shown in Figure 5, is prepared according to the following steps:
将高密度聚乙烯、金属碳化钨按一定比例在高速混合器中混合30min。然后将混合物组分在180℃温度下于双螺杆造粒机造粒,经冷却,粉碎后经单螺杆挤出机挤出,后在压延机的压延后上下两层附上电极箔,压制成面积400平方厘米,厚0.3mm高分子复合材料基层(标号5,5a)。即得到高分子PTC复合片材(标号4、5、6和4a、5a、6a组合),在真空烘箱中120℃热处理0.5小时后,用γ射线(Co60)辐照,剂量为16Mrad。之后通过PCB加工技术,将复合片材通过PCB蚀刻技术使第一导电电极(标号4,4a)和第二导电电极(标号6,6a)分别蚀刻出绝缘槽,然后将一绝缘层(标号3)叠加于第一导电电极和一金属箔之间,同时将另一绝缘层(标号3(a)叠加于第二导电电极(标号6)和另一金属箔之间,将另一层绝缘层叠加于标号4、5、6组合和4a、5a、6a组合之间,然后进行高温压合,压合后的基板通过端电极镀锡、外层图形蚀刻,印刷阻焊油墨等步骤,形成第一端电极(标号1)和第二端电极(标号2)。然后经过后续的钻孔、沉铜、镀锡,形成两个导电构件,分别为第一导电构件(标号7)和第二导电构件(标号8)的过流保护元件。后续将PCB加工后的过流保护元件经过回流焊焊接两个导电端子(标号9、10),之后通过塑封工艺,将上述的过流保护元件四个侧面进行塑封,从而制备出具有一个焊接面、环境可靠性高的高分子PTC过电流保护元件(图5)。Mix high-density polyethylene and metal tungsten carbide in a high-speed mixer for 30 minutes in a certain proportion. Then the mixture components are granulated in a twin-screw granulator at a temperature of 180°C, cooled, crushed, extruded through a single-screw extruder, and then rolled by a calender with two upper and lower layers of electrode foil attached, and pressed into The area is 400 square centimeters, and the base layer of polymer composite material (
本发明也可由三层及以上复合片材并联,采用同样的导通方式实现,通过焊接导电端子及进行塑封,得到优异环境可靠性的过流保护元件。The present invention can also be realized by parallel connection of three or more layers of composite sheets, using the same conduction mode, and by welding conductive terminals and performing plastic sealing, an overcurrent protection element with excellent environmental reliability can be obtained.
本发明的内容和技术特点已揭示如上,然而前面叙述的发明仅仅简要地或只涉及本发明的特定部分,因而熟悉此领域的技术人员可能基于本发明的教示及揭示而作出种种不背离本发明的替换和修饰。因此,本发明的保护范围应不限于实施例所揭示的内容,而应该包括在不同部分中所体现的所有内容的组合,以及各种不背离本发明的替换和修饰。The content and technical characteristics of the present invention have been disclosed as above, but the inventions described above are only briefly or only relate to specific parts of the present invention, so those skilled in the art may make various modifications based on the teachings and disclosures of the present invention without departing from the present invention. replacement and modification. Therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include combinations of all the contents presented in different parts, as well as various replacements and modifications that do not depart from the present invention.
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211720643.4A CN116052966A (en) | 2022-12-30 | 2022-12-30 | A surface mount overcurrent protection component |
PCT/CN2023/131143 WO2024139788A1 (en) | 2022-12-30 | 2023-11-12 | Surface mounted overcurrent protection element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211720643.4A CN116052966A (en) | 2022-12-30 | 2022-12-30 | A surface mount overcurrent protection component |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116052966A true CN116052966A (en) | 2023-05-02 |
Family
ID=86115872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211720643.4A Pending CN116052966A (en) | 2022-12-30 | 2022-12-30 | A surface mount overcurrent protection component |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN116052966A (en) |
WO (1) | WO2024139788A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024139788A1 (en) * | 2022-12-30 | 2024-07-04 | 上海维安电子股份有限公司 | Surface mounted overcurrent protection element |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101246768A (en) * | 2007-12-13 | 2008-08-20 | 上海长园维安电子线路保护股份有限公司 | Surface labeling type polymer PTC senistor and manufacturing method thereof |
CN101000817B (en) * | 2006-01-10 | 2011-11-23 | 聚鼎科技股份有限公司 | Surface adhesive overcurrent protection element |
CN102473493B (en) * | 2009-07-17 | 2015-04-22 | 泰科电子公司 | Oxygen-barrier packaged surface mount device |
CN103380189B (en) * | 2011-02-23 | 2015-11-25 | 东洋纺株式会社 | The manufacture method of electrical and electronic parts resin composition for sealing, electrical and electronic parts and electrical and electronic parts package |
CN109448943A (en) * | 2018-12-22 | 2019-03-08 | 上海长园维安电子线路保护有限公司 | A kind of high molecular PTC over-current protecting element |
CN111681845A (en) * | 2020-06-08 | 2020-09-18 | 上海维安电子有限公司 | Surface-mounted over-current protection element |
CN113674937A (en) * | 2021-08-20 | 2021-11-19 | 上海维安电子有限公司 | Low-resistance high-reproducibility PTC (Positive temperature coefficient) overcurrent protection element |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116052966A (en) * | 2022-12-30 | 2023-05-02 | 上海维安电子股份有限公司 | A surface mount overcurrent protection component |
-
2022
- 2022-12-30 CN CN202211720643.4A patent/CN116052966A/en active Pending
-
2023
- 2023-11-12 WO PCT/CN2023/131143 patent/WO2024139788A1/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101000817B (en) * | 2006-01-10 | 2011-11-23 | 聚鼎科技股份有限公司 | Surface adhesive overcurrent protection element |
CN101246768A (en) * | 2007-12-13 | 2008-08-20 | 上海长园维安电子线路保护股份有限公司 | Surface labeling type polymer PTC senistor and manufacturing method thereof |
CN102473493B (en) * | 2009-07-17 | 2015-04-22 | 泰科电子公司 | Oxygen-barrier packaged surface mount device |
CN103380189B (en) * | 2011-02-23 | 2015-11-25 | 东洋纺株式会社 | The manufacture method of electrical and electronic parts resin composition for sealing, electrical and electronic parts and electrical and electronic parts package |
CN109448943A (en) * | 2018-12-22 | 2019-03-08 | 上海长园维安电子线路保护有限公司 | A kind of high molecular PTC over-current protecting element |
CN111681845A (en) * | 2020-06-08 | 2020-09-18 | 上海维安电子有限公司 | Surface-mounted over-current protection element |
CN113674937A (en) * | 2021-08-20 | 2021-11-19 | 上海维安电子有限公司 | Low-resistance high-reproducibility PTC (Positive temperature coefficient) overcurrent protection element |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024139788A1 (en) * | 2022-12-30 | 2024-07-04 | 上海维安电子股份有限公司 | Surface mounted overcurrent protection element |
Also Published As
Publication number | Publication date |
---|---|
WO2024139788A1 (en) | 2024-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1246958A (en) | Electrical fuse device | |
CN102522172A (en) | Resistance positive temperature effect conductive composite material and thermistor element | |
CN102522173B (en) | Resistance positive temperature degree effect conducing composite material and over-current protecting element | |
CN110111959A (en) | A kind of PTC over-current protection device effectively improving long-range circumstances stability | |
CN101335125B (en) | Surface mounted over-current over-temperature protection element and manufacturing process | |
CN101299362B (en) | Surface labeling type polymer PTC overflow over-temperature protection element and method for manufacturing the same | |
WO2024139788A1 (en) | Surface mounted overcurrent protection element | |
CN113674937A (en) | Low-resistance high-reproducibility PTC (Positive temperature coefficient) overcurrent protection element | |
WO2011079549A1 (en) | Surface-mount type over-current protection element | |
CN106679844A (en) | Polymer PTC temperature sensor | |
CN109448943A (en) | A kind of high molecular PTC over-current protecting element | |
US8451084B2 (en) | Laminated surface mounting type thermistor and manufacturing method thereof | |
WO2020034979A1 (en) | Polymer-based conductive composite material and overcurrent protection element | |
CN212570572U (en) | PTC over-current protection device capable of effectively improving long-term environmental stability | |
CN101312087A (en) | Surface sticking type excess-current excess-temperature protection element and its manufacture method | |
CN111681845A (en) | Surface-mounted over-current protection element | |
CN210245193U (en) | Thermistor element | |
CN210200440U (en) | PTC over-current protection device capable of effectively improving long-term environmental stability | |
CN116162302B (en) | Polymer-based conductive composite material and overcurrent protection element | |
CN206410798U (en) | High molecular ptc temperature sensor | |
CN115985600A (en) | Small-size surface-mounted circuit protection component and production method thereof | |
CN101477859B (en) | Novel surface mounting type thermistor and manufacturing method thereof | |
TW587408B (en) | A structure and its manufacturing method for polymeric circuit protection device | |
CN116705440A (en) | Novel-structure parallel PTC overcurrent protection element | |
JP3514669B2 (en) | Metal-based printed wiring board, metal-based multilayer printed wiring board, and method of manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |