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CN116031184A - 晶圆存取总成及其晶圆存取装置与晶圆载具 - Google Patents

晶圆存取总成及其晶圆存取装置与晶圆载具 Download PDF

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CN116031184A
CN116031184A CN202111240012.8A CN202111240012A CN116031184A CN 116031184 A CN116031184 A CN 116031184A CN 202111240012 A CN202111240012 A CN 202111240012A CN 116031184 A CN116031184 A CN 116031184A
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wafer
access device
shaft
driving block
wafer access
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潘世峰
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Daliyu Technology Co ltd
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Daliyu Technology Co ltd
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Priority to CN202111240012.8A priority Critical patent/CN116031184A/zh
Priority to JP2022166720A priority patent/JP7479072B2/ja
Priority to TW111139651A priority patent/TWI826056B/zh
Priority to US17/972,946 priority patent/US11817342B2/en
Priority to KR1020220138402A priority patent/KR20230059168A/ko
Publication of CN116031184A publication Critical patent/CN116031184A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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Abstract

本申请提供一种晶圆存取总成及其晶圆存取装置与晶圆载具，其中，该晶圆存取装置包含有底座、轴杆、多个连动板、多个手臂以及伸缩组件，该底座具有长槽，该轴杆可滑动地伸入该长槽中，多个连动板套设于该轴杆，各连动板具有板体以及穿孔，该穿孔穿设于该板体供该轴杆穿过，各手臂由该连动板的板体的一端延伸而出，该伸缩组件包含多个连接侧壁，各连接侧壁分别设于各连动板并使相邻的连动板连接在一起，多个连接侧壁可进行伸缩以改变相邻连动板之间的距离。借此，晶圆载具的体积可缩减一半，且晶圆存取装置可同时真空吸附多个晶圆，达到更高的晶圆存取效率。

Description

晶圆存取总成及其晶圆存取装置与晶圆载具
技术领域
本申请关于一种存取晶圆及运送晶圆的技术，特别是指一种既省时又能减少运送体积的晶圆存取总成及其晶圆存取装置与晶圆载具。
背景技术
晶圆是半导体制程中主要的基材，由于晶圆易碎，且一旦已经完成曝光、显影、蚀刻等制程并等待进行切割的晶圆受到污染，所造成的损失更是令人咋舌，因此在运送晶圆的过程中往往需要使用经过特别设计的密封容器来保护。现有技术通过机械手臂(waferrobot)抓取晶圆使其在运送晶圆盒与晶圆传输系统之间取出或置入，因此，为了配合生产线的机台，现有晶圆盒的固定肋(slit)间距大约为10mm左右，使得25片装的晶圆盒具有一定体积，另一方面，机械手臂来回在运送晶圆盒与晶圆传输系统之间一次仅抓取一片晶圆，效率显然不高，当大量的晶圆需跨厂区运送时，其所占用的仓储体积、运送时间与运送成本相当可观。
发明内容
有鉴于此，本申请目的之一在于提供一种晶圆存取总成及其晶圆存取装置与晶圆载具，其存取晶圆的效率较高，且可大幅缩减晶圆载具在运送晶圆时的所占体积。
为达上述目的，本申请揭露一种晶圆存取装置，其包含有底座、轴杆、多个连动板、多个手臂以及伸缩组件，该底座具有长槽，该轴杆可滑动地伸入该长槽中，多个连动板套设于该轴杆，各连动板具有板体以及穿孔，该穿孔穿设于该板体供该轴杆穿过，各手臂由该连动板的板体的一端延伸而出，该伸缩组件包含多个连接侧壁，各连接侧壁分别设于各连动板并使相邻的连动板连接在一起，该伸缩组件可进行伸缩以改变相邻连动板之间的距离。
为达上述目的，本申请另揭露一种晶圆载具，用以供上述任一种实施方式的晶圆存取装置将晶圆取出或置入，该晶圆载具包含有多个插槽。
为达上述目的，本申请另揭露一种晶圆存取总成，包含有上述任一种实施方式的晶圆存取装置以及上述任一种实施方式的晶圆载具，该晶圆存取装置将晶圆取出或置入该晶圆载具。
如此一来，该晶圆载具放置晶圆的所占体积相较于现有结构可大幅缩减一半，尤其当大量的晶圆需跨厂区运送时，其所占用的仓储体积也仅为现有技术的一半；另一方面，由于该晶圆存取装置具有多个手臂，因此可同时真空吸附多个晶圆进行运送，相较于现有结构的机械手臂一次只能吸取一片晶圆，本申请的晶圆存取装置更能省下不少晶圆的真空吸附与运送时间，达到更高的晶圆存取效率。
附图说明
图1为本申请一较佳实施例的晶圆存取装置的立体图；
图2为本申请一较佳实施例的晶圆存取装置的剖视图；
图3为本申请一较佳实施例的晶圆存取装置的局部立体图；
图4为本申请一较佳实施例的晶圆存取总成的立体图；
图5为现有晶圆载具与本申请一较佳实施例的晶圆存取装置的立体图；
图6至图11为本申请一较佳实施例的晶圆存取装置的动作图。
附图标记说明：
10：晶圆存取装置；
30：底座；32：长槽；321：第一端；323：第二端；
40：轴杆：
50：连动板；52：板体；54：穿孔；
60：手臂；
70：伸缩组件；71：连接侧壁；72：带动块；721：衬套；73：弹力件；74：螺柱；75：滚珠；
80：晶圆存取总成；
90：晶圆载具；97：插槽；
100：晶圆载具；
W：晶圆。
具体实施方式
请参考图1、2，是本申请一较佳实施例所提供的晶圆存取装置10，其具有底座30、轴杆40、多个连动板50、多个手臂60以及伸缩组件70。
该底座30具有长槽32，该长槽32具有第一端321以及第二端323，该底座30具有可平移或旋转的功能，该轴杆40可滑动地伸入该长槽32中。
多个连动板50套设于该轴杆40，各连动板50具有板体52以及穿孔54，该穿孔54穿设于该板体52，各穿孔54供该轴杆40穿过而使各连动板50皆套设于该轴杆40。在本实施例中，多个连动板50的数量为25个，在其他可能的实施例中，多个连动板50的数量可视需求改变。
各手臂60由其中一个连动板50的板体52的一端延伸而出，故可理解的是，多个手臂60的数量应与多个连动板50的数量相同，在本实施例中，多个手臂60的数量亦为25个。各手臂60可用来真空吸附一片晶圆W。
该伸缩组件70包含：多个连接侧壁71，设于多个连动板50并使相邻的连动板50连接在一起；带动块72，可上下移动地设于该轴杆40；弹力件73，设于该轴杆40内且贴抵该带动块72；以及，螺柱74，容设于该轴杆40内；多个连接侧壁71可进行伸缩以改变相邻连动板50之间的距离，当多个连接侧壁71处于伸展状态时，该相邻两个连动板50之间的距离为最大，当多个连接侧壁71处于压缩状态时，该相邻两个连动板50之间的距离为最小。在本实施例中，如图3所示，该连接侧壁71包含有第一侧壁711和第二侧壁712，该第二侧壁712与该第一侧壁711枢接在一起，该第一侧壁711和该第二侧壁712枢设于同一个连动板50的板体52，且各板体52的第二侧壁712同时枢接于相邻板体52上的第一侧壁711，当多个第一侧壁711与多个第二侧壁712由伸展状态调整为压缩状态时，相邻两个连动板50的相邻板体52也随之互相缩短距离。
该带动块72和位于最顶层的连动板50连接且可带动该连动板50朝上位移或朝下位移，该带动块72包含有衬套721，该衬套721伸入该轴杆40内且位于该轴杆40与该螺柱74之间；当该螺柱74旋转可驱使该带动块72朝上或下移动，此外，该伸缩组件70还包含有多个滚珠75，多个滚珠75设于该衬套721与该螺柱74之间，也就是该衬套721的内缘与该螺柱74的外缘皆凹设有内纹供多个滚珠75容设并滚动。通过多个连接侧壁71的伸缩，当该相邻两个板体52之间的距离变大时，可有助于承载对象(如晶圆)的取放方便，当该相邻两个板体52之间的距离变小时，该晶圆存取装置10整体的体积可有效缩减，进而节省作业空间。该伸缩组件70的结构可任意变化，只要可借由伸缩来改变各该板体52之间的距离即可。
该带动块72可令多个连接侧壁71进行伸缩，在本实施例中，该螺柱74可受到驱动而旋转，且该螺柱74可为滚珠螺杆，当该螺柱74旋转时可带动该衬套721上下移动进而使该带动块72跟着上下移动，由于该带动块72和位于最顶层的连动板50连接，因此当螺柱74旋转(顺时针或逆时针之一)使得该带动块72向上移动时，该带动块72可拉动该最顶层的连动板50，进而带动多个连接侧壁71伸展，使得各连动板50之间的距离变大，相反地，当该螺柱74旋转(顺时针或逆时针之另一)使得该带动块72向下移动时，该带动块72可压抵该最顶层的连动板50，进而促使多个连接侧壁71闭合，使得各连动板50之间的距离变小；由于该带动块72受到该螺柱74旋转而被带动，故在此情况下，具有弹力的弹力件73无须提供该带动块72向上或向下的弹性回复力，故该弹力件73可省略不设。需特别说明的是，该螺柱74为滚珠螺杆的结构和原理与现有技术无特殊差异，故在此不再赘述。
在其他可能的实施例中，该带动块72可自备或受到其他外部动力而向上移动，在此情况下，该弹力件73可为拉伸弹簧，当外部动力减弱或消失时，便可提供该带动块72朝下位移的回复力，换言之，该带动块72受到自备或其他外部动力而向上移动，进而使得各该连动板50之间的距离变大，且可受到该拉伸弹簧的弹性回复力而使该带动块72朝下位移，进而使得各连动板50之间的距离变小；或者，该带动块72可自备或受到其他外部动力而向下移动，在此情况下，该弹力件73可为压缩弹簧，当外部动力减弱或消失时，便可提供该带动块72朝上位移的回复力，换言之，该带动块72受到自备或其他外部动力而向下移动，进而使得各连动板50之间的距离变小，且可受到该压缩弹簧的弹性回复力而使该带动块72朝上位移，进而使得各连动板50之间的距离变大；由于该带动块72并非受到滚珠螺杆的驱动而移动，因此在此实施例中该螺柱74、多个滚珠75可省略不设。
另一方面，在其他可能的实施例中，该带动块72可自备或受到其他外部动力而兼具向上、向下移动功能，也就是说，该带动块72受到自备或其他外部动力而向上移动，进而使得各连动板50之间的距离变大，且受到自备或其他外部动力而向下移动，进而使得各连动板50之间的距离变小。由于该带动块72本身兼具向上、向下移动功能，因此在此实施例中该弹力件73可省略不设，且该带动块72并非受到滚珠螺杆的驱动而移动，因此该螺柱74与多个滚珠75亦可省略不设。
请参考图4，是本申请一较佳实施例所提供的晶圆存取总成80，其具有如上所述的晶圆存取装置10以及晶圆载具90，该晶圆载具90用以供该晶圆存取装置10将晶圆W取出或置入，该晶圆载具90的结构与现有结构大致相同，该晶圆载具90具有多个插槽97，各插槽97供一片晶圆W置入存放，在本实施例中，该晶圆载具90与现有结构最大的差异在于相邻两个插槽97之间的距离为5mm，在其他可能的实施例中，相邻两个插槽97之间的距离可介于3mm以上(包括端点值3mm)且小于10mm(包括端点值10mm)的范围内。
请参考图5，附图左方的晶圆载具100为现有的晶圆载具，可以是晶圆盒或产线机台等，因此详细结构不再赘述，现有的晶圆载具100共可装载25片晶圆，且每片晶圆之间的间距为10mm，为了方便说明及附图精简化，附图中的晶圆数量以3片作为示例。以下将进一步说明该晶圆存取装置10将晶圆W由现有的晶圆载具100取出并置入于该晶圆载具90的流程。
请结合前述附图并参考图6～11，首先，该晶圆存取装置10位于现有的晶圆载具100与该晶圆载具90之间，且该底座30的长槽32的第一端321较靠近现有的晶圆载具100、该第二端323较靠近该晶圆载具90；各连动板50之间的距离为5mm。接着，该带动块72可开始向上移动而拉动该最顶层的连动板50，带动多个连接侧壁71伸展，使得各该连动板50之间的距离变大至10mm，符合现有晶圆载具100的结构规格，此时，该轴杆40开始沿该长槽32朝该第一端321平移滑动，该轴杆40在平移滑动的同时则驱使多个连动板50连同多个手臂60一起朝该晶圆载具100的方向移动，各该手臂60伸入该晶圆载具100中，并各自真空吸附一片晶圆W之后，接着，该轴杆40沿该长槽32朝该第二端323平移滑动，此时多个手臂60与吸附的晶圆W也退离该晶圆载具100，接着，该底座30原地旋转，使多个手臂60所吸附的晶圆W朝向该晶圆载具90的方向平移，该带动块72可开始向下移动压抵该最顶层的连动板50，带动多个连接侧壁71闭合，使得各连动板50之间的距离缩小至5mm，亦即各晶圆W之间的距离为5mm，使多个手臂60可伸入该晶圆载具90中，并将真空吸附的晶圆W置入所对应的多个插槽97中，该底座30便可朝远离该晶圆载具90的方向平移，而驱使多个手臂60退离该晶圆载具90，如此便完成了该晶圆存取装置10将晶圆W由现有的晶圆载具100取出并置入于该晶圆载具90的流程。
由于该晶圆载具90相邻两个插槽97之间的距离为5mm，因此放置在该晶圆载具90中的每一片晶圆W之间的距离仅为5mm，故相较于现有结构，本申请的该晶圆载具90放置25片晶圆的所占体积可大幅缩减50％，尤其当大量的晶圆需跨厂区运送时，其所占用的仓储体积也仅为现有技术的一半。该晶圆存取装置10可令各晶圆W之间的距离快速地由10mm缩小至5mm，过程简易不繁琐，而轻松达到上述减少所占体积的功效；另一方面，由于该晶圆存取装置10具有多个手臂60，更详细地说，该晶圆存取装置10可具有25个手臂60，因此可以在同一时间真空吸附25片晶圆进行运送，相较于现有技术，现有结构的机械手臂一次只能吸取一片晶圆，本申请的该晶圆存取装置10更能省下不少晶圆的真空吸附与运送时间，达到更高的晶圆存取效率，甚至，该晶圆存取装置10也可用来存取半导体晶圆以外的其他对象或是运用在其他领域，例如该晶圆存取装置10也可同时存取多个扩片环、光罩等，或是面板产业的玻璃基板等，而不局限在半导体的晶圆。举凡其他可轻易想到的结构变化，均应为本申请的专利范围所涵盖。

Claims (12)

1.一种晶圆存取装置，其特征在于，包含：
底座，具有长槽；
轴杆，可滑动地伸入所述长槽中；
多个连动板，套设于所述轴杆，各所述连动板具有板体以及穿孔，所述穿孔穿设于所述板体供所述轴杆穿过；
多个手臂，各所述手臂由各所述连动板的板体的一端延伸而出；以及
伸缩组件，包含多个连接侧壁，各所述连接侧壁分别设于各所述连动板并使相邻的所述连动板连接在一起，且各所述连接侧壁可进行伸缩以改变相邻所述连动板之间的距离。
2.如权利要求1所述的晶圆存取装置，其特征在于，所述伸缩组件还包含：
带动块，可上下移动地设于所述轴杆，所述带动块和位于最顶层的所述连动板连接且可带动所述连动板朝上位移或朝下位移。
3.如权利要求2所述的晶圆存取装置，其特征在于，所述伸缩组件还包含：
弹力件，设于所述轴杆内且贴抵所述带动块。
4.如权利要求3所述的晶圆存取装置，其特征在于，所述弹力件为压缩弹簧，提供所述带动块朝上位移的回复力。
5.如权利要求3所述的晶圆存取装置，其特征在于，所述弹力件为拉伸弹簧，提供所述带动块朝下位移的回复力。
6.如权利要求2所述的晶圆存取装置，其特征在于，所述伸缩组件还包含有螺柱，所述螺柱容设于所述轴杆内，所述带动块包含有衬套，所述衬套伸入所述轴杆内且位于所述轴杆与所述螺柱之间，当所述螺柱旋转可驱使所述带动块上下移动。
7.如权利要求6所述的晶圆存取装置，其特征在于，所述伸缩组件还包含有弹力件，所述弹力件设于所述轴杆内且贴抵所述带动块。
8.如权利要求6所述的晶圆存取装置，其特征在于，所述伸缩组件还包含有多个滚珠，多个所述滚珠设于所述衬套与所述螺柱之间。
9.一种晶圆载具，其特征在于，用以供如权利要求1至8中任一项所述的晶圆存取装置将晶圆取出或置入，所述晶圆载具包含有多个插槽。
10.如权利要求9所述的晶圆载具，其特征在于，相邻两个所述插槽之间的距离范围为3mm～10mm。
11.如权利要求10所述的晶圆载具，其特征在于，相邻两个所述插槽之间的距离为5mm。
12.一种晶圆存取总成，其特征在于，用以运送晶圆，所述晶圆存取总成包含有：
如权利要求1至8中任一项所述的晶圆存取装置；以及
如权利要求9至11中任一项所述的晶圆载具；
其中，所述晶圆存取装置将晶圆取出或置入所述晶圆载具。
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