CN116004132A - Adhesive tape and its preparation method, display module and display device - Google Patents

Abstract

The application provides an adhesive tape, a preparation method thereof, a display module and a display device. The adhesive buffer layer is arranged on at least one side of the substrate, and the loss factor G '/G' of the adhesive buffer layer at 25 ℃ is less than or equal to 0.6 and less than or equal to 10; wherein G' is the storage modulus of the adhesive buffer layer at 25 ℃, and G "is the loss modulus of the adhesive buffer layer at 25 ℃. The adhesive tape can help to reduce the thickness of the display module and improve the impact resistance of the display module.

Description

Adhesive tape and its preparation method, display module and display device

technical field

The present application relates to the field of display technology, in particular to an adhesive tape and a preparation method thereof, a display module and a display device.

Background technique

With the rapid development of display technology, the progress of thinner and lighter display devices has been accelerated. Due to the thinner and lighter display devices, users are provided with a good sense of use experience, making this type of display device one of the most concerned display devices by users.

At present, in the related art, the thinning of the display device is mainly realized by reducing the thickness of the display module. However, the reduction in the thickness of the display module will lead to a decrease in its impact resistance, and even the display module will lose its display function when it is impacted.

Contents of the invention

The present application provides an adhesive tape and a preparation method thereof, a display module and a display device. The adhesive tape can help reduce the thickness of the display module and improve the impact resistance of the display module.

The first aspect of the present application provides an adhesive tape for a display module, including a base material and an adhesive buffer layer. The adhesive buffer layer is arranged on at least one side of the substrate, and the loss factor G″/G′ of the adhesive buffer layer at 25°C satisfies: 0.6≤G″/Gˊ≤10, where G′ is the adhesive buffer layer at 25°C The shear storage modulus at , G″ is the loss modulus of the adhesive buffer layer at 25°C.

In the adhesive tape provided by this application, the substrate can provide support for the adhesion buffer layer, and the adhesion buffer layer arranged on one side of the substrate can provide adhesion on the one hand, and on the other hand, the loss factor at 25°C In a suitable range, when the display module using the tape is impacted, it can absorb more impact energy and consume the impact energy, thereby improving the buffering and shock absorption capacity of the tape, so that the display module also has a strong Shock resistance. In addition, compared with the adhesive tapes in the prior art that include laminated substrates, acrylic, acrylic foam, polyethylene terephthalate, and grid glue, the adhesive tape provided by the application includes substrates And the buffer layer, which has less lamellar structure, can help reduce the thickness of the adhesive tape, thereby further helping to reduce the thickness of the display module.

According to any one of the aforementioned embodiments of the first aspect of the present application, the loss factor G″/G′ of the adhesive buffer layer at 25° C. satisfies: 0.8≤G″/G′≤2.

According to any one of the aforementioned embodiments of the first aspect of the present application, the shear storage modulus G′ of the adhesive buffer layer at 25°C is 10KPa-5000KPa.

According to any one of the aforementioned implementations of the first aspect of the present application, the shear storage modulus G' of the adhesive buffer layer at 25°C is 30KPa-2000KPa.

According to any one of the preceding embodiments of the first aspect of the present application, the adhesion buffer layer comprises a silicone resin.

According to any one of the aforementioned embodiments of the first aspect of the present application, the weight average molecular weight of the silicone resin is 100,000-5 million.

According to any one of the aforementioned embodiments of the first aspect of the present application, the weight average molecular weight of the silicone resin is 500,000-5 million.

According to any one of the aforementioned embodiments of the first aspect of the present application, the degree of crosslinking of the silicone resin is 10%-70%.

According to any one of the aforementioned embodiments of the first aspect of the present application, the degree of crosslinking of the silicone resin is 20%-50%.

According to any one of the aforementioned embodiments of the first aspect of the present application, the silicone resin is selected from at least one of vinyl silicone resins and hexenyl silicone resins.

According to any one of the foregoing implementation manners of the first aspect of the present application, the thickness of the adhesion buffer layer is 0.05mm-0.5mm.

According to any one of the foregoing implementation manners of the first aspect of the present application, the thickness of the adhesion buffer layer is 0.08mm-0.2mm.

According to any one of the aforementioned embodiments of the first aspect of the present application, the adhesive tape further includes an adhesive layer disposed on a side of the adhesive buffer layer away from the substrate.

According to any one of the aforementioned embodiments of the first aspect of the present application, the peeling strength of the adhesive tape at a peeling angle of 180° is 5 N/m or more.

According to any one of the aforementioned embodiments of the first aspect of the present application, the tensile strength E of the substrate satisfies: 200MPa≤E.

According to any one of the aforementioned embodiments of the first aspect of the present application, the tensile strength E of the substrate satisfies: 300MPa≤E.

According to any one of the aforementioned embodiments of the first aspect of the present application, the thickness of the substrate is 10 μm-200 μm.

According to any one of the foregoing implementation manners of the first aspect of the present application, the thickness of the substrate is 20 μm-100 μm.

According to any one of the aforementioned embodiments of the first aspect of the present application, the material of the substrate includes at least one of copper foil, stainless steel and carbon fiber.

The second aspect of the present application provides a method for preparing the adhesive tape of the first aspect of the present application, comprising:

Provide the substrate;

An adhesion buffer layer is formed on at least one side of the substrate, and the loss factor G″/G′ of the adhesion buffer layer at 25° C. satisfies: 0.6≤G″/G′≤10;

Wherein, G′ is the shear storage modulus of the adhesive buffer layer at 25°C, and G″ is the loss modulus of the adhesive buffer layer at 25°C.

The third aspect of the present application provides a display module, including a display panel and the adhesive tape prepared by the adhesive tape of the first aspect of the present application or the adhesive tape prepared by the method of the second aspect of the present application, and the adhesive tape is bonded to one side of the display panel.

The fourth aspect of the present application provides a display device, including the display module of the third aspect of the present application.

Description of drawings

Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals represent the same or similar features, appended Figures are not drawn to scale.

Fig. 1 shows a schematic structural view of an adhesive tape provided by some embodiments of the present application.

Fig. 2 shows a schematic structural view of adhesive tapes provided in other embodiments of the present application.

Fig. 3 shows a schematic flowchart of the preparation method of the adhesive tape provided by some embodiments of the present application.

Fig. 4 shows a schematic structural diagram of a display module provided by some embodiments of the present application.

FIG. 5 shows a schematic structural diagram of a display module provided by another embodiment of the present application.

Explanation of reference signs:

100-display module;

10-adhesive tape, 11-substrate, 12-adhesion buffer layer, 13-adhesive layer;

20 - display panel;

30 - supporting membrane;

40-polarizer;

50-optical adhesive layer;

60 - cover plate.

Detailed ways

The characteristics and exemplary implementations of various aspects of the application will be described in detail below. In order to make the purpose, technical solutions and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only configured to explain the application, not to limit the application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

It should be noted that in this article, relative terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these No such actual relationship or order exists between entities or operations. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the statement "comprising..." does not exclude the presence of additional same elements in the process, method, article or device comprising said element.

It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. And, if the part is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

It should be understood that the term "and/or" used herein is only an association relationship describing associated objects, which means that there may be three relationships, for example, A and/or B, which may mean that A exists alone, and A and B exist simultaneously. B, there are three situations of B alone. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship.

In the embodiments of the present application, the term "electrically connected" may refer to a direct electrical connection between two components, or may refer to an electrical connection between two components via one or more other components.

It will be apparent to those skilled in the art that various modifications and changes can be made in the application without departing from the spirit or scope of the application. Therefore, the present application intends to cover the modifications and changes of the present application falling within the scope of the corresponding claims (technical solutions to be protected) and their equivalents. It should be noted that, the implementation manners provided in the implementation manners of the present application may be combined with each other if there is no contradiction.

Before explaining the technical solutions provided by the embodiments of the present application, in order to facilitate the understanding of the embodiments of the present application, the present application first specifically explains the problems existing in the related technologies:

With the rapid development of display technology, the progress of thinner and lighter display devices has been accelerated. Due to the thinner and lighter display devices, users are provided with a good sense of use experience, making this type of display device one of the most concerned display devices by users.

Currently, a display device usually includes a display module configured to display images, videos, and the like. The thinning of the display device is mainly realized by reducing the thickness of the display module. In the related art, under the premise of reducing the thickness of the display module, in order to protect the display module of the display device and improve the impact resistance of the display module, one side of the display module is bonded with an adhesive tape, which includes a laminated set Copper foil, acrylic, acrylic foam, polyethylene terephthalate and grid glue and other multi-layer structures, these multi-layer structures can protect the display module and improve the impact resistance of the display module.

As users have higher and higher requirements for thinner and lighter display devices, it is necessary to reduce the thickness of the adhesive tape to meet the needs of users. However, reducing the thickness of the tape usually requires reducing the thickness of the foam and copper foil, which will lead to a decrease in the impact resistance of the display module, and even the display module will lose its display function when it is impacted.

In view of this, the implementation method of the present application provides an adhesive tape and a preparation method thereof, a display module and a display device.

adhesive tape

Preferred embodiments of the adhesive tape according to the content disclosed in the embodiments of the present application will be described in detail below with reference to the accompanying drawings. Fig. 1 shows a schematic structural view of an adhesive tape provided by some embodiments of the present application.

Possible embodiments within the scope of the present disclosure may have fewer components, have other components not shown in the figures, different components, differently arranged components or differently connected components than the ones shown in the figures. parts etc. Furthermore, two or more components in a drawing may be implemented in a single component, or a single component shown in a drawing may be implemented as multiple separate components, without departing from the concepts disclosed herein.

As shown in FIG. 1 , an embodiment of the present application provides an adhesive tape for a display module. The adhesive tape 10 includes a base material 11 and an adhesive buffer layer 12 . The adhesion buffer layer 12 is disposed on one side of the substrate 11, and the loss factor G″/G′ of the adhesion buffer layer 12 at 25° C. satisfies: 0.6≤G″/G′≤10. Wherein, G′ is the shear storage modulus of the adhesive buffer layer 12 at 25°C, and G″ is the loss modulus of the adhesive buffer layer 12 at 25°C.

In the present application, the adhesive buffer layer 12 is cut into a test sample with a thickness of 0.1 mm, a width of 0.6 mm, and a length of 10 mm. The shear storage modulus G′ and loss modulus G″ of the test sample at 25° C. can be used The dynamic viscoelasticity measurement device is measured under preset conditions (measurement mode: shear; heating rate: 5°C/min; measurement temperature: 25°C; set strain: 0.1%; frequency: 10Hz).

It can be understood that the adhesion buffer layer 12 is arranged on one side of the substrate 11, the adhesion buffer layer 12 can be arranged on any side of the substrate 11, and the adhesion buffer layer 12 can also be arranged on opposite sides of the substrate 11 respectively. . In addition, the adhesion buffer layer 12 may be directly disposed on the surface of the substrate 11 , or other functional layers may be disposed between the substrate 11 and the adhesion buffer layer 12 , which are not specifically limited in the embodiments of the present application.

In the adhesive tape 10 provided by the present application, the base material 11 can provide support for the buffer layer, and the adhesive buffer layer 12 arranged on one side of the base material 11 can provide adhesion on the one hand, and the temperature at 25° C. If the dissipation factor is within an appropriate range, when the display module using the adhesive tape 10 is impacted, it can absorb more impact energy and consume the impact energy, thereby improving the cushioning and shock absorption capacity of the adhesive tape 10, so that the display module can also Has strong impact resistance. In addition, compared with the adhesive tape 10 of the multi-layer structure including the substrate 11, acrylic, acrylic foam, polyethylene terephthalate and grid glue in the prior art, the adhesive tape 10 provided by the application Including the base material 11 and the buffer layer, which has less layered structure, can help reduce the thickness of the adhesive tape 10, thereby further helping to reduce the thickness of the display module.

In some optional embodiments of the present application, the loss factor G″/G′ of the adhesive buffer layer 12 at 25° C. satisfies: 0.8≦G″/G′≦2.

In the above optional embodiments, the loss factor of the adhesive buffer layer 12 at 25°C is within the above appropriate range, which can absorb more impact energy and dissipate it, thereby further improving the buffering and shock absorption of the adhesive tape 10 Ability, so that the display module also has stronger impact resistance.

In some optional embodiments of the present application, the adhesion buffer layer 12 includes silicone resin.

In the above optional embodiments, on the one hand, the silicone resin can provide adhesion, on the other hand, the silicone resin contains silicon-oxygen bonds, and the silicon-oxygen bonds have the characteristics of long bond length and wide bond angle, and then The degree of freedom of displacement of the molecular chain containing the silicon-oxygen bond is enhanced, and it is easy to rotate, so the internal friction between the molecular chain segments in the silicone resin increases, which in turn helps to convert the impact energy into heat through friction and consume it, thereby The cushioning and shock absorption capacity of the adhesive tape 10 is improved, so that the display module also has a strong impact resistance.

In the embodiment of the present application, the shear storage modulus of the silicone resin at 25°C is in an appropriate range, which can help to enhance the internal friction between the chain segments in the silicone resin, and then the adhesive tape 10 can be subjected to The impact energy is converted into heat through the internal friction between the chain segments and consumed, thereby further improving the buffering and shock absorption capacity of the adhesive tape 10, so that the display module using the adhesive tape 10 has good impact resistance.

In some embodiments of the present application, the shear storage modulus G' of the silicone resin at 25°C is 10KPa-1000KPa. The shear storage modulus G' of the silicone resin at 25°C is within the above-mentioned appropriate range, and more impact energy can be converted into heat through the internal friction between the chain segments to be consumed, thereby further improving the cushioning of the adhesive tape 10 shock absorption capacity.

In other embodiments of the present application, the shear storage modulus G' of the silicone resin at 25°C is 30KPa-200KPa. The shear storage modulus G′ of the silicone resin at 25° C. is within the above suitable range, which can significantly improve the cushioning and shock absorption capacity of the adhesive tape 10 .

In some examples, the shear storage modulus G′ of the silicone resin at 25°C can be, but not limited to, 10KPa, 20KPa, 30KPa, 40KPa, 50KPa, 60KPa, 70KPa, 80KPa, 90KPa, 100KPa, 110KPa, 120KPa, 130KPa , 140KPa, 150KPa, 160KPa, 170KPa, 180KPa, 190KPa, 200KPa, 210KPa, 220KPa, 230KPa, 240KPa, 250KPa, 260KPa, 270KPa, 280KPa, 290KPa, 300KPa, 310KPa, 320KPa, 330KPa, 340KPa, 350KPa, 360KPa, 370KPa, 380KPa , 390KPa, 400KPa, 410KPa, 420KPa, 430KPa, 440KPa, 450KPa, 460KPa, 470KPa, 480KPa, 490KPa, 500KPa, 510KPa, 520KPa, 530KPa, 540KPa, 550KPa, 560KPa, 570KPa, 580KPa, 590KPa, 600KPa, 610KPa, 620KPa, 630KPa , 640KPa, 650KPa, 660KPa, 670KPa, 680KPa, 690KPa, 700KPa, 710KPa, 720KPa, 730KPa, 740KPa, 750KPa, 760KPa, 770KPa, 780KPa, 790KPa, 800KPa, 810KPa, 820KPa, 830KPa, 840KPa, 850KPa, 860KPa, 870KPa, 880KPa . 0KPa- 600KPa, 300KPa-550KPa.

In addition, the internal friction between segments in the silicone resin can be further enhanced by controlling the weight-average molecular weight of the silicone resin so that it has an appropriate shear storage modulus.

In some embodiments of the present application, the weight average molecular weight of the silicone resin is 100,000-5 million. The weight-average molecular weight of the silicone resin is within the above-mentioned appropriate range, which can make the silicone resin have a lower shear storage modulus, thereby enhancing the internal friction between its internal chain segments, thereby helping to consume more impact energy.

In other embodiments of the present application, the weight average molecular weight of the silicone resin is 500,000-4 million. The weight-average molecular weight of the silicone resin is within the above-mentioned appropriate range, which can further reduce the shear storage modulus of the silicone resin, and further enhance the internal friction between the internal chain segments, thereby consuming more energy through internal friction. impact energy.

In some examples, the weight average molecular weight of the silicone resin can be, but not limited to, 100,000, 200,000, 300,000, 400,000, 500,000, 600,000, 700,000, 800,000, 900,000, 1 million, 1.1 million, 1.2 million, 1.3 million, 1.4 million, 1.5 million, 1.6 million, 1.7 million, 1.8 million, 1.9 million, 2 million, 2.1 million, 2.2 million, 2.3 million, 2.4 million, 2.5 million, 2.6 million, 2.7 million, 2.8 million , 2.9 million, 3 million, 3.1 million, 3.2 million, 3.3 million, 3.4 million, 3.5 million, 3.6 million, 3.7 million, 3.8 million, 3.9 million, 4 million, 4.1 million, 4.2 million, 4.3 million, 4.4 million, 4.5 million 10,000, 4.6 million, 4.7 million, 4.8 million, 4.9 million, 5 million or any two of the above values, for example, 200,000-4.8 million, 500,000-4 million, 800,000-3.6 million, 1 million-3 million Ten thousand, 1.5 million to 2.5 million.

The weight-average molecular weight of the silicone resin can be adjusted during the preparation process, for example, the molecular weight and molecular weight distribution of the polymer in the silicone resin can be changed by changing the polymerization method, or the compounding amount of the crosslinking agent can be changed, or the oligomerization can be combined. and other low molecular weight components to adjust. It can also be purchased directly from the market according to actual application requirements, which is not specifically limited in the embodiments of the present application.

The measurement of the weight average molecular weight of a silicone resin can be measured with a GPC apparatus, and it can obtain|require it as a polystyrene conversion value. Specifically, the silicone resin was diluted 50 times with tetrahydrofuran (THF), and the obtained dilution was filtered with a filter (material: polytetrafluoroethylene, pore size: 0.2 μm) to prepare a measurement sample. This measurement sample was subjected to gel permeation chromatography, and GPC measurement was performed at a sample flow rate of 1 mL/min and a column temperature of 40° C. to measure the polystyrene-equivalent molecular weight of the silicone resin to obtain a weight average molecular weight. It should be noted that the weight-average molecular weight of the silicone resin can also be measured by other conventional methods in the art, and the method for measuring the weight-average molecular weight is not specifically limited in the embodiments of the present application.

In addition, the shear storage modulus of the silicone resin can also be adjusted through its degree of crosslinking. When the silicone resin has a lower degree of crosslinking, it can retain more uncrosslinked branched chains, thereby being able to Enhance the fluidity of these branched chains to reduce the shear storage modulus of the silicone resin, thereby enhancing the internal friction between its internal chain segments to help dissipate more impact energy.

In some optional embodiments of the present application, the degree of crosslinking of the silicone resin is 10%-70%.

In other optional embodiments of the present application, the degree of crosslinking of the silicone resin is 20%-50%.

In some examples, the degree of crosslinking of the silicone resin can be, but not limited to, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37% , 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54 %, 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64%, 65%, 66%, 67%, 68%, 69%, 70% or A range composed of any two of the above numerical values, for example, 15%-60%, 25%-45%, 30%-40%.

In the above-mentioned embodiments, the degree of cross-linking of the silicone resin can be adjusted by the amount of additives, such as adding a small amount of plasticizer and reducing the concentration of the cross-linking agent, wherein both the plasticizer and the cross-linking agent can be Any one known in the art is adopted, and the embodiments of the present application are not specifically limited here.

In addition, the cross-linking degree of silicone resin can be measured by the following method: collect a sample of silicone resin with a mass of W1 (g), soak the collected sample in ethyl acetate at 23°C for 24 hours, and filter it with a 200-mesh metal mesh out the insoluble part. The residue on the wire mesh was dried at 110° C. for 1 h, and the dried mass W2 (g) was measured, and the gel fraction (crosslinking degree) was calculated by the following formula, gel fraction (mass %)=( W2/W1) x 100%. In the embodiment of the present application, the degree of crosslinking of the silicone resin can also be measured by other methods well known in the art.

In some optional embodiments of the present application, the silicone resin is selected from at least one of vinyl silicone resins and hexenyl silicone resins.

In the above-mentioned embodiments, the silicone resin is selected from the above-mentioned resins, which can not only make the adhesion buffer layer 12 have better adhesion, but also make the adhesion buffer layer 12 have a lower loss factor, thereby strengthening the adhesive tape 10. shock absorbing capacity.

In the embodiment of the present application, setting the thickness of the adhesive buffer layer 12 within an appropriate range can help to reduce the thickness of the adhesive tape 10 while also helping to improve the buffering and shock absorption capability of the adhesive tape 10 .

In some optional embodiments of the present application, the thickness of the adhesion buffer layer 12 is 0.05 μm-0.5 μm.

In the above optional embodiments, the thickness of the adhesive buffer layer 12 is within the above appropriate range, which helps to reduce the thickness of the adhesive tape 10 and at the same time enables the adhesive tape 10 to have better buffering and shock absorption capabilities.

In other optional embodiments of the present application, the thickness of the adhesion buffer layer 12 is 0.08 μm-0.2 μm.

In some examples, the thickness of the adhesion buffer layer 12 may be, but not limited to, 0.05 μm, 0.06 μm, 0.07 μm, 0.08 μm, 0.09 μm, 0.10 μm, 0.11 μm, 0.12 μm, 0.13 μm, 0.14 μm, 0.15 μm, 0.16μm, 0.17μm, 0.18μm, 0.19μm, 0.20μm, 0.21μm, 0.22μm, 0.23μm, 0.24μm, 0.25μm, 0.26μm, 0.27μm, 0.28μm, 0.29μm, 0.30μm, 0.31μm, 0.32μm , 0.33μm, 0.34μm, 0.35μm, 0.36μm, 0.37μm, 0.38μm, 0.39μm, 0.40μm, 0.41μm, 0.42μm, 0.43μm, 0.44μm, 0.45μm, 0.46μm, 0.47μm, 0.48μm, 0.49 μm, 0.50 μm or a range composed of any two of the above values, for example, 0.06 μm-0.48 μm, 0.1 μm-0.36 μm, 0.16 μm-0.3 μm.

Please refer to FIG. 2 , which shows a schematic structural view of adhesive tapes provided in other embodiments of the present application.

As shown in FIG. 2 , in some optional embodiments of the present application, the adhesive tape 10 further includes an adhesive layer 13 disposed on a side of the adhesive buffer layer 12 away from the substrate 11 .

In the above embodiments, the provision of the adhesive layer 13 can further improve the adhesiveness of the adhesive tape 10, so that the adhesive tape can be firmly bonded to other components. Here, the adhesive layer 13 may be formed of any appropriate adhesive, and the adhesive may refer to a state showing a soft solid (viscoelastic body) in a temperature range around room temperature, having the ability to easily adhere to the substrate by pressure. The material on the sticky body, for example, the adhesive can be but not limited to acrylic polymer, silicon polymer, polyester, polyurethane, polyamide, polyether, fluorine polymer, rubber polymer Polymers, isocyanate-based polymers, polyvinyl alcohol-based polymers, gelatin-based polymers, vinyl-based polymers, latex-based polymers, water-based polyesters and other polymers are mixed together.

In some optional embodiments of the present application, the peeling strength of the adhesive tape 10 is above 5 N/m when the peeling angle is 180°.

In this application, the peel strength of the adhesive tape 10 at a peel angle of 180° can be obtained by crimping it on a stainless steel plate (SUS304BA plate) as an adherend, and placing it in an environment of 23°C and 50%RH 30min, then according to JISZ 0237 under the conditions of peeling angle 180 °, tensile speed 300mm/min measured 180 ° of peel adhesion, to obtain the peel strength.

In the above optional embodiments, the peel strength of the adhesive tape 10 at a peeling angle of 180° is within the above suitable range, which can further improve the adhesiveness of the adhesive tape 10 and make the adherends firmly bonded together.

In some examples, the peel strength of the adhesive tape 10 at a peel angle of 180° may be, but not limited to, 8 N/m or more, 15 N/m or more, 50 N/m or more, 100 N/m or more, 200 N/m or more or higher.

In some optional embodiments of the present application, the tensile strength E of the substrate 11 satisfies: 200MPa≤E.

In the above optional embodiments, the tensile strength E of the base material 11 is set within the above-mentioned appropriate range, which can make the base material 11 have higher rigidity and bending strength, and then change the impact from point force to The force on the surface increases the impact area, so that the movement of the adhesive buffer layer 12 through the chain segments consumes more impact energy, so as to improve the buffering and shock absorption capacity of the adhesive tape 10 .

In other optional embodiments of the present application, the tensile strength E of the substrate 11 satisfies: 300MPa≤E.

In some examples, the tensile strength E of the substrate 11 may be, but not limited to, 250MPa or more, 300MPa or more, 350MPa or more, 400MPa or more, 450MPa or more, 500MPa or more, 550MPa or more, 600MPa or more, 650MPa or more, 700MPa or more, 750MPa or more , Above 800MPa, above 850MPa, above 900MPa, above 950MPa, above 1000MPa.

In some optional embodiments of the present application, the thickness of the substrate 11 is 10 μm-100 μm.

In the above optional embodiments, the thickness of the base material 11 is set within the above appropriate range, which can help to reduce the thickness of the adhesive tape 10 and at the same time enhance the supporting function of the base material 11 .

In some other optional embodiments of the present application, the thickness of the substrate 11 is 20 μm-50 μm.

In some examples, the thickness of the substrate 11 may be, but not limited to, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm Or a range composed of any two values above, for example, 10 μm-90 μm, 15 μm-80 μm, 25 μm-70 μm, 30 μm-55 μm.

In addition, in some optional embodiments of the present application, the material of the substrate 11 includes at least one of copper foil, stainless steel and carbon fiber. These materials can make the substrate 11 have higher rigidity and bending strength, and then change the impact from point force to surface force, increasing the impact area, so that the adhesive buffer layer 12 passes through the gap between the segments. Movement consumes more impact energy, so as to improve the cushioning and shock absorption capacity of the adhesive tape 10 .

Preparation method of adhesive tape

Please refer to FIG. 3 . FIG. 3 shows a schematic structural diagram of a method for preparing an adhesive tape provided in some embodiments of the present application.

As shown in Figure 3, the second aspect of the application provides a method for preparing the adhesive tape of the first aspect of the application, including:

S10, providing a substrate;

S20. Form an adhesive buffer layer on one side of the substrate, and the loss factor G″/G′ of the adhesive buffer layer at 25° C. satisfies: 0.6≤G″/Gˊ≤10; wherein, G′ is the adhesive buffer layer at 25°C The shear storage modulus at °C, G″ is the loss modulus of the adhesive buffer layer at 25 °C.

In the method provided in the embodiment of the present application, the process is simple, and the adhesive tape with the desired performance can be quickly prepared.

display module

Please refer to FIG. 4 and FIG. 5 . FIG. 4 shows a schematic structural diagram of a display module provided by some embodiments of the present application. FIG. 5 shows a schematic structural diagram of a display module provided by another embodiment of the present application.

As shown in FIG. 4 , the third aspect of the present application provides a display module, including a display panel 20 and the adhesive tape 10 prepared by the method of the first aspect of the present application or the adhesive tape 10 prepared by the method of the second aspect of the present application. connected to one side of the display panel 20.

In the display module 100 provided in the embodiment of the present application, since the adhesive tape 10 in the above embodiment is included, the display module 100 is not easily damaged when subjected to external impact.

As shown in FIG. 5 , in some examples, the display module 100 includes a cover plate 60 , an optical adhesive layer 50 , a polarizer 40 , a display panel 20 , a support film 30 and an adhesive tape 10 stacked from top to bottom.

Wherein, the cover plate 60 may be an ultra-thin glass cover plate or a polyimide cover plate. The optical adhesive layer 50 can be used for bonding the cover plate 60 and the polarizer 40 . The polarizer 40 can be a linear polarizer or a circular polarizer.

In addition, the display panel 20 may be a flexible display panel, which may be, but not limited to, an OLED (Organic Light Emitting Diode) display panel, a QLED (Quantum Dot Light Emitting Diode) display panel, a Micro-LED (micron Light Emitting Diode) display panel. panel or Mini-LED (Mini Light Emitting Diode) display panel.

The support film 30 can be used to support and protect the display panel 20 , and the support film 30 can be directly attached to the surface of the display panel 20 away from the cover plate 60 to form an integral structure with the display panel 20 . The support film 30 may be, but not limited to, a polyethylene terephthalate (PET) film or a polyimide (PI) film.

The adhesive tape 10 can be attached to the surface of the support film 30 away from the display panel 20, which can be understood as the back side of the display panel 20. Here, the back side of the display panel 20 refers to the non-display side, that is, the display panel 20 is away from the cover plate 60. side.

display device

A fourth aspect of the present application provides a display device, which may include the display module of the third aspect of the present application.

In some embodiments of the present application, the display device may include components such as a casing and a display module, and the display module is connected to the casing, wherein the display module is used to display images, videos and the like. In some examples, the display device may include 1 or N display modules, where N is a positive integer greater than 1.

In this application, the display device can be any device with a display function. For example, the display device can be, but not limited to, a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra mobile personal computer (ultra -mobile personal computer (UMPC), netbook, and cell phone, personal digital assistant (personal digital assistant, PDA), augmented reality (augmented reality, AR) device, virtual reality (virtual reality, VR) device, artificial intelligence (artificial intelligence) , AI) equipment, vehicle electronic equipment, wearable equipment, ultra mobile personal computer (Ultra mobile Personal Computer; UMPC), netbook or personal digital assistant (Personal Digital Assistant; PDA) and other mobile devices, can also be a TV (Television; For non-mobile devices such as TVs, teller machines, self-service machines, smart home devices, and smart city devices, the implementation of the present application does not impose special restrictions on the specific type of the display device.

The following specific embodiments describe the content disclosed in the present application more specifically, and these embodiments are only used for illustrative illustrations, because it is obvious to those skilled in the art to carry out various modifications and changes within the scope of the disclosed content of the present application . All reagents used in the examples are commercially available or synthesized according to conventional methods, and can be used directly without further treatment, and the instruments used in the examples are all commercially available.

Example 1-1

This embodiment provides an adhesive tape with a thickness of 155 μm; the base material is copper foil (Cu) with a thickness of 35 μm; the adhesion buffer layer contains vinyl silicone resin with a thickness of 120 μm, wherein the adhesion buffer The loss factor of the layer is 0.78 at 25°C, G″/G′.

The preparation method of this adhesive tape is as follows:

(1) Provide a copper foil substrate with a thickness of 35 μm;

(2) Coating vinyl silicone resin slurry on one side of the copper foil substrate to form an adhesion buffer layer, wherein the loss factor G″/G′ of the adhesion buffer layer at 25° C. is 0.78.

Examples 1-2 to 1-5

The preparation method is similar to that of Example 1-1, except that the loss factor of the adhesion buffer layer, please refer to Table 1 for specific parameters.

Comparative example 1-1

The preparation method is similar to that of Example 1-1, except that: the shear modulus/loss factor of the adhesive buffer layer, please refer to Table 1 for specific parameters.

Examples 2-1 to 2-5

The preparation method is similar to that of Example 1-1, except that: the material and thickness of the adhesive buffer layer and the thickness and tensile modulus of the substrate, please refer to Table 2 for specific parameters.

Comparative example 2-1

The preparation method is similar to that of Example 1-1, except that: the material and thickness of the adhesive buffer layer and the thickness and tensile modulus of the substrate, please refer to Table 2 for specific parameters.

test part

1) Test of the shear storage modulus G′ and loss modulus G″ of the adhesive buffer layer at 25°C

The adhesive buffer layer is cut into a test sample with a thickness of 0.1 mm, a width of 0.6 mm, and a length of 10 mm. The shear storage modulus G′ and loss modulus G″ of the test sample at 25° C. can be measured using a dynamic viscoelasticity measuring device at Preset conditions (measurement mode: shear; heating rate: 5°C/min; measurement temperature: 25°C; set strain: 0.1%; frequency: 10Hz) are measured.

2) Display the test of the impact resistance of the module

Place the display module with the display face down on the steel ball drop device, and fix the four corners with tape to prevent the display module from sliding. Drop 11.2g steel balls freely from different heights on the composite tape on the back of the display module, and test 5 points at the same height; after the drop test, turn on the module to confirm whether there are bright spots or black spots on the display. Wherein, the height at which the display module has bright spots or dark spots can be expressed as the impact resistance, that is to say, the higher the height, the stronger the impact resistance.

Table 1 respectively lists the test results of the adhesive buffer layer in Examples 1-1 to 1-5 and Comparative Example 1-1 under different loss factors.

Table 1

According to the test results of impact resistance in Table 1, it can be seen that the loss factor of the adhesive buffer layer in the adhesive tape is within an appropriate range at 25°C. The larger the loss factor, the more the display module using the tape can absorb when it is impacted More impact energy and dissipate the impact energy, so that the buffering and shock absorption capacity of the tape is stronger, and the impact resistance of the display module is also stronger.

Table 2 lists the different thicknesses of the adhesion buffer layer and the different silicone materials contained in Examples 2-1 to 2-5, as well as the thickness and tensile strength of the substrate, and also lists the thickness and tensile strength of the adhesive buffer layer in Comparative Example 2-1. The different thicknesses and materials contained in the adhesive buffer layer as well as the thickness and tensile strength of the substrate are given in Table 2 for specific parameters.

Table 2

According to the test result of impact resistance in table 2, the test result of embodiment 2-1, 2-3 and 2-5 is compared and known, the thickness of the adhesive buffer layer in the adhesive tape is in the appropriate range, and its thickness is thicker, When the display module using the adhesive tape is impacted, the impact resistance of the display module will be stronger.

Comparing the test results of Examples 2-1 and 2-2, it can be seen that the thickness of the base material is within an appropriate range, and the thicker the base material is, the stronger the impact resistance of the display module will be.

According to the comparison of the test results of Examples 2-1, 2-3 and 2-5 in Table 2, it can be seen that the thickness of the adhesive buffer layer in the adhesive tape is within the appropriate range, and the thicker the thickness, the higher the impact resistance of the display module. will be stronger. Based on the above test results, the test results of Example 2-1 and Comparative Example 2-1 are compared, although the thickness of the adhesive buffer layer in Comparative Example 1 is thicker than that of Example 2-1, but due to The adhesive buffer layer of Comparative Example 2-1 contains acrylic resin foam material, so that the impact resistance of the display module is weaker than that of Example 2-1. Therefore, the adhesive buffer layer contains suitable materials, It can absorb more impact energy and dissipate the impact energy, thereby improving the cushioning and shock absorption capacity of the tape, so that the display module also has a strong impact resistance.

According to the embodiments of the present application as described above, these embodiments do not describe all details in detail, nor do they limit the application to only the specific embodiments described. Obviously many modifications and variations are possible in light of the above description. This specification selects and specifically describes these implementation modes in order to better explain the principles and practical applications of the application, so that those skilled in the art can make good use of the application and the modifications based on the application. This application is to be limited only by the claims, along with their full scope and equivalents.

Claims (10)

1. A kind of adhesive tape, is used for display module, is characterized in that, comprises: substrate; and, Adhesive buffer layer, arranged on at least one side of the substrate, the loss factor G″/G′ of the adhesive buffer layer at 25°C satisfies: 0.6≤G″/G′≤10; Wherein, G′ is the shear storage modulus of the adhesive buffer layer at 25°C, and G″ is the loss modulus of the adhesive buffer layer at 25°C. 2. The adhesive tape according to claim 1, characterized in that, the loss factor G″/G′ of the adhesive buffer layer at 25° C. satisfies: 0.8≤G″/G′≤2. 3. The adhesive tape according to claim 1 or 2, wherein the shear storage modulus G' of the adhesive buffer layer at 25°C is 10KPa-5000KPa, optionally 30KPa-2000KPa; Optionally, the adhesion buffer layer comprises silicone resin; Optionally, the weight average molecular weight of the silicone resin is 100,000-5 million, optionally 500,000-4 million. 4. The adhesive tape according to claim 3, characterized in that, the degree of crosslinking of the silicone resin is 10%-70%, optionally 20%-50%; Optionally, the silicone resin is selected from at least one of vinyl silicone resins and hexenyl silicone resins. 5. The adhesive tape according to claim 1, characterized in that, the thickness of the adhesive buffer layer is 0.05mm-0.5mm, optionally 0.08mm-0.2mm. 6. The adhesive tape according to claim 1, wherein the adhesive tape further comprises an adhesive layer disposed on a side of the adhesive buffer layer away from the substrate; Optionally, the adhesive tape has a peeling strength of 5 N/m or more when the peeling angle is 180°. 7. The adhesive tape according to claim 1, wherein the base material satisfies at least one of the following characteristics: (1) The tensile strength E of the base material satisfies: 200MPa≤E, optionally 350MPa≤E; (2) The thickness of the substrate is 10 μm-100 μm, optionally 20 μm-50 μm; (3) The material of the substrate includes at least one of copper foil, stainless steel and carbon fiber. 8. A method for preparing the adhesive tape according to any one of claims 1-7, characterized in that, comprising: Provide the substrate; An adhesion buffer layer is formed on at least one side of the substrate, and the loss factor G″/G′ of the adhesion buffer layer at 25° C. satisfies: 0.6≤G″/G′≤10; Wherein, G′ is the shear storage modulus of the adhesive buffer layer at 25°C, and G″ is the loss modulus of the adhesive buffer layer at 25°C. 9. A display module, comprising: a display panel; and, The adhesive tape according to any one of claims 1-7 or the adhesive tape prepared by the method described in claim 8, wherein the adhesive tape is bonded to one side of the display panel. 10. A display device, comprising the display module according to claim 9.

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