CN115985989B - A solar cell interconnection structure and a solar cell module - Google Patents
A solar cell interconnection structure and a solar cell module Download PDFInfo
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- CN115985989B CN115985989B CN202211678994.3A CN202211678994A CN115985989B CN 115985989 B CN115985989 B CN 115985989B CN 202211678994 A CN202211678994 A CN 202211678994A CN 115985989 B CN115985989 B CN 115985989B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The application discloses a solar cell interconnection structure and a solar cell module. The solar cell interconnection structure comprises a printed circuit board, at least one solar cell unit, an upper electrode and a lower electrode, wherein the printed circuit board comprises a substrate, the front surface of the substrate is provided with a conductive pattern, an interconnection pad and a conductive hole, the conductive pad is arranged on the back surface of the substrate and connected with the conductive pattern and the interconnection pad on the front surface of the substrate through a wire and the conductive hole, the lower electrode is connected with the conductive pattern on the printed circuit board, the upper electrode is connected with the interconnection pad on the printed circuit board, a group of solar cell units form a solar cell assembly through interconnection lines on the printed circuit board in series-parallel connection, and the conductive pad on the back surface of the substrate forms an external positive electrode and an external negative electrode of the group of solar cell assemblies. The solar cell interconnection structure and the solar cell module solve the problems of complicated process, low yield, poor reliability and the like of ultrathin and small-size solar cell interconnection packaging.
Description
Technical Field
The application relates to the technical field of solar photovoltaic power generation, in particular to a solar cell interconnection structure and a solar cell module.
Background
In recent years, as fossil energy sources such as petroleum, coal and the like are exhausted, environmental pollution pressure is severe, the traditional energy structure is changed, and development of renewable energy sources is an important strategic target for national green energy conversion. The solar energy is inexhaustible, and solar light energy is directly converted into electric energy by utilizing the photovoltaic effect of the solar cell module, so that the solar energy is the most ideal green energy at present.
The solar cell assembly is a device for converting solar energy into electric energy, and is generally manufactured by serially and parallelly connecting and packaging one or more solar cells (or called photovoltaic cells), most solar cells are currently connected in series by welding a welding strip on a front electrode and a back electrode of each cell, the welding temperature can generally reach 180-350 ℃, and the difference of thermal expansion coefficients of the welding strip and a cell material under the high temperature condition can cause stress concentration at the joint of the welding strip and the cell, so that hidden cracking or fragments of the cell occur in the serial connection process, and particularly, the problem is more serious in the packaging and interconnection process of the mobile energy assembly.
The mobile energy component is usually manufactured based on ultrathin and small-size solar battery packaging, the customization degree is high, the application scene is complex and changeable, the mobile energy component comprises fields of vehicle and ship application, mobile portable charging bags, wearable products, intelligent sensor power supply and the like, the application end provides higher requirements on the aspects of product attractiveness, consistency, reliability, weight density and the like, and the solar battery component in the application fields is difficult to ensure the component attractiveness, product consistency and long-term product reliability by adopting a traditional packaging interconnection mode.
Disclosure of Invention
Aiming at the problems in the prior art, the application provides a novel solar cell interconnection structure, which effectively solves the problems of complicated process, low yield, poor reliability and the like of ultrathin and small-size solar cell interconnection packaging.
A first aspect of the present application provides a solar cell interconnection structure, comprising:
the printed circuit board comprises a substrate, wherein the front surface of the substrate is provided with a conductive pattern, an interconnection pad and a conductive hole, the back surface of the substrate is provided with a conductive pad, and the conductive pad is connected with the conductive pattern and the interconnection pad on the front surface of the substrate through a wire and the conductive hole;
the solar cell unit comprises an upper electrode and a lower electrode, wherein the lower electrode of the solar cell is connected with a conductive pattern on the printed circuit board, and the upper electrode is connected with an interconnection bonding pad on the printed circuit board;
the solar battery units are connected in series and parallel through interconnection lines on the printed circuit board to form a solar battery assembly, and the conductive pads on the back of the substrate form external positive and negative electrodes of the solar battery assembly.
According to some embodiments of the application, the upper electrode of the solar cell unit is connected with the interconnection pad by a metal wire.
According to some embodiments of the application, the solar cell unit is attached to the conductive pattern of the printed circuit board through a conductive material, so that the lower electrode of the solar cell is in circuit connection with the conductive pattern of the printed circuit board.
According to some embodiments of the application, an interconnection pad on the printed circuit board connected to the upper electrode of one solar cell is connected to a conductive pattern corresponding to another solar cell to achieve a series connection of a plurality of cells.
According to some embodiments of the present application, a plurality of interconnection pads on the front side of the printed circuit board are electrically connected by wires and/or conductive vias, and a corresponding plurality of conductive patterns are electrically connected by wires and/or conductive vias, thereby achieving parallel connection of a plurality of battery cells.
According to some embodiments of the present application, a transparent insulating glue is provided at a portion between the front electrode of the solar cell and the interconnection pad, the transparent insulating glue covers the metal wire, and a width of the transparent insulating glue is greater than or equal to a width of the metal wire from the front electrode of the solar cell to the interconnection pad, and a height of the transparent insulating glue is greater than or equal to a wire arc height of the metal wire.
According to some embodiments of the application, a battery piece positioning frame or a positioning mark is arranged on the conductive pattern on the front side of the printed circuit board, and the solar battery is pasted according to the positioning frame or the positioning mark.
An embodiment of another aspect of the present application provides a solar cell module including:
the solar cell interconnection structure according to the first aspect, and
And the transparent packaging layer is arranged on one side of the solar battery units of the solar battery interconnection structure so as to package the plurality of solar battery units into an integral solar battery assembly.
According to some embodiments of the application, the transparent encapsulation layer comprises a transparent adhesive film coated on the entire printed circuit board on one side of the solar cell unit.
According to some embodiments of the application, the transparent adhesive film is one or more of epoxy adhesive, silica gel, EVA, POE, TPO, PVB.
According to some embodiments of the application, the transparent packaging layer further comprises a transparent cover plate disposed over the transparent adhesive film.
According to some embodiments of the application, the transparent cover plate is made of any one of glass, PMMA, PC, PET and polyurethane.
According to some embodiments of the application, the transparent encapsulation layer comprises a sealing adhesive applied to the perimeter of the printed circuit board and a transparent cover plate bonded to the printed circuit board by the sealing adhesive.
According to some embodiments of the application, the transparent cover plate and the solar cell are in a vacuum structure or filled with transparent glue or gas.
According to some embodiments of the application, the filling gas is air or an inert gas.
The solar cell interconnection structure and the solar cell module provided by the application effectively solve the reliability risks of hidden cracking, splitting, cold joint and the like in the solar cell interconnection process, and particularly solve the key problems of poor consistency, low productivity, low yield and the like in the small-size solar cell packaging process.
Drawings
Fig. 1 is a front view of a printed circuit board according to one embodiment of the present application.
Fig. 2 is a rear view of a printed circuit board according to one embodiment of the present application.
Fig. 3 is a plan view of a solar cell patch according to one embodiment of the present application.
Fig. 4 is a plan view of a solar cell interconnect structure according to one embodiment of the application.
Fig. 5 is a side view of a solar cell interconnect structure according to one embodiment of the application.
Fig. 6 is a side view of a solar cell interconnect structure according to one embodiment of the application.
Fig. 7 is a side view of a solar cell interconnect structure after ball placement according to one embodiment of the application.
Fig. 8 is a top view of a solar cell interconnect structure after application of an insulating paste according to one embodiment of the application.
Fig. 9 is a side view of a solar cell interconnect structure after application of an insulating paste according to one embodiment of the application.
Fig. 10 is a block diagram of a glue packaging assembly according to one embodiment of the application.
Fig. 11 is a block diagram of a laminated packaging laminate in accordance with one embodiment of the present application.
Fig. 12 is a side view of a laminate packaged solar cell module according to one embodiment of the application.
Fig. 13 is a structural side view of a lid package without filler according to one embodiment of the application.
Fig. 14 is a structural side view of a lid package with a filler according to one embodiment of the application.
Fig. 15 is a side view of a transparent adhesive material + cover plate package structure according to one embodiment of the application.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. In the drawings, the same or similar reference numerals are used for the same or similar functional components. Also, some components not directly related to the inventive concept may be omitted from illustration. The drawings and descriptions of specific embodiments are presented only to provide a better understanding of the application and the application is not limited to the embodiments illustrated in the drawings and described in the specification.
Technical or scientific terms used herein should be given the ordinary meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The use of the terms "comprising" or "includes" and the like in this specification is intended to be open-ended terms that do not exclude other elements, components, parts, or items than those explicitly listed. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed. "first," "second," etc. are used for the purpose of distinguishing between different elements and not necessarily for a specific order.
In one aspect, the present invention provides a novel solar cell interconnect structure, see fig. 1-9, comprising a printed circuit board 1, at least one solar cell unit 2 disposed on the printed circuit board 1. As shown in fig. 10 to 15, a plurality of solar cell units 2 may be connected into a solar cell module by interconnection lines on the printed circuit board 1. The printed circuit board 1 may be a single-layer board, a double-layer board or a multi-layer board, and the substrate material of the printed circuit board 1 may be any one of ceramic, aluminum, copper, alloy, FR4, FPC, epoxy resin and fiber board. The solar cell 2 may be any of crystalline silicon, a silicon thin film, copper indium gallium selenide, gallium arsenide, perovskite, dye sensitization, and perovskite stacked solar cells, and the solar cell 2 may be a rigid cell or a flexible cell.
Fig. 1 is a front view of a printed circuit board according to one embodiment of the present application. Fig. 2 is a rear view of a printed circuit board according to one embodiment of the present application. As shown in fig. 1-2, the printed circuit board 1 comprises a substrate 1-1, one or more conductive patterns 1-2, interconnection pads 1-3 and conductive holes 1-4 which are insulated from each other are arranged on the front surface of the substrate 1-1, and the conductive patterns 1-2 are formed by conductive layers. The back of the substrate 1-1 is provided with a conductive pad 1-5, and the conductive pad 1-5 is connected with the conductive pattern 1-2 and/or the interconnection pad 1-3 on the front of the substrate through a wire 1-6 and a conductive hole 1-4. The conductive patterns 1-2 may be arranged in a square, rectangle, triangle, circle, arc shape. The conductive layer, the interconnection pad and the surface plating layer of the conductive pad can be metallic copper, aluminum, gold, silver or alloy materials, and the thickness of the metallic plating layer is more than 10nm.
As shown in fig. 3 to 7, the solar cell unit 2 includes an upper metal electrode 2-1, a lower metal electrode 2-2. The front conductive pattern 1-2 of the printed circuit board 1 is connected with the lower electrode metal layer 2-2 of the solar cell 2, and the upper electrode 2-1 of the solar cell 2 is connected with the interconnection pad 1-3. The solar battery unit 2 can be attached to the conductive pattern 1-2 of the printed circuit board 1 through a conductive material, so that the lower metal electrode 2-2 of the solar battery 2 is in circuit connection with the conductive layer in the conductive pattern 1-2 of the printed circuit board through the conductive material, and the conductive material comprises silver paste, solder paste, conductive adhesive tape and the like. The front surface of the printed circuit board 1 can be provided with a battery piece positioning frame or a positioning mark, and the solar battery is attached according to the positioning frame or the positioning mark.
As shown in fig. 4-7, the upper electrode 2-1 of the solar cell unit 2 and the interconnection pad 1-3 may be connected by using a metal wire 3, the metal wire 3 may be made of gold wire, silver wire, aluminum wire, copper wire or alloy wire, the cross section of the metal wire 3 may be circular, elliptical, rectangular, square or other irregular shapes, and the interconnection shape of the metal wire 3 may be arc, pointed cone, straight line or wave.
In the welding process of the metal wire 3, the front electrode 2-1 of the solar cell 2 can be used as a1 st welding spot, the interconnection welding disc 1-3 can be used as a second welding spot, the first welding spot is welded before the second welding spot, as shown in fig. 5, or the interconnection welding disc 1-3 can be used as a first welding spot, the front electrode 2-1 of the solar cell is used as a second welding spot, and the first welding spot is welded before the second welding spot, as shown in fig. 6. According to the different welding sequences, different arc shapes of the interconnected metal wires can be formed so as to meet different use requirements.
In addition, in the welding process of the metal wire 3, in order to further improve the firmness of the bonding wire on the front electrode 2-1 or the interconnection pad 1-3 of the solar cell 2 and avoid damage such as cracking and hidden cracking to the solar cell 2 in the bonding wire process, before the interconnection metal wire 3 is welded, a gold ball 3-1 may be pre-planted at the bonding wire position of the front electrode 2-1 of the solar cell 2 and the bonding wire position of the interconnection pad 1-3, and then bonding wire is performed on the gold ball 3-1, so as to complete the metal wire welding between the front electrode 2-1 of the solar cell and the interconnection pad 1-3, as shown in fig. 7.
Fig. 1 to 9 schematically show the structure of two solar cells 2 interconnected by a printed circuit board 1. In practice, any number of solar cells can be connected in series and parallel through the interconnection lines on the printed circuit board according to the use requirement, so as to form solar cell modules with different output voltages. The anode and the cathode of the solar cell module are led out from the conductive bonding pads 1-5 on the back surface of the substrate, namely the conductive bonding pads 1-5 on the back surface of the substrate form external anode and cathode of the group of solar cell modules.
For example, referring to fig. 1, 4-7, the interconnection pad 1-3 on the printed circuit board 1 connected to the upper electrode 2-1 of one solar cell 2 is connected to the conductive pattern 1-2 corresponding to the other solar cell 2, realizing the series connection of the two cells. Or the plurality of interconnection pads 1-3 on the front surface of the printed circuit board 1 may be electrically connected through wires and/or conductive holes, and the corresponding plurality of conductive patterns 1-2 may be electrically connected through wires and/or conductive holes, so as to realize parallel connection of a plurality of battery cells. Therefore, the solar cell module can conveniently perform serial-parallel combination of single solar cells through designing the interconnection circuit on the printed circuit board to form the solar cell standard module meeting different output power requirements, and can realize batch production of the solar cell standard module, and finally, only the module is required to be cut.
According to some embodiments of the present invention, as shown in fig. 8 and 9, a transparent insulating paste 4 is coated on a portion between the front electrode 2-1 and the interconnection pad 1-3 of the solar cell 2, and the insulating paste 4 may be any one of epoxy paste, PSA, insulating tape, silicone gel, butyl rubber, and other thermosetting materials. The width of the transparent insulating glue 4 is larger than or equal to the length of the metal wire 3 between the front electrode 2-1 of the solar cell 2 and the interconnection bonding pad 1-3, and the height is larger than or equal to the wire arc height of the metal wire 3. The transparent insulating glue 4 can fix the metal wire 3 to prevent short circuit caused by collapse, and can protect the metal wire from damage in the subsequent battery assembly packaging process.
The novel interconnection structure provided by the invention realizes positive and negative connection of solar cells through the conductive substrate and the metal wire welding mode, effectively reduces welding operation on the cell in the interconnection process, can effectively avoid reliability risks such as cold joint, split, hidden crack and the like of the solar cells in the serial connection process, and simultaneously replaces process steps such as series welding, lamination and the like in the traditional solar cell packaging process by utilizing the novel interconnection structure.
On the other hand, the embodiment of the present invention provides a solar cell module, referring to fig. 10 to 15, showing examples of solar cell modules of different structures including a solar cell interconnection structure such as shown in fig. 3 to 9, and further including a transparent encapsulation layer provided at one side of the solar cell units 2 of the solar cell interconnection structure to encapsulate a plurality of solar cell units 2 into an integral solar cell module. The printed circuit board 1 plays a role of a back plate of the solar cell module and plays a role of circuit interconnection of the solar cell module.
In some embodiments, as shown in fig. 10, the transparent encapsulation layer includes a transparent adhesive film 5, and the transparent adhesive film 5 is coated on the entire printed circuit board on one side of the solar cell unit 2. The transparent adhesive film 5 may be, for example, an epoxy resin adhesive, a silica gel, or the like. The transparent adhesive film 5 encapsulates the solar cell unit 2 together with the metal wires 3 on the printed circuit board 1 to form an integral solar cell module. Optionally, in the case that the solar cell interconnection structure comprises the transparent insulating glue 4, a transparent encapsulation layer is applied on the printed circuit board 1, the solar cell 2, the insulating glue 4, and the metal interconnection wires 3, and the transparent encapsulation layer covers the entire printed circuit board, the solar cell, the insulating glue, and the metal interconnection wires to form a solar cell module.
In other embodiments, as shown in fig. 11, 12 and 15, the transparent encapsulation layer further includes a transparent cover plate 6 disposed over the transparent adhesive film 5. The material of the transparent cover plate 6 may be any one of glass, PMMA, PC, PET and polyurethane. The transparent cover plate 6 can better protect the solar cell module and improve the integrity of the solar cell module.
Or in other embodiments, as shown in fig. 13 and 14, the transparent packaging layer includes a sealing adhesive 9 and a transparent cover plate 6, where the sealing adhesive 9 is coated on the periphery of the printed circuit board 1, and the transparent cover plate 6 is adhered to the printed circuit board 1 by the sealing adhesive 9, so as to package the solar cell 2, the interconnection metal wire 3, the transparent insulating adhesive 4 and the like on the printed circuit board 1, and form an integral solar cell assembly. The space 10 between the transparent cover plate 6 and the solar cell 2 may be a vacuum structure or filled with transparent glue or gas. When filled with a gas, the gas may be air or an inert gas.
The solar cell module provided by the embodiment of the invention can conveniently carry out serial-parallel combination of single solar cells through designing the interconnection circuit on the printed circuit board to form the solar cell standard module meeting the requirements of different output powers, can realize batch production of the solar cell standard module, and finally only needs to cut the module, thereby effectively shortening the steps of solar cell interconnection and packaging process, improving the production efficiency, improving the product yield, further reducing the product cost, and solving the problems of complicated packaging procedure, low yield, poor reliability and the like of ultrathin and small-size solar cells.
The following describes the process of manufacturing the solar cell module in detail, taking the solar cell interconnection structure with different configurations and the solar cell module as an example.
Example 1
The embodiment provides a solar cell interconnection and assembly manufacturing method, which comprises the following steps:
(1) Providing one or more solar cells with upper and lower metal electrodes
The solar cell is any one of gallium arsenide, crystalline silicon, a silicon film, copper indium gallium selenide, perovskite and other types of solar cells, the solar cell comprises a front electrode, a semiconductor functional layer and a back metal electrode, the front electrode comprises a metal grid line or a metal electrode, the electrode material can be any one of gold, silver, copper, aluminum and other metal or alloy materials, the thickness is 10nm-5um, and the thickness of the solar cell is 1um-650um.
(2) Providing a piece of printed circuit board with conductive patterns
Referring to fig. 1-2, the printed circuit board 1 comprises a substrate 1-1, on which a conductive pattern 1-2, an interconnection pad 1-3, a conductive hole 1-4, a wire 1-6, and an insulating coating are disposed, the back of the printed circuit board comprises a conductive pad 1-5 for leading out positive and negative electrodes of a solar cell module, the back conductive pad 1-5 is connected with the front conductive pattern 1-2 or the conductive pad 1-3 through the wire 1-6 and the conductive hole 1-4, the thickness of the printed circuit board substrate is 50-5000um, and the back conductive pad of the printed circuit board comprises "+", "-" electrode marks.
The printed circuit board can be a single-layer board, a double-layer board or a multi-layer board, and the printed circuit board can be any one of ceramic, aluminum, copper, alloy, FR4, FPC, epoxy resin and a fiber board.
The conductive patterns can be square, rectangle, triangle, circle, arc and other shapes, and can be formed by one or more of the shapes, and the surface plating layers of the conductive patterns and the conductive pads can be copper, aluminum, gold, silver and other metal or alloy materials, and the thickness of the metal plating layers is more than 10nm.
(3) Solar cell patch
The front conductive pattern 1-2 of the printed circuit board 1 is coated with conductive adhesive, so that the conductive adhesive is uniformly coated on the printed circuit board pattern 1-2, the conductive adhesive can be in a dot shape, a linear shape or a graph shape and coated on the conductive pattern 1-2 of the printed circuit board 1, the thickness of the conductive adhesive can be 1-200um, the solar cell piece is attached to the conductive pattern 1-2 coated with the conductive adhesive according to the solar cell patch positioning frame pattern on the printed circuit board 1, or the patch is carried out through a set positioning mark, and the positioning mark can be in a dot, line and other marking mode, as shown in fig. 3. And curing the conductive adhesive in a high-temperature mode to enable the solar cell 2 and the conductive pattern 1-2 of the printed circuit board 1 to form good ohmic contact, wherein the curing temperature is 80-200 ℃ and the curing time is 10-240 minutes. The conductive adhesive can be any one of silver adhesive, solder paste and conductive adhesive tape. Preferably, when the solar upper and lower metal electrode materials are active metal materials such as silver, copper and the like, gas protection is applied in the curing process to prevent oxidation.
(4) Solar cell interconnection
As shown in fig. 3-7, the back electrode 2-2 of a solar cell 1 is connected with the front conductive pattern 1-2 of the printed circuit board 1 through conductive glue, and the front conductive pattern 1-2 of the printed circuit board 1 is connected with the back conductive bonding pad 1-5 of the printed circuit board 1 through a wire and a conductive hole, namely, the back electrode 2-2 of the solar cell 1 is led out from the back conductive bonding pad 1-5 of the printed circuit board 1;
The front electrode 2-1 of the first solar cell 2 is connected with the interconnection pad (pad) 1-3 (usually, negative electrode) through the metal wire 3, and the interconnection pad 1-3 is connected with the conductive pattern 2 corresponding to the other solar cell 2, namely, the front electrode 2-1 of the first solar cell 2 is connected with the back electrode 2-2 of the other solar cell 2 through the metal wire 3, the interconnection pad 1-3 and the conductive pattern 1-2;
The front electrode 2-1 of the second solar cell 2 is connected with the interconnection bonding pad 1-3 on the other side of the conductive pattern 1-2 through the metal wire 3, and the interconnection bonding pad 1-3 can be connected with the conductive pattern 1-2 of the 3 rd solar cell, namely, the connection of the front electrode 2-1 of the second solar cell 2 with the back electrode of the 3 rd solar cell through the metal wire 3, the interconnection bonding pad 1-3 and the conductive pattern 1-2 is realized. Therefore, the interconnection of the solar cells 2 can be realized by utilizing the printed circuit board 1 and the metal wire 3, and the serial connection of n solar cells can be realized by analogy;
The nth interconnection pad is connected with the conductive pad 1-5 on the back side of the printed circuit board 1 through a wire and a conductive hole 1-4, and the front electrode of the nth solar cell is led out to the conductive pad 1-5 on the back side of the printed circuit board 1 through the nth interconnection pad, the conductive hole and the wire, so that the series connection of the n solar cells is completed.
The interconnection mode can realize the series-parallel connection effect of the batteries, and a plurality of interconnection bonding pads 1-3 on the front side of the printed circuit board 1 are electrically connected with the conductive bonding pads 1-5 on the back side of the printed circuit board 1 through wires and conductive holes 1-4, and a corresponding plurality of conductive patterns 1-2 are mutually connected with the conductive bonding pads 1-3 of the printed circuit board 1 through wires and conductive holes 1-4.
By analogy, the parallel connection of m solar cell strings can be realized.
In the solar cell interconnection process, the metal wire connected with the front electrode of the solar cell and the interconnection bonding pad is realized in a ball welding mode, a metal wire ball welding machine (wire bonding machine) is utilized for welding the metal wire between the front electrode of the solar cell and the interconnection bonding pad, the temperature range of the bottom plate is 50-250 ℃ during welding, the welding time range is 1-100ms, the metal interconnection wire takes gold wires as an example, aluminum wires, copper wires and other alloy wires, the shape of the metal interconnection wire is circular, elliptic and square, the shape of the metal interconnection wire can be arc-shaped, and the wire arc height is 50-500um.
In the welding process, the front electrode 2-1 of the solar cell 2 is used as a1 st welding spot, the interconnection welding disc 1-3 is used as a second welding spot, the first welding spot is welded before the second welding spot, as shown in fig. 5, or the interconnection welding disc 1-3 is used as a first welding spot, the front electrode 2-1 of the solar cell 2 is used as a second welding spot, and the first welding spot is welded before the second welding spot, as shown in fig. 6. Different arc shapes of the welding lines can be formed according to different welding sequences so as to meet different use requirements.
In the above-mentioned wire bonding process, in order to further improve the firmness of the front electrode or the interconnection pad of the solar cell and avoid damage such as cracking and hidden cracking to the solar cell in the wire bonding process, before the interconnection wire is bonded, the gold ball 3-1 may be pre-planted at the wire bonding position of the front electrode 2-1 of the solar cell 2 and the interconnection pad bonding position, and then the wire bonding is performed on the gold ball 3-1, so as to complete the bonding of the metal wire 3 between the front electrode 2-1 of the solar cell 2 and the interconnection pad 1-3, as shown in fig. 7.
(5) Glue-coated package
And (3) carrying out gluing packaging on the printed circuit board 1 and the solar cell 2 which are interconnected in the step (4), wherein the printed circuit board 1 is used as a backboard of the solar cell module, the packaging mode is to uniformly coat a layer of transparent protective glue 5 on the surfaces of the cell and the printed circuit board by adopting gluing equipment, the protective glue 5 can be epoxy resin glue, silica gel or other types of transparent glue, and the gluing thickness is 50um-5mm.
The epoxy resin glue has self-leveling capability, and after the epoxy glue with fixed capacity is injected, the glue rapidly covers the whole printed circuit board and the solar cell, and the epoxy resin glue passes through the interconnection metal wire 3 between the front electrode 2-1 of the solar cell 2 and the interconnection bonding pad 1-3. The viscosity range of the epoxy resin adhesive is 100-70000 Pa.s/25 ℃, the density is 0.9-1.5g/cm < 3 >, and the light transmittance is 70% -99%.
(6) Curing of the encapsulant
And (3) curing the sample subjected to glue coating encapsulation in the step (5) to integrate the epoxy resin, the printed circuit board (1) and the solar cell (2) to form a solar cell module, wherein the printed circuit board (1) is used as a back stop of the solar cell module, and the epoxy resin glue is used as a front stop of the solar cell module. The packaging adhesive is cured in one of normal temperature curing, heating curing and UV light curing, wherein the normal temperature curing time is 1-72 hours, the heating curing time is 10-480 minutes, the heating curing temperature is 50-180 ℃, the wavelength of the UV light curing light is 355nm, and the UV light intensity is 1-300W/m < 2 >.
(7) After curing in step 6, a solar cell module is obtained as shown in fig. 10.
Example 2
The difference between this embodiment and embodiment 1 is that in step 5, the printed circuit board and the solar cell which are interconnected in step 4 are encapsulated by using a lamination encapsulation method, wherein the lamination encapsulation method is to encapsulate and protect the cell and the interconnection line by using the printed circuit board 1 as a back plate, a transparent polymer material as a glue film and a front rail by using a laminator. The laminated packaging comprises the following specific steps:
(1) Firstly, transparent insulating glue 4 is coated on the part between the front electrode 2-1 of the solar cell 1 and the interconnection bonding pad 1-3, as shown in fig. 8, the insulating glue 4 can be any one of epoxy resin glue, PSA, insulating tape, silica gel, butyl rubber and other materials, the width of the insulating glue 4 is greater than or equal to the width of the metal wire 3 from the front electrode 2-1 of the solar cell 2 to the interconnection bonding pad 1-3, and the height is greater than or equal to the height of the metal wire 3 so as to completely cover the metal wire 3, as shown in the side view of fig. 9.
(2) The packaging material is laid to form a laminate, and the laminate is sequentially provided with a support carrier plate 8, a tetrafluoro cloth 7, the printed circuit board 1 and the solar cell 2 which are interconnected, a transparent packaging adhesive film 5, a transparent front rail 6 and the tetrafluoro cloth 7 from bottom to top, as shown in fig. 11.
The supporting carrier plate 8 can be an epoxy resin plate, glass, a steel plate and the like with the thickness of 1-5mm and used for lamination and supporting of a laminated material, the transparent packaging adhesive film 5 material comprises at least one of EVA polyethylene-polyvinyl acetate copolymer, POE (polyolefin elastomer), TPO (polyolefin thermoplastic elastomer) and PVB (polyvinyl butyral Ding Quanzhi), the thickness is 10-1140um, the transmittance is more than 85% in the light wavelength range of 350-1200nm, the transparent front rail comprises at least one of glass, ETFE, PET, PMMA and the like, the material thickness is 10-5000um, and the transmittance is more than 85% in the light wavelength range of 350 nm.
(3) Laminating the laminate in a laminator
The laminated material is placed into a laminating machine by taking a support carrier plate 8 as a support, and the laminating process comprises the steps of closing an upper cover of the laminating machine, heating the laminated material, controlling the temperature to be 100-160 ℃, vacuumizing an upper vacuum chamber and a lower vacuum chamber for 10S-1000S, inflating the upper vacuum, keeping the lower vacuum chamber in a vacuum state, keeping the pressure difference of 10-90KPa between the upper vacuum chamber and the lower vacuum chamber for 100-3600S, vacuumizing the upper vacuum chamber, inflating the lower vacuum chamber to atmospheric pressure, opening the upper cover of the laminating machine, and taking out the assembly to finish the lamination of the assembly.
(4) The assembly is removed from the support carrier plate 8 to obtain a solar cell assembly, as shown in fig. 12.
Example 3
The present embodiment is different from embodiments 1 and 2 in that the printed circuit board 1 and the solar cell 2 which are interconnected in step 4 are encapsulated by means of the transparent cover plate 6 in step 5. The transparent cover plate 7 is packaged by the following specific steps:
(1) After the step 4 of the embodiment is completed, a layer of sealing adhesive glue 9 is coated on the periphery of the printed circuit board 1 along the edge of the printed circuit board 1, wherein the sealing adhesive glue 9 can be any one of materials with sealing and adhesive functions such as silica gel, epoxy resin glue, butyl glue and adhesive tape, the sealing adhesive glue 9 can be transparent or can be of other colors, the thickness of the sealing adhesive glue 9 is larger than the height of a line arc between the front electrode of the solar cell 2 and the interconnection metal wire 3 of the interconnection bonding pad on the printed circuit board 1, the width of the sealing adhesive glue 9 can be from 0.1mm to any width of the edge of the solar cell, and the solar cell cannot be covered;
(2) A transparent cover plate 6 is stuck on the sample coated with the sealing adhesive 9, so that the edge sealing adhesive material is tightly stuck to the transparent cover plate 6, the material of the transparent cover plate 6 can be any one of materials such as glass, PMMA, PC and the like, the thickness of the material is 50-3200um, the space 10 between the transparent cover plate 6 and the solar cell 2 can be hollowed out, namely vacuum is formed, and meanwhile, gas, preferably inert gas or air can be filled according to actual requirements, as shown in fig. 13, transparent adhesive materials can also be filled, as shown in fig. 14, and the transparent adhesive materials can be any one of silica gel, epoxy resin, silicon rubber and other transparent adhesive materials;
(3) Curing the edge sealant 9 or the filling glue to form a solar cell module;
Example 4
The difference between this embodiment and embodiment 3 is that, when the printed circuit board 1 and the solar cell 2 which are interconnected in step 4 are packaged by adopting the transparent cover plate 6 in step 5, transparent adhesive material 5 is coated on the surfaces of the printed circuit board 1, the solar cell 2 and the interconnection metal wire 3, and the thickness of the transparent adhesive material 5 is higher than the arc height of the interconnection metal wire of the front electrode and the interconnection pad of the solar cell on the printed circuit board;
And (3) attaching a layer of transparent cover plate 6 to the sample coated with the transparent adhesive material 5, so that the transparent cover plate 6 is completely attached to the transparent adhesive material 5, wherein the transparent cover plate 6 can be made of any one of glass, PMMA, PC and the like, and the thickness of the material is 50-3200um, as shown in figure 15.
The transparent adhesive material 5 is cured to form a solar cell module.
The foregoing embodiments are merely illustrative of the principles and configurations of the present application, and are not intended to be limiting, it will be appreciated by those skilled in the art that any changes and modifications may be made without departing from the general inventive concept. The protection scope of the present application should be defined as the scope of the claims of the present application.
Claims (11)
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| KR20110021472A (en) * | 2009-08-26 | 2011-03-04 | 광전자 주식회사 | Solar cell module manufacturing method |
| KR20130006562A (en) * | 2011-07-09 | 2013-01-17 | 민 선 김 | High density solar module by bonding cavity and method of manufacturing the same |
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| KR20130006562A (en) * | 2011-07-09 | 2013-01-17 | 민 선 김 | High density solar module by bonding cavity and method of manufacturing the same |
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