CN115975316A - Fluorine-containing resin matrix composite material and application thereof - Google Patents
Fluorine-containing resin matrix composite material and application thereof Download PDFInfo
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/00—Layered products comprising a layer of synthetic resin
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- B32B27/00—Layered products comprising a layer of synthetic resin
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- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
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Abstract
The invention provides a fluorine-containing resin matrix composite material and application thereof. The fluorine-containing resin-based composite material comprises the following raw materials in parts by weight: 45-65 parts of fluorine-containing polymer, 20-65 parts of heat conducting particles A and 1-5 parts of heat conducting particles B; the heat conducting particles A comprise boron nitride and silicon nitride; the heat conducting particles B are titanium dioxide particles. The fluorine-containing resin-based composite material provided by the invention has good heat dissipation and dielectric properties, higher peel strength and lower production cost, and can meet the use requirements of people on a high-frequency high-heat-conductivity copper-clad plate.
Description
Technical Field
The invention belongs to the technical field of copper-clad plate materials, and particularly relates to a fluorine-containing resin-based composite material and application thereof.
Background
Due to the pursuit of intelligent life, the performance requirements of people on electronic equipment used in life are getting higher and higher, so that the digital circuit gradually shows the characteristics of high speed of information processing and high frequency of signal transmission, that is, the frequency of signals on the PCB is getting higher, and at this time, people pay attention to how to reduce the loss and delay of signals in the transmission process on the PCB. Compared with the common copper-clad plate, the high-frequency and high-speed copper-clad plate can effectively solve the problems of unstable signal transmission performance, large loss and the like in the communication process. The fluorine-containing resin represented by Polytetrafluoroethylene (PTFE) is obtained from a plurality of polymer resins by virtue of the advantages of low dielectric constant and low dielectric loss, and becomes an ideal matrix material for preparing the high-frequency copper-clad plate.
With the rapid development of communication equipment such as a 5G technology, radar, beidou satellite and the like, people have more and more requirements on high-performance high-frequency copper-clad plates, and especially in equipment such as GPS receivers, power amplifiers, low-noise amplifiers, airplane anti-collision systems and the like, the requirements on the heat dissipation performance and the dielectric loss of the copper-clad plates are higher. In order to meet these requirements, researchers have generally achieved the improvement of the poor intrinsic thermal conductivity of the resin by incorporating functional fillers into the fluororesin-containing matrix. At present, boron Nitride (BN) is used as a heat-conducting filler and applied to resin with a good effect, but due to the sheet structure of the boron nitride, the heat conductivity of the material can be obviously improved by adding a large amount of boron nitride, but the peel strength brought by the resin matrix as a copper-clad plate dielectric layer can be obviously reduced, and the manufacturing cost is improved.
Therefore, how to provide a fluorine-containing resin-based composite material which has good heat dissipation and dielectric properties, has high peel strength, and is more economical has become a technical problem to be solved at present.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a fluorine-containing resin-based composite material and application thereof. According to the invention, by designing the composition of the fluorine-containing resin-based composite material and further by the cooperation of various heat-conducting particles, the prepared fluorine-containing resin-based composite material has good heat dissipation and dielectric properties, and has high peel strength, meanwhile, the production cost is reduced, and the use requirements of people on the high-frequency high-heat-conducting copper-clad plate can be met.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a fluorine-containing resin-based composite material, which comprises the following raw materials in parts by weight:
45-65 parts of fluorine-containing polymer, 20-65 parts of heat conducting particles A and 1-5 parts of heat conducting particles B;
the thermally conductive particles A include Boron Nitride (BN) and silicon nitride (Si) 3 N 4 )；
The heat conducting particles B are titanium dioxide particles.
According to the invention, by designing the composition of the fluorine-containing resin matrix composite material and further by the cooperation of various heat-conducting particles, the fluorine-containing resin matrix composite material with good heat dissipation and dielectric property and high peel strength can be prepared under the condition of low consumption of boron nitride, the production cost of the fluorine-containing resin matrix composite material is reduced, the use requirements of people on high-frequency high-heat-conducting copper clad plates are met, and the requirement of industrial production of the fluorine-containing resin matrix composite material is also met.
In the invention, the weight parts of the fluorine-containing polymer in the raw materials for preparing the fluorine-containing resin-based composite material can be 45 parts, 48 parts, 50 parts, 52 parts, 55 parts, 57 parts, 60 parts, 63 parts or 65 parts and the like.
The weight portion of the heat conducting particle A can be 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, 60 parts or 65 parts, and the like, and it is particularly noted that in order to obtain ideal heat conducting performance, the weight portion of the heat conducting particle A is not too low, and in order to balance the heat conducting performance and the peeling strength well, the weight portion of the heat conducting particle A is not too high.
The weight portion of the heat-conducting particles B can be 1 portion, 1.5 portions, 2 portions, 2.5 portions, 3 portions, 3.5 portions, 4 portions, 4.5 portions or 5 portions, and the like, the weight portion of the heat-conducting particles B is directly related to the dielectric property of the composite material, the dielectric constant can be increased when the weight portion of the heat-conducting particles B is too high, and meanwhile, the weight portion of the heat-conducting particles B can not be too low in order to optimize the heat-conducting property of the material to a certain extent. According to the invention, the fluorine-containing resin-based composite material with good heat conductivity and dielectric property is prepared by controlling the weight part of the heat-conducting particles B within a specific range.
The following is a preferred technical solution of the present invention, but not a limitation to the technical solution provided by the present invention, and the object and advantageous effects of the present invention can be better achieved and achieved by the following preferred technical solution.
As a preferred embodiment of the present invention, the fluoropolymer is selected from any one or a combination of at least two of polychlorotrifluoroethylene, poly (chlorotrifluoroethylene-propylene), poly (ethylene-tetrafluoroethylene), poly (ethylene-chlorotrifluoroethylene), polyhexafluoropropylene, polytetrafluoroethylene, poly (tetrafluoroethylene-ethylene-propylene), poly (tetrafluoroethylene-hexafluoropropylene), poly (tetrafluoroethylene-propylene), poly (tetrafluoroethylene-perfluoropropylene vinyl ether), a copolymer having a tetrafluoroethylene main chain and a fully fluorinated alkoxy side chain, polyvinyl fluoride, polyvinylidene fluoride, poly (vinylidene fluoride-chlorotrifluoroethylene), perfluoropolyether, perfluorosulfonic acid, perfluoropolyoxycyclobutane, and preferably polytetrafluoroethylene poly (tetrafluoroethylene-perfluoropropylene vinyl ether).
Preferably, the fluoropolymer is derived from a fluoropolymer emulsion having a solids content of 40% to 60%, and may be, for example, 40%, 42%, 44%, 46%, 48%, 50%, 52%, 54%, 56%, 58%, or 60%, etc. The method for calculating the parts by weight of the fluorine-containing polymer comprises the following steps: fluoropolymer emulsion weight parts solids content.
As a preferred technical scheme of the invention, D of the heat conducting particles A 50 The particle size is 2 μm to 50 μm, and may be, for example, 2 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm or 50 μm.
In a preferred embodiment of the present invention, the weight part of boron nitride in the thermally conductive particles a is 5 to 25 parts, and may be, for example, 5 parts, 7 parts, 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, or the like.
Preferably, the boron nitride is a hexagonal boron nitride sheet.
Preferably, the weight portion of the silicon nitride in the thermally conductive particle a is 15 to 40 portions, such as 15 portions, 18 portions, 20 portions, 24 portions, 27 portions, 30 portions, 33 portions, 36 portions, or 40 portions.
Preferably, the silicon nitride is an irregularly shaped particle having a plurality of flat surfaces.
For the two fillers in the heat conducting particles A, the boron nitride has outstanding heat conducting performance, but the flaky shape of the boron nitride has obvious negative influence on the peeling strength of the copper-clad plate, and the boron nitride mainly plays a role in connecting a heat conducting path in the composite material and plays a key role in the high heat conducting performance of the material; in order to balance the heat conduction performance and the peeling strength, silicon nitride with the heat conduction performance slightly lower than that of boron nitride is introduced, although the heat conduction performance of the silicon nitride is not enough to play a main role in the composite material, the negative effect of the angular shape on the peeling strength is extremely small, and the boron nitride and the silicon nitride are compounded according to a certain proportion for use, so that the heat conduction performance and the peeling strength of the material can be balanced more easily.
As a preferred embodiment of the present invention, the titanium dioxide particles comprise rutile titanium dioxide particles.
Preferably, the titanium dioxide particles are spherical particles.
As a preferred embodiment of the present invention, D is the content of the titanium dioxide particles 50 The particle size is 1 to 50 μm, and may be, for example, 1 to 15 μm, 5 to 25 μm, 30 to 35 μm, 40 to 45 μm or 50 μm.
It should be noted that the particle sizes of various heat-conducting fillers in the present invention can be obtained by a malvern 3000 laser particle size analyzer.
In a preferred embodiment of the present invention, the raw material for preparing the fluorine-containing resin-based composite material further comprises 1 to 40 parts (for example, 1 part, 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, or the like), preferably 5 to 35 parts, of silica particles.
Preferably, the silica particles are spherical particles.
Preferably, D of said silica particles 50 The particle size is 1 to 50 μm, and may be, for example, 1 to 15 μm, 5 to 25 μm, 30 to 35 μm, 40 to 45 μm or 50 μm.
In the invention, the boron nitride, the silicon nitride, the titanium dioxide and the silicon dioxide are further used in a matching way, and the content of the boron nitride, the silicon nitride, the titanium dioxide and the silicon dioxide is designed to be within a specific range, so that the thermal conductivity and the peel strength of the fluorine-containing resin-based composite material can be further improved, the dielectric loss of the fluorine-containing resin-based composite material is reduced, and meanwhile, the production cost of the fluorine-containing resin-based composite material is reduced by reducing the usage amount of the boron nitride, so that the fluorine-containing resin-based composite material has better economy.
The thermally conductive particles a are selected from unmodified thermally conductive particles a or surface-modified thermally conductive particles a; the heat conducting particles B are selected from unmodified heat conducting particles B or surface modified heat conducting particles B. In the present invention, there is no particular limitation on the surface-modified thermally conductive particles a and the surface-modified thermally conductive particles B, and the surface-modified thermally conductive particles a and the surface-modified thermally conductive particles B that are generally used in the art are applicable.
As a preferable technical scheme of the invention, the raw materials for preparing the fluorine-containing resin-based composite material further comprise an auxiliary agent and a solvent, wherein the auxiliary agent comprises at least one of a thickening agent and a dispersing agent.
It should be noted that, in the present invention, there is no particular limitation on the kinds of the thickener and the dispersant, and the thickener and the dispersant commonly used in the art are applicable, and exemplarily, the thickener includes polyoxyethylene distyrylated phenyl ether. The amounts of thickener and dispersant added can be selected according to the experience of the person skilled in the art and the process requirements.
Meanwhile, the raw materials for preparing the fluorine-containing resin-based composite material claimed by the present invention further include a solvent, the specific choice of the solvent in the present invention is not limited at all, and the solvents commonly used in the art are all suitable, and exemplary include but are not limited to: deionized water. The solvent can be added according to the process requirements, and after the solvent is added, the obtained resin mixture has the appropriate viscosity, so that the fluorine-containing resin-based resin composition can be conveniently impregnated, coated and used. In the subsequent links of drying, sintering and the like, the auxiliary agents such as the thickening agent, the dispersing agent and the like and the solvent can be partially or completely volatilized.
In a second aspect, the present invention provides a fluorine resin-based resin film comprising the fluorine resin-based composite material according to the first aspect.
Preferably, the fluorine resin-based resin film is prepared by coating the fluorine resin-based composite material according to the first aspect on a release material and drying and/or sintering;
it should be noted that there is no particular limitation on the choice of the release material in the present invention, and release materials commonly used in the art are applicable, and exemplary ones include, but are not limited to: a polyimide film.
In a preferred embodiment of the present invention, the sintering temperature is 200 to 400 ℃, and may be, for example, 200 ℃, 220 ℃, 240 ℃, 260 ℃, 280 ℃, 300 ℃, 320 ℃, 340 ℃, 360 ℃, 380 ℃ or 400 ℃.
Preferably, the sintering time is 0.1h to 10h, and may be, for example, 0.1h, 0.5h, 1h, 2h, 3h, 4h, 5h, 6h, 7h, 8h, 9h, 10h, or the like.
Preferably, the sintering process further comprises a post-treatment step.
Preferably, the post-treatment method comprises removing the release material.
In a third aspect, the present invention provides a fluorine-containing resin-based prepreg comprising a reinforcing material, and a fluorine-containing resin-based composite material according to the first aspect attached to the reinforcing material by impregnation.
In a fourth aspect, the invention provides a copper-clad plate, which comprises a copper foil and a dielectric layer;
the material of the dielectric layer comprises a fluorine-containing resin-based composite material as described in the first aspect.
In the invention, the copper-clad plate is prepared by the following method, and the method comprises the following steps: and (2) overlapping the copper foil and the fluorine-containing resin-based composite material in the first aspect, and laminating for 2-12 h at the temperature of 200-400 ℃ and the pressure of 300-500 PSI to obtain the copper-clad plate.
Wherein the laminating temperature may be 200 deg.C, 220 deg.C, 240 deg.C, 260 deg.C, 280 deg.C, 300 deg.C, 320 deg.C, 340 deg.C, 360 deg.C, 380 deg.C or 400 deg.C.
The lamination pressure may be 300PSI, 320PSI, 340PSI, 360PSI, 380PSI, 400PSI, 420PSI, 440PSI, 460PSI, 480PSI, 500PSI, or the like.
The time for lamination may be 0.1h, 0.5h, 1h, 2h, 3h, 4h, 5h, 6h, 7h, 8h, 9h, or 10h, etc.
Compared with the prior art, the invention has the following beneficial effects:
the fluorine-containing resin-based composite material with excellent comprehensive performance can be prepared by designing the components of the fluorine-containing resin-based resin composite material and further by the cooperation of various heat conducting particles under the condition of low boron nitride consumption, the prepared copper-clad plate has good heat dissipation and dielectric property and high peel strength, the production cost is reduced, and the use requirements of people on the high-frequency high-heat-conducting copper-clad plate can be met, the heat conductivity coefficient is 1.20-1.60W/(m.K), the dielectric constant Dk at 10GHz is 3.3-3.67, the dielectric loss Df is less than or equal to 0.0006, specifically 0.00042-0.00057, and the peel strength is 0.70-0.90N/mm.
Detailed Description
For the purpose of facilitating an understanding of the present invention, the present invention will now be described by way of examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Some of the component sources in the examples and comparative examples are as follows:
polytetrafluoroethylene emulsion: japan Dajin, D210C, particle size 0.25 μm, solid content 55%;
poly (tetrafluoroethylene-perfluoropropylene vinyl ether) emulsion: sichuan morning light, PFA-E50, particle size 100nm, solid content 50%;
boron nitride: anodon Xinyuan, brand: JYBN-0100, D 50 The grain diameter is 10 mu m; mai chart, brand: CF-500, D 50 The grain diameter is 5 mu m;
silicon nitride: wanshuai chemical products limited in south of the river, brand: SF96, D 50 The grain diameter is 3 mu m;
titanium dioxide: after the surface modification treatment of methacrylic acid silane, the wu luo ao electron, brand: T-RS-3-XF, D 50 The grain diameter is 20 mu m; shandong China porcelain, brand: QTO-15, D 50 The grain diameter is 15 mu m;
silicon dioxide: american 3M company, brand: IM30K, D 50 The grain diameter is 10 mu m;
thickening agent: polyoxyethylene distyrylated phenyl ether, available from EMULGEN A-60 of Kao corporation.
In the following examples and comparative examples, polytetrafluoroethylene is derived from a polytetrafluoroethylene emulsion, poly (tetrafluoroethylene-perfluoropropylene vinyl ether) is derived from a poly (tetrafluoroethylene-perfluoropropylene vinyl ether) emulsion, and the weight part of polytetrafluoroethylene = weight part of polytetrafluoroethylene emulsion × solid content (55%), and the weight part of poly (tetrafluoroethylene-perfluoropropylene vinyl ether) = weight part of poly (tetrafluoroethylene-perfluoropropylene vinyl ether) × solid content (50%). Taking the data of example 1 as an example, if the raw material for preparing the fluorine-containing resin-based dielectric layer in example 1 comprises 38 parts by weight of polytetrafluoroethylene and 7 parts by weight of poly (tetrafluoroethylene-perfluoropropylene vinyl ether), the weight part of polytetrafluoroethylene emulsion = weight part of polytetrafluoroethylene ÷ solid content (55%) =38 ÷ 55% =69.1 parts by weight, and the weight part of poly (tetrafluoroethylene-perfluoropropylene vinyl ether) emulsion = weight part of poly (tetrafluoroethylene-perfluoropropylene vinyl ether) = solid content (50%) =7 ÷ 55% =14 parts by weight is required. Similarly, the conversion method of the polytetrafluoroethylene and poly (tetrafluoroethylene-perfluoropropylene vinyl ether) to the polytetrafluoroethylene emulsion and poly (tetrafluoroethylene-perfluoropropylene vinyl ether) emulsion in the other examples and comparative examples was the same as above.
Example 1
The embodiment provides a fluorine-containing resin matrix composite material and a preparation method thereof, wherein the preparation raw materials of the fluorine-containing resin matrix composite material comprise the following components in parts by weight:
38 parts of polytetrafluoroethylene, 7 parts of poly (tetrafluoroethylene-perfluoropropylene vinyl ether), 20 parts of Unionidae Xinyuan JYBN-0100 type boron nitride, 18 parts of silicon nitride, 2 parts of Shandong China QTO-15 type titanium dioxide and 15 parts of silicon dioxide.
The preparation method of the fluorine-containing resin-based composite material comprises the following steps:
(1) Dispersing the components in deionized water, adding a proper amount of thickening agent, and stirring at high speed for 20min until the components are uniformly mixed to obtain a resin mixture with the viscosity of 220mPa & s;
(2) And (2) coating the resin mixture obtained in the step (1) on one side of a polyimide film, placing the polyimide film in a vacuum oven at 50 ℃, baking for 20min to remove water, then sintering for 20min at 365 ℃, removing a thickening agent, simultaneously melting and leveling the fluorine-containing polymer (polytetrafluoroethylene and poly (tetrafluoroethylene-perfluoropropylene vinyl ether)), cooling, and stripping the polyimide film to obtain the fluorine-containing resin-based composite material with the thickness of 129 microns.
Examples 2 to 10 and comparative examples 1 to 4
Examples 2 to 10 and comparative examples 1 to 4 respectively provide a fluorine-containing resin-based composite material and a preparation method thereof, wherein the raw materials and the content of the fluorine-containing resin-based composite material are shown in table 1 in detail, the contents of the components in table 1 are in parts by weight, and the preparation method of the fluorine-containing resin-based composite material is the same as that of example 1. The boron nitride used in examples 2 and 5 was CF-500 type boron nitride from Mayer corporation, and the titanium dioxide was Titanaode T-RS-3-XF type titanium dioxide, and the boron nitride and titanium dioxide used in the other examples were the same as those used in example 1.
TABLE 1
Application example 1
The application example provides a copper-clad plate and a preparation method thereof, wherein the preparation method of the copper-clad plate comprises the following steps:
two pieces of the 129-micrometer-thick fluorine-containing resin-based composite material provided in the embodiment 1 are laminated to obtain a dielectric layer, the size of the dielectric layer is 250mm multiplied by 250mm, copper foils with the thickness of 0.5OZ are covered on the upper surface and the lower surface of the laminated dielectric layer, and the copper clad plate with the thickness of the intermediate dielectric layer being 0.254mm is obtained by laminating for 60min at the temperature of 380 ℃ and the pressure of 400 PSI.
Application examples 2 to 10
Application examples 2 to 10 sequentially provide a copper-clad plate and a preparation method thereof, and the difference from the application example 1 is only that the 129 μm fluorine-containing resin matrix composite material provided in the application example 1 is sequentially replaced by the 129 μm fluorine-containing resin matrix composite material provided in the embodiments 2 to 10, and other conditions are the same as those in the application example 1.
Comparative application examples 1 to 4
Comparative application examples 1-4 sequentially provide a copper-clad plate and a preparation method thereof, and the difference from the application example 1 is only that the 129 μm thick fluorine-containing resin-based composite material provided by the embodiment 1 in the application example 1 is sequentially replaced by the 129 μm thick fluorine-containing resin-based composite material provided by the comparative examples 1-4, and other conditions are the same as those in the application example 1.
And testing the performance of the copper-clad plate provided by the application example and the comparative application example, wherein the specific test method comprises the following steps:
(1) Dielectric constant Dk and dielectric loss Df: testing by adopting an SPDR (Split Post Electrical Resonator) method under the conditions of A state and 10GHz frequency;
(2) Coefficient of thermal conductivity: testing is carried out by adopting the method of ASTM D5470-2017;
(3) Peel strength: and (3) testing the peeling strength of the copper foils on the two sides of the copper-clad plate by using a JFM012 type copper foil peeling resistance instrument under the condition of A state, wherein the width of the foil strip is 3mm, and the stretching inclination angle is 90 +/-5 degrees with the plane of the dielectric layer.
The performance test results of the copper-clad plates provided by the application examples and the comparative application examples are shown in the following table 2:
TABLE 2
As can be seen from the content in Table 2, the fluorine-containing resin-based resin composite material with excellent comprehensive performance can be prepared by designing the components of the fluorine-containing resin-based resin composite material and further by the coordination of various heat conducting particles under the condition of low boron nitride dosage, so that the prepared copper-clad plate has good heat dissipation and dielectric property and high peel strength, and can meet the use requirements of people on high-frequency high-heat-conductivity copper-clad plates, the heat conductivity coefficient is 1.20-1.60W/(m.K), the dielectric constant Dk at 10GHz is 3.3-3.67, the dielectric loss Df is less than or equal to 0.0006, specifically 0.00042-0.00057, and the peel strength is 0.70-0.90N/mm.
Compared with the application example 1, if the content of boron nitride in the fluorine-containing resin-based composite material is too low (application example 10) or the content of boron nitride in the fluorine-containing resin-based composite material is too high (application example 11), the comprehensive performance of the prepared copper-clad plate is poor.
Compared with application examples 1-6, if the fluorine-containing resin-based composite material only uses boron nitride as heat-conducting particles (compared with application example 1) or only uses silicon nitride as heat-conducting particles (compared with application example 4), the prepared copper-clad plate has the advantages of low peel strength, poor heat conductivity, high production cost and poor economy; if the heat conducting particles of the fluorine-containing resin-based composite material do not contain silicon nitride (compare with application examples 2-3), the peel strength of the prepared copper-clad plate is too low, and the heat conductivity is poor.
In conclusion, under the condition of low consumption of boron nitride, the fluorine-containing resin-based composite material prepared by the invention has excellent comprehensive performance through the cooperation of various heat-conducting particles, so that the prepared copper-clad plate has good heat dissipation and dielectric properties and high peel strength, meanwhile, the production cost is reduced, and the use requirements of people on the high-frequency high-heat-conducting copper-clad plate can be met.
The applicant states that the present invention is illustrated by the detailed process flow of the present invention through the above examples, but the present invention is not limited to the above detailed process flow, that is, it does not mean that the present invention must rely on the above detailed process flow to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The fluorine-containing resin matrix composite material is characterized by comprising the following raw materials in parts by weight:
45-65 parts of fluorine-containing polymer, 20-65 parts of heat conducting particles A and 1-5 parts of heat conducting particles B;
the heat conducting particles A comprise boron nitride and silicon nitride;
the heat conducting particles B are titanium dioxide particles.
2. The fluororesin-based composite according to claim 1, wherein the fluoropolymer is selected from any one or a combination of at least two of polychlorotrifluoroethylene, poly (chlorotrifluoroethylene-propylene), poly (ethylene-tetrafluoroethylene), poly (ethylene-chlorotrifluoroethylene), polyhexafluoropropylene, polytetrafluoroethylene, poly (tetrafluoroethylene-ethylene-propylene), poly (tetrafluoroethylene-hexafluoropropylene), poly (tetrafluoroethylene-propylene), poly (tetrafluoroethylene-perfluoropropylene vinyl ether), a copolymer having a tetrafluoroethylene backbone and fully fluorinated alkoxy side chains, polyvinyl fluoride, polyvinylidene fluoride, poly (vinylidene fluoride-chlorotrifluoroethylene), perfluoropolyether, perfluorosulfonic acid, perfluoropolyoxycyclobutane, preferably polytetrafluoroethylene and/or poly (tetrafluoroethylene-perfluoropropylene vinyl ether).
3. The fluorine resin-based composite material according to claim 1 or 2, wherein D of the thermally conductive particles A is 50 The grain diameter is 2-50 μm.
4. The fluorine resin-based composite material according to any one of claims 1 to 3, wherein the weight portion of boron nitride in the thermally conductive particles A is 5 to 25;
preferably, the boron nitride is hexagonal boron nitride flakes;
the weight portion of the silicon nitride in the heat conducting particle A is 15-40.
5. The fluorine resin-based composite material according to any one of claims 1 to 4, wherein the titanium dioxide particles comprise rutile titanium dioxide particles.
6. The fluorine resin-based composite material according to any one of claims 1 to 5, wherein D of the titanium dioxide particles 50 The grain diameter is 1-50 μm.
7. The fluorine resin-based composite material according to any one of claims 1 to 6, wherein the raw materials for preparing the fluorine resin-based composite material further comprise 1 to 40 parts of silica particles, preferably 5 to 35 parts;
preferably, D of said silica particles 50 The grain diameter is 1-50 μm.
8. A fluorine resin-based resin film, characterized by comprising the fluorine resin-based composite material according to any one of claims 1 to 7;
preferably, the fluorine resin-based resin film is prepared by coating the fluorine resin-based composite material according to any one of claims 1 to 7 on a release material, and drying and/or sintering;
preferably, the sintering temperature is 200-400 ℃;
preferably, the sintering time is 0.1-10 h.
9. A fluorine-containing resin based prepreg comprising a reinforcing material and the fluorine-containing resin based composite material according to any one of claims 1 to 7 attached to the reinforcing material by impregnation.
10. The copper-clad plate is characterized by comprising a copper foil and a dielectric layer;
the material of the dielectric layer comprises the fluorine resin-based composite material according to any one of claims 1 to 7.
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| CN202211664358.5A CN115975316B (en) | 2022-12-23 | 2022-12-23 | Fluorine-containing resin matrix composite and application thereof |
| PCT/CN2022/142186 WO2024130760A1 (en) | 2022-12-23 | 2022-12-27 | Fluorine-containing resin-based composite material and use thereof |
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