CN115955802A - An integrated multi-layer fully sealed shell - Google Patents

Abstract

The invention provides an integrated multilayer full-sealed shell, which belongs to the field of sealed shell devices and comprises pins, a shell body and a bottom base plate, wherein a circuit network is arranged on the bottom base plate, components are welded on the upper surface of the bottom base plate, the pins are arranged above the bottom base plate and electrically connected with the circuit network, the shell body covers the bottom base plate and is arranged in a sealing mode with the bottom base plate, through holes corresponding to the pins are formed in the top end of the shell body, the pins extend out of the shell body, and the pins and the shell body are arranged in a sealing mode. The vacant area on the cover plate substrate can be subjected to multilayer wiring, various components can be assembled on the upper surface and the lower surface, and the vacant area is electrically connected with the bottom substrate through the pins penetrating through the substrate, so that the areas of the front surface and the back surface of the cover plate are fully utilized, the component assembly density of the whole product is increased, and the integrated multilayer assembly of the whole shell is realized.

Description

An integrated multi-layer fully sealed shell

technical field

The invention relates to the field of sealed casing devices, in particular to an integrated multi-layer fully sealed casing.

Background technique

The traditional fully sealed shell is generally made of 10# steel, Kovar, HTCC ceramics and other materials, and the cover plate is made of metal sheets such as Kovar and nickel. The function of the cover plate is only for sealing, and does not have any electrical connection performance. Since the cover plate is metal, if the pins of the fully-sealed casing are to be drawn upward, holes can only be opened on the side wall of the casing, and an insulator with a lead wire is sintered. In this way, the size of the shell becomes larger (the side-out leads will take up a considerable space), and because the pins must be sintered on the shell shell in advance, if a single substrate is used for assembly, the size of the substrate is limited and cannot be as large as the bottom plate of the shell , and the assembly of multiple substrates increases the complexity of the assembly, and the assembly accuracy is also difficult to control. In addition, because the lead wires are fixed, the connection length between the pins and the substrate increases. For high-power and high-current products, in order to reduce the wire resistance, overhead bus connection is used, and the design of the connecting piece becomes very complicated, and different products The connecting pieces need to be specially designed and cannot be used in common with other products. For multi-layer high-density assembly applications, some institutes weld the substrate on the cover plate, and connect the flexible board to the substrate at the bottom of the shell to achieve multi-layer assembly. However, this method is cumbersome, and the flexible board needs to be bent during the sealing process, and its shape is uncontrollable, which may interfere with devices and bonding wires on the bottom substrate.

The prior art has the following problems: (1) when sealing with a metal cover plate, if the pins of the fully-sealed casing are to be drawn upward, only holes can be opened on the side wall of the casing, and the insulator with the lead wire is sintered—shell size increase; (2) When the pins must be sintered on the shell in advance, if a single substrate is used for assembly, the size of the substrate is limited and cannot be as large as the bottom plate of the shell, and when multiple substrates are used for assembly, the assembly is complicated. The assembly accuracy is difficult to control; (3) Because the lead wires are fixed, the connection length between the pins and the substrate increases. To reduce the wire resistance, an overhead bus connection is required, and the design of the connecting piece becomes very complicated, and generally different products The connecting piece is not suitable; (4) If the flexible board is connected to the substrate at the bottom of the shell, the flexible board needs to be bent during the sealing process, and the shape is uncontrollable, which may interfere with the devices and bonding wires on the bottom substrate. interference occurs.

Contents of the invention

The purpose of the present invention is to provide an integrated multi-layer fully sealed casing to solve the technical problems mentioned in the background art.

In order to achieve the above object, the technical scheme adopted in the present invention is as follows:

An integrated multi-layer fully sealed shell, including pins, an outer shell and a bottom substrate, a circuit network is arranged on the bottom substrate, components are welded on the upper surface of the bottom substrate, the pins are arranged above the bottom substrate, and connected to the bottom substrate The circuit network is electrically connected, the outer casing is covered on the bottom substrate, and is sealed with the bottom substrate. The top of the outer casing is provided with through holes corresponding to the pins, and the pins protrude from the outside of the outer casing. The pins and the outer casing Sealed settings.

Further, a sealing ring is provided at the through hole between the pin and the outer shell, and the sealing ring is a pad welding sealing ring for sealing. The sealing ring is arranged around the through hole. When welding the sealing ring, the product is placed under a nitrogen atmosphere , melt the solder to weld the pin and the sealing ring on the pad on the side of the through hole of the outer casing together and fill the gap to achieve sealing.

Furthermore, several layers of housing circuit networks are provided on both sides of the outer shell, and the shell circuit network is electrically connected to the pins, so that the front and back areas of the outer shell are utilized, increasing the device assembly density of the product, and realizing the outer shell. Integrated multi-layer assembly.

Further, the connection between the outer casing and the bottom substrate is sealed and welded together by a welding process, and the welding process is gold-tin welding, parallel seam welding or laser welding.

Further, there are several pins, the pins include power pins and signal pins, the power pins are thicker than the signal pins, and the pins are pins.

Further, the outer four corners of the outer casing are provided with fixing feet, and the fixing feet are integrated with the outer casing.

Further, the assembly process of the sealed case is as follows: components and pins are welded and assembled on the bottom substrate and connected together, the outer case is made into an integrated case by using the HTC C process, and the sealing pad, through-pass holes, through-hole pads and several layers of wiring, place device pads, and assemble the integrated housing. First, use solder to weld the sealing ring or weld the sealing ring on the sealing pad, and then assemble and connect the device. A good bottom substrate is inserted into the integrated shell. First, the bottom substrate and the sealing pad or sealing ring of the integrated shell are welded together by solder welding, laser welding or parallel seam welding to ensure airtightness. In the environment, soldering or laser welding is used to weld the pins and sealing rings and ensure airtightness.

Further, the outer casing includes a cover substrate, a sealing ring and a casing frame, the casing frame is arranged on the four sides of the bottom substrate, and the connection is sealed, the cover substrate is covered on the top of the casing frame, and the sealing ring is arranged on the cover substrate and the top of the casing frame. The joint of the shell frame is sealed and set. There are several layers of substrate circuit networks on the upper and lower sides of the cover substrate. The substrate circuit network is electrically connected to the pins. The front and back areas of the cover substrate are utilized to expand the device assembly of the product. Density, to realize the integrated multi-layer assembly of the cover substrate.

Furthermore, the cover substrate is made of a thick film substrate, several layers of HTC C substrates or a ceramic copper-clad substrate, and continuous sealing pads are designed around the cover substrate for direct welding and sealing with the shell frame or on it. The welding seal ring is sealed by parallel seam welding process.

Further, the sealing shell assembly project is: welding and assembling the components and pins on the bottom substrate, and assembling and connecting the bottom substrate and the shell frame together, using thick film substrates, HTCC several-layer substrates or ceramic copper-clad substrate materials. Cover substrate, and design a sealing plate and a through hole on the cover substrate, the sealing plate is a sealing pad or a sealing ring is welded on the sealing pad, and a through hole pad is designed on the side of the through hole, and welded and sealed on the pad Assemble and connect the devices on the front and back of the cover substrate, put the cover substrate into the shell frame assembled with the bottom substrate, and first complete the connection of the sealing pad or sealing ring on the outer ring of the cover substrate and the shell frame , using solder welding, laser welding or parallel seam welding process to ensure the airtightness of the seal ring and the shell frame weld seam, after the welded product is baked to remove moisture, the pins and the seal ring are welded in a nitrogen environment , using solder welding or laser welding process to ensure the airtightness between the pin and the sealing ring.

In terms of shell structure, nail-head pins of different thicknesses are used as pins (thick pins for power pins, thin pins for signal pins), and are welded vertically on the bottom substrate by welding (soldering or ultrasonic welding). High-strength substrates (such as thick film substrates, HTC C multi-layer substrates or ceramic copper-clad substrates) are used to make cover substrates. Design continuous sealing pads around the cover substrate (used to directly weld the seal with the shell frame or weld the seal on it) The ring is sealed by processes such as parallel seam welding), circuit layout and through holes (pins can pass through, and pad welding sealing rings are designed around the through holes for sealing). When assembling, the bottom substrate and the shell frame are welded together by various welding processes (such as gold tin welding, parallel seam welding, laser welding, etc.), the components and pins to be assembled are assembled on the bottom plate, and finally the cover plate The substrate is inserted into the pins and covered on the shell frame and welded (gold tin soldering, parallel seam welding, laser welding, etc.) The sealing rings on the through-hole pads are welded together and the gap is filled to achieve sealing, so as to meet the requirements of the national military standard for the internal atmosphere of the sealed product. The free area on the cover substrate can be used for multi-layer wiring, the upper and lower surfaces can be assembled with various components, and the pins passing through the substrate are electrically connected to the bottom substrate, so that the front and back areas of the cover are fully utilized, expanding the The device assembly density of the entire product realizes the integrated multi-layer assembly of the entire shell.

The present invention has the following beneficial effects due to the adoption of the above technical solution:

The free area on the cover substrate of the present invention can be multi-layer wiring, and various components can be assembled on the upper and lower surfaces, and the pins passing through the substrate are electrically connected to the bottom substrate, so that the front and back areas of the cover are fully utilized. The device assembly density of the entire product is expanded, and the integrated multi-layer assembly of the entire shell is realized.

Description of drawings

Fig. 1 is a schematic diagram of the external three-dimensional structure of the first embodiment of the present invention;

Fig. 2 is a schematic diagram of the cutout structure of the first embodiment of the present invention;

Fig. 3 is a schematic diagram of the external three-dimensional structure of the second embodiment of the present invention;

Fig. 4 is a schematic diagram of the cutout structure of the second embodiment of the present invention.

Symbols in the figure: 1-pin; 2-sealing ring; 3-outer casing; 4-fixing feet; 5-bottom substrate; 6-cover substrate; 7-sealing ring; 8-outer shell frame.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below with reference to the accompanying drawings and preferred embodiments. However, it should be noted that many of the details listed in the specification are only for readers to have a thorough understanding of one or more aspects of the present invention, and these aspects of the present invention can be implemented even without these specific details.

Example 1:

As shown in Figure 1-2, an integrated multi-layer fully sealed casing includes pins 1, an outer casing 3 and a bottom substrate 5. A circuit network is arranged on the bottom substrate 5, and elements are welded on the upper surface of the bottom substrate 5. device, the pin 1 is arranged above the bottom substrate 5, and is electrically connected with the circuit network; Corresponding to the through hole, the pin 1 extends out of the outer shell 3 , and the pin 1 and the outer shell 3 are sealed.

The outer shell 3 and the bottom base plate 5 are used to form a closed space, and the two shells are sealed. At the same time, the two shells are also used as a circuit board structure, and multiple Layered circuit network, and then connected through pin 1, the electrical connection between the two shells is realized, and the inner wall of the closed space is a circuit structure, which greatly saves space and can realize the three-dimensional placement of electronic devices .

A sealing ring 2 is provided at the through hole between the pin 1 and the outer shell 3. The sealing ring 2 is a pad welding sealing ring for sealing. The sealing ring 2 is set around the through hole. When welding the sealing ring, the product is placed in nitrogen Under the atmosphere, the solder is melted to weld the pin 1 and the sealing ring on the pad on the side of the through hole of the outer casing 3 together and fill the gap to achieve sealing.

In the embodiment of the present invention, several layers of shell circuit networks are provided on the inner and outer sides of the outer shell 3, and the shell circuit network is electrically connected to the pin 1, and the area of the front and back of the outer shell 3 is utilized to expand the device assembly of the product. Density, to realize the integrated multi-layer assembly of the outer shell 3. The exterior of the outer casing 3 is provided with sealing paint to insulate and seal the circuit for outer layer insulation and sealing protection. By using the outer casing 3 as a circuit substrate, the same volume can accommodate more complex and multi-component circuit designs. The connection between the outer casing 3 and the bottom substrate 5 is hermetically welded together by a welding process, and the welding process is gold-tin welding, parallel seam welding or laser welding. The joints are better sealed by gold-tin soldering, parallel seam welding or laser welding.

In the embodiment of the present invention, there are several pins 1, the pins 1 include power pins and signal pins, the power pins are thicker than the signal pins, and the pins 1 are pins. The outer four corners of the outer casing 3 are provided with fixed feet 4 , and the fixed feet 4 are integrated with the outer casing 3 . Fixed pin 4 is mainly used to fix the device, and pin 1 is used as the connection of input and output signals. Pin 1 is mainly used as an internal signal input or output of the device, and is also connected to a power line, etc., and can also be connected to an external circuit module to achieve internal sealing.

The assembly process of the sealed case is as follows: the components and pins 2 are welded and assembled on the bottom substrate 5 and connected together, the outer case 3 is made into an integrated case by using the HTC C process, and the sealing pad is made on the case, Through-holes, through-hole pads and several layers of wiring, place device pads, assemble the integrated housing, first use solder to weld the sealing ring or weld the sealing ring on the sealing pad, and then assemble and connect the device. The assembled bottom substrate 5 is inserted into the integrated casing, and the bottom substrate 5 is welded together with the sealing pad or sealing ring of the integrated casing by solder welding, laser welding or parallel seam welding to ensure the sealing. Then, the pin 1 and the sealing ring 2 are welded by soldering or laser welding in a nitrogen environment to ensure airtightness.

Example 2:

An integrated multi-layer fully sealed casing, as shown in Figure 3-4, includes pins 1, an outer casing 3 and a bottom substrate 5, the bottom substrate 5 is provided with a circuit network, and the upper surface of the bottom substrate 5 is welded with elements device, the pin 1 is arranged above the bottom substrate 5, and is electrically connected with the circuit network; Corresponding to the through hole, the pin 1 extends out of the outer shell 3 , and the pin 1 and the outer shell 3 are sealed. The outer casing 3 includes a cover substrate 6, a sealing ring 7 and a casing frame 8. The casing frame 8 is arranged on the four sides of the bottom substrate 5, and the connection is sealed. The cover substrate 6 is covered on the top of the casing frame 8, and the sealing ring 7 It is arranged at the joint between the cover substrate 6 and the housing frame 8, and sealed. There are several layers of substrate circuit networks on the upper and lower sides of the cover substrate 6. The substrate circuit network is electrically connected to the pin 1. The positive side of the cover substrate 6 The area on the reverse side is utilized to increase the device assembly density of the product and realize the integrated multi-layer assembly of the cover substrate 6 . The cover substrate 6 is made of a thick film substrate, several layers of HTCC substrates, or a ceramic copper-clad substrate. Continuous sealing pads are designed around the cover substrate 6 for direct welding and sealing with the housing frame 8 or welding on it. The sealing ring is sealed by parallel seam welding process.

The difference between this structure and Embodiment 1 is that the outer shell 3 is set as a two-part, so that the process of welding electronic components and installation is more convenient and efficient, but there are more procedures on the installation and sealing, but the achieved The effect is just as good.

In this structure, the general circuit network is arranged on the cover substrate 6 and the circuit network may not be provided, and it can also be set, that is, only manual welding can be performed when welding electronic components, but only when the circuit network is set on the cover substrate 6, the cover plate When the substrate 6 and the bottom substrate 5 are opened and electronic components are welded, the production line is used for welding directly, and the processing efficiency is higher.

The sealing shell assembly project is: welding and assembling components and pins 2 on the bottom substrate 5, and assembling and connecting the bottom substrate 5 and the shell frame 8 together, using thick film substrates, HTCC several-layer substrates or ceramic copper-clad substrate materials Make the cover substrate 6, and design a sealing plate and a through hole on the cover substrate 6. The sealing plate is a sealing pad or a sealing ring is welded on the sealing pad, and a through hole pad is designed on the side of the through hole, and on the pad Weld the sealing ring on top, assemble the devices on the front and back sides of the cover substrate 6 and connect them, insert the cover substrate 6 into the shell frame 8 assembled with the bottom substrate 5, and first complete the sealing pad on the outer ring of the cover substrate 6 Or the connection between the sealing ring 7 and the shell frame 8 is performed by solder welding, laser welding or parallel seam welding to ensure the airtightness of the weld seam between the sealing ring 7 and the shell frame 8, and after the welded product is baked to remove water vapor, The welding of the pin 1 and the sealing ring 2 is performed in a nitrogen environment, and the airtightness between the pin 1 and the sealing ring 2 is ensured by using a soldering or laser welding process.

This structure uses the front and back sides of the cover substrate to assemble devices without affecting the size of the box body, thereby maximizing space utilization.

The above is only a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be It is regarded as the protection scope of the present invention.

Claims (10)

1. An integrated multi-layer fully sealed shell is characterized in that: it comprises pins (1), an outer casing (3) and a bottom substrate (5), the bottom substrate (5) is provided with a circuit network, and the bottom substrate (5) ) is welded with components on the upper surface, the pins (1) are arranged above the bottom substrate (5), and are electrically connected with the circuit network, and the outer shell (3) is covered on the bottom substrate (5), and connected to the bottom The substrate (5) is sealed, and the top of the outer shell (3) is provided with through holes corresponding to the pins (1), the pins (1) protrude from the outside of the outer shell (3), and the pins (1) and the shell The body (3) is sealed. 2. A kind of integrated multi-layer fully sealed casing according to claim 1, characterized in that: a sealing ring (2) is provided at the through hole of the pin (1) and the outer shell (3), and the sealing ring (2 ) is welding the sealing ring for the pad for sealing. The sealing ring (2) is set around the through hole. The sealing rings on the pads on the side of the through hole are welded together and fill the gap to achieve sealing. 3. A kind of integrated multi-layer fully sealed shell according to claim 1, characterized in that: the inner and outer sides of the outer shell (3) are provided with several layers of shell circuit networks, the shell circuit network and the pins ( 1) For electrical connection, the area of the front and back of the outer shell (3) is utilized, the device assembly density of the product is increased, and the integrated multi-layer assembly of the outer shell (3) is realized. 4. An integrated multi-layer fully sealed casing according to claim 1, characterized in that: the connection between the casing (3) and the bottom substrate (5) is sealed and welded together by a welding process, and the welding process is gold tin soldering , parallel seam welding or laser welding. 5. A kind of integrated multi-layer fully sealed casing according to claim 1, characterized in that: the number of pins (1) is several, and the pins (1) include power pins and signal pins, and the power The pin is thicker than the signal pin, pin (1) is a pin needle. 6. An integrated multi-layer fully sealed casing according to claim 1, characterized in that: the outer four corners of the outer casing (3) are provided with fixing feet (4), and the fixing feet (4) and the outer casing (3) ) integrated setting. 7. An integrated multi-layer fully sealed casing according to any one of claims 1-6, characterized in that: the assembly process of the sealed casing is: welding and assembling components and pins (2) on the bottom substrate ( 5) Put together and connect together, use the HTCC process to make the outer shell (3) into an integrated shell, make sealing pads, through holes, and through hole pads on the shell, and perform several layers of wiring, and place device pads , to assemble the integrated housing, first use solder to weld the sealing ring or weld the sealing ring on the sealing pad, then perform device assembly and connection, insert the assembled bottom substrate (5) into the integrated housing, first use The process of solder welding, laser welding or parallel seam welding integrates the bottom substrate (5) with the sealing pad or sealing ring of the integrated shell to ensure airtightness, and then uses solder welding or laser welding in a nitrogen environment for welding pin (1) and sealing ring (2) and ensure airtightness. 8. An integrated multi-layer fully sealed casing according to claim 1, characterized in that: the casing (3) includes a cover substrate (6), a sealing ring (7) and a casing frame (8), and the casing frame (8) It is arranged on the four sides of the bottom substrate (5), and the connection is sealed, the cover substrate (6) is covered on the top of the shell frame (8), and the sealing ring (7) is arranged on the cover substrate (6) and The joints of the shell frame (8) are sealed and arranged. Several layers of substrate circuit networks are arranged on the upper and lower sides of the cover substrate (6). The substrate circuit network is electrically connected to the pins (1), and the cover substrate (6) The areas of the front and back sides are utilized, the device assembly density of the product is increased, and the integrated multi-layer assembly of the cover substrate (6) is realized. 9. An integrated multi-layer fully sealed casing according to claim 8, characterized in that: the cover substrate (6) is made of a thick film substrate, HTCC several-layer substrate or a ceramic copper-clad substrate, and the cover substrate (6) is designed with continuous sealing pads around it, which are used to directly weld the seal with the shell frame (8) or weld the seal ring on it to seal through the parallel seam welding process. 10. An integrated multi-layer fully sealed casing according to any one of claims 8-9, characterized in that: the assembly process of the sealed casing is: welding and assembling components and pins (2) on the bottom substrate (5 ), and assemble and connect the bottom substrate (5) and the housing frame (8), and use thick film substrates, HTCC several-layer substrates or ceramic copper-clad substrates to make the cover substrate (6), and place the cover substrate ( 6) Design the sealing plate and the through hole on the top, the sealing plate is a sealing pad or a sealing ring is welded on the sealing pad, the through hole pad is designed on the side of the through hole, and the sealing ring is welded on the pad, and the cover substrate ( 6) Assemble and connect the devices on the front and back sides, insert the cover substrate (6) into the shell frame (8) assembled with the bottom substrate (5), and first complete the sealing pad on the outer ring of the cover substrate (6) Or the connection between the sealing ring (7) and the shell frame (8) adopts solder welding, laser welding or parallel seam welding process to ensure the airtightness of the weld seam between the sealing ring (7) and the shell frame (8). After the product is baked to remove water vapor, the pin (1) and the sealing ring (2) are welded in a nitrogen environment, and the solder welding or laser welding process is used to ensure the tightness between the pin (1) and the sealing ring (2). air tightness.

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