CN115955791A - Preparation method for mini-LED PCB - Google Patents
Preparation method for mini-LED PCB Download PDFInfo
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- CN115955791A CN115955791A CN202310244395.9A CN202310244395A CN115955791A CN 115955791 A CN115955791 A CN 115955791A CN 202310244395 A CN202310244395 A CN 202310244395A CN 115955791 A CN115955791 A CN 115955791A
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Abstract
The invention discloses a preparation method for a mini-led PCB, which comprises the following steps: s1: preparing an inner core plate; the inner core board comprises inner layer circuits; s2: preparing an outer core board, wherein the outer core board comprises at least one layer of insulating medium layer, and a copper interconnection layer communicated with the inner circuit is arranged in the insulating medium layer; the insulating medium layer is prepared by adopting a printing process and specifically comprises the following steps: the insulating material filled outside the inner core plate is firstly cured by light to form a flexible insulating solder mask, the flexible insulating assembly welding layer is leveled, and then is cured by heat to form an insulating medium layer; s3: and forming a solder resist printing layer on the outer side of the outer core plate, and performing post-treatment. According to the preparation method for the mini-led PCB, provided by the invention, a printing process is adopted to replace a pressing process, so that the combination of different substrates in the mini-led PCB is realized, the production cost of the mini-led PCB is reduced, and the line yield of the mini-led PCB is improved.
Description
Technical Field
The invention relates to the field of mini-led PCBs, in particular to a preparation method for a mini-led PCB.
Background
With the development of the technology, as an important application of a semiconductor Light Emitting Diode (LED) in display, small-pitch display gradually matures. In the conventional small-pitch display, due to the influence of pixel pitch and the inherent defects of discrete devices, the phenomena of insufficient display visual distance, moire fringes and the like still exist, and in order to meet the requirement of people for continuously pursuing display effect and further expand the application field, the small-pitch display continuously advances on a road developing towards smaller dot pitch, which means that the size of a chip is continuously reduced. Due to the fact that the mini-led can avoid various defects of an original chip, the mini-led becomes the only choice for smaller dot spacing and also becomes a hot spot of research in the industry of nearly two years.
The lamination needs to be carried out between adjacent core plates in the mini-led PCB, along with the reduction of the size of the mini-led PCB, the traditional laminating machine is more and more difficult to meet the precision requirement of the mini-led PCB with small size, and meanwhile, the laminating process cost is relatively high, so that the cost reduction production of the mini-led PCB is not facilitated.
Disclosure of Invention
The present invention is directed to solving, at least in part, one of the problems in the related art. Therefore, the invention aims to provide a preparation method for a mini-led PCB, which adopts a printing process to replace a pressing process, realizes the combination of different substrates in the mini-led PCB, reduces the production cost of the mini-led PCB and improves the line yield of the mini-led PCB.
In order to achieve the purpose, the following technical scheme is adopted in the application: a preparation method for a mini-led PCB comprises the following steps:
s1: preparing an inner core plate; the inner core board comprises inner layer circuits;
s2: preparing an outer core plate, wherein the outer core plate comprises at least one layer of insulating medium layer, and a copper interconnection layer communicated with the inner circuit is arranged in the insulating medium layer; the insulating medium layer is prepared by adopting a printing process and specifically comprises the following steps: the insulating material filled outside the inner core plate is firstly subjected to photocuring to form a flexible insulating solder mask, the flexible insulating assembly welding layer is leveled, and then is subjected to thermocuring to form an insulating medium layer;
s3: and forming a solder resist printing layer on the outer side of the outer core plate, and performing post-treatment.
Further, in the step S2, laser drilling is carried out in the insulating medium layer, electroplating and hole filling are carried out, and a copper interconnection layer communicated with the inner-layer circuit is formed.
Further, step S2 specifically includes:
forming a bottom copper layer on the surface of the inner core plate, depositing a dry film on the bottom copper layer, exposing and developing the dry film to form a gap of the copper interconnection layer, electroplating and filling holes in the gap, removing the dry film, removing the bottom copper layer outside the copper interconnection layer, and forming the copper interconnection layer on the inner core plate;
and forming an insulating medium layer filled on the side edge of the copper interconnection layer by adopting a printing process.
Further, the preparation method of the bottom copper layer comprises the following steps: depositing a first bottom copper layer on the surface of the inner-layer core plate by adopting a chemical deposition method; and depositing a second bottom copper layer on the surface of the first bottom copper layer by adopting an electroplating copper deposition method, wherein the first bottom copper layer and the second bottom copper layer jointly form a bottom copper layer.
Further, the insulating material in step S2 includes a diluent.
Further, step S2 specifically includes: the method comprises the steps of placing an inner core plate in a mold, arranging a cushion pad at the bottom of the mold, filling an insulating material containing a diluent at the top of the inner core plate, carrying out photocuring on the insulating material at a wave band of 240-300nm to form a flexible insulating medium layer, flattening the flexible insulating medium layer in a vacuum open-press machine by adopting a flattening plate, and baking in an oven to volatilize a solvent in the insulating material to form the insulating medium layer.
Furthermore, in the step S2, the outer core board is located on the top and the bottom two side surfaces of the inner core board, the outer core board comprises two stacked insulating medium layers, an outer circuit is formed on the surface of the insulating medium layer far away from the inner core board, and the outer circuit is communicated with the copper interconnection layer.
Further, the preparation of the inner core board in the step S1 includes: cutting, drilling, wetting the hole wall, electroplating and filling the hole to form an inner layer circuit, performing AOI detection, and performing browning treatment.
Further, the post-processing in step S3 includes: grinding a plate, sinking gold, testing electrical property, cutting and visually inspecting.
Further, the grinding plate specifically comprises: and grinding the mini-led PCB in a grinding plate solution, wherein the grinding plate solution comprises abrasive particles and a heat-conducting insulating compound for heat dissipation.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: according to the method, after the inner core plate is formed, the insulating medium layer, the copper interconnection layer inside the insulating medium layer and the outer layer circuit outside the insulating medium layer are formed on the inner core plate through the printing process, the outer core plate is formed together, the inner core plate and the outer core plate can be combined without using a pressing process, the production cost of the mini-led PCB can be reduced, meanwhile, the printing process can meet the production precision of the small-size mini-led PCB, and the circuit yield of the mini-led PCB is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a flow chart of the preparation of an outer core panel of example 2;
fig. 2 is a flow chart of the preparation of an outer core panel in example 3.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the orientations and positional relationships indicated by the terms "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "leading", "trailing", and the like are configured and operated in specific orientations based on the orientations and positional relationships shown in the drawings, and are only for convenience of description of the present invention, but not for indicating that the mechanism or element referred to must have a specific orientation, and thus, are not to be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Example 1
The application provides a preparation method for a mini-led PCB, which comprises the following steps:
s1: preparing an inner core plate; the inner core board comprises inner circuits;
s2: preparing an outer core plate, wherein the outer core plate comprises at least one layer of insulating medium layer, and a copper interconnection layer communicated with the inner circuit is arranged in the insulating medium layer; the insulating medium layer is prepared by adopting a printing process and specifically comprises the following steps: the insulating material filled outside the inner core plate is firstly subjected to photocuring to form a flexible insulating solder mask, the flexible insulating assembly welding layer is leveled, and then is subjected to thermocuring to form an insulating medium layer;
s3: and forming a solder resist printing layer on the outer side of the outer core plate, and performing post-treatment.
According to the method, after the inner core board is formed, the insulating medium layer, the copper interconnection layer inside the insulating medium layer and the outer circuit outside the insulating medium layer and the copper interconnection layer are formed on the inner core board through the printing process, the outer core board is formed together, the inner core board and the outer core board can be combined without using a pressing process, the production cost of the mini-led type PCB can be reduced, meanwhile, the printing process can meet the production precision of the small-size mini-led type PCB, and the circuit yield of the mini-led type PCB is improved.
Example 2
The application provides a preparation method for a mini-led PCB, which comprises the following steps:
s1: preparing an inner core plate; the inner core board comprises inner circuits; the preparation of the inner core plate specifically comprises the following steps:
cutting: the large panels are cut to produce the appropriate size.
Drilling: and drilling a through hole to be conducted or a heat dissipation hole not to be conducted on the plate to be processed in a mechanical drilling mode. The aperture may be, for example, about 0.1 mm.
Wetting the pore walls: and the hole wall is wetted by gas, so that subsequent electroplating and hole filling are facilitated.
Horizontal black hole: the hole wall is cleaned, so that subsequent electroplating and hole filling are facilitated.
And electroplating a counter bore, and filling an electroplating copper layer in the drill hole and on the surface of the plate material so as to realize stronger conductivity and other functions.
And reducing copper, and removing the redundant copper layer on the surface after the hole is filled by electroplating to ensure that the thickness of the copper layer on the top of the plate is about 15 mu m.
Forming an inner layer circuit: and patterning the copper layer on the surface of the plate to form an inner layer circuit.
AOI detection: and carrying out automatic optical detection on the inner layer circuit and the copper layer in the hole.
Brown oxidation treatment: the copper surface is roughened to increase the roughness of the copper surface, so that the bonding force is better after subsequent pressing.
S2: and preparing an outer core board, wherein the outer core board comprises at least one insulating medium layer, and a copper interconnection layer communicated with the inner circuit is arranged in the insulating medium layer.
Referring to fig. 1, the method specifically includes the following steps: s21: the method comprises the steps of placing an inner core plate in a mold, arranging a cushion pad at the bottom of the mold, clamping the peripheral side walls of the inner core plate by a clamp, filling an insulating material containing a diluent at the top of the inner core plate, carrying out photocuring on the insulating material at a wave band of 240-300nm to form a flexible insulating medium layer, flattening the flexible insulating medium layer in a vacuum press, baking for 30 minutes in a 180 ℃ oven, and volatilizing a solvent in the insulating material to form the insulating medium layer.
The cushion pad is a PI type cotton pad for protecting the bottom of the inner core board, where the top refers to the side of the inner core board where the insulating medium layer is required to be printed and the bottom refers to the side opposite to the top. In actual operation, both sides of the inner core board may need to be printed with insulating medium layers, in this case, one side may be printed first, and after printing is completed, the inner core board is inverted, and then the other side is printed. In both printing processes, the top and bottom are reversed.
The flexible insulating medium layer refers to an incompletely cured insulating medium layer in a semi-cured state, at the moment, the flexible insulating medium layer is rolled by the leveling plate, so that the surface of the flexible insulating medium layer is smooth, and the specific leveling plate can be a PET (polyethylene terephthalate) plate with a smooth surface.
S22: and (4) performing laser drilling in the insulating medium layer, and performing electroplating hole filling to form a copper interconnection layer communicated with the inner layer circuit. And after the hole is filled by electroplating, carrying out full-plate electroplating and patterning continuously to form an outer layer circuit on the surface of the insulating medium layer, wherein the outer layer circuit is communicated with the inner layer circuit through a copper interconnection layer.
S23: after the insulating medium layer, the copper interconnection layer and the outer layer circuit are formed, AOI detection is carried out on the circuits, and browning treatment is carried out.
It should be noted that, in the present application, the insulating medium layer and the copper interconnection layer inside the insulating medium layer in the outer core board may be one layer or multiple layers, and when the insulating medium layer and the copper interconnection layer inside the insulating medium layer are multiple layers, the above steps are repeated to sequentially form multiple layers of insulating medium layers and copper interconnection layers inside the insulating medium layers, and finally, the outer side surface of the outer core board has an outer layer circuit.
Meanwhile, the insulating medium layer can be only positioned on one side of the inner core board, and can also be positioned on two sides of the inner core board at the same time, when the insulating medium layer is positioned on two sides of the inner core board, the inner core board is inverted, and the steps are repeated.
S3: and forming a solder resist printing layer on the outer side of the outer core plate, covering a layer of printing ink on the copper interconnection layer which is not allowed to be welded or exposed out of the surface, and preventing the metal surface which is not required to be welded from being welded with tin. And post-processing the mini-led PCB, wherein the post-processing comprises the following steps:
s31: and (3) grinding the solder resist printing layer on the outer side of the mini-led PCB in a board grinding solution to remove the redundant solder resist printing layer and obtain the solder resist printing layer with a smooth surface, so that subsequent treatment is facilitated.
In order to prevent the local temperature from being too high in the plate grinding process, the mini-LED PCB is ground in a plate grinding solution, the plate grinding solution is liquid, and the heat generated by friction can be taken away by the flowing of the plate grinding solution in the plate grinding process, so that the local temperature is prevented from being too high.
And adjusting the current of the ceramic grinding and brushing wheel in real time in the plate grinding process to ensure that the pressure on each area in the mini-led PCB is the same. In actual operation, a pressure sensor can be arranged at the ceramic grinding and brushing wheel, the pressure sensor can monitor the pressure between the ceramic grinding and brushing wheel and the mini-led PCB in real time, the larger the current applied to the ceramic grinding and brushing wheel is, the larger the pressure applied to the mini-led PCB is, the control current of the ceramic grinding and brushing wheel is correspondingly adjusted in real time by monitoring the pressure fed back by the pressure sensor in real time, the same pressure of the ceramic grinding and brushing wheel to the mini-led PCB is ensured, so that the phenomenon that the acting force of the ceramic grinding and brushing wheel to the local area is too large or too small can be avoided, and the reliability of the product is improved.
Further, including being used for radiating heat conduction insulating compound in this application grinding plate solution, heat conduction insulating compound can be hexagonal boron nitride for example, and it has good heat conductivility, and at the grinding plate in-process, the produced heat of grinding the board can in time be taken away to heat conduction insulating compound, avoids local high temperature.
Furthermore, the grinding plate solution comprises abrasive particles which can be emery and other abrasive particles with high hardness, and the abrasive particles can also be in contact friction with the mini-led PCB under the action of the ceramic grinding wheel in the plate grinding process of the ceramic grinding wheel for the plate grinding speed is increased.
S32: and (3) gold immersion treatment is carried out on the outer side of the outer layer circuit, so that the outer layer circuit in the mini-led type PCB is protected by virtue of good oxidation resistance of gold, and the mini-led type PCB has the advantages of stable color, good brightness and good weldability.
S33: and (3) carrying out electrical property test on the mini-LED PCB to ensure that the electrical property is good and no point is missed, and removing unqualified products to obtain the final mini-LED PCB.
S34: and cutting the mini-led PCB into a target shape and size.
S35: visual inspection: and inspecting the appearance defects of the product and picking out the defects.
The printing process is used for replacing a press-fit process to print the insulating medium layer, so that the insulating medium layer and the inner core plate can be combined without press-fit, the production cost of the mini-led PCB can be reduced, the production precision of the small-size mini-led PCB can be met, and the line yield of the mini-led PCB can be improved.
The innovation of the application is that the mini-LED PCB is ground in a board grinding solution, the board grinding solution is liquid, and the heat generated by friction can be taken away by the flowing of the board grinding solution in the board grinding process, so that the local overhigh temperature is avoided. Including being used for radiating heat conduction insulating compound in this application grinding plate solution, heat conduction insulating compound has good heat conductivility, and at the grinding plate in-process, heat that the grinding plate produced can in time be taken away to heat conduction insulating compound, avoids local high temperature. The grinding plate solution comprises abrasive particles, the abrasive particles can be made of carborundum and other abrasive particles with high hardness, and when the ceramic grinding and brushing wheel is used for grinding mini-led PCBs, the abrasive particles can be in contact friction with the support plate under the action of the ceramic grinding and brushing wheel, so that the plate grinding speed is increased.
Example 3
This example differs from example 2 in that: the method for forming the outer core plate in the step S2 is different, the remaining steps are the same, and the detailed description of the same parts is omitted.
In this embodiment, S2: and preparing an outer core plate, wherein the outer core plate comprises at least one layer of insulating medium layer, and a copper interconnection layer communicated with the inner circuit is arranged in the insulating medium layer.
Referring to fig. 2, the method specifically includes the following steps: s21: forming a bottom copper layer on the surface of the inner core plate, depositing a dry film on the bottom copper layer, exposing and developing the dry film to form a gap of the copper interconnection layer, electroplating and filling holes in the gap, removing the dry film, removing the bottom copper layer outside the copper interconnection layer, and forming the copper interconnection layer on the inner core plate.
The preparation method of the bottom copper layer comprises the following steps: depositing a first bottom copper layer on the surface of the inner-layer core plate by adopting a chemical deposition method; and depositing a second bottom copper layer on the surface of the first bottom copper layer by adopting an electroplating copper deposition method, wherein the first bottom copper layer and the second bottom copper layer jointly form a bottom copper layer.
S22: and forming an insulating medium layer filled on the side edge of the copper interconnection layer by adopting a printing process. The method specifically comprises the following steps: the method comprises the steps of placing an inner core plate in a mold, arranging a cushion pad at the bottom of the mold, clamping the peripheral side walls of the inner core plate by a clamp, filling an insulating material containing a diluent at the top of the inner core plate, carrying out photocuring on the insulating material at a wave band of 240-300nm to form a flexible insulating medium layer, flattening the flexible insulating medium layer in a vacuum press, and baking in an oven at 180 ℃ for 30 minutes to volatilize a solvent in the insulating material to form the insulating medium layer.
The cushion pad is a PI type cotton pad for protecting the bottom of the inner core board, where the top refers to the side of the inner core board where the insulating medium layer is required to be printed and the bottom refers to the side opposite to the top. In actual operation, both sides of the inner core board may need to be printed with insulating medium layers, in this case, one side may be printed first, and after printing is completed, the inner core board is inverted, and then the other side is printed. In both printing processes, the top and bottom are reversed.
The flexible insulating medium layer refers to an incompletely cured insulating medium layer in a semi-cured state, at the moment, the flexible insulating medium layer is rolled by adopting a leveling plate, so that the surface of the flexible insulating medium layer is smooth, the specific leveling plate can be a PET plate with a smooth surface, and the rolled flexible insulating medium layer is flush with the surface of the copper interconnection layer.
S23: after the insulating medium layer, the copper interconnection layer and the outer layer circuit are formed, AOI detection is carried out on the circuits, and browning treatment is carried out.
It should be noted that, in the present application, the insulating medium layer and the copper interconnection layer inside the insulating medium layer in the outer core board may be one layer or multiple layers, and when the insulating medium layer and the copper interconnection layer inside the insulating medium layer are multiple layers, the above steps are repeated to sequentially form multiple layers of insulating medium layers and copper interconnection layers inside the insulating medium layers, and finally, the outer side surface of the outer core board has an outer layer circuit.
Meanwhile, the insulating medium layer can be only positioned on one side of the inner core board or can be positioned on two sides of the inner core board simultaneously, when the insulating medium layer is positioned on two sides of the inner core board, the inner core board is inverted, and the steps are repeated.
The innovation of the embodiment 3 of the application is that a copper interconnection layer can be formed by adopting an etching, developing and exposing method, and then an insulating interconnection layer is printed by adopting a printing process; the copper interconnection layer is formed by the etching method, laser drilling is not needed to be carried out on the semiconductor carrier plate, so that the etching method can form a copper-filled notch with a smaller size, the laser processing requirement is avoided, the equipment investment cost can be reduced, and the circuit yield of the semiconductor carrier plate is improved.
It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (10)
1. A preparation method for a mini-led PCB is characterized by comprising the following steps:
s1: preparing an inner core plate; the inner core board comprises inner layer circuits;
s2: preparing an outer core board, wherein the outer core board comprises at least one layer of insulating medium layer, and a copper interconnection layer communicated with the inner circuit is arranged in the insulating medium layer; the insulating medium layer is prepared by adopting a printing process and specifically comprises the following steps: the insulating material filled outside the inner core plate is firstly subjected to photocuring to form a flexible insulating solder mask, the flexible insulating assembly welding layer is leveled, and then is subjected to thermocuring to form an insulating medium layer;
s3: and forming a solder resist printing layer on the outer side of the outer core plate, and performing post-treatment.
2. The method for preparing a mini-led PCB as claimed in claim 1, wherein the insulating medium layer is laser drilled and electroplated to fill the holes in step S2, thereby forming the copper interconnection layer communicated with the inner layer circuit.
3. The method for preparing a mini-led PCB as claimed in claim 1, wherein the step S2 specifically comprises:
forming a bottom copper layer on the surface of the inner core plate, depositing a dry film on the bottom copper layer, exposing and developing the dry film to form a gap of the copper interconnection layer, electroplating and filling holes in the gap, removing the dry film, removing the bottom copper layer outside the copper interconnection layer, and forming the copper interconnection layer on the inner core plate;
and forming an insulating medium layer filled on the side edge of the copper interconnection layer by adopting a printing process.
4. The method for preparing a mini-led PCB according to claim 3, wherein the method for preparing the copper underlayer comprises the following steps: depositing a first bottom copper layer on the surface of the inner-layer core plate by adopting a chemical deposition method; and depositing a second bottom copper layer on the surface of the first bottom copper layer by adopting an electroplating copper deposition method, wherein the first bottom copper layer and the second bottom copper layer jointly form a bottom copper layer.
5. The method for preparing a mini-led PCB as recited in claim 1, wherein the insulating material in the step S2 comprises a diluent.
6. The method for preparing a mini-led PCB as claimed in claim 5, wherein the step S2 specifically comprises: the method comprises the steps of placing an inner core plate in a mold, arranging a cushion pad at the bottom of the mold, filling an insulating material containing a diluent at the top of the inner core plate, carrying out photocuring on the insulating material at a wave band of 240-300nm to form a flexible insulating medium layer, flattening the flexible insulating medium layer in a vacuum open-press machine by adopting a flattening plate, and baking in an oven to volatilize a solvent in the insulating material to form the insulating medium layer.
7. The method as claimed in claim 1, wherein the outer core board is located on both top and bottom sides of the inner core board in step S2, and the outer core board comprises two stacked insulating medium layers, the surface of the insulating medium layer away from the inner core board forms outer layer circuits, and the outer layer circuits are communicated with the copper interconnection layer.
8. The method for preparing a mini-led PCB as claimed in claim 1, wherein the preparing of the core board in the step S1 comprises: cutting, drilling, wetting the hole wall, electroplating and filling the hole to form an inner layer circuit, performing AOI detection, and performing browning treatment.
9. The method for preparing a mini-led PCB as claimed in claim 1, wherein the post-processing in the step S3 comprises: grinding a plate, sinking gold, testing electrical property, cutting and visually inspecting.
10. The method for preparing a mini-led PCB as claimed in claim 9, wherein the grinding plate comprises: and grinding the mini-led PCB in a grinding plate solution, wherein the grinding plate solution comprises abrasive particles and a heat-conducting insulating compound for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310244395.9A CN115955791A (en) | 2023-03-15 | 2023-03-15 | Preparation method for mini-LED PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310244395.9A CN115955791A (en) | 2023-03-15 | 2023-03-15 | Preparation method for mini-LED PCB |
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| CN115955791A true CN115955791A (en) | 2023-04-11 |
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| CN202310244395.9A Pending CN115955791A (en) | 2023-03-15 | 2023-03-15 | Preparation method for mini-LED PCB |
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| CN1408764A (en) * | 2001-09-27 | 2003-04-09 | 山荣化学株式会社 | Light solidified and heat solidified resin composition and method for producing printed circuit board |
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| KR20140035622A (en) * | 2012-09-14 | 2014-03-24 | 삼성전기주식회사 | Multilayer printed circuit board and manufacturing method thereof |
| US20190373742A1 (en) * | 2018-05-29 | 2019-12-05 | Tdk Corporation | Printed wiring board and method for manufacturing the same |
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2023
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| CN1408764A (en) * | 2001-09-27 | 2003-04-09 | 山荣化学株式会社 | Light solidified and heat solidified resin composition and method for producing printed circuit board |
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