CN115942097B

CN115942097B - Double-OIS camera module device

Info

Publication number: CN115942097B
Application number: CN202211590479.XA
Authority: CN
Inventors: 谭碧亮; 于立新; 徐宇震; 周龙
Original assignee: Shenzhen Holitech Optoelectronics Co Ltd
Current assignee: Shenzhen Holitech Optoelectronics Co Ltd
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2024-10-11
Anticipated expiration: 2042-12-12
Also published as: CN115942097A

Abstract

A double OIS camera module device relates to the field of camera modules, and comprises: a base, an inner shell PCB and magnet; CMOSSensor is fixedly arranged on the PCB; the PCB is elastically connected with the base through four elastic sheets, and can move along any direction of the plane of the base through the elastic sheets; the magnet is at least provided with one magnet and is fixedly connected with the inner shell; at least one group of coils are fixedly arranged on the PCB, and the at least one group of coils are opposite to the at least one magnet; two Hall ICs are fixedly arranged on the PCB and are respectively used for detecting the real-time displacement distance of the PCB relative to the X direction and the real-time displacement distance of the PCB relative to the base; the lens deflection device is used for driving the lens mechanism to turn over at a certain angle; the inner shell is fixedly connected with the base; the invention ensures that the imaging module can still ensure the quality of imaging image quality in a shooting state of large-angle shake by the offset of the image sensor and the overturning of the lens by the lens deflection device, and reduces the loss of the image quality in shooting in the shake state.

Description

Double-OIS camera module device

Technical Field

The invention relates to the field of camera modules, in particular to a double-OIS camera module device.

Background

In recent years, with the rapid development of smart phones, photographing is continuously upgraded and evolved as a core requirement thereof, and is continuously expanded in other fields including security cameras, vehicle-mounted cameras and the like. From shooting to video, how to obtain stable and clear image quality under the condition of shaking is a higher requirement of users on a shooting module; most of anti-shake functions of camera modules in the current market realize optical anti-shake through LENS SHIFT (lens shift); in the device with larger anti-shake angle, the anti-shake precision is lower, so that the image quality loss of an imaging picture is serious; in the device with smaller anti-shake angle, although the anti-shake precision is higher, in many shooting scenes, the application range is smaller, and the shooting requirement in the large-angle shake state in the moving process is difficult to meet;

Therefore, the invention provides a double OIS camera module device, which realizes small-angle fine adjustment and large-angle correction through the combination of small-angle image sensor offset and large-angle lens offset, improves the application range of a shooting scene while ensuring higher image quality of an imaging picture, and meets the shooting requirement in a large-angle shaking state in the moving process.

Disclosure of Invention

The technical scheme adopted by the invention is as follows: a double OIS camera module device comprises an FPC integrated group, a base, an inner shell, a PCB board and a magnet;

CMOSSensor is fixedly arranged on the PCB; the PCB is elastically connected with the base through a plurality of elastic sheets, and can move along any direction of the plane of the base through the elastic sheets;

A lens mechanism is fixedly arranged on the inner shell, and light rays reach the CMOSSensor through the lens mechanism;

the magnet is at least provided with one magnet and is fixedly connected with the inner shell; at least one group of coils are fixedly arranged on the PCB, and at least one group of coils are opposite to at least one magnet;

At least two Hall ICs are fixedly arranged on the PCB, and the at least one Hall IC is used for detecting the real-time displacement distance of the PCB relative to the X direction of the base; the at least one Hall IC is used for detecting the real-time displacement distance of the PCB relative to the Y direction of the base;

The lens deflection device is used for driving the lens mechanism to turn over at a certain angle;

The inner shell is fixedly connected with the base; a gyroscope and a driving IC are fixedly arranged on the FPC integrated group; the lens mechanism, the PCB and the lens deflection device are electrically connected with the FPC integrated assembly.

Further, at least three beads are arranged on the base, and the surface of each bead is contacted with the bottom surface of the PCB; the base is provided with at least three ball grooves, each ball is respectively positioned in one ball groove, and each ball can rotate in any direction on the base.

Further, the lens mechanism includes: a lens group, a connecting shell and a lens connecting frame; the connecting shell is fixedly arranged on the inner shell;

The lens connecting frame is elastically connected with the connecting shell through a zooming elastic sheet group, and the lens connecting frame moves up and down relative to the connecting shell through the zooming elastic sheet group;

at least one zoom coil is fixedly arranged on the lens connecting frame, and at least one zoom coil is opposite to at least one magnet;

the lens group is fixedly connected with the lens connecting frame; the zoom coil is electrically connected with the FPC integrated assembly.

Further, each magnet is fixedly mounted on the connecting shell.

Further, the zooming spring piece group includes: a first zooming spring piece; the first zoom spring plate is at least provided with one, the lens connecting frame is elastically connected with the connecting shell through at least one first zoom spring plate, and the lens connecting frame moves up and down relative to the connecting shell through at least one first zoom spring plate.

Further, the zooming spring piece group further comprises: a second zoom spring plate; the second zoom spring plate is at least provided with one, and the lens connecting frame is elastically connected with the connecting shell through at least one first zoom spring plate and at least one second zoom spring plate; the lens connecting frame moves up and down relative to the connecting shell through at least one first zooming spring piece and at least one second zooming spring piece.

Furthermore, a plurality of limiting plates are fixedly arranged on the connecting shell, and each limiting plate is used for providing supporting force for the lens connecting frame.

Further, the lens deflection device includes: the deflection yoke comprises an outer frame, a deflection coil, a deflection magnet and a deflection Hall IC;

the outer frame is rotationally connected with the inner shell; the deflection magnets are at least provided with one and are fixedly connected with the inner shell; the deflection coils are at least provided with one deflection coil and are fixedly connected with the outer frame; at least one of the deflection magnets is opposite to at least one of the deflection coils;

The deflection Hall ICs are at least provided with one and are fixedly connected with the outer frame, and at least one deflection Hall IC is used for monitoring the deflection angle of the inner shell relative to the outer frame in real time;

The deflection coil and the deflection Hall IC are electrically connected with the FPC integrated assembly.

Further, the lens deflection device further includes: a deflection frame; the inner shell is fixedly arranged on the deflection frame, and the deflection frame is rotationally connected with the outer frame; each deflection magnet is fixedly arranged on the deflection frame.

Further, the deflection frame is provided with a plurality of protrusions for limiting the rotation angle of the deflection frame relative to the outer frame, and the outer frame is provided with grooves matched with the protrusions on the deflection frame.

Further, the outer frame is fixedly connected with the FPC integrated group, and each deflection coil and each deflection Hall IC are fixedly installed on the FPC integrated group.

Further, a shell is fixedly arranged on the outer side of the outer frame.

Further, an optical filter is fixedly installed on the lens group, and the optical filter is located between the lens group and the CMOS Sensor.

Due to the adoption of the technical scheme, the invention has the following beneficial effects: according to the invention, the shake prevention under the small-angle shake state is satisfied through the X, Y two-axis direction offset of the image sensor, the shake prevention precision is high, meanwhile, the lens is turned through the lens deflection device, the shake prevention under the large-angle shake state is satisfied, and the shake prevention range is large; through the offset of the image sensor and the overturning of the lens by the lens deflection device, the quality of imaging image quality can be ensured still in the shooting state of large-angle shake of the camera shooting module, and the loss of image quality in shooting in the shake state is reduced.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present invention.

Fig. 2-3 are schematic views of part of the structure of the present invention.

Fig. 4 is a sectional view in the direction a of fig. 3 according to the present invention.

Fig. 5 is a sectional view in the direction B of fig. 3 according to the present invention.

Fig. 6 is a schematic diagram of the positional relationship between a PCB board and a chassis according to the present invention.

Fig. 7 to 8 are schematic views of a lens mechanism according to the present invention.

Fig. 9 is a sectional view showing a part of the structure of the lens mechanism of the present invention.

Fig. 10 is a schematic diagram of the overall structure of the lens deflection device of the present invention.

Fig. 11 is a schematic view of a portion of a lens deflector according to the present invention.

FIG. 12 is a schematic view showing the positional relationship between the outer frame and the deflection frame according to the present invention.

Fig. 13 is a cross-sectional view in the direction C of fig. 12 in accordance with the present invention.

Fig. 14 is an enlarged schematic view of the structure of fig. 13D according to the present invention.

Reference numerals: PCB integrated group-1; a lens mechanism-2; lens group-3; a base-4; an inner shell-5; a PCB board-6; ball-7; CMOS Sensor-8; a spring plate-9; magnet-10; a coil-11; hall IC-12; an outer frame-13; a deflection yoke 14; deflection coils-15; a deflection magnet 16; a housing-17; a filter-18; a connection shell-21; a lens connecting frame-22; a zoom coil-23; a first zooming spring piece-24; a second zooming spring piece-25; and a limiting disc-26.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

1-11, A dual OIS camera module device comprises an FPC integrated group 1, a base 4, an inner shell 5, a PCB 6 and a magnet 10;

CMOSSensor8 is fixedly arranged on the PCB 6; the PCB 6 is elastically connected with the base 4 through four elastic sheets 9, and the PCB 6 can move along any direction of the plane of the base 4 through the elastic sheets 9;

the inner shell 5 is fixedly provided with a lens mechanism 2, and light rays reach CMOSSensor through the lens mechanism 2;

the magnets 10 are arranged in four and are all positioned in the same plane and are all fixedly connected with the inner shell 5; at least four groups of coils 11 are fixedly arranged on the PCB 6, and each group of coils 11 is opposite to one magnet 10;

Two Hall ICs 12 are fixedly arranged on the PCB6, and one Hall IC12 is used for detecting the real-time displacement distance of the PCB6 relative to the X direction of the base 4; the other Hall IC12 is used for detecting the Y-direction real-time displacement distance of the PCB6 relative to the base 4;

the lens deflection device is used for driving the lens mechanism 2 to turn over at a certain angle;

The inner shell 5 is fixedly connected with the base 4; a gyroscope and a driving IC are fixedly arranged on the FPC integrated group 1; the lens mechanism 2, the PCB 6 and the lens deflection device are electrically connected with the FPC integrated assembly 1; the PCB 6 and the FPC integrated assembly 1 are in signal transmission through an ultra-flexible circuit board; the FPC integrated group 1 is electrically connected with the SOC; when the gyroscope detects shaking, a real-time signal of the shaking angle is transmitted to the SOC, the SOC transmits a signal to the drive IC according to the signal of the gyroscope, and the drive IC independently changes the current sizes in the four coils 11, so that the PCB 6 overcomes the elastic force of the four elastic sheets 9 and displaces towards a specified direction and distance relative to the base 4, and the lens mechanism 2 is fixedly arranged on the inner shell 5, and the inner shell 5 is fixedly connected with the base 4, so that the PCB 6 displaces relative to the base 4, namely the CMOS Sensor8 displaces towards the lens mechanism 2, thereby realizing the anti-shaking effect; the two Hall ICs respectively detect real-time displacement of the PCB 6 relative to the X, Y direction of the base 4 in real time, the real-time displacement distance of the PCB 6 is transmitted to the SOC, the SOC judges whether jitter compensation is met in real time, and transmits instructions to the driving IC, whether the current in the four coils 11 is changed and how to change; thereby realizing high-precision small-angle anti-shake; when the gyroscope detects shaking, the lens deflection device is started, the SOC controls the lens deflection device to drive the lens mechanism 2 to turn over the angle according to the shaking angle detected by the gyroscope, so that large-angle shaking prevention is realized, the lens mechanism 2 is driven to turn over by the lens deflection device and the movement of the PCB 6, high-precision large-angle shaking prevention is realized, and further, the image quality loss of an imaging picture in the shaking process is reduced.

Specifically, as shown in fig. 4, four beads 7 are provided on the base 4, and the surface of each bead 7 is in contact with the bottom surface of the PCB 6; four ball grooves are formed in the base 4, each ball 7 is located in one ball groove, and each ball 7 can rotate in any direction on the base 4; play the effect of further supporting the PCB board through four ball 7 to four ball 7 can not influence PCB board 6, and PCB board 6 still can carry out the slip of arbitrary direction on base 4.

Specifically, as shown in fig. 7 to 9, the lens mechanism 2 includes: a lens group 3, a connection housing 21, and a lens connection frame 22; the connection housing 21 is fixedly mounted on the inner housing 5;

the lens connecting frame 22 is elastically connected with the connecting shell 21 through a zooming spring piece group, and the lens connecting frame 22 moves up and down relative to the connecting shell 21 through the zooming spring piece group, so that the lens group 3 moves up and down relative to the CMOS Sensor8, and the zooming effect is achieved;

a zoom coil 23 is fixedly arranged on the lens connecting frame 22, and the zoom coil 23 is positioned in the four magnets 10 for each magnet 10;

The lens group 3 is fixedly connected with the lens connecting frame 22; the zoom coil 23 is electrically connected with the FPC integrated group 1; each magnet 10 is fixedly mounted on the connection housing 21; when zooming is needed, the SOC transmits a signal to the drive IC, and the drive IC changes the current in the zoom coil 23, so that the lens group 3 overcomes the elasticity of the zoom elastic sheet group and can move up and down, the distance between the lens group 3 and CMOSSensor is changed, and the zooming effect is realized.

Specifically, as shown in fig. 7 to 8, the zoom dome group includes: a first zoom spring piece 24; the first zoom spring piece 24 is provided with one, the lens connecting frame 22 is elastically connected with the connecting shell 21 through the first zoom spring piece 24, the lens connecting frame 22 moves up and down relative to the connecting shell 21 through the first zoom spring piece 24, and the zoom spring piece group further comprises: a second zoom spring piece 25; the second zoom spring pieces 25 are provided with four, and the lens connecting frame 22 is elastically connected with the connecting shell 21 through the first zoom spring pieces 24 and the second zoom spring pieces 25; the lens connecting frame 22 moves up and down relative to the connecting shell 21 through a first zooming spring piece 24 and a second zooming spring piece 25; the first zoom spring piece is located at the upper end of the lens connecting frame 22, and the second zoom spring piece 25 is located at the lower end of the lens connecting frame 22, so that the lens connecting frame 22 is more stable.

Specifically, as shown in fig. 8, four limiting plates 26 are fixedly mounted on the connection housing 21, and each limiting plate 26 is used for providing a supporting force for the lens connection frame 22; the position of the limiting disc 26 is a position for achieving debugging, namely, the minimum zoom multiple when the limiting disc 26 supports the lens connecting frame 22; when the camera module is not started, the limiting disc 26 always supports the lens connecting frame 22, when the camera module is started, the zoom coil 23 is electrified and moves to the position with the zoom multiple of 1, and then the current in the zoom coil 23 is changed according to the zoom multiple to be changed.

Specifically, as shown in fig. 10 to 14, the lens deflection apparatus includes: an outer frame 13, a deflection coil 15, a deflection magnet 16, and a deflection hall IC;

The outer frame 13 is rotationally connected with the inner shell 5; the number of the deflection magnets 16 is determined according to the weight of the lens group 3, the higher the weight of the lens group 3 is, the more the number of the deflection magnets 16 is, and each deflection magnet 16 is fixedly connected with the inner shell 5; the number of the deflection coils 15 is equal to that of the deflection magnets 16, and the deflection coils are fixedly connected with the outer frame 13; each deflection magnet 16 is facing one deflection coil 15;

the deflection Hall IC is provided with one deflection Hall IC and is fixedly connected with the outer frame 13, and the deflection Hall IC is used for monitoring the deflection angle of the inner shell 5 relative to the outer frame 13 in real time;

The deflection coil 15 and the deflection hall IC are electrically connected with the FPC integrated set 1, and the lens deflection device further includes: a deflection yoke 14; the inner shell 5 is fixedly arranged on the deflection frame 14, and the deflection frame 14 is rotationally connected with the outer frame 13; as shown in fig. 13 to 14, a first sleeve 19 is fixedly installed on the opposite angles of one pair of deflection frames 14, a second sleeve 20 is fixedly installed on the opposite angles of one pair of outer frames 13, and the two first sleeves 19 and the two second sleeves 20 are on the same axis; a rotating shaft 201 is inserted between a second sleeve 20 on the outer frame 13 and a first sleeve 19 on the corresponding deflection frame 14; the outer frame 13 and the deflection frame 14 are rotatably connected through two rotating shafts 201; each deflection magnet 16 is fixedly mounted on the deflection yoke 14; for clarity of explanation of the present technical solution, in this embodiment, the number of the deflection magnets 16 is two, and both are located on the same side of the rotation axis of the deflection frame 14 and the outer frame 13; when the gyroscope detects shaking, a real-time shaking signal is transmitted to the SOC, the SOC transmits an instruction to the drive IC, and the drive IC changes the current in the two deflection coils, so that the deflection frame 14 rotates on the outer frame 13; the deflection hall IC monitors the rotation angle of the deflection yoke 14 in real time and transmits a signal to the SOC, which judges whether the rotation angle of the deflection yoke 14 meets the requirement, whether jitter compensation is satisfied, and transmits instructions to the driving IC, whether the current in the two deflection collars 15 is changed, and how the current in the two deflection coils 15 is changed.

Specifically, as shown in fig. 10, two protrusions for limiting the rotation angle of the deflection frame 14 relative to the outer frame 13 are provided on the deflection frame 14, and a groove matched with each protrusion on the deflection frame 14 is provided on the outer frame 13; the maximum deflection angle of the deflection frame 14 is determined according to the depth of the groove on the outer frame 13 and the protrusion on the deflection frame 14, i.e. the deflection frame 14 reaches the maximum deflection angle when the protrusion on the deflection frame 14 contacts the lowest point of the groove on the outer frame 13.

Specifically, the outer frame 13 is fixedly connected with the FPC integrated assembly 1, each deflection coil 15 and each deflection Hall IC are fixedly installed on the FPC integrated assembly 1, a shell 17 is fixedly installed on the outer side of the outer frame 13, a light filter 18 is fixedly installed on the lens assembly 3, and the light filter 18 is located between the lens assembly 3 and the CMOS Sensor 8; the light passes through the lens group 3 and the filter 18 to CMOSSensor.

In embodiment 2, when the weight of the lens group 3 increases, the number of deflection magnets 16 is increased to four, and the deflection coils 15 are respectively and fixedly mounted on the four sides of the deflection yoke 14, and the number of deflection coils 15 is increased to four, corresponding to each deflection magnet 16, respectively, two deflection magnets 16 on both sides of the rotation axis of the deflection yoke 14 and the outer frame 13, respectively, and when the deflection yoke 14 rotates, the current directions in the deflection coils 15 on both sides of the rotation axis of the deflection yoke 14 and the outer frame 13 are opposite.

Working principle: after the camera module is started, when the gyroscope detects shaking, a real-time shaking signal is transmitted to the SOC, the SOC transmits a signal to the drive IC, the drive IC simultaneously controls the current magnitude and the current direction in each coil 11 and the current magnitude and the current direction in each deflection coil 15, so that the PCB 6 is controlled to move and the lens group 3 is controlled to rotate, the Hall IC12 and the deflection Hall IC respectively monitor the displacement distance of the PCB 6 and the rotation angle of the deflection frame 14 in real time, the signal is transmitted to the SOC, the SOC judges whether shaking compensation is met or not, and the drive IC is transmitted with the signal according to the judging result, and the current magnitude and the current direction in each coil 11 and the deflection coil 15 are changed or not; the SOC sends real-time signals to the drive IC according to the real-time shaking signals detected by the gyroscope, and the currents in the coil 11 and the deflection coil 15 are changed in real time, and the displacement distance of the PCB 6 and the rotation angle of the deflection frame 14 are monitored by the Hall IC12 and the deflection Hall IC in real time and transmitted to the SOC, so that accurate closed-loop control is realized; the rotation of the deflection frame 14 is used for large-angle anti-shake compensation, and the movement of the PCB 6 is used for small-angle and high-precision anti-shake compensation, so that the large-angle and high-precision anti-shake compensation is realized, and the loss of shooting image quality in the shake process is reduced.

The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.

Claims

1. The double-OIS camera module device is characterized by comprising an FPC integrated group (1), a base (4), an inner shell (5), a PCB (6) and a magnet (10);

CMOSSensor (8) is fixedly arranged on the PCB (6); the PCB (6) is elastically connected with the base (4) through a plurality of elastic pieces (9), and the PCB (6) can move along any direction of the plane of the base (4) through the elastic pieces (9);

A lens mechanism (2) is fixedly arranged on the inner shell (5), and light rays reach the CMOSSensor (8) through the lens mechanism (2);

The magnet (10) is at least provided with one magnet and is fixedly connected with the inner shell (5); at least one group of coils (11) is fixedly arranged on the PCB (6), and at least one group of coils (11) is opposite to at least one magnet (10);

At least two Hall ICs (12) are fixedly arranged on the PCB (6), and at least one Hall IC (12) is used for detecting the real-time displacement distance of the PCB (6) relative to the X direction of the base (4); the Hall IC (12) is used for detecting the Y-direction real-time displacement distance of the PCB (6) relative to the base (4);

The lens deflection device is used for driving the lens mechanism (2) to turn over at a certain angle;

The inner shell (5) is fixedly connected with the base (4); a gyroscope and a driving IC are fixedly arranged on the FPC integrated group (1); the lens mechanism (2), the PCB (6) and the lens deflection device are electrically connected with the FPC integrated assembly (1);

the lens mechanism (2) includes: a lens group (3), a connecting shell (21) and a lens connecting frame (22); the connecting shell (21) is fixedly arranged on the inner shell (5);

The lens connecting frame (22) is elastically connected with the connecting shell (21) through a zooming spring piece group, and the lens connecting frame (22) moves up and down relative to the connecting shell (21) through the zooming spring piece group;

At least one zoom coil (23) is fixedly arranged on the lens connecting frame (22), and at least one zoom coil (23) is opposite to at least one magnet (10);

The lens group (3) is fixedly connected with the lens connecting frame (22); the zoom coil (23) is electrically connected with the FPC integrated assembly (1);

The lens deflection device includes: an outer frame (13), a deflection coil (15), a deflection magnet (16) and a deflection Hall IC;

The outer frame (13) is rotationally connected with the inner shell (5); the deflection magnet (16) is at least provided with one and is fixedly connected with the inner shell (5); the deflection coils (15) are at least provided with one and are fixedly connected with the outer frame (13); at least one of the deflection magnets (16) is opposite to at least one of the deflection coils (15);

The deflection Hall ICs are at least provided with one and are fixedly connected with the outer frame (13), and the at least one deflection Hall IC is used for monitoring the deflection angle of the inner shell (5) relative to the outer frame (13) in real time;

The deflection coil (15) and the deflection Hall IC are electrically connected with the FPC integrated assembly (1).

2. The dual OIS camera module device according to claim 1, characterized in that the base (4) is provided with at least three beads (7), and each bead (7) surface is contacted with the bottom surface of the PCB (6); the base (4) is provided with at least three ball grooves, each ball (7) is located in one ball groove, and each ball (7) can rotate in any direction on the base (4).

3. A dual OIS camera module assembly according to claim 1, characterized in that each magnet (10) is fixedly mounted on the connection housing (21).

4. The dual OIS camera module assembly of claim 1, wherein the zoom dome assembly comprises: a first zoom spring piece (24); the first zoom spring piece (24) is at least provided with one, the lens connecting frame (22) is elastically connected with the connecting shell (21) through at least one first zoom spring piece (24), and the lens connecting frame (22) moves up and down relative to the connecting shell (21) through at least one first zoom spring piece (24).

5. The dual OIS camera module assembly of claim 4, wherein the zoom dome assembly further comprises: a second zoom spring piece (25); the second zoom spring piece (25) is at least provided with one, and the lens connecting frame (22) is elastically connected with the connecting shell (21) through at least one first zoom spring piece (24) and at least one second zoom spring piece (25); the lens connecting frame (22) moves up and down relative to the connecting shell (21) through at least one first zooming spring piece (24) and at least one second zooming spring piece (25).

6. A dual OIS camera module device according to claim 1, characterized in that a plurality of limiting plates (26) are fixedly mounted on the connecting housing (21), each limiting plate (26) being used for providing a supporting force for the lens connecting frame (22).

7. The dual OIS camera module apparatus of claim 1, wherein the lens deflecting means further comprises: a deflection frame (14); the inner shell (5) is fixedly arranged on the deflection frame (14), and the deflection frame (14) is rotationally connected with the outer frame (13); each deflection magnet (16) is fixedly mounted on the deflection frame (14).

8. The dual OIS camera module device according to claim 7, wherein the deflection frame (14) is provided with a plurality of protrusions for limiting the rotation angle of the deflection frame (14) relative to the outer frame (13), and the outer frame (13) is provided with a groove matched with each protrusion on the deflection frame (14).