CN115938231A - Display module and display device - Google Patents

Abstract

The utility model relates to a display module assembly, this display module assembly include main flexible circuit board, and one side that main flexible circuit board is close to display substrates is equipped with first depressed part, is equipped with the pad in the first depressed part, is connected with electronic components on the pad, and first protective layer is equipped with the recess in electronic components's orthographic projection region, and the part that electronic components salient main flexible circuit board is located the recess. Electronic components locates in flexible circuit board and the first protective layer, has saved electronic components and at the shared size of the portion of binding of display module assembly, has reduced display module assembly's thickness greatly, is favorable to display module assembly's frivolousization, can play the guard action to electronic components moreover. The present disclosure also provides a display device including the display module.

Description

Display module and display device

technical field

The present disclosure relates to the field of display technologies, and in particular, to a display module and a display device.

Background technique

With the popularization of Organic Light-Emitting Diode (OLED), Main Flexible Printed Circuit (MFPC), which can be bent together with OLED screen, has become the main display driver module due to its cost advantage .

Using the main flexible circuit board to bend and bind the display panel can reduce the size of the main flexible circuit board in the plane direction, but it will increase the thickness of the binding part of the display module, which is not conducive to realizing the thinning of the display module .

It should be noted that the information disclosed in the above background section is only for enhancing the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to those of ordinary skill in the art.

Contents of the invention

The purpose of the present disclosure is to overcome the problem of increasing the thickness of the display module at the binding part when the main flexible circuit board is used to bend and bind the display panel, and to provide a display module and a display device.

According to one aspect of the present disclosure, a display module is provided, including a display substrate, a driver chip and a main flexible circuit board. The display substrate includes a display part, a bending part and a binding part, and the bending part is connected to one end of the display part. And bend to the non-display surface of the display part, the binding part is connected to the end of the bending part away from the display part; the driving chip is bound to the side of the binding part away from the display part, and the driving chip is provided The first protective layer, the first protective layer covers the driver chip and at least part of the binding part; the main flexible circuit board is connected to the side of the first protective layer away from the display substrate, and the main flexible circuit board is bound to the binding part; the main flexible circuit board A side of the board close to the display substrate is provided with a first recess, and a pad is provided in the first recess, and electronic components are connected to the pad, and the first protective layer is provided with a groove in the orthographic projection area of the electronic component. The part of the electronic components protruding from the main flexible circuit board is located in the groove.

In one embodiment of the present disclosure, the side of the main flexible circuit board close to the display substrate is provided with a plurality of first depressions, each first depression is provided with a pad, and each pad is connected to an electronic element. For the device, the first protection layer is provided with a plurality of grooves corresponding to the plurality of electronic components, and the parts of the plurality of electronic components protruding from the main flexible circuit board are respectively located in the grooves.

In one embodiment of the present disclosure, at least two first recesses have different depths, the electronic components arranged in the first recesses with different depths have different sizes along the first direction, and the electronic components of different sizes are close to the display One ends of the substrates are flush with each other, and the first direction is the thickness direction of the flexible circuit board.

In one embodiment of the present disclosure, the main flexible circuit board includes at least two sub-layer groups, the sub-layer groups include a conductive layer and an insulating layer arranged in sequence along a direction away from the display substrate, the first recess passes through part of the sub-layer groups, The conductive layer of another part of the sub-layer group is exposed, and the welding pad is arranged on the same layer as the conductive layer that exposes the first recessed part.

In one embodiment of the present disclosure, the first recesses of different depths pass through sub-layer groups with different numbers of layers, exposing conductive layers of different sub-layer groups in another sub-layer group, and pads of electronic components of different sizes It is arranged in the same layer as the conductive layer of different sublayer groups.

In one embodiment of the present disclosure, the side of the binding part away from the display part is provided with a second binding pin, and the flexible circuit board further includes a first connecting part, which is bent and bound to the second binding part. On the fixed pin, the bent portion is set on the same layer as the conductive layer of one sub-layer group in all sub-layer groups.

In one embodiment of the present disclosure, at least two electronic components are connected to each pad, and the electronic components on the same pad have the same size along the first direction.

In one embodiment of the present disclosure, each electronic component corresponds to a groove, and at least two electronic components on the same pad protrude from the main flexible circuit board and are located in different grooves.

In one embodiment of the present disclosure, each pad corresponds to a groove, and the parts of at least two electronic components protruding from the main flexible circuit board on the same pad are located in the same groove.

In an embodiment of the present disclosure, the display module further includes an adhesive layer, and the adhesive layer is respectively bonded to the first protective layer and the main flexible circuit board.

In one embodiment of the present disclosure, the adhesive layer is a pressure sensitive adhesive.

In one embodiment of the present disclosure, a support layer is provided between the display part and the binding part, a first back film is provided between the support layer and the display part, and a second back film is provided between the support layer and the binding part , a heat dissipation film is arranged between the first back film and the supporting layer.

According to another aspect of the present disclosure, a display device is provided, including the display module described in any one aspect of the present disclosure.

The display module of the present disclosure includes a main flexible circuit board. The side of the main flexible circuit board close to the display substrate is provided with a first recessed part. A pad is provided in the first recessed part, and electronic components are connected to the pad. The first The protection layer is provided with grooves in the front projection area of the electronic components, and the part of the electronic components protruding from the main flexible circuit board is located in the grooves. The electronic components are arranged in the flexible circuit board and the first protective layer, which saves the size occupied by the electronic components in the binding part of the display module, greatly reduces the thickness of the display module, and is beneficial to the display module. Light and thin, and can protect electronic components.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure. Apparently, the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can obtain other drawings according to these drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of a display module involved in an embodiment of the present disclosure.

FIG. 2 is a schematic cross-sectional view of another display module involved in an embodiment of the present disclosure.

FIG. 3 is a schematic cross-sectional view of another display module involved in an embodiment of the present disclosure.

FIG. 4 is a schematic cross-sectional view of another display module involved in an embodiment of the present disclosure.

FIG. 5 is a schematic cross-sectional view of another display module when the flexible circuit board involved in the embodiment of the present disclosure has a multi-layer structure.

FIG. 6 is a schematic cross-sectional view of another display module when the flexible circuit board involved in the embodiment of the present disclosure has a multi-layer structure.

FIG. 7 is another schematic cross-sectional view of another display module when the flexible circuit board involved in the embodiment of the present disclosure has a multi-layer structure.

8 is another schematic cross-sectional view of another display module when the flexible circuit board involved in the embodiment of the present disclosure has a multi-layer structure.

FIG. 9 is a schematic plan view of another display module according to an embodiment of the present disclosure.

In the figure: 1-display substrate, 101-display part, 102-bending part, 103-binding part, 1031-first binding area, 1032-second binding area, 1033-second binding pin, 2-support layer, 3-second back film, 4-first back film, 5-heat dissipation film, 6-drive chip, 7-first protective layer, 701-groove, 8-main flexible circuit board, 801- Sublayer group, 8011-insulating layer, 8012-conductive layer, 802-first recessed part, 803-pad, 804-first connecting part, 805-second connecting part, 9-electronic components, 10-bonding layer, 11-second protective layer, 12-battery compartment.

Detailed ways

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is turned over so that it is upside down, then elements described as being "upper" will become elements that are "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" placed on another structure, or that a structure is "indirectly" placed on another structure through another structure. other structures.

The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements/components/etc; the terms "comprising" and "have" are used to indicate an open and means that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first", "second" and "third" etc. only Used as a marker, not a limit on the number of its objects.

At present, the display device pursues a light and thin design, so the internal space of the display device is very compact. Some display devices can be carried around, and usually need to be powered by batteries. In order to have a larger battery compartment for this display device, the size of the main flexible circuit board in the display module is compressed more and more to the limit, in order to provide more The large battery compartment is provided for the display device without increasing the thickness of the display device, but the large number of signal lines and power lines greatly limits the compression space for the main flexible circuit board.

Therefore, it is considered to bend the main flexible circuit board for driving the display device to the back of the display panel. As shown in Figure 1, the display module includes a display substrate 1, a driver chip 6 and a main flexible circuit board 8, the display substrate 1 includes a display part 101, a bending part 102 and a binding part 103, the bending part 102 is connected to the display One end of the bending portion 101 is bent toward the non-display surface of the display portion 101 , and the binding portion 103 is connected to the end of the bending portion 102 away from the display portion 101 . A support layer 2 is provided between the display part 101 and the binding part 103, a first back film 4 is provided between the support layer 2 and the display part 101, and a second back film 3 is provided between the support layer 2 and the binding part 103 A heat dissipation film 5 is provided between the first back film 4 and the supporting layer 2 .

The orthographic projection of the binding portion 103 on the display portion 101 is located inside the display portion 101, and the side of the binding portion 103 away from the display portion 101 is provided with a first binding area 1031 and a second binding area 1032, the first binding area 1031 and the second binding area 1032 are successively away from the bending portion 102, wherein the first binding area 1031 is provided with a plurality of first binding pins (not shown in FIG. 1 ), and the driver chip 6 is bound to a plurality of first binding pins. On a binding pin, the second binding area 1032 is provided with a plurality of second binding pins (not shown in FIG. 1 ), and the end of the flexible circuit board away from the bending portion 102 is provided with a first connecting portion 804, The first connecting portion 804 is bent and bound to a plurality of second binding pins.

A first protective layer 7 is provided on the side of the driving chip 6 away from the display substrate 1 , and the first protective layer 7 covers the driving chip 6 and at least the first bonding area 1031 . It should be noted that the first protective layer 7 is not in direct contact with the driving chip 6 , and there is a certain gap between them. The main flexible circuit board 8 is connected to the side of the first protective layer 7 away from the display substrate 1 , and the first protective layer 7 fills the gap between the main flexible circuit board 8 and the binding portion 103 . The display module further includes an adhesive layer 10 which is bonded to the first protective layer 7 and the main flexible circuit board 8 respectively.

It can be understood that, using the good bending performance of the first connecting portion 804, the main flexible circuit board 8 is bent 180 degrees, which can better reduce the size of the main flexible circuit board 8 in the plane, so that it can be predicted Leave more space to set the battery compartment 12. But at the same time, the side of the flexible circuit board away from the display substrate 1 is connected to the electronic components 9 through the pads 803, and the electronic components 9 will increase the thickness of the entire display device. Therefore, how to balance the dimension of the display device in the plane and the thickness direction is the key to realize the thinning of the display device.

Based on this, the embodiment of the present disclosure provides a display module to solve the problem of increasing the thickness of the display module at the binding part 103 when the main flexible circuit board 8 is used to bend and bind the display panel.

As shown in FIGS. 2 to 9, the display module includes a display substrate 1, a driver chip 6 and a main flexible circuit board 8. The display substrate 1 includes a display portion 101, a bending portion 102, and a binding portion 103. The bending portion 102 One end connected to the display portion 101, and bent toward the non-display surface of the display portion 101, the binding portion 103 is connected to the end of the binding portion 103 away from the display portion 101; the driver chip 6 is bound to the binding portion 103 away from the display portion 101, the driver chip 6 is provided with a first protection layer 7 on the side away from the display substrate 1, and the first protection layer 7 covers the driver chip 6 and at least part of the binding portion 103; the main flexible circuit board 8 is connected to the first protection layer 7. The side of the layer 7 away from the display substrate 1, the main flexible circuit board 8 is bound to the binding part 103; the side of the main flexible circuit board 8 close to the display substrate 1 is provided with a first concave part 802, and the first concave part 802 is provided with a There is a pad 803, and the electronic component 9 is connected to the pad 803. The first protective layer 7 is provided with a groove 701 in the orthographic projection area of the electronic component 9, and the part of the electronic component 9 protruding from the main flexible circuit board 8 is located In the groove 701.

The display module includes a main flexible circuit board 8, the main flexible circuit board 8 is provided with a first concave portion 802 on the side close to the display substrate 1, and a pad 803 is provided in the first concave portion 802, and the pad 803 is connected with an electronic circuit board. For the component 9 , the first protective layer 7 is provided with a groove 701 in the orthographic projection area of the electronic component 9 , and the part of the electronic component 9 protruding from the main flexible circuit board 8 is located in the groove 701 . The electronic components 9 are arranged in the flexible circuit board and the first protective layer 7, which saves the size occupied by the electronic components 9 in the binding part 103 of the display module, greatly reduces the thickness of the display module, and is beneficial to The lightness and thinness of the display module can also protect the electronic components 9 .

It should be noted that the first protective layer 7 usually adopts an adhesive layer, so that the connection with the main flexible circuit board can be realized.

The display module provided by the embodiments of the present disclosure will be described in detail below in conjunction with specific embodiments.

As shown in FIG. 2, the display module includes a display substrate 1, a driver chip 6 and a main flexible circuit board 8. The display substrate 1 includes a display part 101, a bending part 102 and a binding part 103. The bending part 102 is connected to the display One end of the binding portion 101 is bent toward the non-display surface of the display portion 101 , and the binding portion 103 is connected to the end of the binding portion 103 away from the display portion 101 . A support layer 2 is provided between the display part 101 and the binding part 103, a first back film 4 is provided between the support layer 2 and the display part 101, and a second back film 3 is provided between the support layer 2 and the binding part 103 , A heat dissipation film 5 is provided between the second back film 3 and the support layer 2 .

The display module also includes a second protective layer 11, the second protective layer 11 can be arranged on the outside of the bending portion 102, the second protective layer 11 can be an adhesive layer, and the second protective layer 11 can buffer the bending portion 102 during The bending stress received during the bending process prevents the metal traces and film layers in the bending portion 102 from being broken.

The side of the binding part 103 away from the display part 101 is provided with a first binding area 1031 and a second binding area 1032, the first binding area 1031 and the second binding area 1032 are in turn away from the bending part 102, wherein the first The binding area 1031 is provided with a plurality of first binding pins (not shown in FIG. 2 ), the driver chip 6 is bound on a plurality of first binding pins, and the second binding area 1032 is provided with a plurality of Two binding pins (not shown in Figure 2), the end of the flexible circuit board away from the bending part 102 is provided with a first connecting part 804, the first connecting part 804 is bent and bound to a plurality of second binding leads on feet.

A first protective layer 7 is provided on the side of the driving chip 6 away from the display substrate 1 , and the first protective layer 7 covers the driving chip 6 and at least the first bonding area 1031 . It should be noted that the first protective layer 7 is not in direct contact with the driving chip 6 , and there is a certain gap between them. The main flexible circuit board 8 is connected to the side of the first protective layer 7 away from the display substrate 1 , and the first protective layer 7 fills the gap between the main flexible circuit board 8 and the binding portion 103 . The display module also includes an adhesive layer 10, the adhesive layer 10 is bonded to the first protective layer 7 and the main flexible circuit board 8 respectively, and the first protective layer 7 and the main flexible circuit board 8 are connected together through the adhesive layer 10 , can improve the tightness of the connection between the flexible circuit board 8 and the first protective layer 7 .

It should be noted that, the adhesive layer 10 can specifically adopt pressure-sensitive adhesive. Pressure-sensitive adhesive is a type of adhesive that is sensitive to pressure. The adhesive force of the pressure-sensitive adhesive (the peeling force shown after the adhesive tape and the adhered surface is pressed and pasted) must be greater than the adhesive force (that is, the so-called light touch with fingers). The stickiness shown when lightly touching the adhesive tape).

The side of the main flexible circuit board 8 close to the display substrate 1 is provided with a first recessed portion 802, the first recessed portion 802 is provided with a pad 803, and the electronic component 9 is connected to the pad 803, and the pad can be connected to the via hole. The wiring inside the main flexible circuit board 8 is connected, and the first connecting part 804 is connected to the wiring inside the main flexible circuit board 8, and the pad is connected to the first connecting part, so that the electronic component 9 and the display substrate 1 are connected. Pass. The first protective layer 7 is provided with a groove 701 in the orthographic projection area of the electronic component 9 , and the part of the electronic component 9 protruding from the main flexible circuit board 8 is located in the groove 701 .

The main flexible circuit board 8 is attached to the first protective layer 7, and the length of the part of the electronic component 9 protruding from the main flexible circuit board 8 is usually less than or equal to the sum of the thickness of the first protective layer 7 and the thickness of the adhesive layer 10, Therefore, the sum of the depth of the first recess 802 , the depth of the groove 701 and the thickness of the adhesive layer 10 is greater than or equal to the size of the electronic component 9 along the first direction.

When the size of the electronic component 9 along the first direction is 650um, the size of the main flexible circuit board 8 along the first direction is 350um, the size of the adhesive layer 10 along the first direction is 50um, and the size of the protective layer along the first direction is 500um, it can be concluded that the size of the display module in Figure 1 along the first direction is the sum of the thickness of the electronic component 9, the thickness of the main flexible circuit board 8, the thickness of the adhesive layer 10 and the thickness of the protective layer, which is equal to 1550um. FIG. 2 shows that the dimension of the module along the first direction is equal to 900 um, which is equal to the sum of the thickness of the main flexible circuit board 8 , the thickness of the adhesive layer 10 and the thickness of the protective layer.

The thickness of the display module in Fig. 2 is compared with the thickness of the display module in Fig. 1, and the size of the electronic components 9 along the first direction is omitted, that is, the thickness of the display module in Fig. 2 is larger than that in Fig. 1 The thickness of the display module is 650um smaller, and the thickness of the display module is reduced by 42%.

A side of the main flexible circuit board 8 close to the display substrate 1 can be provided with a plurality of first recesses 802, and the plurality of first recesses 802 are arranged in sequence along the second direction, and each first recess 802 is provided with a pad 803 , each pad 803 is connected with a plurality of electronic components 9, the first protective layer 7 is provided with a plurality of grooves 701 respectively corresponding to the plurality of electronic components 9, and the plurality of electronic components 9 protrude from the main body Parts of the flexible circuit board 8 are respectively located in different grooves 701 .

It should be noted that the first direction is the thickness direction of the display module, that is, the z direction in FIG. 2 , and the second direction is the length direction of the display module, that is, the y direction in FIG. 2 .

Two electronic components 9 can be connected to each pad 803 , and the electronic components 9 on the same pad 803 have the same size along the first direction. As shown in FIG. 3 , each electronic component 9 corresponds to a groove 701, and the parts of at least two electronic components 9 protruding from the main flexible circuit board 8 on the same pad 803 are located in different grooves 701. The grooves 701 are separated from each other by part of the first protective layer 7 . The degree of freedom of the electronic component 9 is low, and it will not shake when the display module shakes. The whole display module has good stability and high compressive strength.

As shown in Figure 2, each pad 803 may also correspond to a groove 701, and the parts of the two electronic components 9 protruding from the main flexible circuit board 8 on the same pad 803 are located in the same groove 701, and the groove 701 The orthographic projection on the flexible circuit board may overlap with the orthographic projection of the first recess 802 on the flexible circuit board. Of course, the size of the groove 701 and the size of the first concave portion 802 can also be set to be unequal, for example: the size of the groove 701 is larger than the size of the first concave portion 802, and the size of the groove 701 is smaller than that of the first concave portion 802. size.

In other embodiments, all the electronic components 9 protruding from the main flexible circuit board 8 in the same accommodation area of the main flexible circuit board 8 can also be arranged in the same groove 701, so that only the protective layer Grooves are provided in different accommodating areas, which can reduce the difficulty of patterning the protective layer. Similarly, the electronic components 9 located in the same accommodating area can also be arranged on the same pad 803 , which can also reduce the difficulty of patterning the flexible circuit board.

Generally, electronic components 9 of different types or specifications have different sizes along the first direction. As shown in FIG. 3 , the depths of the two first recesses 802 are different, and the sizes of the electronic components 9 arranged in the first recesses 802 of different depths along the first direction are different, and the electronic components 9 of different sizes are close to each other. One ends of the display substrate 1 are flush with each other, and the first direction is the thickness direction of the main flexible circuit board 8 . It is also possible to set more first recesses 802 with different depths, which will not be repeated here. For the electronic components 9 with different sizes along the first direction, when the depths of the first recesses 802 are different, the depths of the corresponding grooves 701 may be different.

The main flexible circuit board 8 may include at least two sub-layer groups 801, the sub-layer group 801 includes a conductive layer 8012 and an insulating layer 8011 arranged in sequence along a direction away from the display substrate 1, the first recess 802 passes through part of the sub-layer group 801, The conductive layer 8012 of another sub-layer group 801 is exposed, the pad 803 is arranged on the same layer as the conductive layer 8012 exposing the first recessed part 802, and the bending part 102 is connected to the conductive layer of one sub-layer group 801 in all sub-layer groups 801. 8012 is set on the same floor.

As shown in FIG. 5 , the main flexible circuit board 8 may include three sublayer groups 801 , the first sublayer group 801 , the second sublayer group 801 and the third sublayer group 801 are separated from the display substrate 1 in sequence. The depths of the plurality of first depressions 802 are the same, the first depressions 802 pass through the first layer sub-layer group 801, exposing the conductive layer 8012 of the second layer sub-layer group 801, the pad 803 and the second layer sub-layer group 801 The conductive layer 8012 is set in the same layer. Of course, according to the size change of the electronic component 9 , the pad and the conductive layer 8012 of the third layer sub-layer group 801 can also be arranged in the same layer.

As shown in FIG. 6 , for electronic components 9 with different sizes along the first direction, first recesses 802 of different depths can be provided, specifically, the first recesses 802 pass through sub-layer groups 801 of different layers, exposing another Conductive layers 8012 of different sub-layer groups 801 in a part of sub-layer groups 801 , pads 803 of electronic components 9 of different sizes and conductive layers 8012 of different sub-layer groups 801 are arranged in the same layer. For example, the pads 803 of electronic components 9 of one size are located on the conductive layer 8012 of the second sublayer group 801 , and the pads 803 of electronic components 9 of another size are located on the conductive layer 8012 of the third sublayer group 801 . It should be noted that when the depths of the first recesses 802 corresponding to electronic components 9 of different sizes are different, the depths of the corresponding grooves 701 may be the same.

As shown in FIG. 7 , there may also be a case where the size of the electronic component 9 along the first direction is relatively small, and the height of the electronic component 9 with such a small size may be less than the sum of the thicknesses of the adhesive layer 10 and the protective layer. Therefore, for electronic components 9 of this size, there is no need to set the first recess 802, and the electronic components 9 of this size are directly welded on the conductive layer 8012 of the first sub-layer group 801, that is, the electronic components 9 of this size The pad 803 is set in the same layer as the conductive layer 8012 of the first sub-layer group 801 .

As shown in FIG. 8, when the size of the electronic components 9 of different sizes along the first direction is greater than the sum of the thicknesses of the adhesive layer 10 and the protective layer 7, the pads 803 of the electronic components 9 of different sizes can also be set to In the same sub-layer group 801, for example, different kinds of electronic components 9 are all arranged in the second layer sub-layer group 801, and for electronic components 9 of different sizes, the recesses in the orthographic projection area of the first protective layer 7 are provided. The depth of the groove 701 is different, and the parts of the electronic components 9 of different sizes protruding from the main flexible circuit board 8 are all equal to the sum of the thicknesses of the adhesive layer 10 and the protective layer 7, so that each electronic component 9 is close to one end of the display substrate 1 All are in close contact with the bottom of the groove 701, and when the display module is under pressure, all the electronic components 9 can share a certain amount of pressure, which can improve the compression resistance of the display module.

As shown in FIG. 9 , the first connecting portion 804 of the main flexible circuit board 8 is bound to a plurality of second binding pins 8033 of the display substrate 1, and the protective layer 7 has two different accommodating areas, which are respectively set and connected to the two pins. The grooves 701 whose shapes and sizes match the two accommodation areas are respectively provided with electronic components 9 of different types and sizes in the two grooves 701, and the driving chip 6 is connected with part of the electronic components in the two accommodation areas respectively. Device 9 is connected. Among them, the electronic components 9 in one accommodating area are connected to the external control circuit board through the second connection part 805 to switch the display screen, and a touch chip is provided in the other accommodating area, and the control command is transmitted by the touch chip The information is transmitted to the driver chip 6 to switch the display screen. It should be noted that, in addition to the touch chip, the electronic components 9 may also be capacitors, resistors and other components, which will not be listed here.

The display substrate needs to be bent, so it can be an OLED display substrate. The specific structure of the OLED display substrate will be described below. The OLED display substrate usually includes a driving backplane and a pixel layer. The pixel layer is arranged on the driving side of the driving backplane. A driving circuit is arranged in the driving backplane. The pixel layer includes a plurality of sub-pixels, and the driving circuit drives different sub-pixels to emit light, thereby realizing Display the display function of the module.

Embodiments of the present disclosure provide a display device. The display device may include any one of the above display modules. For the beneficial effects of the display device, reference may be made to the specific structure and beneficial effects of the display module, which will not be repeated here.

It should be noted that in addition to the display module, the display device also includes other necessary components and components. Taking the display as an example, such as the casing, the main control circuit board, the power cord, etc., those skilled in the art can according to the The specific usage requirements of the display device are correspondingly supplemented, which will not be repeated here.

Display devices are generally traditional medium and large electronic devices, such as computers and video recorders, and of course small electronic devices, such as mobile phones and wearable devices. Wearable devices can be specifically VR glasses, which are not mentioned here. to enumerate.

Other embodiments of the present disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with the true scope and spirit of the disclosure indicated by the appended claims.

Claims (13)

1. A display module, characterized in that, comprising: The display substrate includes a display part, a bending part and a binding part. The bending part is connected to one end of the display part and is bent toward the non-display surface of the display part. The binding part is connected to the an end of the bending portion away from the display portion; The driving chip is bound to the side of the binding part away from the display part, the side of the driving chip far away from the display substrate is provided with a first protective layer, and the first protective layer covers the driving chip and at least a portion of the binding portion; The main flexible circuit board is connected to the side of the first protective layer away from the display substrate, and the main flexible circuit board is bound to the binding part; The side of the main flexible circuit board close to the display substrate is provided with a first concave portion, and a pad is provided in the first concave portion, and electronic components are connected to the pad, and the first protective layer A groove is provided in the orthographic projection area of the electronic component, and the part of the electronic component protruding from the main flexible circuit board is located in the groove. 2. The display module according to claim 1, wherein the side of the main flexible circuit board close to the display substrate is provided with a plurality of first depressions, and each of the first depressions is provided with a There are pads, each of the pads is connected with electronic components, the first protective layer is provided with a plurality of grooves corresponding to the plurality of electronic components, and the plurality of electronic components The parts protruding from the main flexible circuit board are respectively located in the grooves. 3. The display module according to claim 2, wherein at least two of the first recesses have different depths, and the electronic components arranged in the first recesses with different depths are arranged along the second edge. The sizes in one direction are different, and the ends of the electronic components with different sizes close to the display substrate are flush with each other, and the first direction is the thickness direction of the flexible circuit board. 4. The display module according to claim 3, wherein the main flexible circuit board comprises at least two sub-layer groups, and the sub-layer groups include conductive layers and In an insulating layer, the first recess passes through part of the sub-layer group, exposing another part of the conductive layer of the sub-layer group, and the pad is arranged on the same layer as the conductive layer exposing the first recess. 5. The display module according to claim 4, wherein the first recesses of different depths pass through sub-layer groups with different numbers of layers, exposing another part of the different sub-layer groups in the sub-layer groups As for the conductive layer, the pads of the electronic components of different sizes are arranged on the same layer as the conductive layers of the different sub-layer groups. 6. The display module according to claim 5, wherein a second binding pin is provided on a side of the binding part away from the display part, and the flexible circuit board further comprises a first connecting part , the first connecting part is bent and bound to the second binding pin, and the bent part is arranged on the same layer as the conductive layer of one of the sub-layer groups in all the sub-layer groups. 7. The display module according to claim 3, wherein at least two electronic components are connected to each of the pads, and the electronic components on the same pad are connected along the second pad. The dimensions are the same in one direction. 8. The display module according to claim 7, wherein each of the electronic components corresponds to one of the grooves, and at least two of the electronic components on the same pad protrude from the Portions of the main flexible circuit board are located in different said grooves. 9. The display module according to claim 7, wherein each of the pads corresponds to one of the grooves, and at least two of the electronic components on the same pad protrude from the main flex. Parts of the circuit board are located in the same said groove. 10. The display module according to claim 1, wherein the display module further comprises an adhesive layer, and the adhesive layer is respectively bonded to the first protective layer and the main flexible circuit board . 11. The display module according to claim 10, wherein the adhesive layer is pressure sensitive adhesive. 12. The display module according to claim 1, wherein a support layer is provided between the display part and the binding part, and a first back is provided between the support layer and the display part. A film, a second back film is provided between the support layer and the binding part, and a heat dissipation film is provided between the first back film and the support layer. 13. A display device, comprising the display module according to any one of claims 1-12.

Images