CN115900815A - Combining Sensors and Electronics - Google Patents

Abstract

The embodiment of the application provides a combination sensor and electronic equipment, the combination sensor includes base plate and casing, the base plate includes first base plate and second base plate, the casing lid is located on the first base plate, be provided with the opening orientation on the first base plate the recess of casing, the second base plate connect in the opening part. First sensing module among the combination sensor with the second sensing module all set up in the second base plate orientation one side of casing has avoided piling up each other between first sensing module and the second sensing module, has reduced combination sensor's height, has realized combination sensor's miniaturized setting.

Description

Combining Sensors and Electronics

technical field

The present application belongs to the technical field of sensors, and in particular, the present application relates to a combined sensor and electronic equipment.

Background technique

With the continuous increase of functions on electronic equipment, more and more sensors are required in electronic equipment. In order to reduce the assembly space of electronic equipment, the development of combined sensors has become a market trend.

However, multiple chips in the traditional combination sensor are stacked on each other, resulting in an increase in the height of the combination sensor. The larger size of the combination sensor not only increases the internal space of the electronic device occupied by the combination sensor, but also increases the packaging difficulty of the combination sensor.

Contents of the invention

An object of the embodiments of the present application is to provide a technical solution for combining sensors and electronic devices, which can solve the problem of large size of traditional combined sensors.

According to a first aspect of an embodiment of the present application, a combined sensor is provided, including:

A substrate and a casing, the substrate includes a first substrate and a second substrate, the casing is covered on the first substrate, and the first substrate is provided with a groove opening toward the casing, so The second substrate is connected to the opening and is electrically connected to the first substrate, and the casing is provided with a vent hole;

A first sensing module and a second sensing module, the first sensing module includes a first MEMS chip and a first ASIC chip, and the second sensing module includes a second MEMS chip and a second ASIC chip;

A plurality of first welding parts are provided on the side of the first substrate facing the housing, and the first sensing module and the second sensing module are both arranged on the second substrate facing the housing. one side of the casing, and the first MEMS chip and the second MEMS chip are electrically connected to the first soldering portion.

Optionally, the first MEMS chip and the first ASIC chip are arranged at intervals on a side of the second substrate facing the casing.

Optionally, the second MEMS chip and the second ASIC chip are stacked on the side of the second substrate facing the housing, and the second ASIC chip is located between the second substrate and the between the second MEMS chips.

Optionally, a plurality of second welding portions are provided on a side of the first substrate facing the housing, and a plurality of third welding portions are provided on a side of the second substrate facing the groove;

The first soldering portion is exposed from the first substrate and is electrically connected to the second soldering portion, and the second soldering portion is opposite to the third soldering portion.

Optionally, a plurality of fourth welding parts are provided on the side of the second substrate facing the housing, and the fourth welding parts and the third welding parts are connected by internal wiring of the second substrate ;

The first ASIC chip and the second ASIC chip are electrically connected to the fourth soldering portion.

Optionally, a plurality of fifth welding portions are provided on a side of the second substrate facing the housing, and a plurality of sixth welding portions are provided on a side of the second substrate facing the groove, the The fifth welding part is connected to the sixth welding part through the internal wiring of the second substrate;

The first ASIC chip and the second ASIC chip are electrically connected to the fifth soldering portion.

Optionally, a plurality of seventh welding portions are provided on a side of the first substrate facing the housing;

The seventh welding portion is opposite to the sixth welding portion.

Optionally, the first sensing module is a microphone module;

A communication hole is provided on the second substrate, and the communication hole communicates with the back cavity of the first MEMS chip and the groove.

Optionally, a sealant is provided between the second substrate and the first substrate.

According to a second aspect of the embodiments of the present application, an electronic device is provided, including the combination sensor described in the first aspect.

A technical effect of the present application is:

An embodiment of the present application provides a combined sensor, the combined sensor includes a substrate and a housing, the substrate includes a first substrate and a second substrate, the housing is covered on the first substrate, and the second A groove with an opening facing the casing is provided on a base plate, and the second base plate is connected to the opening. The first sensing module and the second sensing module in the combined sensor are both arranged on the side of the second substrate facing the housing, avoiding the first sensing module and the second sensing module The sensing modules are stacked on each other, which reduces the height of the combined sensor and realizes the miniaturization of the combined sensor.

Other features of the present application and advantages thereof will become apparent through the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the embodiments of the application and together with the description serve to explain the principles of the application.

Fig. 1 is a side sectional view of a combined sensor provided by the embodiment of the present application;

Fig. 2 is a top view of a second substrate of a combined sensor provided by an embodiment of the present application;

Fig. 3 is a bottom view of a second substrate of a combined sensor provided in an embodiment of the present application;

Fig. 4 is a top view 1 of a first substrate of a combined sensor provided by an embodiment of the present application;

FIG. 5 is a second top view of a first substrate of a combined sensor provided in an embodiment of the present application.

in:

1. Substrate; 11. First substrate; 111. Groove; 112. First welding part; 113. Second welding part; 114. Seventh welding part; 12. Second substrate; 121. Third welding part; 122 , the fourth welding part; 123, the fifth welding part; 124, the sixth welding part; 125, the communication hole; 2, the shell; 21, the vent hole; 3, the first sensing module; 311, the back cavity; 32, the first ASIC chip; 4, the second sensing module; 41, the second MEMS chip; 42, the second ASIC chip;

Detailed ways

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as any limitation of the application, its application or uses.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

Referring to Fig. 1 to Fig. 5, the embodiment of the present application provides a combination sensor, which can integrate two or more of information such as sound, pressure and temperature into one sensor, so as to improve the combined sensor integration and functional diversity. The combined sensor includes:

A substrate 1 and a casing 2, the substrate 1 includes a first substrate 11 and a second substrate 12, the casing 2 is covered on the first substrate 11, and the first substrate 11 is provided with an opening facing the The groove 111 of the housing 2, the second substrate 12 is connected to the opening and electrically connected to the first substrate 11, the housing 2 is provided with a vent hole 21, and the vent hole 21 can Sensors used inside the combination sensor sense changes in airflow and air pressure.

The first sensing module 3 and the second sensing module 4, the first sensing module 3 includes the first MEMS chip 31 and the first ASIC chip 32, the second sensing module 4 includes the second MEMS chip 41 and the second ASIC chip 42; the first sensing module 3 and the second sensing module 4 can be respectively acoustic sensor and pressure sensing module, such as the first sensing module 3 can be a microphone module .

Referring to FIG. 1 and FIG. 4 , the first substrate 11 is provided with a plurality of first welding portions 112 on the side facing the housing 2 , for example, a plurality of first welding portions 112 are arranged at intervals on the top surface of the first substrate 11 edge; the first sensing module 3 and the second sensing module 4 are both arranged on the side of the second substrate 12 facing the housing 2, such as the first sensing module 3 and the second sensing module 3 The two sensing modules 4 are both disposed on the top surface of the second substrate 12 ; and the first MEMS chip 31 and the second MEMS chip 41 are electrically connected to the first soldering portion 112 .

Specifically, the first soldering portion 112 may be a pad, the first MEMS chip 31 and the second MEMS chip 41 both have pads, and the pads on the first MEMS chip 31 and the pads on the second MEMS chip 41 are respectively It is connected to different first soldering parts 112 through gold wires 5 .

Further, the second substrate 12 can be mounted on the first substrate 11, and the first soldering part 112 is connected to the first ASIC chip 32 and the second ASIC chip 42 through the second substrate 12, so as to realize that the first MEMS chip 31 passes through the second substrate 11. A welding portion 112 and the second substrate 12 are electrically connected to the first ASIC chip 32, and the second MEMS chip 41 is electrically connected to the second ASIC chip 42 through the first welding portion 112 and the second substrate 12; and the first ASIC chip 32 and The second ASIC chip 42 can also be electrically connected to the first substrate 11 through the second substrate 12, so as to ensure the signal transmission between the first sensing module 3 and the second sensing module 4, and ensure that the first sensing module 3 and the signal sensing stability of the second sensing module 4.

In the combined sensor provided in the embodiment of the present application, the first sensing module 3 and the second sensing module 4 are both arranged on the side of the second substrate 12 facing the housing 2, The mutual stacking between the first sensing module 3 and the second sensing module 4 is avoided, and the height of the combined sensor is reduced, which not only reduces the size of the combined sensor, but also simplifies the packaging process of the combined sensor.

Optionally, referring to FIG. 1 , the first MEMS chip 31 and the first ASIC chip 32 are arranged at intervals on a side of the second substrate 12 facing the housing 2 .

Specifically, the first MEMS chip 31 and the first ASIC chip 32 can be arranged at intervals on the same side of the second substrate 12, so as to avoid stacking of the first MEMS chip 31 and the first ASIC chip 32. Afterwards, the height of the combined sensor is increased, which simplifies the structure of the first sensing module 3 .

Optionally, referring to FIG. 1, the second MEMS chip 41 and the second ASIC chip 42 are stacked on the side of the second substrate 12 facing the housing 2, and the second ASIC chip 42 Located between the second substrate 12 and the second MEMS chip 41 .

Specifically, the second ASIC chip 42 can be arranged on the side of the second substrate 12 facing the housing 2 in a flip-chip packaging manner, specifically connecting the pads of the second ASIC chip 42 to the pads on the second substrate , the second MEMS chip 41 is mounted on the second ASIC chip 42 in a stacked manner, so as to realize the compact design of the second sensing module 4 .

In addition, referring to FIG. 1, the first MEMS chip 31, the first ASIC chip 32 and the second ASIC chip 42 can be arranged side by side on the side of the second substrate 12 facing the housing 2, and the first MEMS chip 31, A separation distance is spaced between the first ASIC chip 32 and the second ASIC chip 42, for example, a separation distance of 0.2-1.0 mm is reserved between the first ASIC chip 32 and the second ASIC chip 42 to ensure that the first ASIC chip 32 and the second ASIC chip 42 have a separation distance of 0.2-1. Independence of signal transmission between the sensing module 3 and the second sensing module 4 .

In one embodiment, the second sensing module 4 can be a pressure sensing module, that is, the second MEMS chip 41 is a pressure MEMS chip, and the second ASIC chip 42 is a pressure ASIC chip, so that the second MEMS chip 41 senses the external pressure of the combined sensor, and then transmits the pressure signal sensed by the second MEMS chip 41 to the first substrate 11 through the second ASIC chip 42 to ensure the stability of the signal transmission of the second sensing module 4 .

Optionally, referring to FIG. 3 and FIG. 4 , the first substrate 11 is provided with a plurality of second welding portions 113 on one side facing the housing 2 , and one side of the second substrate 12 facing the groove 111 A plurality of third welding parts 121 are provided on the side;

The first soldering portion 112 is exposed from the first substrate 11 and is electrically connected to the second soldering portion 113 , and the second soldering portion 113 is opposite to the third soldering portion 121 .

Specifically, in one embodiment, the second welding portion 113 and the third welding portion 121 can abut against each other after facing each other, and in another embodiment, the second welding portion 113 can also be connected by solder paste or metal material. and the third welding part 121, the connection between the first welding part 112 and the third welding part 121 can be realized through the second welding part 113, so that the first MEMS chip 31 and the second MEMS chip 41 is electrically connected to the second substrate 12 .

Optionally, referring to FIGS. 2 to 4 , the second substrate 12 is provided with a plurality of fourth welding portions 122 on a side facing the housing 2 , and the fourth welding portions 122 and the third welding portions 121 is connected through the internal wiring of the second substrate 12;

The first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the fourth welding portion 122 .

Specifically, when the first ASIC chip 32 and the second ASIC chip 42 are arranged on the side of the second substrate 12 facing the housing 2, both the first MEMS chip 31 and the second MEMS chip 41 can be The connection with the first ASIC chip 32 and the second ASIC chip 42 is realized through the first welding part 112, the second welding part 113, the third welding part 121 and the fourth welding part 122 in sequence, and then the first MEMS chip 31 is reached. The signal transmission between the first ASIC chip 32 and the signal transmission between the second MEMS chip 41 and the second ASIC chip 42 .

In addition, when the fourth welding portion 122 and the third welding portion 121 are connected through the internal wiring of the second substrate 12, since the internal wiring of the second substrate 12 can extend freely, the fourth welding portion 122 The third welding portion 121 can be disposed on both sides of the second substrate 12 opposite to the third welding portion 121 , or the fourth welding portion 122 and the third welding portion 121 can be disposed on both sides of the second substrate 12 with an offset.

Optionally, referring to FIG. 2 and FIG. 3 , the second substrate 12 is provided with a plurality of fifth welding portions 123 on a side facing the housing 2 , and one side of the second substrate 12 facing the groove 111 A plurality of sixth soldering portions 124 are arranged on the side, and the fifth soldering portion 123 and the sixth soldering portion 124 are connected through the internal wiring of the second substrate 12;

The first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the fifth welding portion 123 .

Specifically, the first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the fourth welding portion 122, and the first ASIC chip 32 and the second ASIC chip 42 are connected to the fifth In the case that the welding part 123 is electrically connected, the fourth welding part 122 can be used as the signal inlet port interface of the first ASIC chip 32 and the second ASIC chip 42, and the fifth welding part 123 can be used as the The signal output ports of the first ASIC chip 32 and the second ASIC chip 42 are connected to ensure signal transmission and conversion between the first ASIC chip 32 and the second ASIC chip 42 .

In addition, when the fifth welding part 123 and the sixth welding part 124 are connected by the internal wiring of the second substrate 12, since the internal wiring of the second substrate 12 can extend freely, the fifth welding part 123 The sixth welding portion 124 can be disposed on both sides of the second substrate 12 opposite to each other, or the fifth welding portion 123 and the sixth welding portion 124 can be disposed on both sides of the second substrate 12 in an offset position.

Optionally, referring to FIG. 4 and FIG. 5 , the side of the first substrate 11 facing the housing 2 is provided with a plurality of seventh welding portions 114;

The seventh welding portion 114 is opposite to the sixth welding portion 124 .

Specifically, in one embodiment, the seventh welding portion 114 and the sixth welding portion 124 may abut against each other after facing each other, and in another embodiment, the seventh welding portion 114 may also be connected by solder paste or a metal material. The first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the sixth soldering portion 124 through the sequential connection of the fifth soldering portion 123, the sixth soldering portion 124 and the seventh soldering portion 114. The first substrate 11 realizes signal transmission between the first ASIC chip 32 and the second ASIC chip 42 and the first substrate 11 .

Optionally, referring to FIG. 1, the first sensing module 3 is a microphone module;

The second substrate 12 is provided with a communication hole 125 , and the communication hole 125 communicates with the back cavity 311 of the first MEMS chip 31 and the groove 111 .

Specifically, the size of the back cavity 311 is directly related to the sensitivity of the microphone module. After the communication hole 125 communicates with the back cavity 311 of the first MEMS chip 31 and the groove 111, the groove 111 can be used to Extending the space of the back cavity 311 can also increase the volume of the back cavity of the microphone module, and improve the SNR (signal-to-noise ratio, SIGNAL-NOISERATIO) and sound quality of the microphone module.

Optionally, a sealant is disposed between the second substrate 12 and the first substrate 11 .

Specifically, when the second substrate 12 is connected to the opening of the groove 111 and is electrically connected to the first substrate 11, the groove 111 can be used to communicate with the back cavity 311 to improve the microphone module. back cavity space. In order to ensure the airtightness of the back cavity space in the microphone module, a sealant can be provided between the second substrate 12 and the first substrate 11, and the setting of the sealant can not only fill the space between the second substrate 12 and the first substrate 11 The gap can prevent air leakage in the groove 111 and can also ensure the stability of the connection between the second substrate 12 and the first substrate 11 .

The embodiment of the present application also provides an electronic device, the electronic device includes the combined sensor.

Specifically, in the combined sensor of the electronic device, the first sensing module 3 and the second sensing module 4 are both arranged on the side of the second substrate 12 facing the housing 2, Avoid stacking between the first sensing module 3 and the second sensing module 4, reduce the height of the combined sensor, not only reduce the size of the combined sensor, but also reduce the space occupied by the combined sensor in the electronic device, and at the same time The packaging process of the combination sensor is simplified, and the assembly efficiency of the electronic equipment is improved.

In addition, the electronic device includes but is not limited to one of microphones, speakers, smart watches, mobile phones, tablet computers, e-book readers, MP3 players, MP4 players, computers, set-top boxes, smart TVs and wearable devices.

Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, rather than limiting the scope of the present application. Those skilled in the art will appreciate that modifications can be made to the above embodiments without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.

Claims (10)

1. A composite sensor, characterized in that, comprising: A substrate (1) and a casing (2), the substrate (1) includes a first substrate (11) and a second substrate (12), and the casing (2) is covered on the first substrate (11) Above, the first substrate (11) is provided with a groove (111) with an opening facing the housing (2), and the second substrate (12) is connected to the opening and is connected to the first substrate (11) Electrically connected, the casing (2) is provided with a ventilation hole (21); The first sensing module (3) and the second sensing module (4), the first sensing module (3) includes a first MEMS chip (31) and a first ASIC chip (32), the described The second sensing module (4) includes a second MEMS chip (41) and a second ASIC chip (42); The side of the first substrate (11) facing the housing (2) is provided with a plurality of first welding parts (112), and the first sensing module (3) and the second sensing module The group (4) is all arranged on the side of the second substrate (12) facing the housing (2), and the first MEMS chip (31) and the second MEMS chip (41) are electrically connected to The first welding part (112). 2. The combination sensor according to claim 1, characterized in that, the first MEMS chip (31) and the first ASIC chip (32) are arranged at intervals on the second substrate (12) towards the shell one side of the body (2). 3. The combination sensor according to claim 1, characterized in that, the second MEMS chip (41) and the second ASIC chip (42) are stacked on the second substrate (12) towards the housing (2) on one side, and the second ASIC chip (42) is located between the second substrate (12) and the second MEMS chip (41). 4. The combination sensor according to claim 1, characterized in that, the first substrate (11) is provided with a plurality of second welding parts (113) on one side facing the housing (2), and the first The side of the second substrate (12) facing the groove (111) is provided with a plurality of third welding parts (121); The first welding part (112) is exposed from the first substrate (11) and is electrically connected to the second welding part (113), and the second welding part (113) and the third welding part (121) relative. 5. The combination sensor according to claim 4, characterized in that, the second substrate (12) is provided with a plurality of fourth welding parts (122) on one side facing the housing (2), and the first The four welding parts (122) and the third welding part (121) are connected through internal wiring of the second substrate (12); The first ASIC chip (32) and the second ASIC chip (42) are electrically connected to the fourth welding portion (122). 6. The combination sensor according to claim 4, characterized in that, the second substrate (12) is provided with a plurality of fifth welding parts (123) on one side facing the housing (2), and the first The side of the second substrate (12) facing the groove (111) is provided with a plurality of sixth welding parts (124), and the fifth welding part (123) and the sixth welding part (124) pass through the Internal wiring connection of the second substrate (12); The first ASIC chip (32) and the second ASIC chip (42) are electrically connected to the fifth soldering portion (123). 7. The combination sensor according to claim 6, characterized in that, the first substrate (11) is provided with a plurality of seventh welding parts (114) on a side facing the housing (2); The seventh welding portion (114) is opposite to the sixth welding portion (124). 8. The combination sensor according to claim 1, characterized in that, the first sensing module (3) is a microphone module; The second substrate (12) is provided with a communication hole (125), and the communication hole (125) communicates with the back cavity (311) of the first MEMS chip (31) and the groove (111). 9. The combination sensor according to claim 1, characterized in that a sealant is provided between the second substrate (12) and the first substrate (11). 10. An electronic device, comprising the combined sensor according to any one of claims 1-9.

Images