CN115871338A - Heater device with memory unit and operation method thereof - Google Patents
Heater device with memory unit and operation method thereof Download PDFInfo
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- CN115871338A CN115871338A CN202111158619.1A CN202111158619A CN115871338A CN 115871338 A CN115871338 A CN 115871338A CN 202111158619 A CN202111158619 A CN 202111158619A CN 115871338 A CN115871338 A CN 115871338A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/1412—Shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04538—Control methods or devices therefor, e.g. driver circuits, control circuits involving calculation of heater resistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04541—Specific driving circuit
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Abstract
Description
技术领域technical field
本公开实施例关于一种加热器装置,特别是关于一种具有记忆单元的加热器装置及其操作方法。Embodiments of the present disclosure relate to a heater device, and in particular to a heater device with a memory unit and an operating method thereof.
背景技术Background technique
已知的打印机装置会使用加热器控制电路,对喷墨头的加热器进行加热,使得喷墨头可以喷出所需图形。然而,打印机装置若要增加功能,例如记忆区块,则会有增加信号、接脚、电路使用面积、成本等情况发生。因此,需要一种新的电路结构设计,其可以改善前述的问题。The known printer device uses a heater control circuit to heat the heater of the inkjet head, so that the inkjet head can eject the desired pattern. However, if the printer device needs to increase functions, such as memory blocks, it will increase signals, pins, circuit usage area, cost and so on. Therefore, there is a need for a new circuit structure design, which can improve the aforementioned problems.
发明内容Contents of the invention
本公开实施例提供一种具有记忆单元的加热器装置,包括第一晶体管、第二晶体管、记忆单元与加热器。第二晶体管的第一端与第一晶体管的第一端彼此电性连接。记忆单元电性连接至第一晶体管的第二端。加热器电性连接至第二晶体管的第二端。An embodiment of the disclosure provides a heater device with a memory unit, including a first transistor, a second transistor, a memory unit, and a heater. The first end of the second transistor is electrically connected to the first end of the first transistor. The memory unit is electrically connected to the second terminal of the first transistor. The heater is electrically connected to the second terminal of the second transistor.
本公开实施例提供一种操作具有记忆单元的加热器装置的方法。加热器装置具有刻录模式、读取模式与加热模式,加热器装置包括多个加热器电路,每个加热器电路包括第一晶体管与第二晶体管,以及分别电性连接至第一晶体管与第二晶体管的记忆单元与加热器。上述方法包括下列步骤。于刻录模式中,根据第一信号选择性地打开第一晶体管的至少一者,使得耦接至第一晶体管的两端点的电压所产生的第一电流通过记忆单元。于读取模式中,依序地打开第一晶体管以判断记忆单元的状态。于加热模式中,根据第二信号选择性地打开第二晶体管的至少一者,使得耦接至第二晶体管的两端点的电压所产生的第二电流通过加热器。Embodiments of the present disclosure provide a method of operating a heater device having a memory unit. The heater device has a writing mode, a reading mode, and a heating mode. The heater device includes a plurality of heater circuits, and each heater circuit includes a first transistor and a second transistor, and is electrically connected to the first transistor and the second transistor respectively. Transistor memory cells and heaters. The above method includes the following steps. In the recording mode, at least one of the first transistors is selectively turned on according to the first signal, so that the first current generated by the voltage coupled to the two terminals of the first transistor passes through the memory unit. In the read mode, the first transistors are sequentially turned on to determine the state of the memory unit. In the heating mode, at least one of the second transistors is selectively turned on according to the second signal, so that the second current generated by the voltage coupled to the two terminals of the second transistor passes through the heater.
附图说明Description of drawings
为让本发明的上述目的、特征和优点能更明显易懂,以下结合附图对本发明的具体实施方式作详细说明,其中:In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:
图1为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。FIG. 1 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure.
图2为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。FIG. 2 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure.
图3为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。FIG. 3 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure.
图4为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。FIG. 4 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure.
图5为依据本公开的一实施例的操作具有记忆单元的加热器装置的方法的流程图。FIG. 5 is a flowchart of a method of operating a heater device with a memory unit according to an embodiment of the disclosure.
图6为依据本公开的另一实施例的操作具有记忆单元的加热器装置的方法的流程图。FIG. 6 is a flowchart of a method of operating a heater device with a memory unit according to another embodiment of the present disclosure.
图1-图6附图编号如下:Figures 1-6 are numbered as follows:
100,200,300,400:具有记忆单元的加热器装置100, 200, 300, 400: heater unit with memory unit
110,210,310,410_1~410_N:加热器电路110, 210, 310, 410_1~410_N: heater circuit
120:记忆单元120: memory unit
130:加热器130: Heater
140,430:逻辑控制电路140, 430: logic control circuit
420_1~420_N:选择开关420_1~420_N: selection switch
M1,M2,M3,M4,M5,M6:晶体管M1, M2, M3, M4, M5, M6: Transistors
V1,V2,V3,V4:参考电压信号V1, V2, V3, V4: reference voltage signal
SLS:选择信号SLS: Selection Signal
ADS:地址信号ADS: address signal
DS:数据信号DS: data signal
S502~S506,S602~S606:步骤S502~S506, S602~S606: steps
具体实施方式Detailed ways
为让本公开的目的、特征或优点能更明显易懂,下文特举出实施例,并配合所附附图,做详细的说明。为了使读者能容易了解及附图的简洁,本公开中的多张附图可能只绘出整个装置的一部分,且附图中的特定组件并非依照实际比例绘图。In order to make the purpose, features or advantages of the present disclosure more comprehensible, the following specifically cites the embodiments, together with the accompanying drawings, for a detailed description. In order to make the readers understand easily and the drawings are concise, the several drawings in the present disclosure may only depict a part of the whole device, and the specific components in the drawings are not drawn according to the actual scale.
本公开说明书提供不同的实施例来说明本公开不同实施方式的技术特征。其中,实施例中的各组件的配置、数量及尺寸是用以说明,并非用以限制本公开。另外,若实施例与附图中组件标号出现重复,是为了简化说明,并非意指不同实施例之间的关联性。The specification of the disclosure provides different embodiments to illustrate the technical features of different implementations of the disclosure. Wherein, the configuration, quantity and size of each component in the embodiments are for illustration, not for limiting the present disclosure. In addition, if the numbering of components in the embodiment and the drawings is repeated, it is for the purpose of simplifying the description, and does not imply the correlation between different embodiments.
再者,说明书与权利要求书中所使用的序数例如“第一”、“第二”等的用词,以修饰权利要求书的组件,其本身并不意含及代表该请求组件有任何之前的序数,也不代表某一请求组件与另一请求组件的顺序、或是制造方法上的顺序,该多个序数的使用仅用来使具有某命名的一请求组件得以和另一具有相同命名的请求组件能作出清楚区分。Furthermore, the ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify the components of the claims, which themselves do not imply and represent that the claimed components have any previous The ordinal number does not represent the order of a requested component with another requested component, or the order of the manufacturing method. The use of multiple ordinal numbers is only used to enable a requested component with a certain name to be compared with another one with the same name. Request components make a clear distinction.
在本公开中,各实施例间特征只要不违背发明精神或相冲突,均可任意混合搭配使用。In the present disclosure, as long as the features of the various embodiments do not violate the spirit of the invention or conflict, they can be mixed and matched arbitrarily.
在通篇说明书及权利要求书当中所提及的“包括”为一开放式用语,故应解释成“包括但不限定于”。"Include" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to".
再者,“连接”、“耦接”在此包括任何直接及间接的连接手段。因此,当组件或膜层被称为“连接”至另一个组件或膜层时,它可以直接连接到此另一组件或膜层,或者两者之间存在有插入的组件或膜层。当组件被称为“直接连接”至另一个组件或膜层时,两者之间不存在有插入的组件或膜层。若文中描述电路上的一第一装置耦接至一第二装置,则代表第一装置可直接电连接第二装置,当第一装置直接电连接第二装置时,第一装置与第二装置之间只透过导线或被动组件(例如电阻、电容等)连接,没有其他电子组件连接于第一装置与第二装置之间。Furthermore, "connection" and "coupling" here include any direct and indirect connection means. Thus, when a component or film is referred to as being "connected to" another component or film, it can be directly connected to the other component or film or intervening components or films may be present therebetween. When a component is referred to as being "directly connected" to another component or layer, there are no intervening components or layers in between. If it is described in the text that a first device on the circuit is coupled to a second device, it means that the first device can be directly electrically connected to the second device. When the first device is directly electrically connected to the second device, the first device and the second device They are only connected through wires or passive components (such as resistors, capacitors, etc.), and no other electronic components are connected between the first device and the second device.
图1为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。在本实施例中,具有记忆单元的加热器装置100可以设置于硅晶圆(silicon(Si)wafer)基板、玻璃基板或聚酰亚胺(polyimide,PI)基板上,但本公开不限于此。请参考图1,具有记忆单元的加热器装置100包括加热器电路110,且加热器电路110可以至少包括晶体管M1、晶体管M2、记忆单元120与加热器130。FIG. 1 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure. In this embodiment, the
晶体管M2的第一端可以与晶体管M1的第一端彼此电性连接。记忆单元120可以电性连接至晶体管M1的第二端。加热器130可以电性连接至晶体管M2的第二端。The first end of the transistor M2 and the first end of the transistor M1 are electrically connected to each other. The
在本实施例中,晶体管M1例如是N型(N-type)晶体管,但本公开不限于此。晶体管M1的第一端可以是栅极(gate)端,晶体管M1的第二端(即记忆单元120所电性连接的晶体管M1的第二端)可以是漏极(drain)端,晶体管M1的第三端可以是源极(source)端。另外,晶体管M1的第二端(例如漏极端)可以透过记忆单元120接收参考电压信号V1(例如高电压信号),晶体管M1的第三端(例如源极端)可以接收参考电压信号V2(例如低电压信号)。在一些实施例中,晶体管M1也可以是P型(P-type)晶体管。In this embodiment, the transistor M1 is, for example, an N-type transistor, but the disclosure is not limited thereto. The first terminal of the transistor M1 may be a gate terminal, and the second terminal of the transistor M1 (that is, the second terminal of the transistor M1 to which the
在本实施例中,晶体管M1与晶体管M2可以为同一掺杂型态的晶体管。也就是说,晶体管M2例如也是N型晶体管,但本公开不限于此。晶体管M2的第一端可以是栅极端,晶体管M2的第二端(即加热器130所电性连接的晶体管M2的第二端)可以是漏极端,晶体管M2的第三端可以是源极端。另外,晶体管M2的第二端(例如漏极端)可以透过加热器130接收参考电压信号V3(例如高电压信号),晶体管M2的第三端(例如源极端)可以接收参考电压信号V4(例如低电压信号)。在一些实施例中,晶体管M2也可以是P型晶体管。In this embodiment, the transistor M1 and the transistor M2 may be transistors of the same doping type. That is to say, the transistor M2 is also an N-type transistor, for example, but the disclosure is not limited thereto. The first terminal of the transistor M2 may be a gate terminal, the second terminal of the transistor M2 (ie, the second terminal of the transistor M2 to which the
在一些实施例中,记忆单元120例如为熔断器(fuse),但本公开不限于此。当有电流通过记忆单元120时,加热器电路110可以进行刻录操作,以便将记忆单元120烧断而呈现开路(open circuit)。另外,当未有电流通过记忆单元120时,加热器电路110不会进行刻录操作而使记忆单元120呈现不开路。此外,记忆单元120的材料例如为氧化铟锡(indium tinoxide,ITO)、多晶硅(polysilicon),铝(Al)、铜(Cu)、镍(Ni)、钼(Mo)、氧化铟锌(indiumzinc oxide,IZO),但本公开不限于此。In some embodiments, the
在一些实施例中,加热器130可以为电阻或其他适合的加热组件,但本公开不限于此。当有电流通过加热器130时,加热器电路110可以进行加热操作,使得对应该位置的喷墨头进行喷墨操作(例如喷出所需图形)。当未有电流通过加热器130时,加热器电路110不会进行加热操作。In some embodiments, the
此外,加热器装置100还包括逻辑控制电路140。逻辑控制电路140可以电性连接晶体管M1的第一端与晶体管M2的第一端。另外,加热器装置100还可以包括控制电路(图未示)与电源电路(图未示)。控制电路可以电性连接参考电压信号V1的端点与逻辑控制电路140。电源电路可以电性连接参考电压信号V2的端点、参考电压信号V3的端点、参考电压信号V4的端点与控制电路,且控制电路可以控制电源电路,以使电源电路提供参考电压信号V2、参考电压信号V3、参考电压信号V4。在本实施例中,控制电路例如为微控制器(microcontroller unit,MCU),电源电路例如为电源供应芯片,但本公开不限于此。In addition, the
在本实施例中,加热器装置100可以包括刻录模式、读取模式与加热模式,但本公开不限于此。在加热器装置100的操作上,于刻录模式中,逻辑控制电路140可以产生第一信号(例如高电压信号)至晶体管M1的第一端(例如栅极端)以打开(turn on)晶体管M1,且控制电路可以提供参考电压信号V1并控制电源电路提供参考电压信号V2,使得耦接至晶体管M1的两端点的电压信号(例如参考电压信号V1与参考电压信号V2)所产生的电流通过记忆单元120,以对记忆单元120进行刻录操作,例如将记忆单元120烧断而呈现开路。另一方面,当逻辑控制电路140未产生第一信号(例如高电压信号)至晶体管M1的第一端(例如栅极端)时,晶体管M1会关闭(turn off)而不会有电流通过记忆单元120,则不会对记忆单元120进行刻录操作而使记忆单元120呈现不开路。In this embodiment, the
另外,于刻录模式中,控制电路还可以选择性地断开(disconnect)晶体管M2的两端点所耦接的电压信号。也就是说,控制电路可以控制电源电路停止提供参考电压信号V3与参考电压信号V4,则不会有电流通过加热器130,使得加热器电路110不会进行加热操作。如此一来,可以减少加热器装置100的耗电量。In addition, in the recording mode, the control circuit can also selectively disconnect the voltage signal coupled to the two terminals of the transistor M2. That is to say, the control circuit can control the power supply circuit to stop providing the reference voltage signal V3 and the reference voltage signal V4 , so that no current flows through the
接着,于读取模式中,逻辑控制电路140控制打开(或导通)晶体管M1,以使控制电路判断记忆单元120的状态。也就是说,当逻辑控制电路控制晶体管M1打开时,控制电路可以停止提供参考电压信号V1,且控制电路可以透过参考电压信号V1的端点,对记忆单元120进行读取,并依据读取结果,判断记忆单元120的状态为开路或不开路。在一些实施例中,开路例如表示为“0”,不开路例如表示为“1”,但本公开不限于此。在另一实施例中,开路例如表示为“1”,不开路例如表示为“0”。因此,控制电路的读取结果可以为“0”或“1”,且此读取结果可以作为打印机装置的喷墨头的标识符,防止打印机装置降级使用到旧的固件或软件,或作为产品参数分批辨识。如此一来,加热器装置100可以具有记忆功能,以增加使用上的便利性。Next, in the read mode, the
另外,于读取模式中,控制电路还可以选择性地断开晶体管M2的两端点所耦接的电压信号。也就是说,控制电路可以控制电源电路停止提供参考电压信号V3与参考电压信号V4,则不会有电流通过加热器130,使得加热器电路110不会进行加热操作。如此一来,可以减少加热器装置100的耗电量。In addition, in the read mode, the control circuit can also selectively disconnect the voltage signal coupled to the two terminals of the transistor M2. That is to say, the control circuit can control the power supply circuit to stop providing the reference voltage signal V3 and the reference voltage signal V4 , so that no current flows through the
之后,于加热模式中,逻辑控制电路140可以产生第二信号(例如高电压信号)至晶体管M2的第一端(例如栅极端)以打开晶体管M2,且控制电路可以控制电源电路提供参考电压信号V3与参考电压信号V4,使得耦接至晶体管M2的两端点的电压信号(例如参考电压信号V3与参考电压信号V4)所产生的电流通过加热器130,使得加热器电路110进行加热操作。另一方面,当逻辑控制电路140未产生第二信号(例如高电压信号)至晶体管M2的第一端(例如栅极端)时,晶体管M2会关闭而不会有电流通过加热器130,则加热器电路110不会进行加热操作。Afterwards, in the heating mode, the
另外,于加热模式中,控制电路还可以选择性地断开晶体管M1的两端点所耦接的电压信号。也就是说,控制电路可以停止提供参考电压信号V1并控制电源电路停止提供参考电压信号V2,减少加热器装置100的耗电量。In addition, in the heating mode, the control circuit can also selectively disconnect the voltage signal coupled to the two terminals of the transistor M1. That is to say, the control circuit can stop providing the reference voltage signal V1 and control the power supply circuit to stop providing the reference voltage signal V2, so as to reduce the power consumption of the
在本实施例中,晶体管M1的第一端与晶体管M2的第一端彼此电性连接,且接收相同信号,但本公开不限于此。在一些实施例中,晶体管M1的第一端与晶体管M2的第一端可以分离,且接收不同的信号,也可达到相同具有记忆功能的效果。In this embodiment, the first end of the transistor M1 and the first end of the transistor M2 are electrically connected to each other and receive the same signal, but the disclosure is not limited thereto. In some embodiments, the first terminal of the transistor M1 and the first terminal of the transistor M2 can be separated and receive different signals, and the same effect of having a memory function can also be achieved.
图2为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。请参考图2,具有记忆单元的加热器装置200包括加热器电路210,且加热器电路210可以至少包括晶体管M3、晶体管M4、记忆单元120与加热器130。在本实施例中,记忆单元120和加热器130与图1的记忆单元120和加热器130相同或相似,可参考图1的实施例的说明,故在此不再赘述。FIG. 2 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure. Please refer to FIG. 2 , the
晶体管M4的第一端可以与晶体管M3的第一端彼此电性连接。记忆单元120可以电性连接至晶体管M3的第二端。加热器130可以电性连接至晶体管M4的第二端。The first end of the transistor M4 and the first end of the transistor M3 are electrically connected to each other. The
在本实施例中,晶体管M3例如是P型晶体管,但本公开不限于此。晶体管M3的第一端可以是栅极端,晶体管M3的第二端(即记忆单元120所电性连接的晶体管M3的第二端)可以是漏极端,晶体管M3的第三端可以是源极端。另外,晶体管M3的第二端(例如漏极端)可以透过记忆单元120接收参考电压信号V2(例如低电压信号),晶体管M3的第三端(例如源极端)可以接收参考电压信号V1(例如高电压信号)。在一些实施例中,晶体管M3也可以是N型晶体管。In this embodiment, the transistor M3 is, for example, a P-type transistor, but the disclosure is not limited thereto. The first terminal of the transistor M3 may be a gate terminal, the second terminal of the transistor M3 (ie, the second terminal of the transistor M3 electrically connected to the memory unit 120 ) may be a drain terminal, and the third terminal of the transistor M3 may be a source terminal. In addition, the second terminal (such as the drain terminal) of the transistor M3 can receive the reference voltage signal V2 (such as the low voltage signal) through the
在本实施例中,晶体管M3与晶体管M4可以为不同掺杂型态的晶体管。也就是说,晶体管M4例如是N型晶体管,但本公开不限于此。晶体管M4的第一端可以是栅极端,晶体管M4的第二端(即加热器130所电性连接的晶体管M4的第二端)可以是漏极端,晶体管M4的第三端可以是源极端。另外,晶体管M4的第二端(例如漏极端)可以透过加热器130接收参考电压信号V3(例如高电压信号),晶体管M4的第三端(例如源极端)可以接收参考电压信号V4(例如低电压信号)。在一些实施例中,晶体管M4也可以是P型晶体管。In this embodiment, the transistor M3 and the transistor M4 may be transistors of different doping types. That is to say, the transistor M4 is, for example, an N-type transistor, but the disclosure is not limited thereto. The first terminal of the transistor M4 may be a gate terminal, the second terminal of the transistor M4 (ie, the second terminal of the transistor M4 to which the
此外,加热器装置200还包括逻辑控制电路140。逻辑控制电路140可以电性连接晶体管M3的第一端与晶体管M4的第一端。另外,逻辑控制电路140可以控制是否提供参考电压信号V1、参考电压信号V2、参考电压信号V3、参考电压信号V4。在本实施例中,加热器装置200的操作流程与加热器装置100的操作流程相同或相似,可参考图1的实施例的说明,故在此不再赘述。In addition, the
在本实施例中,晶体管M3的第一端与晶体管M4的第一端彼此电性连接,且接收相同信号,但本公开不限于此。在一些实施例中,晶体管M3的第一端与晶体管M4的第一端可以分离,且接收不同的信号,也可达到相同具有记忆功能的效果。In this embodiment, the first end of the transistor M3 and the first end of the transistor M4 are electrically connected to each other and receive the same signal, but the disclosure is not limited thereto. In some embodiments, the first terminal of the transistor M3 and the first terminal of the transistor M4 can be separated and receive different signals, and the same effect of having a memory function can also be achieved.
图3为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。请参考图3,具有记忆单元的加热器装置300包括加热器电路310,且加热器电路310可以至少包括晶体管M5、晶体管M6、记忆单元120与加热器130。在本实施例中,记忆单元120和加热器130与图1的记忆单元120和加热器130相同或相似,可参考图1的实施例的说明,故在此不再赘述。FIG. 3 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure. Referring to FIG. 3 , the
晶体管M6的第一端可以与晶体管M5的第一端彼此电性连接。记忆单元120可以电性连接至晶体管M5的第二端与晶体管M6的第三端。加热器130可以电性连接至晶体管M6的第二端。The first end of the transistor M6 and the first end of the transistor M5 are electrically connected to each other. The
在本实施例中,晶体管M5例如是P型晶体管,但本公开不限于此。晶体管M5的第一端可以是栅极端,晶体管M5的第二端(即记忆单元120所电性连接的晶体管M5的第二端)可以是漏极端,晶体管M5的第三端可以是源极端。另外,晶体管M5的第二端(例如漏极端)可以透过记忆单元120接收参考电压信号V4(例如低电压信号),晶体管M5的第三端(例如源极端)可以接收参考电压信号V1(例如高电压信号)。在一些实施例中,晶体管M5也可以是N型晶体管。In this embodiment, the transistor M5 is, for example, a P-type transistor, but the disclosure is not limited thereto. The first terminal of the transistor M5 may be a gate terminal, the second terminal of the transistor M5 (ie, the second terminal of the transistor M5 electrically connected to the memory unit 120 ) may be a drain terminal, and the third terminal of the transistor M5 may be a source terminal. In addition, the second terminal (for example, the drain terminal) of the transistor M5 can receive the reference voltage signal V4 (for example, a low voltage signal) through the
在本实施例中,晶体管M5与晶体管M6可以为不同掺杂型态的晶体管。也就是说,晶体管M6例如是N型晶体管,但本公开不限于此。晶体管M6的第一端可以是栅极端,晶体管M6的第二端(即加热器130所电性连接的晶体管M6的第二端)可以是漏极端,晶体管M6的第三端可以是源极端。另外,晶体管M6的第二端(例如漏极端)可以透过加热器130接收参考电压信号V3(例如高电压信号),晶体管M6的第三端(例如源极端)可以接收参考电压信号V4(例如低电压信号)。在一些实施例中,晶体管M6也可以是P型晶体管。In this embodiment, the transistor M5 and the transistor M6 may be transistors of different doping types. That is to say, the transistor M6 is, for example, an N-type transistor, but the disclosure is not limited thereto. The first terminal of the transistor M6 may be a gate terminal, the second terminal of the transistor M6 (ie, the second terminal of the transistor M6 to which the
此外,加热器装置300还包括逻辑控制电路140。逻辑控制电路140可以电性连接晶体管M5的第一端与晶体管M6的第一端。另外,逻辑控制电路140可以控制是否提供参考电压信号V1、参考电压信号V2、参考电压信号V3、参考电压信号V4。在本实施例中,加热器装置300的操作流程与加热器装置100的操作流程相同或相似,可参考图1的实施例的说明,故在此不再赘述。In addition, the
在本实施例中,晶体管M5的第一端与晶体管M6的第一端彼此电性连接,且接收相同信号,但本公开不限于此。在一些实施例中,晶体管M5的第一端与晶体管M6的第一端可以分离,且接收不同的信号,也可达到相同具有记忆功能的效果。In this embodiment, the first end of the transistor M5 and the first end of the transistor M6 are electrically connected to each other and receive the same signal, but the disclosure is not limited thereto. In some embodiments, the first terminal of the transistor M5 and the first terminal of the transistor M6 can be separated and receive different signals, and the same effect of having a memory function can also be achieved.
图4为依据本公开的一实施例的具有记忆单元的加热器装置的示意图。请参考图4,具有记忆单元的加热器装置400包括多个加热器电路410_1~410_N、多个选择开关420_1~420_N、与逻辑控制电路430,其中N为大于1的正整数。在一些实施例中,加热器电路410_1~410_N可以是图1的加热器电路110、图2的加热器电路210、图3的加热器电路310或其组合,但本公开不限于此。另外,加热器电路410_1~410_N的内部电路及其连接关系,可参考图1、图2或图3的实施例的说明,故在此不再赘述。FIG. 4 is a schematic diagram of a heater device with a memory unit according to an embodiment of the disclosure. Referring to FIG. 4 , the
选择开关420_1~420_N分别电性连接加热器电路410_1~410_N。举例来说,选择开关420_1电性连接加热器电路410_1,选择开关420_2电性连接加热器电路410_2,…,选择开关420_N电性连接加热器电路410_N。The selection switches 420_1 - 420_N are electrically connected to the heater circuits 410_1 - 410_N, respectively. For example, the selection switch 420_1 is electrically connected to the heater circuit 410_1 , the selection switch 420_2 is electrically connected to the heater circuit 410_2 , . . . , and the selection switch 420_N is electrically connected to the heater circuit 410_N.
逻辑控制电路430透过选择开关420_1~420_N电性连接加热器电路410_1~410_N。进一步来说,逻辑控制电路430可以电性连接加热器电路410_1~410_N的第一晶体管(例如晶体管M1、晶体管M3或晶体管M5)的第一端与第二晶体管(例如晶体管M2、晶体管M4或晶体管M6)的第一端。另外,加热器装置400控制电路还可以包括控制电路(图未示)与电源电路(图未示)。控制电路可以电性连接参考电压信号V1的端点与逻辑控制电路430。电源电路可以电性连接参考电压信号V2的端点、参考电压信号V3的端点、参考电压信号V4的端点与控制电路,且控制电路可以控制电源电路,以使电源电路提供参考电压信号V2、参考电压信号V3、参考电压信号V4。此外,逻辑控制电路430可以接收选择信号SLS、地址信号ADS与数据信号DS,并依据选择信号SLS、地址信号ADS与数据信号DS,控制选择开关420_1~420_N的打开或关闭,以便对加热器410_1~410_N进行相应操作。The
在图4中,选择信号SLS、地址信号ADS与数据信号DS的数量为1个,但本公开不限于此。在一些实施例中,选择信号SLS、地址信号ADS与数据信号DS的数量可以是多个,且选择信号SLS、地址信号ADS与数据信号DS的数量可以依据加热器电路410_1~410_N的数量增加或减少,但本公开不限于此。也就是说,当加热器电路410_1~410_N的数量增加时,选择信号SLS、地址信号ADS与数据信号DS的数量可对应增加。当加热器电路410_1~410_N的数量减少时,选择信号SLS、地址信号ADS与数据信号DS的数量可对应减少。In FIG. 4 , the number of the selection signal SLS, the address signal ADS and the data signal DS is one, but the disclosure is not limited thereto. In some embodiments, the number of the selection signal SLS, the address signal ADS and the data signal DS may be multiple, and the number of the selection signal SLS, the address signal ADS and the data signal DS may increase or decrease according to the number of the heater circuits 410_1˜410_N. reduced, but the disclosure is not limited thereto. That is to say, when the number of the heater circuits 410_1 - 410_N increases, the number of the selection signal SLS, the address signal ADS and the data signal DS can increase correspondingly. When the number of the heater circuits 410_1 - 410_N is reduced, the number of the selection signal SLS, the address signal ADS and the data signal DS can be correspondingly reduced.
在本实施例中,加热器装置400可以包括刻录模式、读取模式与加热模式,但本公开不限于此。在加热器装置400的操作上,于刻录模式中,逻辑控制电路430可以依据选择信号SLS、地址信号ADS与数据信号DS,产生第一信号(例如高电压信号或低电压信号)至加热器电路410_1~410_N的至少一者,例如加热器电路410_1。接着,第一信号提供至加热器电路410_1的第一晶体管(例如晶体管M1、晶体管M3或晶体管M5)的第一端(例如栅极端)以打开加热器电路410_1的第一晶体管(例如晶体管M1、晶体管M3或晶体管M5),且控制电路可以提供参考电压信号V1并控制电源电路提供参考电压信号V2或是参考电压信号V4,使得耦接至加热器电路410_1的第一晶体管(例如晶体管M1、晶体管M3或晶体管M5)的两端点的电压信号(例如参考电压信号V1与参考电压信号V2或是参考电压信号V1与参考电压信号V4)所产生的电流通过加热器电路410_1的记忆单元120,以对加热器电路410_1的记忆单元120进行刻录操作,例如将加热器电路410_1的记忆单元120烧断而呈现开路。另一方面,当逻辑控制电路430未产生第一信号(例如高电压信号或低电压信号)至加热器电路410_2~410_N时,加热器电路410_2~410_N的第一晶体管(例如晶体管M1、晶体管M3或晶体管M5)会关闭而不会有电流通过加热器电路410_2~410_N的记忆单元120,则不会对加热器电路410_2~410_N的记忆单元120进行刻录操作而呈现不开路。In this embodiment, the
另外,于刻录模式中,控制电路还可以选择性地断开加热器电路410_1~410_N的第二晶体管(例如晶体管M2、晶体管M4)的两端点所耦接的电压信号或是第二晶体管(例如晶体管M6)的一端点所耦接的电压信号。也就是说,控制电路可以控制电源电路停止提供参考电压信号V3与参考电压信号V4或是参考电压信号V3,以减少加热器装置400的耗电量。In addition, in the writing mode, the control circuit can also selectively disconnect the voltage signal coupled to the two terminals of the second transistors (such as transistor M2 and transistor M4 ) of the heater circuits 410_1˜410_N or the second transistor (such as A voltage signal coupled to one terminal of the transistor M6). That is to say, the control circuit can control the power supply circuit to stop providing the reference voltage signal V3 and the reference voltage signal V4 or the reference voltage signal V3 to reduce the power consumption of the
接着,于读取模式中,逻辑控制电路430依序地打开加热器电路410_1~410_N的第一晶体管(例如晶体管M1、晶体管M3或晶体管M5),以使控制电路判断加热器电路410_1~410_N的记忆单元120的状态。也就是说,当加热器电路410_1~410_N的第一晶体管(例如晶体管M1、晶体管M3或晶体管M5)打开时,控制电路可以透过参考电压信号V1的端点,依序地对加热器电路410_1~410_N的记忆单元120进行读取,并依据读取结果,判断加热器电路410_1~410_N的记忆单元120的状态为开路或不开路。在本实施例中,加热器电路410_1的记忆单元120的状态为开路,而加热器电路420_2~420_N的记忆单元120的状态为不开路。因此,控制电路的读取结果例如为“01…1”或是“10…0”,且此读取结果可以作为打印机装置的喷墨头的标识符,防止打印机装置降级使用到旧的固件或软件,或作为产品参数分批辨识。如此一来,加热器装置400可以具有记忆功能,以增加使用上的便利性。Next, in the read mode, the
另外,于读取模式中,控制电路还可以选择性地断开加热器电路410_1~410_N的第二晶体管(例如晶体管M2、晶体管M4)的两端点所耦接的电压信号或是第二晶体管(例如晶体管M6)的一端点所耦接的电压信号。也就是说,控制电路可以控制电源电路停止提供参考电压信号V3与参考电压信号V4或是参考电压信号V3,以减少加热器装置400的耗电量。In addition, in the reading mode, the control circuit can also selectively disconnect the voltage signal coupled to the two terminals of the second transistors (such as the transistor M2 and the transistor M4 ) of the heater circuits 410_1˜410_N or the second transistor ( For example, a voltage signal coupled to one terminal of the transistor M6). That is to say, the control circuit can control the power supply circuit to stop providing the reference voltage signal V3 and the reference voltage signal V4 or the reference voltage signal V3 to reduce the power consumption of the
之后,于加热模式中,逻辑控制电路430可以依据选择信号SLS、地址信号ADS与数据信号DS,产生第二信号(例如高电压信号)至加热器电路410_1~410_N的至少一者,例如加热器电路410_1。接着,第二信号提供至加热器电路410_1的第二晶体管(例如晶体管M2、晶体管M4或晶体管M6)的栅极端以打开加热器电路410_1的第二晶体管(例如晶体管M2、晶体管M4或晶体管M6),且控制电路控制电源电路提供参考电压信号V3与参考电压V4,使得耦接至加热器电路410_1的第二晶体管(例如晶体管M2、晶体管M4或晶体管M6)的两端点的电压信号(例如参考电压信号V3与参考电压信号V4)所产生的电流通过加热器电路410_1的加热器130,以便加热器电路410_1进行加热操作。另一方面,当逻辑控制电路430未产生第二信号(例如高电压信号)至加热器电路410_2~410_N至加热器电路410_2~410_N时,加热器电路410_2~410_N的第二晶体管(例如晶体管M2、晶体管M4或晶体管M6)会关闭而不会有电流通过加热器电路410_2~410_N的加热器130,则加热器电路410_2~410_N不会进行加热操作。Afterwards, in the heating mode, the
另外,于加热模式中,控制电路还可以选择性地断开加热器电路410_1~410_N的第一晶体管(例如晶体管M1、晶体管M3)的两端点所耦接的电压信号或是第一晶体管(例如晶体管M5)的一端点所耦接的电压信号。也就是说,控制电路可以停止提供参考电压信号V1并控制电源电路停止提供参考电压信号V2,以减少加热器装置400的耗电量。In addition, in the heating mode, the control circuit can also selectively disconnect the voltage signal coupled to the two terminals of the first transistors (such as transistor M1 and transistor M3 ) of the heater circuits 410_1˜410_N or the first transistor (such as A voltage signal coupled to one terminal of the transistor M5). That is to say, the control circuit can stop providing the reference voltage signal V1 and control the power supply circuit to stop providing the reference voltage signal V2, so as to reduce the power consumption of the
图5为依据本公开的一实施例的操作具有记忆单元的加热器装置的方法的流程图。在本实施例中,加热器装置具有刻录模式、读取模式与加热模式。加热器装置包括多个加热器电路,且每个加热器电路包括第一晶体管与第二晶体管,以及分别电性连接至第一晶体管与第二晶体管的记忆单元与加热器。在步骤S502中,于刻录模式中,根据第一信号选择性地打开多个第一晶体管的至少一者,使得耦接至第一晶体管的两端点的电压所产生的第一电流通过记忆单元。FIG. 5 is a flowchart of a method of operating a heater device with a memory unit according to an embodiment of the disclosure. In this embodiment, the heater device has a writing mode, a reading mode and a heating mode. The heater device includes a plurality of heater circuits, and each heater circuit includes a first transistor and a second transistor, and a memory unit and a heater electrically connected to the first transistor and the second transistor, respectively. In step S502 , in the recording mode, at least one of the plurality of first transistors is selectively turned on according to a first signal, so that a first current generated by a voltage coupled to two terminals of the first transistor passes through the memory unit.
在步骤S504中,于读取模式中,依序地打开第一晶体管以判断记忆单元的状态。在步骤S506中,于加热模式中,根据第二信号选择性地打开第二晶体管的至少一者,使得耦接至第二晶体管的两端点的电压所产生的一第二电流通过加热器。In step S504, in the read mode, the first transistors are sequentially turned on to determine the state of the memory cell. In step S506 , in the heating mode, at least one of the second transistors is selectively turned on according to the second signal, so that a second current generated by the voltage coupled to the two terminals of the second transistor passes through the heater.
图6为依据本公开的一实施例的操作具有记忆单元的加热器装置的方法的流程图。在本实施例中,步骤S502、步骤S504、步骤S506与图5的步骤S502、步骤S504、步骤S506相同或相似,可参考图5的实施例的说明,故在此不再赘述。FIG. 6 is a flowchart of a method of operating a heater device with a memory unit according to an embodiment of the disclosure. In this embodiment, step S502, step S504, and step S506 are the same as or similar to step S502, step S504, and step S506 in FIG.
在步骤S602中,于刻录模式中,断开第二晶体管的两端点所耦接的电压。在步骤S604中,于读取模式中,断开第二晶体管的两端点所耦接的电压信号。在步骤S606中,于加热模式中,断开第一晶体管的两端点所耦接的电压信号。In step S602, in the writing mode, the voltage coupled to the two terminals of the second transistor is disconnected. In step S604, in the read mode, the voltage signal coupled to the two terminals of the second transistor is disconnected. In step S606, in the heating mode, the voltage signal coupled to the two terminals of the first transistor is disconnected.
综上所述,本公开实施例的具有记忆单元的加热器装置及操作具有记忆单元的加热器装置的方法,透过第二晶体管的第一端与第一晶体管的第一端彼此电性连接,记忆单元电性连接至第一晶体管的第二端,加热器电性连接至第二晶体管的第二端。另外,于刻录模式中,根据第一信号打开第一晶体管,使得耦接至第一晶体管的两端点的电压信号所产生的第一电流通过记忆单元,于该读取模式中,打开第一晶体管以判断记忆单元的状态,且于加热模式中,根据第二信号打开第二晶体管,使得耦接至第二晶体管的两端点的电压信号所产生的第二电流通过加热器。如此一来,加热器装置可以具有记忆功能、减少加热器装置的耗电量、减少信号的使用数量、减少接脚的数量或减少电路使用面积,以增加使用上的便利性。In summary, the heater device with memory unit and the method for operating the heater device with memory unit according to the embodiments of the present disclosure are electrically connected to each other through the first terminal of the second transistor and the first terminal of the first transistor , the memory unit is electrically connected to the second terminal of the first transistor, and the heater is electrically connected to the second terminal of the second transistor. In addition, in the recording mode, the first transistor is turned on according to the first signal, so that the first current generated by the voltage signal coupled to the two terminals of the first transistor passes through the memory unit, and in the reading mode, the first transistor is turned on To determine the state of the memory unit, and in the heating mode, turn on the second transistor according to the second signal, so that the second current generated by the voltage signal coupled to the two terminals of the second transistor passes through the heater. In this way, the heater device can have a memory function, reduce the power consumption of the heater device, reduce the number of signals used, reduce the number of pins or reduce the area used by the circuit, so as to increase the convenience of use.
本公开虽以实施例公开如上,然其并非用以限定本公开的范围,任何所属技术领域中具有通常知识者,在不脱离本公开的精神和范围内,可将数个不同实施例中的特征进行替换、重组、混合或可做些许的调整、组合、更动与润饰以完成其他实施例,因此本公开的保护范围当视所附的权利要求书所界定者为准。Although the present disclosure is disclosed above with the embodiments, it is not intended to limit the scope of the present disclosure. Anyone with ordinary knowledge in the technical field can use several different embodiments without departing from the spirit and scope of the present disclosure. The features can be replaced, rearranged, mixed or slightly adjusted, combined, changed and modified to complete other embodiments, so the protection scope of the present disclosure should be defined by the appended claims.
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