CN115817000A - Inner and outer platform mechanism for raw ceramic chip with frame hole wall metallization - Google Patents
Inner and outer platform mechanism for raw ceramic chip with frame hole wall metallization Download PDFInfo
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- CN115817000A CN115817000A CN202310031572.5A CN202310031572A CN115817000A CN 115817000 A CN115817000 A CN 115817000A CN 202310031572 A CN202310031572 A CN 202310031572A CN 115817000 A CN115817000 A CN 115817000A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention relates to the field of sensor processing, in particular to an inner and outer platform mechanism for metalizing a framed hole wall of a green ceramic chip, which comprises an outer platform assembly and an inner platform assembly; the outer table component comprises a bottom plate and a top plate, a central through hole is formed in the middle of the top plate, and a first negative pressure hole is formed in the top plate; the inner platform assembly comprises a vertical lifting mechanism, the movable end of the vertical lifting mechanism is connected with an inner supporting platform which can extend into the central through hole, a groove for mounting the slurry collecting box is formed in the top surface of the inner supporting platform, second negative pressure holes are distributed in the top surface of the inner supporting platform, a fan interface is arranged at the bottom of the inner supporting platform, and an air port is formed in the bottom of the slurry collecting box; and a lifting sensor is arranged on the vertical lifting mechanism. The metal frame of pasting the green ceramic chip adsorbs to the outer assembly, and the mask plate adsorbs to the inner assembly, and the inner saddle can realize independent lift for outer assembly under vertical elevating system's drive, and then guarantees that the mask plate can laminate the lower surface of green ceramic chip completely, plays the supporting effect to the ceramic chip, avoids the deformation of green ceramic chip.
Description
Technical Field
The invention relates to the field of sensor processing, in particular to a hole hanging machine, and particularly relates to an inner platform mechanism and an outer platform mechanism for metalizing a framed hole wall of a green ceramic chip.
Background
The high-temperature ceramic production is to manufacture a required circuit pattern on a green ceramic chip by punching, hole grouting, conductor and resistance printing, and a plurality of passive elements can be embedded in the circuit pattern; in the process, the high-temperature ceramic product can be processed only by a plurality of procedures of slitting, slicing, tearing a film, pasting a frame, punching, hole wall metallization, leveling, hole filling, laminating, packaging, laminating, sintering, cutting and the like; the hole wall metallization is an important key process step, the process step is completed by a hole hanging machine, the hole hanging machine prints the slurry on the inner wall of the raw porcelain piece hole, the hollow shape in the middle of the hole is formed, the effect of the slurry adhesion of the hole wall is achieved, and the hole wall metallization process is completed; the inspection basis of the quality of the hole wall metallization process is the uniformity degree of the hole wall slurry adhesion, and the index is determined by the precision of a hole wall metallization mechanism of a hole hanging machine;
the hole wall metallization process adopts a raw ceramic chip framing mode, namely the raw ceramic chip is pasted on a metal frame by using a special adhesive tape, so that the deformation of the raw ceramic chip in the whole process flow is reduced; the upper surface of the metal frame and the upper surface of the green ceramic chip are on the same plane, and the lower surface of the metal frame and the lower surface of the green ceramic chip are not on the same plane due to the difference of the thickness of the metal frame and the thickness of the green ceramic chip; in the hole wall metallization process, when the scraper applies pressure to the upper surface of the green ceramic sheet for missing printing, the lower surface of the green ceramic sheet has no supporting plane, so that the green ceramic sheet deforms, the position of the graph of the green ceramic sheet changes, the graph which is missed to the green ceramic sheet from the screen printing plate and the graph position of the green ceramic sheet are deviated, the position precision is low, and the final yield is reduced.
The prior art for metalizing the framed hole wall of the green ceramic chip comprises the following steps: the thickness difference between the green ceramic chip and the metal frame is realized by adjusting the mask plates with different thicknesses, and the stainless steel material die with the mask plate of 0.2mm-0.4mm is used for stamping, so that the position precision of the holes on the mask plate is ensured and can reach 5 microns; however, the precision of the thickness of the mask plate is 0.1mm, and the precision of the thickness of the green ceramic chip is 0.01mm, so that the method adopting the mask plates with different thicknesses has the following problems: one is as follows: the thickness precision of the mask plate is lower than that of the green ceramic chip, the lower surface of the metal frame and the lower surface of the green ceramic chip cannot be in the same plane, and the green ceramic chip still deforms in the hole wall metallization process, so that the precision of the hole wall metallization position is reduced; and the second step is as follows: the height difference between the lower surface of the metal frame and the lower surface of the green ceramic chip cannot be accurately quantified, and the degree of whether the two surfaces are in the same plane can be sensed only by hand feeling, so that the efficiency and the reliability are reduced. From the above problem, we can conclude that: the process has the problems of low position precision, low efficiency and low reliability.
Disclosure of Invention
In order to overcome the defects that the thickness precision of a mask plate is low and the precision of the hole wall metallization position is still reduced in the existing raw ceramic chip framed hole wall metallization treatment process; and the technical defects that the efficiency and the reliability are reduced can be caused by feeling whether the lower surface of the metal frame and the lower surface of the green ceramic chip are on the same plane or not by hands.
The invention provides an inner and outer platform mechanism for metallizing the framed hole wall of a green ceramic chip, which comprises: an outer stage assembly and an inner stage assembly;
the outer table assembly comprises a bottom plate and a top plate, the bottom plate and the top plate are connected through the side wall of the outer table, a central through hole is formed in the middle of the top plate, a circle of first negative pressure holes used for adsorbing the metal frame are further formed in the top plate, first air passages used for communicating all the first negative pressure holes are formed in the plate body of the top plate, and the bottom of the top plate is connected with a first negative pressure pipe orifice communicated with the first air passages and used for connecting a negative pressure air pump;
the inner platform assembly comprises a vertical lifting mechanism fixedly connected to the bottom plate, the movable end of the vertical lifting mechanism is connected with an inner supporting platform capable of extending into the central through hole, a groove for mounting a slurry collecting box is formed in the top surface of the inner supporting platform, second negative pressure holes for adsorbing a mask plate are uniformly distributed in the top surface of the inner supporting platform around the groove, a second negative pressure pipe orifice for communicating all the second negative pressure holes and connecting a negative pressure air pump is formed in the bottom of the inner supporting platform, a fan interface for connecting a fan is further communicated with the bottom of the inner supporting platform, a wind port communicated with the fan interface is formed in the bottom of the slurry collecting box, and a shielding plate for preventing slurry from dropping into the fan interface is supported above the wind port; and a lifting sensor for detecting vertical stroke is arranged on the vertical lifting mechanism.
The raw ceramic chips are pasted on the metal frame by special adhesive tapes in a frame mode; the upper surface of the metal frame and the upper surface of the raw ceramic chip are on the same plane, because the thickness of the metal frame is different from that of the raw ceramic chip, the lower surface of the metal frame and the lower surface of the raw ceramic chip are not on the same plane, the metal frame is arranged on the surface of a top plate of the outer table assembly, and the metal frame corresponds to a first negative pressure hole in the top plate in position, so that the metal frame can be adsorbed on the top plate through the first negative pressure hole after the first negative pressure pipe orifice is communicated with the negative pressure air pump; the mask plate is arranged on the inner supporting platform of the inner platform assembly, the second negative pressure pipe orifice is communicated with the negative pressure air pump and then can be firmly adsorbed through the second negative pressure hole, and the position of the upper surface of the mask plate when the upper surface of the metal frame is level to the normal is the initial position of the vertical lifting mechanism. When the novel mortar collecting box is used specifically, the signal output end of the lifting sensor is connected to the controller, the controller is further electrically connected with the vertical lifting mechanism and used for controlling the lifting and the falling of the vertical lifting mechanism, the controller is further connected with a touch screen used for inputting thickness information of the raw ceramic chips, the thickness of the raw ceramic chips is input through the touch screen, the controller controls the vertical lifting mechanism to fall by the distance the same as the thickness, the raw ceramic chips can be just supported by the mask plate at the moment, the raw ceramic chips start to be printed, after the printing is completed, the fan connected with the fan interface is started, the mortar collecting box is communicated with the fan interface on the inner supporting platform through the air port, the mortar in the holes in the raw ceramic chips is drawn out through the fan, the falling mortar is collected in the mortar collecting box, the shielding plate can prevent the mortar from falling into a fan pipeline, and when the mortar in the mortar collecting box is accumulated to a certain amount, the novel mortar collecting box can be replaced. The fan automatically stops after the set time, the metal frame is adsorbed and loosened, the metal frame adhered with the green ceramic chips is conveyed to a blanking position through a manual or mechanical arm, and the metallization process of the hole walls of the green ceramic chips is completed.
Preferably, vertical elevating system includes elevator motor, screw-thread fit's lead screw and screw nut, link firmly the mount pad that is used for installing elevator motor and lead screw on the bottom plate, elevator motor links firmly to the mount pad on, the lead screw is through rotating connecting piece and mount pad normal running fit, be connected through the hold-in range between elevator motor's drive shaft and the lead screw, be connected with nut switching piece on the screw nut, nut switching piece passes through horizontal connecting plate and interior pallet bottom fixed connection, be provided with the second air flue that is used for communicateing the second negative pressure hole in the plate body of horizontal connecting plate, the second negative pressure mouth of pipe is linked together and links firmly to the bottom of horizontal connecting plate with the second air flue, be connected with two piece at least vertical guiding axles between horizontal connecting plate and the bottom plate, vertical guiding axle is connected with the bottom plate through linear bearing.
Preferably, the number of the vertical guide shafts is four, and the four vertical guide shafts are respectively positioned at four corners of the bottom plate.
Preferably, the lifting sensor is matched with a lifting sensing piece, the lifting sensing piece is fixedly connected with the nut switching block through at least one bolt, and the lifting sensor is fixedly connected to the mounting seat.
Preferably, the number of the bolts is two, and the through holes for penetrating the bolts on the lifting sensing piece are long round holes arranged in the vertical direction.
Preferably, the bottom of the screw rod is connected with a large belt wheel, a small belt wheel is connected to a driving shaft of the lifting motor, and the large belt wheel and the small belt wheel are connected through a synchronous belt.
Preferably, the bottom of the slurry collection box extends upward along the edge of the tuyere with a flange ring higher than the bottom of the slurry collection box for preventing the slurry from flowing into the blower interface.
Preferably, the cross section of the slurry collection box is matched with the positions of the holes on the green ceramic chips, the groove is matched with the slurry collection box, and the top surface of the side wall of the slurry collection box is flush with the top surface of the inner supporting platform.
Preferably, the outer table side wall is provided with a window for viewing the inner table assembly.
Compared with the prior art, the technical scheme provided by the invention has the following advantages: the invention relates to an inner and outer platform mechanism for metallizing a hole wall with a frame of a raw ceramic chip, which is divided into an inner platform component and an outer platform component, wherein a metal frame for pasting the raw ceramic chip is adsorbed on the outer platform component, a mask plate is adsorbed on the inner platform component, and in the inner platform component, an inner supporting platform can be driven by a vertical lifting mechanism to independently lift relative to the outer platform component, so that the mask plate can be completely attached to the lower surface of the raw ceramic chip, the raw ceramic chip can be completely supported, and the raw ceramic chip is prevented from deforming in the hole wall metallizing process.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a schematic view of the overall structure of an inner and outer stage mechanism for metallizing a hole wall with a frame of a green ceramic chip after adsorbing a metal frame, the green ceramic chip and a mask plate according to an embodiment of the present invention;
FIG. 2 is a schematic view of the inner and outer stage mechanisms with metalized frame hole walls of a green ceramic chip according to the embodiment of the present invention in a use state after only a mask plate is adsorbed;
FIG. 3 is a schematic view of the overall structure of the inner and outer stage mechanism for metalizing the framed hole walls of the green ceramic sheets when the metal frame, the green ceramic sheets and the mask plate are not adsorbed according to the embodiment of the present invention;
FIG. 4 is a schematic view of the inner table assembly of the present embodiment on the base plate (with one of the vertical guide shafts removed);
FIG. 5 is a schematic view of the installation of the lift sensor strip and lift sensor in the inner stage assembly according to the embodiment of the present invention;
FIG. 6 is a schematic structural diagram of the inner pallet mounted on the horizontal connecting plate according to the embodiment of the invention;
FIG. 7 is a bottom view of the horizontal web in an embodiment of the present invention;
FIG. 8 is a top view of the horizontal connecting plate and the inner pallet according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of the assembly of the large pulley, the small pulley and the synchronous belt in the embodiment of the invention;
FIG. 10 is a schematic diagram of the relative positions of the metal frame, the green ceramic chip and the mask in the embodiment of the present invention;
FIG. 11 is a schematic bottom structure view of the metal frame, the green ceramic chip and the mask in the embodiment of the present invention.
Wherein: 1. a base plate; 2. a top plate; 3. an outer platform side wall; 4. a central through hole; 5. a first negative pressure hole; 6. a vertical lifting mechanism; 7. an inner saddle; 8. a slurry collection box; 9. a groove; 10. a second negative pressure hole; 11. a second negative pressure pipe orifice; 12. a fan interface; 13. a tuyere; 14. a shutter; 15. a lift sensor; 16. a lifting motor; 17. a lead screw; 18. a lead screw nut; 19. a mounting seat; 20. rotating the connecting piece; 21. a synchronous belt; 22. a nut transfer block; 23. a horizontal connecting plate; 24. a vertical guide shaft; 25. a linear bearing; 26. lifting the induction sheet; 27. a long round hole; 28. a large belt pulley; 29. a small belt pulley; 30. a flange ring; 31. a window; 32. a motor base; 33. a metal frame; 34. a green ceramic chip; 35. and (5) masking the film plate.
Detailed Description
In order that the above objects, features and advantages of the present invention may be more clearly understood, a solution of the present invention will be further described below. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those described herein; it is to be understood that the embodiments described in this specification are only some embodiments of the invention, and not all embodiments.
In an embodiment of the present invention, there is provided an inner and outer stage mechanism for metallizing framed hole walls of green ceramic tiles, as shown in fig. 1 to 11, comprising: an outer stage assembly and an inner stage assembly;
the outer table assembly comprises a bottom plate 1 and a top plate 2, the bottom plate 1 and the top plate 2 are connected through an outer table side wall 3, a central through hole 4 is formed in the middle of the top plate 2, a circle of first negative pressure holes 5 used for adsorbing the metal frame 33 are further formed in the top plate 2, a first air passage used for communicating all the first negative pressure holes 5 is formed in a plate body of the top plate 2, and the bottom of the top plate 2 is connected with a first negative pressure pipe orifice communicated with the first air passage and used for connecting a negative pressure air pump;
the inner platform assembly comprises a vertical lifting mechanism 6 fixedly connected to the bottom plate 1, the movable end of the vertical lifting mechanism 6 is connected with an inner supporting platform 7 capable of extending into the central through hole 4, a groove 9 used for installing a slurry collecting box 8 is formed in the top surface of the inner supporting platform 7, second negative pressure holes 10 used for adsorbing a mask plate 35 are uniformly distributed in the top surface of the inner supporting platform 7 around the groove 9, a second negative pressure pipe orifice 11 used for communicating all the second negative pressure holes 10 and connecting a negative pressure air pump is formed in the bottom of the inner supporting platform 7, a fan interface 12 used for connecting a fan is further communicated with the bottom of the inner supporting platform 7, an air port 13 communicated with the fan interface 12 is formed in the bottom of the slurry collecting box 8, and a shielding plate 14 used for preventing slurry from dropping into the fan interface 12 is supported above the air port 13; the vertical lift mechanism 6 is provided with a lift sensor 15 for detecting a vertical stroke.
The mode that the green ceramic chip 34 is provided with a frame is adopted, namely the green ceramic chip 34 is pasted on the metal frame 33 by a special adhesive tape; the upper surface of the metal frame 33 and the upper surface of the green ceramic chip 34 are on the same plane, because the thickness of the metal frame 33 is different from that of the green ceramic chip 34, the lower surface of the metal frame 33 and the lower surface of the green ceramic chip 34 are not on the same plane, the metal frame 33 is arranged on the surface of the top plate 2 of the outer table assembly, the metal frame 33 corresponds to the first negative pressure hole 5 on the top plate 2 in position, and then when the first negative pressure pipe orifice is communicated with the negative pressure air pump, the first negative pressure hole 5 can adsorb the metal frame 33 on the top plate 2; on arranging mask plate 35 in interior platform 7 of interior platform subassembly, can adsorb mask plate 35 firmly through second negative pressure hole 10 behind the 11 switch-on negative pressure air pumps of second negative pressure mouth of pipe, the position at the same time of mask plate 35 upper surface and metal frame 33 upper surface level is vertical elevating system 6's initial position this moment. During the specific use, the signal output part of the lifting sensor 15 is connected to the controller, the controller is further electrically connected with the vertical lifting mechanism 6 and used for controlling the lifting and the falling of the vertical lifting mechanism 6, the controller is further connected with a touch screen used for inputting the thickness information of the raw ceramic tiles 34, the thickness of the raw ceramic tiles 34 is input through the touch screen, the controller controls the vertical lifting mechanism 6 to fall down by the distance same as the thickness (according to the specific situation, the vertical lifting mechanism 6 can rise and fall down), at the moment, the raw ceramic tiles 34 can be just supported by the mask plate 35, the raw ceramic tiles 34 start printing, after the printing is completed, the fan connected with the fan interface 12 is started, the slurry collecting box 8 is communicated with the fan interface 12 on the inner supporting platform 7 through the air port 13, the slurry in the holes in the raw ceramic tiles 34 is extracted through the fan, the dropped slurry is collected in the slurry collecting box 8, the shielding plate 14 can prevent the slurry from falling into a fan pipeline, and when the slurry in the slurry collecting box 8 is accumulated to a certain amount, the slurry collecting box 8 can be replaced by a new slurry collecting box 8. The fan is automatically stopped after the set time, the metal frame 33 is adsorbed and loosened, the metal frame 33 adhered with the green ceramic chip 34 is conveyed to the blanking position through a manual or mechanical arm, and the hole wall metallization process of the green ceramic chip 34 is completed.
Further, as a specific implementation manner of a certain embodiment of the present invention, the vertical lifting mechanism 6 includes a lifting motor 16, a screw 17 and a screw nut 18 which are in threaded fit, a base plate 1 is fixedly connected with a mounting seat 19 for mounting the lifting motor 16 and the screw 17, the lifting motor 16 is fixedly connected to the mounting seat 19, the screw 17 is rotatably fitted to the mounting seat 19 through a rotating connecting member 20, a driving shaft of the lifting motor 16 is connected to the screw 17 through a synchronous belt 21, the screw nut 18 is connected to a nut transfer block 22, the nut transfer block 22 is fixedly connected to the bottom of the inner platform 7 through a horizontal connecting plate 23, a second air passage for communicating with the second negative pressure hole 10 is provided in a plate body of the horizontal connecting plate 23, the second negative pressure pipe orifice 11 is communicated with the second air passage and is fixedly connected to the bottom of the horizontal connecting plate 23, at least two vertical guide shafts 24 are connected between the horizontal connecting plate 23 and the base plate 1, and the vertical guide shafts 24 are connected to the base plate 1 through linear bearings 25.
Wherein, the technical personnel in the field can understand that, the drive shaft axial of elevator motor 16 is parallel with lead screw 17 axial, specifically, elevator motor 16 passes through motor cabinet 32 to be fixed to one side of mount pad 19, lead screw 17 passes through to rotate connecting piece 20 and fixes to the opposite side of mount pad 19, under the drive of hold-in range 21, elevator motor 16 can drive lead screw 17 and rotate, lead screw nut 18 on lead screw 17 passes through nut switching piece 22 and horizontal connecting plate 23 and links to each other again, horizontal connecting plate 23 is because the restriction of vertical guiding axle 24, so lead screw nut 18 can only move from top to bottom, and then drive interior saddle 7 on horizontal connecting plate 23 and can reciprocate.
Further, the number of the vertical guide shafts 24 is four, and the four vertical guide shafts 24 are respectively located at four corners of the bottom plate 1. The arrangement is reasonable, and the balance of the horizontal connecting plate 23 can be guaranteed.
Further, as a specific implementation manner of a certain embodiment of the present invention, the elevation sensor 15 is matched with an elevation sensing piece 26, the elevation sensing piece 26 is fixedly connected with the nut transfer block 22 through at least one bolt, and the elevation sensor 15 is fixedly connected to the mounting base 19.
Wherein, lift response piece 26 links firmly to nut switching piece 22, so lift response piece 26 can move up and down along with nut switching piece 22, but lift sensor 15 is fixed on mount pad 19, so lift sensor 15 is static relatively, so when lift response piece 26 moved up and down, lift sensor 15 can detect out vertical stroke, guarantees the precision of vertical elevating system 6.
Furthermore, the number of the bolts is two, and the through holes for the bolts to pass through on the lifting sensing piece 26 are oblong holes 27 arranged along the vertical direction.
The oblong holes 27 are arranged in the vertical direction because the height of the initial position of the lifting sensing piece 26 can be flexibly set through the oblong holes 27 to meet the requirements of green ceramic pieces 34 with different thicknesses.
Further, the bottom of the lead screw 17 is connected with a large belt wheel 28, a driving shaft of the lifting motor 16 is connected with a small belt wheel 29, and the large belt wheel 28 and the small belt wheel 29 are connected through a synchronous belt 21.
Specifically, the installation seat 19 is arranged below to be an emptying structure, the bottom of the screw rod 17 and the driving shaft of the lifting motor 16 extend into the lower portion of the installation seat 19, so that the large belt wheel 28, the small belt wheel 29 and the synchronous belt 21 are all located below the installation seat 19, and the arrangement structure is reasonable.
Further, as a specific embodiment of the present invention, the bottom of the slurry collecting box 8 is extended upward along the edge of the tuyere 13 by a flange ring 30 higher than the bottom of the slurry collecting box 8, and the flange ring 30 is used for preventing the slurry from flowing into the fan attachment 12.
Wherein, as is easily understood by those skilled in the art, the flange ring 30 is higher than the bottom of the slurry collecting box 8, so as to effectively prevent the slurry from being directly sucked into the fan connector 12 by the wind, and in the specific use process, since the slurry is a quick-drying material with extremely small fluidity, the slurry will be quickly solidified and accumulated after dropping into the slurry collecting box 8, and when the height of the slurry after accumulation exceeds the top of the slurry collecting box 8, the slurry collecting box 8 needs to be replaced.
Furthermore, the cross section of the slurry collection box 8 is matched with the positions of the holes on the green ceramic sheets 34, the groove 9 is matched with the slurry collection box 8, and the top surface of the side wall of the slurry collection box 8 is flush with the top surface of the inner support 7.
Set up rational in infrastructure like this, the top surface of 8 lateral walls of box is collected to thick liquids flushes with the top surface of interior saddle 7, perhaps the top surface of 8 lateral walls of box is collected to thick liquids is less than the top surface of interior saddle 7, just can guarantee that interior saddle 7 accessible second negative pressure hole 10 adsorbs mask plate 35.
Further, the outer stage side wall 3 is provided with a window 31 for viewing the inner stage assembly. The operation state of the inner table component is convenient to observe at any time, and the maintenance is convenient.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The utility model provides a raw ceramic chip area frame pore wall metallization's interior outer platform mechanism which characterized in that includes: an outer stage assembly and an inner stage assembly;
the outer table assembly comprises a bottom plate (1) and a top plate (2), the bottom plate (1) and the top plate (2) are connected through an outer table side wall (3), a central through hole (4) is formed in the middle of the top plate (2), a circle of first negative pressure holes (5) used for adsorbing a metal frame (33) are further formed in the top plate (2), first air passages used for communicating all the first negative pressure holes (5) are formed in a plate body of the top plate (2), and the bottom of the top plate (2) is connected with a first negative pressure pipe orifice communicated with the first air passages and used for being connected with a negative pressure air pump;
the inner platform assembly comprises a vertical lifting mechanism (6) fixedly connected to the bottom plate (1), the movable end of the vertical lifting mechanism (6) is connected with an inner support platform (7) capable of extending into the central through hole (4), a groove (9) for mounting a slurry collecting box (8) is formed in the top surface of the inner support platform (7), second negative pressure holes (10) for adsorbing a mask plate (35) are uniformly distributed in the top surface of the inner support platform (7) around the groove (9), second negative pressure pipe orifices (11) for communicating all the second negative pressure holes (10) and connecting a negative pressure air pump are formed in the bottom of the inner support platform (7), a fan interface (12) for connecting a fan is further communicated with the bottom of the inner support platform (7), an air port (13) communicated with the fan interface (12) is formed in the bottom of the slurry collecting box (8), and a shielding plate (14) for preventing slurry from dropping into the fan interface (12) is supported above the air port (13); and a lifting sensor (15) for detecting a vertical stroke is arranged on the vertical lifting mechanism (6).
2. The inside and outside platform mechanism for the metallization of the wall of the hole with the frame of the green ceramic chip according to claim 1, characterized in that the vertical lifting mechanism (6) comprises a lifting motor (16), a screw rod (17) and a screw nut (18) which are in threaded fit, a mounting seat (19) for mounting the lifting motor (16) and the screw rod (17) is fixedly connected to the bottom plate (1), the lifting motor (16) is fixedly connected to the mounting seat (19), the screw rod (17) is in rotational fit with the mounting seat (19) through a rotational connecting piece (20), a driving shaft of the lifting motor (16) is connected to the screw rod (17) through a synchronous belt (21), a nut transfer block (22) is connected to the screw nut (18), the nut transfer block (22) is fixedly connected to the bottom of the inside platform (7) through a horizontal connecting plate (23), a second air passage for communicating the second negative pressure hole (10) is arranged in the plate body of the horizontal connecting plate (23), a second negative pressure pipe orifice (11) is communicated with the second air passage and fixedly connected to the bottom of the horizontal connecting plate (23), at least two linear guide shafts (24) are connected to the bottom plate (1).
3. The inner and outer stage mechanism for the metallization of the framed hole wall of a green ceramic chip according to claim 2, wherein the number of the vertical guide shafts (24) is four, and the four vertical guide shafts (24) are respectively located at four corners of the bottom plate (1).
4. The inner and outer stage mechanism for raw ceramic tile framed hole wall metallization according to claim 2 or 3, characterized in that the elevation sensor (15) is fitted with an elevation sensing piece (26), the elevation sensing piece (26) is fixedly connected with the nut transfer block (22) through at least one bolt, and the elevation sensor (15) is fixedly connected to the mounting base (19).
5. The inner and outer platform mechanisms for the metallization of the wall of the green ceramic tile frame hole according to claim 4, wherein the number of the bolts is two, and the through holes for the bolts to pass through on the lifting induction sheet (26) are long round holes (27) arranged along the vertical direction.
6. The inner and outer stage mechanism for the metallization of the wall of the green ceramic tile frame hole according to claim 2, wherein the bottom of the screw rod (17) is connected with a large belt pulley (28), the driving shaft of the lifting motor (16) is connected with a small belt pulley (29), and the large belt pulley (28) and the small belt pulley (29) are connected through a synchronous belt (21).
7. The inner and outer stage mechanism for the framing wall metallization of a green ceramic tile as claimed in claim 4, wherein the bottom of the slurry collection box (8) extends upwardly along the edge of the air opening (13) with a flange ring (30) above the bottom of the slurry collection box (8), the flange ring (30) being adapted to prevent slurry from flowing into the fan attachment (12).
8. The inner and outer stage mechanism for the metallization of the framed wall of the green ceramic tile according to claim 7, wherein the cross-sectional shape of the slurry collecting box (8) is adapted to the position of the holes on the green ceramic tile (34), the groove (9) is adapted to the shape of the slurry collecting box (8), and the top surface of the sidewall of the slurry collecting box (8) is flush with the top surface of the inner stage (7).
9. The inner and outer stage mechanism for the metallization of the framed wall of the green ceramic tile according to claim 1, wherein the outer stage side wall (3) is provided with a window (31) for viewing the inner stage assembly.
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Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000190451A (en) * | 1994-05-11 | 2000-07-11 | Matsushita Electric Ind Co Ltd | Screen process printing |
JP2004034444A (en) * | 2002-07-02 | 2004-02-05 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board and squeegee |
JP2008265141A (en) * | 2007-04-19 | 2008-11-06 | Yamaha Motor Co Ltd | Lifting and lowering apparatus for superposing and mounting substrate, lifting and lowering apparatus for backup, substrate supporting unit, and printer |
JP2009081305A (en) * | 2007-09-26 | 2009-04-16 | Tdk Corp | Method of filling through hole for substrate workpiece |
JP2009190364A (en) * | 2008-02-18 | 2009-08-27 | Ngk Insulators Ltd | Method and apparatus for sealing end face of ceramic honeycomb |
JP2010184430A (en) * | 2009-02-12 | 2010-08-26 | Denso Corp | Method and apparatus which fill up closed-bottom hole with paste-like substance |
CN201638798U (en) * | 2010-01-27 | 2010-11-17 | 中国电子科技集团公司第四十五研究所 | Workbench device on low-temperature co-fired ceramic printing sub-system |
CN104125724A (en) * | 2014-07-23 | 2014-10-29 | 广东兴达鸿业电子有限公司 | Production process for PCB (Printed Circuit Board) metal half-hole products |
CN205272821U (en) * | 2016-01-06 | 2016-06-01 | 江苏省宜兴电子器件总厂 | Metallization thick liquids printing device of green through -hole |
CN106658997A (en) * | 2016-12-29 | 2017-05-10 | 中国电子科技集团公司第二研究所 | Printing mechanism for raw ceramic chip through hole wall metallization |
CN107144905A (en) * | 2017-05-08 | 2017-09-08 | 湖北东田光电材料科技有限公司 | Optical filter and preparation facilities with extinction frame |
CN108248202A (en) * | 2017-12-30 | 2018-07-06 | 广州泰行智能科技有限公司 | A kind of screen printer for handset touch panel printing |
WO2020008761A1 (en) * | 2018-07-04 | 2020-01-09 | パナソニックIpマネジメント株式会社 | Screen-printing device and screen-printing method |
CN111492724A (en) * | 2018-01-15 | 2020-08-04 | 株式会社富士 | Supporting block and screen printing machine |
CN215152927U (en) * | 2021-07-21 | 2021-12-14 | 浙江新纳陶瓷新材有限公司 | Ceramic hole metallization subassembly |
CN216100963U (en) * | 2021-10-29 | 2022-03-22 | 四川英创力电子科技股份有限公司 | Screen printing device for printing copper paste on printed circuit board |
CN114228314A (en) * | 2021-11-04 | 2022-03-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Compensating mechanism for stripping angle of slurry on screen printing machine |
CN115379664A (en) * | 2022-07-29 | 2022-11-22 | 浙江长兴电子厂有限公司 | Production device for completing metallization of diaphragm hole wall |
-
2023
- 2023-01-10 CN CN202310031572.5A patent/CN115817000B/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000190451A (en) * | 1994-05-11 | 2000-07-11 | Matsushita Electric Ind Co Ltd | Screen process printing |
JP2004034444A (en) * | 2002-07-02 | 2004-02-05 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board and squeegee |
JP2008265141A (en) * | 2007-04-19 | 2008-11-06 | Yamaha Motor Co Ltd | Lifting and lowering apparatus for superposing and mounting substrate, lifting and lowering apparatus for backup, substrate supporting unit, and printer |
JP2009081305A (en) * | 2007-09-26 | 2009-04-16 | Tdk Corp | Method of filling through hole for substrate workpiece |
JP2009190364A (en) * | 2008-02-18 | 2009-08-27 | Ngk Insulators Ltd | Method and apparatus for sealing end face of ceramic honeycomb |
JP2010184430A (en) * | 2009-02-12 | 2010-08-26 | Denso Corp | Method and apparatus which fill up closed-bottom hole with paste-like substance |
CN201638798U (en) * | 2010-01-27 | 2010-11-17 | 中国电子科技集团公司第四十五研究所 | Workbench device on low-temperature co-fired ceramic printing sub-system |
CN104125724A (en) * | 2014-07-23 | 2014-10-29 | 广东兴达鸿业电子有限公司 | Production process for PCB (Printed Circuit Board) metal half-hole products |
CN205272821U (en) * | 2016-01-06 | 2016-06-01 | 江苏省宜兴电子器件总厂 | Metallization thick liquids printing device of green through -hole |
CN106658997A (en) * | 2016-12-29 | 2017-05-10 | 中国电子科技集团公司第二研究所 | Printing mechanism for raw ceramic chip through hole wall metallization |
CN107144905A (en) * | 2017-05-08 | 2017-09-08 | 湖北东田光电材料科技有限公司 | Optical filter and preparation facilities with extinction frame |
CN108248202A (en) * | 2017-12-30 | 2018-07-06 | 广州泰行智能科技有限公司 | A kind of screen printer for handset touch panel printing |
CN111492724A (en) * | 2018-01-15 | 2020-08-04 | 株式会社富士 | Supporting block and screen printing machine |
WO2020008761A1 (en) * | 2018-07-04 | 2020-01-09 | パナソニックIpマネジメント株式会社 | Screen-printing device and screen-printing method |
CN215152927U (en) * | 2021-07-21 | 2021-12-14 | 浙江新纳陶瓷新材有限公司 | Ceramic hole metallization subassembly |
CN216100963U (en) * | 2021-10-29 | 2022-03-22 | 四川英创力电子科技股份有限公司 | Screen printing device for printing copper paste on printed circuit board |
CN114228314A (en) * | 2021-11-04 | 2022-03-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Compensating mechanism for stripping angle of slurry on screen printing machine |
CN115379664A (en) * | 2022-07-29 | 2022-11-22 | 浙江长兴电子厂有限公司 | Production device for completing metallization of diaphragm hole wall |
Non-Patent Citations (3)
Title |
---|
吕琴红;乔海灵;: "浅谈LTCC工艺及设备的发展" * |
张丽华;张金利;: "LTCC工艺技术研究" * |
杨伟;马其琪;贾少雄;: "LTCC技术中生瓷片的形变分析及应用" * |
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