CN115811838B - Forming method and forming die of PCB - Google Patents
Forming method and forming die of PCB Download PDFInfo
- Publication number
- CN115811838B CN115811838B CN202310078355.1A CN202310078355A CN115811838B CN 115811838 B CN115811838 B CN 115811838B CN 202310078355 A CN202310078355 A CN 202310078355A CN 115811838 B CN115811838 B CN 115811838B
- Authority
- CN
- China
- Prior art keywords
- cover plate
- pcb
- routing
- forming
- gong
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000005553 drilling Methods 0.000 claims description 12
- 238000003754 machining Methods 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Punching Or Piercing (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a forming method and a forming die of a PCB, wherein the method comprises the following steps: a material cutting step, namely processing a first cover plate and a second cover plate which correspond to the PNL size of the PCB according to the PNL size; a forming step, namely adding the first cover plate and the second cover plate twice on the surface of the PCB respectively, and forming the PCB according to first gong band data and second gong band data; wherein, the routing of the first routing information and the second routing information are overlapped with each other to form a plurality of frames with the same size as SET or PCS required by delivery. The cover plate can be repeatedly used, and when the cover plate is taken down and covered, the cover plate is taken down and covered according to the size of PNL instead of the SET or PCS, so that the operation is convenient, the time is saved, and the production efficiency is obviously improved.
Description
Technical Field
The invention belongs to the technical field of electronic element production, and particularly relates to a forming method and a forming die of a PCB.
Background
Along with the development of the electronic products towards the directions of light weight, integration and multifunction, the requirements on the manufacturing process of the electronic component assembly are higher and higher, and the apparent requirements on the electronic component assembly are also more and more strict, particularly, when the surface-treated gold or tin surface of the PCB is formed, a cover plate is often required to be added on the upper surface of the PCB to be formed as a protection layer, the cover plate is formed and produced together with the PCB to prevent the friction of the pressure foot of a forming machine from scratching the gold or tin surface, and the cover plate is produced according to the delivery size of the PCB, but when the PNL size of the produced PCB is larger and the delivery size (SET or PCS size) is smaller, each PCB is divided into a plurality of or dozens of SET or PCS after the PCB is formed, if the size of SET or PCS is smaller, the dividing number is more, and when the subsequent processing is performed, the cover plate divided into small-size is required to be covered on the PCB to be formed again one by one.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a forming method of a PCB, which is convenient to operate, saves time and improves the production efficiency of the PCB by rounding according to the size of PNL when the cover plate is taken down and covered.
The aim of the invention is achieved by the following technical scheme:
a forming method of a PCB board comprises the following steps:
a material cutting step, namely processing a first cover plate and a second cover plate which correspond to the PNL size of the PCB according to the PNL size;
a forming step, namely adding the first cover plate and the second cover plate twice on the surface of the PCB respectively, and forming the PCB according to first gong band data and second gong band data;
wherein, the routing of the first routing information and the second routing information are overlapped with each other to form a plurality of frames with the same size as SET or PCS required by delivery.
In one embodiment, the routing of the first routing information is perpendicular to the routing of the second routing information, and the routing of the first routing information and the routing of the second routing information extend in parallel respectively.
In one embodiment, the routing within the first or second routing information extends in a horizontal direction.
In one embodiment, the first routing information and the first positioning holes of the second routing information are all arranged in a common hole.
In one embodiment, in the step of cutting, if the first cover plate and the second cover plate are optical plates, the core plate is used for cutting, and the first cover plate and the second cover plate are etched into backing plates after cutting is completed.
In one embodiment, after the blanking step, a drilling step is further included,
the first cover plate and the second cover plate are installed on a drilling machine table, the machining range is adjusted by means of the masking tape, second positioning holes needed during PCB forming are machined, and the second positioning holes are correspondingly arranged with the first positioning holes in the first gong belt data and the second gong belt data.
In one embodiment, the molding step further comprises:
drilling a third positioning hole corresponding to the first positioning hole on a machine table of the gong machine;
arranging the PCB on a machine table of the gong machine, aligning the second positioning hole with the third positioning hole and inserting a pin;
adding the first cover plate on the surface of the PCB, and processing according to the first gong band data;
and taking down the first cover plate, adding the second cover plate on the surface of the PCB, and processing according to the second gong band information.
The invention also provides a forming die of the PCB, which comprises a first cover plate and a second cover plate, wherein the sizes of the first cover plate and the second cover plate are corresponding to the PNL size of the PCB, and the routing processed on the first cover plate and the second cover plate can form a plurality of frames consistent with the SET or PCS size required by delivery after being overlapped.
The invention has the beneficial effects that:
the cover plate can be repeatedly used, when the cover plate is taken down and covered, the cover plate is taken down and covered according to the size of PNL, instead of the size of SET or PCS, the operation is convenient, the time is saved, and the production efficiency is obviously improved.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
FIG. 1 shows a schematic flow chart of the present invention;
fig. 2 shows a PNL size schematic of a PCB board of the present invention;
fig. 3 shows a SET size schematic diagram of the PCB board of the present invention;
fig. 4 shows a PCS schematic of the PCB board of the present invention;
FIG. 5 shows a schematic structural view of a first cover plate of the present invention;
FIG. 6 shows a schematic structural view of a second cover plate of the present invention;
in the drawings, like parts are designated with like reference numerals. The figures are not to scale.
Reference numerals:
PNL size of 1-PCB board, SET size of 2-PCB board, PCS size of 3-PCB board, 4-second locating hole, 5-third locating hole, 6-first apron, 7-second apron.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
Example 1
The invention provides a forming method of a PCB (printed Circuit Board), which is shown in figure 1 and comprises the following steps:
step S100, cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the PNL size of the PCB;
step S200, forming, namely respectively adding a first cover plate and a second cover plate on the surface of the PCB twice, and respectively processing and forming the PCB according to the first gong belt data and the second gong belt data;
in step S200, the routing of the first routing information and the second routing information are overlapped with each other to form a plurality of frames with the same size as the SET or PCS required for delivery.
It should be noted that, because the electronic products develop in the direction of light weight, integration and multifunction, when the PCB board is formed, it is often necessary to add a cover plate on the PCB board to be formed, and to form and produce the cover plate together with the PCB board as a protective layer, to prevent the brushing of the pressure foot of the forming machine from scratching the gold or tin surface, and when the PCB board is formed, both the PCB board and the auxiliary cover plate are produced according to the delivery size of the PCB, when the PNL size of the produced PCB board is larger, and the delivery size (SET or PCS size) is smaller, each PCB board will be divided into several or tens of SETs or PCS after forming, if the size of SET or PCS is smaller, the number of divisions is larger, and when the subsequent processing is performed, it is also necessary to cover the cover plate divided into small sizes on the PCB board to be formed one by one again, so that the production efficiency is lower;
as shown in fig. 2, 3 and 4, the PNL size 1 of the PCB board has SET sizes 2 of a plurality of PCB boards, and the SET size 2 of the PCB board has PCS size 3 of a plurality of PCB boards, that is, the PCB board is divided into a plurality of SETs or PCS after being formed.
Example 2
The invention provides a forming method of a PCB, which comprises the following steps:
step A100, cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the PNL size of the PCB;
step A200, drilling, namely processing second positioning holes on the first cover plate and the second cover plate, wherein the positions of the second positioning holes correspond to the positions of the first positioning holes in the gong belt data;
step A300, copper deposition;
step A400, performing resistance welding, and performing surface treatment after resistance welding;
step A500, forming, namely respectively adding a first cover plate and a second cover plate on the surface of the PCB twice, and respectively processing and forming the PCB according to the first gong belt information and the second gong belt information;
in step a500, the routing of the first routing information and the second routing information are overlapped with each other to form a plurality of frames with the same size as the SET or PCS required for delivery;
and step A600, testing the formed PCB and finishing packaging.
Example 3
The same contents as those of the foregoing embodiments are not repeated in this embodiment;
the invention provides a forming method of a PCB, which comprises the following steps:
step B100, cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the PNL size of the PCB;
specifically, in step B100, the number of the first cover plate and the second cover plate is determined according to the processing spindle of the gong machine, and is generally 6 axes, when the first cover plate and the second cover plate are backing plates, no other treatment is needed, if the first cover plate and the second cover plate are light plates, a core plate is used during material cutting, and after the material cutting is completed, the core plate is etched into the light plates;
step B200, drilling, namely processing second positioning holes on the first cover plate and the second cover plate, wherein the positions of the second positioning holes correspond to the positions of the first positioning holes in the gong belt data;
specifically, in step B200, the first cover plate and the second cover plate are centrally placed on a drilling machine table, and are fixed by using a masking tape, and a machining range is adjusted to machine a second positioning hole required by the formation of the PCB board;
the drilling belt of the second positioning hole is manufactured according to the position of the first positioning hole in the formed gong belt;
step B500, forming, namely respectively adding a first cover plate and a second cover plate on the surface of the PCB twice, and respectively processing and forming the PCB according to the first gong belt information and the second gong belt information;
in step B500, the routing of the first routing information and the second routing information are overlapped with each other to form a plurality of frames with the same size as the SET or PCS required for delivery;
specifically, in step B500, the suffix of the first gong band data is rou1, the suffix of the second gong band data is rou2, rou1 and rou2 share a set of positioning holes;
step B500 specifically comprises;
step B501, calling the first gong band data or the second gong band data, and drilling a third positioning hole corresponding to the first positioning hole on a gong machine platform for forming a PCB;
step B502, placing the PCB on the surface of the gong machine after drilling the third positioning hole, aligning the second positioning hole with the third positioning hole and inserting a pin;
step B503, adding a cover plate on the surface of the PCB, and processing according to the first gong band data, namely rou file;
step B504, after the first gong belt data is processed, the cover plate is taken down, and the cover plate is marked as a first cover plate;
step B505, adding a cover plate on the surface of the PCB again, and processing according to second gong band data, namely rou files;
step B506, after the second gong belt data is processed, the cover plate is taken down, and the cover plate is marked as a second cover plate;
and B507, taking down the formed PCB, namely, taking the size of the PCB as the delivery size.
Further, as shown in fig. 2, 3 and 4, the third positioning hole 5 is formed on the PCB board and corresponds to the position of the second positioning hole 4, as shown in fig. 5 and 6, the first cover plate processed by the first routing information is shown in fig. 5, the second cover plate processed by the second routing information is shown in fig. 6, the routing on the first cover plate 6 is perpendicular to the routing on the second cover plate 7, the routing on the first cover plate 6 and the routing Cheng Junfen on the second cover plate 7 are respectively extended in parallel, the routing on the second cover plate 7 extends along the horizontal direction, the routing on the first cover plate 6 and the routing Cheng Chong of the second cover plate 7 are overlapped to form the SET or PCS size required by delivery, and the cover plate keeps a whole (PNL size) during forming, so that the time for removing the cover plate and the time for re-loading the cover plate is very short, and the work efficiency is greatly improved.
Example 4
The invention provides a forming die of a PCB (printed circuit board), which comprises a first cover plate 6 and a second cover plate 7, wherein the sizes of the first cover plate 6 and the second cover plate 7 are corresponding to the PNL size of the PCB, and gongs machined on the first cover plate 6 and the second cover plate 7 can form a plurality of frames with the same size as SET or PCS required by delivery after being overlapped.
In the description of the present invention, it should be understood that the terms "upper," "lower," "bottom," "top," "front," "rear," "inner," "outer," "left," "right," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the different dependent claims and the features described herein may be combined in ways other than as described in the original claims. It is also to be understood that features described in connection with separate embodiments may be used in other described embodiments.
Claims (6)
1. The forming method of the PCB is characterized by comprising the following steps of:
a material cutting step, namely processing a first cover plate and a second cover plate which correspond to the PNL size of the PCB according to the PNL size;
a forming step, namely adding the first cover plate on the surface of the PCB, and processing according to first gong band data; after the processing is finished, the first cover plate is taken down, the second cover plate is added on the surface of the PCB again, and the processing is carried out according to second gong band data;
wherein, the routing of the first routing information and the second routing information are overlapped with each other to form a plurality of frames with the same size as SET or PCS required by delivery; the routing of the first routing information is perpendicular to the routing of the second routing information, the routing of the first routing information and the routing of the second routing information extend in parallel respectively, and the routing of the first routing information or the routing of the second routing information extends in the horizontal direction.
2. The method of claim 1, wherein the first routing data and the first positioning holes of the second routing data are all arranged in a common hole.
3. The method according to claim 1 or 2, wherein in the step of cutting, if the first cover plate and the second cover plate are optical plates, the core plate is used for cutting, and the first cover plate and the second cover plate are etched into backing plates after the cutting is completed.
4. The method for forming a PCB according to claim 2, wherein,
after the blanking step, a drilling step is further included,
the first cover plate and the second cover plate are installed on a drilling machine table, the machining range is adjusted by means of the masking tape, second positioning holes needed during PCB forming are machined, and the second positioning holes are correspondingly arranged with the first positioning holes in the first gong belt data and the second gong belt data.
5. The method of claim 4, wherein the step of forming further comprises:
drilling a third positioning hole corresponding to the first positioning hole on a machine table of the gong machine;
arranging the PCB on a machine table of the gong machine, aligning the second positioning hole with the third positioning hole and inserting a pin;
adding the first cover plate on the surface of the PCB, and processing according to the first gong band data;
and taking down the first cover plate, adding the second cover plate on the surface of the PCB, and processing according to the second gong band information.
6. The forming die for the PCB manufactured by the forming method of the PCB in claim 1 is characterized by comprising a first cover plate and a second cover plate, wherein the sizes of the first cover plate and the second cover plate correspond to the PNL size of the PCB, and gongs machined on the first cover plate and the second cover plate can form a plurality of frames with the same size as SET or PCS required for delivery after being overlapped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310078355.1A CN115811838B (en) | 2023-02-08 | 2023-02-08 | Forming method and forming die of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310078355.1A CN115811838B (en) | 2023-02-08 | 2023-02-08 | Forming method and forming die of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115811838A CN115811838A (en) | 2023-03-17 |
| CN115811838B true CN115811838B (en) | 2023-06-27 |
Family
ID=85487691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310078355.1A Active CN115811838B (en) | 2023-02-08 | 2023-02-08 | Forming method and forming die of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115811838B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104936376A (en) * | 2015-06-05 | 2015-09-23 | 大连崇达电路有限公司 | Printed circuit board copper hole positioning plate and processing method thereof |
| CN205071479U (en) * | 2015-10-20 | 2016-03-02 | 同扬光电（江苏）有限公司 | A lamination jig for inciting somebody to action equidistant low paper that adheres of multi -disc circuit board is typeset |
| CN206977814U (en) * | 2017-06-28 | 2018-02-06 | 上海汇博精工电子科技有限公司 | A kind of pcb board cuts tool |
| CN110177434A (en) * | 2019-02-20 | 2019-08-27 | 淳华科技(昆山)有限公司 | Flexible circuit board takes off lid equipment |
| CN113038715A (en) * | 2021-03-12 | 2021-06-25 | 江西旭昇电子有限公司 | One-time routing forming method for printed circuit board |
| CN216217798U (en) * | 2021-11-01 | 2022-04-05 | 宁波特一电子有限公司 | Circuit board is cut apart and is assembled pressfitting tool frock with connector |
| CN114364128A (en) * | 2021-12-14 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | A kind of gong plate method and gong plate machine for PCB board |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9402319B2 (en) * | 2011-05-11 | 2016-07-26 | Vlt, Inc. | Panel-molded electronic assemblies |
| CN104703396B (en) * | 2015-03-02 | 2017-08-15 | 西安金百泽电路科技有限公司 | Small size wiring board method for processing forming without interior positioning |
| CN105960095B (en) * | 2016-05-31 | 2019-02-05 | Oppo广东移动通信有限公司 | Circuit board jointed board |
| CN108668446A (en) * | 2018-06-29 | 2018-10-16 | 奥士康精密电路（惠州）有限公司 | A kind of pcb board half bore gong plate processing structure and machining method |
| CN110944454A (en) * | 2019-12-19 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board production process |
| CN111093329B (en) * | 2019-12-27 | 2022-11-04 | 智恩电子(大亚湾)有限公司 | Small-size stepped PCB forming method |
| CN110996531B (en) * | 2020-01-02 | 2021-03-09 | 深圳市景旺电子股份有限公司 | Processing and manufacturing method for PCB molding |
| CN111954382B (en) * | 2020-09-07 | 2021-09-14 | 胜宏科技（惠州）股份有限公司 | Circuit board PAD and hole-to-edge size control method |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
| CN115135041A (en) * | 2022-06-10 | 2022-09-30 | 厦门恒富达电子科技有限公司 | Process for improving forming efficiency of circuit board |
| CN115334754A (en) * | 2022-08-15 | 2022-11-11 | 中山芯承半导体有限公司 | A processing and forming method for a circuit board without internal positioning holes |
-
2023
- 2023-02-08 CN CN202310078355.1A patent/CN115811838B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104936376A (en) * | 2015-06-05 | 2015-09-23 | 大连崇达电路有限公司 | Printed circuit board copper hole positioning plate and processing method thereof |
| CN205071479U (en) * | 2015-10-20 | 2016-03-02 | 同扬光电（江苏）有限公司 | A lamination jig for inciting somebody to action equidistant low paper that adheres of multi -disc circuit board is typeset |
| CN206977814U (en) * | 2017-06-28 | 2018-02-06 | 上海汇博精工电子科技有限公司 | A kind of pcb board cuts tool |
| CN110177434A (en) * | 2019-02-20 | 2019-08-27 | 淳华科技(昆山)有限公司 | Flexible circuit board takes off lid equipment |
| CN113038715A (en) * | 2021-03-12 | 2021-06-25 | 江西旭昇电子有限公司 | One-time routing forming method for printed circuit board |
| CN216217798U (en) * | 2021-11-01 | 2022-04-05 | 宁波特一电子有限公司 | Circuit board is cut apart and is assembled pressfitting tool frock with connector |
| CN114364128A (en) * | 2021-12-14 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | A kind of gong plate method and gong plate machine for PCB board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115811838A (en) | 2023-03-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107484356B (en) | Manufacturing method of thick copper sandwich aluminum substrate | |
| EP1543453A1 (en) | System and method for modifying electronic design data | |
| CN113891557B (en) | Printed circuit board manufacturing method | |
| CN111031682B (en) | Manufacturing method of 5G signal shielding PCB module with latch | |
| CN112631080B (en) | Exposure method of double-workbench exposure machine | |
| CN103018591A (en) | Method for testing electrical property of high-precision circuit board | |
| CN115811838B (en) | Forming method and forming die of PCB | |
| CN111615265A (en) | Blind hole processing method of LCP multilayer board | |
| CN206542641U (en) | A kind of equipment of circuit process automatic measurement management and control harmomegathus | |
| CN102006727A (en) | Method for machining built-in slot of PCB | |
| CN110072340B (en) | Manufacturing method of same-layer dual-copper circuit board | |
| CN114900967B (en) | Cover opening processing method for rigid-flex board | |
| CN108848616B (en) | Structure for forming circuit board adhesive film and adhesive film forming method | |
| CN114007332B (en) | Processing method for multi-press-fit interlayer high-alignment printed circuit board | |
| CN116419491A (en) | Anti-soldering area exposure cost-saving processing method for PCB semi-finished product | |
| CN111405840B (en) | Method for manufacturing stepped groove for PCB (printed circuit board) embedding capacity by PCB (printed circuit board) appearance processing machine | |
| CN112873355B (en) | Touch screen OCA laminating alignment target design method | |
| CN111356305B (en) | Processing technology for forming V-CUT | |
| CN114945248B (en) | Processing technology of precise circuit board | |
| JP2001121481A (en) | Printed board cutting device | |
| CN113645767B (en) | Finger fishing process for flexible printed circuit board and flexible board area | |
| CN117858351A (en) | Circuit board and manufacturing method thereof | |
| CN118019250A (en) | ATE (automatic test equipment) type printed circuit board manufacturing method and system and printed circuit board | |
| CN119676995A (en) | POP three-dimensional stacked interconnection substrate and manufacturing method thereof | |
| CN114501804A (en) | Depth control method for back drilling of 5G precision circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |