CN115805520A - Polishing apparatus and polishing pad removing method - Google Patents
Polishing apparatus and polishing pad removing method Download PDFInfo
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- 238000005498 polishing Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000003960 organic solvent Substances 0.000 claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 description 9
- 239000003292 glue Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
5技术领域5 technical fields
本发明涉及半导体制造技术领域，尤其涉及一种抛光装置及抛光垫去除方法。The invention relates to the technical field of semiconductor manufacturing, in particular to a polishing device and a polishing pad removal method.
背景技术Background technique
0抛光设备主要由上下定盘、抛光垫以及承载盘等组成。抛光垫贴附在抛光设备的定盘上，抛光过程中使用抛光液，在上下定盘高压力高转速的加工条件下，利用抛光液中碱性添加剂刻蚀硅片表面生成硅酸盐，并通过抛光垫以及抛光液中的SiO2颗粒的摩擦作用，去除硅片表面的硅酸盐，实现硅片表面损伤层的去除，达到高平坦度的镜面状态。0 Polishing equipment is mainly composed of upper and lower fixed plates, polishing pads and carrier plates. The polishing pad is attached to the fixed plate of the polishing equipment. The polishing liquid is used in the polishing process. Under the processing conditions of high pressure and high speed of the upper and lower fixed plates, the alkaline additive in the polishing liquid is used to etch the surface of the silicon wafer to form silicate, and Through the friction of the polishing pad and the SiO2 particles in the polishing liquid, the silicate on the surface of the silicon wafer is removed, and the damaged layer on the surface of the silicon wafer is removed to achieve a mirror state with high flatness.
5抛光过程中抛光垫由于受到摩擦力的影响，会逐渐被磨损，抛光垫的厚度也会逐渐变薄。当抛光速率无法满足生产效率要求时，需要更换抛光垫。由于整个抛光过程是在高压力高转速的加工条件下进行，需要将抛光垫紧紧贴附在定盘表面，防止由于粘附力不足出现硅片破片的问题。为实现高粘附力，会使5. During the polishing process, the polishing pad will be gradually worn due to the influence of friction, and the thickness of the polishing pad will gradually become thinner. When the polishing rate cannot meet the production efficiency requirements, the polishing pad needs to be replaced. Since the entire polishing process is carried out under high-pressure and high-speed processing conditions, the polishing pad needs to be tightly attached to the surface of the fixed plate to prevent the problem of silicon wafer fragmentation due to insufficient adhesion. To achieve high adhesion, make
用高粘力的胶水，同时使用高压力将抛光垫与定盘进行贴附。但在更换抛光垫0时，由于抛光垫与定盘间的吸附力过大，造成更换抛光垫的作业时间较长，影响设备稼动率及产能。Attach the polishing pad to the platen with high-tack glue while using high pressure. However, when replacing the polishing pad 0, because the adsorption force between the polishing pad and the fixed plate is too large, it takes a long time to replace the polishing pad, which affects the equipment utilization rate and production capacity.
发明内容Contents of the invention
为了解决上述技术问题，本发明提供一种抛光装置及抛光垫去除方法，能5够方便地去除定盘表面的抛光垫。In order to solve the above technical problems, the present invention provides a polishing device and a method for removing a polishing pad, which can conveniently remove the polishing pad on the surface of the fixing plate.
为了达到上述目的，本发明实施例采用的技术方案是：In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is:
一种抛光装置，包括：A polishing device comprising:
相对设置的上抛光头和下抛光头；An upper polishing head and a lower polishing head arranged oppositely;
固定设置于所述上抛光头上的上定盘以及固定设置于所述下抛光头上的下定盘；an upper fixed plate fixed on the upper polishing head and a lower fixed plate fixed on the lower polishing head;
贴附于所述上定盘表面上的上抛光垫以及贴附于所述下定盘表面上的下抛光垫，所述上定盘内设置有第一通道，所述第一通道与所述上定盘的表面连通；所述下定盘内设置有第二通道，所述第二通道与所述下定盘的表面连通；The upper polishing pad attached to the surface of the upper fixed plate and the lower polished pad attached to the surface of the lower fixed plate, a first channel is arranged in the upper fixed plate, and the first channel is connected to the upper fixed plate. The surface of the fixed plate is connected; a second channel is arranged in the lower fixed plate, and the second channel communicates with the surface of the lower fixed plate;
溶液供给组件，分别与所述第一通道和所述第二通道连接，用于向所述第一通道和所述第二通道内通入有机溶剂。A solution supply component is connected to the first channel and the second channel respectively, and is used to feed an organic solvent into the first channel and the second channel.
一些实施例中，In some embodiments,
所述上定盘的表面设置有多个与所述第一通道连通的第一孔；The surface of the upper fixed plate is provided with a plurality of first holes communicating with the first channel;
所述下定盘的表面设置有多个与所述第二通道连通的第二孔。The surface of the lower fixed plate is provided with a plurality of second holes communicating with the second channel.
一些实施例中，多个所述第一孔阵列排布；多个所述第二孔阵列排布。In some embodiments, a plurality of the first holes are arranged in an array; a plurality of the second holes are arranged in an array.
一些实施例中，沿远离所述上抛光垫的方向，所述第一孔的孔径逐渐增大；In some embodiments, along the direction away from the upper polishing pad, the diameter of the first hole gradually increases;
沿远离所述下抛光垫的方向，所述第二孔的孔径逐渐增大。Along the direction away from the lower polishing pad, the diameter of the second hole gradually increases.
一些实施例中，所述上定盘的表面设置有多个与所述第一通道连通的第一凹槽；In some embodiments, the surface of the upper fixed plate is provided with a plurality of first grooves communicating with the first channel;
所述下定盘的表面设置有多个与所述第二通道连通的第二凹槽。The surface of the lower fixed plate is provided with a plurality of second grooves communicating with the second channel.
一些实施例中，所述第一凹槽呈网状排布；In some embodiments, the first grooves are arranged in a network;
所述第二凹槽呈网状排布。The second grooves are arranged in a net shape.
一些实施例中，所述上定盘的表面设置有呈圆环状分布的多个所述第一凹槽，多个呈圆环状的所述第一凹槽呈同心圆设置；In some embodiments, the surface of the upper fixed plate is provided with a plurality of the first grooves distributed in an annular shape, and the plurality of annular first grooves are arranged in concentric circles;
所述下定盘的表面设置有呈圆环状分布的多个所述第二凹槽，多个呈圆环状的所述第二凹槽呈同心圆设置；The surface of the lower fixing plate is provided with a plurality of the second grooves distributed in an annular shape, and the plurality of annular second grooves are arranged in concentric circles;
一些实施例中，沿远离所述上抛光垫的方向，多个所述第一凹槽的宽度逐渐增大；In some embodiments, along the direction away from the upper polishing pad, the widths of the plurality of first grooves gradually increase;
沿远离所述下抛光垫的方向，多个所述第二凹槽的宽度逐渐增大。Along a direction away from the lower polishing pad, the widths of the plurality of second grooves gradually increase.
本发明实施例还提供了一种抛光垫去除方法，应用于如上所述的抛光装置，所述方法包括：An embodiment of the present invention also provides a method for removing a polishing pad, which is applied to the above-mentioned polishing device, and the method includes:
在抛光结束后，控制所述溶液供给组件向所述第一通道和所述第二通道内通入有机溶剂。After polishing, the solution supply component is controlled to feed an organic solvent into the first channel and the second channel.
一些实施例中，向所述第一通道和所述第二通道内通入有机溶剂的压力大于0.3Mpa。In some embodiments, the pressure of introducing the organic solvent into the first channel and the second channel is greater than 0.3Mpa.
本发明的有益效果是：The beneficial effects of the present invention are:
本实施例中，在需要更换抛光垫时，利用外置压力装置可以将有机溶剂通过第一通道和第二通道通入上定盘和下定盘的表面，能够溶解定盘与抛光垫接触面的胶水，使得定盘与抛光垫接触面的粘结作用减弱或消失，进而方便地去除定盘表面的抛光垫，减少更换抛光垫的作业时间，提高作业效率，优化设备稼动率。In this embodiment, when the polishing pad needs to be replaced, the organic solvent can be passed through the first channel and the second channel into the surface of the upper fixed plate and the lower fixed plate by using an external pressure device, which can dissolve the contact surface between the fixed plate and the polishing pad. The glue weakens or disappears the bonding effect between the fixed plate and the polishing pad contact surface, and then removes the polishing pad on the surface of the fixed plate conveniently, reduces the working time of replacing the polishing pad, improves the working efficiency, and optimizes the equipment utilization rate.
附图说明Description of drawings
图1表示本发明一实施例抛光装置的结构示意图；Fig. 1 shows the structural representation of an embodiment of the polishing device of the present invention;
图2表示本发明一实施例抛光装置的平面示意图；Fig. 2 shows a schematic plan view of a polishing device according to an embodiment of the present invention;
图3表示本发明另一实施例抛光装置的结构示意图；Fig. 3 shows the structural representation of another embodiment of the polishing device of the present invention;
图4表示本发明另一实施例抛光装置的平面示意图。FIG. 4 shows a schematic plan view of another embodiment of the polishing device of the present invention.
附图标记reference sign
1抛光垫1 polishing pad
2定盘2 fixed offer
3溶剂通道3 solvent channels
4孔4 holes
5凹槽5 grooves
具体实施方式Detailed ways
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本发明保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.
在本发明的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.
现有技术中，抛光垫与定盘间的粘附力过大，造成人员更换抛光垫的作业时间较长，影响设备稼动率及产能。In the prior art, the adhesive force between the polishing pad and the fixed disk is too large, resulting in a long working time for personnel to replace the polishing pad, which affects the utilization rate and production capacity of the equipment.
为了解决上述技术问题，本发明提供一种抛光装置及抛光垫去除方法，能够方便地去除定盘表面的抛光垫。In order to solve the above technical problems, the present invention provides a polishing device and a polishing pad removal method, which can conveniently remove the polishing pad on the surface of the fixing plate.
本发明实施例提供一种抛光装置，包括：An embodiment of the present invention provides a polishing device, comprising:
相对设置的上抛光头和下抛光头；An upper polishing head and a lower polishing head arranged oppositely;
固定设置于所述上抛光头上的上定盘以及固定设置于所述下抛光头上的下定盘；an upper fixed plate fixed on the upper polishing head and a lower fixed plate fixed on the lower polishing head;
贴附于所述上定盘表面上的上抛光垫以及贴附于所述下定盘表面上的下抛光垫，所述上定盘内设置有第一通道，所述第一通道与所述上定盘的表面连通；所述下定盘内设置有第二通道，所述第二通道与所述下定盘的表面连通；The upper polishing pad attached to the surface of the upper fixed plate and the lower polished pad attached to the surface of the lower fixed plate, a first channel is arranged in the upper fixed plate, and the first channel is connected to the upper fixed plate. The surface of the fixed plate is connected; a second channel is arranged in the lower fixed plate, and the second channel communicates with the surface of the lower fixed plate;
溶液供给组件，分别与所述第一通道和所述第二通道连接，用于向所述第一通道和所述第二通道内通入有机溶剂。A solution supply component is connected to the first channel and the second channel respectively, and is used to feed an organic solvent into the first channel and the second channel.
本实施例中，在需要更换抛光垫时，利用外置压力装置可以将有机溶剂通过第一通道和第二通道通入上定盘和下定盘的表面，能够溶解定盘与抛光垫接触面的胶水，使得定盘与抛光垫接触面的粘结作用减弱或消失，进而方便地去除定盘表面的抛光垫，减少更换抛光垫的作业时间，提高作业效率，优化设备稼动率。In this embodiment, when the polishing pad needs to be replaced, the organic solvent can be passed through the first channel and the second channel into the surface of the upper fixed plate and the lower fixed plate by using an external pressure device, which can dissolve the contact surface between the fixed plate and the polishing pad. The glue weakens or disappears the bonding effect between the fixed plate and the polishing pad contact surface, and then removes the polishing pad on the surface of the fixed plate conveniently, reduces the working time of replacing the polishing pad, improves the working efficiency, and optimizes the equipment utilization rate.
其中，有机溶剂可以包括异丙醇溶液、丙酮溶液等。Wherein, the organic solvent may include isopropanol solution, acetone solution and the like.
一些实施例中，所述上定盘的表面设置有多个与所述第一通道连通的第一孔；In some embodiments, the surface of the upper fixed plate is provided with a plurality of first holes communicating with the first channel;
所述下定盘的表面设置有多个与所述第二通道连通的第二孔。The surface of the lower fixed plate is provided with a plurality of second holes communicating with the second channel.
通过第一孔可以将第一通道内的有机溶剂导入到上定盘的表面，与上抛光垫接触，可以溶解上定盘与上抛光垫接触面的胶水；通过第二孔可以将第二通道内的有机溶剂导入到下定盘的表面，可以溶解下定盘与下抛光垫接触面的胶水。Through the first hole, the organic solvent in the first channel can be introduced to the surface of the upper plate, and in contact with the upper polishing pad, the glue on the contact surface between the upper plate and the upper polishing pad can be dissolved; through the second hole, the second channel can be The organic solvent inside is introduced to the surface of the lower fixed plate, which can dissolve the glue on the contact surface between the lower fixed plate and the lower polishing pad.
一些实施例中，多个所述第一孔阵列排布；多个所述第二孔阵列排布。这样可以将有机溶剂导入到定盘表面的各个位置。In some embodiments, a plurality of the first holes are arranged in an array; a plurality of the second holes are arranged in an array. This allows the organic solvent to be introduced to various locations on the surface of the plate.
一些实施例中，沿远离所述上抛光垫的方向，所述第一孔的孔径逐渐增大；In some embodiments, along the direction away from the upper polishing pad, the diameter of the first hole gradually increases;
沿远离所述下抛光垫的方向，所述第二孔的孔径逐渐增大。Along the direction away from the lower polishing pad, the diameter of the second hole gradually increases.
沿远离所述上抛光垫的方向，所述第一孔的孔径逐渐增大，这样可以使得有机溶剂的导入压强增大，有效地将有机溶剂导入上抛光垫与上定盘的接触面；沿远离所述下抛光垫的方向，所述第二孔的孔径逐渐增大，这样可以使得有机溶剂的导入压强增大，有效地将有机溶剂导入下抛光垫与下定盘的接触面。Along the direction away from the upper polishing pad, the aperture of the first hole gradually increases, so that the introduction pressure of the organic solvent can be increased, and the organic solvent can be effectively introduced into the contact surface between the upper polishing pad and the upper fixed plate; In the direction away from the lower polishing pad, the aperture of the second hole gradually increases, which can increase the introduction pressure of the organic solvent, and effectively introduce the organic solvent into the contact surface between the lower polishing pad and the lower fixing plate.
一具体示例中，如图1和图2所示，定盘2表面上设置有多个孔4，多个孔4阵列排布，孔4与定盘2内部的溶剂通道3连通，有机溶剂可以通过溶剂通道3导入孔4。其中，定盘2可以为上定盘或下定盘，定盘2为上定盘时，孔4为第一孔，抛光垫1为上抛光垫，溶剂通道3为第一通道；定盘2为下定盘时，孔4为第二孔，抛光垫1为下抛光垫，溶剂通道3为第二通道。In a specific example, as shown in Figure 1 and Figure 2, a plurality of
一些实施例中，所述上定盘的表面设置有多个与所述第一通道连通的第一凹槽；In some embodiments, the surface of the upper fixed plate is provided with a plurality of first grooves communicating with the first channel;
所述下定盘的表面设置有多个与所述第二通道连通的第二凹槽。The surface of the lower fixed plate is provided with a plurality of second grooves communicating with the second channel.
一些实施例中，所述第一凹槽可以呈网状排布；所述第二凹槽可以呈网状排布。这样可以将有机溶剂导入到定盘表面的各个位置。In some embodiments, the first grooves may be arranged in a network; the second grooves may be arranged in a network. This allows the organic solvent to be introduced to various locations on the surface of the plate.
一些实施例中，所述上定盘的表面设置有呈圆环状分布的多个所述第一凹槽，多个呈圆环状的所述第一凹槽呈同心圆设置；In some embodiments, the surface of the upper fixed plate is provided with a plurality of the first grooves distributed in an annular shape, and the plurality of annular first grooves are arranged in concentric circles;
所述下定盘的表面设置有呈圆环状分布的多个所述第二凹槽，多个呈圆环状的所述第二凹槽呈同心圆设置；The surface of the lower fixing plate is provided with a plurality of the second grooves distributed in an annular shape, and the plurality of annular second grooves are arranged in concentric circles;
一些实施例中，沿远离所述上抛光垫的方向，多个所述第一凹槽的宽度逐渐增大；In some embodiments, along the direction away from the upper polishing pad, the widths of the plurality of first grooves gradually increase;
沿远离所述下抛光垫的方向，多个所述第二凹槽的宽度逐渐增大。Along a direction away from the lower polishing pad, the widths of the plurality of second grooves gradually increase.
沿远离所述上抛光垫的方向，所述第一凹槽的宽度逐渐增大，这样可以使得有机溶剂的导入压强增大，有效地将有机溶剂导入上抛光垫与上定盘的接触面；沿远离所述下抛光垫的方向，所述第二凹槽的宽度逐渐增大，这样可以使得有机溶剂的导入压强增大，有效地将有机溶剂导入下抛光垫与下定盘的接触面。Along the direction away from the upper polishing pad, the width of the first groove gradually increases, so that the introduction pressure of the organic solvent can be increased, and the organic solvent can be effectively introduced into the contact surface between the upper polishing pad and the upper fixed plate; Along the direction away from the lower polishing pad, the width of the second groove gradually increases, which can increase the introduction pressure of the organic solvent and effectively introduce the organic solvent into the contact surface of the lower polishing pad and the lower platen.
一具体示例中，如图3和图4所示，定盘2表面上设置有多个凹槽5和孔4，多个孔4阵列排布，孔4与定盘2内部的溶剂通道3连通，有机溶剂可以通过溶剂通道3导入孔4，进而导入凹槽5。其中，定盘2可以为上定盘或下定盘，定盘2为上定盘时，凹槽5为第一凹槽，抛光垫1为上抛光垫，溶剂通道3为第一通道；定盘2为下定盘时，凹槽5为第二凹槽，抛光垫1为下抛光垫，溶剂通道3为第二通道。In a specific example, as shown in Figure 3 and Figure 4, a plurality of
本发明实施例还提供了一种抛光垫去除方法，应用于如上所述的抛光装置，所述方法包括：An embodiment of the present invention also provides a method for removing a polishing pad, which is applied to the above-mentioned polishing device, and the method includes:
在抛光结束后，控制所述溶液供给组件向所述第一通道和所述第二通道内通入有机溶剂。After polishing, the solution supply component is controlled to feed an organic solvent into the first channel and the second channel.
本实施例中，在需要更换抛光垫时，利用外置压力装置可以将有机溶剂通过第一通道和第二通道通入上定盘和下定盘的表面，能够溶解定盘与抛光垫接触面的胶水，使得定盘与抛光垫接触面的粘结作用减弱或消失，进而方便地去除定盘表面的抛光垫，减少更换抛光垫的作业时间，提高作业效率，优化设备稼动率。In this embodiment, when the polishing pad needs to be replaced, the organic solvent can be passed through the first channel and the second channel into the surface of the upper fixed plate and the lower fixed plate by using an external pressure device, which can dissolve the contact surface between the fixed plate and the polishing pad. The glue weakens or disappears the bonding effect between the fixed plate and the polishing pad contact surface, and then removes the polishing pad on the surface of the fixed plate conveniently, reduces the working time of replacing the polishing pad, improves the working efficiency, and optimizes the equipment utilization rate.
一些实施例中，向所述第一通道和所述第二通道内通入有机溶剂的压力为大于0.3Mpa，比如可以为0.4Mpa、0.5Mpa、0.6Mpa或0.7Mpa，这样可以提供足够的压力，使得有机溶剂从所述第一通道和所述第二通道进入到定盘与抛光垫的接触面。In some embodiments, the pressure of introducing the organic solvent into the first channel and the second channel is greater than 0.3Mpa, such as 0.4Mpa, 0.5Mpa, 0.6Mpa or 0.7Mpa, which can provide sufficient pressure , so that the organic solvent enters the contact surface between the fixed disk and the polishing pad from the first channel and the second channel.
需要说明，本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于实施例而言，由于其基本相似于产品实施例，所以描述得比较简单，相关之处参见产品实施例的部分说明即可。It should be noted that each embodiment in this specification is described in a progressive manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, as for the embodiment, since it is basically similar to the product embodiment, the description is relatively simple, and for related parts, please refer to the description of the product embodiment.
在上述实施方式的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。The above is only a specific implementation of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope of the present disclosure. should fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be determined by the protection scope of the claims.
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