[go: up one dir, main page]

CN115775677A - High-performance and high-quality integrated inductance element and production process thereof - Google Patents

High-performance and high-quality integrated inductance element and production process thereof Download PDF

Info

Publication number
CN115775677A
CN115775677A CN202211613235.9A CN202211613235A CN115775677A CN 115775677 A CN115775677 A CN 115775677A CN 202211613235 A CN202211613235 A CN 202211613235A CN 115775677 A CN115775677 A CN 115775677A
Authority
CN
China
Prior art keywords
soft magnetic
coil
lead pin
inductance element
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211613235.9A
Other languages
Chinese (zh)
Inventor
汪彩霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northern Hemisphere Technology Suzhou Co ltd
Original Assignee
Northern Hemisphere Technology Suzhou Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Hemisphere Technology Suzhou Co ltd filed Critical Northern Hemisphere Technology Suzhou Co ltd
Priority to CN202211613235.9A priority Critical patent/CN115775677A/en
Publication of CN115775677A publication Critical patent/CN115775677A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Coils Or Transformers For Communication (AREA)

Abstract

The invention discloses a high-performance high-quality integrated inductance element and a production process thereof, and the high-performance high-quality integrated inductance element comprises two groups of inductance element parts, wherein each group of inductance element parts comprises a soft magnetic cladding body upper assembly and a soft magnetic cladding body lower assembly; the soft magnetic coating body upper assembly comprises a soft magnetic coating body base and a coil, the coil is installed on the soft magnetic coating body base, the coil is provided with a first lead pin and a second lead pin, the soft magnetic coating body base comprises a base plate, the middle of the top surface of the base plate is provided with a limiting groove, one end of the limiting groove is provided with a limiting opening, and the center of the bottom surface of the limiting groove is provided with an installation column; the soft magnetic cladding lower assembly comprises a soft magnetic cladding cover plate and an insulating isolation plate; by adopting the structure, the short circuit and the cracking damage of the element caused by coil package damage and displacement due to non-protection positioning pressing can be reduced, the inductance and the saturation temperature rise performance of the formed inductance element are improved, and the reliability and the performance of the formed inductance element are improved.

Description

一种高性能高品质一体电感元件及其生产工艺A high-performance and high-quality integrated inductance element and its production process

技术领域technical field

本发明涉及电子元器件技术领域,具体涉及一种高性能高品质一体电感元件及其生产工艺。The invention relates to the technical field of electronic components, in particular to a high-performance and high-quality integrated inductance component and a production process thereof.

背景技术Background technique

电感元件的原始模型为导线绕成圆柱线圈,当线圈中通以电流i,在线圈中就会产生磁通量Φ,并储存能量,电感元件的电磁感应分为自感应和互感应,自身磁场在线圈内产生磁通量变化导致的电磁感应现象,称为“自感应”现象;外部磁场在线圈里磁通量变化产生的电磁感应现象,称为“互感应”现象。The original model of the inductance element is a wire wound into a cylindrical coil. When the current i is passed through the coil, a magnetic flux Φ will be generated in the coil and energy will be stored. The electromagnetic induction of the inductance element is divided into self-induction and mutual induction. The self-magnetic field in the coil The electromagnetic induction phenomenon caused by the change of magnetic flux inside the coil is called "self-induction" phenomenon; the electromagnetic induction phenomenon caused by the change of magnetic flux in the external magnetic field in the coil is called "mutual induction" phenomenon.

但是现有的电感元件中,安装线圈时无防护定位压制,导致线圈位置偏移,进而造成两侧壁厚不均匀,产生单侧壁厚偏小的问题,壁厚变小则结构强度就会变差,所以导致开裂,造成线圈的线包损伤、跑位造成的元件短路导致电感元件破损不良,对于电感元件产品的质量和使用寿命有很大的考验,生产出来的电感元件品质不足,缺乏在市场上同类产品的竞争力。However, in the existing inductive components, there is no protective positioning and pressing when installing the coil, which causes the position of the coil to shift, which in turn causes uneven wall thickness on both sides, resulting in the problem that the wall thickness on one side is too small, and the structural strength will decrease when the wall thickness becomes smaller. Deterioration, so it leads to cracking, damage to the wire package of the coil, short circuit of the components caused by displacement, and poor damage to the inductance components. This has a great test for the quality and service life of the inductance components. Competitiveness of similar products in the market.

发明内容Contents of the invention

为了克服上述的技术问题,本发明的目的在于提供一种高性能高品质一体电感元件及其生产工艺。In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide a high-performance and high-quality integrated inductance element and its production process.

本发明的目的可以通过以下技术方案实现:The purpose of the present invention can be achieved through the following technical solutions:

一种高性能高品质一体电感元件,包括两组电感单元件,两组电感单元件对称分布,每组电感单元件均包括软磁包覆体上组件和软磁包覆体下组件;A high-performance and high-quality integrated inductance element, including two sets of inductance unit elements, the two sets of inductance unit elements are symmetrically distributed, and each set of inductance unit elements includes an upper component of a soft magnetic coating and a lower component of a soft magnetic coating;

其中所述软磁包覆体上组件包括软磁包覆体底座和线圈,所述线圈安装在软磁包覆体底座上,所述线圈设置有第一引线脚和第二引线脚,所述软磁包覆体底座包括底座板,所述底座板顶面中部开设有限位槽,且限位槽一端设置有限位开口,限位槽底面中心设置有安装柱;Wherein the upper component of the soft magnetic covering body includes a base of the soft magnetic covering body and a coil, the coil is installed on the base of the soft magnetic covering body, the coil is provided with a first lead pin and a second lead pin, the The base of the soft magnetic covering body includes a base plate, a limiting groove is provided in the middle of the top surface of the base plate, and a limiting opening is arranged at one end of the limiting groove, and a mounting column is arranged at the center of the bottom surface of the limiting groove;

所述软磁包覆体下组件包括软磁包覆体盖板和绝缘隔离板,所述绝缘隔离板位于软磁包覆体盖板顶面。The lower assembly of the soft magnetic enclosure includes a cover plate of the soft magnetic enclosure and an insulation isolation plate, and the insulation isolation plate is located on the top surface of the cover plate of the soft magnetic enclosure.

作为本发明进一步的方案:所述安装柱的高度高于线圈高度。As a further solution of the present invention: the height of the mounting column is higher than that of the coil.

作为本发明进一步的方案:所述安装柱的高度等于线圈高度。As a further solution of the present invention: the height of the mounting column is equal to the height of the coil.

作为本发明进一步的方案:所述安装柱的高度小于线圈高度。As a further solution of the present invention: the height of the mounting column is smaller than the height of the coil.

作为本发明进一步的方案:软磁包覆体盖板与绝缘隔离板是一体成型。As a further solution of the present invention: the cover plate of the soft magnetic covering body and the insulation isolation plate are integrally formed.

作为本发明进一步的方案:软磁包覆体盖板与绝缘隔离板是分开成型。As a further solution of the present invention: the cover plate of the soft magnetic covering body and the insulation isolation plate are formed separately.

作为本发明进一步的方案:所述软磁包覆体底座和软磁包覆体盖板均采用软磁粉体制成。As a further solution of the present invention: the base of the soft magnetic covering body and the cover plate of the soft magnetic covering body are both made of soft magnetic powder.

作为本发明进一步的方案:一种高性能高品质一体电感元件的生产工艺,包括以下步骤:As a further solution of the present invention: a production process of a high-performance and high-quality integrated inductance element, comprising the following steps:

步骤一;将线圈套入软磁包覆体底座的安装柱上,并置于限位槽中,之后将第一引线脚和第二引线脚进行弯折,并将限位开口与第一引线脚对应限位,得到软磁包覆体上组件;Step 1: Put the coil on the mounting column of the base of the soft magnetic covering body, and place it in the limit slot, then bend the first lead pin and the second lead pin, and connect the limit opening with the first lead wire The feet correspond to the limit, and the upper component of the soft magnetic covering is obtained;

步骤二;在挤压模具中放入一个软磁包覆体上组件,之后将一个预制好的软磁包覆体下组件正置的放入挤压模具中;Step 2: Put an upper assembly of the soft magnetic covering body in the extrusion mold, and then put a prefabricated lower assembly of the soft magnetic covering body upright into the extrusion mold;

步骤三;在挤压模具中再次放入一个倒置的预制好的软磁包覆体下组件,之后放入一个倒置的软磁包覆体上组件,其中两个第一引线脚和第二引线脚的朝向位于同一侧;Step 3: Put an inverted prefabricated soft magnetic covering body lower assembly again in the extrusion mold, and then put an inverted soft magnetic covering body upper assembly, wherein the two first lead pins and the second lead The feet are facing on the same side;

步骤四;进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚和第二引线脚进行电镀镀锡,得到成品的电感元件。Step 4: Extruding to obtain a semi-finished inductance element, taking out the semi-finished inductance element, and electroplating and tinning the exposed first and second lead pins to obtain a finished inductance element.

本发明的有益效果:Beneficial effects of the present invention:

1、本发明通过预先成型软磁包覆体底座,设置安装柱,保证在安装线圈是时进行定位防护,在压制的时候使线圈被安装柱固定,保证压制的过程中线圈位置的稳定性,降低因无防护定位压制造成的线圈线包损伤、跑位造成的元件短路、开裂破损不良。1. The present invention preforms the base of the soft magnetic coating body and sets the installation column to ensure the positioning protection when the coil is installed, and the coil is fixed by the installation column during pressing to ensure the stability of the coil position during the pressing process. Reduce coil package damage caused by unprotected positioning and pressing, component short circuit, cracking and damage caused by displacement.

2、本发明进一步缩小成品电感元件的外形尺寸,尤其是厚度缩小了3mm,制成的小型一体电感元件给小型电路板搭载连接更多元件提供了更好的空间利用前提条件,同时减少制造所需原材料铁粉、铜材、锡的损耗。2. The present invention further reduces the external dimension of the finished inductive element, especially the thickness is reduced by 3mm, and the small integrated inductive element made provides better space utilization preconditions for the small circuit board to carry and connect more elements, while reducing the manufacturing cost. The loss of raw materials such as iron powder, copper, and tin is required.

3、本发明的电感元件制成结构实现了一体电感元件的小型化的同时,提升一体电感元件感量约14%、饱和性能10%和DCR特性50%,进一步提高了成型电感元件的可靠性与性能。3. The structure of the inductance element of the present invention realizes the miniaturization of the integrated inductance element, and at the same time improves the inductance of the integral inductance element by about 14%, the saturation performance by 10% and the DCR characteristic by 50%, and further improves the reliability of the formed inductance element with performance.

附图说明Description of drawings

下面结合附图对本发明作进一步的说明。The present invention will be further described below in conjunction with the accompanying drawings.

图1是本发明成品电感元件结构示意图;Fig. 1 is the structural representation of finished product inductance element of the present invention;

图2是本发明中线圈结构示意图;Fig. 2 is a schematic diagram of a coil structure in the present invention;

图3是本发明实施例一中软磁包覆体底座整体结构示意图;Fig. 3 is a schematic diagram of the overall structure of the base of the soft magnetic coating in Embodiment 1 of the present invention;

图4是本发明实施例一中软磁包覆体下组件整体结构示意图;Fig. 4 is a schematic diagram of the overall structure of the lower component of the soft magnetic coating in Embodiment 1 of the present invention;

图5是本发明实施例一中软磁包覆体上组件整体结构示意图;Fig. 5 is a schematic diagram of the overall structure of the upper assembly of the soft magnetic coating in Embodiment 1 of the present invention;

图6是本发明实施例一生产工艺挤压位置示意图;Fig. 6 is a schematic diagram of the extrusion position of the production process of Embodiment 1 of the present invention;

图7是本发明实施例二中软磁包覆体底座整体结构示意图;Fig. 7 is a schematic diagram of the overall structure of the base of the soft magnetic covering body in Embodiment 2 of the present invention;

图8是本发明实施例二中软磁包覆体下组件整体结构示意图;Fig. 8 is a schematic diagram of the overall structure of the lower assembly of the soft magnetic coating in Embodiment 2 of the present invention;

图9是本发明实施例二中软磁包覆体上组件整体结构示意图;Fig. 9 is a schematic diagram of the overall structure of the upper assembly of the soft magnetic coating in the second embodiment of the present invention;

图10是本发明实施例二生产工艺挤压位置示意图;Fig. 10 is a schematic diagram of the extrusion position of the production process of Example 2 of the present invention;

图11是本发明实施例二中软磁包覆体盖体结构变形示意图一;Fig. 11 is a schematic diagram of deformation of the cover body of the soft magnetic coating in the second embodiment of the present invention;

图12是本发明实施例二中软磁包覆体底座结构变形示意图一;Fig. 12 is a schematic diagram of deformation of the base of the soft magnetic covering body in Embodiment 2 of the present invention;

图13是本发明实施例二中软磁包覆体盖体结构变形示意图二;Fig. 13 is the second schematic diagram of the deformation of the soft magnetic covering body cover structure in the second embodiment of the present invention;

图14是本发明实施例二中软磁包覆体底座结构变形示意图二;Fig. 14 is the second schematic diagram of the deformation of the base of the soft magnetic coating in the second embodiment of the present invention;

图15是本发明实施例二中软磁包覆体盖体结构变形示意图三;Fig. 15 is the third schematic diagram of the structural deformation of the soft magnetic covering body cover in the second embodiment of the present invention;

图16是本发明实施例二中软磁包覆体底座结构变形示意图三;Fig. 16 is the third schematic diagram of the structural deformation of the base of the soft magnetic coating in the second embodiment of the present invention;

图17是本发明实施例二中软磁包覆体盖体结构变形示意图四;Fig. 17 is a fourth schematic diagram of the structural deformation of the soft magnetic covering body cover in the second embodiment of the present invention;

图18是本发明实施例二中软磁包覆体底座结构变形示意图四;Fig. 18 is a fourth schematic diagram of the structural deformation of the base of the soft magnetic coating in the second embodiment of the present invention;

图19是本发明实施例二中软磁包覆体底座结构变形示意图五。Fig. 19 is a fifth schematic diagram of the deformation of the base structure of the soft magnetic covering body in the second embodiment of the present invention.

图中:1、线圈;101、第一引线脚;102、第二引线脚;2、软磁包覆体底座;21、安装柱;22、底座板;23、限位槽;24、限位开口;202、底平板;203、第一凹槽;204、第二凹槽;3、软磁包覆体下组件;30、软磁包覆体盖板;31、软磁包覆体盖体;311、放置凹槽;312、定位开口;32、绝缘隔离板;4、软磁包覆体上组件;5、电感单元件。In the figure: 1, coil; 101, first lead pin; 102, second lead pin; 2, soft magnetic coating body base; 21, mounting column; 22, base plate; 23, limit slot; 24, limit Opening; 202, the bottom plate; 203, the first groove; 204, the second groove; 3, the lower component of the soft magnetic coating; 30, the cover plate of the soft magnetic coating; 31, the cover of the soft magnetic coating ; 311 , placement groove; 312 , positioning opening; 32 , insulating isolation plate; 4 , soft magnetic cladding upper assembly; 5 , inductance unit.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

实施例一:Embodiment one:

如图1-图6所示,一种高性能高品质一体电感元件,包括两组电感单元件5,两组电感单元件5关于结合面对称分布,每组电感单元件5均包括软磁包覆体上组件4和软磁包覆体下组件3,通过对应的软磁包覆体上组件4和软磁包覆体下组件3进行装配形成电感单元件5,再将两组电感单元件5放置在挤压模具中压制成一体,形成该电感元件。As shown in Figures 1 to 6, a high-performance and high-quality integrated inductance element includes two sets of inductance unit elements 5, and the two sets of inductance unit elements 5 are symmetrically distributed about the bonding surface, and each set of inductance unit elements 5 includes a soft magnetic The upper assembly 4 of the covering body and the lower assembly 3 of the soft magnetic covering body are assembled through the corresponding upper assembly 4 of the soft magnetic covering body and the lower assembly 3 of the soft magnetic covering body to form an inductance unit element 5, and then the two groups of inductance units Part 5 is placed in an extrusion die and pressed into one body to form the inductance element.

进一步的如图2、图3和图5所示,软磁包覆体上组件4包括软磁包覆体底座2和线圈1,该线圈1安装在软磁包覆体底座2上,其中线圈1设置有第一引线脚101和第二引线脚102,上述的软磁包覆体底座2包括有底座板22,在底座板22的顶面中部开设有限位槽23,且限位槽23一端设置为弧形,一端为矩形,在矩形面的一端开设有限位开口24,用于对安装上的第一引线脚101或第二引线脚102进行定位,且限制位置,便于后续的压制,进一步的限位槽23底面中心设置有安装柱21,用于装配定位,且安装住21的形状包括但不限于圆形和椭圆形,所述软磁包覆体上组件4由线圈1和软磁包覆体底座2装配形成,其中线圈1安装过程中需要二次折弯第一引线脚101和第二引线脚102,第一次折弯使得第一引线脚101和第二引线脚102弯折到对应的底座板22侧面,第二次折弯将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合。Further as shown in Fig. 2, Fig. 3 and Fig. 5, the upper assembly 4 of the soft magnetic covering body includes a soft magnetic covering body base 2 and a coil 1, and the coil 1 is installed on the soft magnetic covering body base 2, wherein the coil 1. The first lead pin 101 and the second lead pin 102 are provided. The above-mentioned soft magnetic covering body base 2 includes a base plate 22, and a limiting groove 23 is opened in the middle of the top surface of the base plate 22, and one end of the limiting groove 23 It is arranged in an arc shape, and one end is rectangular, and a limited opening 24 is opened at one end of the rectangular surface, which is used to position the first lead pin 101 or the second lead pin 102 on the installation, and limit the position to facilitate subsequent pressing, further The center of the bottom surface of the limiting groove 23 is provided with a mounting column 21 for assembly and positioning, and the shape of the mounting 21 includes but is not limited to a circle and an ellipse. The cover body base 2 is assembled and formed, wherein the first lead pin 101 and the second lead pin 102 need to be bent twice during the installation process of the coil 1, and the first bend makes the first lead pin 101 and the second lead pin 102 bend To the corresponding side of the base plate 22 , the second bending bends the first lead pin 101 and the second lead pin 102 to the bottom surface of the base plate 22 and closely adheres to the bottom surface of the base plate 22 .

更进一步的如图3中的安装柱21的高度可以是高于线圈1高度、等于线圈1高度或低于线圈1的高度,多种尺寸均可。Furthermore, as shown in Figure 3, the height of the mounting column 21 can be higher than the height of the coil 1, equal to the height of the coil 1 or lower than the height of the coil 1, and various sizes are available.

进一步如图4所示,软磁包覆体下组件3包括软磁包覆体盖板30和绝缘隔离板32,其中软磁包覆体盖板30为平板,便于配合软磁包覆体上组件4对线圈1密封,其中绝缘隔离板32位于软磁包覆体盖板30顶面;其中需要注意的是,软磁包覆体盖板30与绝缘隔离板32是可以一体成型或分开成型,最终形成电感元件的时候,按顺序进行放置挤压即可,进一步的两组软磁包覆体下组件3也可以一体成型或分开成型。As further shown in FIG. 4 , the lower assembly 3 of the soft magnetic coating includes a soft magnetic coating cover plate 30 and an insulating isolation plate 32, wherein the soft magnetic coating cover plate 30 is a flat plate, which is convenient to fit on the soft magnetic coating. The assembly 4 seals the coil 1, wherein the insulating isolation plate 32 is located on the top surface of the soft magnetic covering body cover plate 30; it should be noted that the soft magnetic covering body cover plate 30 and the insulating insulating plate 32 can be formed integrally or separately , when the inductance element is finally formed, it only needs to be placed and squeezed in order, and the further two sets of soft magnetic coating lower components 3 can also be integrally formed or separately formed.

更进一步的软磁包覆体底座2和软磁包覆体盖板30均采用软磁粉体制成,常用的软磁材料有铁氧体,铁粉芯,非晶态合金等,能够随着加压变形,上述的绝缘隔离板32材料为陶瓷、高分子、纳米和绝缘包覆后的金属颗粒材料。Further, the soft magnetic covering body base 2 and the soft magnetic covering body cover plate 30 are all made of soft magnetic powder. Commonly used soft magnetic materials include ferrite, iron powder core, amorphous alloy, etc. Compression deformation, the material of the above-mentioned insulation and isolation plate 32 is ceramic, polymer, nanometer and metal particle material after insulation coating.

进一步的上述软磁包覆体盖板30和绝缘隔离板32在预制过程中可以是进行填粉预制,也可以进行切块预制。Further, in the prefabrication process of the above-mentioned soft magnetic cladding cover plate 30 and insulating spacer plate 32 , powder filling prefabrication can also be carried out, and cutting prefabrication can also be carried out.

进一步的该高性能高品质一体电感元件的生产工艺包括以下几个方案:The further production process of the high-performance and high-quality integrated inductive element includes the following schemes:

方案一:Option One:

步骤A1:将线圈1套入软磁包覆体底座2的安装柱21上,并置于限位槽23中,之后将第一引线脚101和第二引线脚102进行弯折,其中将限位开口24与第一引线脚101对应限位,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到底座板22开设有限位开口24的一侧,第二次弯折将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合,得到软磁包覆体上组件4;Step A1: Put the coil 1 on the mounting column 21 of the base 2 of the soft magnetic covering body, and place it in the limiting groove 23, and then bend the first lead pin 101 and the second lead pin 102, wherein the limit The position opening 24 is corresponding to the first lead pin 101, and the number of times of bending is two times. The first bend bends the first lead pin 101 and the second lead pin 102 to one side of the base plate 22 where the limit opening 24 is opened. side, bend the first lead pin 101 and the second lead pin 102 to the bottom surface of the base plate 22 for the second bending, and closely adhere to the bottom surface of the base plate 22 to obtain the upper assembly 4 of the soft magnetic coating;

步骤A2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体下组件3(其中软磁包覆体盖板30与绝缘隔离板32是一体成型)正置的放入挤压模具中;Step A2: Put a soft magnetic covering body upper assembly 4 in the extrusion die, and then place a prefabricated soft magnetic covering body lower assembly 3 (wherein the soft magnetic covering body cover plate 30 and the insulation isolation plate 32 are Integral molding) put into the extrusion mold upright;

步骤A3:在挤压模具中再次放入一个倒置的预制好的软磁包覆体下组件3(其中软磁包覆体盖板30与绝缘隔离板32是一体成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step A3: Put an inverted prefabricated soft magnetic cladding lower assembly 3 again in the extrusion mold (wherein the soft magnetic cladding cover plate 30 and the insulation isolation plate 32 are integrally formed), and then put an inverted The upper assembly 4 of the soft magnetic coating, wherein the orientation of the two first lead pins 101 and the second lead pins 102 is on the same side;

步骤A4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step A4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed first lead pin 101 and second lead pin 102 to obtain a finished inductance element (wherein the size of the tin plating based on the longer lead pin).

方案二:Option II:

步骤B1:将线圈1套入软磁包覆体底座2的安装柱21上,并置于限位槽23中,之后将第一引线脚101和第二引线脚102进行弯折,其中将限位开口24与第一引线脚101对应限位,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到底座板22开设有限位开口24的一侧,第二次弯折将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合,得到软磁包覆体上组件4;Step B1: Put the coil 1 on the mounting column 21 of the base 2 of the soft magnetic covering body, and place it in the limiting groove 23, and then bend the first lead pin 101 and the second lead pin 102, wherein the limit The position opening 24 is corresponding to the first lead pin 101, and the number of times of bending is two times. The first bend bends the first lead pin 101 and the second lead pin 102 to one side of the base plate 22 where the limit opening 24 is opened. side, bend the first lead pin 101 and the second lead pin 102 to the bottom surface of the base plate 22 for the second bending, and closely adhere to the bottom surface of the base plate 22 to obtain the upper assembly 4 of the soft magnetic coating;

步骤B2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体下组件组合体(其中软磁包覆体下组件组合体是由两个软磁包覆体下组件3预先一体压制而成)倒置放入挤压模具中;Step B2: Put a soft magnetic coating upper assembly 4 in the extrusion die, then put a prefabricated soft magnetic coating lower assembly (wherein the soft magnetic coating lower assembly is composed of two The lower component 3 of the soft magnetic coating is pre-pressed in one piece) and placed upside down into the extrusion mold;

步骤B3:在挤压模具中再次放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step B3: Putting an upside-down soft magnetic covering upper assembly 4 in the extrusion mold again, wherein the orientation of the two first lead pins 101 and the second lead pins 102 is on the same side;

步骤B4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step B4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed first lead pin 101 and second lead pin 102 to obtain a finished inductance element (wherein the size of the tin plating based on the longer lead pin).

方案三:third solution:

步骤C1:将线圈1套入软磁包覆体底座2的安装柱21上,并置于限位槽23中,之后将第一引线脚101和第二引线脚102进行弯折,其中将限位开口24与第一引线脚101对应限位,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到底座板22开设有限位开口24的一侧,第二次弯折将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合,得到软磁包覆体上组件4;Step C1: Put the coil 1 on the mounting column 21 of the base 2 of the soft magnetic covering body, and place it in the limiting groove 23, and then bend the first lead pin 101 and the second lead pin 102, wherein the limit The position opening 24 is corresponding to the first lead pin 101, and the number of times of bending is two times. The first bend bends the first lead pin 101 and the second lead pin 102 to one side of the base plate 22 where the limit opening 24 is opened. side, bend the first lead pin 101 and the second lead pin 102 to the bottom surface of the base plate 22 for the second bending, and closely adhere to the bottom surface of the base plate 22 to obtain the upper assembly 4 of the soft magnetic coating;

步骤C2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体盖板30(其中软磁包覆体盖板30与绝缘隔离板32是分开成型)倒置放入挤压模具中;Step C2: Put a soft magnetic covering body upper assembly 4 in the extrusion die, and then place a prefabricated soft magnetic covering body cover plate 30 (wherein the soft magnetic covering body cover plate 30 and the insulating isolation plate 32 are separate molding) and put it upside down into the extrusion die;

步骤C3:在挤压模具中放入两块预制好的绝缘隔离板32,之后再次放入一个正放的预先制成的软磁包覆体盖板30(其中软磁包覆体盖板30与绝缘隔离板32是分开成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step C3: Put two prefabricated insulating spacers 32 in the extrusion die, and then put in a prefabricated soft magnetic covering body cover plate 30 (wherein the soft magnetic covering body cover plate 30 It is molded separately from the insulating spacer plate 32), and then put into an upside-down soft magnetic covering body assembly 4, wherein the direction of the two first lead pins 101 and the second lead pin 102 is on the same side;

步骤C4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step C4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed first lead pin 101 and second lead pin 102 to obtain a finished inductance element (wherein the size of the tin plating based on the longer lead pin).

实施例二:Embodiment two:

与实施例一相比,本实施例区别在于,如图7-图10所示,所述软磁包覆体底座2的结构不相同,本实施例中的软磁包覆体底座2包括有底平板202,在底平板202顶面中部设置有与实施例一相同的安装柱21,底平板202一侧面开设有第一凹槽203和第二凹槽204,其中第一凹槽203和第二凹槽204关于底平板202的纵向中线对称分布,所述软磁包覆体上组件4由线圈1和软磁包覆体底座2装配形成,其中线圈1安装过程中需要二次折弯第一引线脚101和第二引线脚102,第一次折弯使得第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次折弯将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合。Compared with Embodiment 1, the difference of this embodiment is that, as shown in Figures 7-10, the structure of the soft magnetic coating base 2 is different, and the soft magnetic coating base 2 in this embodiment includes Bottom plate 202, in the middle of the top surface of bottom plate 202 is provided with the same mounting column 21 as in Embodiment 1, and one side of bottom plate 202 is provided with a first groove 203 and a second groove 204, wherein the first groove 203 and the second groove The two grooves 204 are distributed symmetrically about the longitudinal centerline of the bottom plate 202. The upper component 4 of the soft magnetic covering body is formed by assembling the coil 1 and the base 2 of the soft magnetic covering body. A lead pin 101 and a second lead pin 102 are bent for the first time so that the first lead pin 101 and the second lead pin 102 are bent into the corresponding first groove 203 and the second groove 204, and the second bend is Bending the first lead pin 101 and the second lead pin 102 to the bottom surface of the bottom plate 202 , and closely attaching to the bottom surface of the bottom plate 202 .

同样的实施例二中的安装柱21的高度也可以是高于线圈1高度、等于线圈1高度或低于线圈1的高度,多种尺寸均可。Similarly, the height of the mounting column 21 in the second embodiment can also be higher than the height of the coil 1 , equal to the height of the coil 1 or lower than the height of the coil 1 , and various sizes are available.

进一步本实施例区别在于,如图8所示,软磁包覆体下组件3中由软磁包覆体盖体31代替软磁包覆体盖板30,其中软磁包覆体盖体31一侧开设有放置凹槽311,用于和软磁包覆体上组件4中的线圈1装配,进一步的放置凹槽311一端开设有定位开口312,便于对第一引线脚101或第二引线脚102进行定位,其中绝缘隔离板32位于软磁包覆体盖体31开设放置凹槽311的对侧面;其中需要注意的是,软磁包覆体盖体31与绝缘隔离板32是一体成型或分开成型,最终形成电感元件的时候,按顺序进行放置挤压即可,且软磁包覆体盖体31与软磁包覆体盖板30材质相同。Further, the difference of this embodiment is that, as shown in FIG. 8 , the soft magnetic covering body cover 31 replaces the soft magnetic covering body cover 30 in the soft magnetic covering body lower assembly 3 , wherein the soft magnetic covering body cover 31 One side is provided with a placement groove 311 for assembling with the coil 1 in the upper assembly 4 of the soft magnetic covering body, and one end of the further placement groove 311 is provided with a positioning opening 312, which is convenient for the first lead pin 101 or the second lead wire The feet 102 are positioned, wherein the insulating isolation plate 32 is located on the opposite side of the soft magnetic covering body cover 31 where the groove 311 is placed; it should be noted that the soft magnetic covering body cover 31 and the insulating insulating plate 32 are integrally formed Or separate molding, when the inductance element is finally formed, it only needs to be placed and pressed in sequence, and the material of the soft magnetic coating body cover 31 and the soft magnetic coating body cover plate 30 is the same.

更进一步如图11-图18所示,本实施例的软磁包覆体盖体31和软磁包覆体底座2可以采用多种对应结构用以配合:Further, as shown in Figures 11-18, the soft magnetic covering body cover 31 and the soft magnetic covering body base 2 of this embodiment can adopt various corresponding structures for cooperation:

A:如图11和图12所示,安装柱21与本实施例一样,定位开口312为全贯通开口,与放置凹槽311连通;A: As shown in Figure 11 and Figure 12, the installation column 21 is the same as this embodiment, and the positioning opening 312 is a full-through opening, which communicates with the placement groove 311;

B:如图13和图14所示,放置凹槽311和底平板202均设置安装柱21,且两个安装柱21尺寸相互配合,且定位开口312为全贯通开口,与放置凹槽311连通,且在定位开口312下方设置两个凹槽与第一凹槽203和第二凹槽204对应;B: As shown in Figure 13 and Figure 14, both the placement groove 311 and the bottom plate 202 are provided with installation columns 21, and the dimensions of the two installation columns 21 match each other, and the positioning opening 312 is a full-through opening, communicating with the placement groove 311 , and two grooves are provided below the positioning opening 312 to correspond to the first groove 203 and the second groove 204;

C:如图15-图16所示,放置凹槽311和底平板202均设置安装柱21,且两个安装柱21尺寸相互配合,其他与实施例二一致;C: As shown in Figures 15-16, both the placement groove 311 and the bottom plate 202 are provided with mounting columns 21, and the dimensions of the two mounting columns 21 match each other, and the others are consistent with the second embodiment;

D:如图17-图18所示,安装柱21不变,区别在于底平板202远离定位凸起205一端导圆角,对应软磁包覆体盖体31设放置凹槽311一侧形成台阶面,台阶高度等于底平板202厚度,倒有圆角的底平板202适配在阶梯的软磁包覆体盖体31上。D: As shown in Figures 17-18, the installation column 21 remains unchanged, the difference is that the end of the bottom plate 202 away from the positioning protrusion 205 has a rounded corner, and the corresponding soft magnetic covering body cover 31 is provided with a groove 311 to form a step On the surface, the step height is equal to the thickness of the bottom plate 202 , and the bottom plate 202 with rounded corners fits on the stepped soft magnetic covering body cover 31 .

E:如图19所示,安装柱21不变,区别在于底平板202呈十字型,对应的软磁包覆体盖体31可以是任何形状。E: As shown in Figure 19, the mounting column 21 remains unchanged, the difference is that the bottom plate 202 is cross-shaped, and the corresponding soft magnetic covering body 31 can be in any shape.

本实施例除上述区别的结构特征与实施例一不同,其他结构与实施例一完全相同。This embodiment is different from the first embodiment except for the structural features of the above differences, and the other structures are completely the same as the first embodiment.

进一步的该高性能高品质一体电感元件的生产工艺包括以下几个方案:The further production process of the high-performance and high-quality integrated inductive element includes the following schemes:

方案四:Option four:

步骤D1:将线圈1套入软磁包覆体底座2的安装柱21上,之后将第一引线脚101和第二引线脚102进行弯折,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次弯折将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合,得到软磁包覆体上组件4;Step D1: Put the coil 1 on the mounting column 21 of the base 2 of the soft magnetic covering body, and then bend the first lead pin 101 and the second lead pin 102, the number of bending times is two times, and the first bend The first lead pin 101 and the second lead pin 102 are bent into the corresponding first groove 203 and the second groove 204, and the second bending bends the first lead pin 101 and the second lead pin 102 to the bottom The bottom surface of the flat plate 202 is closely attached to the bottom surface of the bottom flat plate 202 to obtain the upper assembly 4 of the soft magnetic coating;

步骤D2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体下组件3(其中软磁包覆体盖体31与绝缘隔离板32是一体成型)倒置放入挤压模具中,并将定位开口312与第一引线脚101对应限位;Step D2: Put a soft magnetic covering body upper assembly 4 in the extrusion die, and then place a prefabricated soft magnetic covering body lower assembly 3 (wherein the soft magnetic covering body cover 31 and the insulating isolation plate 32 are Integral molding) put it upside down into the extrusion mold, and position the positioning opening 312 corresponding to the first lead pin 101;

步骤D3:在挤压模具中再次放入一个正放的预制好的软磁包覆体下组件3(其中软磁包覆体盖体31与绝缘隔离板32是一体成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step D3: Put a prefabricated soft magnetic covering body lower assembly 3 (wherein the soft magnetic covering body cover 31 and the insulation isolation plate 32 are integrally formed) in the extrusion mold again, and then put a The upper assembly 4 of the soft magnetic coating is inverted, wherein the orientations of the two first lead pins 101 and the second lead pins 102 are on the same side;

步骤D4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step D4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed first lead pin 101 and second lead pin 102 to obtain a finished inductance element (wherein the size of the tin plating based on the longer lead pin).

方案五;Option five;

步骤E1:将线圈1套入软磁包覆体底座2的安装柱21上,之后将第一引线脚101和第二引线脚102进行弯折,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次弯折将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合,得到软磁包覆体上组件4;Step E1: Put the coil 1 on the mounting column 21 of the base 2 of the soft magnetic coating, and then bend the first lead pin 101 and the second lead pin 102, the number of times of bending is two times, and the first bend The first lead pin 101 and the second lead pin 102 are bent into the corresponding first groove 203 and the second groove 204, and the second bending bends the first lead pin 101 and the second lead pin 102 to the bottom The bottom surface of the flat plate 202 is closely attached to the bottom surface of the bottom flat plate 202 to obtain the upper assembly 4 of the soft magnetic coating;

步骤E2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型)倒置放入挤压模具中,并将定位开口312与第一引线脚101对应限位;Step E2: Put a soft magnetic coating upper assembly 4 in the extrusion die, and then place a prefabricated soft magnetic coating cover 31 (wherein the soft magnetic coating cover 31 and the insulation isolation plate 32 are separate molding) and put it upside down into the extrusion mold, and position the positioning opening 312 corresponding to the first lead pin 101;

步骤E3:在挤压模具中放入两块预制好的绝缘隔离板32,之后再次放入一个正放的预先制成的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step E3: Put two prefabricated insulating spacers 32 in the extrusion die, and then put in a prefabricated soft magnetic covering body cover 31 (wherein the soft magnetic covering body cover 31 It is molded separately from the insulating spacer plate 32), and then put into an upside-down soft magnetic covering body assembly 4, wherein the direction of the two first lead pins 101 and the second lead pin 102 is on the same side;

步骤E4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step E4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed first lead pin 101 and second lead pin 102 to obtain a finished inductance element (wherein the size of the tin plating based on the longer lead pin).

方案六;Option six;

步骤F1:将线圈1套入软磁包覆体底座2的安装柱21上,之后将第一引线脚101和第二引线脚102进行弯折,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次弯折将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合,得到软磁包覆体上组件4;Step F1: Put the coil 1 on the mounting column 21 of the base 2 of the soft magnetic coating, and then bend the first lead pin 101 and the second lead pin 102. The number of bends is two times, and the first bend The first lead pin 101 and the second lead pin 102 are bent into the corresponding first groove 203 and the second groove 204, and the second bending bends the first lead pin 101 and the second lead pin 102 to the bottom The bottom surface of the flat plate 202 is closely attached to the bottom surface of the bottom flat plate 202 to obtain the upper assembly 4 of the soft magnetic coating;

步骤F2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型)倒置放入挤压模具中,并将定位开口312与第一引线脚101对应限位;Step F2: Put a soft magnetic coating upper assembly 4 in the extrusion die, and then place a prefabricated soft magnetic coating cover 31 (wherein the soft magnetic coating cover 31 and the insulating isolation plate 32 are separate molding) and put it upside down into the extrusion mold, and position the positioning opening 312 corresponding to the first lead pin 101;

步骤F3:在挤压模具中放入一块预制好的绝缘隔离板32(其中该绝缘隔离板32厚度为实施例一和实施例二的两倍),之后再次放入一个正放的预先制成的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step F3: put a prefabricated insulating spacer 32 in the extrusion die (wherein the thickness of the insulating spacer 32 is twice that of Embodiment 1 and Embodiment 2), and then put a prefabricated prefabricated The soft magnetic covering body cover 31 (wherein the soft magnetic covering body cover 31 and the insulating spacer plate 32 are molded separately), then put into an inverted soft magnetic covering body upper assembly 4, wherein the two first leads The direction of the pin 101 and the second lead pin 102 is on the same side;

步骤F4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step F4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed first lead pin 101 and second lead pin 102 to obtain a finished inductance element (wherein the size of the tin plating based on the longer lead pin).

进一步的针对本发明的一体电感元件与传统一体电感元件进行性能测试,其中厚度采用游标卡尺进行检测,感量采用感量电表(型号为H IOKI I M3536)进行检测,饱和后感是用绕线元件脉冲测试器(型号为Chroma 3302),直流电阻用DCR电表(型号为固纬GOM804),得到的实验数据如下表1和表2;Further carry out performance test for the integral inductance element of the present invention and traditional integral inductance element, wherein thickness adopts vernier caliper to detect, and inductance adopts inductance ammeter (model is H IOKI I M3536) to detect, and the feeling after saturation is to use winding element Pulse tester (model Chroma 3302), DCR ammeter for direct current resistance (model GOM804), the experimental data obtained are as follows Table 1 and Table 2;

表1为本发明的一体电感元件数据:Table 1 is the integrated inductance element data of the present invention:

Figure BDA0004000975780000121
Figure BDA0004000975780000121

Figure BDA0004000975780000131
Figure BDA0004000975780000131

Figure BDA0004000975780000141
Figure BDA0004000975780000141

表2为传统的一体电感元件数据:Table 2 shows the data of traditional integrated inductance components:

Figure BDA0004000975780000142
Figure BDA0004000975780000142

Figure BDA0004000975780000151
Figure BDA0004000975780000151

Figure BDA0004000975780000161
Figure BDA0004000975780000161

通过表1和表2的实验数据对比可知,本发明的一体电感元件相较于传统的一体电感元件,首先在尺寸上更加小型化,厚度降低0.3mm,在感量上本发明的一体电感元件提升了约14%,在6.6A的条件下,本发明的一体电感元件饱和特性提升约10%,进一步的DCR特性提升约50%。Through the comparison of the experimental data in Table 1 and Table 2, it can be seen that compared with the traditional integrated inductance element, the integrated inductance element of the present invention is more miniaturized in size, and the thickness is reduced by 0.3mm. In terms of inductance, the integrated inductance element of the present invention The improvement is about 14%. Under the condition of 6.6A, the saturation characteristic of the integrated inductance element of the present invention is improved by about 10%, and the further DCR characteristic is improved by about 50%.

其中DCR是直流电阻,单位是mΩ,对于相同尺寸大小的电感器,其直流电阻通常会呈现以下特点:如果电感值较高,则直流电阻值较高和如果电感值较低,则直流电阻值较低。Where DCR is the DC resistance in mΩ. For inductors of the same size, the DC resistance usually exhibits the following characteristics: If the inductance value is high, the DC resistance value is high; if the inductance value is low, the DC resistance value lower.

以上对本发明的一个实施例进行了详细说明,但所述内容仅为本发明的较佳实施例,不能被认为用于限定本发明的实施范围。凡依本发明申请范围所作的均等变化与改进等,均应仍归属于本发明的专利涵盖范围之内。An embodiment of the present invention has been described in detail above, but the content described is only a preferred embodiment of the present invention, and cannot be considered as limiting the implementation scope of the present invention. All equivalent changes and improvements made according to the application scope of the present invention shall still belong to the scope covered by the patent of the present invention.

Claims (8)

1. A high-performance high-quality integrated inductance element is characterized by comprising two groups of inductance unit pieces (5), wherein the two groups of inductance unit pieces (5) are symmetrically distributed, and each group of inductance unit pieces (5) comprises a soft magnetic cladding body upper assembly (4) and a soft magnetic cladding body lower assembly (3);
the soft magnetic coating upper assembly (4) comprises a soft magnetic coating base (2) and a coil (1), the coil (1) is installed on the soft magnetic coating base (2), the coil (1) is provided with a first lead pin (101) and a second lead pin (102), the soft magnetic coating base (2) comprises a base plate (22), a limiting groove (23) is formed in the middle of the top surface of the base plate (22), one end of the limiting groove (23) is provided with a limiting opening (24), and an installation column (21) is arranged in the center of the bottom surface of the limiting groove (23);
the soft magnetic cladding body lower assembly (3) comprises a soft magnetic cladding body cover plate (30) and an insulating isolation plate (32), and the insulating isolation plate (32) is located on the top surface of the soft magnetic cladding body cover plate (30).
2. A high performance high quality integral inductor component according to claim 1, characterized in that the height of the mounting posts (21) is higher than the height of the coil (1).
3. A high performance high quality integral inductor component according to claim 1, characterized in that the height of the mounting posts (21) is equal to the height of the coil (1).
4. A high performance high quality integral inductor component according to claim 1, characterized in that the height of the mounting posts (21) is less than the height of the coil (1).
5. A high performance, high quality integrated inductor component as claimed in claim 1, characterized in that the soft magnetic cladding cover plate (30) is formed integrally with the insulating spacer plate (32).
6. A high performance, high quality integrated inductor component as claimed in claim 1, characterized in that the soft magnetic cladding cover plate (30) and the insulating spacer plate (32) are formed separately.
7. A high performance high quality integral inductor component as claimed in claim 1, characterized in that said soft magnetic cladding base (2) and said soft magnetic cladding cover plate (30) are made of soft magnetic powder.
8. A process for producing a high-performance high-quality integral inductive component according to claim 1, characterized by comprising the following steps:
step one; sleeving the coil (1) on the mounting column (21) of the soft magnetic cladding body base (2), placing the coil in the limiting groove (23), bending the first lead pin (101) and the second lead pin (102), and correspondingly limiting the limiting opening (24) and the first lead pin (101) to obtain the soft magnetic cladding body upper assembly (4);
step two; placing a soft magnetic coating upper component (4) in an extrusion die, and then placing a prefabricated soft magnetic coating lower component (3) in the extrusion die in a positive mode;
step three; placing an inverted pre-formed soft magnetic cladding lower component (3) in the extrusion die again, and then placing an inverted soft magnetic cladding upper component (4), wherein the two first terminal pins (101) and the two second terminal pins (102) face the same side;
step four; and extruding to obtain a semi-finished inductive element, taking out the semi-finished inductive element, and electroplating and tinning the exposed first pin (101) and the second pin (102) to obtain the finished inductive element.
CN202211613235.9A 2022-12-15 2022-12-15 High-performance and high-quality integrated inductance element and production process thereof Pending CN115775677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211613235.9A CN115775677A (en) 2022-12-15 2022-12-15 High-performance and high-quality integrated inductance element and production process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211613235.9A CN115775677A (en) 2022-12-15 2022-12-15 High-performance and high-quality integrated inductance element and production process thereof

Publications (1)

Publication Number Publication Date
CN115775677A true CN115775677A (en) 2023-03-10

Family

ID=85392406

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211613235.9A Pending CN115775677A (en) 2022-12-15 2022-12-15 High-performance and high-quality integrated inductance element and production process thereof

Country Status (1)

Country Link
CN (1) CN115775677A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111627648A (en) * 2020-04-16 2020-09-04 昆山奥迪尔智能科技有限公司 Choke coil and manufacturing method thereof
CN119069236A (en) * 2024-10-15 2024-12-03 北半球技术(苏州)有限公司 A four-electrode inductor and its production process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039888A (en) * 2002-07-04 2004-02-05 Matsushita Electric Ind Co Ltd Inductor component
JP2013051399A (en) * 2011-08-04 2013-03-14 Alps Green Devices Co Ltd Inductor and manufacturing method of the same
CN103339695A (en) * 2011-01-31 2013-10-02 东光株式会社 Surface mount inductor and method for manufacturing surface mount inductor
TWM578003U (en) * 2019-01-31 2019-05-11 美桀科技股份有限公司 Dual inductor
CN211699884U (en) * 2019-12-06 2020-10-16 深圳市科达嘉电子有限公司 Heap heavy current inductance
CN114068152A (en) * 2021-12-14 2022-02-18 苏州邦鼎新材料有限公司 A high-performance and high-quality integrated inductive element structure and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039888A (en) * 2002-07-04 2004-02-05 Matsushita Electric Ind Co Ltd Inductor component
CN103339695A (en) * 2011-01-31 2013-10-02 东光株式会社 Surface mount inductor and method for manufacturing surface mount inductor
JP2013051399A (en) * 2011-08-04 2013-03-14 Alps Green Devices Co Ltd Inductor and manufacturing method of the same
TWM578003U (en) * 2019-01-31 2019-05-11 美桀科技股份有限公司 Dual inductor
CN211699884U (en) * 2019-12-06 2020-10-16 深圳市科达嘉电子有限公司 Heap heavy current inductance
CN114068152A (en) * 2021-12-14 2022-02-18 苏州邦鼎新材料有限公司 A high-performance and high-quality integrated inductive element structure and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111627648A (en) * 2020-04-16 2020-09-04 昆山奥迪尔智能科技有限公司 Choke coil and manufacturing method thereof
CN119069236A (en) * 2024-10-15 2024-12-03 北半球技术(苏州)有限公司 A four-electrode inductor and its production process

Similar Documents

Publication Publication Date Title
US20240145154A1 (en) Method of manufacturing an electronic component
CN102856037B (en) Molded power inductance component and manufacture method
CN115775677A (en) High-performance and high-quality integrated inductance element and production process thereof
KR20120014563A (en) Surface-Mount Magnetic Components and Manufacturing Method Thereof
WO2021196447A1 (en) Plastic molded power inductance element and manufacturing method
CN106449014A (en) Magnetic element, manufacturing method thereof and lead frame for magnetic element
TWI410988B (en) Electronic device and choke
JP2009260116A (en) Molded coil and producing method of the same
JP7501685B2 (en) Inductor and manufacturing method thereof
US12100543B2 (en) Molded-forming power inductor and manufacturing method thereof
CN101834055B (en) Electronic device and choke
CN102122563A (en) Wire wound inductor and manufacturing method thereof
CN111477425A (en) Pin embedded exposed inductance element capable of realizing microminiaturization
TWI685860B (en) Inductor device and method of fabricating the same
JP3707460B2 (en) Coil parts
CN115206669A (en) A kind of manufacturing method of chip inductor
JP3707461B2 (en) Coil parts manufacturing method
KR20180017479A (en) Coil component
CN212161444U (en) Pin embedded exposed inductance element capable of realizing microminiaturization
CN205542250U (en) Inductor structure
CN114068152A (en) A high-performance and high-quality integrated inductive element structure and its manufacturing method
CN201063289Y (en) Shading type inductor structure
CN111627650A (en) Magnetic element and preparation method thereof
JP7215463B2 (en) Inductor and its manufacturing method
TWM569060U (en) Inductor structure with height limit

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination