CN115775677A - High-performance and high-quality integrated inductance element and production process thereof - Google Patents
High-performance and high-quality integrated inductance element and production process thereof Download PDFInfo
- Publication number
- CN115775677A CN115775677A CN202211613235.9A CN202211613235A CN115775677A CN 115775677 A CN115775677 A CN 115775677A CN 202211613235 A CN202211613235 A CN 202211613235A CN 115775677 A CN115775677 A CN 115775677A
- Authority
- CN
- China
- Prior art keywords
- soft magnetic
- coil
- lead pin
- inductance element
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
技术领域technical field
本发明涉及电子元器件技术领域,具体涉及一种高性能高品质一体电感元件及其生产工艺。The invention relates to the technical field of electronic components, in particular to a high-performance and high-quality integrated inductance component and a production process thereof.
背景技术Background technique
电感元件的原始模型为导线绕成圆柱线圈,当线圈中通以电流i,在线圈中就会产生磁通量Φ,并储存能量,电感元件的电磁感应分为自感应和互感应,自身磁场在线圈内产生磁通量变化导致的电磁感应现象,称为“自感应”现象;外部磁场在线圈里磁通量变化产生的电磁感应现象,称为“互感应”现象。The original model of the inductance element is a wire wound into a cylindrical coil. When the current i is passed through the coil, a magnetic flux Φ will be generated in the coil and energy will be stored. The electromagnetic induction of the inductance element is divided into self-induction and mutual induction. The self-magnetic field in the coil The electromagnetic induction phenomenon caused by the change of magnetic flux inside the coil is called "self-induction" phenomenon; the electromagnetic induction phenomenon caused by the change of magnetic flux in the external magnetic field in the coil is called "mutual induction" phenomenon.
但是现有的电感元件中,安装线圈时无防护定位压制,导致线圈位置偏移,进而造成两侧壁厚不均匀,产生单侧壁厚偏小的问题,壁厚变小则结构强度就会变差,所以导致开裂,造成线圈的线包损伤、跑位造成的元件短路导致电感元件破损不良,对于电感元件产品的质量和使用寿命有很大的考验,生产出来的电感元件品质不足,缺乏在市场上同类产品的竞争力。However, in the existing inductive components, there is no protective positioning and pressing when installing the coil, which causes the position of the coil to shift, which in turn causes uneven wall thickness on both sides, resulting in the problem that the wall thickness on one side is too small, and the structural strength will decrease when the wall thickness becomes smaller. Deterioration, so it leads to cracking, damage to the wire package of the coil, short circuit of the components caused by displacement, and poor damage to the inductance components. This has a great test for the quality and service life of the inductance components. Competitiveness of similar products in the market.
发明内容Contents of the invention
为了克服上述的技术问题,本发明的目的在于提供一种高性能高品质一体电感元件及其生产工艺。In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide a high-performance and high-quality integrated inductance element and its production process.
本发明的目的可以通过以下技术方案实现:The purpose of the present invention can be achieved through the following technical solutions:
一种高性能高品质一体电感元件,包括两组电感单元件,两组电感单元件对称分布,每组电感单元件均包括软磁包覆体上组件和软磁包覆体下组件;A high-performance and high-quality integrated inductance element, including two sets of inductance unit elements, the two sets of inductance unit elements are symmetrically distributed, and each set of inductance unit elements includes an upper component of a soft magnetic coating and a lower component of a soft magnetic coating;
其中所述软磁包覆体上组件包括软磁包覆体底座和线圈,所述线圈安装在软磁包覆体底座上,所述线圈设置有第一引线脚和第二引线脚,所述软磁包覆体底座包括底座板,所述底座板顶面中部开设有限位槽,且限位槽一端设置有限位开口,限位槽底面中心设置有安装柱;Wherein the upper component of the soft magnetic covering body includes a base of the soft magnetic covering body and a coil, the coil is installed on the base of the soft magnetic covering body, the coil is provided with a first lead pin and a second lead pin, the The base of the soft magnetic covering body includes a base plate, a limiting groove is provided in the middle of the top surface of the base plate, and a limiting opening is arranged at one end of the limiting groove, and a mounting column is arranged at the center of the bottom surface of the limiting groove;
所述软磁包覆体下组件包括软磁包覆体盖板和绝缘隔离板,所述绝缘隔离板位于软磁包覆体盖板顶面。The lower assembly of the soft magnetic enclosure includes a cover plate of the soft magnetic enclosure and an insulation isolation plate, and the insulation isolation plate is located on the top surface of the cover plate of the soft magnetic enclosure.
作为本发明进一步的方案:所述安装柱的高度高于线圈高度。As a further solution of the present invention: the height of the mounting column is higher than that of the coil.
作为本发明进一步的方案:所述安装柱的高度等于线圈高度。As a further solution of the present invention: the height of the mounting column is equal to the height of the coil.
作为本发明进一步的方案:所述安装柱的高度小于线圈高度。As a further solution of the present invention: the height of the mounting column is smaller than the height of the coil.
作为本发明进一步的方案:软磁包覆体盖板与绝缘隔离板是一体成型。As a further solution of the present invention: the cover plate of the soft magnetic covering body and the insulation isolation plate are integrally formed.
作为本发明进一步的方案:软磁包覆体盖板与绝缘隔离板是分开成型。As a further solution of the present invention: the cover plate of the soft magnetic covering body and the insulation isolation plate are formed separately.
作为本发明进一步的方案:所述软磁包覆体底座和软磁包覆体盖板均采用软磁粉体制成。As a further solution of the present invention: the base of the soft magnetic covering body and the cover plate of the soft magnetic covering body are both made of soft magnetic powder.
作为本发明进一步的方案:一种高性能高品质一体电感元件的生产工艺,包括以下步骤:As a further solution of the present invention: a production process of a high-performance and high-quality integrated inductance element, comprising the following steps:
步骤一;将线圈套入软磁包覆体底座的安装柱上,并置于限位槽中,之后将第一引线脚和第二引线脚进行弯折,并将限位开口与第一引线脚对应限位,得到软磁包覆体上组件;Step 1: Put the coil on the mounting column of the base of the soft magnetic covering body, and place it in the limit slot, then bend the first lead pin and the second lead pin, and connect the limit opening with the first lead wire The feet correspond to the limit, and the upper component of the soft magnetic covering is obtained;
步骤二;在挤压模具中放入一个软磁包覆体上组件,之后将一个预制好的软磁包覆体下组件正置的放入挤压模具中;Step 2: Put an upper assembly of the soft magnetic covering body in the extrusion mold, and then put a prefabricated lower assembly of the soft magnetic covering body upright into the extrusion mold;
步骤三;在挤压模具中再次放入一个倒置的预制好的软磁包覆体下组件,之后放入一个倒置的软磁包覆体上组件,其中两个第一引线脚和第二引线脚的朝向位于同一侧;Step 3: Put an inverted prefabricated soft magnetic covering body lower assembly again in the extrusion mold, and then put an inverted soft magnetic covering body upper assembly, wherein the two first lead pins and the second lead The feet are facing on the same side;
步骤四;进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚和第二引线脚进行电镀镀锡,得到成品的电感元件。Step 4: Extruding to obtain a semi-finished inductance element, taking out the semi-finished inductance element, and electroplating and tinning the exposed first and second lead pins to obtain a finished inductance element.
本发明的有益效果:Beneficial effects of the present invention:
1、本发明通过预先成型软磁包覆体底座,设置安装柱,保证在安装线圈是时进行定位防护,在压制的时候使线圈被安装柱固定,保证压制的过程中线圈位置的稳定性,降低因无防护定位压制造成的线圈线包损伤、跑位造成的元件短路、开裂破损不良。1. The present invention preforms the base of the soft magnetic coating body and sets the installation column to ensure the positioning protection when the coil is installed, and the coil is fixed by the installation column during pressing to ensure the stability of the coil position during the pressing process. Reduce coil package damage caused by unprotected positioning and pressing, component short circuit, cracking and damage caused by displacement.
2、本发明进一步缩小成品电感元件的外形尺寸,尤其是厚度缩小了3mm,制成的小型一体电感元件给小型电路板搭载连接更多元件提供了更好的空间利用前提条件,同时减少制造所需原材料铁粉、铜材、锡的损耗。2. The present invention further reduces the external dimension of the finished inductive element, especially the thickness is reduced by 3mm, and the small integrated inductive element made provides better space utilization preconditions for the small circuit board to carry and connect more elements, while reducing the manufacturing cost. The loss of raw materials such as iron powder, copper, and tin is required.
3、本发明的电感元件制成结构实现了一体电感元件的小型化的同时,提升一体电感元件感量约14%、饱和性能10%和DCR特性50%,进一步提高了成型电感元件的可靠性与性能。3. The structure of the inductance element of the present invention realizes the miniaturization of the integrated inductance element, and at the same time improves the inductance of the integral inductance element by about 14%, the saturation performance by 10% and the DCR characteristic by 50%, and further improves the reliability of the formed inductance element with performance.
附图说明Description of drawings
下面结合附图对本发明作进一步的说明。The present invention will be further described below in conjunction with the accompanying drawings.
图1是本发明成品电感元件结构示意图;Fig. 1 is the structural representation of finished product inductance element of the present invention;
图2是本发明中线圈结构示意图;Fig. 2 is a schematic diagram of a coil structure in the present invention;
图3是本发明实施例一中软磁包覆体底座整体结构示意图;Fig. 3 is a schematic diagram of the overall structure of the base of the soft magnetic coating in
图4是本发明实施例一中软磁包覆体下组件整体结构示意图;Fig. 4 is a schematic diagram of the overall structure of the lower component of the soft magnetic coating in
图5是本发明实施例一中软磁包覆体上组件整体结构示意图;Fig. 5 is a schematic diagram of the overall structure of the upper assembly of the soft magnetic coating in
图6是本发明实施例一生产工艺挤压位置示意图;Fig. 6 is a schematic diagram of the extrusion position of the production process of
图7是本发明实施例二中软磁包覆体底座整体结构示意图;Fig. 7 is a schematic diagram of the overall structure of the base of the soft magnetic covering body in
图8是本发明实施例二中软磁包覆体下组件整体结构示意图;Fig. 8 is a schematic diagram of the overall structure of the lower assembly of the soft magnetic coating in
图9是本发明实施例二中软磁包覆体上组件整体结构示意图;Fig. 9 is a schematic diagram of the overall structure of the upper assembly of the soft magnetic coating in the second embodiment of the present invention;
图10是本发明实施例二生产工艺挤压位置示意图;Fig. 10 is a schematic diagram of the extrusion position of the production process of Example 2 of the present invention;
图11是本发明实施例二中软磁包覆体盖体结构变形示意图一;Fig. 11 is a schematic diagram of deformation of the cover body of the soft magnetic coating in the second embodiment of the present invention;
图12是本发明实施例二中软磁包覆体底座结构变形示意图一;Fig. 12 is a schematic diagram of deformation of the base of the soft magnetic covering body in
图13是本发明实施例二中软磁包覆体盖体结构变形示意图二;Fig. 13 is the second schematic diagram of the deformation of the soft magnetic covering body cover structure in the second embodiment of the present invention;
图14是本发明实施例二中软磁包覆体底座结构变形示意图二;Fig. 14 is the second schematic diagram of the deformation of the base of the soft magnetic coating in the second embodiment of the present invention;
图15是本发明实施例二中软磁包覆体盖体结构变形示意图三;Fig. 15 is the third schematic diagram of the structural deformation of the soft magnetic covering body cover in the second embodiment of the present invention;
图16是本发明实施例二中软磁包覆体底座结构变形示意图三;Fig. 16 is the third schematic diagram of the structural deformation of the base of the soft magnetic coating in the second embodiment of the present invention;
图17是本发明实施例二中软磁包覆体盖体结构变形示意图四;Fig. 17 is a fourth schematic diagram of the structural deformation of the soft magnetic covering body cover in the second embodiment of the present invention;
图18是本发明实施例二中软磁包覆体底座结构变形示意图四;Fig. 18 is a fourth schematic diagram of the structural deformation of the base of the soft magnetic coating in the second embodiment of the present invention;
图19是本发明实施例二中软磁包覆体底座结构变形示意图五。Fig. 19 is a fifth schematic diagram of the deformation of the base structure of the soft magnetic covering body in the second embodiment of the present invention.
图中:1、线圈;101、第一引线脚;102、第二引线脚;2、软磁包覆体底座;21、安装柱;22、底座板;23、限位槽;24、限位开口;202、底平板;203、第一凹槽;204、第二凹槽;3、软磁包覆体下组件;30、软磁包覆体盖板;31、软磁包覆体盖体;311、放置凹槽;312、定位开口;32、绝缘隔离板;4、软磁包覆体上组件;5、电感单元件。In the figure: 1, coil; 101, first lead pin; 102, second lead pin; 2, soft magnetic coating body base; 21, mounting column; 22, base plate; 23, limit slot; 24, limit Opening; 202, the bottom plate; 203, the first groove; 204, the second groove; 3, the lower component of the soft magnetic coating; 30, the cover plate of the soft magnetic coating; 31, the cover of the soft magnetic coating ; 311 , placement groove; 312 , positioning opening; 32 , insulating isolation plate; 4 , soft magnetic cladding upper assembly; 5 , inductance unit.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
实施例一:Embodiment one:
如图1-图6所示,一种高性能高品质一体电感元件,包括两组电感单元件5,两组电感单元件5关于结合面对称分布,每组电感单元件5均包括软磁包覆体上组件4和软磁包覆体下组件3,通过对应的软磁包覆体上组件4和软磁包覆体下组件3进行装配形成电感单元件5,再将两组电感单元件5放置在挤压模具中压制成一体,形成该电感元件。As shown in Figures 1 to 6, a high-performance and high-quality integrated inductance element includes two sets of
进一步的如图2、图3和图5所示,软磁包覆体上组件4包括软磁包覆体底座2和线圈1,该线圈1安装在软磁包覆体底座2上,其中线圈1设置有第一引线脚101和第二引线脚102,上述的软磁包覆体底座2包括有底座板22,在底座板22的顶面中部开设有限位槽23,且限位槽23一端设置为弧形,一端为矩形,在矩形面的一端开设有限位开口24,用于对安装上的第一引线脚101或第二引线脚102进行定位,且限制位置,便于后续的压制,进一步的限位槽23底面中心设置有安装柱21,用于装配定位,且安装住21的形状包括但不限于圆形和椭圆形,所述软磁包覆体上组件4由线圈1和软磁包覆体底座2装配形成,其中线圈1安装过程中需要二次折弯第一引线脚101和第二引线脚102,第一次折弯使得第一引线脚101和第二引线脚102弯折到对应的底座板22侧面,第二次折弯将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合。Further as shown in Fig. 2, Fig. 3 and Fig. 5, the
更进一步的如图3中的安装柱21的高度可以是高于线圈1高度、等于线圈1高度或低于线圈1的高度,多种尺寸均可。Furthermore, as shown in Figure 3, the height of the mounting
进一步如图4所示,软磁包覆体下组件3包括软磁包覆体盖板30和绝缘隔离板32,其中软磁包覆体盖板30为平板,便于配合软磁包覆体上组件4对线圈1密封,其中绝缘隔离板32位于软磁包覆体盖板30顶面;其中需要注意的是,软磁包覆体盖板30与绝缘隔离板32是可以一体成型或分开成型,最终形成电感元件的时候,按顺序进行放置挤压即可,进一步的两组软磁包覆体下组件3也可以一体成型或分开成型。As further shown in FIG. 4 , the
更进一步的软磁包覆体底座2和软磁包覆体盖板30均采用软磁粉体制成,常用的软磁材料有铁氧体,铁粉芯,非晶态合金等,能够随着加压变形,上述的绝缘隔离板32材料为陶瓷、高分子、纳米和绝缘包覆后的金属颗粒材料。Further, the soft magnetic
进一步的上述软磁包覆体盖板30和绝缘隔离板32在预制过程中可以是进行填粉预制,也可以进行切块预制。Further, in the prefabrication process of the above-mentioned soft magnetic
进一步的该高性能高品质一体电感元件的生产工艺包括以下几个方案:The further production process of the high-performance and high-quality integrated inductive element includes the following schemes:
方案一:Option One:
步骤A1:将线圈1套入软磁包覆体底座2的安装柱21上,并置于限位槽23中,之后将第一引线脚101和第二引线脚102进行弯折,其中将限位开口24与第一引线脚101对应限位,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到底座板22开设有限位开口24的一侧,第二次弯折将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合,得到软磁包覆体上组件4;Step A1: Put the
步骤A2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体下组件3(其中软磁包覆体盖板30与绝缘隔离板32是一体成型)正置的放入挤压模具中;Step A2: Put a soft magnetic covering body
步骤A3:在挤压模具中再次放入一个倒置的预制好的软磁包覆体下组件3(其中软磁包覆体盖板30与绝缘隔离板32是一体成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step A3: Put an inverted prefabricated soft magnetic cladding
步骤A4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step A4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed
方案二:Option II:
步骤B1:将线圈1套入软磁包覆体底座2的安装柱21上,并置于限位槽23中,之后将第一引线脚101和第二引线脚102进行弯折,其中将限位开口24与第一引线脚101对应限位,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到底座板22开设有限位开口24的一侧,第二次弯折将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合,得到软磁包覆体上组件4;Step B1: Put the
步骤B2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体下组件组合体(其中软磁包覆体下组件组合体是由两个软磁包覆体下组件3预先一体压制而成)倒置放入挤压模具中;Step B2: Put a soft magnetic coating
步骤B3:在挤压模具中再次放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step B3: Putting an upside-down soft magnetic covering
步骤B4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step B4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed
方案三:third solution:
步骤C1:将线圈1套入软磁包覆体底座2的安装柱21上,并置于限位槽23中,之后将第一引线脚101和第二引线脚102进行弯折,其中将限位开口24与第一引线脚101对应限位,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到底座板22开设有限位开口24的一侧,第二次弯折将第一引线脚101和第二引线脚102弯折到底座板22底面,并且与底座板22底面紧密贴合,得到软磁包覆体上组件4;Step C1: Put the
步骤C2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体盖板30(其中软磁包覆体盖板30与绝缘隔离板32是分开成型)倒置放入挤压模具中;Step C2: Put a soft magnetic covering body
步骤C3:在挤压模具中放入两块预制好的绝缘隔离板32,之后再次放入一个正放的预先制成的软磁包覆体盖板30(其中软磁包覆体盖板30与绝缘隔离板32是分开成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step C3: Put two prefabricated insulating
步骤C4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step C4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed
实施例二:Embodiment two:
与实施例一相比,本实施例区别在于,如图7-图10所示,所述软磁包覆体底座2的结构不相同,本实施例中的软磁包覆体底座2包括有底平板202,在底平板202顶面中部设置有与实施例一相同的安装柱21,底平板202一侧面开设有第一凹槽203和第二凹槽204,其中第一凹槽203和第二凹槽204关于底平板202的纵向中线对称分布,所述软磁包覆体上组件4由线圈1和软磁包覆体底座2装配形成,其中线圈1安装过程中需要二次折弯第一引线脚101和第二引线脚102,第一次折弯使得第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次折弯将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合。Compared with
同样的实施例二中的安装柱21的高度也可以是高于线圈1高度、等于线圈1高度或低于线圈1的高度,多种尺寸均可。Similarly, the height of the mounting
进一步本实施例区别在于,如图8所示,软磁包覆体下组件3中由软磁包覆体盖体31代替软磁包覆体盖板30,其中软磁包覆体盖体31一侧开设有放置凹槽311,用于和软磁包覆体上组件4中的线圈1装配,进一步的放置凹槽311一端开设有定位开口312,便于对第一引线脚101或第二引线脚102进行定位,其中绝缘隔离板32位于软磁包覆体盖体31开设放置凹槽311的对侧面;其中需要注意的是,软磁包覆体盖体31与绝缘隔离板32是一体成型或分开成型,最终形成电感元件的时候,按顺序进行放置挤压即可,且软磁包覆体盖体31与软磁包覆体盖板30材质相同。Further, the difference of this embodiment is that, as shown in FIG. 8 , the soft magnetic covering body cover 31 replaces the soft magnetic covering body cover 30 in the soft magnetic covering body
更进一步如图11-图18所示,本实施例的软磁包覆体盖体31和软磁包覆体底座2可以采用多种对应结构用以配合:Further, as shown in Figures 11-18, the soft magnetic
A:如图11和图12所示,安装柱21与本实施例一样,定位开口312为全贯通开口,与放置凹槽311连通;A: As shown in Figure 11 and Figure 12, the
B:如图13和图14所示,放置凹槽311和底平板202均设置安装柱21,且两个安装柱21尺寸相互配合,且定位开口312为全贯通开口,与放置凹槽311连通,且在定位开口312下方设置两个凹槽与第一凹槽203和第二凹槽204对应;B: As shown in Figure 13 and Figure 14, both the
C:如图15-图16所示,放置凹槽311和底平板202均设置安装柱21,且两个安装柱21尺寸相互配合,其他与实施例二一致;C: As shown in Figures 15-16, both the
D:如图17-图18所示,安装柱21不变,区别在于底平板202远离定位凸起205一端导圆角,对应软磁包覆体盖体31设放置凹槽311一侧形成台阶面,台阶高度等于底平板202厚度,倒有圆角的底平板202适配在阶梯的软磁包覆体盖体31上。D: As shown in Figures 17-18, the
E:如图19所示,安装柱21不变,区别在于底平板202呈十字型,对应的软磁包覆体盖体31可以是任何形状。E: As shown in Figure 19, the mounting
本实施例除上述区别的结构特征与实施例一不同,其他结构与实施例一完全相同。This embodiment is different from the first embodiment except for the structural features of the above differences, and the other structures are completely the same as the first embodiment.
进一步的该高性能高品质一体电感元件的生产工艺包括以下几个方案:The further production process of the high-performance and high-quality integrated inductive element includes the following schemes:
方案四:Option four:
步骤D1:将线圈1套入软磁包覆体底座2的安装柱21上,之后将第一引线脚101和第二引线脚102进行弯折,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次弯折将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合,得到软磁包覆体上组件4;Step D1: Put the
步骤D2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体下组件3(其中软磁包覆体盖体31与绝缘隔离板32是一体成型)倒置放入挤压模具中,并将定位开口312与第一引线脚101对应限位;Step D2: Put a soft magnetic covering body
步骤D3:在挤压模具中再次放入一个正放的预制好的软磁包覆体下组件3(其中软磁包覆体盖体31与绝缘隔离板32是一体成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step D3: Put a prefabricated soft magnetic covering body lower assembly 3 (wherein the soft magnetic
步骤D4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step D4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed
方案五;Option five;
步骤E1:将线圈1套入软磁包覆体底座2的安装柱21上,之后将第一引线脚101和第二引线脚102进行弯折,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次弯折将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合,得到软磁包覆体上组件4;Step E1: Put the
步骤E2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型)倒置放入挤压模具中,并将定位开口312与第一引线脚101对应限位;Step E2: Put a soft magnetic coating
步骤E3:在挤压模具中放入两块预制好的绝缘隔离板32,之后再次放入一个正放的预先制成的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step E3: Put two prefabricated insulating
步骤E4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step E4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed
方案六;Option six;
步骤F1:将线圈1套入软磁包覆体底座2的安装柱21上,之后将第一引线脚101和第二引线脚102进行弯折,弯折次数为两次,第一次弯折将第一引线脚101和第二引线脚102弯折到对应的第一凹槽203和第二凹槽204中,第二次弯折将第一引线脚101和第二引线脚102弯折到底平板202底面,并且与底平板202底面紧密贴合,得到软磁包覆体上组件4;Step F1: Put the
步骤F2:在挤压模具中放入一个软磁包覆体上组件4,之后将一个预制好的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型)倒置放入挤压模具中,并将定位开口312与第一引线脚101对应限位;Step F2: Put a soft magnetic coating
步骤F3:在挤压模具中放入一块预制好的绝缘隔离板32(其中该绝缘隔离板32厚度为实施例一和实施例二的两倍),之后再次放入一个正放的预先制成的软磁包覆体盖体31(其中软磁包覆体盖体31与绝缘隔离板32是分开成型),之后放入一个倒置的软磁包覆体上组件4,其中两个第一引线脚101和第二引线脚102的朝向位于同一侧;Step F3: put a prefabricated insulating
步骤F4:进行挤压,得到半成品的电感元件,将半成品电感元件取出,并将露出的第一引线脚101和第二引线脚102进行电镀镀锡,得到成品的电感元件(其中镀锡的尺寸以较长的引线脚为基准)。Step F4: Extrude to obtain a semi-finished inductance element, take out the semi-finished inductance element, and perform electroplating and tinning on the exposed
进一步的针对本发明的一体电感元件与传统一体电感元件进行性能测试,其中厚度采用游标卡尺进行检测,感量采用感量电表(型号为H IOKI I M3536)进行检测,饱和后感是用绕线元件脉冲测试器(型号为Chroma 3302),直流电阻用DCR电表(型号为固纬GOM804),得到的实验数据如下表1和表2;Further carry out performance test for the integral inductance element of the present invention and traditional integral inductance element, wherein thickness adopts vernier caliper to detect, and inductance adopts inductance ammeter (model is H IOKI I M3536) to detect, and the feeling after saturation is to use winding element Pulse tester (model Chroma 3302), DCR ammeter for direct current resistance (model GOM804), the experimental data obtained are as follows Table 1 and Table 2;
表1为本发明的一体电感元件数据:Table 1 is the integrated inductance element data of the present invention:
表2为传统的一体电感元件数据:Table 2 shows the data of traditional integrated inductance components:
通过表1和表2的实验数据对比可知,本发明的一体电感元件相较于传统的一体电感元件,首先在尺寸上更加小型化,厚度降低0.3mm,在感量上本发明的一体电感元件提升了约14%,在6.6A的条件下,本发明的一体电感元件饱和特性提升约10%,进一步的DCR特性提升约50%。Through the comparison of the experimental data in Table 1 and Table 2, it can be seen that compared with the traditional integrated inductance element, the integrated inductance element of the present invention is more miniaturized in size, and the thickness is reduced by 0.3mm. In terms of inductance, the integrated inductance element of the present invention The improvement is about 14%. Under the condition of 6.6A, the saturation characteristic of the integrated inductance element of the present invention is improved by about 10%, and the further DCR characteristic is improved by about 50%.
其中DCR是直流电阻,单位是mΩ,对于相同尺寸大小的电感器,其直流电阻通常会呈现以下特点:如果电感值较高,则直流电阻值较高和如果电感值较低,则直流电阻值较低。Where DCR is the DC resistance in mΩ. For inductors of the same size, the DC resistance usually exhibits the following characteristics: If the inductance value is high, the DC resistance value is high; if the inductance value is low, the DC resistance value lower.
以上对本发明的一个实施例进行了详细说明,但所述内容仅为本发明的较佳实施例,不能被认为用于限定本发明的实施范围。凡依本发明申请范围所作的均等变化与改进等,均应仍归属于本发明的专利涵盖范围之内。An embodiment of the present invention has been described in detail above, but the content described is only a preferred embodiment of the present invention, and cannot be considered as limiting the implementation scope of the present invention. All equivalent changes and improvements made according to the application scope of the present invention shall still belong to the scope covered by the patent of the present invention.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211613235.9A CN115775677A (en) | 2022-12-15 | 2022-12-15 | High-performance and high-quality integrated inductance element and production process thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211613235.9A CN115775677A (en) | 2022-12-15 | 2022-12-15 | High-performance and high-quality integrated inductance element and production process thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115775677A true CN115775677A (en) | 2023-03-10 |
Family
ID=85392406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211613235.9A Pending CN115775677A (en) | 2022-12-15 | 2022-12-15 | High-performance and high-quality integrated inductance element and production process thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115775677A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111627648A (en) * | 2020-04-16 | 2020-09-04 | 昆山奥迪尔智能科技有限公司 | Choke coil and manufacturing method thereof |
CN119069236A (en) * | 2024-10-15 | 2024-12-03 | 北半球技术(苏州)有限公司 | A four-electrode inductor and its production process |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004039888A (en) * | 2002-07-04 | 2004-02-05 | Matsushita Electric Ind Co Ltd | Inductor component |
JP2013051399A (en) * | 2011-08-04 | 2013-03-14 | Alps Green Devices Co Ltd | Inductor and manufacturing method of the same |
CN103339695A (en) * | 2011-01-31 | 2013-10-02 | 东光株式会社 | Surface mount inductor and method for manufacturing surface mount inductor |
TWM578003U (en) * | 2019-01-31 | 2019-05-11 | 美桀科技股份有限公司 | Dual inductor |
CN211699884U (en) * | 2019-12-06 | 2020-10-16 | 深圳市科达嘉电子有限公司 | Heap heavy current inductance |
CN114068152A (en) * | 2021-12-14 | 2022-02-18 | 苏州邦鼎新材料有限公司 | A high-performance and high-quality integrated inductive element structure and its manufacturing method |
-
2022
- 2022-12-15 CN CN202211613235.9A patent/CN115775677A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004039888A (en) * | 2002-07-04 | 2004-02-05 | Matsushita Electric Ind Co Ltd | Inductor component |
CN103339695A (en) * | 2011-01-31 | 2013-10-02 | 东光株式会社 | Surface mount inductor and method for manufacturing surface mount inductor |
JP2013051399A (en) * | 2011-08-04 | 2013-03-14 | Alps Green Devices Co Ltd | Inductor and manufacturing method of the same |
TWM578003U (en) * | 2019-01-31 | 2019-05-11 | 美桀科技股份有限公司 | Dual inductor |
CN211699884U (en) * | 2019-12-06 | 2020-10-16 | 深圳市科达嘉电子有限公司 | Heap heavy current inductance |
CN114068152A (en) * | 2021-12-14 | 2022-02-18 | 苏州邦鼎新材料有限公司 | A high-performance and high-quality integrated inductive element structure and its manufacturing method |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111627648A (en) * | 2020-04-16 | 2020-09-04 | 昆山奥迪尔智能科技有限公司 | Choke coil and manufacturing method thereof |
CN119069236A (en) * | 2024-10-15 | 2024-12-03 | 北半球技术(苏州)有限公司 | A four-electrode inductor and its production process |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20240145154A1 (en) | Method of manufacturing an electronic component | |
CN102856037B (en) | Molded power inductance component and manufacture method | |
CN115775677A (en) | High-performance and high-quality integrated inductance element and production process thereof | |
KR20120014563A (en) | Surface-Mount Magnetic Components and Manufacturing Method Thereof | |
WO2021196447A1 (en) | Plastic molded power inductance element and manufacturing method | |
CN106449014A (en) | Magnetic element, manufacturing method thereof and lead frame for magnetic element | |
TWI410988B (en) | Electronic device and choke | |
JP2009260116A (en) | Molded coil and producing method of the same | |
JP7501685B2 (en) | Inductor and manufacturing method thereof | |
US12100543B2 (en) | Molded-forming power inductor and manufacturing method thereof | |
CN101834055B (en) | Electronic device and choke | |
CN102122563A (en) | Wire wound inductor and manufacturing method thereof | |
CN111477425A (en) | Pin embedded exposed inductance element capable of realizing microminiaturization | |
TWI685860B (en) | Inductor device and method of fabricating the same | |
JP3707460B2 (en) | Coil parts | |
CN115206669A (en) | A kind of manufacturing method of chip inductor | |
JP3707461B2 (en) | Coil parts manufacturing method | |
KR20180017479A (en) | Coil component | |
CN212161444U (en) | Pin embedded exposed inductance element capable of realizing microminiaturization | |
CN205542250U (en) | Inductor structure | |
CN114068152A (en) | A high-performance and high-quality integrated inductive element structure and its manufacturing method | |
CN201063289Y (en) | Shading type inductor structure | |
CN111627650A (en) | Magnetic element and preparation method thereof | |
JP7215463B2 (en) | Inductor and its manufacturing method | |
TWM569060U (en) | Inductor structure with height limit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |