CN115774051A - Self-focusing phased array probe, manufacturing process and parameter determination method - Google Patents
Self-focusing phased array probe, manufacturing process and parameter determination method Download PDFInfo
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- CN115774051A CN115774051A CN202111036393.8A CN202111036393A CN115774051A CN 115774051 A CN115774051 A CN 115774051A CN 202111036393 A CN202111036393 A CN 202111036393A CN 115774051 A CN115774051 A CN 115774051A
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- 239000000523 sample Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000002131 composite material Substances 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims abstract description 9
- 239000007924 injection Substances 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 16
- 238000013461 design Methods 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 13
- 238000004088 simulation Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 51
- 238000003466 welding Methods 0.000 description 8
- 238000007689 inspection Methods 0.000 description 4
- 238000011960 computer-aided design Methods 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Abstract
The invention belongs to the technical field of phased array ultrasonic detection, and particularly relates to a self-focusing phased array probe, a manufacturing process and a parameter determination method. Including casing, self-focusing piezoelectric wafer, sound conduction piece, central locating hole and water injection hole, the casing connect for the cuboid, self-focusing piezoelectric wafer installs on the bottom surface in the casing lower extreme through sound conduction piece, it has the round guiding gutter to open at casing lower extreme off-plate side, the water injection hole that guiding gutter and casing up end set up be linked together, still install cable joint on the casing up end, cable joint be connected with the self-focusing piezoelectric wafer in the casing. The advantages are that: by adopting a self-focusing mode of a wafer in the probe instead of lens focusing, the piezoelectric wafer self-focusing is realized by outputting higher energy, so that the optimal human focusing effect is achieved, and the detection capability is enhanced; and the high epoxy phase composite material is adopted, so that the flexibility is realized, and the probe can be bent to a designed angle in the preparation process.
Description
Technical Field
The invention belongs to the technical field of phased array ultrasonic detection, and particularly relates to a self-focusing phased array probe, a manufacturing process and a parameter determination method.
Background
In the nuclear power field, 100% of ray detection is required for nondestructive detection of sheet welding seams according to ASME and RSE-M specification requirements. However, in practice, radiation detection cannot be performed due to problems in field quality control or due to design changes of some positions, and at the moment, only an alternative method can be found for performing inspection.
One of the challenges for alternative test implementations is that the ASME and RSE-M specifications do not specify methods and acceptance criteria for alternative tests for welds with wall thicknesses less than 10 mm. Therefore, the feasibility and detection capability of the alternative method can only be demonstrated by a technical capability verification mode.
In one of the prior art, manual verification is performed by conventional ultrasonic inspection techniques, which have poor inspection results for such thin-walled welds due to the limitations of the inspection methods. Therefore, the feasibility and detection capability of the method cannot be effectively verified.
Adopt above-mentioned conventional ultrasonic technology to have the problem that the welding seam remaining height is because the design reason can't grind flat, and the sheet metal welding seam receives tensile stress effect from top to bottom and leads to the welding seam to warp seriously, must adopt the many times reflection wave to detect moreover, and its reflection signal is more and indiscriminate, and the root to 2 times, 3 times of wave, signal such as remaining height, surface are very difficult to distinguish, need the measurement personnel experience very abundant moreover, have personnel technical capability limitation.
Another problem with conventional ultrasound techniques is focusing, which is characterized by less concentration of energy and greater attenuation of scatter if not used. However, if the conventional ultrasound is focused by using a bimorph probe, the waveform of the conventional ultrasound is longitudinal waves, and the longitudinal waves are reflected in a workpiece to form transverse waves and longitudinal waves, so that scanning cannot be performed by adopting multiple reflections.
Disclosure of Invention
The invention aims to provide a self-focusing phased array probe, a manufacturing process and a parameter determination method, so that the problem that a conventional linear array phased array probe cannot focus a sound beam inside a workpiece through a plane contact surface is solved, the sound beam is focused inside the probe by changing the structure of a piezoelectric wafer, and then the focused sound beam enters the workpiece to realize focusing inside the workpiece, so that the problem of focusing can be solved, the high concentration of energy is realized, and the defects have high sensitivity and resolution.
The invention is realized in such a way that a self-focusing phased array probe comprises a shell, a self-focusing piezoelectric wafer, a sound guide block, a central positioning hole and a water injection hole, wherein the shell is a cuboid joint, the self-focusing piezoelectric wafer is arranged on the inner bottom surface at the lower end of the shell through the sound guide block, a circle of flow guide groove is arranged outside the outer surface at the lower end of the shell, the flow guide groove is communicated with the water injection hole arranged on the upper end surface of the shell, a cable joint is also arranged on the upper end surface of the shell, and the cable joint is connected with the self-focusing piezoelectric wafer in the shell.
The diversion trench is rectangular.
The phased array probe is arranged on the holder through the central positioning hole, and the coupling agent is injected into the probe through the diversion trench.
A process for manufacturing a self-focusing piezoelectric wafer, comprising the steps of:
step 1: cutting the piezoelectric wafer to a required size according to design parameters;
step 2: filling flexible materials in the cutting groove;
and 3, step 3: positioning and pressurizing the piezoelectric wafer, and forming the piezoelectric wafer to a radian required by design so as to realize physical self-focusing of the piezoelectric wafer;
and 4, step 4: accurately measuring the radian size of the self-focusing piezoelectric wafer obtained in the step 3 to ensure that the radian size is within the range of design parameters;
and 5: aligning and bonding the piezoelectric wafer obtained in the step (4) with the convex sound guide block;
step 6: the electrode lead-out of the self-focusing piezoelectric wafer is reliably butted with the cable.
The material in step 2 is polyurethane or epoxy resin with hardness SHORE A40-60.
The parameter determination method of the self-focusing piezoelectric wafer comprises the following steps:
step 1: calculating and simulating the bending parameters of the piezoelectric wafer;
step 2: testing and verifying parameters of the piezoelectric wafer;
and step 3: and (3) bending the piezoelectric wafer.
The step 1 comprises the steps that the bending parameters of the piezoelectric wafer such as curvature, width, deformation and the like are simulated and calculated through engineering calculation software, the rough range of focal spots within the depth range of a workpiece is obtained when the angle of a main sound beam of the piezoelectric wafer with different curvatures is calculated, then, several groups of closer design values are selected according to the actual range and input into Civa sound field simulation software, the focal distance range obtained by each group of simulation is calculated, and the final bending parameters of the piezoelectric wafer are selected through comparison of simulation results of each group and comparison with actual requirements.
The engineering calculation software comprises CAD and an Inventor.
The step 2 comprises designing two phased array ultrasonic probes, wherein the first probe adopts a phased array probe with the frequency of 4MHz and the wafer spacing of 0.6mm, and is not self-focusing; the second probe adopts a phased array probe with the frequency of 5MHz and the wafer spacing of 0.31mm, and is self-focused; the two probes are all transverse wave wedge blocks, the nominal angle of each wedge block is 60 degrees, and actual measurement tests are carried out on actual defects through the module test pieces.
And the step 3 comprises compounding the piezoelectric ceramic and the piezoelectric polymer to prepare the composite piezoelectric material, so that the brittleness of the piezoelectric ceramic material and the temperature limit of the piezoelectric polymer material are overcome.
The invention has the beneficial effects that:
(1) By adopting a self-focusing mode of a wafer in the probe instead of lens focusing, the piezoelectric wafer self-focusing is realized by outputting higher energy, so that the optimal human focusing effect is achieved, and the detection capability is enhanced;
(2) The high epoxy phase composite material is adopted, so that the flexibility is realized, and the probe can be bent to a designed angle in the preparation process;
(3) Through the design of the convex wedge blocks and the design of the tool with corresponding radian, the flexible piezoelectric material is pressed and cured.
Drawings
FIG. 1 is a schematic diagram of a self-focusing phased array probe according to the present invention;
FIG. 2 is a front view of a self-focusing phased array probe provided in accordance with the present invention;
fig. 3 is a top view of a self-focusing phased array probe provided by the present invention.
In the figure: 1 probe casing, 2 self-focusing piezoelectric wafers, 3 sound guide blocks, 4 central locating holes, 5 water injection holes, 6 diversion trenches and 7 cable connectors.
Detailed Description
The invention is described in further detail below with reference to the figures and the embodiments.
As shown in fig. 1-3, a self-focusing phased array probe comprises a housing 1, a self-focusing piezoelectric wafer 2, a sound guide block 3, a center positioning hole 4 and a water injection hole 5, wherein the housing 1 is a cuboid joint, the self-focusing piezoelectric wafer 2 is mounted on the inner bottom surface of the lower end of the housing 1 through the sound guide block 3, a circle of rectangular diversion trench 6 is formed outside the lower end surface of the housing 1, the diversion trench 6 is communicated with the water injection hole 5 formed in the upper end surface of the housing 1, and a cable joint 7 is further mounted on the upper end surface of the housing 1 and connected with the self-focusing piezoelectric wafer 2 in the housing 1. The phased array probe is arranged on the holder through the central positioning hole, and the coupling agent is injected into the probe through the diversion trench. Compared with the traditional diversion holes, the diversion trench has obvious promotion of avoiding blockage, increasing flow velocity and the like.
The invention adopts phased array technology for thin-wall welding seams, can adopt multi-angle sector scanning to collect 2 and 3 times of reflected wave signals of the welding seams, and combines a B/C/S mode two-dimensional graph to display three-dimensional information of the welding seams in real time. The pipeline is circular, and the probe is placed on the pipeline with the cambered surface, so that the contact surface of the phased array probe is concave cambered to realize self-focusing scanning.
The invention also comprises a manufacturing process of the self-focusing piezoelectric wafer, which comprises the following steps:
step 1: cutting the piezoelectric wafer to a required size according to design parameters;
and 2, step: filling flexible materials in the cutting groove, wherein the materials are polyurethane or epoxy resin with the hardness of SHORE A40-60;
and 3, step 3: the piezoelectric wafer is clamped and positioned at the center position through a special positioning tool, and is pressurized through a special forming tool, so that the piezoelectric wafer is formed to the radian required by design, and the physical self-focusing of the piezoelectric wafer is realized;
and 4, step 4: the self-focusing piezoelectric wafer accurately measures the radian size in the range of design parameters under an optical projector;
and 5: the formed piezoelectric wafer is bonded with the convex sound guide block in an alignment way through a special tool;
and 6: the electrode lead-out of the self-focusing piezoelectric wafer is reliably butted with the cable;
and 7: and (5) encapsulating, assembling and testing the self-focusing phased array probe shell.
The invention also comprises a parameter determination method for the piezoelectric wafer for realizing self-focusing on the plane contact surface, which comprises the following specific contents:
step 1: calculation and simulation of piezoelectric wafer bending parameters
The bending parameters of the piezoelectric wafer, such as curvature, width, deformation and the like, determine the focal spot range of the piezoelectric wafer formed in a workpiece, simulate and calculate the rough focal spot range of the piezoelectric wafer with different curvatures in the depth range of the workpiece when the angle of a main sound beam of the piezoelectric wafer is calculated through engineering calculation software, such as CAD (computer aided design), inventor and the like, then select several groups of closer values, such as curvature, wafer number, wafer width and the like, of the focal range required by the welding seam of the project sheet within the range of 4-15 mm according to the actual range, input the values into Civa sound field simulation software, calculate the focal range obtained by each group of simulation, compare the results of each group of simulation with the actual requirements, and select the final bending parameters of the piezoelectric wafer.
And 2, step: test verification of piezoelectric wafer parameters
In order to compare and verify the test effect of the phased array ultrasonic probe on ferrite thin-wall butt-joint welding seams under different frequencies and different wafer sizes, two phased array ultrasonic probes are designed, wherein the probe 1 adopts a phased array probe with the frequency of 4MHz and the wafer spacing of 0.6mm, and is not self-focusing; the probe 2 adopts a phased array probe with the frequency of 5MHz and the wafer spacing of 0.31mm, and is self-focusing. The two probes are both transverse wave wedge blocks, and the nominal angle of the wedge blocks is 60 degrees. The results of actual measurement tests on 45 defects on 15 module test pieces show that 100% of defects can be detected by the self-focusing phased array probe, and 84% of defects can be detected by the non-self-focusing phased array probe.
And step 3: bending process of piezoelectric wafer
The piezoelectric ceramic and the piezoelectric polymer are compounded into the composite piezoelectric material, the brittleness of the piezoelectric ceramic material and the temperature limit of the piezoelectric polymer material can be overcome, and the density (rho), the acoustic impedance (Z) and the dielectric constant (epsilon) of the piezoelectric composite material are all reduced due to the addition of the flexible polymer phase; the figure of merit (dhgh) and the electromechanical coupling coefficient (k 1) of the composite material are improved.
The flexibility of the piezoelectric material is changed by compounding the traditional piezoelectric material and the high polymer from the wafer material, so that the preparation process of the piezoelectric composite material can be bent to a designed angle.
From the manufacturing process of the composite piezoelectric wafer, a tool is designed to enable the radian of the tool to be just the forming radian, a wedge block material is additionally designed to protrude the corresponding radian, and then the tool and the convex wedge block are used for pressurizing the flexible piezoelectric material to achieve the purpose of bending the flexible piezoelectric material to the specified thickness. And glue is coated between the convex wedge block and the piezoelectric composite material, and finally the glue is solidified and molded.
Claims (10)
1. The self-focusing phased array probe is characterized in that: including casing, self-focusing piezoelectric wafer, sound guide block, central locating hole and water injection hole, the casing connect for the cuboid, self-focusing piezoelectric wafer installs on the bottom surface in the casing lower extreme through sound guide block, and the terminal surface outside is equipped with the round guiding gutter under the casing, the water injection hole that guiding gutter and casing up end set up be linked together, still install cable joint on the casing up end, cable joint and the casing in self-focusing piezoelectric wafer be connected.
2. The self-focusing phased array probe of claim 1, wherein: the diversion trench is rectangular.
3. The self-focusing phased array probe of claim 1, wherein: the phased array probe is arranged on the holder through the central positioning hole, and the coupling agent is injected into the probe through the diversion trench.
4. A process for manufacturing a self-focusing piezoelectric wafer for use in the probe of claim 1, comprising the steps of:
step 1: cutting the piezoelectric wafer to a required size according to design parameters;
and 2, step: filling flexible materials in the cutting groove;
and step 3: positioning and pressurizing the piezoelectric wafer, and forming the piezoelectric wafer to the radian required by design so as to realize the physical self-focusing of the piezoelectric wafer;
and 4, step 4: accurately measuring the radian size of the self-focusing piezoelectric wafer obtained in the step (3) to ensure that the radian size is within the range of design parameters;
and 5: aligning and bonding the piezoelectric wafer obtained in the step (4) with the convex sound guide block;
step 6: the electrode lead-out of the self-focusing piezoelectric wafer is reliably butted with the cable.
5. A process for fabricating a self-focusing piezoelectric wafer as claimed in claim 4, wherein: the material in step 2 is polyurethane or epoxy resin with hardness SHORE A40-60.
6. The method for determining parameters of a self-focusing piezoelectric wafer of claim 4, comprising the steps of:
step 1: calculating and simulating the bending parameters of the piezoelectric wafer;
step 2: testing and verifying parameters of the piezoelectric wafer;
and 3, step 3: and (3) bending the piezoelectric wafer.
7. The method as claimed in claim 6, wherein the step 1 comprises the steps of calculating the bending parameters of the piezoelectric wafer such as curvature, width and deformation, simulating the focal spot rough range within the depth range of the workpiece when the main beam angle of the piezoelectric wafer with different curvatures is calculated through engineering calculation software, selecting several groups of closer values according to the actual range, inputting the values into Civa sound field simulation software, calculating the focal range obtained by each group of simulation, comparing the results of each group of simulation with the actual requirements, and selecting the final bending parameters of the piezoelectric wafer.
8. The method of claim 6 wherein said engineering calculation software includes CAD, inventor.
9. The method for determining parameters of a self-focusing piezoelectric wafer according to claim 6, wherein the step 2 comprises designing two phased array ultrasonic probes, wherein the first probe is a non-self-focusing phased array probe with a frequency of 4MHz and a wafer spacing of 0.6 mm; the second probe adopts a phased array probe with the frequency of 5MHz and the wafer spacing of 0.31mm, and is self-focused; the two probes are all transverse wave wedge blocks, the nominal angle of each wedge block is 60 degrees, and actual measurement tests are carried out on actual defects through the module test pieces.
10. A method of determining parameters of a self-focusing piezoelectric wafer in accordance with claim 6, wherein: and the step 3 comprises compounding the piezoelectric ceramic and the piezoelectric polymer to prepare the composite piezoelectric material, so that the brittleness of the piezoelectric ceramic material and the temperature limit of the piezoelectric polymer material are overcome.
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