CN115732605A - Display panel preparation method and display panel - Google Patents

Abstract

The invention discloses a display panel preparation method and a display panel, wherein the display panel preparation method comprises the following steps: providing a transfer substrate, wherein light-emitting elements are formed on the transfer substrate, and each light-emitting element comprises a body part and a first electrode connected to one side of the body part; forming a first stress slow-release layer at least on one side of the body part, which is far away from the transfer substrate; providing an array substrate, wherein the array substrate comprises a substrate and a plurality of mutually insulated second electrodes arranged on one side of the substrate; forming a second stress slow release layer at least on one side of the substrate base plate provided with the second electrode; aligning the first electrode of the transfer substrate with the second electrode of the array substrate; and separating the light-emitting element from the transfer substrate to enable the light-emitting element to fall on the array substrate, wherein the first stress slow-release layer is in contact with the second stress slow-release layer. The accuracy of the alignment connection of the first electrode of the follow-up light-emitting element and the second electrode of the array substrate is improved, and the transfer efficiency of the light-emitting element is improved.

Description

Display panel manufacturing method and display panel

technical field

The invention belongs to the technical field of electronic products, and in particular relates to a method for preparing a display panel and the display panel.

Background technique

Light Emitting Diodes (LEDs) are widely used in technical fields such as lighting and display due to their small size, low power, long service life, and high brightness. The micro LED display has an LED array of individual pixel elements. Compared with the currently widely used display devices, the micro LED display has better contrast, faster response speed, and lower energy consumption.

Since micro-LEDs are manufactured individually in the form of chips, the size of which is on the order of microns, therefore, in the process of manufacturing display devices, it is necessary to transfer a huge amount of micro-LED chips to the proper position of the array substrate. However, the inventors Long-term research has found that when the micro-LED falls from the transfer substrate to the array substrate, affected by the impact of the drop, the micro-LED is prone to problems such as bouncing off, unstable landing position, and offset rotation, which affects the success rate of transfer. .

Therefore, there is an urgent need for a new method for preparing a display panel and a display panel.

Contents of the invention

Embodiments of the present invention provide a method for manufacturing a display panel and a display panel, through which the first stress-releasing layer is in contact with the second stress-releasing layer, which can effectively offset the impact force generated when the light-emitting element falls. Avoid problems such as the light-emitting element being bounced off after impacting on the array substrate or the position of the landing point is unstable, resulting in misalignment and rotation, and the accuracy of the alignment connection between the first electrode of the subsequent light-emitting element and the second electrode of the array substrate is improved. The efficiency and accuracy of light emitting element transfer are improved.

Embodiments of the present invention provide a method for manufacturing a display panel on the one hand, including: providing a transfer substrate, on which light-emitting elements are formed, and each of the light-emitting elements includes a body part and a first connected to one side of the body part. An electrode; a first stress relief layer is formed at least on the side of the main body away from the transfer substrate, and in a direction perpendicular to the plane where the transfer substrate is located, the first stress relief layer is relatively opposite to the The first electrode protrudes away from the transfer substrate; an array substrate is provided, and the array substrate includes a base substrate and a plurality of mutually insulated second electrodes arranged on one side of the base substrate; at least on the The side of the base substrate on which the second electrode is provided forms a second stress relief layer, and in a direction perpendicular to the plane where the base substrate is located, the second stress relief layer is relatively opposite to the second The electrodes protrude in a direction away from the base substrate; the first electrode of the transfer substrate is aligned with the second electrode of the array substrate; the light-emitting element is separated from the transfer substrate, The light-emitting element is placed on the array substrate, and the first stress-releasing layer is in contact with the second stress-releasing layer.

According to one aspect of the present invention, the step of forming a first stress relief layer at least on the side of the main body part away from the transfer substrate includes: the first stress relief layer covers the first The electrode is away from the surface of the body part and fills the part of the body part exposed between the adjacent first electrodes of the same light emitting element. In order to improve the flatness of the first stress relief layer on the light-emitting element.

According to an aspect of the present invention, in the step of covering the surface of the first electrode on the side of the first electrode away from the body part with the first stress relief layer, it includes: The surface of the first stress-releasing layer facing away from the main body protrudes relative to the first electrode to a thickness of 0.1 μm˜2 μm. The protective effect of the first stress relief layer on the first electrode is enhanced.

According to one aspect of the present invention, the step of forming a second stress relief layer at least on the side of the base substrate on which the second electrode is provided includes: between the adjacent second electrodes The base substrate in between and the side of the second electrode away from the base substrate are covered with a second stress relief layer; preferably, along the direction perpendicular to the plane where the base substrate is located, located The second stress-releasing layer on the side of the second electrode away from the base substrate and the second stress-releasing layer between adjacent second electrodes are arranged flush with each other. In order to improve the flatness of the second stress relief layer on the base substrate.

According to one aspect of the present invention, after the step of separating the light-emitting element from the transfer substrate so that the light-emitting element falls on the array substrate, further comprising: heating and pressing the first The stress relief layer and the second stress relief layer move to expose the first electrode and the second electrode respectively, and electrically connect the first electrode and the second electrode. To realize the electrical connection between the first electrode and the second electrode.

According to an aspect of the present invention, in the step of forming the first stress relief layer at least on the side of the body part away from the transfer substrate, comprising: at least on the side of the body part away from the transfer substrate by means of coating or inkjet printing A first stress relief layer is formed on one side of the transfer substrate. to form a first stress relief layer on the body part.

According to one aspect of the present invention, in the step of providing a transfer substrate on which light-emitting elements are formed, it includes: forming an adhesive glue on one side of the transfer substrate; A light-emitting element is formed on one side of the transfer substrate. The transfer substrate and the light emitting element are connected by bonding glue.

According to one aspect of the present invention, the step of separating the light-emitting element from the transfer substrate includes: separating the light-emitting element from the adhesive by irradiating with a laser. to transfer the light-emitting elements on the transfer substrate to the array substrate.

Another aspect of the embodiments of the present invention provides a display panel, and the display panel is formed by the method for manufacturing a display panel described in any of the above embodiments.

According to another aspect of the present invention, the display panel includes: an array substrate, the array substrate includes a base substrate and a plurality of mutually insulated second electrodes provided on one side of the base substrate, The side is provided with a second stress relief layer at least partially surrounding the second electrode; a light-emitting element, each of which includes a body part and a first electrode connected to one side of the body part, in the body part One side is provided with a first stress relief layer at least partially surrounding the first electrodes, and the first electrodes of each light-emitting element are respectively electrically connected to the second electrodes. By arranging the first stress relief layer and the second stress relief layer, the impact force generated when the light-emitting element falls can be effectively offset.

Compared with the prior art, in the display panel manufacturing method provided by the embodiment of the present invention, the first stress relief layer is formed on the side of the main body away from the transfer substrate, and at the same time, the second electrode is provided on the same side of the base substrate. The second stress-releasing layer is formed, and when each light-emitting element on the transfer substrate falls on the array substrate, the contact between the first stress-releasing layer and the second stress-releasing layer can effectively offset the stress generated when the light-emitting element falls. impact. At the same time, the arrangement of the first stress-releasing layer and the second stress-releasing layer can also avoid the direct contact between the first electrode and the second electrode, and prevent the light-emitting element from being bounced off after impacting on the array substrate or the position of the landing point is unstable. Problems such as offset rotation improve the accuracy of alignment connection between the first electrode of the subsequent light-emitting element and the second electrode of the array substrate, and improve the efficiency and accuracy of light-emitting element transfer.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required in the embodiments of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.

FIG. 1 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

Fig. 2 is a schematic structural diagram during the preparation process of a display panel provided by an embodiment of the present invention;

Fig. 3 is a schematic structural diagram during the preparation process of another display panel provided by an embodiment of the present invention;

Fig. 4 is a schematic structural diagram during the preparation process of another display panel provided by an embodiment of the present invention;

Fig. 5 is a schematic structural diagram during the preparation process of another display panel provided by an embodiment of the present invention;

FIG. 6 is a schematic structural diagram during the preparation of another display panel provided by an embodiment of the present invention;

Fig. 7 is a schematic structural diagram during the preparation process of another display panel provided by an embodiment of the present invention;

Fig. 8 is a schematic structural diagram during the preparation process of another display panel provided by an embodiment of the present invention;

Fig. 9 is a schematic structural diagram during the preparation process of another display panel provided by an embodiment of the present invention;

FIG. 10 is a schematic structural diagram during the preparation process of another display panel provided by an embodiment of the present invention.

In the attached picture:

1-transfer substrate; 2-light-emitting element; 21-body part; 22-first electrode; 3-first stress release layer; 4-second electrode; 5-second stress release layer; 6-substrate ; T-drive transistor; S-source; D-drain; G-gate.

Detailed ways

The characteristics and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only configured to explain the present invention, not to limit the present invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or order between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the statement "comprising..." does not exclude the presence of additional same elements in the process, method, article or device comprising said element.

It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. And, if the part is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. Therefore, the present invention is intended to cover the modifications and variations of the present invention falling within the scope of the corresponding claims (technical solutions to be protected) and their equivalents. It should be noted that, the implementation manners provided in the embodiment of the present invention may be combined with each other if there is no contradiction.

Embodiments of the present invention provide a display panel and a display device, and various embodiments of the display panel and the display device will be described below with reference to the accompanying drawings.

Referring to FIG. 1 to FIG. 10, an embodiment of the present invention provides a method for manufacturing a display panel, including:

S110: As shown in FIG. 2 , provide a transfer substrate 1, on which a light-emitting element 2 is formed, and each light-emitting element 2 includes a body part 21 and a first electrode 22 connected to one side of the body part 21;

S120: As shown in FIG. 3 , form a first stress relief layer 3 at least on the side of the main body 21 facing away from the transfer substrate 1 , and in a direction perpendicular to the plane where the transfer substrate 1 is located, the first stress relief layer 3 is relatively The first electrode 22 protrudes away from the transfer substrate 1;

S130: As shown in FIG. 4 , provide an array substrate, the array substrate includes a base substrate 6 and a plurality of mutually insulated second electrodes 4 disposed on one side of the base substrate 6;

S140: As shown in FIG. 5 , form a second stress relief layer 5 at least on the side of the base substrate 6 where the second electrode 4 is provided, and in a direction perpendicular to the plane where the base substrate 6 is located, the second stress relief layer 5 The release layer 5 protrudes in a direction away from the base substrate 6 relative to the second electrode 4;

S150: As shown in FIG. 6 , align the first electrode 22 of the transfer substrate 1 with the second electrode 4 of the array substrate;

S160: As shown in FIG. 7 , separate the light emitting element 2 from the transfer substrate 1 , so that the light emitting element 2 falls on the array substrate, and the first stress relief layer 3 and the second stress relief layer 5 are in contact.

In the display panel manufacturing method provided by the embodiment of the present invention, the first stress relief layer 3 is formed on the side of the main body 21 facing away from the transfer substrate 1, and at the same time, the first stress release layer 3 is formed on the side of the base substrate 6 where the second electrode 4 is provided. The second stress relief layer 5, when each light emitting element 2 on the transfer substrate 1 falls on the array substrate, the first stress relief layer 3 and the second stress relief layer 5 are in contact, which can effectively counteract the fall of the light emitting element 2 the impact force produced. At the same time, the arrangement of the first stress relief layer 3 and the second stress relief layer 5 can also avoid the direct contact between the first electrode 22 and the second electrode 4, and prevent the light-emitting element 2 from being bounced off or dropped after hitting the array substrate. Unstable position leads to problems such as misalignment and rotation, which improves the accuracy of the alignment connection between the first electrode 22 of the subsequent light-emitting element 2 and the second electrode 4 of the array substrate, and improves the efficiency and accuracy of the transfer of the light-emitting element 2 .

In step S110, the light-emitting elements 2 on the transfer substrate 1 can be formed on a temporary substrate, and then transferred and fixed on the transfer substrate 1, and then each light-emitting element 2 is transferred to the array substrate through the transfer substrate 1, and passed through the array substrate. The light emitting element 2 is driven to emit light. It is also possible that the light-emitting element 2 is directly molded on the transfer substrate 1 , which can be set according to the actual situation, and no specific limitation is made here.

Specifically, the light emitting element 2 may be a Micro LED (Micro Light Emitting Diode, micro light emitting diode) or a Mini LED (miniature light emitting diode). Micro LED and Mini LED have the advantages of small size, high luminous efficiency and low energy consumption. The size of Micro LED is less than 50 μm, while the size of Mini LED is less than 100 μm, which can clearly display numbers and patterns on smaller display panels.

LED chip structure is divided into positive structure, vertical structure and flip structure. The embodiments of the present invention are applicable to LEDs with front-mounted structure, vertical structure and flip-chip structure, and the LEDs with flip-chip structure are used as examples in FIGS. 1 to 5 .

Optionally, the body portion 21 of the light emitting element 2 includes a sapphire substrate, an N-type GaN layer, an active layer, and a P-type GaN layer, and the first electrode 22 includes a P electrode and an N electrode.

In step S120, the first stress-releasing layer 3 can be specifically made of organic resin materials, such as OCA (Optically Clear Adhesive, optical adhesive) and other relatively soft and elastic materials, which can absorb light through their own deformation. The impact force formed when the element 2 falls acts as a buffer.

In step S130, the array substrate includes the base substrate 6 and a conductive layer. The conductive layer includes the second electrode 4, etc. The conductive layer can specifically be a single layer of metal such as silver, aluminum, molybdenum or a composite metal layer such as titanium, aluminum and titanium, or an oxide layer. Indium tin, transparent conductive polymer and other conductive materials, the scope is not limited.

The base substrate 6 can be a hard substrate, such as a glass substrate; it can also be a flexible substrate, and its material can be polyimide, polystyrene, polyethylene terephthalate, parylene, polyether Sulfone or polyethylene naphthalate. The base substrate 6 is mainly used to support devices disposed thereon. Each second electrode 4 of the conductive layer is used to connect with the light emitting element 2 to send a driving signal to each light emitting element 2 .

In step S140, a second stress relief layer 5 is formed at least on the side of the base substrate 6 where the second electrode 4 is provided, and the second stress relief layer 5 can be made of the same material as the first stress relief layer 3 made to reduce production costs. The second stress relief layer 5 and the first stress relief layer 3 may not cover the second electrode 4 and the first electrode 22 , so as to facilitate the subsequent electrical connection between the second electrode 4 and the first electrode 22 .

In step S150 , in order to accurately connect the subsequent light-emitting elements 2 and the second electrodes 4 , it is necessary to align the transfer substrate 1 and the array substrate so that the light-emitting elements 2 and the second electrodes 4 are disposed opposite to each other.

In step S160, the light-emitting element 2 is separated from the transfer substrate 1 by means of laser irradiation, so that the light-emitting element 2 falls on the array substrate under the action of its own gravity, and passes through the first stress relief layer 3 and the second stress relief layer 3. The slow-release layer 5 contacts to reduce the interaction force between the light-emitting element 2 and the array substrate and play a buffer role.

In order to realize the electrical connection between the first electrode 22 and the second electrode 4, the first stress relief layer 3 and the second stress relief layer 5 can be heated and pressed to the surroundings of the first electrode 22 and the second electrode 4. Space movement, that is, squeeze the first stress relief layer 3 and the second stress relief layer 5 apart, and remove the redundant first stress relief layer 3 and the second stress relief layer 5, so as to realize the first electrode 22 and the second electrode 22. The electrodes 4 are electrically connected. For details, reference may be made to the schematic diagram of the display panel after the first electrode 22 and the second electrode 4 are electrically connected as shown in FIG. 10 .

In order to further avoid problems such as misalignment of the light-emitting element 2 due to impact when falling, in some optional embodiments, as shown in FIG. In the step of releasing the layer 3, it includes: the first stress relief layer 3 covers the surface of the first electrode 22 on the side away from the body part 21 and fills the exposed part of the body between the adjacent first electrodes 22 of the same light emitting element 2 Section 21.

It should be noted that each part of the first stress relief layer 3 can be formed together to cover the first electrode 22 and the exposed part of the body part 21 between adjacent first electrodes 22 of the same light emitting element 2, thereby improving the performance of the light emitting element 2. The flatness of the side facing the array substrate is conducive to the smooth landing of the light-emitting element 2 on the array substrate, reducing the risk of the light-emitting element 2 being toppled or misaligned.

In order to improve the protective effect of the first stress relief layer 3 on the first electrode 22, in some optional embodiments, in the step of forming the first stress relief layer 3 at least on the side of the body part 21 away from the transfer substrate 1 , including: along the direction perpendicular to the plane where the transfer substrate 1 is located, the surface of the first stress relief layer 3 facing away from the body portion 21 protrudes relative to the first electrode 22 by a thickness of 0.1 μm˜2 μm.

It can be understood that the greater the thickness of the first stress relief layer 3 protruding relative to the first electrode 22, the greater the impact force that the first stress relief layer 3 can absorb, protecting the first electrode 22 from being damaged by force. , but the protruding thickness of the first stress relief layer 3 relative to the first electrode 22 is too large, which may also affect the subsequent connection effect between the first electrode 22 and the second electrode 4 . Therefore, in this embodiment, the surface of the first stress relief layer 3 facing away from the body portion 21 protrudes relative to the first electrode 22 by a thickness of 0.1 μm˜2 μm. Preferably, the surface of the first stress relief layer 3 facing away from the body part 21 protrudes relative to the first electrode 22 by a thickness of 0.8 μm˜1.8 μm.

Since a plurality of second electrodes 4 arranged at intervals are formed on the base substrate 6, there is a step difference between the second stress relief layer 5 and the second electrodes 4 between adjacent second electrodes 4, and there is unevenness. The problem of affecting the stability of the light-emitting element 2 when it falls on the base substrate 6 .

In order to avoid the above problems, as shown in FIG. 9 , in some optional embodiments, in the step of forming the second stress relief layer 5 at least on the side of the base substrate 6 where the second electrode 4 is provided, Including: the base substrate 6 between the adjacent second electrodes 4 is covered with the second stress relief layer 5 and the second electrode 4 is covered with the second stress relief layer 5, and is perpendicular to the base substrate 6 along the In the direction of the plane, the second stress relief layer 5 on the side of the second electrode 4 facing away from the base substrate 6 and the second stress relief layer 5 between adjacent second electrodes 4 are arranged flush.

It can be understood that the second stress relief layer 5 located on the side of the second electrode 4 away from the base substrate 6 and the second stress relief layer 5 located between adjacent second electrodes 4 are arranged flush, that is, located There is no level difference between the second stress relief layer 5 on the side of the second electrode 4 facing away from the base substrate 6 and the second stress relief layer 5 located between the adjacent second electrodes 4, so that a flat plane can be formed, In order to facilitate the light-emitting element 2 to fall on the second stress relief layer 5 smoothly.

In order to improve the protective effect of the second stress relief layer 5 on the second electrode 4, in some optional embodiments, in a direction perpendicular to the plane where the base substrate 6 is located, the second stress relief layer 5 is away from the backing The surface of one side of the base substrate 6 protrudes from the second electrode 4 to a thickness of 0.1 μm˜2 μm.

It can be understood that the greater the thickness of the second stress relief layer 5 protruding relative to the second electrode 4, the second stress relief layer 5 can absorb greater impact force, and protect the second electrode 4 from being damaged by force. , but the thickness of the second stress relief layer 5 protruding from the second electrode 4 is too large, which may also affect the connection effect between the subsequent first electrode 22 and the second electrode 4 . Therefore, in this embodiment, the surface of the second stress relief layer 5 facing away from the base substrate 6 protrudes from the second electrode 4 to a thickness of 0.1 μm to 2 μm. Preferably, the second stress relief layer 5 is away from the backing. The thickness of one side surface of the base substrate 6 protruding relative to the second electrode 4 is 1.1 μm˜1.9 μm.

Optionally, when the surface of the first stress relief layer 3 facing away from the body portion 21 protrudes from the first electrode 22 to a thickness of 1.0 μm to 1.8 μm, and the second stress relief layer 5 is facing away from the base substrate 6 When the protruding thickness of the surface relative to the second electrode 4 is 1.2 μm to 1.8 μm, long-term experimental research by the inventors has shown that it can effectively ensure that the light-emitting element 2 of the transfer substrate 1 falls on the array substrate smoothly, and the light-emitting element 2 will not be biased. Position, rotation, being bounced away, self-damage and other bad problems.

Since the first stress relief layer 3 and the second stress relief layer 5 are arranged between the first electrode 22 and the second electrode 4, the electrical connection between the first electrode 22 and the second electrode 4 is affected, as shown in FIG. 10 , In some optional embodiments, after the step of separating the light-emitting element 2 from the transfer substrate 1 so that the light-emitting element 2 falls on the array substrate, it further includes: heat and pressurize the first stress release layer 3 and the second stress relief layer 5 move to expose the first electrode 22 and the second electrode 4 respectively, and electrically connect the first electrode 22 and the second electrode 4 . Specifically, the first stress relief layer 3 and the second stress relief layer 5 can be extruded into the area adjacent to the first electrode 22 and the second electrode 4 by means of heating and pressure, and can be cut or The redundant first stress relief layer 3 and the second stress relief layer 5 are removed by scraping or the like, so that the first electrode 22 and the second electrode 4 can be directly contacted to realize electrical connection. It can be understood that this lighting mode is also applicable to the situation in FIG. 7 .

In order to form the first stress relief layer 3, optionally, in the step of forming the first stress relief layer 3 at least on the side of the body part 21 away from the transfer substrate 1, including: at least The first stress relief layer 3 is formed on the side of the first electrode 22 away from the body portion 21 .

The manufacturing method of inkjet printing is to first melt the material of the first stress relief layer 3 in a solvent to make it into the shape of ink, and the ink containing the material of the first stress relief layer 3 passes through the nozzle of the inkjet head to the first electrode. 22 to form the first stress relief layer 3, the manufacturing technology of inkjet printing is simpler in process, and the material utilization rate is relatively high.

In order to realize the driving of the light-emitting element 2, in some optional embodiments, in the step of providing the array substrate: the array substrate includes a plurality of pixel circuits, the pixel circuits include a driving transistor T, the second electrode 4 and the driving transistor T One of the source S and the drain D is electrically connected.

It should be noted that the driving transistor T may specifically be a thin film transistor, and the thin film transistor includes a gate G, a source S, and a drain D, and the materials of the drain D, the source S, and the gate G may include molybdenum, titanium, aluminum, One or more combinations of copper, etc. The gate G of the thin film transistor is generally used to receive a control signal, so that the thin film transistor is turned on or off under the control of the control signal. One of the source S and the drain D of the TFT is connected to the second electrode 4 , and then connected to the first electrode 22 of the light emitting element 2 through the second electrode 4 , so as to control the normal light emission of the light emitting element 2 .

Specifically, the light-emitting elements 2 on the transfer substrate 1 may have one-to-one correspondence with the pixel circuits of the array substrate, or may not correspond, that is, the light-emitting elements 2 are densely arranged, and the pixel circuits of the array substrate are sparse, or the light-emitting elements 2 may be sparse. , the pixel circuits of the array substrate are densely arranged, and there is no special limitation.

In order to effectively fix the light-emitting element 2 and facilitate subsequent separation, the step of providing the transfer substrate 1 includes: forming an adhesive on the side of the transfer substrate 1 ; forming the light-emitting element 2 on the side of the adhesive away from the transfer substrate 1 . Specifically, the bonding glue can use photoresist and other glue materials that are easy to separate. When photoresist is used as the adhesive, the photoresist has the property of being decomposed by light, which facilitates the transfer of light emitting element 2. Optionally, the step of separating the light emitting element 2 from the transfer substrate 1 includes: irradiating the light emitting element 2 with Separate the light-emitting element 2 from the adhesive. The adhesive can be quickly decomposed by laser irradiation, and the light-emitting element 2 and the transfer substrate 1 are separated, so that the light-emitting element 2 can move from the transfer substrate 1 to the array substrate.

As shown in FIG. 10 , an embodiment of the present invention further provides a display panel, which is formed by the method for manufacturing a display panel in any of the above-mentioned embodiments.

Optionally, the display panel includes: an array substrate, the array substrate includes a base substrate 6 and a plurality of mutually insulated second electrodes 4 disposed on one side of the base substrate 6, and at least partially surrounding the base substrate 6. The second stress relief layer 5 provided by the second electrode 4; the light-emitting element 2, each light-emitting element 2 includes a body part 21 and a first electrode 22 connected to one side of the body part 21, and at least part of the body part 21 is provided on the side of the body part 21 The first stress relief layer 3 is arranged around the first electrode 22 , and the first electrode 22 of each light emitting element 2 is electrically connected to the second electrode 4 respectively.

In the display panel provided by the embodiment of the present invention, the first stress relief layer 3 is formed on the side of the main body 21 facing away from the transfer substrate 1, and the second stress relief layer 3 is formed on the side of the base substrate 6 where the second electrode 4 is provided. The slow release layer 5, when each light-emitting element 2 on the transfer substrate 1 falls on the array substrate, through the contact between the first stress-releasing layer 3 and the second stress-releasing layer 5, can effectively offset the stress caused by the falling of the light-emitting element 2. impact force.

Therefore, the display panel provided by the embodiment of the present invention has the technical effect of the technical solution of the display panel manufacturing method in any of the above-mentioned embodiments, and the same or corresponding structures and terminology explanations of the above-mentioned embodiments will not be repeated here. The display panel provided by the embodiment of the present invention can be a mobile phone, or any electronic product with a display function, including but not limited to the following categories: TV sets, notebook computers, desktop monitors, tablet computers, digital cameras, smart bracelets , smart glasses, vehicle displays, medical equipment, industrial control equipment, touch interaction terminals, etc., which are not specifically limited in this embodiment of the present invention.

The above are only specific implementations of the present invention, and those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working process of the above-described systems, modules and units can be referred to in the foregoing method embodiments The corresponding process will not be repeated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present invention, and these modifications or replacements should cover all Within the protection scope of the present invention.

It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps may be performed in the order mentioned in the embodiment, or may be different from the order in the embodiment, or several steps may be performed simultaneously.

Claims (10)

1. A method for preparing a display panel, comprising: providing a transfer substrate, on which light-emitting elements are formed, each of the light-emitting elements includes a body part and a first electrode connected to one side of the body part; A first stress relief layer is formed at least on the side of the main body away from the transfer substrate, and in a direction perpendicular to the plane where the transfer substrate is located, the first stress relief layer is opposite to the first electrode protruding in a direction away from the transfer substrate; An array substrate is provided, and the array substrate includes a base substrate and a plurality of mutually insulated second electrodes disposed on one side of the base substrate; A second stress relief layer is formed at least on the side where the second electrode is provided on the base substrate, and in a direction perpendicular to the plane where the base substrate is located, the second stress relief layer is relatively The second electrode protrudes in a direction away from the base substrate; aligning the first electrode of the transfer substrate and the second electrode of the array substrate; The light-emitting element is separated from the transfer substrate, so that the light-emitting element falls on the array substrate, and the first stress-releasing layer is in contact with the second stress-releasing layer. 2. The method for manufacturing a display panel according to claim 1, wherein, in the step of forming a first stress-relieving layer at least on the side of the body portion away from the transfer substrate, comprising: The first stress relief layer covers the surface of the first electrode away from the body part and fills the part of the body part exposed between adjacent first electrodes of the same light emitting element. . 3. The method for manufacturing a display panel according to claim 2, characterized in that, in the step of covering the surface of the first electrode on the side away from the main body part with the first stress relief layer, comprising: In a direction perpendicular to the plane where the transfer substrate is located, the surface of the first stress relief layer facing away from the body portion protrudes relative to the first electrode by a thickness of 0.1 μm˜2 μm. 4. The method for manufacturing a display panel according to claim 1, wherein the step of forming a second stress relief layer at least on the side of the base substrate on which the second electrode is provided comprises: : A second stress relief layer is covered on the base substrate between adjacent second electrodes and on the side of the second electrode away from the base substrate; Preferably, in a direction perpendicular to the plane where the base substrate is located, the second stress relief layer located on the side of the second electrode away from the base substrate and the adjacent second stress release layer The second stress relief layer between the electrodes is arranged evenly. 5. The method for manufacturing a display panel according to claim 1, wherein after the step of separating the light-emitting element from the transfer substrate so that the light-emitting element falls on the array substrate, further include: The first stress release layer and the second stress release layer are moved by heating and pressing to expose the first electrode and the second electrode respectively, and the first electrode and the second The electrodes are electrically connected. 6. The method for manufacturing a display panel according to claim 1, characterized in that, in the step of forming a first stress relief layer at least on the side of the body part away from the transfer substrate, comprising: The first stress relief layer is formed at least on the side of the body portion away from the transfer substrate by coating or inkjet printing. 7. The method for manufacturing a display panel according to claim 1, characterized in that, in the step of providing a transfer substrate on which a light-emitting element is formed, comprising: forming an adhesive on one side of the transfer substrate; A light-emitting element is formed on the side of the adhesive glue away from the transfer substrate. 8. The method for manufacturing a display panel according to claim 7, wherein the step of separating the light-emitting element from the transfer substrate comprises: The light-emitting element and the adhesive are separated by laser irradiation. 9. A display panel, characterized in that the display panel is prepared by the method for manufacturing a display panel according to any one of claims 1 to 8. 10. The display panel according to claim 9, comprising: An array substrate, the array substrate includes a base substrate and a plurality of mutually insulated second electrodes arranged on one side of the base substrate, and at least partially surrounding the second electrodes on the side of the base substrate The second stress relief layer; A light emitting element, each of the light emitting elements includes a body part and a first electrode connected to one side of the body part, and a first stress relief layer at least partially surrounding the first electrode is provided on one side of the body part , the first electrodes of each of the light emitting elements are respectively electrically connected to the second electrodes.

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