CN115732167A - Inductance device - Google Patents

Abstract

An inductance device includes a first inductance, a second inductance and a connection part. The first inductor includes a first wire and a second wire. One of the first routing and the second routing has a spiral shape. The second inductor includes a third wire and a fourth wire. The third routing and the fourth routing are symmetrical to each other. The connection part is used for coupling the first inductor and the second inductor.

Description

Inductive device

technical field

The present disclosure relates to an electronic device, and more particularly to an inductive device.

Background technique

Various existing inductors have their advantages and disadvantages. For example, a spiral inductor has a high Q value and a large mutual inductance. For spiral inductors/transformers, it is difficult to avoid coupling effects with other devices. For the figure-eight inductor/transformer, it has two sets of coils, and the coupling between the two sets of coils is relatively low. However, the figure-eight inductor/transformer occupies a large area in the device. In addition, when the figure-eight inductor/transformer is designed as a symmetrical structure, the capacitance between the differential signals will greatly increase the parasitic capacitance due to the traditional interleaved structure. Therefore, the application ranges of the above-mentioned inductors/transformers are limited.

Contents of the invention

A technical implementation of the present disclosure relates to an inductance device, which includes a first inductor, a second inductor and a connection part. The first inductor includes a first wire and a second wire. One of the first routing and the second routing has a spiral shape. The second inductor includes a third wire and a fourth wire. The third routing and the fourth routing are symmetrical to each other. The connection part is used for coupling the first inductor and the second inductor.

Therefore, according to the technical content of the present disclosure, due to the configuration of the inductance device shown in the embodiment of the present disclosure, the parasitic capacitance of the device can be reduced, because the differential signal (differential signal) input signal on the same side of the symmetrical circuit, such as a positive voltage signal or a negative Voltage signal (P or N), use its positive voltage signal adjacent (P and P adjacent) design to avoid the traditional negative voltage signal and positive and negative voltage signal adjacent (N/P adjacent) caused by capacitance . As a result, the configuration of the inductance device shown in the embodiments of the present disclosure can also improve the quality factor (Q value) and improve the symmetry of the overall structure due to the reduction of the parasitic capacitance.

Description of drawings

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more comprehensible, the accompanying drawings are described as follows:

FIG. 1 is a schematic diagram illustrating an inductor device according to an embodiment of the disclosure.

FIG. 2 is a schematic diagram illustrating a partial structure of the inductance device shown in FIG. 1 according to an embodiment of the present disclosure.

FIG. 3 is a schematic diagram illustrating a partial structure of the inductance device shown in FIG. 1 according to an embodiment of the present disclosure.

FIG. 4 is a schematic diagram illustrating a partial structure of the inductance device shown in FIG. 1 according to an embodiment of the present disclosure.

FIG. 5 is a schematic diagram illustrating an inductance device according to an embodiment of the disclosure.

FIG. 6 is a schematic diagram illustrating an inductance device according to an embodiment of the disclosure.

FIG. 7 is a schematic diagram illustrating an inductance device according to an embodiment of the disclosure.

FIG. 8 is a schematic diagram illustrating experimental data of an inductance device according to an embodiment of the disclosure.

In accordance with common practice, the various features and elements in the drawings have not been drawn to scale, but rather have been drawn in order to best present the specific features and elements relevant to the present disclosure. Furthermore, the same or similar reference numerals refer to similar elements/components in different drawings.

Symbol Description

1000, 1000A～1000C: inductance device

1100, 1100A～1100C: the first inductance

1110, 1110A～1110C: the first routing

1111, 1111A～1111C: Partial wiring

1112, 1112A～1112C: Partial wiring

1120, 1120A～1120C: the second wiring

1121, 1121A～1121C: Partial wiring

1122, 1122A～1122C: Partial wiring

1130, 1130A～1130C: the first input and output terminals

1140, 1140A～1140C: connectors

1150, 1150A～1150C: the second input and output terminals

1160, 1160A～1160C: connectors

1200, 1200A～1200C: Second inductance

1210, 1210A～1210C: the third wiring

1220, 1220A～1220C: the fourth routing

1230, 1230A～1230C: the third input and output terminal

1240, 1240A～1240C: connectors

1250, 1250A～1250C: the fourth input and output terminal

1260, 1260A～1260C: connectors

1270, 1270A～1270C: connectors

1280, 1280A～1280C: central tap end

1290, 1290A～1290C: connectors

1300, 1300A～1300C: connection part

1310, 1310A～1310C: the first connection part

1320, 1320A～1320C: the second connection part

1330, 1330A～1330C: connectors

A～L: node

Detailed ways

In order to make the description of the present disclosure more detailed and complete, the following provides an illustrative description of the implementation modes and specific examples of the present disclosure; but this is not the only form for implementing or using the specific embodiments of the present disclosure. The description covers features of various embodiments as well as method steps and their sequences for constructing and operating those embodiments. However, other specific embodiments can also be used to achieve the same or equivalent functions and step sequences.

Unless otherwise defined in this specification, the meanings of scientific and technical terms used herein are the same as those commonly understood and commonly used by those skilled in the art to which this disclosure belongs. In addition, the singular nouns used in this specification include the plural forms of the nouns, and the plural nouns used also include the singular forms of the nouns, unless the context conflicts with the context.

FIG. 1 is a schematic diagram illustrating an inductive device 1000 according to an embodiment of the disclosure. As shown in the figure, the inductor device 1000 includes a first inductor 1100 , a second inductor 1200 and a connection part 1300 . The first inductor 1100 includes a first wire 1110 and a second wire 1120 . The second inductor 1200 includes a third wire 1210 and a fourth wire 1220 . As shown in the figure, the connection part 1300 located in the central area can be used to couple the first inductor 1100 and the second inductor 1200 .

In order to understand the structure of the inductance device 1000 shown in FIG. 1 , please refer to FIGS. 2 to 4 together. 2 to 4 are schematic diagrams illustrating a partial structure of the inductance device 1000 shown in FIG. 1 according to an embodiment of the present disclosure. Please refer to FIG. 2 , in one embodiment, the shape of one of the partial traces 1112 of the first trace 1110 and the partial trace 1121 of the second trace 1120 may be a spiral shape. For example, the shape of any one of the partial traces 1112 and the partial traces 1121 can be spiral, or both of them can be spiral.

Please refer to FIG. 3 , in one embodiment, the third routing 1210 and the fourth routing 1220 are symmetrical to each other. In detail, the third wiring 1210 and the fourth wiring 1220 may be symmetrical to each other based on the central area of the inductor device 1000 .

In one embodiment, the partial structure of the inductive device 1000 shown in FIG. 2 is located on the first layer, the partial structure of the inductive device 1000 shown in FIG. 3 is located on the second layer, and the partial structure of the inductive device 1000 shown in FIG. 4 Located on the third floor. For example, referring to FIG. 2 , a portion of the trace 1112 of the first trace 1110 , a portion of the trace 1121 of the second trace 1120 , and a portion of the connection portion 1320 of the connection portion 1300 are located on the first layer.

Furthermore, please refer to FIG. 3 , part of the wire 1111 of the first wire 1110 , part of the wire 1122 of the second wire 1120 , the third wire 1210 and the fourth wire 1220 are located on the second layer. In addition, referring to FIG. 4 , the first connection part 1310 of the connection part 1300 is located on the third floor. In addition, the third layer shown in FIG. 4 is also equipped with a plurality of connectors 1140 , 1160 , 1240 , 1260 , 1270 , 1290 , input and output terminals 1230 , 1250 and a central tap terminal 1280 . The above structures will be described in detail later. As mentioned above, all the structures of the inductive device 1000 of the present disclosure are configured in three layers. Compared with the existing inductive device that requires four layers to complete the configuration of all structures, the inductive device 1000 of the present disclosure can save area and volume etc., and it can be completed with only a three-layer structure, which is very convenient for the design of circuit layout.

In one embodiment, the first trace 1110 may be a first spiral trace 1110, and the first spiral trace 1110 is disposed on the first layer and the second layer. For example, part of the routing 1112 of the first spiral routing 1110 is arranged on the first layer shown in FIG. 2 , and part of the routing 1111 of the first spiral routing 1110 is arranged on the second layer shown in FIG. 3 .

In another embodiment, the first inductor 1100 further includes a first input and output terminal 1130 and a first connecting member 1140 . The first input and output terminal 1130 is disposed on the first floor of FIG. 2 , and the first connecting member 1140 is disposed on the third floor of FIG. 4 . On the connection structure, the node A of the first input and output end 1130 in FIG. 2 is coupled to the node A of the first connector 1140 in FIG. It is disposed at the node B of the partial trace 1111 of the first spiral trace 1110 in FIG. 3 . Then, the node C of the partial trace 1111 of the first spiral trace 1110 is coupled to the node C of the partial trace 1112 of the first spiral trace 1110 in FIG. 2 .

In one embodiment, the second trace 1120 can be a second spiral trace 1120 , and the second spiral trace 1120 is disposed on the first layer and the second layer. For example, part of the routing 1121 of the second spiral routing 1120 is arranged on the first layer shown in FIG. 2 , and part of the routing 1122 of the second spiral routing 1120 is arranged on the second layer shown in FIG. 3 .

In another embodiment, the first inductor 1100 further includes a second input and output terminal 1150 and a second connecting member 1160 . The second input and output terminal 1150 is disposed on the first floor of FIG. 2 , and the second connecting member 1160 is disposed on the third floor of FIG. 4 . In connection structure, the second input-output terminal 1150 in FIG. 2 is coupled to the part of the trace 1121 of the second spiral trace 1120 also in FIG. 2 . Then, the node D of the partial trace 1121 of the second spiral trace 1120 is coupled to the node D of the partial trace 1122 of the second spiral trace 1120 in FIG. 3 . Then, the node E of the part of the trace 1122 of the second spiral trace 1120 is coupled to the node E of the second connecting member 1160 provided in FIG. 4 .

Next, the node F of the second connecting member 1160 is coupled to the node F of the partial trace 1121 of the second spiral trace 1120 in FIG. 2 . Then, the node G of the part of the trace 1121 of the second spiral trace 1120 is coupled to the node G of the connector 1330 in FIG. 3 . Then, the node H of the connector 1330 is coupled to the node H of the first connection part 1310 of the connection part 1300 in FIG. Node I of the partial trace 1112 of the first spiral trace 1110 in FIG. 2 .

In one embodiment, the second inductor 1200 further includes a third input and output terminal 1230 and a third connecting element 1240 . The third input and output terminal 1230 is disposed on the third floor of FIG. 4 , and the third connecting member 1240 is disposed on the third floor of FIG. 4 . In the connection structure, the node J arranged at the third input and output terminal 1230 in FIG. 4 is coupled to the node J arranged at the fourth wiring 1220 in FIG. The third connecting element 1240 is cross-coupled with the fourth wiring 1220 also located on the second layer.

In another embodiment, referring to FIG. 1 , a portion of the trace 1121 of the second spiral trace 1120 on the first layer partially overlaps with a fourth trace 1220 on the second layer.

In one embodiment, the second inductor 1200 further includes a fourth input and output terminal 1250 and a fourth connecting member 1260 . The fourth input and output terminal 1250 is disposed on the third floor of FIG. 4 , and the fourth connecting member 1260 is disposed on the third floor of FIG. 4 . In the connection structure, the node K of the fourth input and output terminal 1250 in FIG. 4 is coupled to the node K of the fourth wiring 1220 in FIG. It is cross-coupled with the fourth wiring 1220 also located on the second layer. In another embodiment, the third connection part 1240 and the fourth connection part 1260 are located on different sides of the second inductor 1200 . For example, the third connection part 1240 and the fourth connection part 1260 are respectively located on the lower side and the upper side of the second inductor 1200 .

In another embodiment, in the central region of the inductor device 1000 (for example, the center of the structure in the figure), the third wiring 1210 disposed on the second layer of FIG. 3 is coupled to the fourth wiring also located on the second layer. 1220.

In one embodiment, the second inductor 1200 further includes a fifth connecting element 1270 , and the fifth connecting element 1270 is disposed on the third layer in FIG. 4 . On the connection structure, the third wiring 1210 disposed in FIG. 3 is cross-coupled with the third wiring 1210 also located in the second layer through the fifth connecting member 1270 in FIG. 4 .

In another embodiment, referring to FIG. 1 , a portion of the trace 1112 of the first spiral trace 1110 on the first layer partially overlaps with a third trace 1210 on the second layer.

In one embodiment, the second inductor 1200 further includes a central tap terminal 1280 , and the central tap terminal 1280 is disposed on the third layer in FIG. 4 . In connection structure, the node L disposed on the central tap end 1280 in FIG. 4 is coupled to the node L disposed on the third trace 1210 in FIG. 3 .

In another embodiment, referring to FIG. 1 , the central tap terminal 1280 is symmetrically arranged with the third input and output terminal 1230 and the fourth input and output terminal 1250 based on the central area of the inductive device 1000 (such as the center of the structure in the figure). .

In one embodiment, the second inductor 1200 further includes a sixth connection element 1290 , and the sixth connection element 1290 is disposed on the third layer in FIG. 4 . In the connection structure, the third wiring 1210 disposed in FIG. 3 is cross-coupled with the third wiring 1210 also located in the second layer through the sixth connecting member 1290 in FIG. 4 . In another embodiment, the fifth connection part 1270 and the sixth connection part 1290 are on different sides of the second inductor 1200 . For example, the fifth connection part 1270 and the sixth connection part 1290 are respectively located on the upper side and the lower side of the second inductor 1200 .

In another embodiment, the connection part 1300 further includes a second connection part 1320, and the second connection part 1320 is disposed on the first layer in FIG. 2 . Please refer to FIG. 1 , in the central region of the inductive device 1000 (for example, the center of the structure in the figure), the third wiring 1210 on the second layer is coupled to the fourth wiring on the second layer through the second connecting portion 1320 1220. It should be noted that the present disclosure is not limited to the embodiments shown in FIG. 1 to FIG. 4 , which are only used to exemplarily show one of implementations of the present disclosure.

FIG. 5 is a schematic diagram illustrating an inductive device 1000A according to an embodiment of the disclosure. Compared with the inductive device 1000 shown in FIG. 1 , the structural configuration of the inductive device 1000A in FIG. 5 is slightly different, and details are as follows.

Please refer to FIG. 5 , the structure between the first wiring 1110A and the third wiring 1210A of the inductance device 1000A is adjusted so that the fifth connecting member 1270A in the upper left corner of the figure can be arranged on the first layer, and the figure The sixth connecting element 1290A at the lower left corner can be disposed on the first layer.

In addition, the structure between the second wiring 1120A and the fourth wiring 1220A of the inductance device 1000A is adjusted so that the fourth connecting element 1260A in the upper right corner of the figure can be arranged on the first layer, and the fourth connecting element 1260A in the lower right corner of the figure can be arranged on the first layer. The third connecting member 1240A can be disposed on the first layer. It should be noted that, in the embodiment of FIG. 5 , the component numbers are similar to those in FIG. 1 , and have similar structural and electrical operation features. For the sake of brevity, details are not repeated here. In addition, the present disclosure is not limited to the embodiment shown in FIG. 5 , which is only used to exemplarily show one of implementations of the present disclosure.

FIG. 6 is a schematic diagram illustrating an inductance device 1000B according to an embodiment of the disclosure. Compared with the inductive device 1000 shown in FIG. 1 , the structural configuration of the inductive device 1000B in FIG. 6 is slightly different, and details are as follows.

Please refer to FIG. 6 , the structure between the first wiring 1110B and the third wiring 1210B of the inductance device 1000B is adjusted so that the fifth connecting member 1270B in the upper left corner of the figure can be arranged on the first layer, and the figure The sixth connecting element 1290B at the lower left corner can be disposed on the first layer.

In addition, the structure between the second wiring 1120B and the fourth wiring 1220B of the inductance device 1000B is adjusted so that the fourth connecting member 1260B in the upper right corner of the figure can be arranged on the first layer, and the fourth connecting member 1260B in the lower right corner of the figure can be arranged on the first layer. The third connecting member 1240B can be disposed on the first layer. It should be noted that, in the embodiment of FIG. 6 , the component numbers are similar to those in FIG. 1 , and have similar structural and electrical operation characteristics. In addition, the present disclosure is not limited to the embodiment shown in FIG. 6 , which is only used to exemplarily show one of implementations of the present disclosure.

FIG. 7 is a schematic diagram illustrating an inductance device 1000C according to an embodiment of the disclosure. Compared with the inductive device 1000 shown in FIG. 1 , the structural configuration of the inductive device 1000C in FIG. 7 is slightly different, and details are as follows.

Please refer to FIG. 7 , the structure between the first wiring 1110C and the third wiring 1210C of the inductance device 1000C is adjusted so that the fifth connecting member 1270C in the upper left corner of the figure can be arranged on the first layer, and the figure The sixth connecting element 1290C at the lower left corner can be disposed on the first layer.

In addition, the structure between the second wiring 1120C and the fourth wiring 1220C of the inductance device 1000C is adjusted so that the fourth connecting element 1260C in the upper right corner of the figure can be arranged on the first layer, and the fourth connecting element 1260C in the lower right corner of the figure can be arranged on the first layer. The third connecting member 1240C may be disposed on the first layer.

Furthermore, the input and output terminals 1230C and 1250C of the inductor device 1000C can be disposed on the first layer, and the input and output terminals 1230C and 1250C are coupled to the third sub-trace 1210C. In addition, the central tap end 1280C of the inductor device 1000C can be disposed on the first layer, and the central tap end 1280C is coupled to the fourth sub-wire 1220C. It should be noted that, in the embodiment of FIG. 7 , the component numbers are similar to those in FIG. 1 , and have similar structural and electrical operation characteristics. In addition, the present disclosure is not limited to the embodiment shown in FIG. 7 , which is only used to exemplarily show one of implementations of the present disclosure.

FIG. 8 is a schematic diagram illustrating experimental data of an inductance device according to an embodiment of the disclosure. As shown in the figure, the experimental curves of quality factors without the inductor device of the present disclosure are respectively C1 and C2, while the experimental curves of the quality factors of the inductor device of the present disclosure are respectively C3 and C4. It can be seen from the figure that the inductor device of the present disclosure has a better quality factor.

Although the specific embodiments of the present disclosure are disclosed in the above embodiments, they are not intended to limit the present disclosure. Those skilled in the art to which the present disclosure pertains can, without departing from the principles and concepts of the present disclosure, Various changes and modifications are made, so the protection scope of the present disclosure should be defined by the appended claims.

Claims (10)

1. An inductive device, comprising:

a first inductor, comprising:

a first wire; and

a second trace, wherein a shape of one of the first trace and the second trace comprises a spiral;

a second inductor, comprising:

a third wire; and

a fourth trace, wherein the third trace and the fourth trace are symmetrical to each other; and

a connecting portion for coupling the first inductor and the second inductor.

2. The inductive device of claim 1, wherein the first inductor and the second inductor are located on a first layer and a second layer, and the connection portion is located on the first layer and a third layer.

3. The inductive device of claim 2, wherein the first trace comprises a first spiral trace, wherein the first spiral trace is disposed on the first layer and the second layer;

wherein the first inductor further comprises:

a first input/output end arranged on the first layer and coupled to the first spiral routing on the second layer, and coupled to the first spiral routing on the first layer by the first spiral routing on the second layer; and

and a first connecting piece arranged on the third layer, wherein the first input/output end is coupled with the first spiral routing on the second layer through the first connecting piece.

4. The inductive device of claim 3, wherein the second trace comprises a second spiral trace, wherein the second spiral trace is disposed on the first layer and the second layer;

wherein the first inductor further comprises:

a second I/O port disposed on the first layer and coupled to the second spiral trace on the first layer, and coupled to the second spiral trace on the second layer by the second spiral trace on the first layer; and

a second connecting element disposed on the third layer, wherein the second spiral trace on the second layer is coupled to the second spiral trace on the first layer via the second connecting element;

wherein the connecting portion includes:

a first sub-connection portion for coupling the second spiral trace on the first layer and the first spiral trace on the first layer.

5. The inductive device of claim 4, wherein the second inductor further comprises:

a third input/output end arranged on the third layer and coupled to the fourth wire on the second layer; and

and a third connecting member disposed on the third layer, wherein the fourth trace on the second layer is cross-coupled to the fourth trace on the second layer via the third connecting member.

6. The inductive device of claim 5, wherein the second spiral trace on the first layer partially overlaps the fourth trace on the second layer.

7. The inductive device of claim 6, wherein the second inductor further comprises:

a fourth input/output end disposed on the third layer and coupled to the fourth trace on the second layer; and

a fourth connecting member disposed on the third layer, wherein the fourth trace on the second layer is cross-coupled to the fourth trace on the second layer via the fourth connecting member, and the third connecting member and the fourth connecting member are disposed on different sides of the second inductor;

wherein the third trace on the second layer is coupled to the fourth trace on the second layer in a central region of the inductor device.

8. The inductive device of claim 7, wherein the second inductor further comprises:

and a fifth connection element disposed on the third layer, wherein the third trace on the second layer is cross-coupled to the third trace on the second layer via the fifth connection element, and the first spiral trace on the first layer partially overlaps the third trace on the second layer.

9. The inductive device of claim 8, wherein the second inductor further comprises:

and a central tap end disposed on the third layer and coupled to the third trace on the second layer, wherein the central tap end is configured symmetrically with the third input/output end and the fourth input/output end with the central area as a reference.

10. The inductive device of claim 9, wherein the second inductor further comprises:

a sixth connecting member disposed on the third layer, wherein the third trace on the second layer is cross-coupled to the third trace on the second layer via the sixth connecting member, and the fifth connecting member and the sixth connecting member are disposed on different sides of the second inductor;

wherein the connecting portion further comprises:

and a second connection portion disposed on the first layer, wherein the third trace on the second layer is coupled to the fourth trace on the second layer through the second connection portion in the central region of the inductor device.

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