CN115725947B - Substrate supporting and fixing mechanism and thin film deposition equipment - Google Patents
Substrate supporting and fixing mechanism and thin film deposition equipment Download PDFInfo
- Publication number
- CN115725947B CN115725947B CN202111014690.2A CN202111014690A CN115725947B CN 115725947 B CN115725947 B CN 115725947B CN 202111014690 A CN202111014690 A CN 202111014690A CN 115725947 B CN115725947 B CN 115725947B
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- cover ring
- substrate
- stopper
- annular
- main body
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- 239000000758 substrate Substances 0.000 title claims abstract description 109
- 230000007246 mechanism Effects 0.000 title claims abstract description 27
- 238000000427 thin-film deposition Methods 0.000 title claims description 27
- 239000013077 target material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 9
- 230000000903 blocking effect Effects 0.000 description 17
- 239000007789 gas Substances 0.000 description 10
- 239000012495 reaction gas Substances 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a substrate bearing and fixing mechanism, which mainly comprises a baffle piece, a cover ring and a bearing plate, wherein the baffle piece is used for bearing the cover ring. The annular bottom of the baffle member is connected with the side wall and the annular convex part, and an opening is formed on the radial inner side of the annular convex part. The bearing plate is used for bearing a substrate, wherein the bearing plate is positioned below the cover ring and can enter the opening of the baffle piece. The cover ring comprises a main body part and a shielding part, wherein the main body part is an annular body, and part of the main body part covers the opening of the baffle. The shielding part is connected with the radial outer side of the main body part and protrudes towards the annular bottom of the baffle piece, wherein the distance between the shielding part of the cover ring and the side wall of the baffle piece is 3-10 mm, so that the process gas or target atoms can be prevented from being transmitted to the outside of the baffle piece through the gap between the cover ring and the baffle piece.
Description
Technical Field
The invention relates to a substrate bearing and fixing mechanism which is used for fixing a substrate on a bearing plate and reducing the pollution of process gas or target atoms to a cavity.
Background
Chemical Vapor Deposition (CVD), physical Vapor Deposition (PVD), and Atomic Layer Deposition (ALD) are common thin film deposition equipment and are commonly used in the manufacture of integrated circuits, light emitting diodes, and displays.
The deposition equipment mainly comprises a cavity and a bearing disc, wherein the bearing disc is positioned in the cavity and is used for bearing at least one substrate. Taking physical vapor deposition as an example, a target needs to be disposed in the chamber, wherein the target faces the substrate on the carrier plate. When physical vapor deposition is carried out, the substrate is fixed on the bearing plate through the fixing device, inert gas and/or reaction gas are conveyed into the cavity, bias voltages are respectively applied to the target and the bearing plate, and the bearing plate can heat the bearing substrate. The inert gas in the chamber forms ionized inert gas due to the high voltage electric field. The ionized inert gas is attracted to the bias on the target and bombards the target. Target atoms or molecules sputtered from the target are attracted by the bias on the carrier platter and deposit on the surface of the heated substrate to form a thin film on the surface of the substrate.
In addition, when the physical vapor deposition process is performed, the bearing plate can be displaced relative to the target, and the distance between the substrate borne by the bearing plate and the target is changed so as to adjust the parameters of the deposition process.
Disclosure of Invention
As described in the prior art, conventional thin film deposition apparatus can change the parameters of the deposition process by adjusting the distance between the carrier plate and the target. However, the distance between the carrier plate and the target in the conventional thin film deposition apparatus can be adjusted to a small extent, and when the carrier plate is displaced toward the target, the process gas and/or the target atoms and/or the target molecules may be transferred to the chamber, and thin film deposition is formed on the inner surface of the chamber, thereby polluting the chamber. Therefore, the invention provides a novel substrate bearing and fixing mechanism and a thin film deposition device using the same, which can increase the adjustable range of the distance between the bearing plate and the target material and reduce the entry of process gas and/or target material atoms and/or target material molecules into the cavity.
An objective of the present invention is to provide a substrate supporting and fixing mechanism and a thin film deposition apparatus, which mainly includes a supporting plate, a cover ring and a blocking member, wherein the supporting plate is used for supporting at least one substrate. The baffle is used for bearing the cover ring, and when the bearing plate drives the bearing substrate to approach towards the direction of the cover ring, the cover ring contacts the substrate so as to fix the substrate on the bearing plate, and a reaction space is formed among the baffle, the cover ring, the bearing plate and/or the cavity.
The spacing between the side edge of the cover ring and the baffle piece is smaller than 10 mm, so that the shielding effect of the cover ring and the baffle piece on the cavity is improved, and the reaction gas, target atoms and/or target molecules in the reaction space can be prevented from contacting the cavity outside the cover ring and/or the baffle piece, so that the film deposition on the inner surface of the cavity is reduced.
In addition, the bearing disc can drive the bearing substrate and the cover ring to continuously approach to the direction of the target, so that the cover ring leaves the baffle piece, and the distance between the substrate and the target is further shortened. Because the distance between the cover ring and the baffle piece is smaller, even if the cover ring leaves the baffle piece, the cover ring and the baffle piece can still provide good shielding effect, and the reaction gas, target atoms and/or target molecules in the reaction space can be prevented from being transmitted to the cavity outside the cover ring and/or the baffle piece.
An object of the present invention is to provide a substrate supporting and fixing mechanism and a thin film deposition apparatus, wherein the cover ring includes a first cover ring and a second cover ring, and the radius of the first cover ring is larger than that of the second cover ring, and is used for supporting the second cover ring. When the bearing plate is contacted with the cover ring, only the second cover ring is contacted with the substrate on the bearing plate, and the bearing plate is used for bearing the first cover ring. The design of the first cover ring and the second cover ring can reduce the pressure exerted by the cover ring on the substrate and reduce the probability of crushing the substrate by the cover ring.
In order to achieve the above-mentioned objective, the present invention provides a substrate bearing and fixing mechanism, comprising a blocking member, a cover ring, a shielding portion and a bearing plate, wherein the blocking member comprises a side wall, an annular bottom and an annular protruding portion, the annular bottom is connected with the side wall and the annular protruding portion, an opening is formed on the radial inner side of the annular protruding portion, the cover ring is used for being placed on the blocking member, the cover ring comprises a main body portion, the main body portion is an annular body, a part of the main body portion is located at the extending position of the opening of the blocking member, the shielding portion is connected with the radial outer side of the main body portion, the shielding portion comprises a first protruding portion protruding towards the annular bottom of the blocking member or protruding towards the direction away from the annular bottom of the blocking member, the distance between the shielding portion and the side wall of the blocking member is 3-10 mm, the bearing plate comprises a bearing surface used for bearing a substrate, and the bearing plate is located below the cover ring.
The invention provides thin film deposition equipment, which comprises a cavity, a substrate bearing and fixing mechanism, a cover ring and a shielding part, wherein the cavity comprises a containing space, the substrate bearing and fixing mechanism is located in the containing space and comprises a blocking piece, the blocking piece comprises a side wall, an annular bottom and an annular protruding part, the side wall is connected with the cavity, the annular bottom is connected with the side wall and the annular protruding part, an opening is formed in the radial inner side of the annular protruding part, the cover ring is used for being placed on the blocking piece and comprises a main body part which is an annular body, part of the main body part is located at the extending position of the opening of the blocking piece, the shielding part is connected with the radial outer side of the main body part and comprises a first protruding part protruding towards the direction of the annular bottom of the blocking piece, the distance between the shielding part and the side wall of the blocking piece is 3-10 mm, and the bearing disc comprises a bearing surface and is used for bearing a substrate, the bearing disc is located below the cover ring, and when the bearing disc drives the substrate to move towards the cover ring, the main body part of the cover ring contacts the substrate.
The substrate bearing and fixing mechanism and the thin film deposition equipment comprise a second protruding part protruding towards the direction away from the annular bottom of the baffle.
The substrate bearing and fixing mechanism and the thin film deposition equipment are characterized in that the cover ring and the bearing plate are respectively provided with a corresponding alignment unit, and the cover ring and the bearing plate are aligned through the alignment unit.
The substrate bearing and fixing mechanism and the thin film deposition equipment are characterized in that the cover ring comprises a first cover ring and a second cover ring, the circumference of the first cover ring is larger than that of the second cover ring, the second cover ring is used for bearing the first cover ring, when the bearing plate moves towards the cover ring, the bearing plate is used for bearing the first cover ring, the second cover ring contacts the substrate, and the first cover ring and the second cover ring are respectively provided with a corresponding alignment unit and are aligned through the alignment unit.
The substrate bearing and fixing mechanism and the thin film deposition equipment comprise an annular member connected with the bearing disc, wherein the annular member is positioned around the bearing surface of the bearing disc, and the annular member and the cover ring are respectively provided with a corresponding alignment unit and are aligned through the alignment unit.
The thin film deposition equipment comprises a target material which is arranged in the cavity and faces the bearing disc and the base plate, wherein the bearing disc is positioned in the opening of the baffle member and drives the cover ring to leave the baffle member so as to shorten the distance between the base plate on the bearing disc and the target material.
The invention has the beneficial effects of providing the substrate bearing and fixing mechanism which is used for fixing the substrate on the bearing plate and reducing the pollution of the process gas or the target atoms to the cavity.
Drawings
FIG. 1 is a schematic cross-sectional view of an embodiment of a substrate carrier fixture according to the present invention.
FIG. 2 is a schematic cross-sectional view of an embodiment of the thin film deposition apparatus of the present invention operating in a feed and discharge state.
FIG. 3 is a schematic cross-sectional view of an embodiment of the thin film deposition apparatus of the present invention operating in a deposition state.
FIG. 4 is a schematic cross-sectional view of a further embodiment of the thin film deposition apparatus of the present invention operating in a deposited state.
FIG. 5 is a schematic cross-sectional view of a substrate carrier fixture according to another embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view of a substrate carrier fixture according to another embodiment of the present invention.
FIG. 7 is a schematic cross-sectional view of a substrate carrier fixture according to another embodiment of the present invention.
The reference numerals illustrate 10-substrate carrying and fixing mechanism, 100-thin film deposition apparatus, 11-carrying tray, 111-carrying surface, 113-recess, 115-annular member, 12-substrate, 13-stopper, 131-sidewall, 132-opening, 133-annular bottom, 135-annular protrusion, 14-accommodation space, 141-reaction space, 15-cover ring, 151-main body, 153-shielding part, 1531-first protrusion, 1533-second protrusion, 1535-protrusion, 155-protrusion, 157-first cover ring, 159-second cover ring, 161-lifting unit, 163-carrying member, 17-cavity, 171-substrate access, 19-target.
Detailed Description
Referring to fig. 1 and 2, a schematic cross-sectional view of an embodiment of a substrate carrying and fixing mechanism according to the present invention and a schematic cross-sectional view of an embodiment of a thin film deposition apparatus according to the present invention operating in a material feeding and discharging state are shown. As shown in the figure, the substrate supporting and fixing mechanism 10 is used for supporting and fixing at least one substrate 12, and mainly comprises at least one supporting plate 11, a blocking member 13 and a cover ring 15, wherein the blocking member 13 is used for supporting the cover ring 15, and the supporting plate 11 is located below the cover ring 15 and/or the blocking member 13.
The carrier plate 11 includes a carrier surface 111 for carrying the substrate 12. The cover ring 15 and/or the stopper 13 has a top view shape similar to a ring shape, wherein the stopper 13 includes a sidewall 131, an annular bottom 133 and an annular protrusion 135, and the annular bottom 133 connects the sidewall 131 and the annular protrusion 135.
The side wall 131 of the stopper 13 has an appearance similar to a cylinder, a hollow cylinder or a hollow truncated cone, wherein one end of the side wall 131 of the stopper 13 may be connected to the cavity 17, and the other end of the side wall 131 is connected to the annular bottom 133.
The annular bottom 133 has an appearance of an approximately circular ring, wherein one end of the annular bottom 133 is connected to the side wall 131 of the stopper 13, for example, a radially outer side of the annular bottom 133 is connected to a bottom end of the side wall 131, wherein an angle between the side wall 131 and the annular bottom 133 is approximately 90 degrees.
The annular protrusion 135 has an appearance similar to a cylinder, a hollow cylinder, or a hollow truncated cone, wherein one end of the annular protrusion 135 is connected to the radial inner side of the annular bottom 133, and an opening 132 is formed in a radial inner side of the annular protrusion 135. Specifically, the side wall 131 and the annular protrusion 135 are respectively connected to the radially outer side and the radially inner side of the annular bottom 133 and protrude or extend in the same direction, wherein the height of the side wall 131 is greater than that of the annular protrusion 135.
The cover ring 15 includes a main body 151 and a shielding portion 153, wherein the main body 151 is an annular body, and the shielding portion 153 has an appearance similar to a cylinder, a hollow cylinder or a hollow truncated cone. Specifically, the shielding portion 153 is connected to the radially outer side of the main body portion 151, wherein an angle between the shielding portion 153 and the main body portion 151 is about 90 degrees.
The cover ring 15 may be configured to rest on the stopper 13, such as an annular protrusion 135 of the stopper 13 configured to bear against a lower surface of the body portion 151 of the cover ring 15. When the cover ring 15 is placed on the annular protrusion 135 of the stopper 13, a portion of the main body 151 extends radially inward of the annular bottom 133 and/or the annular protrusion 135 of the stopper 13 and is located at an extended position of the opening 132 of the stopper 13 to cover or cover a portion of the opening 132. The main body 151 of the further portion extends radially outwardly of the annular bottom 133 and/or the annular projection 135 of the stopper 13 and covers or covers a substantial portion of the annular bottom 133.
Specifically, the cover ring 15 of the present invention extends toward the sidewall 131 of the stopper 13 and reduces the space between the shielding portion 153 of the cover ring 15 and the sidewall 131, wherein the space is between 3 and 10 millimeters (mm). By the special design of the cover ring 15, the shielding effect of the cover ring 15 and the baffle member 13 can be improved, so that target atoms and/or target molecules generated in the reaction gas and/or deposition process can be reduced to contact with the cavity 17 outside the baffle member 13.
The thin film deposition apparatus 100 shown in fig. 2 mainly includes a chamber 17 and a substrate supporting and fixing mechanism 10, wherein the substrate supporting and fixing mechanism 10 is located in the accommodating space 14 of the chamber 17. One end of the stopper 13 may be connected to the cavity 17, while the other end is used to carry the cover ring 15. The carrier plate 11 is located below the cover ring 15 and/or the stopper 13 and is displaceable relative to the cover ring 15 and/or the stopper 13.
A substrate access 171 may be provided in the cavity 17, wherein the carrier plate 11 may be displaced away from the cover ring 15 and/or the stop member 13 such that the height of the carrier surface 111 of the carrier plate 11 is similar to the substrate access 171. The substrate 12 outside the chamber 17 may then be placed on the load surface 111 of the load plate 11 by a robot arm through the substrate access port 171. In addition, the robot arm may also transport the substrate 12 on the carrying surface 111 of the carrying tray 11 to the outside of the cavity 17 through the substrate inlet and outlet 171.
In an embodiment of the present invention, the thin film deposition apparatus 100 may be a physical vapor deposition device, and a target 19 is disposed in the chamber 17, where the target 19 faces the carrier plate 11 and/or the substrate 12. At least one gas inlet may be disposed on the chamber 17, wherein the gas inlet is fluidly connected to the accommodating space 14 of the chamber 17 and is used to deliver a process gas into the accommodating space 14 for performing a deposition process, and the process gas may be an inert gas or a reactive gas, for example. In addition, an air extraction opening may be disposed on the cavity 17, and the air in the cavity 17 is extracted through the air extraction opening by a pump, so that the accommodating space 14 is low pressure or vacuum.
As shown in fig. 3, the carrier plate 11 may drive the substrate 12 to move toward the cover ring 15, the baffle 13 and/or the target 19, so that the carrier plate 11 is located in the opening 132 of the baffle 13, where the main body 151 of the cover ring 15 contacts the substrate 12 on the carrier plate 11 to fix the substrate 12 on the carrier plate 11. At this time, the carrying tray 11, the cover ring 15, the baffle 13 and the cavity 17 define a reaction space 141 in the accommodating space 14, and perform thin film deposition on the surface of the substrate 12 in the reaction space 141. The reaction space 141 is basically an isolated space in the accommodating space 14, wherein the reaction gas, the target atoms and/or the target molecules in the reaction space 141 do not contact the cavity 17 outside the baffle 13, so as to avoid depositing a thin film on the surface of the cavity 17, thereby polluting the cavity 17.
As shown in fig. 4 and 5, the carrier plate 11 in the opening 132 of the baffle 13 can continuously drive the substrate 12 to move toward the target 19, so as to shorten the distance between the target 19 and the substrate 12 carried by the carrier plate 11. At this time, the carrying tray 11 also carries the cover ring 15 and drives the cover ring 15 to leave the stopper 13.
Since the gap between the shielding portion 153 of the cover ring 15 and the side wall 131 of the baffle member 13 is smaller than 10mm, even if the carrier plate 11 drives the cover ring 15 to leave the baffle member 13, the reaction gas, the target atoms and/or the target molecules in the reaction space 141 can be prevented from entering the accommodating space 14 outside the baffle member 13.
Specifically, by the thin film deposition apparatus 100 of the present invention, it is possible to avoid increasing the adjustable range of the distance between the substrate 12 and the target 19 carried by the carrier plate 11 in the case of forming a deposited thin film on the inner surface of the chamber 17. Therefore, the distance between the substrate 12 and the target 19 can be adjusted according to the requirement of the deposition process, so as to improve the uniformity of the thin film deposited on the surface of the substrate 12.
In contrast, the adjustable range of the distance between the substrate 12 and the target 19 carried by the carrier 11 of the deposition chamber is smaller, and if the distance between the carrier 11 and the target 19 is reduced, an excessive gap is often generated between the cover ring 15 and the baffle 13, so that the reaction gas, the target atoms and/or the target molecules in the reaction space 141 enter the accommodating space 14 outside the baffle 13, and further thin film deposition is formed on the inner surface of the chamber 17.
In addition, the gap between the shielding portion 153 of the cover ring 15 and the side wall 131 of the stopper 13 is larger than 3 mm, so as to prevent the cover ring 15 from being electrically connected with the stopper 13, and prevent the shielding portion 153 of the cover ring 15 from contacting or rubbing against the side wall 131 of the stopper 13 to generate pollution of particles.
In an embodiment of the present invention, as shown in fig. 1, a corresponding alignment unit may be disposed between the cover ring 15 and the carrier plate 11, for example, a protrusion 155 is disposed on the lower surface of the cover ring 15, and a recess 113 is disposed on the carrier plate 11, wherein a corresponding inclined plane is disposed between the protrusion 155 and the recess 113. When the carrier plate 11 approaches the cover ring 15, the protrusion 155 of the cover ring 15 contacts the recess 113 of the carrier plate 11 and aligns the cover ring 15 and the carrier plate 11.
In another embodiment of the present invention, the carrier 11 may include an annular member 115, wherein the annular member 115 is disposed around the carrying surface 111 of the carrier 11, and corresponding alignment units are disposed between the cover ring 15 and the annular member 115 to align the cover ring 15 and the annular member 115.
In an embodiment of the present invention, the substrate supporting and fixing mechanism 10 may include at least one lifting unit 161 and a supporting member 163, wherein the supporting member 163 is disposed on the supporting plate 11 and located below the substrate 12 supported by the supporting plate 11, for example, the supporting member 163 may be annular in appearance and located inside the annular member 115.
The lifting unit 161 is connected to the carrying member 163 and the carrying tray 11, and is used for driving the carrying member 163 to displace relative to the carrying tray 11, for example, the lifting unit 161 can extend relative to the carrying surface 111 of the carrying tray 11, and drive the carrying member 163 to leave the carrying tray 11, so that the carrying member 163 drives the substrate 12 to leave the carrying surface 111 of the carrying tray 11, which is beneficial for the robot arm to take the substrate 12.
In another embodiment of the present invention, the lifting unit 161 is connected to the carrying tray 11 and is located below the substrate 12 carried by the carrying tray 11. The lifting unit 161 can extend relative to the bearing surface 111 of the bearing plate 11 and drive the substrate 12 to leave the bearing surface 111 of the bearing plate 11, so that the bearing member 163 is not required.
The shielding portion 153 of fig. 1 includes a first protruding portion 1531 and a second protruding portion 1533, wherein the first protruding portion 1531 protrudes toward the annular bottom portion 133 of the shielding member 13, and the second protruding portion 1533 protrudes away from the annular bottom portion 133 of the shielding member 13.
As shown in fig. 5, the cover ring 15 may include a first cover ring 157 and a second cover ring 159, wherein the first cover ring 157 and the second cover ring 159 have a ring shape in plan view, and the maximum circumference and/or the maximum radius of the first cover ring 157 is greater than the maximum circumference and/or the maximum radius of the second cover ring 159. The second cover ring 159 is located above the first cover ring 157 and carries the second cover ring 159 with the first cover ring 157. When the carrier 11 is displaced toward the first cover ring 157 and/or the second cover ring 159, the second cover ring 159 contacts the edge of the substrate 12 carried by the carrier 11 and secures the substrate 12 to the carrying surface 111 of the carrier 11.
In practice, the second cover ring 159 may be placed on the first cover ring 157, and the smaller substrate 12 may be fixed to the carrier plate 11 by the second cover ring 159. In addition, the second cover ring 159 may be removed from the first cover ring 157, and the substrate 12 having a larger size may be fixed to the carrier 11 by the first cover ring 157. When the larger-sized substrate 12 is fixed to the carrier tray 11 with the first cover ring 157, it may be necessary to replace the carrier tray 11 or to dispose an additional member on the carrier tray 11. Corresponding alignment units can be arranged between the first cover ring 157 and the second cover ring 159 respectively, and the first cover ring 157 and the second cover ring 159 can be aligned by the corresponding alignment units.
Since the length, area and weight of the cover ring 15 may be larger than those of the prior art, the pressure applied to the substrate 12 by the cover ring 15 may be increased, thereby increasing the probability of breakage of the substrate 12. When the cover ring 15 includes the first cover ring 157 and the second cover ring 159, the weight of the first cover ring 157 can be borne by the carrier plate 11, and the pressure applied by the cover ring 15 to the substrate 12 can be reduced by the second cover ring 159 contacting and fixing the substrate 12 to the carrier plate 11, so as to reduce the probability of cracking the substrate 12.
As shown in fig. 6, the shielding portion 153 of the cover ring 15 includes a first protruding portion 1531, wherein the first protruding portion 1531 protrudes toward the annular bottom 133 of the stopper 13. As shown in fig. 7, the shielding portion 153 of the cover ring includes a convex portion 1535, wherein the convex portion 1535 is convex in a direction away from the annular bottom 133 of the stopper 13.
Since the cover ring 15 of the present invention can provide a good shielding effect, the heights of the annular protrusion 135 of the shielding member 13 and the first protrusion 1531 of the shielding portion 153 can be further shortened, so as to increase the adjustable distance between the substrate 12 and the target 19 carried by the carrier plate 11 without affecting the shielding effect of the cover ring 15 and the shielding member 13 on the cavity 17, for example, the distance between the substrate 12 and the target 19 can be increased while the main body 151 of the cover ring 15 still contacts the substrate 12.
The invention has the advantages that:
a substrate carrying and fixing mechanism is provided for fixing a substrate on a carrying plate and reducing the pollution of process gas or target atoms to a chamber.
The foregoing description is only a preferred embodiment of the present invention and is not intended to limit the scope of the invention, i.e., all equivalent variations and modifications in shape, construction, characteristics and spirit as defined in the claims should be embraced by the claims.
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111014690.2A CN115725947B (en) | 2021-08-31 | 2021-08-31 | Substrate supporting and fixing mechanism and thin film deposition equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111014690.2A CN115725947B (en) | 2021-08-31 | 2021-08-31 | Substrate supporting and fixing mechanism and thin film deposition equipment |
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| CN115725947A CN115725947A (en) | 2023-03-03 |
| CN115725947B true CN115725947B (en) | 2024-12-13 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM614087U (en) * | 2021-03-24 | 2021-07-01 | 天虹科技股份有限公司 | Substrate carrying and fixing device and film deposition facility using the substrate carrying and fixing device |
| CN216614824U (en) * | 2021-08-31 | 2022-05-27 | 鑫天虹(厦门)科技有限公司 | Substrate bearing and fixing device and thin film deposition equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2012057987A2 (en) * | 2010-10-29 | 2012-05-03 | Applied Materials, Inc. | Deposition ring and electrostatic chuck for physical vapor deposition chamber |
| JP2016148062A (en) * | 2015-02-10 | 2016-08-18 | セイコーエプソン株式会社 | Film deposition apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM614087U (en) * | 2021-03-24 | 2021-07-01 | 天虹科技股份有限公司 | Substrate carrying and fixing device and film deposition facility using the substrate carrying and fixing device |
| CN216614824U (en) * | 2021-08-31 | 2022-05-27 | 鑫天虹(厦门)科技有限公司 | Substrate bearing and fixing device and thin film deposition equipment |
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