CN115706059A

CN115706059A - Connection structure of IPM module and radiator, IPM module and radiator

Info

Publication number: CN115706059A
Application number: CN202110918625.6A
Authority: CN
Inventors: 杨巧莹; 史波; 江伟; 黄玲; 秦明柳谦; 杨景城
Original assignee: Gree Electric Appliances Inc of Zhuhai
Current assignee: Gree Electric Appliances Inc of Zhuhai
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2023-02-17

Abstract

The invention provides a connecting structure of an IPM module and a radiator, the IPM module and the radiator, wherein in the connecting structure, a groove structure is arranged on the surface of a plastic package body of the IPM module, which is matched with the radiator, a clamping strip structure matched with the groove structure is arranged on the surface of the radiator, which is matched with the plastic package body of the IPM module, an elastic limiting device capable of stretching along the vertical direction is arranged on the surface of the radiator, which is matched with the plastic package body of the IPM module, and the elastic limiting devices are symmetrically arranged on two sides of the IPM module. The connecting structure adopts the clamping structure and the elastic limiting device to fix the IPM module, replaces the original mounting mode of screws and nuts, reduces the risk of deformation, fracture and damage of the module caused by mounting errors, saves the mounting cost, improves the mounting efficiency, increases the surface area of the radiating fins, and can improve the radiating performance of the module.

Description

Connection structure of IPM module and radiator, IPM module and radiator

Technical Field

The invention relates to the technical field of installation structures of heat radiators for IPM modules, in particular to a connection structure of an IPM module and the heat radiators, the IPM module and the heat radiators.

Background

Heat dissipation of power modules has been a major concern for research designers in module applications. In the actual application of IPM modules, either fully enclosed or semi-enclosed modules require the use of a heat sink to aid in heat dissipation. At present, the mainstream radiator installation mode is mainly to lock and fix the IPM module and the radiator by using nuts, and semicircular holes are formed in two sides of the IPM module and used for being matched with the nuts. The mode that this module and radiator combine easily leads to the module to be broken harmfully etc. because installer's misoperation, takes place the safety problem of using.

Disclosure of Invention

The technical problem to be solved by the invention is to overcome the defects of the prior art, and provide a connecting structure of an IPM module and a radiator, and the IPM module and the radiator, wherein a clamping structure is used for combination, no additional screw is needed, the volume of a plastic package body is reduced, the contact area of the IPM module and the radiator is increased, the radiating efficiency is improved, and multiple limit fixing can be carried out on multiple transverse and longitudinal IPM modules by adding symmetrically arranged elastic limit devices.

In order to solve the technical problems, the technical scheme provided by the invention is as follows:

the utility model provides a connection structure of IPM module and radiator, be equipped with groove structure on the plastic-sealed body of IPM module on with radiator complex surface, be equipped with on the radiator with the plastic-sealed body complex of IPM module on the surface and form complex card strip structure with groove structure, be equipped with on the radiator with the plastic-sealed body complex of IPM module on the surface can follow the flexible elasticity stop device of vertical direction, elasticity stop device symmetrical arrangement is in the both sides of IPM module.

According to the connecting structure of the IPM module and the radiator, the module is combined with the radiator by adopting the clamping structure and is fixed on the radiator, the IPM module is further fixed by adopting the elastic limiting device to replace the original mounting mode of screws and nuts, the risk of deformation, fracture and damage of the module caused by mounting errors is reduced, the number of parts during mounting is reduced, the mounting cost is saved, the mounting efficiency is improved due to the mounting convenience, the surface area of the radiating fin is increased by the clamping structure matched with the grooves and the clamping strips, and the radiating performance of the module can be improved.

With respect to the above technical solution, further improvements as described below can be made.

According to the connection structure of the IPM module and the heat sink of the present invention, in a preferred embodiment, the groove structure and the bar structure extend to both sides in the width direction of the molding body of the IPM module and the heat sink, respectively.

The clamping structure can ensure that the IPM module is well fixed along the length direction of the radiator.

Further, in a preferred embodiment, the elastic stoppers are symmetrically arranged at both sides in the width direction of the plastic package body and the heat sink of the IPM module.

The elastic limiting device in the above arrangement can ensure that the IPM module is well fixed in the width direction of the heat sink.

Specifically, in a preferred embodiment, the surface of the plastic package body of the IPM module, which is matched with the heat sink, and the surface of the heat sink, which is matched with the plastic package body of the IPM module, are connected by using a mortise and tenon joint structure.

The tenon-and-mortise structure is used, so that stable and reliable positioning between the IPM module and the radiator can be further ensured.

Further, in a preferred embodiment, the tenon-and-mortise structure adopts a dovetail structure with a wide top and a narrow bottom.

The tenon fourth of twelve earthly branches structure of above-mentioned structural style can further ensure to fix IPM module on the radiator from vertical direction.

Specifically, in a preferred embodiment, the elastic limiting device comprises an elastic supporting part and a limiting part, wherein the elastic supporting part is arranged on the radiator along the vertical direction, the limiting part is connected with the elastic supporting part, the elastic supporting part can ensure that the limiting part is matched with two sides of the plastic package body of the IPM module in a normal state, and the elastic supporting part can ensure that the height of the limiting part does not exceed the surface of the radiator in a pressed state.

The elastic limiting device with the structural form is simple in structure, the IPM module and the radiator can be conveniently installed in a matched mode, and limiting is stable and reliable.

In particular, in a preferred embodiment, the resilient support member comprises a spring.

The spring is used as an elastic supporting part, so that the structure is simple, the installation and the arrangement are easy, the cost is low, and the operation is convenient.

In particular, in a preferred embodiment, the stop member is a square block-like structure.

The limiting component with the structure is simple in structure, easy to machine and manufacture and capable of being well matched with the two sides of the IPM module, so that the limiting is stable and reliable.

Specifically, in a preferred embodiment, the limiting part is a square shell-shaped structure with an opening at the bottom, and the elastic supporting part extends into the limiting part to be connected.

The limiting component with the structure can further simplify the structure, save the cost and enable the operation process to be more stable and reliable.

Further, in a preferred embodiment, the side of the position limiting part opposite to the outer side of the heat sink is an inclined surface, so that the top width of the position limiting part is narrower than the bottom width.

The limiting component with the structure can further increase the structural strength of the limiting component, save the cost and enable the operation process to be more stable and reliable.

According to the IPM module of the second aspect of the present invention, the surface of the plastic package body of the IPM module, which is fitted to the heat sink, is provided with a groove structure, and two sides of the IPM module are symmetrically provided with elastic limiting devices.

Specifically, in a preferred embodiment, the IPM module of the present invention includes a lead frame, wherein the lead frame has pins respectively disposed in the middle and at two sides thereof, the pins at two sides of the lead frame extend out of the outer side of the lead frame body, a chip is welded on the lead frame, an aluminum wire is bonded to the pin region, and the chip and the lead frame body are wrapped by a plastic package body.

The IPM module with the structure is simple in structure, a groove structure is convenient to arrange on the bottom surface of the plastic package body, and the installation position for installing the screw does not need to be additionally arranged.

Specifically, in a preferred embodiment, the lead frame is made of a copper alloy material by stamping.

Specifically, in a preferred embodiment, the chips include a power chip and an IC chip, the power chip is soldered by using a solder wire or a solder paste soldering material, and the IC chip is soldered by using a silver paste soldering material.

Specifically, in a preferred embodiment, the power chip and the lead frame are bonded by using an aluminum wire, and the wire diameter of the bonded aluminum wire is 5-20 mil.

Specifically, in a preferred embodiment, gold wire bonding is adopted between the power chip and the IC chip and between the IC chip and the lead frame, and the wire diameter of the bonding alloy wire is 20um to 70um.

According to the radiator of the third aspect of the present invention, the surface of the radiator, which is fitted with the plastic package body of the IPM module, is provided with the clip structure, and the surface of the radiator, which is fitted with the plastic package body of the IPM module, is provided with the elastic limit device capable of extending and retracting in the vertical direction.

Specifically, in a preferred embodiment, the heat sink comprises a heat sink bottom plate and heat dissipation fins which are uniformly arranged on the heat sink bottom plate at intervals, wherein the heat sink bottom plate is provided with mounting grooves for arranging the elastic limiting devices.

The radiator with the structure form not only can effectively ensure that the radiating effect of the radiator is not reduced, but also can be convenient for arranging the elastic limiting device, and the fixed mounting structure of the elastic limiting device is stable and reliable.

Compared with the prior art, the invention has the advantages that: the module is combined with the radiator by adopting a clamping structure, the module is fixed on the radiator, the IPM module is further fixed by adopting an elastic limiting device, the original mounting mode of screws and nuts is replaced, the risk of deformation, fracture and damage of the module caused by mounting errors is reduced, the number of parts during mounting is reduced, the mounting cost is saved, the mounting efficiency is improved due to the convenience in mounting, the surface area of the radiating fin is increased by the clamping structure matched with the grooves and the clamping strips, and the radiating performance of the module can be improved.

Drawings

The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:

fig. 1 schematically shows a front view structure of a connection structure of an embodiment of the present invention;

FIG. 2 is a schematic diagram showing the overall structure of an IPM module in the embodiment of the present invention;

fig. 3 schematically shows the overall structure of a heat sink in an embodiment of the invention;

FIG. 4 is a schematic view showing an integrated assembly structure of an IPM module and a heat sink in an embodiment of the present invention;

fig. 5 schematically shows a normal state of the elastic stopper according to the embodiment of the present invention;

fig. 6 schematically shows a pressed state of the elastic stopper according to the embodiment of the present invention.

In the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.

Detailed Description

The invention will be further explained in detail with reference to the figures and the embodiments without thereby limiting the scope of protection of the invention.

Fig. 1 schematically shows a front view structure of a connection structure 10 of an embodiment of the present invention. Fig. 2 schematically shows the overall structure of the IPM module 1 in the embodiment of the present invention. Fig. 3 schematically shows the overall structure of the heat sink 2 in the embodiment of the invention; fig. 4 schematically shows an integrated assembly structure of the IPM module 1 and the heat sink 2 in the embodiment of the present invention. Fig. 5 schematically shows a normal state of the elastic limiting device 3 according to the embodiment of the present invention. Fig. 6 schematically shows a pressed state of the elastic stopper 3 according to the embodiment of the present invention.

Example 1

As shown in fig. 1 to 4, a connection structure 10 between an IPM Module (Intelligent Power Module) and a heat sink in an embodiment of the present invention, at least two sets of groove structures 11 are disposed on a surface of a molding compound of the IPM Module 1, the surface of the molding compound of the IPM Module 1, which is matched with the heat sink 2, and a strip structure 21, which is matched with the groove structures 11, is disposed on a surface of the heat sink 2, which is matched with the molding compound of the IPM Module 1; the surface of the radiator 2, which is matched with the plastic package body of the IPM module 1, is provided with elastic limiting devices 3 which can stretch out and draw back along the vertical direction, and the elastic limiting devices 3 are symmetrically arranged on two sides of the IPM module 1.

According to the connecting structure of the IPM module and the radiator, the module and the radiator are combined by adopting the clamping structure to fix the module on the radiator, the IPM module is further fixed by adopting the elastic limiting device to replace the original mounting mode of screws and nuts, the risk of deformation, fracture and damage of the module caused by mounting errors is reduced, the number of parts during mounting is reduced, the mounting cost is saved, the mounting efficiency is improved due to the convenience in mounting, the surface area of the radiating fin is increased by the clamping structure matched with the groove and the clamping strip, and the radiating performance of the module can be improved.

As shown in fig. 2 to 4, preferably, in the present embodiment, the groove structure 11 and the card bar structure 21 both extend to both sides in the width direction of the molded body of the IPM module 1 and the heat sink 2, respectively. The clamping structure can ensure that the IPM module is well fixed along the length direction of the radiator. Further, in the present embodiment, the elastic stopper 3 is symmetrically arranged on both sides in the width direction of the molded body of the IPM module 1 and the heat sink 2. The elastic limiting device in the above arrangement can ensure that the IPM module is well fixed in the width direction of the heat sink.

Specifically, as shown in fig. 2 to 4, in this embodiment, the surface of the IPM module 1, which is matched with the heat sink 2, on the plastic package body is connected with the surface of the heat sink, which is matched with the plastic package body of the IPM module, by using a mortise and tenon joint structure. The tenon-and-mortise structure is used, so that stable and reliable positioning between the IPM module and the radiator can be further ensured. Further, in this embodiment, the mortise and tenon structure adopts a dovetail structure with a wide top and a narrow bottom. The tenon-and-mortise structure with the structural form can further ensure that the IPM module is fixed on the radiator from the vertical direction.

Specifically, as shown in fig. 3 to 6, in the present embodiment, the elastic limiting device 3 includes an elastic supporting part 31 and a limiting part 32 connected to the elastic supporting part 31, the elastic supporting part 31 is arranged on the heat sink 2 in the vertical direction, the elastic supporting part 31 can ensure that the limiting part 32 is matched with both sides of the plastic package body of the IPM module 1, and the elastic supporting part 31 can ensure that the height of the limiting part 32 does not exceed the surface of the heat sink in the pressed state. The elastic limiting device with the structural form is simple in structure, the IPM module and the radiator are conveniently installed in a matched mode, and the limiting is stable and reliable.

Specifically, as shown in fig. 5 and 6, in the present embodiment, the elastic support member 31 includes a spring. The spring is used as an elastic supporting part, so that the structure is simple, the installation and the arrangement are easy, the cost is low, and the operation is convenient.

Specifically, as shown in fig. 5 and 6, in the present embodiment, the limiting member 32 is a square shell-shaped structure with an open bottom, and the elastic supporting member 31 extends into the limiting member 32 to be connected. The limiting component with the structure can further simplify the structure, save the cost and enable the operation process to be more stable and reliable. Further, in the present embodiment, the side surface of the position limiting part 32 opposite to the outer side surface of the heat sink 2 is an inclined surface, so that the top width of the position limiting part 32 is narrower than the bottom width. The limiting component with the structure can further increase the structural strength of the limiting component, save the cost and enable the operation process to be more stable and reliable.

In particular, in one embodiment, not shown, the stop member 32 is a square block-like structure. The limiting component with the structure is simple in structure, easy to machine and manufacture and capable of being well matched with two sides of the IPM module, so that the limiting is stable and reliable.

As shown in fig. 2 to 4, in this embodiment, specifically, the IPM module 1 includes a lead frame 12, the lead frame 12 has pins respectively disposed in the middle and at two sides, the pins at two sides of the lead frame 12 extend out of the outer side of the body of the lead frame 12, a chip is welded on the lead frame 12, an aluminum wire is arranged on the pin area, and a plastic package body wraps the chip and the body of the lead frame 12. The IPM module with the structure is simple in structure, a groove structure is convenient to arrange on the bottom surface of the plastic package body, and the installation position for installing the screw does not need to be additionally arranged. Specifically, in the present embodiment, the heat sink 2 includes a heat sink bottom plate and heat dissipation fins arranged on the heat sink bottom plate at uniform intervals, and the heat sink bottom plate is provided with mounting grooves for arranging the elastic limiting devices 3. The radiator with the structure form not only can effectively ensure that the radiating effect of the radiator is not reduced, but also can be convenient for arranging the elastic limiting device, and the fixed mounting structure of the elastic limiting device is stable and reliable.

Specifically, in this embodiment, as shown in fig. 1, the IPM module 1 includes a lead frame 12, the copper frame includes pins, the middle pin is connected to the main frame, the pins on two sides are separated from the main frame, the chip and the copper frame are wrapped by the plastic package, and the aluminum wires are printed in the pin area. The radiator 2 is used for being attached to the chip outer surface plastic package body to help the chip to radiate heat. The elastic stopper 3 is used to fix the IPM module 1 and the heat sink 2 in the width direction. When the IPM module 1 is combined with the heat sink 2, the IPM module 1 is pushed in along the width direction on the surface of the heat sink 2, since the limiting part 32 has a preset inclination angle and the spring is connected below the limiting part 32, when the IPM module is pushed in, the spring is compressed, and the limiting part 32 is pressed down, so that the IPM module 1 can be smoothly pushed in. When the IPM module 1 is completely pushed in, the spring rebounds, locking the IPM module 1 in the width direction. The mortise and tenon structure is used for fixing the IPM module 1 and the radiator 2 along the length direction, and the IPM module cannot fall off along the length direction due to the fact that the mortise and tenon structure is of a structure with the wide upper part and the narrow lower part.

Example 2

As shown in fig. 2, the IPM module 1 of the embodiment of the present invention, and the surface of the plastic package body of the IPM module 1, which is matched with the heat sink 2, is provided with a groove structure 11, and two sides of the IPM module 1 are symmetrically provided with elastic limiting devices 3.

Specifically, in this embodiment, the IPM module 1 includes a lead frame 12, wherein pins are respectively disposed in the middle and at two sides of the lead frame 12, the pins at two sides of the lead frame 12 extend out of the outer side surface of the main body of the lead frame 12, a chip is welded on the lead frame 12, an aluminum wire is bonded to the pin area, and a plastic package body wraps the chip and the main body of the lead frame 12. The IPM module with the structure is simple in structure, a groove structure is convenient to arrange on the bottom surface of the plastic package body, and the installation position for installing the screw does not need to be additionally arranged.

Specifically, in the present embodiment, the lead frame 12 is made of a copper alloy material by a press method. Specifically, in this embodiment, the chip includes a power chip and an IC chip, the power chip is soldered by using a solder wire or a solder paste soldering material, and the IC chip is soldered by using a silver paste soldering material. And the power chip and the lead frame are bonded by adopting an aluminum wire, and the wire diameter of the bonded aluminum wire is 5-20 mil. And gold wires are used for bonding between the power chip and the IC chip and between the IC chip and the lead frame, and the wire diameter of the bonding alloy wire is 20-70 um.

Example 3

As shown in fig. 3, in the heat sink 2 according to the embodiment of the present invention, a surface of the heat sink 2, which is matched with the plastic package of the IPM module 1, is provided with a strip structure 21, and a surface of the heat sink 2, which is matched with the plastic package of the IPM module 1, is provided with an elastic limiting device 3 capable of extending and contracting in a vertical direction.

Specifically, in this embodiment, the heat sink 2 includes a heat sink bottom plate and heat dissipation fins arranged on the heat sink bottom plate at uniform intervals, and the heat sink bottom plate is provided with mounting grooves for arranging the elastic limiting devices. The radiator with the structure can not only effectively ensure that the radiating effect of the radiator is not reduced, but also be convenient for arranging the elastic limiting device, and the fixed mounting structure of the elastic limiting device is stable and reliable.

Specifically, the manufacturing process of the connection structure 10 according to embodiment 1 of the present invention is as follows:

s01: and welding the power chip on the lead frame. The power chip is soldered to the lead frame using solder material such as solder wire and solder paste. Generally, the lead frame can be made of a copper alloy lead frame in a stamping mode, or a copper frame, a ceramic plate and a copper radiating fin are integrally called as a DBC ceramic substrate structure;

s02: welding an IC chip on the lead frame, wherein the welding material is silver paste;

s03: carrying out aluminum wire bonding on the power chip and the lead frame, wherein the wire diameter of the bonded aluminum wire can be selected within the range of 5-20 mil, and specifically, the proper wire diameter is selected according to the size of the power chip and the current specification of the chip;

s04: gold wire welding, namely using gold wires to electrically connect the IC chip and the power chip, electrically connecting the IC chip and the lead frame, wherein the selectable range of the wire diameter of the bonding gold wire is 20-70 um according to different chip specifications;

s05: according to the step of plastic package, according to the step shown in fig. 2, firstly, a corresponding plastic package mold is manufactured, then the lead frame is placed in the mold, the mold is closed, and the plastic package material is injected to wrap the lead frame, the chip and the bonding wire so as to form a package body;

s06: a heat sink matched with the plastic package body is manufactured as shown in fig. 3, wherein the normal state and the pressing state of the elastic limiting device 3 in fig. 3 are respectively shown in fig. 5 and fig. 6. When the IPM module is in a pressed state, the top end of the elastic limiting device 3 does not exceed the outer surface of the top of the radiator 2, so that the IPM module 1 can be conveniently pushed in. The two cover elastic stoppers 3 may fix the IPM module 1 in the width direction so that it does not slide on the heat sink 2. Because the draw-in groove between IPM module 1 and radiator 2 designs into mortise and tenon structure for it can be in the same place with radiator 2 firm combination along length direction, and this structure also makes IPM module 1's plastic envelope material volume reduce and with radiator 2's area of contact increase, increased the radiating efficiency.

According to the embodiment, the connecting structure of the IPM module and the radiator, the IPM module and the radiator provided by the invention have the advantages that the module is combined with the radiator by adopting the clamping structure, the module is fixed on the radiator, the IPM module is further fixed by adopting the elastic limiting device, the original mounting mode of screws and nuts is replaced, the risk of deformation, fracture and damage of the module caused by mounting errors is reduced, the number of parts during mounting is reduced, the mounting cost is saved, the mounting efficiency is improved by convenient mounting, the surface area of the radiating fin is increased by the clamping structure matched with the grooves and the clamping strips, and the radiating performance of the module can be improved.

While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A connecting structure of an IPM module and a radiator is characterized in that a groove structure is arranged on the surface, matched with the radiator, of a plastic package body of the IPM module, and a clamping strip structure matched with the groove structure is arranged on the surface, matched with the plastic package body of the IPM module, of the radiator; elastic limiting devices capable of stretching and retracting in the vertical direction are arranged on the surface, matched with the plastic package body of the IPM module, of the radiator, and the elastic limiting devices are symmetrically arranged on two sides of the IPM module.

2. The IPM module and heat sink connection structure of claim 1, wherein said groove structure and said strip structure extend to both sides along a width direction of the IPM module plastic package body and the heat sink, respectively.

3. The IPM module and heat sink connection structure of claim 2, wherein said elastic stoppers are symmetrically disposed at both sides in a width direction of the IPM module molding body and the heat sink.

4. The structure for connecting an IPM module and a heat sink according to any one of claims 1 to 3, wherein the surface of the IPM module plastic package body mating with the heat sink and the surface of the heat sink mating with the IPM module plastic package body are connected by a mortise and tenon joint structure.

5. The IPM module and heat sink connection structure of claim 4, wherein said mortise and tenon structure is a dovetail structure with a wide top and a narrow bottom.

6. The IPM module-to-heat sink connection structure of any one of claims 1 to 3, wherein the elastic stopper includes an elastic support part disposed on the heat sink in a vertical direction and a stopper part connected to the elastic support part, the elastic support part is capable of ensuring that the stopper part is engaged with both sides of the molded body of the IPM module in a normal state, and the elastic support part is capable of ensuring that a height of the stopper part does not exceed a surface of the heat sink in a pressed state.

7. The IPM module and heat sink connection structure of claim 6, wherein said elastic support member includes a spring.

8. The IPM module and heat sink connection structure of claim 6, wherein said stopper member is a square block structure.

9. The IPM module and heat sink connection structure of claim 6, wherein said stopper is a square shell structure with an open bottom, and said elastic support member is connected to extend into said stopper.

10. The IPM module and heat sink connection structure of claim 6, wherein a side of the stopper portion opposite to the outer side of the heat sink is an inclined surface such that a top width of the stopper portion is narrower than a bottom width thereof.

11. The IPM module is characterized in that a groove structure is arranged on the surface, matched with a radiator, of a plastic package body of the IPM module, and elastic limiting devices are symmetrically arranged on two sides of the IPM module.

12. The IPM module of claim 11, including a lead frame, wherein the lead frame has leads at the middle and two sides, the leads at the two sides of the lead frame extend out of the outer side of the lead frame body, the lead frame has a chip bonded thereon, the lead area is provided with aluminum wires, and the plastic package body covers the chip and the lead frame body.

13. The IPM module of claim 12, wherein the lead frame is stamped from a copper alloy material.

14. The IPM module of claim 12, wherein the chips include a power chip and an IC chip, the power chip is soldered using a solder wire or a solder paste solder material, and the IC chip is soldered using a silver paste solder material.

15. The IPM module of claim 14, wherein the power chip is bonded to the lead frame by an aluminum wire, and the wire diameter of the bonded aluminum wire is 5-20 mil.

16. The IPM module of claim 14, wherein the power chip and the IC chip and the lead frame are bonded by gold wire, and the wire diameter of the bonding wire is 20 to 70um.

17. A radiator is characterized in that a clamping strip structure is arranged on the surface, matched with a plastic package body of an IPM module, of the radiator; and an elastic limiting device capable of stretching along the vertical direction is arranged on the surface of the radiator matched with the plastic package body of the IPM module.

18. The heat sink as claimed in claim 17, comprising a heat sink bottom plate and heat dissipating fins arranged on the heat sink bottom plate at regular intervals, wherein the heat sink bottom plate is provided with mounting grooves for arranging the elastic limiting devices.