CN115692237A

CN115692237A - Base plate leveling device and leveling tool

Info

Publication number: CN115692237A
Application number: CN202110823846.5A
Authority: CN
Inventors: 陈明宗; 杨佳裕; 赖家伟; 霍正邦
Original assignee: Zhisheng Technology Guangzhou Co Ltd
Current assignee: Zhisheng Technology Guangzhou Co Ltd
Priority date: 2021-07-21
Filing date: 2021-07-21
Publication date: 2023-02-03

Abstract

A substrate leveling device comprises a mechanical working arm and a leveling jig, wherein the leveling jig can vertically move relative to the mechanical working arm. The leveling jig comprises a main body, a plurality of flattening units and an alignment unit. The main body is arranged on the mechanical working arm and is provided with an observation window. The flattening units are arranged in the peripheral area of the main body at intervals. The alignment unit is arranged on the main body and corresponds to the observation window.

Description

Base plate leveling device and leveling tool

Technical Field

The invention relates to the technical field of substrate processing, in particular to a substrate leveling device and a leveling jig.

Background

With the advancement of technology, the processes for manufacturing the components of electronic devices are also complicated. For example, a semiconductor wafer, a printed circuit board, or a display panel is subjected to a plurality of processes such as grinding, machining, etching, and high temperature heating. In addition, when a substrate is subjected to a cleaning or etching process, the substrate is generally fixed to a spin chuck (spin chuck) by vacuum suction or edge clamping, and is rotated at a high speed and a cleaning or etching liquid is sprayed thereon.

However, after the substrate is subjected to the above-mentioned multiple polishing, machining and high temperature processes, the substrate may be deformed due to the influence of mechanical force or thermal stress. Especially for thin substrates (such as silicon wafers or flexible circuit boards), after various processing and high temperature processes, the substrate is more likely to be deformed seriously, so that the whole substrate is warped irregularly. Therefore, when the substrate with warpage is subjected to cleaning or etching processes, the substrate is not smoothly placed on the spin chuck, and the spin chuck cannot smoothly vacuum-adsorb the substrate to be fixed thereon by the vacuum chuck. Or the warped edge of the substrate may interfere structurally with the chuck jaws of the spin chuck, causing the chuck jaws to not successfully clamp and secure the substrate to the spin chuck.

Disclosure of Invention

The invention provides a substrate leveling device and a leveling jig, which are beneficial to solving the problem that a substrate is warped due to various processing.

The substrate leveling device disclosed by the invention comprises at least one mechanical working arm and a leveling jig. The leveling tool is arranged on the mechanical working arm and can vertically move relative to the mechanical working arm. The leveling jig comprises a main body, a plurality of flattening units and an alignment unit. The main body is arranged on the mechanical working arm and is provided with an observation window. The flattening units are arranged in the peripheral area of the main body at intervals. The alignment unit is arranged on the main body and corresponds to the observation window.

The leveling tool disclosed by the invention further comprises a main body, at least one flattening unit and an alignment unit. The body has a viewing window. The flattening unit is arranged in the peripheral area of the main body. The alignment unit is disposed on the main body and corresponds to the observation window.

According to the substrate leveling device and the leveling jig disclosed by the invention, the leveling jig can vertically move relative to the mechanical working arm. The leveling tool is moved above the substrate by the mechanical working arm, and then the mechanical working arm is vertically lowered to make the leveling tool physically contact with the surface of the substrate. The mechanical working arm continuously and vertically descends, and the leveling jig is not supported by the mechanical working arm any more. At the moment, the self weight of the leveling jig is applied to the position of the substrate where the substrate warps, and the warped position is flattened.

The foregoing description of the disclosure and the following detailed description are provided to illustrate and explain the principles and spirit of the invention and to provide further explanation of the invention as claimed.

Drawings

Fig. 1 is a schematic view of a leveling tool according to an embodiment of the invention.

Fig. 2 is a cross-sectional view of the leveling jig shown in fig. 1.

Fig. 3 is another sectional view of the leveling jig shown in fig. 1.

Fig. 4 is a schematic view of the leveling tool of fig. 1 mounted to a robotic arm.

Fig. 5 is an exploded view of the leveling tool and the robot arm shown in fig. 4.

Fig. 6 is a cross-sectional view of the leveling tool and the robot arm shown in fig. 4.

Fig. 7 and 8 are schematic diagrams illustrating the flattening of the substrate by using the flattening jig of fig. 4.

Figure 9 is a schematic view of a substrate flattening apparatus in accordance with an embodiment of the present invention.

Figure 10 is a schematic view of flattening a substrate using the substrate flattening apparatus of figure 9.

Detailed Description

The detailed features and advantages of the present invention are described in detail in the following embodiments, which are sufficient for anyone skilled in the art to understand the technical contents of the present invention and to implement the present invention, and the related objects and advantages of the present invention can be easily understood by anyone skilled in the art from the disclosure of the present specification, the claims and the accompanying drawings. The following examples are intended to illustrate the aspects of the present invention in further detail, but are not intended to limit the scope of the present invention in any way.

Referring to fig. 1 to fig. 3, fig. 1 is a schematic view of a leveling tool according to an embodiment of the invention. Fig. 2 and 3 are sectional views of the leveling jig of fig. 1. In the present embodiment, the leveling jig 1 includes a main body 10, a flattening unit 20, and an alignment unit 30.

The main body 10 is, for example and without limitation, a plate-shaped body of a rigid material, such as a metal plate or a marble plate, and has a viewing window 110. The viewing window 110 is a through-hole formed in the peripheral region of the body 10. Fig. 1 illustrates the main body 10 formed with a plurality of oval viewing windows 110 (through holes), but the number and shape of the viewing windows 110 are not intended to limit the present invention.

The flattening unit 20 is disposed at a peripheral region of the main body 10. Specifically, the leveling jig 1 of the present embodiment includes a plurality of flattening units 20, and the flattening units 20 are disposed at intervals in the peripheral region of the main body 10. Each of the pressing units 20 has a cushioning material portion on a side away from the main body 10. In the present embodiment, the pressing unit 20 is disposed on the lower surface of the main body 10, and has a silicone pad, a rubber pad or a latex pad as a buffer material at the end. The observation window 110 does not overlap with the flattening unit 20, that is, the flattening unit 20 is not visible when the observation window 110 is downward viewed from above the main body 10.

The alignment unit 30 is disposed on the main body 10, and the alignment unit 30 corresponds to the viewing window 110 of the main body 10. In the present embodiment, the alignment unit 30 is disposed on the lower surface of the main body 10, and the alignment unit 30 includes a mark or a bump having a special shape, which can be observed through the observation window 110. The aligning unit 30 is disposed between two adjacent flattening units 20. As shown in fig. 2 and 3, the thickness D1 of the aligning unit 30 is smaller than the thickness D2 of the flattening unit 20 in a direction along the center (central region) of the main body 10 to the edge (peripheral region) of the main body 10.

The leveling jig 1 may be mounted on a robot arm. Fig. 4 to fig. 6 are also shown, in which fig. 4 is a schematic view illustrating the leveling jig of fig. 1 mounted on the robot arm, fig. 5 is an exploded schematic view illustrating the leveling jig and the robot arm of fig. 4, and fig. 6 is a sectional schematic view illustrating the leveling jig and the robot arm of fig. 4. The leveling tool 1 is disposed on the mechanical working arm 2, and the leveling tool 1 can vertically move relative to the mechanical working arm 2. Furthermore, the main body 10 of the leveling jig 1 may include guide posts 120, and the arm 2 has through grooves 21 for receiving the guide posts 120. The guide post 120 is disposed in the through groove 21. As shown in fig. 5, the length L of the guide post 120 in the vertical direction H is greater than the thickness D3 of the mounting portion of the end of the arm 2, so that it can move in the vertical direction H when the jig 1 is leveled.

In the present embodiment, the main body 10 of the leveling tool 1 further has bar-shaped locking holes 130, and the mechanical arm 2 has a number of grooves 22 corresponding to the number of the bar-shaped locking holes 130. The bar-shaped locking holes 130 are distributed closer to the central region of the main body 10. Screws may be used to lock into the bar-shaped locking holes 130 and the grooves 22 to limit the displacement of the leveling jig 1 in the horizontal direction.

Fig. 7 and 8 are schematic diagrams illustrating the flattening of the substrate by using the flattening jig of fig. 4. Fig. 7 illustrates a warped substrate 3 placed on a carrier, wherein the substrate 3 is, for example, but not limited to, a silicon wafer, a printed circuit board or a glass plate.

As shown in fig. 7, the leveling tool 1 is moved above the substrate 3 by the robot arm 2, and then the robot arm 2 is vertically lowered to make the leveling unit 20 of the leveling tool 1 physically contact the surface of the substrate 3. As shown in fig. 8, since the length of the guide post 120 of the leveling jig 1 is greater than the thickness of the mechanical working arm 2, if the mechanical working arm 2 continuously descends vertically after the leveling jig 1 contacts the substrate 3, the leveling jig 1 will not be supported by the mechanical working arm 2. At this time, the weight (for example, a weight of about 2 to 5 kg) of the leveling jig 1 itself is applied to the warped position of the substrate 3 via the flattening unit 20, and the warped position is flattened. In fig. 7, the leveling jig 1 flattens the substrate 3 by its own weight, and the opposite arm 2 does not apply a force to the substrate 3.

When the leveling tool 1 contacts the substrate 3, a user or a camera can view the alignment unit 30 through the observation window 110 of the leveling tool 1 to determine whether the leveling unit 20 is pressed to a correct position. For example, the end of the alignment unit 30 may have a concave profile with a shape matching the edge of the substrate, and if the concave profile of the alignment unit 30 is seen to be aligned with the edge of the substrate 3, it can be determined that the pressing unit 20 is pressed to the correct position. On the contrary, if a gap is formed between the concave contour of the alignment unit 30 and the edge of the substrate, it can be determined that the flattening unit 20 deviates from the predetermined flattening working position, and the position can be adjusted by means of translating the flattening jig 1.

Figure 9 is a schematic view of a substrate flattening apparatus in accordance with an embodiment of the present invention. The substrate leveling device 4 includes the leveling jig 1 and the robot arm 2. The specific structure of the leveling jig 1 and the mechanical working arm 2 can refer to fig. 1 to 4, and the detailed description is omitted here. Further, the number of the mechanical working arms 2 is two or more, and the leveling jig 1 is provided to one of the mechanical working arms 2 (first mechanical working arm). The substrate leveling device 4 may further comprise a substrate pick-up jig 2 "which is arranged on the other robot arm 2 (second robot arm). The substrate pick-up jig 2 "is, for example, but not limited to, a gripper or a carrier tray, and is used for picking up a substrate and placing the substrate at a designated position. These robotic arms 2 may be mounted on the same carrier and the movements of the individual robotic arms 2 are controlled independently via a central controller.

Figure 10 is a schematic view of flattening a substrate using the substrate flattening apparatus of figure 9. The mechanical working arm 2 provided with the substrate pickup jig 2 ″ puts the substrate 3 into the working chamber. Thereafter, the mechanical work arm 2 provided with the leveling jig 1 is extended into the work chamber, and the work of leveling the substrate is performed. The operation of pressing the substrate may refer to fig. 7 and 8, and the description thereof is not repeated. After the operation of flattening the substrate is finished, the mechanical working arm 2 of the substrate picking jig 2 ″ is arranged to enter the working chamber again and the flattened substrate 3 is taken out.

In summary, according to the substrate leveling device and the leveling jig disclosed in the present invention, the leveling jig can move vertically relative to the mechanical working arm. The leveling tool is moved above the substrate by the mechanical working arm, and then the mechanical working arm is vertically lowered to make the leveling tool physically contact with the surface of the substrate. The mechanical working arm continuously and vertically descends, and the leveling jig is not supported by the mechanical working arm any more. At the moment, the self weight of the leveling jig is applied to the position of the substrate where the substrate warps, and the warped position is flattened.

In addition, the substrate leveling device disclosed by the invention can comprise at least two mechanical working arms, wherein one mechanical working arm is provided with a substrate picking jig, and the other mechanical working arm is provided with a leveling jig. Compared with the prior art that a special machine platen flattening machine plate is needed, the invention can install the pick-up working arm and the flattening working arm in the same machine platen, so that the operations of processing the substrate and flattening the substrate can be completed in one machine platen.

[ notation ] to show

Leveling jig

Mechanical working arm

2

Substrate

Device for leveling substrate

Main body

An observation window

120

130

A flattening unit

21

A trench

Alignment unit

Thickness D1, D2, D3

Length of

H.

Claims

1. A substrate flattening apparatus, comprising:

at least one mechanical working arm; and

the flattening tool, can be relative this at least mechanical work arm vertical movement, this flattening tool contains:

a main body, which is arranged on the at least one mechanical working arm and is provided with an observation window;

a plurality of flattening units which are arranged in the peripheral area of the main body at intervals; and

and the alignment unit is arranged on the main body and corresponds to the observation window.

2. The apparatus of claim 1, wherein the main body of the leveling fixture has at least one guide post, the at least one robot arm has a through slot, and the at least one guide post is disposed in the through slot.

3. The substrate flattening apparatus of claim 2, wherein the flattening fixture is movable in a vertical direction, and a length of the at least one guide post in the vertical direction is greater than a thickness of the at least one robotic arm.

4. The substrate leveling device of claim 1, wherein the body of the leveling fixture has at least one bar-shaped locking hole, and the at least one mechanical arm has at least one groove corresponding to the at least one bar-shaped locking hole.

5. The apparatus of claim 1, wherein each of the flattening units of the flattening fixture has a buffer portion on a side thereof away from the main body.

6. The substrate flattening apparatus of claim 1, wherein the viewing window does not overlap the flattening units.

7. The substrate flattening apparatus of claim 6, wherein the alignment unit is disposed between adjacent ones of the flattening units.

8. The substrate flattening apparatus of claim 1, further comprising a substrate pickup fixture, wherein the at least one robot comprises a first robot and a second robot, the flattening fixture is disposed on the first robot, and the substrate pickup fixture is disposed on the second robot.

9. A leveling jig is characterized by comprising:

a body having a viewing window;

at least one flattening unit arranged in the peripheral area of the main body; and

10. The flattening fixture of claim 9, wherein the number of the at least one flattening unit is plural, and the flattening units are disposed at intervals in a peripheral region of the main body.

11. The flattening fixture of claim 10, wherein the viewing window does not overlap the flattening units, and the alignment unit is disposed between adjacent ones of the flattening units.

12. The flattening fixture of claim 10, wherein each of the flattening units of the flattening fixture has a cushioning material portion on a side away from the main body.

13. The flattening fixture of claim 9, wherein the alignment unit has a thickness less than a thickness of the at least one flattening unit in a direction from the center of the body to the edge of the body.