CN115656602A - A current sensor and its manufacturing method - Google Patents

Abstract

The present invention provides a current sensor and a manufacturing method thereof, comprising a housing on which a first groove is provided, wherein a first installation groove is provided on the side of the first groove away from the opening, and a first installation groove is provided on the first installation groove. The gap; the shell cover is arranged on the opening side of the first groove, wherein the side of the shell cover facing the first groove is provided with a first pressing member for fixing the chip; the glue filling area is arranged on the first groove The side away from the shell cover, wherein the depth of the glue filling area is lower than the gap of the first installation groove; when the iron core and the chip are installed in the first groove, the glue can surround the iron core by filling the glue filling area. The surface of the core, and not in contact with the chip, realizes partial glue filling, thereby avoiding the stress of the chip due to the heating of the glue. The current sensor provided by the invention has the characteristics of integration, miniaturization and high stability.

Description

A current sensor and its manufacturing method

technical field

The invention belongs to the technical field of sensors, in particular to a current sensor and a manufacturing method thereof.

Background technique

Current detection is an important function of the electronic control system of new energy vehicles, and its performance is directly related to the stability and reliability of electric vehicles; the current detection method based on the Hall current sensor has low loss, stable performance, built-in isolation, The advantages of strong overload capacity have gradually become the mainstream solution for current detection in new energy vehicles; with the vigorous development of the new energy vehicle industry, the market's requirements for the integration, miniaturization and stability of current sensors continue to increase.

In order to improve the integration and miniaturization of current sensors, the patent document CN202815058U discloses a "current sensor", which includes a magnetic core, a magnetic core support, a housing, and a chip arranged on the housing. Directly above the air gap of the magnetic core; the current sensor utilizes a chip to replace the PCBA part, reduces the volume of the current sensor, and omits the SMT and manual welding process in the prior art. At the same time, the magnetic core of the current sensor, The magnetic core bracket, the chip and the shell are integrally formed, with compact structure and reduced volume, which reduces the curing time of the shell and potting compound, shortens the production cycle, improves production efficiency, and reduces production costs; however, the current sensor There are the following problems; first, the temperature change of the potting glue will produce greater stress on the chip, and the water absorption rate of the potting glue is higher than that of the chip, forcing the chip to be in a wet state, resulting in abnormal performance of the current sensor; second, the The pin spacing of the chip is fixed and cannot be adjusted according to the change of the external interface spacing; third, the air gap opening of the iron core is prone to deformation when it vibrates or falls, making the size of the air gap opening unstable, resulting in the failure of the current sensor. The precision is reduced; Fourth, the magnetic core and the shell are integrally formed by an integral injection molding process, and the thermal expansion coefficient difference between the plastic shell and the ferromagnetic body is large, which is easy to generate high stress and cause the shell to crack.

In view of the above problems, the patent document CN208459468U discloses a "Hall current sensor" which includes a skeleton, a Hall assembly, an iron core assembly, and a package; the Hall assembly includes a Hall element, a PCB board, pins, and a package. The Hall elements and pins are respectively welded on the PCB board, and the outside of the PCB board is injected to form a Hall package shell; specifically, the pins of the chip are welded on the PCB board through surface mount technology (SMT), and the PCB pins are assembled through surface assembly. Technology (SMT) is welded on the PCB board, and the PCB board soldered with the chip and the PCB pin is injection-molded to form a Hall component; the Hall component is fixed on the installation groove, and one end with pins passes through the installation slot, and the other end goes through the air gap of the iron core assembly and pushes against the package shell; the skeleton is fixed on the iron core assembly, and the Hall assembly is fixed by fixing the skeleton and the package shell together; the solution is to connect the chip and the PCB board Secondary plastic sealing is carried out to form the Hall component, and it is fixed to the mounting groove in the package shell by plugging, which avoids the problems of the chip being in a wet state and stress with temperature changes through the overall glue filling method, and through the PCB The internal circuit setting of the board realizes the gap adjustment of the chip pins.

However, the Hall current sensor solution has the following problems: First, the chip, PCB and PCB pins need to be integrally molded and packaged after assembly, and the high temperature and high pressure during molding will generate greater stress on the chip and PCB, affecting the performance of the chip; Second, the packaged PCB chip needs to be baked, and the baking time is more than four hours, which reduces the mass production efficiency; third, the iron core assembly is fixed by riveting with a bracket, and the riveting fatigue is low and the strength is poor.

Contents of the invention

The object of the present invention is to solve the above-mentioned problems in the prior art, and propose a current sensor with integration, miniaturization and high stability.

The purpose of the present invention can be achieved through the following technical solutions, a current sensor, including iron core and chip, also includes:

The housing is provided with a first groove, wherein the first groove is provided with a first installation groove on the side away from the opening, and a notch is arranged on the first installation groove;

The case cover is arranged on the opening side of the first groove, wherein the side of the case cover facing the first groove is provided with a first pressing member for fixing the chip;

The glue filling area is located on the side of the first groove away from the shell cover, wherein the depth of the glue filling area is lower than the gap of the first installation groove; when the iron core and the chip are installed in the first groove, through the glue filling area Carry out glue filling, so that the glue can surround the surface of the iron core, and not contact with the chip, so as to realize local glue filling, so as to avoid the stress of the chip due to the heating of the glue.

In the above-mentioned current sensor, the first installation slot is hollow, one end of which passes through the housing, and the other end extends toward a side close to the case cover, and the notch is provided at the extension end of the first installation slot.

In the above-mentioned current sensor, there is a height difference between the notch and the side of the first groove away from the shell cover, wherein the height difference is greater than the depth of the glue filling area, so as to isolate the notch from the glue filling area.

In the above-mentioned current sensor, the first mounting groove is plugged with the chip, wherein the chip includes a pin end inserted into the first mounting groove through a gap on the side away from the shell cover, and is connected to the pin end And form a snap-fit plastic part end with the notch, so as to realize the isolation of the chip and the glue filling area.

In the above-mentioned current sensor, a second installation groove is provided on the side away from the notch of the first installation groove, wherein a first limit block is arranged in the second installation groove, and the side of the plastic part close to the pin end It is engaged with the first limit block.

In the above-mentioned current sensor, there are two first limiting blocks, and a sliding slot is formed between the two first limiting blocks, and a third installation slot is provided on the side of the sliding slot away from the notch.

In the above-mentioned current sensor, a limiting slot is provided in the third installation slot, and a pin bending part is snap-fitted with the limiting slot, wherein the pin bending part includes a slider connected to the sliding slot. block, and a second limit block snapped into the limit groove.

In the above-mentioned current sensor, a pin positioning part is provided on the side close to the notch of the pin bending part, wherein the pin positioning part extends away from the notch to form a pin guide part, so as to realize the pin positioning part. Spacing adjustment.

In the above-mentioned current sensor, the first pressing member is arranged at the position where the case cover is opposite to the notch, and extends toward the side of the case cover close to the first groove. When the chip is inserted into the first mounting groove, the first pressing member part-to-chip abutment.

The object of the present invention is also to provide a method for manufacturing a current sensor, based on the above-mentioned current sensor, comprising steps:

S1: Injection molding the casing, setting a first groove and a second groove, and setting a first installation groove in the first groove;

S2: setting a notch on the first installation groove, and setting the space of the first groove lower than the notch as the glue filling area;

S3: setting a second installation groove and a third installation groove in sequence in the first installation groove to realize the compatibility of the first installation groove, wherein the second installation groove forms a longitudinal positioning for the chip;

S4: making the lead bending part by injection molding, and forming a snap connection between the lead bending part and the third installation groove;

S5: Manufacture an iron core with a special-shaped structure through the winding process, and set an air gap on the iron core, and at the same time, set an iron core fixing piece on the air gap;

S6: Put the iron core into the second groove, and pour glue on the glue filling area, so that the glue surrounds the surface of the iron core and does not contact the chip, so as to realize partial glue filling;

S7: Injection molding the case cover, and setting a first pressing part and a second pressing part on the side of the case cover facing the first groove, wherein the first pressing part forms contact with the chip, and the second pressing part The parts form abutment against the iron core;

S8: By arranging a locking block on the housing and a buckle on the housing cover, the housing and the housing cover form a snap connection.

Compared with prior art, the beneficial effect of the present invention:

(1) In the current sensor provided by the present invention, by setting the glue filling area, the glue filling area is not in contact with the chip, so as to realize local glue filling, thereby avoiding the stress of the chip due to the heating of the glue, and effectively ensuring the performance of the chip.

(2) In the current sensor provided by the present invention, the iron core part is in contact with the colloidal colloid through local glue filling, which avoids cracking of the shell caused by high stress caused by the difference in thermal expansion coefficient between the iron core and the shell in the overall injection molding , effectively improving the service life of the sensor.

(3) In the current sensor provided by the present invention, a notch is provided on the first installation groove, and the area from the bottom of the first groove to below the notch is set as the glue-filling area to realize the positioning of the glue-filling area.

(4) In the current sensor provided by the present invention, a height difference is formed between the gap and the first groove away from the side of the shell cover, and the height difference is greater than the depth of the glue filling area, thereby realizing the isolation of the gap and the glue filling area , to prevent the chip from being affected by the potting compound.

(5), a kind of electric current sensor provided by the present invention, by arranging the pin bending part, and setting the pin positioning part and the pin guide part on the pin bending part, make the chip pin deform along the predetermined track, realize Adjustment of pin gap.

(6) The current sensor provided by the present invention can also pre-bend the chip pins through a pin bending process, so as to realize adjustment of the pin gap.

(7), a kind of electric current sensor provided by the present invention, by arranging the second installation groove and the third installation groove successively in the first installation groove, make the chip that has bent pin and the chip that does not bend pin all can be Installed in the first installation groove, the compatibility of the first installation groove is improved.

(8) In the current sensor provided by the present invention, the positioning of the chip is realized by setting the second mounting groove, and making the plastic end of the chip snap into the second mounting groove.

(9) In the current sensor provided by the present invention, by setting the first pressing member, the first pressing member forms contact with the chip after the shell cover is connected to the housing, so as to realize the fixing of the chip and prevent the chip from appearing after installation. loose.

(10) In the current sensor provided by the present invention, by setting the second pressing part, the second pressing part forms contact with the iron core after the shell cover is connected with the housing, so as to realize the fixing of the iron core and further ensure the core stability.

(11), a kind of electric current sensor provided by the present invention, realize the integration and miniaturization of electric current sensor by arranging the chip in the sensor, by arranging the first pressing part and the second pressing part, make the chip and iron The core can be stably fixed in the sensor, which effectively improves the stability of the current sensor.

Description of drawings

Fig. 1 is an explosion diagram of a current sensor of the present invention.

Fig. 2 is a structural schematic diagram of the casing of the present invention.

FIG. 3 is a structural schematic diagram of another viewing angle of FIG. 2 .

Fig. 4 is a sectional view A-A shown in Fig. 3 .

Fig. 5 is a structural schematic diagram of the shell cover of the present invention.

Fig. 6 is a schematic structural view of the lead bending part of the present invention.

Fig. 7 is a schematic structural diagram of a current sensor of the present invention.

Fig. 8 is a flow chart of the pin bending process of the present invention.

Fig. 9 is a schematic diagram of pin bending in the present invention.

Fig. 10 is a step diagram of the manufacturing method of the present invention.

In the figure, 1, shell; 100, first groove; 101, fixed block; 110, first installation groove; 111, second installation groove; 112, third installation groove; 113, notch; 114, first limit Bit block; 115, sliding groove; 116, limit groove; 117, rectangular groove; 120, second groove; 130, glue filling area; 140, pin bending piece; 141, slider; 142, second Limiting block; 143, pin positioning part; 144, pin guide part; 145, first radian; 146, second radian; 150, block; 160, first through hole; 161, protrusion; 162, pressure 170, bending fulcrum; 171, bending rod; 2, shell cover; 200, first pressing piece; 210, second pressing piece; 220, second through hole; 230, buckle; 3, Iron core; 300, air gap opening; 310, iron core fixing piece; 4, chip; 400, pin end; 410, plastic part end.

Detailed ways

The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

As shown in Figures 1 to 9, a current sensor provided by the present invention includes an iron core 3 and a chip 4, and also includes a housing 1 on which a first groove 100 is arranged, wherein the first groove 100 is far away from The opening side is provided with a first installation groove 110, and the first installation groove 110 is provided with a notch 113; The side is provided with a first pressing member 200 for fixing the chip 4; the glue filling area 130 is located on the side of the first groove 100 away from the shell cover 2, wherein the depth of the glue filling area 130 is lower than that of the first installation groove 110 gap 113; when the iron core 3 and the chip 4 are installed in the first groove 100, by filling the glue filling area 130 with glue, the glue can surround the surface of the iron core 3 without contacting the chip 4, realizing local Pouring the glue, so as to avoid the stress of the chip 4 due to the heating of the glue.

Specifically, the housing 1 is rectangular, and a first groove 100 and a second groove 120 are arranged on it, wherein the second groove 120 is arranged in the first groove 100 and faces away from the cover 2. One side extends, and the size of the second groove 120 is adapted to the iron core 3 for installing the iron core 3 and realizing the positioning of the iron core 3 .

Further, the center of the housing 1 is provided with a first through hole 160 which is circular and runs through the housing 1, wherein the first through hole 160 is provided with a protrusion 161 which is annular , extending along the side of the first through hole 160 close to the shell cover 2, on which several crush ribs 162 are arranged, and the crush ribs 162 are distributed around the side of the protrusion 161 close to the iron core 3, preferably, the crush ribs There are four ribs 162 , abutting against the inner side of the iron core 3 to fix the iron core 3 .

Further, the first groove 100 is provided with a fixing block 101, the fixing block 101 is set at the first groove 100 close to the second groove 120, preferably, there are four, surrounding the second groove Around 120, it is in contact with the outside of the iron core 3 to fix the iron core 3 and prevent the iron core 3 from being bumped and loosened.

Further, the iron core 3 is ring-shaped, and an air gap opening 300 is provided on it, and the air gap opening 300 is provided with an iron core fixing piece 310, which is L-shaped and connected to the air gap opening. 300 in contact with each other, wherein the iron core 3 is made by a winding process. In order to avoid deformation of the air gap opening 300 due to the impact of the iron core 3 or the influence of the temperature of the potting glue, the iron core fixing piece 310 is clamped between the air gap openings 300 and form a weld with the air gap openings 300 , thereby improving the stability of the iron core 3 .

Further, the iron core 3 is disposed in the second groove 120 and sleeved on the protrusion 161 to form contact with the crush rib 162 to realize the installation of the iron core 3 .

Further, the first installation groove 110 is set on the side of the first groove 100 close to the air gap opening 300 of the iron core 3, and the first installation groove 110 and the protrusion 161 are vertically arranged, wherein the first installation groove 110 One end is connected to the protrusion 161 , and the other end extends to the side of the housing 1 away from the protrusion 161 .

Further, the first installation groove 110 is hollow, and a rectangular groove 117 is arranged on it. One end of the rectangular groove 117 runs through the housing 1, and the other end extends toward the side close to the shell cover 2. The rectangular groove 117 The width of 117 is adapted to the thickness of the chip 4 to prevent the chip 4 from shaking left and right in the first installation groove 110 .

Further, the notch 113 is set at the extension end of the first installation groove 110, and the notch 113 is I-shaped, wherein the area from the first groove 100 to the notch 113 is the glue filling area 130, realizing the partial glue filling area 130 divided.

Further, there is a height difference between the notch 113 and the side of the first groove 100 away from the case cover 2 , wherein the height difference is greater than the depth of the glue filling area 130 , so as to isolate the notch 113 from the glue filling area 130 .

Further, the chip 4 includes a pin end 400, and a plastic part end 410 connected to the pin end 400, wherein the chip 4 pin end 400 is provided with several pins, preferably four , all form an electrical connection with the plastic part terminal 410 .

Further, the first installation groove 110 forms a plug fit with the chip 4, wherein the pin end 400 of the chip 4 is inserted into the side of the first installation groove 110 away from the case cover 2 through the gap 113, and the chip 4 The plastic part end 410 and the notch 113 form a clamped plastic part end 410 to realize the isolation of the chip 4 from the glue filling area 130 .

Further, the first mounting groove 110 is provided with a second mounting groove 111 on the side away from the notch 113 , wherein a first limiting block 114 is arranged in the second mounting groove 111 , and the first limiting block 114 is connected to the notch 113 Steps are formed between them, wherein, the side of the plastic part end 410 close to the pin end 400 is engaged with the first limiting block 114 to realize the longitudinal positioning of the chip 4 .

Further, the first limiting block 114 is provided with two trapezoidal shapes, both of which are attached to the inner wall of the second installation groove 111, wherein there is a certain distance between the two first limiting blocks 114 to form a sliding groove 115 , the side of the sliding groove 115 away from the notch 113 is provided with a third installation groove 112 , and the third installation groove 112 is provided with a limiting groove 116 to realize the positioning of the chip 4 .

Further preferably, the third installation groove 112 is provided with a pin bending piece 140 that is engaged with the limiting groove 116, wherein the pin bending piece 140 includes a slider 141 connected to the sliding groove 115, and The second limiting block 142 snapped into the limiting groove 116 .

Further, the pin bending part 140 is T-shaped, and the second limiting block 142 is provided with two, which are respectively engaged with the limiting groove 116, wherein the sliding block 141 is arranged on the A side of the pin bending member 140 close to the first limiting block 114 has a size adapted to the sliding slot 115 .

Further preferably, in order to realize the gap adjustment of the pins of the chip 4, the pin bending part 140 is provided with a pin positioning part 143 on the side away from the slider 141, and the pin positioning part 143 is a pin positioning recess. Groove, the number of the pin positioning grooves is adapted to the number of 4 pins of the chip, preferably, four pin positioning grooves are provided.

Further, the pin positioning groove is provided on the side of the pin bending part 140 close to the notch 113, wherein the pin positioning groove extends away from the notch 113 to form a pin guide part 144, so as to realize guiding Foot spacing adjustment.

Further, the pin guide part 144 is a pin guide groove, which is curved and includes a first arc 145 and a second arc 146, wherein the first arc 145 is located in the pin guide recess At the joint between the groove and the pin positioning groove, the second radian 146 is set on the side of the first radian 145 away from the notch 113, so as to realize the primary bending and secondary bending of the chip 4 pins, thereby realizing the adjustment of the pin spacing.

Furthermore, both the first arc 145 and the second arc 146 are rounded to avoid stress concentration at the first arc 145 and the second arc 146 , resulting in reduced pin strength or scratches on the plating.

Further, through the integration of the pin positioning part 143 and the pin guiding part 144, after the chip 4 is inserted into the lead bending part 140, its pins can be generated along the pin positioning part 143 and the pin guiding part 144. Deformation, so as to realize the adjustment of the pin spacing.

Further preferably, in order to realize the gap adjustment of the pins of the chip 4, the chip 4 can also be made through a pin bending process, and the steps of the pin bending process are firstly cutting the pins of the chip 4 , and then perform primary bending and secondary bending on the pins on both sides and the middle pin in turn, then perform fixed-length tailoring, and finally, blanking; in this pin bending process, the chip 4 plastic package is in the overall position Avoid the state to avoid damage caused by mechanical force.

Further, by performing primary bending and secondary bending on the pins of the chip 4 , the pitch adjustment of the pins is realized.

Further preferably, in the pin bending process, the bending fulcrum 170 is designed with rounded corners, so as to avoid the reduction of the pin strength or the scratch of the plating layer caused by the stress concentration of the bending fulcrum 170 .

Further preferably, in the pin bending process, the bending rod 171 for bending the pins of the chip 4 is cylindrical and made of Teflon or nylon to avoid damage to the pins of the chip 4 .

Further, the chip 4 processed by the pin bending process is inserted into the second mounting groove 111 through the first mounting groove 110, wherein the plastic part end 410 of the chip 4 is connected to the first mounting groove 111 of the second mounting groove 111. The limiting blocks 114 are in contact with each other to realize the longitudinal positioning of the chip 4 , and the pin end 400 of the chip 4 protrudes from the side of the housing 1 away from the notch 113 through the second installation groove 111 .

Further, the housing cover 2 is rectangular, and its size is adapted to the size of the housing 1 to form a seal for the housing 1 .

Further, the case cover 2 is provided with a second through hole 220 , which is circular and runs through the case cover 2 , and its size is compatible with the first through hole 160 .

Further preferably, the first pressing member 200 is arranged at the position where the case cover 2 is opposite to the notch 113, is irregular, and extends toward the side of the case cover 2 close to the first groove 100, when the chip 4 is inserted into the first installation groove 110, the first pressing member 200 abuts against the chip 4, so as to fix the chip 4 and prevent the chip 4 from loosening when being bumped.

Further, the shell cover 2 is provided with a second pressing member 210 on the side facing the housing 1, and the second pressing member 210 is cylindrical, and there are four of them, surrounding the second through hole 220, and moving towards the One side of the housing 1 extends to abut against the iron core 3 , so as to realize the fixation of the iron core 3 .

Further, a buckle 230 is provided on the outside of the case cover 2. The buckle 230 surrounds the case cover 2 and extends toward the side close to the housing 1. It is rectangular and hollow. Preferably, the buckle 230 is provided with Five, forming snap connection with the housing 1 to realize the fixing of the housing cover 2 and the housing 1 .

Further, the side of the housing 1 away from the first groove 100 is provided with a block 150 corresponding to the buckle 230 , the block 150 extends toward the side away from the first groove 100 , and is connected to the buckle 230 A clamp connection is formed to realize the fixing of the case cover 2 and the housing 1 .

As shown in Figures 1 to 10, the present invention also provides a method for manufacturing a current sensor, comprising steps:

S1: Injection molding the casing 1, setting the first groove 100 and the second groove 120, and setting the first installation groove 110 in the first groove 100;

S2: setting a notch 113 on the first installation groove 110, and setting the space of the first groove 100 lower than the notch 113 as the glue filling area 130;

S3: sequentially arrange the second installation groove 111 and the third installation groove 112 in the first installation groove 110 to realize the compatibility of the first installation groove 110, wherein the second installation groove 111 forms a longitudinal positioning for the chip 4;

S4: making the pin bending part 140 by injection molding, and forming the pin bending part 140 and the third installation groove 112 into clamping connection;

S5: Manufacture the iron core 3 with a special-shaped structure through a winding process, and set an air gap opening 300 on the iron core 3, and at the same time, weld the iron core 3 fixed sheet structure on the air gap opening 300;

S6: Put the iron core 3 into the second groove 120, and pour glue on the glue filling area 130, so that the glue surrounds the surface of the iron core 3 and does not contact the chip 4, so as to realize local glue filling;

S7: Injection-molding the case cover 2, and setting the first pressing member 200 and the second pressing member 210 on the side of the case cover 2 facing the first groove 100, wherein the first pressing member 200 is formed on the chip 4 Abutment, the second pressing member 210 forms an abutment against the iron core 3;

S8: By setting the locking block 150 on the housing 1 and the buckle 230 on the housing cover 2, the housing 1 and the housing cover 2 form a locking connection.

In general, when manufacturing a current sensor provided by the present invention, the iron core 3 is put into the second groove 120 first, the fixing block 101 is in contact with the iron core 3, and the glue potting area 130 is injected and sealed. Glue, so that the potting glue is covered with the bottom of the first groove 100, when the depth of the potting glue is close to the gap 113, stop injecting the potting glue, complete the fixing of the iron core 3, and then install the pin bending part 140 on the In the first mounting groove 110, the pin bending part 140 is engaged with the third groove, and then the chip 4 is installed in the pin bending part 140 through the first mounting groove 110, so that the pins of the chip 4 are along the The lead guide part 144 is bent, and then, the case cover 2 is placed on the opening side of the housing 1, so that the first pressing part 200 is in contact with the plastic part end 410 of the chip 4, and the second pressing part 210 is in contact with the plastic part end 410 of the chip 4. The iron core 3 forms an abutment, and finally, the clamp block 150 is clamped into the corresponding buckle 230 to complete the manufacture of the current sensor.

It is worth noting that after the chip 4 has been processed by the chip 4-pin bending process, it can be directly inserted into the first installation groove 110 to form a snap connection with the second installation groove 111, without additional installation of the pin bending member 140. The pitch adjustment of the 4 pins of the chip can be realized.

It should be noted that, in the present invention, descriptions involving "first", "second", "one" and so on are only for descriptive purposes, and should not be understood as indicating or implying their relative importance or implicitly indicating The number of technical characteristics. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. The terms "connection" and "fixation" should be interpreted in a broad sense, for example, "fixation" can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be a direct connection , can also be indirectly connected through an intermediary, and can be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In addition, the technical solutions of the various embodiments of the present invention can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered as a combination of technical solutions. Does not exist, nor is it within the scope of protection required by the present invention.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which the present invention belongs can make various modifications or supplements to the described specific embodiments or adopt similar methods to replace them, but they will not deviate from the spirit of the present invention or go beyond the definition of the appended claims range.

Claims (10)

1. A current sensor, comprising iron core (3) and chip (4), is characterized in that, comprises: The housing (1) is provided with a first groove (100), wherein the first groove (100) is provided with a first installation groove (110) away from the opening side, and the first installation groove (110) is provided with gapped(113); The case cover (2) is arranged on the opening side of the first groove (100), wherein the side of the case cover (2) facing the first groove (100) is provided with a first pressing member (200) for fixed chip (4); The glue filling area (130) is located on the side of the first groove (100) away from the shell cover (2), wherein the depth of the glue filling area (130) is lower than the notch (113) of the first installation groove (110); When the iron core (3) and chip (4) are installed in the first groove (100), by filling the glue area (130) with glue, the glue can surround the surface of the iron core (3) without contact with the chip (4) contact with each other to realize partial filling of glue, so as to avoid stress on the chip (4) due to heating of the glue. 2. A current sensor according to claim 1, characterized in that, the first mounting groove (110) is hollow, one end of which runs through the housing (1), and the other end faces toward the housing cover (2). The side extends, and the notch (113) is arranged at the extension end of the first installation groove (110). 3. A current sensor according to claim 2, characterized in that there is a height difference between the notch (113) and the side of the first groove (100) away from the case cover (2), wherein the height difference is greater than The depth of the glue filling area (130) is used to realize the isolation of the gap (113) and the glue filling area (130). 4. A current sensor according to claim 3, characterized in that, the first mounting groove (110) forms a plug fit with the chip (4), wherein the chip (4) includes a through notch (113) Insert the pin end (400) on the side away from the case cover (2) of the first installation groove (110), and the plastic part end (410) connected to the pin end (400) and forming a clamping connection with the notch (113), In order to realize the isolation of the chip (4) and the glue filling area (130). 5. A current sensor according to claim 4, characterized in that, the side of the first installation groove (110) away from the notch (113) is provided with a second installation groove (111), wherein the second installation groove (111) is provided with a first limiting block (114), and the side of the plastic part end (410) close to the pin end (400) is engaged with the first limiting block (114). 6. A kind of current sensor according to claim 5, is characterized in that, described first limit block (114) is provided with two, and forms sliding groove (114) between two first limit blocks (114) 115), the side of the slide groove (115) away from the notch (113) is provided with a third installation groove (112). 7. A current sensor according to claim 6, characterized in that, the third mounting groove (112) is provided with a limiting groove (116), and pins that are engaged with the limiting groove (116) A bending piece (140), wherein the pin bending piece (140) includes a slider (141) connected to the sliding groove (115), and a second limiting block (142) snapped into the limiting groove (116) ). 8. A current sensor according to claim 7, characterized in that a pin positioning part (143) is provided on the side of the pin bending part (140) close to the notch (113), wherein the pin The positioning part (143) extends away from the notch (113) to form a lead guide part (144), so as to realize the adjustment of the lead distance. 9. A current sensor according to claim 1, characterized in that, the first pressing member (200) is arranged at the position opposite to the notch (113) of the case cover (2), and faces the case cover (2) Extending near the side of the first groove (100), when the chip (4) is inserted into the first installation groove (110), the first pressing member (200) abuts against the chip (4). 10. A method for manufacturing a current sensor, characterized in that, based on a current sensor according to any one of claims 1-9, comprising steps; S1: Injection molding the shell (1), setting a first groove (100) and a second groove (120), and setting a first installation groove (110) in the first groove (100); S2: setting a notch (113) on the first installation groove (110), and setting the space of the first groove (100) lower than the notch (113) as the glue filling area (130); S3: Set the second installation groove (111) and the third installation groove (112) in sequence in the first installation groove (110) to realize the compatibility of the first installation groove (110), wherein the second installation groove (111) Form longitudinal positioning to chip (4); S4: making the pin bending part (140) by injection molding, and forming a snap connection between the pin bending part (140) and the third installation groove (112); S5: Manufacture the iron core (3) with a special-shaped structure through the winding process, and set the air gap (300) on the iron core (3), and at the same time, set the iron core (3) on the air gap (300) to fix piece; S6: Put the iron core (3) into the second groove (120), and pour glue on the glue filling area (130), so that the glue surrounds the surface of the iron core (3) and does not contact the chip (4) , realize partial glue filling; S7: Injection molding the case cover (2), and setting the first pressing part (200) and the second pressing part (210) on the side of the case cover (2) facing the first groove (100), wherein, The first pressing part (200) forms an abutment against the chip (4), and the second pressing part (210) forms an abutment against the iron core (3); S8: The housing (1) and the housing cover (2) are snapped together by arranging a locking block (150) on the housing (1) and a buckle (230) on the housing cover (2).

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