CN115623698A - Processing method of leadless electroplating - Google Patents
Processing method of leadless electroplating Download PDFInfo
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- CN115623698A CN115623698A CN202211616172.2A CN202211616172A CN115623698A CN 115623698 A CN115623698 A CN 115623698A CN 202211616172 A CN202211616172 A CN 202211616172A CN 115623698 A CN115623698 A CN 115623698A
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- layer
- copper
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- solder mask
- electroplating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of printed circuits, in particular to a processing method of leadless electroplating, which sequentially comprises the following steps: manufacturing a solder mask layer, evaporating copper plating, pasting a film, electroplating nickel and gold, and removing the film and copper; in the solder mask layer manufacturing step, curing the solder mask layer by using photocuring and thermocuring; after curing, carrying out Plasma treatment on the solder mask layer; in the step of evaporating copper plating, plating a copper layer on the surface of the workpiece by using a vapor deposition method; the process does not need to reserve an area for the lead in the substrate, increases the utilization rate of the substrate, increases the wiring space, can reduce the area of the substrate under the condition that the bonding pads are the same, improves the freedom degree of the design of the substrate, and increases the density degree of the circuit of the substrate.
Description
Technical Field
The invention relates to the technical field of printed circuits, in particular to a processing method of leadless electroplating.
Background
With the miniaturization and the improvement of the integration of components, on the premise that the chip size is fixed, dense routing with high density and micronization is required, and the further micronization of the circuit on the substrate is inevitably caused.
In the prior art, in order to enable the pad to be subjected to electroplating treatment, a lead needs to be arranged to conduct a pad and an electroplating clamping point, and current is allowed to pass through the pad and the electroplating clamping point so as to achieve the electroplating effect.
Disclosure of Invention
The invention aims to provide a processing method of leadless electroplating, aiming at the defects of the prior art, the technology comprises the steps of firstly coating a solder mask layer on a base plate, then plating a copper layer on the surface of the base plate in an evaporation copper plating mode to be used as a lead, carrying out electroplating operation on a pad in a pattern, and then removing the copper layer by using a corresponding process, so that no lead remains exist, and the utilization rate of the base plate is increased.
In order to achieve the purpose, the invention provides the following technical scheme:
the processing method of the leadless electroplating comprises the following steps in sequence:
manufacturing a solder mask layer, evaporating copper plating, pasting a film, electroplating nickel and gold, and removing the film and copper;
in the solder mask manufacturing step, curing the solder mask by using photocuring and thermocuring; after curing, performing Plasma treatment on the solder mask;
in the step of the evaporation copper plating, a copper layer is plated on the surface of the workpiece by using a vapor deposition method.
Further, carrying out sand blasting treatment on the substrate, wherein the Ra value of the surface roughness of the substrate after the sand blasting treatment is 0.1-0.2 mu m.
Further, the solder mask layer is manufactured by coating a solder mask layer on a base plate, exposing the solder mask layer by using a UV exposure machine, removing the unexposed solder mask layer, processing the solder mask layer by using photo-curing and thermosetting, and then performing Plasma processing on the cured solder mask layer.
The Plasma treatment increases the wettability of the surface of the solder mask layer and increases the binding force between the solder mask layer and the base plate.
The treatment power of the Plasma is 400 to 600W, the treatment time is 4 to 6min 2 The flow rate is 200 to 400sccm.
The solder mask layer is one of AUS308, AUS320 and SR1 ink.
AUS308, AUS320, SR1 are all commercially available products of Suzhou ink, inc.
Further, the exposure energy of the solder mask layer exposure is 200 to 700mJ/cm 2 。
Irradiating the solder mask layer to be reserved to polymerize the solder mask layer, and using Na with the mass concentration of 1-2% 2 CO 3 The solution is used as a developer to remove the unexposed solder mask layer.
Further, carrying out photocuring treatment by using a UV curing machine, wherein the irradiation energy is 1000 to 1500mJ/cm 2 (ii) a And (3) carrying out thermal curing treatment by using an oven, wherein the thermal curing temperature is 110-130 ℃, and the thermal curing time is 20-40min.
Further, the evaporation copper plating is to place the substrate made of the solder mask layer in a vacuum chamber, perform vacuum pumping treatment, and plate a copper layer on the surface of the substrate with the bonding pad by using a vacuum evaporation method.
Further, the thickness of the copper layer is 0.5 to 1 mu m.
Further, the film pasting is to carry out sand blasting on the substrate after the evaporation copper plating treatment, paste a dry film in vacuum, irradiate the dry film which does not need to be plated with nickel and gold by using a UV exposure machine, and use Na with the mass concentration of 1-2% 2 CO 3 Taking the solution as a developer to remove the dry film which is not subjected to exposure treatment, and using H with the mass concentration of 1-3% 2 SO 4 Solution and H with mass concentration of 1 to 3 percent 2 O 2 The solution is used as an etching solution to remove the copper layer on the bonding pad.
The surface roughness Ra of the copper layer after the sand blasting treatment is 0.1 to 0.2 mu m.
The exposure energy of dry film exposure is 90 to 110mJ/cm 2 。
Further, the nickel-gold electroplating and film removing and copper removing are to plate a nickel layer on the substrate subjected to film pasting by using a nickel-gold electroplating process, use a NaOH solution with the concentration of 30 to 50g/L as an alkaline cleaning solution to remove an exposed dry film, and use H with the mass concentration of 1 to 3% 2 SO 4 Solution and H with mass concentration of 1 to 3 percent 2 O 2 The solution is used as an etching solution to remove the copper layer on the surface of the solder resist layer.
The invention has the following beneficial effects:
(1) The process provided by the invention does not need to reserve a region for the lead in the substrate, thereby increasing the utilization rate of the substrate, increasing the wiring space, reducing the area of the substrate under the condition that the bonding pads are the same, improving the freedom degree of the design of the substrate and increasing the density degree of the circuit of the substrate.
(2) According to the invention, the solder mask layer is further cured by processing the solder mask layer, the bonding force between the solder mask layer and the copper layer is enhanced, and the uniformity of the copper layer is ensured.
(3) The method comprises the steps of firstly carrying out sand blasting treatment on the copper layer, ensuring that the dry film is tightly attached to the copper layer by adopting a vacuum film pasting mode, and avoiding the defects in the nickel-gold electroplating process.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not limit the invention. In the drawings:
FIG. 1 is a cross-sectional view of a substrate subjected to a solder resist treatment in a solder resist layer manufacturing step according to an embodiment;
FIG. 2 is a cross-sectional view of a substrate subjected to a solder resist layer formation process in an embodiment;
FIG. 3 is a cross-sectional view of a substrate subjected to an evaporation copper plating treatment in the example;
FIG. 4 is a cross-sectional view of a substrate subjected to a film-attaching treatment in the embodiment;
FIG. 5 is a cross-sectional view of a substrate having undergone an etching process in the step of electroplating nickel and gold according to one embodiment;
FIG. 6 is a cross-sectional view of the substrate treated with Ni/Au plating in the example;
FIG. 7 is a cross-sectional view of a substrate treated with an alkaline cleaning solution in an exemplary film removal and copper removal step;
FIG. 8 is a cross-sectional view of a substrate subjected to a film removal and copper removal process in accordance with one embodiment;
in the figure: 1. a base plate; 2. a bonding pad; 3. a solder resist layer; 4. a copper layer; 5. drying the film; 6. a nickel layer.
Detailed Description
The present invention will be further described with reference to the following examples.
Example 1
The processing method of the leadless electroplating comprises the following steps:
manufacturing a solder mask layer 3, evaporating copper plating, film pasting, nickel gold electroplating, film removing and copper removing;
and (3) manufacturing a solder mask layer: (1) Performing resistance welding pretreatment, namely roughening the surface of the base plate 1 by using carborundum as a sand blasting material to enable the surface roughness Ra value of the base plate 1 to reach 0.1 mu m and increase the binding force between the base plate 1 and printing ink; (2) Manufacturing a solder mask layer 3, performing screen printing by using AUS308 ink, printing the ink on the bottom plate 1, and pre-baking for 20min at the temperature of 80 ℃; (3) Solder mask exposure, performing exposure treatment with ORC exposure machine with exposure energy of 200mJ/cm 2 Selectively curing the solder resist at an exposure speed of 2m/min to form a solder resist layer 3; (4) Development, using Na at a concentration of 1% by mass 2 CO 3 Removing the solder resist which is not exposed by using the solution as a developing solution; (5) post-curing: curing treatment was carried out using a UV curing machine and a baking oven, the energy of the UV curing machine being 1000mJ/cm 2 The speed is 5m/min, the temperature of the baking oven is 110 ℃, and the time is 20min; (6) The Plasma treatment has the treatment power of 400W and the treatment time of 4min 2 The flow rate was 200sccm.
And (3) evaporation copper plating: the surface of the substrate was subjected to evaporation treatment using an evaporation copper plating apparatus at a processing speed of 1m/min to form a copper layer 4 having a thickness of 0.5 μm on the surface of the substrate.
Film pasting: (1) Using carborundum as a sand blasting material again, and coarsening and evaporating the copper layer 4 generated by copper plating to ensure that the surface roughness Ra value of the copper layer 4 reaches 0.1 mu m; (2) Forming a film layer tightly attached to the copper layer 4 on the surface of the copper layer 4 by using vacuum film attaching equipment; (3) Irradiating the dry film 5 without being plated with nickel and gold by using an exposure machine with exposure energy of 90mJ/cm 2 The speed is 5m/min; (4) Na with a mass concentration of 1% was used 2 CO 3 And developing the dry film 5 by using the solution, removing the uncured dry film 5 and exposing the bonding pad 2 to be electroplated.
Electroplating nickel and gold: using 1% by mass of H 2 SO 4 Solution and 1% by mass of H 2 O 2 The solution is used as etching solution to remove the copper layer 4 on the surface of the bonding pad 2, and the nickel layer 6 is plated on the bonding pad 2 by electroplating
Removing the film and copper: removing the exposed dry film 5 at 60 deg.C with NaOH solution with concentration of 30g/L as alkaline cleaning solution, and H with mass concentration of 1% 2 SO 4 Solution and 1% by mass of H 2 O 2 And removing the copper layer 4 on the surface of the solder mask layer 3 by using the solution as etching liquid to finish the whole leadless electroplating processing.
Example 2
The processing method of the leadless electroplating comprises the following steps:
manufacturing a solder mask layer 3, evaporating copper plating, film pasting, nickel gold electroplating, film removing and copper removing;
and (3) manufacturing a solder mask layer: (1) Performing resistance welding pretreatment, namely using carborundum as a sand blasting material to roughen the surface of the base plate 1, so that the surface roughness Ra of the base plate 1 reaches 0.2 mu m, and the binding force between the base plate 1 and printing ink is increased; (2) Manufacturing a solder mask layer 3, performing screen printing by using AUS320 ink, printing the ink on the bottom plate 1, and pre-baking for 20min at the temperature of 80 ℃; (3) Solder mask exposure, performing exposure treatment by using an ORC exposure machine with exposure energy of 700mJ/cm 2 Selectively curing the solder resist at an exposure speed of 2m/min to form a solder resist layer 3; (4) Development, using Na in a mass concentration of 2% 2 CO 3 Removing the solder resist which is not exposed by using the solution as a developing solution; (5) post-curing: curing treatment was carried out using a UV curing machine and a baking oven, the energy of the UV curing machine being 1500mJ/cm 2 The speed is 5m/min, the temperature of the baking oven is 130 ℃, and the time is 40min; (6) The Plasma treatment was carried out at a treatment power of 600W for a treatment time of 6min 2 The flow rate was 400sccm.
And (3) evaporation copper plating: the surface of the substrate was subjected to evaporation treatment using an evaporation copper plating apparatus, the processing speed during evaporation copper plating was 1m/min, and a copper layer 4 having a thickness of 1 μm was formed on the surface of the substrate.
Film pasting: (1) Then, carborundum is used as a sand blasting material, and the copper layer 4 generated by copper plating is coarsened and evaporated, so that the surface roughness Ra value of the copper layer 4 reaches 0.2 mu m; (2) Vacuum film pasting equipmentForming a film layer tightly attached to the copper layer 4 on the surface of the copper layer 4; (3) Irradiating the dry film 5 without plating nickel and gold by using an exposure machine with exposure energy of 110mJ/cm 2 The speed is 5m/min; (4) Na with a mass concentration of 2% is used 2 CO 3 And developing the dry film 5 by using the solution, removing the uncured dry film 5 and exposing the bonding pad 2 to be electroplated.
Electroplating nickel and gold: using 3% by mass of H 2 SO 4 Solution and 3% by mass of H 2 O 2 The solution is used as etching solution to remove the copper layer 4 on the surface of the bonding pad 2, and the nickel layer 6 is plated on the bonding pad 2 by electroplating
Removing the film and copper: removing the exposed dry film 5 with NaOH solution of 50g/L concentration as alkaline washing liquid at 60 deg.C, and using H of 3% mass concentration 2 SO 4 Solution and 3% by mass of H 2 O 2 And removing the copper layer 4 on the surface of the solder mask layer 3 by using the solution as etching liquid to finish the whole leadless electroplating processing.
Example 3
The processing method of the leadless electroplating comprises the following steps:
manufacturing a solder mask layer 3, evaporating copper plating, film pasting, nickel gold electroplating, film removing and copper removing;
and (3) manufacturing a solder mask layer: (1) Performing resistance welding pretreatment, namely roughening the surface of the base plate 1 by using carborundum as a sand blasting material to enable the surface roughness Ra value of the base plate 1 to reach 0.15 mu m and increase the binding force between the base plate 1 and printing ink; (2) Manufacturing a solder mask layer 3, performing screen printing by using SR1 ink, printing the ink on the bottom plate 1, and pre-baking for 20min at the temperature of 80 ℃; (3) Solder mask exposure, performing exposure treatment by using ORC exposure machine with exposure energy of 480mJ/cm 2 Selectively curing the solder resist at an exposure speed of 2m/min to form a solder resist layer 3; (4) Development, using Na with a mass concentration of 1.5% 2 CO 3 Removing the solder resist which is not exposed by using the solution as a developing solution; (5) post-curing: curing treatment was carried out using a UV curing machine having an energy of 1200mJ/cm and a baking oven 2 The speed is 5m/min, the temperature of the baking oven is 120 ℃, and the time is 30min; (6) Plasma treatment, in the case of Plasma treatmentThe treatment power is 500W, the treatment time is 5min 2 The flow rate was 300sccm.
And (3) evaporation copper plating: the surface of the substrate was subjected to evaporation treatment using an evaporation copper plating apparatus, the processing speed during evaporation copper plating was 1m/min, and a copper layer 4 having a thickness of 0.8 μm was formed on the surface of the substrate.
Film pasting: (1) Using carborundum as a sand blasting material again, and coarsening and evaporating the copper layer 4 generated by copper plating to ensure that the surface roughness Ra value of the copper layer 4 reaches 0.15 mu m; (2) Forming a film layer tightly attached to the copper layer 4 on the surface of the copper layer 4 by using vacuum film attaching equipment; (3) Irradiating the dry film 5 without plating nickel and gold by using an exposure machine with exposure energy of 100mJ/cm 2 The speed is 5m/min; (4) Na with a mass concentration of 1.5% was used 2 CO 3 And developing the dry film 5 by using the solution, removing the uncured dry film 5 and exposing the bonding pad 2 to be electroplated.
Electroplating nickel and gold: using 2% by mass of H 2 SO 4 Solution and 2% by mass of H 2 O 2 The solution is used as etching solution to remove the copper layer 4 on the surface of the bonding pad 2, and the nickel layer 6 is plated on the bonding pad 2 by electroplating
Removing the film and copper: removing the exposed dry film 5 at 60 deg.C with NaOH solution with concentration of 40g/L as alkaline cleaning solution, and H with mass concentration of 2% 2 SO 4 Solution and 2% by mass of H 2 O 2 And removing the copper layer 4 on the surface of the solder mask layer 3 by using the solution as etching liquid to finish the whole leadless electroplating processing.
Claims (9)
1. The processing method for leadless electroplating is characterized by sequentially comprising the following steps of:
manufacturing a solder mask layer (3), evaporating copper plating, film pasting, nickel and gold electroplating, and removing copper by removing a film;
in the solder mask layer (3) manufacturing step, curing the solder mask layer (3) by using photo-curing and thermosetting; after curing, performing Plasma treatment on the solder mask layer (3);
in the evaporation copper plating step, a copper layer (4) is plated on the surface of the substrate by using a vapor deposition method.
2. The method of processing leadless plating according to claim 1, wherein the solder resist layer (3) is made by coating the solder resist layer (3) on the base plate (1), exposing the solder resist layer (3) using a UV exposure machine, removing the solder resist layer (3) not exposed, processing the solder resist layer (3) using photo-curing and thermal curing, and then performing Plasma processing on the cured solder resist layer (3).
3. The method for processing leadless electroplating according to claim 2, wherein the solder mask layer (3) is one of AUS308, AUS320 and SR1 ink.
4. The method of claim 2, wherein the exposure energy of the solder mask (3) is 200 to 700mJ/cm 2 。
5. The method of claim 2, wherein the light curing is performed by a UV curing machine with an irradiation energy of 1000 to 1500mJ/cm 2 (ii) a And (3) performing thermal curing treatment by using an oven, wherein the thermal curing temperature is 110 to 130 ℃, and the thermal curing time is 20 to 40min.
6. The method for processing leadless electroplating according to claim 1, wherein the evaporation copper plating is to place the substrate after the solder mask layer (3) is formed in a vacuum chamber, vacuumize the substrate, and plate a copper layer (4) on the surface of the substrate having the pad (2) by vacuum evaporation.
7. The method for processing leadless electroplating according to claim 6, wherein the thickness of the copper layer (4) is 0.5 to 1 μm.
8. The method of manufacturing leadless electroplating according to claim 1, wherein the film coating is performed by sand blasting the substrate after the evaporation copper plating treatment, vacuum coating of the dry film (5), irradiation of the dry film (5) not requiring nickel-gold plating using a UV exposure machine, removal of the dry film (5) not subjected to the exposure treatment using a developer solution, and removal of the copper layer (4) on the pad (2) using an etchant solution.
9. The method for processing leadless electroplating according to claim 8, wherein the nickel-gold electroplating and film copper removing are to plate a nickel layer (6) on the substrate after the film attaching process by using a nickel-gold electroplating process, remove the exposed dry film (5) by using an alkaline cleaning solution, and remove the copper layer (4) on the surface of the solder resist (3) by using an etching solution.
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| CN202211616172.2A CN115623698A (en) | 2022-12-16 | 2022-12-16 | Processing method of leadless electroplating |
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| CN202211616172.2A CN115623698A (en) | 2022-12-16 | 2022-12-16 | Processing method of leadless electroplating |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH057081A (en) * | 1991-06-27 | 1993-01-14 | Sanyo Electric Co Ltd | Manufacture of multilayer wiring substrate |
| JP2001110939A (en) * | 1999-10-12 | 2001-04-20 | Nippon Circuit Kogyo Kk | Semiconductor package substrate and manufacturing method thereof |
| JP2001110940A (en) * | 1999-10-12 | 2001-04-20 | Nippon Circuit Kogyo Kk | Semiconductor package substrate and manufacturing method thereof |
| US20040173375A1 (en) * | 2003-02-24 | 2004-09-09 | Samsung Electro-Mechanics Co., Ltd. | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| CN103140042A (en) * | 2011-11-25 | 2013-06-05 | 苏州群策科技有限公司 | Surface processing method for electroless plating wire of printed circuit board |
| JP2021027224A (en) * | 2019-08-07 | 2021-02-22 | イビデン株式会社 | Method for manufacturing printed wiring board |
-
2022
- 2022-12-16 CN CN202211616172.2A patent/CN115623698A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH057081A (en) * | 1991-06-27 | 1993-01-14 | Sanyo Electric Co Ltd | Manufacture of multilayer wiring substrate |
| JP2001110939A (en) * | 1999-10-12 | 2001-04-20 | Nippon Circuit Kogyo Kk | Semiconductor package substrate and manufacturing method thereof |
| JP2001110940A (en) * | 1999-10-12 | 2001-04-20 | Nippon Circuit Kogyo Kk | Semiconductor package substrate and manufacturing method thereof |
| US20040173375A1 (en) * | 2003-02-24 | 2004-09-09 | Samsung Electro-Mechanics Co., Ltd. | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| CN103140042A (en) * | 2011-11-25 | 2013-06-05 | 苏州群策科技有限公司 | Surface processing method for electroless plating wire of printed circuit board |
| JP2021027224A (en) * | 2019-08-07 | 2021-02-22 | イビデン株式会社 | Method for manufacturing printed wiring board |
Non-Patent Citations (1)
| Title |
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| 宋长发, 国防工业出版社 * |
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