CN115577672B - Through hole unit determination method and device, electronic equipment and storage medium - Google Patents

Abstract

The present application relates to the technical field of integrated circuits, and in particular to a method, device, electronic equipment, and storage medium for determining through-hole units, which are used to improve the efficiency of determining through-hole units. The main solution is: identify the metal line width of the wiring metal layer from the current layout design information; calculate the width difference between the metal line width of the wiring metal layer and the metal width of each via cell metal layer in the via cell library , the via cell library includes different via cell information corresponding to metal widths of different via cell metal layers; the wiring metal layer is determined according to the via cell information corresponding to the via cell metal layer with the smallest width difference through-hole unit.

Description

Method, device, electronic equipment and storage medium for determining through-hole unit

technical field

The present application relates to the technical field of integrated circuits, and in particular to a method, device, electronic equipment and storage medium for determining a via unit.

Background technique

The technical files required by digital back-end layout and routing tools include process information of each layer, layout and routing rules of metal lines and vias, etc. In the prior art, the through-hole unit is usually defined in the technical document, and the through-hole unit includes the size of the through-hole, the name of the upper and lower metal lines and the wrapping distance to the through-hole. When routing, the routing is done by selecting the defined via cells. As the process size becomes smaller, the degree of integration becomes higher and higher, and the design rules become more and more complex, more and more types of through-hole units are defined, and a large number of through-hole units need to be defined in technical documents for use in wiring , the definition of through-hole units is manual definition, and different line widths need to define through-hole units with different wrapping distances. With the increase of line width, the types of through-hole units required also increase significantly, the amount of data is large, the content is cumbersome, and definitions are easy to appear Mistakes, incomplete definitions, etc., lead to the failure to select the appropriate through-hole unit during wiring, which ultimately affects the efficiency of process/chip development.

Contents of the invention

In view of this, the present application provides a method, device, electronic device, and storage medium for determining a through-hole unit, so as to improve the efficiency of determining the through-hole unit.

In the first aspect, the embodiment of the present application provides a method for determining a via unit, the method including:

identifying the metal line width of the wiring metal layer from the current layout design information;

Calculate the width difference between the metal line width of the wiring metal layer and the metal width of each via cell metal layer in the via cell library, the via cell library contains different via cell information corresponding to different vias The metal width of the element metal layer;

The via unit of the wiring metal layer is determined according to the via unit information corresponding to the via unit metal layer with the smallest width difference.

In the second aspect, the embodiment of the present application also provides a device for determining a through-hole unit, which includes:

An identification module, configured to identify the metal line width of the wiring metal layer from the current layout design information;

A calculation module, configured to calculate the width difference between the metal line width of the wiring metal layer and the metal width of each via cell metal layer in the via cell library, the via cell library contains different via cell information respectively Corresponding to the metal width of different via unit metal layers;

The determination module is configured to determine the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference.

In the third aspect, the embodiment of the present application also provides an electronic device, including: a processor, a memory, and a bus. The memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory pass through The bus communicates, and the machine-readable instructions are executed by the processor to execute the steps of the method for determining the via unit in the first aspect.

In the fourth aspect, the embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is run by the processor, the method for determining the through-hole unit in the above-mentioned first aspect is executed. A step of.

A method, device, electronic device, and storage medium for determining a through-hole unit provided in an embodiment of the present application firstly identify the metal line width of the wiring metal layer from the current layout design information; then calculate the relationship between the metal line width of the wiring metal layer and The width difference corresponding to the metal width of each via unit metal layer in the via unit library, and finally determine the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference. Since the via cell library in this application contains different via cell information corresponding to the metal width of different via cell metal layers, it can be calculated by calculating the metal line width of the wiring metal layer and each via cell in the via cell library. The width difference corresponding to the metal width of the metal layer can determine the corresponding via unit. Compared with the manual definition of the via unit in the prior art, the present application can automatically confirm the corresponding via unit based on the metal line width of the wiring metal layer, so that the determination efficiency of the via unit can be improved through the present invention.

In order to make the above-mentioned purpose, features and advantages of the present application more comprehensible, preferred embodiments will be described in detail below together with the accompanying drawings.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, so It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

FIG. 1 shows a flowchart of a method for determining a through-hole unit provided by an embodiment of the present application;

FIG. 2 shows a structural diagram of a wiring metal layer provided by an embodiment of the present application;

FIG. 3 shows a structural diagram of a via unit metal layer provided by an embodiment of the present application;

FIG. 4 shows a structural diagram of a square hole in a metal layer of a via unit provided by an embodiment of the present application;

FIG. 5 shows a structural diagram of a long hole in a metal layer of a via unit provided by an embodiment of the present application;

FIG. 6 shows a schematic diagram of a via cell array provided by an embodiment of the present application;

FIG. 7 shows a schematic diagram of a through-hole unit with a cutting layer provided by an embodiment of the present application;

FIG. 8 shows a structural block diagram of an apparatus for determining a through-hole unit provided by an embodiment of the present application.

Detailed ways

The terms "first", "second" and "third" in the specification and claims of the present application and the above drawings are used to distinguish different objects, rather than to limit a specific order.

In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. To be precise, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner for easy understanding.

In the description of this application, unless otherwise specified, "/" means that the objects associated with each other are an "or" relationship, for example, A/B can mean A or B; "and/or" in this application is only It is an association relationship describing associated objects, which means that there can be three kinds of relationships, for example, A and/or B, which can mean: A exists alone, A and B exist at the same time, and B exists alone, among which A, B Can be singular or plural. And, in the description of the present application, unless otherwise specified, "plurality" means two or more than two. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple .

In the embodiment of this application, at least one can also be described as one or more, and multiple can be two, three, four or more, which is not limited in this application.

As shown in Figure 1, the embodiment of the present application provides a method for determining a through-hole unit, and the method for determining a through-hole unit provided in this application may include:

S10. Identify the metal line width of the wiring metal layer from the current layout design information.

Wherein, the wiring metal layer includes a wiring metal top layer and a wiring metal bottom layer. As shown in FIG. 2 , the number 1 is the top layer of the wiring metal, w1 is the width of the metal line on the top layer of the wiring metal; the number 2 is the bottom layer of the wiring metal, and w2 is the width of the metal line on the bottom layer of the wiring metal.

S20. Calculate the width difference corresponding to the metal line width of the wiring metal layer and the metal width of each via cell metal layer in the via cell library.

Wherein, the via cell metal layer includes: a via cell metal top layer and a via cell metal bottom layer. As shown in FIG. 3 , the number 11 is the metal top layer of the through-hole unit, w11 is the metal width of the metal top layer of the through-hole unit; the number 22 is the metal bottom layer of the through-hole unit, and w22 is the metal width of the metal bottom layer of the through-hole unit.

The via cell library in this embodiment contains different via cell information corresponding to the metal width of the metal layer of the via cell. The via cell information includes the size of the via, the wrapping distance of the via, and the size of the via number and via spacing. Among them, the wrapping distance of the through hole is the distance in four directions wrapped by the metal layer of the through hole unit. If the through hole is a square hole, the wrapping distance does not distinguish the direction; if the through hole is a long hole, the wrapping distance is according to the through hole It is defined by the rule that the wrapping distance in the two short-side directions is in front and the wrapping distance in the two long-side directions is in the back.

It should be noted that this embodiment can generate a through-hole cell library in the automatic layout and routing tool according to the design inspection rules in the technical file. The design inspection rules in the technical file include: a series of metal line widths, through-hole sizes, metal lines of this width The wrapping distance for vias of this size, and the minimum number of vias and via spacing defined in the design check rules. Among them, the width of the metal wire, the size of the through hole, and the wrapping distance of the metal wire of this width to the through hole of this size are a set of data. The same metal wire width and the same through hole size can have various wrapping distance relationships, and the inspection method To distinguish the package distance with or without the cutting layer.

Preferably, this embodiment can automatically select a suitable via unit according to the width of the metal line, the size of the via, and the wrapping distance. When the width of the metal line is small, the selected via cell is relatively small, and when the width of the metal line is large, the generated via cell is larger or an array of via cells is generated. Finally, the through-hole cell library is automatically generated through the design check rules, and the through-hole cell is selected based on the through-hole cell library in the subsequent steps to complete the wiring work.

As shown in FIGS. 4 and 5 , the via unit includes a via 3, a via unit metal top layer 11, a via unit metal bottom layer 22, and the via 3 metal top layer 11 and the via unit metal bottom layer 22. Parcel distance. The types of through-hole units listed in Figure 4 and Figure 5 are only the two types of through-hole units that need to be checked as defined in the design inspection rules. Figure 4 is a square hole, and Figure 4 is a long hole. 4 and 5 also indicate the wrapping distances of the via unit metal layer to the via 3, which are E1, E2, E3, and E4, respectively. When the through hole is a long hole, the wrapping distance in the technical document will be defined according to certain rules, that is, the wrapping distance in the two short sides of the through hole is in the front, and the wrapping distance in the two long sides of the hole is behind. Defined by inspection.

In an optional embodiment provided by the present invention, the calculation of the width difference corresponding to the metal line width of the wiring metal layer and the metal width of each via cell metal layer in the via cell library includes:

S201. Obtain, from the via cell library, the metal width of the via cell metal layer whose metal width of the metal top layer of the via cell is within a preset range of the metal line width of the wiring metal top layer; and/or obtain the metal width of the via cell metal layer; The metal width of the via unit metal bottom layer is within the preset range of the metal line width of the wiring metal bottom layer.

Wherein, the preset range is specifically set according to the actual wiring information, for example, the preset range is preset within the line width interval of the top layer/bottom layer of the wiring metal within 20-100 nm. In this embodiment, the via cell library can be sorted according to the metal width of the metal top layer of the via cell and/or the metal width of the bottom metal layer of the via cell from small to large, or sorted from large to small, and then According to the sorting result, obtain the metal width of the via cell metal layer whose metal width of the metal top layer of the via cell is within the preset range of the metal line width of the wiring metal top layer from the via cell library; and/or obtain the metal width of the bottom layer of the via cell metal The metal width of the metal layer of the via unit whose metal width is within the preset range of the metal line width of the wiring metal bottom layer.

For example, the minimum width w1 of the metal line on the top layer of the wiring metal in the current layout is 20nm, the maximum width w2 is 100nm, the minimum width w2 of the metal line on the bottom layer of the wiring metal is 40nm, and the maximum width is 120nm, preset range: top layer of wiring metal The preset range is 20-100nm, and the preset range of the wiring metal bottom layer is 40-120nm; the metal width w11 of the metal top layer of the through-hole unit is obtained from the through-hole unit library, and the metal of the through-hole unit metal layer corresponding to 20-100 nm The width, and/or the metal width w22 of the metal bottom layer of the via unit is 40-120 nm corresponding to the metal width of the metal layer of the via unit.

S202. Calculate the width difference corresponding to the metal line width of the wiring metal layer and the metal width of each via unit metal layer acquired from the via unit library.

Wherein, the calculating the width difference corresponding to the metal line width of the wiring metal layer and the metal width of each via unit metal layer obtained from the via unit library includes: calculating the metal line width of the wiring metal top layer The first absolute value of the difference between the line width and the metal width of the metal top layer of the via unit; calculate the second absolute value of the difference between the metal line width of the wiring metal bottom layer and the metal width of the metal bottom layer of the via unit; A sum of the first absolute value of the difference and the absolute value of the second difference is determined as the width difference.

As shown in FIG. 6 , number 3 is a through hole, a in FIG. 6 is a wiring metal layer, and b1, b2, and b3 in FIG. 6 are through hole units. Then calculate the first difference absolute value corresponding to the metal line width w1 of the wiring metal top layer and the metal width w11 of the via unit metal top layer in b1, b2, and b3 in FIG. 6 respectively, and calculate the metal line width w2 and The second absolute value of the difference corresponding to the metal width w22 of the metal bottom layer of the through-hole unit in b1, b2, and b3 in FIG. The sum of the absolute values of the second difference, if the width difference between b1 in FIG. 6 and the wiring metal layer a in FIG. 6 is the smallest, then b1 in FIG. 6 is determined as the via unit of the wiring metal layer.

S30. Determine the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference.

Automatic layout and routing by checking a series of design inspection rules defined in the technical file, including the width of the metal line, the size of the via, the wrapping distance of the metal line of this width to the via hole of this size, and the minimum number of via holes and the spacing of the via holes The tool can automatically generate a suitable through-hole cell library according to the above conditions. The generated through-hole cells conform to the size and number of the design inspection rules, and select the best through-hole cells according to the specific layout information in the layout and routing. Among them, the width of the metal line and the size of the through hole in the technical document are defined in a certain order, the width of the metal line listed is all the widths defined in the design inspection rules, the size of the through holes is all the dimensions defined in the design inspection rules, and the wrapping distance is the design All distances defined in the rules are checked. The enumerated metal line width, through hole size, and the wrapping distance of the metal line of this width to the through hole of this size can generate a through hole unit library containing all types, and the through hole unit can be automatically selected when routing.

The present invention uses the width of the metal line defined in the design inspection rules defined in the technical document, the size of the through hole, the wrapping distance of the metal line of this width to the through hole of this size, as well as the minimum number of through holes and the spacing of the through holes, and according to the specific layout The information selects the preferred via cell, and the layout and routing tool selects the optimal via cell according to the layout design information. This method can effectively simplify the writing of technical documents, and it is not easy to make mistakes. The types of through-hole cells obtained are comprehensive, and the automatic layout and routing score selects appropriate through-hole cells, which is more automatic and compatible. It also has compatibility, which can greatly improve design efficiency.

In an optional embodiment for advanced technology provided by the present invention, before determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, the method Also includes:

determining whether the wiring metal layer includes a cutting layer;

If the wiring metal layer includes a cutting layer, then obtain the metal width of the via unit metal layer whose wrapping distance of the via hole in the via unit information satisfies the design rule;

The determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference includes:

The via unit of the wiring metal layer is determined according to the via unit information corresponding to the via unit metal layer with the smallest width difference among the metal widths of the via unit metal layer whose wrapping distance of the via hole satisfies the design rule.

In an optional embodiment provided by the present invention, before determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, the method further includes:

Obtain the metal width of the metal layer of the through-hole unit whose through-hole size meets the design rule in the through-hole unit information;

The determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference includes:

The via unit of the wiring metal layer is determined according to the via unit information corresponding to the via unit metal layer with the smallest width difference among the metal widths of the via unit metal layer whose via size satisfies the design rule.

It should be noted that in this embodiment, different through-hole units can be selected according to different metal line widths and whether the metal lines have a cutting layer. As shown in Figure 6, when the width of the metal line is small, a smaller through-hole unit can be automatically selected during routing. As shown in FIG. 7 , when the metal wire has a cutting layer 4 , the through-hole unit selected during wiring conforms to the wrapping distance when the cutting layer 4 is present. The presence or absence of cut layers on the metal wires is defined by means of inspection in the technical documentation.

In this embodiment, if the minimum number of via holes is 1, the via hole spacing is set to 0; if the minimum number of via holes is greater than 1, the via hole spacing is the maximum spacing defined in the design check rule; if the defined The minimum number of through holes is greater than 1, and a through hole cell array that meets the design inspection rules can be automatically generated. Specifically, when the width of the metal line is large, a larger size via cell or via cell array is required, as shown in Figure 6, the width of the metal line is large, and the minimum number of via holes required is greater than 1, automatic layout and routing The tool will automatically generate and select a through-hole cell array, which meets the size and number of through-holes required by the design check rules.

A method for determining a via cell provided by an embodiment of the present application firstly identifies the metal line width of the wiring metal layer from the current layout design information; then calculates the relationship between the metal line width of the wiring metal layer and each via hole in the via cell library The metal widths of the unit metal layers correspond to width differences, and finally determine the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference. Since the via cell library in this application contains different via cell information corresponding to the metal width of different via cell metal layers, it can be calculated by calculating the metal line width of the wiring metal layer and each via cell in the via cell library. The width difference corresponding to the metal width of the metal layer can determine the corresponding via unit. Compared with the manual definition of the via unit in the prior art, the present application can automatically confirm the corresponding via unit based on the metal line width of the wiring metal layer, so that the determination efficiency of the via unit can be improved through the present invention.

In the case of dividing each functional module corresponding to each function, FIG. 8 shows a possible composition diagram of the device for determining the through-hole unit involved in the above-mentioned and embodiments. As shown in FIG. 8 , the through-hole unit Determining means may include:

An identification module 81, configured to identify the metal line width of the wiring metal layer from the current layout design information;

The calculation module 82 is used to calculate the width difference between the metal line width of the wiring metal layer and the metal width of each via cell metal layer in the via cell library, the via cell library contains different via cell information Corresponding to the metal width of different via unit metal layers;

The determination module 83 is configured to determine the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference.

In an optional embodiment, the wiring metal layer includes a wiring metal top layer and a wiring metal bottom layer, and the via cell metal layer includes a via cell metal top layer and a via cell metal bottom layer; the calculation module 82 is specifically used to :

Acquire the metal width of the metal layer of the metal top layer of the via cell in which the metal width of the metal top layer of the via cell is within the preset range of the metal line width of the wiring metal top layer; and/or obtain the metal width of the metal layer of the via cell; The metal width of the metal bottom layer of the hole unit metal layer is within the preset range of the metal line width of the wiring metal bottom layer;

Calculate the width difference corresponding to the metal line width of the wiring metal layer and the metal width of each via cell metal layer obtained from the via cell library.

In an optional embodiment, the calculation module 82 is specifically used for:

calculating the absolute value of a first difference between the metal line width of the wiring metal top layer and the metal width of the via unit metal top layer;

calculating a second absolute value of the difference between the metal line width of the wiring metal bottom layer and the metal width of the via unit metal bottom layer;

A sum of the first absolute value of the difference and the absolute value of the second difference is determined as the width difference.

In an optional embodiment, the via unit information includes the size of the via hole, the wrapping distance of the via hole, the number of the via hole and the pitch of the via hole, and the wrapping distance of the via hole includes the metal Layers wrap the distance of the vias in four directions.

In an optional embodiment, the determination module 83 is also used for:

determining whether the wiring metal layer includes a cutting layer;

If the wiring metal layer includes a cutting layer, then obtain the metal width of the via unit metal layer whose wrapping distance of the via hole in the via unit information satisfies the design rule;

The via unit of the wiring metal layer is determined according to the via unit information corresponding to the via unit metal layer with the smallest width difference among the metal widths of the via unit metal layer whose wrapping distance of the via hole satisfies the design rule.

In an optional embodiment, the determination module 83 is also used for:

Obtain the metal width of the metal layer of the through-hole unit whose through-hole size meets the design rule in the through-hole unit information;

The via unit of the wiring metal layer is determined according to the via unit information corresponding to the via unit metal layer with the smallest width difference among the metal widths of the via unit metal layer whose via size satisfies the design rule.

In an optional embodiment, if the through hole is a square hole, the wrapping distance does not distinguish between directions; The wrapping distance in the edge direction is defined in the following rules.

Based on the same application idea, an embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is run by a processor, the through-hole provided by the above-mentioned embodiment is executed. The steps of the determination method of the unit.

Specifically, the storage medium can be a general-purpose storage medium, such as a removable disk, a hard disk, etc. When the computer program on the storage medium is run, the above-mentioned method for determining the through-hole unit can be executed, by calculating the metal of the wiring metal layer The difference between the line width and the metal width of the metal layer of each via unit in the via unit library can determine the corresponding via unit. Compared with the manual definition of the via unit in the prior art, the present application can automatically confirm the corresponding via unit based on the metal line width of the wiring metal layer, so that the determination efficiency of the via unit can be improved through the present invention.

Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working process of the above-described system and device can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here. In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or May be integrated into another system, or some features may be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some communication interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.

If the functions are realized in the form of software function units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium executable by a processor. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions for enabling a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage media include: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program codes. .

The above is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the application, and should be covered Within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (8)

1. A method of determining a via cell, the method comprising:

identifying the metal wire width of the wiring metal layer from the current layout design information; the wiring metal layer comprises a wiring metal top layer and a wiring metal bottom layer;

acquiring the metal width of the metal top layer of the through hole unit in a preset range of the metal line width of the metal top layer of the wiring metal from a through hole unit library; acquiring the metal width of the metal bottom layer of the through hole unit within the preset range of the metal wire width of the wiring metal bottom layer; the through hole unit library comprises a plurality of through hole unit information and metal widths of through hole unit metal layers respectively corresponding to the through hole unit information, and the through hole unit metal layers comprise through hole unit metal top layers and through hole unit metal bottom layers;

calculating a first difference absolute value between the metal wire width of the wiring metal top layer and the metal width of the through hole unit metal top layer obtained from the through hole unit library; calculating a second difference absolute value between the metal wire width of the wiring metal bottom layer and the metal width of the through hole unit metal bottom layer obtained from the through hole unit library;

determining a sum of the first difference absolute value and the second difference absolute value as a width difference;

and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.

2. The method of claim 1, wherein the through-hole unit information comprises a through-hole size, a wrapping distance of through-holes, and a number of through-holes and a distance between through-holes, and the wrapping distance of the through-holes comprises distances of the through-hole unit metal layer wrapping the through-holes in four directions.

3. The method of claim 2, wherein before determining via cells of the routing metal layer according to via cell information corresponding to a via cell metal layer having a smallest width difference, the method further comprises:

determining whether the wiring metal layer includes a cut layer;

if the wiring metal layer comprises a cutting layer, acquiring the metal width of the through hole unit metal layer, wherein the wrapping distance of the through hole in the through hole unit information meets the design rule;

determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, including:

and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference in the metal widths of the through hole unit metal layers with the wrapping distance of the through holes meeting the design rule.

4. The method of claim 2, wherein before determining via cells of the routing metal layer according to via cell information corresponding to a via cell metal layer having a smallest width difference, the method further comprises:

obtaining the metal width of a through hole unit metal layer of which the size of the through hole meets the design rule in the through hole unit information;

determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, including:

and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference in the metal widths of the through hole unit metal layers with the through hole sizes meeting the design rule.

5. The method of claim 2, wherein if the through hole is a square hole, the wrapping distance does not distinguish the direction; if the through hole is a long hole, the wrapping distance is defined according to the rule that the wrapping distance in the two short side directions of the through hole is in the front and the wrapping distance in the two long side directions is in the back.

6. An apparatus for determining a via unit, the apparatus comprising:

the identification module is used for identifying the metal wire width of the wiring metal layer from the current layout design information; the wiring metal layer comprises a wiring metal top layer and a wiring metal bottom layer;

the calculation module is used for acquiring the metal width of the metal top layer of the through hole unit within the preset range of the metal line width of the wiring metal top layer from the through hole unit library; acquiring the metal width of the metal bottom layer of the through hole unit within the preset range of the metal wire width of the wiring metal bottom layer; the through hole unit library comprises a plurality of through hole unit information and metal widths of through hole unit metal layers respectively corresponding to the through hole unit information, and the through hole unit metal layers comprise through hole unit metal top layers and through hole unit metal bottom layers; calculating a first difference absolute value of the metal line width of the wiring metal top layer and the metal width of the through hole unit metal top layer; calculating a second absolute difference value between the metal wire width of the wiring metal bottom layer and the metal width of the through hole unit metal bottom layer; determining a sum of the first difference absolute value and the second difference absolute value as a width difference;

and the determining module is used for determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.

7. An electronic device, comprising: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory communicating via the bus when an electronic device is operated, the machine-readable instructions being executed by the processor to perform the steps of the method of determining a via unit according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when being executed by a processor, performs the steps of the method for determining a via unit according to any one of claims 1 to 5.

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