CN115548201A - Infrared light-emitting diode packaging structure and packaging method - Google Patents

Abstract

The invention discloses an infrared light emitting diode packaging structure, comprising: the chip is arranged on the light reflecting inclined plane, and the packaging shell is arranged on the light reflecting inclined plane and outside the chip. The packaging method of the packaging structure comprises the following steps: penetrating the insulating layer so that the lead is fixed at the penetrated position of the insulating layer; fixing the reflecting inclined plane above the insulating layer; the light reflecting slope is penetrated, and the penetrated position of the light reflecting slope corresponds to the penetrated position of the insulating layer; fixing the chip on the reflecting inclined plane, wherein a pin arranged below the chip is positioned in a penetrated position of the reflecting inclined plane and is electrically connected with the lead; encapsulating the light reflecting inclined plane and the chip to form an encapsulating shell; cutting a plurality of package bodies existing on the insulating layer; and testing the packaging body. The problem of current diode adopt transparent to glue when integrative pouring, be difficult for fixing a position the core part that chip, pin in the diode are constituteed for the diode yields is not high is solved.

Description

An infrared light-emitting diode packaging structure and packaging method

technical field

The invention relates to the technical field of diodes, in particular to an infrared light emitting diode packaging structure and packaging method.

Background technique

Diodes, also known as crystal diodes, or diodes for short, are electronic devices that conduct current in one direction. There is a PN junction and two lead terminals inside the semiconductor diode. This electronic device has unidirectional current conduction according to the direction of the applied voltage. Generally speaking, a crystal diode is a p-n junction interface formed by sintering a p-type semiconductor and an n-type semiconductor. A space charge layer is formed on both sides of the interface to form a self-built electric field. When the applied voltage is equal to zero, the diffusion current caused by the carrier concentration difference on both sides of the p-n junction is equal to the drift current caused by the self-built electric field, and it is in a state of electrical balance, which is also the diode characteristic under normal conditions. In almost all electronic circuits, semiconductor diodes are used. It plays an important role in many circuits and has a wide range of applications.

Existing diodes are usually integrally poured with transparent sealing glue, but during pouring, it is difficult to locate the core components of the diode, which consists of chips, pins, and heat sinks, resulting in a low yield of diodes.

Contents of the invention

Aiming at the deficiencies of the prior art, the present invention provides an infrared light-emitting diode packaging structure and packaging method, which solves the problem that the existing diodes in the above background technology are integrally poured with transparent sealing glue, which is not easy to damage the chips and pins in the diode. The positioning of the core components makes the problem that the yield rate of the diode is not high.

In order to achieve the above object, the present invention is achieved through the following technical solutions: an infrared light-emitting diode packaging structure, including a packaging body, the packaging body includes: a packaging shell, a reflective slope, and a chip, and the chip is arranged on the reflective slope , an encapsulation shell is arranged on the reflective slope and outside the chip.

Preferably, pins are provided under the chip, and the pins are electrically connected to the chip.

Preferably, an insulating layer is provided under the reflective slope, and the encapsulation shell is filled between the insulating layer and the lower surface of the reflective slope.

Preferably, the pins penetrate the reflective slope, and the insulating layer is provided with leads, and the leads penetrate the insulating layer and are electrically connected to the pins.

Preferably, the insulating layer is an epoxy glass fiber cloth laminated board.

Preferably, titanium dioxide paint is coated on the reflective slope.

A packaging method for an infrared light emitting diode packaging structure, comprising:

Step 1: penetrate the insulating layer so that the lead wire is fixed at the place where the insulating layer is penetrated;

Step 2: Fix the reflective slope on the insulating layer;

Step 3: penetrate the reflective slope, and the position where the reflective slope is penetrated corresponds to the position where the insulating layer is penetrated;

Step 4: Fix the chip on the reflective slope, and the pins provided under the chip are located in the place where the reflective slope is penetrated, and the pins are electrically connected to the leads;

Step 5: Potting the reflective slope and the chip to form a packaging shell;

Step 6: cutting a plurality of package bodies existing on the insulating layer;

Step 7: Test the package body.

Preferably, in the sixth step, an adaptive cutting device is used to cut several package bodies on the insulating layer.

Preferably, the adaptive cutting device includes:

Frame, linear motor, output end of linear motor, support rod, first chute, first rotating shaft, telescopic sleeve, linkage rod, slider, second chute, cutting piece;

The frame is driven to move by a driving device;

The linear motor is fixedly connected to the frame;

The upper end of the frame is provided with the first chute, and the first rotating shaft slides left and right along the first chute;

Several of the struts are rotatably connected by the first rotating shaft;

The first rotating shaft located at the left end of the frame is fixedly connected to the frame, and the first rotating shaft located at the left end of the frame is fixedly connected to the left end of the output end of the linear motor;

The right end of the output end of the linear motor is connected to the linear motor;

The telescopic sleeves are rotatably connected to several of the first rotating shafts, and the telescopic sleeves are sleeved on the outer periphery of the upper end of the linkage rod;

The lower end of the frame is provided with the second chute;

The middle section of the linkage rod is fixedly connected with the slider, and the slider is slid left and right and connected in the second chute;

The lower end of the linkage rod is fixedly connected with the cutting member.

Preferably, the cutting parts include:

First fixed rod, second fixed rod, cavity, first fixed plate, second fixed plate, first hinge, spring, telescopic rod, second hinge, third fixed rod, hinge shaft, second rotating shaft, cutting head;

The upper end of the first fixed rod is fixedly connected to the lower end of the linkage rod, and the lower end of the first fixed rod is fixedly connected to the upper end of the second fixed rod;

The first fixing plate is provided with the cavity, and the second fixing rod passes through the cavity;

The second fixed rod is fixedly connected to the upper end of the third fixed rod, and the third fixed rod is arc-shaped;

The lower side of the first fixing plate is fixedly connected with the second fixing plate;

The middle position of the third fixed rod is rotatably connected with the second fixed plate through the hinge shaft;

The upper surface of the lower end of the third fixed rod is fixedly connected with the second hinge;

The first hinge is fixedly connected to the lower surface of the first fixing plate;

The telescopic rod is rotatably connected between the first hinge part and the second hinge part, and the spring is connected to the outside of the telescopic rod, and the spring is respectively fixed on the lower end of the first hinge part and the second hinge part. upper end;

The lower end of the second fixing plate is rotatably connected with the cutting head through the second rotating shaft.

Description of drawings

Fig. 1 is a structural representation of the present invention;

Fig. 2 is a schematic diagram of the arrangement of the package body of the present invention;

Fig. 3 is a schematic bottom view of the body structure of the present invention;

Fig. 4 is a structural schematic diagram of an adaptive cutting device of the present invention;

Fig. 5 is a schematic structural diagram of the cutting member of the present invention.

In the figure: 1. Package body; 2. Package shell; 3. Reflective slope; 4. Chip; 5. Pin; 6. Lead wire; 7. Insulation layer; 8. Adaptive cutting device; 9. Insulation coating device; 801, frame; 802, linear motor; 803, output end of linear motor; 804, strut; 805, first chute; 806, first rotating shaft; 807, telescopic sleeve; 808, linkage rod; block; 810, the second chute; 811, the cutting piece; 81101, the first fixed rod; 81102, the second fixed rod; 81103, the hollow; 81104, the first fixed plate; Hinge; 81107, spring; 81108, telescopic rod; 81109, second hinge; 81110, third fixed rod; 81111, hinge shaft; 81112, second shaft;

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

Example 1

Please refer to Figures 1-3, the present invention provides a technical solution: an infrared light-emitting diode packaging structure, including a package body 1, the package body 1 includes: a package shell 2, a reflective slope 3, a chip 4, and the chip 4 It is arranged on the reflective slope 3 , and the encapsulation case 2 is arranged on the reflective slope 3 and outside the chip 4 .

Preferably, pins 5 are provided under the chip 4 , and the pins 5 are electrically connected to the chip 4 .

Preferably, an insulating layer 7 is disposed below the reflective slope 3 , and the encapsulation shell 2 is filled between the insulating layer 7 and the lower surface of the light reflecting slope 3 .

Preferably, the pin 5 runs through the reflective slope 3 , the insulating layer 7 is provided with a lead 6 , and the lead 6 is electrically connected to the pin 5 through the insulating layer 7 .

Preferably, the insulating layer 7 is an epoxy glass fiber cloth laminated board.

Preferably, the reflective slope 3 is coated with titanium dioxide paint.

A packaging method for an infrared light emitting diode packaging structure, the packaging method comprising:

Step 1: penetrating the insulating layer 7 so that the lead wire 6 is fixed at the place where the insulating layer 7 is penetrated;

Step 2: Fix the reflective slope 3 above the insulating layer 7;

Step 3: penetrate the reflective slope 3, and the position where the reflective slope 3 is penetrated corresponds to the position where the insulating layer 7 is penetrated;

Step 4: Fix the chip 4 on the reflective slope 3, and the pin 5 provided under the chip 4 is located in the penetrating part of the reflective slope 3, and the pin 5 is electrically connected to the lead 6;

Step 5: Potting the reflective slope 3 and the chip 4 to form the packaging shell 2;

Step 6: cutting a plurality of package bodies 1 existing on the insulating layer 7;

Step 7: Test the package body 1 .

The working principle and beneficial effects of the above scheme: punch through the insulating layer 7, fix the lead wire 6 on the insulating layer 7, fix the reflective slope 3 on the insulating layer 7, punch through the reflective slope 3, and the reflective slope 3 is penetrated by the position corresponding to the position where the insulating layer 7 is penetrated, and the chip 4 is fixed on the reflective slope 3, and finally it is poured and sealed, which solves the problem that the existing light-emitting diodes are not easy to be damaged when the existing light-emitting diodes are integrally poured with transparent sealing glue. The core component composed of chip 4 and pin 5 is positioned, which makes the problem that the yield rate of the diode is not high.

In addition, the reflective slope 3 is set to gather the light emitted by the chip 4, which ensures that the optical performance of the diode is more excellent.

Example 2

Please refer to FIG. 4 , on the basis of Embodiment 1, in the sixth step, an adaptive cutting device 8 is used to cut several package bodies 1 on the insulating layer 7 .

Described adaptive cutting device 8 comprises:

Frame 801, linear motor 802, linear motor output end 803, strut 804, first chute 805, first rotating shaft 806, telescopic sleeve 807, linkage rod 808, slider 809, second chute 810, cutting piece 811;

The frame 801 is driven to move by a driving device;

The linear motor 802 is fixedly connected to the frame 801;

The upper end of the frame 801 is provided with the first chute 805, and the first rotating shaft 806 slides left and right along the first chute 805;

Several of the struts 804 are rotatably connected by the first rotating shaft 806;

The first rotating shaft 806 at the left end of the frame 801 is fixedly connected to the frame 801, and the first rotating shaft 806 at the left end of the frame 801 is fixedly connected to the left end of the linear motor output end 803;

The right end of the linear motor output end 803 is connected to the linear motor 802;

The telescopic sleeves 807 are rotatably connected to the plurality of first rotating shafts 806, and the telescopic sleeves 807 are sleeved on the outer periphery of the upper end of the linkage rod 808;

The lower end of the frame 801 is provided with the second chute 810;

The middle position of the linkage rod 808 is fixedly connected with the slider 809, and the slider 809 is slidably connected in the second chute 810 left and right;

The cutting member 811 is fixedly connected to the lower end of the linkage rod 808 .

The working principle and beneficial effects of the above scheme: cutting several package bodies 1 on the insulating layer 7, so that the diodes are divided into individual existence, when cutting, because the size of the package body 1 will vary with different models and batches At this time, the cutting device for the insulating layer 7 and the package body 1 also changes accordingly, which increases the operation and reduces the efficiency;

Using the self-adaptive cutting device 8, the linear motor 802 and the linear motor output end 803 act on the first rotating shaft 806 at the right end of the frame 801, so that the first rotating shaft 806 slides in the first chute 805, because it is located at the left end of the frame 801 The first rotating shaft 806 of the frame 801 is fixed to the frame 801, so when the first rotating shaft 806 at the right end of the frame 801 is moved by the linear motor 802, the first rotating shaft 806 at the left end of the frame 801 and the first rotating shaft 806 at the right end of the frame 801 The first rotating shafts 806 between the first rotating shafts 806 all move accordingly, and the distance between two adjacent first rotating shafts 806 is always equal. Under the action of the linear motor 802, the two adjacent first rotating shafts 806 pass The distance between the cutting parts 811 connected by the telescopic sleeve 807 and the linkage rod 808 is also equal. When the distance between the cutting parts 811 is adjusted, the insulating layer 7 and the package body 1 are cut, which reduces the operating time and improves increased efficiency;

The telescopic sleeve 807 and the linkage rod 808 are connected to facilitate the disassembly and maintenance of the linkage rod 808 and the cutting piece 811 as a whole.

Example 3

Referring to Fig. 5, on the basis of Embodiment 1-2, the cutting member 811 includes:

First fixed rod 81101, second fixed rod 81102, cavity 81103, first fixed plate 81104, second fixed plate 81105, first hinge 81106, spring 81107, telescopic rod 81108, second hinge 81109, third fixed rod 81110, hinged shaft 81111, second rotating shaft 81112, cutting head 81113;

The upper end of the first fixed rod 81101 is fixedly connected with the lower end of the linkage rod 808, and the lower end of the first fixed rod 81101 is fixedly connected with the upper end of the second fixed rod 81102;

The first fixing plate 81104 is provided with the cavity 81103, and the second fixing rod 81102 passes through the cavity 81103;

The second fixed rod 81102 is fixedly connected to the upper end of the third fixed rod 81110, and the third fixed rod 81110 is arc-shaped;

The lower side of the first fixing plate 81104 is fixedly connected with the second fixing plate 81105;

The middle position of the third fixing rod 81110 is rotationally connected with the second fixing plate 81105 through the hinge shaft 81111;

The upper surface of the lower end of the third fixed rod 81110 is fixedly connected with the second hinge 81109;

The first hinge 81106 is fixedly connected to the lower surface of the first fixing plate 81104;

The telescopic rod 81108 is rotationally connected between the first hinge 81106 and the second hinge 81109, and the spring 81107 is externally connected to the telescopic rod 81108, and the springs 81107 are respectively fixed to the first hinge 81106 lower end, second hinge 81109 upper end;

The lower end of the second fixing plate 81105 is rotatably connected to the cutting head 81113 through the second rotating shaft 81112 .

The working principle and beneficial effects of the above scheme: when the cutting part 811 cuts the insulating layer 7 and the package body 1, the cutting head 81113 is in contact with the insulating layer 7, and the cutting head 81113 is stressed, driving the first fixing plate 81104, the second The second fixed plate 81105 deflects around the hinge shaft 81111. During this process, the telescopic rod 81108 is shortened, the spring 81107 is compressed, the second fixed rod 81102 moves in the cavity 81103, and the force is compressed by the spring 81107, which ensures that the cutting head 81113 is The insulating layer 7 is always under force during the cutting process, which effectively avoids idling of the equipment during the cutting process, and ensures the cutting effect of the cutting head 81113 on the insulating layer 7 .

Example 4

On the basis of Embodiment 1-3, it also includes a diode state detection device, and the diode state detection device includes:

A current sensor for detecting the current through the diode;

A voltage sensor for detecting the voltage applied to the diode;

A first timer, the first timer is used to record the energization time of the diode;

a second timer, the second timer is used to record the duration of the diode;

Alarm, the alarm is used for alarm;

A controller, the controller is electrically connected to the current sensor, the voltage sensor, the first timer, the second timer, and the alarm, and the controller is based on the current sensor, the voltage sensor, and the first timer , The second timer controls the work of the alarm, including:

Step 1: The controller obtains the state effect index of the diode based on the first timer, the second timer and formula (1):

Wherein, A is the state effect index of the diode, _t1 is the energization duration of the diode recorded by the first timer, _t2 is the existence duration of the diode recorded by the second timer, _t0 is the unit duration, and e is Natural constant, value 2.72;

Step 2: the controller calculates the diode state index based on the current sensor, voltage sensor, counter and formula (2):

Among them, B is the state index of the diode, I is the current through the diode detected by the current sensor, U is the voltage acting on the diode detected by the voltage sensor, W1 is the rated power _of the diode, W is the maximum power of the diode, and δ is the voltage of the diode Electro-optical conversion efficiency;

When the diode state index is less than the corresponding preset reference value, the controller controls the alarm to give an alarm.

为基于二极管处于不同状态的时间得出的二极管的状态效应指数，

为在二极管的功率处于二极管的最大功率内时，二极管的状态指数，当二极管的功率大于二极管的最大功率时，二极管被烧毁，此时二极管的状态指数为0。In the formula,

is the state effect index of the diode based on the time the diode is in different states,

is the state index of the diode when the power of the diode is within the maximum power of the diode. When the power of the diode is greater than the maximum power of the diode, the diode is burned, and the state index of the diode is 0 at this time.

Assuming that the energization duration of the diode recorded by the first timer is t ₁ =3000min, the existence duration of the diode recorded by the second timer is _t2 =50000min, the unit duration _t0 =1min, and the natural constant e=2.72, then Through the above calculation, the state effect index A=1 of the diode can be obtained.

The current I=0.1A passing through the diode detected by the current sensor, the voltage U=5V applied to the diode detected by the voltage sensor, the rated power W ₁ of the diode=1W, the maximum power W=3W of the diode, and the electro-optical conversion efficiency δ= 0.4, the diode state index B=2.134 (taking three decimal places after the decimal point) is calculated by formula (2), and the calculated diode state index B=2.134 does not exceed the preset reference value 1. At this time, the controller does not control the alarm The device sends out an alarm prompt.

The beneficial effect of the above technical solution is: by setting the first timer to record the energization time of the diode, and setting the second timer to record the existence time of the diode, the energization time of the diode recorded by the first timer and the second timer record The existence time of the diode and the formula (1) are used to calculate the state effect index of the diode. At the same time, the current sensor is set to detect the current passing through the diode, and the voltage sensor is set to detect the voltage acting on the diode, and then according to the formula (1) The calculation result, the current through the diode detected by the current sensor, the voltage acting on the diode detected by the voltage sensor and the formula (2) can be calculated to obtain the diode state index. When the diode state index is less than the preset reference value, the The controller controls the alarm to alarm to notify the user, and the intelligence is increased by setting the controller to control the alarm to alarm.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, and therefore should not be construed as limiting the present invention; the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance, and unless otherwise Clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or a Electrical connection; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications and substitutions can be made to these embodiments without departing from the principle and spirit of the present invention. and modifications, the scope of the invention is defined by the appended claims and their equivalents.

Claims (10)

1. An infrared light emitting diode packaging structure, characterized in that: It includes a package body (1), and the package body (1) includes: a package shell (2), a reflective slope (3), and a chip (4), and the chip (4) is arranged on the reflective slope (3), An encapsulation shell (2) is arranged on the reflective slope (3) and outside the chip (4). 2. A kind of infrared light-emitting diode packaging structure according to claim 1, characterized in that: Pins (5) are arranged under the chip (4), and the pins (5) are electrically connected to the chip (4). 3. A kind of infrared light-emitting diode packaging structure according to claim 2, characterized in that: An insulating layer (7) is arranged under the reflective slope (3), and the package shell (2) is filled between the insulating layer (7) and the lower surface of the reflective slope (3). 4. A kind of infrared light-emitting diode packaging structure according to claim 3, characterized in that: The pin (5) runs through the reflective slope (3), the insulating layer (7) is provided with a lead wire (6), and the lead wire (6) runs through the insulating layer (7) and the pin (5) Electrical connection. 5. A kind of infrared light-emitting diode packaging structure according to claim 3, characterized in that: The insulating layer (7) is an epoxy glass fiber cloth laminated board. 6. A kind of infrared light-emitting diode packaging structure according to claim 3, characterized in that: Titanium dioxide paint is coated on the reflective slope (3). 7. A packaging method for the infrared light emitting diode packaging structure according to any one of claims 1-6, characterized in that: the packaging method comprises: Step 1: penetrating the insulating layer (7), so that the lead wire (6) is fixed at the place where the insulating layer (7) is penetrated; Step 2: Fix the reflective slope (3) above the insulating layer (7); Step 3: penetrate the reflective slope (3), and the position where the reflective slope (3) is penetrated corresponds to the position where the insulating layer (7) is penetrated; Step 4: Fix the chip (4) on the reflective slope (3), and the pin (5) provided under the chip (4) is located in the place where the reflective slope (3) is penetrated, the pin (5) and the lead (6) ) is electrically connected; Step 5: Potting the reflective slope (3) and the chip (4) to form a package (2); Step 6: cutting several package bodies (1) existing on the insulating layer (7); Step 7: Test the package body (1). 8. A method for packaging infrared light-emitting diodes according to claim 7, characterized in that: In the sixth step, an adaptive cutting device (8) is used to cut several package bodies (1) on the insulating layer (7). 9. A method for packaging infrared light-emitting diodes according to claim 8, characterized in that: Described adaptive cutting device (8) comprises: Frame (801), linear motor (802), output end of linear motor (803), support rod (804), first chute (805), first rotating shaft (806), telescopic sleeve (807), linkage Rod (808), slide block (809), second chute (810), cutting piece (811); The frame (801) is driven to move by a driving device; The linear motor (802) is fixedly connected to the frame (801); The upper end of the frame (801) is provided with the first chute (805), and the first rotating shaft (806) slides left and right along the first chute (805); Several said struts (804) are rotatably connected by said first rotating shaft (806); The first rotating shaft (806) at the left end of the frame (801) is fixedly connected to the frame (801), and the first rotating shaft (806) at the left end of the frame (801) is connected to the The left end of the linear motor output terminal (803) is fixedly connected; The right end of the linear motor output end (803) is connected to the linear motor (802); The telescopic sleeves (807) are rotatably connected to the plurality of first rotating shafts (806), and the telescopic sleeves (807) are sleeved on the outer periphery of the upper end of the linkage rod (808); The lower end of the frame (801) is provided with the second chute (810); The middle position of the linkage rod (808) is fixedly connected with the slider (809), and the slider (809) is slidingly connected in the second sliding groove (810) left and right; The cutting member (811) is fixedly connected to the lower end of the linkage rod (808). 10. A method for packaging infrared light-emitting diodes according to claim 9, characterized in that: The cutting part (811) includes: First fixed rod (81101), second fixed rod (81102), cavity (81103), first fixed plate (81104), second fixed plate (81105), first hinge (81106), spring (81107), Telescopic rod (81108), second hinge (81109), third fixed rod (81110), hinge shaft (81111), second rotating shaft (81112), cutting head (81113); The upper end of the first fixed rod (81101) is fixedly connected to the lower end of the linkage rod (808), and the lower end of the first fixed rod (81101) is fixedly connected to the upper end of the second fixed rod (81102); The first fixing plate (81104) is provided with the cavity (81103), and the second fixing rod (81102) passes through the cavity (81103); The second fixed rod (81102) is fixedly connected to the upper end of the third fixed rod (81110), and the third fixed rod (81110) is arc-shaped; The lower side of the first fixing plate (81104) is fixedly connected with the second fixing plate (81105); The middle position of the third fixing rod (81110) is rotationally connected with the second fixing plate (81105) through the hinge shaft (81111); The upper surface of the lower end of the third fixed rod (81110) is fixedly connected with the second hinge (81109); The first hinge (81106) is fixedly connected to the lower surface of the first fixing plate (81104); The telescopic rod (81108) is rotatably connected between the first hinge (81106) and the second hinge (81109), and the spring (81107) is externally connected to the telescopic rod (81108), and the spring (81107) are respectively fixed to the lower end of the first hinge (81106) and the upper end of the second hinge (81109); The lower end of the second fixing plate (81105) is rotatably connected with the cutting head (81113) through the second rotating shaft (81112).

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