CN115521056A - Splitting method for glass laser cutting - Google Patents
Splitting method for glass laser cutting Download PDFInfo
- Publication number
- CN115521056A CN115521056A CN202211309491.9A CN202211309491A CN115521056A CN 115521056 A CN115521056 A CN 115521056A CN 202211309491 A CN202211309491 A CN 202211309491A CN 115521056 A CN115521056 A CN 115521056A
- Authority
- CN
- China
- Prior art keywords
- glass
- cutting
- splitting
- laser
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000003698 laser cutting Methods 0.000 title claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000000926 separation method Methods 0.000 description 3
- 238000004880 explosion Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to the technical field of glass processing, in particular to a splitting method for glass laser cutting. The method comprises the following steps: s1, planning a plurality of cutting tracks on a whole glass substrate, carrying out irradiation cutting on the glass substrate by picosecond laser traveling along the cutting tracks, and forming a materialized glass cutting seam on the cutting tracks; s2, placing the cut glass base materials on a splitting machine, pressing a blade of the splitting machine downwards to the position of the glass cutting seam, splitting the glass cutting seam, and forming a plurality of small glass base materials. The method utilizes the quality change cutting line or the cutting track left after the glass is cut by the laser, and the splitter physically touches the cutting line or the cutting track under certain pressure to separate the glass physically, and the operation process is simple and the efficiency is high.
Description
Technical Field
The invention relates to the technical field of glass processing, in particular to a splitting method for glass laser cutting.
Background
With the continuous promotion of glass processing technology, glass products gradually develop towards fine processing, and the applied field is wider and wider. Because the glass products need different glass shapes, and the semi-finished glass generally used for processing is in a whole block shape, the whole block of glass needs to be cut to be divided into glasses with different sizes and different shapes.
At present, the laser cutting process can reduce the damage to the cut surface of the glass, so the application of the laser to the glass cutting process is more and more. However, in the glass cut by the traditional laser, the width of a cutting line or a cutting track is only 0.4 to 5um, which is not enough for physical separation between glasses, so how to effectively complete the problem of physical separation of the glasses without damaging the glasses on the basis of laser cutting becomes the research direction.
Disclosure of Invention
The invention provides a splitting method for glass laser cutting, and aims to solve the problem of physical separation of glass after laser cutting.
The invention provides a splitting method for glass laser cutting, which comprises the following steps:
s1, planning a plurality of cutting tracks on a whole glass substrate, carrying out irradiation cutting on the glass substrate by picosecond laser traveling along the cutting tracks, and forming a materialized glass cutting seam on the cutting tracks;
and S2, placing the cut glass base materials on a splitting machine, pressing a blade of the splitting machine downwards to the position of the glass cutting seam and splitting the glass cutting seam to form a plurality of small glass base materials.
As a further improvement of the invention, the picosecond laser is an infrared picosecond laser with a 1064nm wave band.
As a further improvement of the present invention, in step S2, the blade of the cleaving machine presses down to the glass cutting seam and cleaves the glass cutting seam, which specifically includes:
after the blade of the splitting machine is lowered to be aligned with the glass cutting seam, the splitting machine realizes downward instant pressure to the blade to lightly touch the glass cutting seam, so that the glass cutting seam is physically split.
As a further improvement of the present invention, the cutting track in step S1 is a grid track line with equal spacing, and the cleaving machine in step S2 delivers the glass substrates at equal intervals step by step according to the spacing of the cutting track, so that each glass is aligned with the blade when being slit to the cutting position.
As a further improvement of the present invention, the grid formed by the segmentation tracks is a square grid.
As a further improvement of the invention, the width of the glass cutting seam is 0.4-5um.
As a further improvement of the invention, the blade is provided with a linear cutting edge, the width of the cutting edge is not more than 5um, and the levelness is not more than 3um.
The beneficial effects of the invention are: the quality-change cutting line or the cutting track left after the glass is cut by the laser is physically touched by the splitter under certain pressure, so that the glass is physically separated, and the operation process is simple and high in efficiency.
Drawings
FIG. 1 is a flow chart of a glass laser cutting cleaving method of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, the splitting method for glass laser cutting of the present invention comprises the following steps:
s1, planning a plurality of cutting tracks on a whole glass substrate, irradiating and cutting the glass substrate by picosecond laser traveling along the cutting tracks, and forming materialized glass cutting seams on the cutting tracks;
in the track design process, the cutting track can be drawn on the corresponding drawing, then the corresponding drawing is covered on the surface of the glass substrate, the laser travels on the glass substrate according to the track by capturing the cutting track on the drawing, the pulsed laser is focused in the glass to generate 'explosion' to vitrify the glass, and the glass substrate on the cutting track is punctured, so that all the glass substrates on the cutting track are vitrified, namely the intermolecular structure of the glass substrate at the cutting joint is changed.
The picosecond laser is preferably an infrared picosecond laser in the 1064nm waveband. The infrared picosecond laser with the wave band of 1064nm is adopted to cut the glass, so that the cutting efficiency is improved and the cost is reduced while the glass substrate is not damaged. If the laser with the wave band higher than 1064nm is adopted, the glass substrate is easy to be directly burnt and cracked, and the glass substrate cannot be cut; if the laser with the wave band less than 1064nm, such as green light, ultraviolet laser, etc., is adopted, the cutting efficiency is very low, and the cost is high.
And S2, placing the cut glass base materials on a splitting machine, pressing a blade of the splitting machine downwards to the position of the glass cutting seam and splitting the glass cutting seam to form a plurality of small glass base materials. The present breaking method can be used to divide a large glass substrate into a plurality of small glass substrates, preferably into a plurality of small square-block-shaped glass substrates.
In step S2, the blade of the splitting machine is pressed down to the position of the glass joint cutting and splits the glass joint cutting, which specifically comprises the following steps:
after a blade of the splitting machine is lowered to be aligned with the glass cutting seam, the splitting machine realizes downward instant pressure to the blade to lightly touch the glass cutting seam, so that the glass cutting seam is physically cracked. When the blade is pressed down instantly, the contact surface of the seam and the blade will be expanded instantly and then split, and the split seam will extend gradually to penetrate the whole seam, so that the whole seam is broken to complete the splitting.
After the infrared picosecond laser with the wave band of 1064nm cuts the glass, the line width of a cut glass joint is only 0.4 to 5um, the glass substrates are not physically separated, the joint is physically touched by a blade of a splitting machine under proper pressure, and the joint is split, so that the glass substrates are physically separated, and the operation is simple and the efficiency is high.
The splitting method by using the splitting machine is effective for square products with straight edges and right angles, therefore, the splitting track is preferably a grid track line with equal intervals, and the grid formed by the splitting track is preferably a square grid. The cleaving machine delivers the glass substrates incrementally and equidistantly according to the spacing of the cutting path so that each glass slit is aligned with the blade when in the cutting position. After laser cutting, the splitting machine can deliver the glass substrate to the lower part of the blade in sequence according to the interval of the cutting seam, the blade can complete splitting operation only by up-and-down reciprocating movement and light contact with the glass cutting seam, the whole process is automatic, and the production efficiency is high.
For the square product of adaptation straight flange right angle, the blade is equipped with the linear type cutting edge, and the cutting edge width is not more than 5um, and the levelness is not more than 3um. According to different glass substrate product thickness, can adjust the degree of depth that blade and glass lancing contacted through the Z axle of cleaving machine, when further making the cutting edge touch the lancing, can be with the lancing fracture and do not harm the glass substrate body.
The picosecond laser and the blade splintering can be completed on the same splitting machine, the picosecond laser can be arranged in the last process step of the blade splintering, during operation, a cutting track is planned on a drawing, the drawing is covered on a glass substrate to be cut, the picosecond laser cuts a glass body by capturing the track on the drawing and walking according to the track, the picosecond laser is focused inside the glass to generate 'explosion' to vitrify the glass, the glass substrate on the cutting track is punctured, and all the glass substrates on the cutting track are vitrified. The splitting machine gradually delivers the glass substrate cut by the laser to the position below the blade, downward pressure is applied to the blade through the splitting machine, the cutting edge lightly touches the cutting seam to enable the cutting seam to expand, and finally the splitting effect is achieved.
The foregoing is a further detailed description of the invention in connection with specific preferred embodiments and it is not intended to limit the invention to the specific embodiments described. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (7)
1. A splitting method for glass laser cutting is characterized by comprising the following steps:
s1, planning a plurality of cutting tracks on a whole glass substrate, carrying out irradiation cutting on the glass substrate by picosecond laser traveling along the cutting tracks, and forming a materialized glass cutting seam on the cutting tracks;
s2, placing the cut glass base materials on a splitting machine, pressing a blade of the splitting machine downwards to the position of the glass cutting seam, splitting the glass cutting seam, and forming a plurality of small glass base materials.
2. The method according to claim 1, wherein the picosecond laser is an infrared picosecond laser with a 1064nm wavelength band.
3. The method for splitting glass cut by laser according to claim 1, wherein in step S2, a blade of the splitter presses down to the glass slit and splits the glass slit, specifically:
after a blade of the splitting machine is lowered to be aligned with the glass cutting seam, the splitting machine realizes downward instant pressure to the blade to lightly touch the glass cutting seam, so that the glass cutting seam is physically cracked.
4. The method of claim 1, wherein the cutting path in step S1 is a grid path line with equal spacing, and the cleaving machine in step S2 delivers the glass substrates with equal distance step by step according to the spacing of the cutting path, so that each glass is aligned with the blade when it is cut to the cutting position.
5. The glass laser cutting splitting method according to claim 4, wherein the grid formed by the splitting track is a square grid.
6. The glass laser cutting splitting method according to claim 1, wherein the width of the glass cutting seam is 0.4 to 5um.
7. The method of claim 1, wherein the blade has a linear edge with a width of 5um or less and a levelness of 3um or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211309491.9A CN115521056A (en) | 2022-10-25 | 2022-10-25 | Splitting method for glass laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211309491.9A CN115521056A (en) | 2022-10-25 | 2022-10-25 | Splitting method for glass laser cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115521056A true CN115521056A (en) | 2022-12-27 |
Family
ID=84703830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211309491.9A Pending CN115521056A (en) | 2022-10-25 | 2022-10-25 | Splitting method for glass laser cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115521056A (en) |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07164400A (en) * | 1993-12-15 | 1995-06-27 | Nec Corp | Cutting device for glass board |
| US5871134A (en) * | 1994-12-27 | 1999-02-16 | Asahi Glass Company Ltd. | Method and apparatus for breaking and cutting a glass ribbon |
| US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
| JP2002328352A (en) * | 2001-04-27 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing liquid crystal display element |
| JP2003154517A (en) * | 2001-11-21 | 2003-05-27 | Seiko Epson Corp | Method and apparatus for cleaving brittle material, and method for manufacturing electronic component |
| US20040001177A1 (en) * | 2002-06-28 | 2004-01-01 | Byun Yong Sang | System and method for manufacturing liquid crystal display devices |
| US20060137505A1 (en) * | 2002-11-06 | 2006-06-29 | Haruo Wakayama | Scribe line forming device and scribe line forming method |
| US20070039990A1 (en) * | 2005-05-06 | 2007-02-22 | Kemmerer Marvin W | Impact induced crack propagation in a brittle material |
| US20070090100A1 (en) * | 2004-04-27 | 2007-04-26 | Toshifumi Yonai | Glass cutting method and apparatus therefor |
| US20080289464A1 (en) * | 2006-01-27 | 2008-11-27 | Nitto Denko Corporation | Cutting method and manufacturing method of sheet member, sheet member, optical element, and image display device |
| CN103936272A (en) * | 2013-01-17 | 2014-07-23 | 雅士晶业股份有限公司 | Cutting method for large-area toughened glass substrate |
| CN104599960A (en) * | 2014-12-29 | 2015-05-06 | 国家电网公司 | Laser cutting method for high-power power electronic device wafer |
| CN104755236A (en) * | 2012-10-19 | 2015-07-01 | 陶氏环球技术有限公司 | Apparatus and method for cutting formable and/or collapsible materials |
| CN108658442A (en) * | 2018-07-26 | 2018-10-16 | 深圳大宇精雕科技有限公司 | Glass-cutting sliver processing line |
| CN208747928U (en) * | 2018-05-31 | 2019-04-16 | 北京沃尔德金刚石工具股份有限公司 | Pressure break break bar and sliver glass cutting machine for sliver |
| CN110550854A (en) * | 2018-05-31 | 2019-12-10 | 北京沃尔德金刚石工具股份有限公司 | Fracturing knife wheel for splintering and glass cutting machine for splintering |
| CN111302613A (en) * | 2020-04-13 | 2020-06-19 | 武汉吉事达科技股份有限公司 | Picosecond laser cutting method for ultra-thick glass |
| CN111393019A (en) * | 2020-03-26 | 2020-07-10 | 深圳市青虹激光科技有限公司 | Glass cutting and splitting processing method and device |
| CN111438442A (en) * | 2018-12-28 | 2020-07-24 | 三星钻石工业株式会社 | Method and apparatus for dividing SiC substrate |
| CN113233751A (en) * | 2021-06-04 | 2021-08-10 | 深圳菲比特光电科技有限公司 | Glass processing method and device |
| CN113571469A (en) * | 2021-06-28 | 2021-10-29 | 中国电子科技集团公司第五十五研究所 | Method for scribing and cutting SiC slices by laser |
-
2022
- 2022-10-25 CN CN202211309491.9A patent/CN115521056A/en active Pending
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07164400A (en) * | 1993-12-15 | 1995-06-27 | Nec Corp | Cutting device for glass board |
| US5871134A (en) * | 1994-12-27 | 1999-02-16 | Asahi Glass Company Ltd. | Method and apparatus for breaking and cutting a glass ribbon |
| US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
| JP2002328352A (en) * | 2001-04-27 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing liquid crystal display element |
| JP2003154517A (en) * | 2001-11-21 | 2003-05-27 | Seiko Epson Corp | Method and apparatus for cleaving brittle material, and method for manufacturing electronic component |
| US20040001177A1 (en) * | 2002-06-28 | 2004-01-01 | Byun Yong Sang | System and method for manufacturing liquid crystal display devices |
| US20060137505A1 (en) * | 2002-11-06 | 2006-06-29 | Haruo Wakayama | Scribe line forming device and scribe line forming method |
| US20070090100A1 (en) * | 2004-04-27 | 2007-04-26 | Toshifumi Yonai | Glass cutting method and apparatus therefor |
| US20070039990A1 (en) * | 2005-05-06 | 2007-02-22 | Kemmerer Marvin W | Impact induced crack propagation in a brittle material |
| US20080289464A1 (en) * | 2006-01-27 | 2008-11-27 | Nitto Denko Corporation | Cutting method and manufacturing method of sheet member, sheet member, optical element, and image display device |
| CN104755236A (en) * | 2012-10-19 | 2015-07-01 | 陶氏环球技术有限公司 | Apparatus and method for cutting formable and/or collapsible materials |
| CN103936272A (en) * | 2013-01-17 | 2014-07-23 | 雅士晶业股份有限公司 | Cutting method for large-area toughened glass substrate |
| CN104599960A (en) * | 2014-12-29 | 2015-05-06 | 国家电网公司 | Laser cutting method for high-power power electronic device wafer |
| CN208747928U (en) * | 2018-05-31 | 2019-04-16 | 北京沃尔德金刚石工具股份有限公司 | Pressure break break bar and sliver glass cutting machine for sliver |
| CN110550854A (en) * | 2018-05-31 | 2019-12-10 | 北京沃尔德金刚石工具股份有限公司 | Fracturing knife wheel for splintering and glass cutting machine for splintering |
| CN108658442A (en) * | 2018-07-26 | 2018-10-16 | 深圳大宇精雕科技有限公司 | Glass-cutting sliver processing line |
| CN111438442A (en) * | 2018-12-28 | 2020-07-24 | 三星钻石工业株式会社 | Method and apparatus for dividing SiC substrate |
| CN111393019A (en) * | 2020-03-26 | 2020-07-10 | 深圳市青虹激光科技有限公司 | Glass cutting and splitting processing method and device |
| CN111302613A (en) * | 2020-04-13 | 2020-06-19 | 武汉吉事达科技股份有限公司 | Picosecond laser cutting method for ultra-thick glass |
| CN113233751A (en) * | 2021-06-04 | 2021-08-10 | 深圳菲比特光电科技有限公司 | Glass processing method and device |
| CN113571469A (en) * | 2021-06-28 | 2021-10-29 | 中国电子科技集团公司第五十五研究所 | Method for scribing and cutting SiC slices by laser |
Non-Patent Citations (1)
| Title |
|---|
| 张冬云: "《激光先进制造基础实验》", 北京工业大学出版社, pages: 130 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105226143B (en) | A kind of cutting method of GaAs base LED chips | |
| KR100626983B1 (en) | Scribing method by use of laser | |
| KR101275739B1 (en) | Method of mechanically breaking a scribed workpiece of brittle fracturing material | |
| EP2507182B1 (en) | Methods for laser scribing and separating glass substrates | |
| JP4729242B2 (en) | Method and apparatus for cutting flat glass plate into multiple rectangular plates | |
| CN105314837A (en) | Substrate cutting method and substrate cutting apparatus | |
| TW201332917A (en) | Cutting and separating method of plate glass, and cutting and separating apparatus of plate glass | |
| JP2004259846A (en) | Method for separating element formed on substrate | |
| TW201620844A (en) | Dividing method and dividing device | |
| CN102898013A (en) | A kind of method of ultraviolet laser cutting glass substrate | |
| CN111900080B (en) | A kind of cutting method of LED chip | |
| CN113172354A (en) | Laser processing method for hole-shaped structure of brittle sheet | |
| JP2006199553A (en) | Apparatus and method for severing substrate | |
| JPS6246930A (en) | Apparatus for dividing glass plate | |
| CN103086594A (en) | Method for scribing reinforced glass substrate and apparatus for scribing the same | |
| JP5076662B2 (en) | Method and apparatus for cleaving brittle materials | |
| CN115521056A (en) | Splitting method for glass laser cutting | |
| KR20170008676A (en) | Method and apparatus for scribing hard brittel plate | |
| CN110828615A (en) | How to make shingled battery string | |
| CN103387335A (en) | Substrate cutting device and substrate cutting method | |
| CN104658976A (en) | Dividing method and dividing apparatus for wafer laminated body | |
| JP4298072B2 (en) | Cleaving method of hard brittle plate | |
| JP3847864B2 (en) | Glass scriber | |
| CN104045230A (en) | Ultra-thin and ultra-thick plate glass cutting method | |
| CN205556461U (en) | Lobe of a leaf device and system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20221227 |
|
| RJ01 | Rejection of invention patent application after publication |