CN115519275B - Lead-free solder paste without soldering flux residue and preparation method thereof - Google Patents
Lead-free solder paste without soldering flux residue and preparation method thereof Download PDFInfo
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- CN115519275B CN115519275B CN202210021066.3A CN202210021066A CN115519275B CN 115519275 B CN115519275 B CN 115519275B CN 202210021066 A CN202210021066 A CN 202210021066A CN 115519275 B CN115519275 B CN 115519275B
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- solder paste
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- tin powder
- lead
- binder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 238000005476 soldering Methods 0.000 title claims abstract description 22
- 230000004907 flux Effects 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000011230 binding agent Substances 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 23
- 239000007787 solid Substances 0.000 claims description 18
- 239000002562 thickening agent Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 8
- 150000002009 diols Chemical class 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 3
- 229910006913 SnSb Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- PICOUKGVAGTEEW-UHFFFAOYSA-N [In][Ag][Sn] Chemical compound [In][Ag][Sn] PICOUKGVAGTEEW-UHFFFAOYSA-N 0.000 claims 2
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims 2
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims 2
- 239000008041 oiling agent Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 6
- 239000010953 base metal Substances 0.000 abstract description 5
- 239000012298 atmosphere Substances 0.000 abstract description 4
- 230000002776 aggregation Effects 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 3
- 238000005054 agglomeration Methods 0.000 abstract description 2
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 2
- 238000004513 sizing Methods 0.000 abstract 1
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 6
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- ZWNMRZQYWRLGMM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diol Chemical compound CC(C)(O)CCC(C)(C)O ZWNMRZQYWRLGMM-UHFFFAOYSA-N 0.000 description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 239000013543 active substance Substances 0.000 description 4
- 235000019253 formic acid Nutrition 0.000 description 4
- OAERLTPBKQBWHJ-UHFFFAOYSA-N n,n-dimethylhexanamide Chemical compound CCCCCC(=O)N(C)C OAERLTPBKQBWHJ-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 2
- DBTGFWMBFZBBEF-UHFFFAOYSA-N 2,4-dimethylpentane-2,4-diol Chemical compound CC(C)(O)CC(C)(C)O DBTGFWMBFZBBEF-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- MGJZVIRGOSYXEE-UHFFFAOYSA-N [Sn].[Ag].[Sn].[In] Chemical compound [Sn].[Ag].[Sn].[In] MGJZVIRGOSYXEE-UHFFFAOYSA-N 0.000 description 2
- GEVVDOZNESEIHY-UHFFFAOYSA-N [Sn].[Sn].[Sb] Chemical compound [Sn].[Sn].[Sb] GEVVDOZNESEIHY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- VHRUBWHAOUIMDW-UHFFFAOYSA-N n,n-dimethyloctanamide Chemical compound CCCCCCCC(=O)N(C)C VHRUBWHAOUIMDW-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N n-decyl alcohol Natural products CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XGGVPUCMUQQFJM-UHFFFAOYSA-N 2-methylhexane-1,3-diol Chemical compound CCCC(O)C(C)CO XGGVPUCMUQQFJM-UHFFFAOYSA-N 0.000 description 1
- FZHZPYGRGQZBCV-UHFFFAOYSA-N 2-propylpropane-1,3-diol Chemical compound CCCC(CO)CO FZHZPYGRGQZBCV-UHFFFAOYSA-N 0.000 description 1
- RDAWEBNAEYZNNL-UHFFFAOYSA-N 4-ethylheptane-3,5-diol Chemical compound CCC(O)C(CC)C(O)CC RDAWEBNAEYZNNL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- ILWSXRPSPOSQNA-UHFFFAOYSA-N [Sn].[Cu].[Ag].[Sn] Chemical compound [Sn].[Cu].[Ag].[Sn] ILWSXRPSPOSQNA-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- KJIOQYGWTQBHNH-UHFFFAOYSA-N undecanol Chemical compound CCCCCCCCCCCO KJIOQYGWTQBHNH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to B23K, in particular to lead-free solder paste without soldering flux residue and a preparation method thereof. The solder paste comprises the following components in percentage by weight: 85-92 wt% of tin powder; 8-15wt% of a binder; the obtained solder paste has the advantages of both the traditional solder paste and soldering lug forming, has the viscosity of the solder paste, can adhere to devices, has no soldering flux residue after welding, and does not need cleaning. The solder paste is required to be welded in the reducing atmosphere as the soldering lug, and can be used for IGBT modules and the like; can be used in screen printing or spot sizing process, and is favorable for forming intermetallic compounds of tin powder and base metal; and the tin powder and the binder provided by the invention have good fluidity and no agglomeration.
Description
Technical Field
The invention relates to B23K, in particular to lead-free solder paste without soldering flux residue and a preparation method thereof.
Background
The solder paste is formed by mixing metal powder and soldering flux, and the conventional solder paste soldering flux generally comprises components such as an oil agent, rosin, an active agent, a thickening agent and the like, wherein the soldering flux releases the activity in the welding process, so that the oxidation of the surfaces of solder metal and a welded base metal is removed, the surface tension of the solder metal is reduced, and the solder metal can fully wet the welded base metal, thereby forming a reliable welding interface. The surface of the solder paste has viscosity, so that the solder paste can be stuck to a welded part, and the welded part cannot be displaced in the production process. Because of the flux, soldering using the solder paste process can be performed in an air or nitrogen atmosphere.
However, after soldering with the solder paste, the flux in the solder paste may remain on the surface of the device, so that the flux residue needs to be completely removed by cleaning, otherwise, the reliability of subsequent bonding and plastic packaging may be seriously affected by the organic matters remaining on the surface of the device. However, the cleaning operation may increase the number of processing steps, and it is difficult to clean some substances in the flux, such as rosin, so that the research of the solder paste without cleaning is one of the current research directions.
CN109877484a provides a no-clean no-residue solder paste and a preparation method thereof, and the solder paste is used for tin-bismuth low-temperature solder paste by adopting self-made polycarbonate polyol, active agent and the like, but the no-residue research on solder paste with higher temperature is less at present, and the components of the solder paste soldering flux used at present are rosin, organic acid, organic amine and the like, most of the components can be left on a substrate after soldering, and in the application occasions with high requirements on surface cleanliness and surface ion residues, a cleaning process is added to remove the residues to meet the requirements.
Disclosure of Invention
In order to solve the above problems, a first aspect of the present invention provides a lead-free solder paste free of flux residue, the solder paste comprising, in weight percent:
85-92 wt% of tin powder;
8-15wt% of binder.
As a preferable technical scheme of the invention, the tin powder is selected from one or more of tin-silver-copper tin powder, tin-antimony tin powder and tin-silver-indium tin powder.
In order to avoid the influence of addition of high molecular substances such as rosin and the like and an active agent on residues, the tin paste is not added with the active agent, but is welded in formic acid atmosphere to remove metal oxides in the soldering paste, wherein formic acid reduces the metal oxides, the obtained metal acid salt is decomposed into metal, and the process of obtaining hydrogen and carbon dioxide has temperature requirements, particularly the decomposition of the metal acid salt is performed at 200 ℃ or above, so tin powder with a proper melting point is required to be selected to control the welding temperature, and the removal of the metal oxides is realized. In addition, the solvent having a boiling point higher than 200 ℃ is preferably more than 50wt%, more preferably more than 80wt%, based on the total amount of the solvent, also because of its high welding temperature. The test conditions of the melting point and the boiling point are normal temperature and normal pressure.
As a preferable technical scheme of the invention, the tin-silver-copper series tin powder is SnAg0.5-3.5Cu0-0.5, and can be exemplified by Sn96Ag3.5Cu0.5, sn96.5Ag3.5, sn98.5Ag1Cu0.5 and Sn96.3Ag3.2Cu0.5; the tin-antimony tin powder is SnSb 5-10, and can be exemplified by SnSb5, snSb8 and SnSb10; the tin-silver-indium tin powder is SnAg 1-5 In 3-20 Bi 0-3, and examples thereof include Sn88Ag3.5In8Bi0.5 and Sn92Ag3.5In4Bi0.5.
As a preferable technical scheme of the invention, the raw materials for preparing the adhesive comprise 8-30wt% of thickener, and the thickener comprises 8wt%, 9wt%, 10wt%, 11wt%, 12wt%, 13wt%, 14wt%, 15wt%, 20wt%, 25wt% and 30wt%; and the balance of oil;
The melting point of the tin powder is 200 to 300 ℃, and 200 ℃, 210 ℃, 220 ℃, 230 ℃, 240 ℃, 250 ℃, 260 ℃, 270 ℃, 280 ℃, 290 ℃ and 300 ℃ can be cited.
As a preferable technical scheme of the invention, the oil agent comprises liquid oil agent, or liquid oil agent and solid oil agent. The liquid oil agent is a solvent which is liquid at normal temperature (30 ℃), and the solid solvent is a solvent which is solid at normal temperature.
As a preferable technical scheme of the invention, the liquid oil agent is at least one C8-C12 monohydric alcohol and/or at least one C5-C10 dihydric alcohol, and preferably, the liquid oil agent accounts for 40wt% or more of the binder.
Examples of the liquid oil include lauryl alcohol, 1-decyl alcohol, 1-undecyl alcohol, 2-methyl-1, 3-hexanediol, 3-methyl-1, 5-pentanediol, 2-ethyl-1, 3-hexanediol, 2-methyl-2, 4-pentanediol, 2-n-propyl propane-1, 3-diol, and 2, 4-dimethyl-2, 4-pentanediol.
As a preferable technical scheme of the invention, the solid oil is at least one C5-C10 branched diol or at least one C5-C10 branched diol and at least one C5-C10 triol. Preferably, the solid oil agent accounts for 10wt% or more of the binder, preferably 20wt% or more, more preferably 30wt% or more; the content of the C5-C10 triol in the binder is 0-8 wt%, and examples thereof include 0wt%, 1wt%, 2wt%, 3wt%, 4wt%, 5wt%, 6wt%, 7wt% and 8wt%.
As a preferable technical scheme of the invention, the solid oil is at least two C5-C10 branched diols, or at least two C5-C10 branched diols and at least one C5-C10 triol.
Examples of the solid oil include 2, 4-trimethyl-1, 3-pentanediol, 2, 5-dimethyl-2, 5-hexanediol, 2, 3-trimethyl-1, 3-pentanediol, trimethylolpropane, trimethylolethane, 4-ethyl-3, 5-heptanediol, and neopentyl glycol.
The invention does not limit the dosage of solid oil agent and liquid oil agent, and can be adjusted according to the welding temperature.
As a preferable embodiment of the present invention, the thickener is an N, N-di-C1-C3 alkyl substituted C8-C20 fatty amide, and examples thereof include N, N-dimethylcaproamide, N, N-dimethyl-caprylamide and N, N-dimethylcaproamide.
The second aspect of the invention provides a method for preparing the lead-free solder paste without soldering flux residue, which comprises the following steps:
and mixing tin powder with a binder to obtain the tin paste.
Compared with the prior art, the invention has the following beneficial effects: the invention provides a residue-free solder paste formulation technology, and the obtained solder paste combines the advantages of the traditional solder paste and soldering lug forming, has the viscosity of the solder paste, can adhere devices, has no soldering flux residue after welding, and does not need cleaning. The solder paste is required to be welded in the reducing atmosphere as the soldering lug, and can be used for IGBT modules and the like; the inventor finds that the adhesive can be used in screen printing or spot-size process by controlling the selection of the oil agent and the selection of the thickener in the solder paste, and the inventor finds that the adhesive is favorable for the storage stability between the tin powder and the adhesive, and the inventor finds that the adhesive can be used in screen printing or spot-size process by adjusting the selection of the thickener, and also provides the proper fluidity of the tin powder, promotes the escape of hydrogen and carbon dioxide in the subsequent formic acid reflow soldering process, avoids the retraction phenomenon caused by overlarge viscosity, and is favorable for the formation of intermetallic compounds of the tin powder and the base metal; and the tin powder and the binder provided by the invention have good fluidity and no agglomeration.
Detailed Description
Examples
Example 1
The example provides a solder paste, which comprises the following components in percentage by weight: 92wt% of tin powder; 8wt% of a binder, wherein the tin powder is Sn96Ag3.5Cu0.5; the adhesive is prepared from the following raw materials in percentage by weight, including 15% of thickener and the balance of oil, wherein the oil comprises liquid oil and solid oil, the liquid oil is 2, 4-dimethyl-2, 4-pentanediol, the liquid oil accounts for 45% by weight of the adhesive, the solid oil is 2, 4-trimethyl-1, 3-pentanediol and 2, 5-dimethyl-2, 5-hexanediol, and the weight ratio is 1:1, wherein the thickener is N, N-dimethylcaproamide.
The example also provides a preparation method of the lead-free solder paste, which comprises the following steps: and mixing tin powder with a binder to obtain the tin paste.
Example 2
The example provides a solder paste, which comprises the following components in percentage by weight: 90wt% of tin powder; 10wt% of a binder, wherein the tin powder is SnSb5; the adhesive is prepared from the following raw materials in percentage by weight, wherein the raw materials comprise 10 weight percent of thickener and the balance of oil, the oil comprises liquid oil and solid oil, the liquid oil is 1-decyl alcohol and lauryl alcohol, and the weight ratio is 1:1.2, the liquid oil agent accounts for 50 weight percent of the binder, the solid oil agent is 2-ethyl-1, 3-hexanediol, trimethylolpropane and 2, 5-dimethyl-2, 5-hexanediol, the 2-ethyl-1, 3-hexanediol, the trimethylolpropane and the 2, 5-dimethyl-2, 5-hexanediol account for 18 weight percent, 4 weight percent and 18 weight percent of the binder, and the thickener is N, N-dimethyl-octanoyl amide.
The example also provides a preparation method of the lead-free solder paste, which comprises the following steps: and mixing tin powder with a binder to obtain the tin paste.
Example 3
The example provides a solder paste, which comprises the following components in percentage by weight: 85wt% of tin powder; 15wt% of a binder, wherein the tin powder is Sn88Ag3.5In8Bi0.5; the adhesive is prepared from the following raw materials in percentage by weight, wherein the raw materials comprise 8 weight percent of thickener and the balance of oil, the oil comprises liquid oil and solid oil, the liquid oil is 3-methyl-1, 5-pentanediol and 2-methyl-2, 4-pentanediol, and the weight ratio is 1:1.5, wherein the liquid oil agent accounts for 40 weight percent of the binder, the solid oil agent is neopentyl glycol and 2-ethyl-1, 3-hexanediol, and the weight ratio is 1:1.5, wherein the thickener is N, N-dimethylcaproamide.
The example also provides a preparation method of the lead-free solder paste, which comprises the following steps: and mixing tin powder with a binder to obtain the tin paste.
Example 4
The example provides a solder paste, which comprises the following components in percentage by weight: 85wt% of tin powder; 15wt% of a binder, wherein the tin powder is Sn88Ag3.5In8Bi0.5; the adhesive is prepared from the following raw materials in percentage by weight, wherein the raw materials comprise 8 weight percent of thickener and the balance of oil, the oil comprises liquid oil and solid oil, the liquid oil is 3-methyl-1, 5-pentanediol and 2-methyl-2, 4-pentanediol, and the weight ratio is 1:1.5, wherein the liquid oil agent accounts for 40 weight percent of the binder, the solid oil agent is neopentyl glycol and 2-ethyl-1, 3-hexanediol, and the weight ratio is 1:1.5, the thickener is OP-10.
The example also provides a preparation method of the lead-free solder paste, which comprises the following steps: and mixing tin powder with a binder to obtain the tin paste.
Evaluation of Performance
1. Residue: the mass m1 of the alloy powder before solder paste mixing of the examples, the mass m2 of the base metal copper, and the total mass m3 of the solder paste after reflow soldering in a formic acid atmosphere were weighed, and the residue = (m 3-m1-m 2)/m 2 was calculated to be 100%, and the results are shown in table 1.
Wherein the welding conditions of each experimental group and the control group are as follows:
example 1:200 ℃ for 5min and 275 ℃ for 5min;
example 2:220 ℃ for 5min and 300 ℃ for 5min;
examples 3 and 4:200 ℃ for 5min and 275 ℃ for 5min.
2. Layering phenomenon: the solder paste provided in the examples was stored at 30℃for 6 months, and observed for delamination, and the results are shown in Table 1: no delamination or micro-delamination, and uniformity after stirring.
3. Dispersion properties: after the solder paste provided in the example was stored at 30℃for 6 months, it was observed whether or not there were problems such as hard aggregation and drying, and the result was in a paste flow state, as shown in Table 1.
TABLE 1
As shown by the test results of the table, the solder paste provided by the invention has the characteristics of no residue, good storage stability and good fluidity, and can be used for packaging IGBT modules.
Claims (5)
1. A lead-free solder paste without soldering flux residue, which is characterized by comprising the following components in percentage by weight:
85-92 wt% of tin powder;
8-15wt% of a binder;
The adhesive is prepared from the following raw materials in percentage by weight, wherein the raw materials comprise 8-30wt% of thickening agent and the balance of oil agent;
The melting point of the tin powder is 200-300 ℃;
the oil agent comprises liquid oil agent or liquid oil agent and solid oil agent;
the liquid oiling agent is at least one C8-C12 monohydric alcohol and at least one C5-C10 dihydric alcohol; the solid oil agent is at least two C5-C10 branched diols, or at least two C5-C10 branched diols and at least one C5-C10 triol;
The thickener is N, N-di-C1-C3 alkyl substituted C8-C20 fatty amide.
2. The lead-free solder paste of claim 1, wherein the tin powder is selected from one or more of tin-silver-copper-based tin powder, tin-antimony-based tin powder, tin-silver-indium-based tin powder.
3. The lead-free solder paste without flux residue according to claim 2, wherein the tin-silver-copper-based tin powder is snag0.5-3.5cu0-0.5, the tin-antimony-based tin powder is SnSb 5-12, and the tin-silver-indium-based tin powder is snag1-5 in 3-20 bi 0-3.
4. The lead-free solder paste without flux residue according to claim 1, wherein the thickener accounts for 9-15 wt% of the binder.
5. A method for producing a lead-free solder paste free of flux residue according to any one of claims 1 to 4, comprising:
and mixing tin powder with a binder to obtain the tin paste.
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| CN118342159A (en) * | 2024-05-16 | 2024-07-16 | 深圳市晨日科技股份有限公司 | A formic acid high-lead solder paste and its application |
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| CN1047236A (en) * | 1989-03-20 | 1990-11-28 | 波克股份有限公司 | The method of reflow soldering |
| CN109262161A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of low-residual halogen-free soldering tin paste |
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| US5116433A (en) * | 1990-10-31 | 1992-05-26 | Motorola, Inc. | Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same |
| CN101569966B (en) * | 2009-06-10 | 2015-11-25 | 上海华庆焊材技术有限公司 | A kind of lead-free tin cream |
| CN104028912A (en) * | 2014-06-18 | 2014-09-10 | 谢光玉 | Lead-free solder paste |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047236A (en) * | 1989-03-20 | 1990-11-28 | 波克股份有限公司 | The method of reflow soldering |
| CN109262161A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of low-residual halogen-free soldering tin paste |
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