CN115502500A - Aluminum product with multilayer structure and manufacturing method thereof - Google Patents

Abstract

The application relates to a manufacturing method of an aluminum product with a multilayer structure, which comprises the following steps: providing a plurality of metal base metals made of aluminum or aluminum alloy; stacking a plurality of metal base materials according to a preset sequence, wherein the surfaces to be welded of the adjacent metal base materials are relatively attached, and at least one surface of each of the two opposite surfaces to be welded is covered with a simple substance of silicon in advance; and performing vacuum brazing on the plurality of metal base materials which are stacked. The aluminum product with the multilayer structure is manufactured by the method, the covered silicon simple substance layer can replace the traditional soldering lug or soldering paste as the soldering flux for vacuum brazing, the thickness of the product can be thinner, the flatness of a welding surface can be better ensured, the welding defects can be reduced, the yield of finished products can be improved, a soldering flux groove does not need to be reserved, special customized soldering flux is not needed, the soldering flux does not need to be positioned before welding, and the process is simpler.

Description

Aluminum product with multilayer structure and manufacturing method thereof

technical field

The present application relates to the technical field of metal welding, in particular to an aluminum product with a multi-layer structure and a manufacturing method thereof.

Background technique

Vacuum aluminum brazing technology refers to a brazing method in which aluminum or aluminum alloy is used as the metal base material, and under certain temperature and vacuum conditions, the metal base material is connected by brazing filler metal by capillary action. The vacuum aluminum brazing process is completed under the condition of vacuum and uniform heating, which can effectively avoid the adverse effects of air on the metal base metal. The welded parts have dense welds and no corrosion, high weld strength, small dimensional deformation, and no need for welding after welding. Cleaning and other advantages, and this technology can also realize multiple welding seams and multiple parts welding at the same time. , radar and other fields that require high complexity and precision of parts have been widely used.

The current vacuum aluminum brazing technology usually needs to use solder for auxiliary welding. Since the temperature of aluminum single substance or aluminum alloy for vacuum brazing is higher than the liquidus temperature of the solder but lower than the solidus temperature of the metal base material, when welding The solder melts into a liquid state while the base metal remains solid. The liquid solder wets, capillary flows, fills, and spreads in the gaps or surfaces of the base metal. After cooling, the solder solidifies to form a firm welding layer, thereby realizing the Multiple layers of base metal are firmly welded together.

Further, the process of traditional vacuum aluminum brazing technology is usually: machining the metal base material made of aluminum or aluminum alloy, processing a cavity or groove, and reserving a solder groove on the surface of the metal base material; The surface of the metal base material after machining is deoxidized; the solder sheet or solder paste is placed in the reserved solder tank for vacuum brazing to form a welded product.

Solder flakes and solder paste are common solders in vacuum aluminum brazing technology. The operation of brazing with solder paste is relatively simple, but it is difficult to ensure the thickness and shape of the coating when the solder paste is coated on the metal base material Consistency, the unevenness of the welding surface is likely to lead to welding defects, and the final product yield is low; while the soldering sheet is used for brazing operation, it is necessary to customize the soldering sheet in advance according to the processing structure of each layer of the metal base material, the customization cost is high, and Since the soldering sheet required for brazing is extremely thin, usually between 0.01mm and 0.1mm, it is difficult to manufacture a soldering sheet with a special structure, and the material is too thin to be easily deformed during processing. In addition, the soldering sheet is used for brazing When welding, it is necessary to use special positioning equipment to preset the soldering piece on the surface to be welded before welding, and the process is cumbersome.

Contents of the invention

Based on this, it is necessary to provide an aluminum product with a multi-layer structure and a manufacturing method thereof, which can improve the flatness of the welding surface, reduce welding defects, thereby improving the yield of finished products, and have a simple process.

An embodiment of the present application provides a method for manufacturing an aluminum product with a multilayer structure, comprising the following steps:

Provide multiple metal base materials made of aluminum or aluminum alloy;

A plurality of metal base materials are stacked and placed in a preset order, the surfaces to be welded of adjacent metal base materials are relatively attached, and at least one of the two opposite surfaces to be welded is pre-coated with a silicon element layer;

Vacuum brazing is performed on multiple metal base materials stacked on top of each other.

In one embodiment, the simple silicon layer is deposited on the surface to be welded by evaporation or sputtering.

In one of the embodiments, the thickness of the silicon element layer between two opposing surfaces to be welded in adjacent metal base materials satisfies at least one of the following conditions:

(1) The total thickness is 5 μm to 1000 μm;

(2) The thickness of each silicon element layer is 1 to 1.5 times the flatness of the surface to be welded covered with the silicon element layer.

In one of the embodiments, the following steps are also included:

A functional structure is directly processed on the surface of the metal base material not covered with the simple silicon layer and/or a functional structure is processed through the simple silicon layer to the metal base material on the surface covered with the simple silicon layer.

In one of the embodiments, the functional structures on the two opposite surfaces to be welded in adjacent metal base materials are mutually symmetrical structures;

Optionally, one of the two opposite surfaces to be welded is covered with a silicon element layer, and the other side is not covered with a silicon element layer.

In one of the embodiments, the functional structures on the two opposite surfaces to be welded in adjacent metal base materials are mutually asymmetrical structures;

Optionally, the two opposite surfaces to be welded are covered with a single-silicon layer, and the thickness of each single-silicon layer is thinner than that of only one single-silicon layer in the adjacent metal base material.

In one of the embodiments, the functional structure includes at least one of a channel, a groove and a hole.

In one of the embodiments, the conditions of vacuum brazing meet at least one of the following conditions:

(1) The temperature of vacuum brazing is 500℃～700℃;

(2) The vacuum degree of vacuum brazing is < ^10-3 Pa.

An embodiment of the present application provides an aluminum product with a multi-layer structure, including a base metal layer and a welding layer, the material of the base metal layer includes aluminum or aluminum alloy, and the material of the welding layer includes simple silicon;

The number of layers of the metal base material layer is multi-layer, and the adjacent metal base material layers are connected through the welding layer.

In one of the embodiments, it is produced by the method for producing an aluminum product with a multi-layer structure described in any of the above-mentioned embodiments.

In the above method, a plurality of metal base materials are stacked and placed in a preset order, and at least one of the two opposing surfaces to be welded in adjacent metal base materials is covered with a simple silicon layer, and then vacuum brazing is carried out. Aluminum products with a multi-layer structure are produced, and the silicon single-substance layer covered can replace the traditional solder sheet or solder paste as the solder for vacuum brazing, which can have a thinner thickness, which is more conducive to ensuring the flatness of the soldering surface , which is beneficial to reduce welding defects and improve the yield rate of finished products, and this method does not need to reserve a solder groove, nor does it need to customize the solder, and it does not need to position the solder before soldering, and the process is simpler.

Description of drawings

FIG. 1 is a schematic structural view of an aluminum product with a multilayer structure in an embodiment.

Explanation of reference signs:

100: aluminum product with multi-layer structure; 110: metal base material layer; 120: welding layer.

detailed description

In order to facilitate the understanding of the present application, the present application will be more fully described below in conjunction with the embodiments and accompanying drawings. This application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the application more thorough and comprehensive.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In this application, the technical features described in open form include closed technical solutions consisting of the listed features, and open technical solutions including the listed features.

An embodiment of the present application provides a method for manufacturing an aluminum product with a multi-layer structure, including the following steps S110-S130.

Step S110: Provide a plurality of metal base materials made of aluminum or aluminum alloy.

It can be understood that the number of metal base materials can be provided according to the number of layers of the final aluminum product, for example, it can be two pieces, three pieces, five pieces, even ten pieces, twenty pieces, etc., not limited to this.

It can be understood that the shape of the base metal can be provided according to the design requirements of the final aluminum product, such as a rectangle, a circle, a polygon, etc., and is not limited thereto.

It can be understood that the thickness of the base metal can be provided according to the design requirements of the final aluminum product, which is not specifically limited in this application. In a specific example, the thickness of the base metal is 3 mm to 20 mm.

Step S120: Lay a plurality of base metals on top of each other in a preset order, the surfaces to be welded of adjacent base metals are relatively attached, and at least one of the two opposing surfaces to be welded is pre-coated with a simple silicon layer.

Further, the total thickness of the silicon element layer between two opposing surfaces to be welded in adjacent metal base materials is 5 μm˜1000 μm. The total thickness of the silicon single substance layer between the two opposite surfaces to be welded in adjacent metal base materials can ensure that there is sufficient solder to effectively form a firm welded layer within this range, and the thickness will not be too thick, During soldering, the risk of excess solder overflowing to functional structures can be reduced, and the yield rate of finished products can be improved. It can be understood that the total thickness of the silicon element layer between two opposing surfaces to be welded in adjacent metal base materials can be, for example, 5 μm, 8 μm, 10 μm, 15 μm, 25 μm, 30 μm, 50 μm, 80 μm, 100 μm, 150 μm, 200 μm , 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm, 1000 μm, etc., are not limited thereto. Preferably, the total thickness of the silicon element layer between two opposing surfaces to be welded in adjacent metal base materials is 5 μm˜500 μm. More preferably, the total thickness of the silicon element layer between two opposing surfaces to be welded in adjacent metal base materials is 5 μm to 200 μm. More preferably, the total thickness of the silicon element layer between two opposing surfaces to be welded in adjacent metal base materials is 5 μm˜50 μm.

Further, in the silicon single substance layer between two opposing surfaces to be welded in adjacent metal base materials, the thickness of each silicon single substance layer is 1 to 1.5 times the flatness of the surface to be welded covered with the silicon simple substance layer . Within this range, the thickness of each silicon element layer between the two opposing surfaces to be welded in adjacent metal base materials is more matched to the flatness of the surface to be welded covered with the silicon element layer, which is beneficial to ensure welding The resulting welding surface is smoother, which can reduce welding gaps, which in turn helps to reduce welding defects and improve the yield of finished products. For example, in a specific example, when only one side between the two opposite surfaces to be welded in adjacent metal base materials is covered with a silicon simple substance layer, the flatness of the surface to be welded to be covered with a silicon simple substance layer is 0.02mm, the thickness of the silicon element layer covered on the surface to be welded is preferably 20 μm to 30 μm. The total thickness of the silicon element layer between the surfaces to be welded. For another example, in other specific examples, the opposite two surfaces to be welded in the adjacent metal base materials are covered with silicon simple substance layers, and the flatness of one of the surfaces to be welded is 0.01mm, then the surface to be welded is coated with During silicon single substance layer, the thickness of silicon simple substance layer is preferably 10 μm～15 μm, and the flatness of another surface to be welded is 0.02mm, then when this surface to be welded is covered with silicon simple substance layer, the thickness of silicon simple substance layer is preferably 20 μm～ It can be understood that the total thickness of the silicon element layer between the two opposing surfaces to be welded in adjacent metal base materials is the sum of the thicknesses of the individual silicon element layers on the two opposite surfaces to be welded respectively.

Further, the simple silicon layer is coated on the surface to be welded by evaporation or sputtering. It can be understood that evaporation refers to a coating process in which the coating material is evaporated and vaporized by heating and evaporating under vacuum conditions, and the vaporized coating material floats to the surface of the substrate to be coated and condenses to form a film. Sputtering refers to a coating process that bombards the surface of the target with ions, the atoms of the target are knocked out, and the knocked out atoms are deposited on the surface of the substrate to be coated to form a film, such as but not limited to radio frequency sputtering , Magnetron sputtering, etc. At least one surface between the two opposing surfaces to be welded in adjacent metal base materials is pre-plated with a silicon element layer by means of evaporation or sputtering, which can help ensure the consistency of the thickness of the silicon element layer, and then facilitate Ensure that the welding surface formed by welding is smoother, which can reduce welding defects and improve the welding rate.

In the traditional technology, whether it is to apply solder paste or use soldering sheet for soldering, it is difficult to make the soldering layer in it reach a thickness as thin as 5 μm to 1000 μm, especially if you want to make the solder paste or soldering sheet less than 50 μm The thin thickness process is very difficult and almost impossible to achieve. Traditionally, when welding with solder paste or using solder tabs, due to the excessive thickness of solder paste or solder tabs, not only is it difficult to ensure the flatness of the soldering surface, it is easy to cause the weld seam to be too large, and it will also cause the overall thickness of the final product to change. Large, but for products with high precision requirements, the size of any component is strictly regulated. If the overall thickness of the finished product is too large, it may not meet the design requirements, and it is also a defective product. In one embodiment of the present application, the silicon-coated simple substance layer can have a smaller thickness, and can ensure a smoother welding surface, which can greatly improve the yield of finished products.

In a specific example, step S120 also includes the following steps:

The functional structure is directly processed on the surface of the metal base material not covered with the silicon simple substance layer and/or the functional structure is processed through the silicon simple substance layer to the metal base material on the surface covered with the silicon simple substance layer.

It can be understood that the functional structure can be designed according to requirements, and it can be provided on any surface of each metal base material, and any metal base material can be preset with a specific functional structure. Further, the functional structure may include, but is not limited to, at least one of a channel, a groove, and a hole, for example.

It can be understood that if the surface of the metal base material of the functional structure to be processed is covered with a silicon simple substance layer, the processing starts directly from the silicon simple substance layer on the surface, and the processing depth penetrates the silicon simple substance layer to the inside of the metal base material.

When soldering is traditionally used as solder, the functional structure is processed first, and then the soldering sheet is placed. The soldering sheet needs to be specially customized to avoid all functional structures. For complex functional structures, the processing of soldering sheets is difficult. It is very easy to deform and easily affect the flatness of the welding surface, especially when the size of the functional structure is also very small, for example, when the size of the cavity is less than 1mm, the deformation of the welding piece cannot be controlled due to the deformation of the welding piece, so as to avoid the deformation of the welding piece and block the cavity , often only let the solder piece avoid the cavity, thereby reducing the welding rate. In a specific example provided in this application, the simple silicon layer is directly and completely covered in advance on at least one side between the two opposing surfaces to be welded in adjacent metal base materials, and then the functional structure is processed. In the process of functional structure, if the surface is covered with silicon single substance layer, the material part of silicon single substance layer corresponding to the functional structure will be processed and removed at the same time. The processing depth of functional structure penetrates the silicon simple substance layer to the corresponding metal base material. It can ensure that there will be no solder in the place with functional structure, so as to avoid blocking the functional structure, and the area without functional structure is covered with silicon single-layer material for welding, which can greatly improve the welding rate. Further, at least one side between the two opposing surfaces to be welded in adjacent metal base materials is pre-coated with a silicon single-substance layer and then processed into a functional structure, which can further reduce the amount of solder by controlling the total thickness of the coated silicon single-substance layer. Risk of overflow into functional structures during brazing.

It can be understood that, for the two opposite surfaces to be welded in adjacent metal base materials, the functional structures on the two opposite surfaces to be welded may be mutually symmetrical or mutually asymmetrical.

In a specific example, the functional structures on the two opposite surfaces to be welded in the adjacent metal base materials are mutually symmetrical; optionally, one of the two opposite surfaces to be welded may be covered with silicon layer, and the other side is not covered with a silicon simple substance layer; optionally, the two opposite surfaces to be welded can also be covered with a silicon simple substance layer.

Preferably, the functional structures on the two opposite surfaces to be welded in the adjacent metal base materials are symmetrical to each other, and one of the two opposite surfaces to be welded is covered with a silicon element layer, and the other side is not covered with a silicon element layer. layer. When the functional structures on the two opposite surfaces to be welded in the adjacent metal base materials are mutually symmetrical structures, only one of the surfaces is covered with a single layer of silicon, and then the silicon at the corresponding position of the functional structure is processed on the surface. The single layer materials have been processed and removed at the same time. When the two opposite surfaces to be welded are bonded together, the other opposite surface to be welded has a symmetrical structure with the welding surface with the silicon single layer, and its functional structure also avoids being used as solder. The problem of material blockage of the single-layer silicon layer can be avoided, and the process of covering the single-layer silicon layer on the other surface to be welded can be omitted, which simplifies the manufacturing method.

In a specific example, the functional structures on the two opposite surfaces to be welded in the adjacent metal base materials are mutually asymmetrical structures, and the two opposite surfaces to be welded are covered with a silicon element layer, and each silicon element The thickness of the layer is thinner than the thickness of only one single silicon layer on the two opposite surfaces to be welded in adjacent metal base materials. It can be understood that when the functional structures on the opposite two surfaces to be welded in adjacent metal base materials are mutually asymmetrical structures, the thicknesses of the silicon element layers respectively covered on the two opposite surfaces to be welded meet the requirements of each silicon layer. Under the premise of the flatness requirements between the simple substance layer and the surface to be welded, compared with the case where there is only one silicon simple substance layer in the adjacent metal base material, reducing the thickness of each silicon simple substance layer as much as possible can help reduce the silicon substance. Risk of layer solder overflowing into functional structures on another surface.

Step S130: Vacuum brazing is performed on the stacked metal base materials.

In the traditional process of vacuum brazing using solder paste or solder sheet as solder, before vacuum brazing, the step of removing the oxide film on the surface of the metal base material is required, but in one embodiment provided by the application, after step S120 Finally, the metal base material covered with a simple silicon layer on the surface to be welded can block the contact between the metal base material and the air due to the existence of the silicon single material layer, thereby avoiding the continuous oxidation of the metal base material surface to form a dense oxide film, so the corresponding metal base material The material can be directly vacuum brazed, and there is no need to remove the oxide film on the surface of the metal base material before brazing, which can save process procedures.

In a specific example, the temperature of the vacuum brazing ranges from 500°C to 700°C. In this temperature range, the silicon in the silicon element layer and the aluminum in the metal base material in contact with it will react and interact with each other so that the material used as the solder layer is alloyed into an aluminum-silicon alloy and melted, which can The silicon single-layer solder layer is fully contacted with the two surfaces of the corresponding metal base materials and the welding is successfully completed. If the temperature is too low, the solder will not melt until it reaches the melting point, and the welding effect cannot be achieved. If the temperature is too high, the metal base material will be melted or ablated. Understandably, the temperature of vacuum brazing can be, for example, 500°C, 510°C, 520°C, 530°C, 540°C, 550°C, 560°C, 570°C, 580°C, 590°C, 600°C, 610°C, 620°C , 630°C, 640°C, 650°C, 660°C, 670°C, 680°C, 690°C, 700°C, etc., are not limited thereto.

In a specific example, the vacuum degree of vacuum brazing is <10 ⁻³ Pa.

In the above method, at least one surface of the two opposing surfaces to be welded in adjacent metal base materials is covered with a simple substance layer of silicon, and the simple substance layer of silicon is used as a connecting surface to make the two surfaces to be welded correspond to each other, so that the multiple pieces The above-mentioned metal base materials are stacked and placed in a preset order, and then vacuum brazed to produce an aluminum product with a multi-layer structure. The silicon-coated simple layer can replace the traditional use of solder sheets or solder paste for vacuum brazing. Solder, which can have a thinner thickness, is more conducive to ensuring the flatness of the welding surface, is conducive to reducing welding defects, and can improve the yield of finished products, and this method does not need to customize the solder, and does not need to position the solder before welding. The process is simpler.

As shown in FIG. 1 , an embodiment of the present application also provides an aluminum product 100 with a multilayer structure, including a base metal layer 110 and a welding layer 120. The material of the base metal layer 110 includes aluminum or an aluminum alloy. The material of layer 120 includes simple silicon.

The number of layers of the metal base material layer 110 is multi-layer, and the adjacent metal base material layers 110 are connected by the welding layer 120 .

Further, the aluminum product 100 with a multi-layer structure is manufactured by the above-mentioned method for manufacturing an aluminum product with a multi-layer structure.

An embodiment of the present application also provides an industrial component, including the above-mentioned aluminum product 100 with a multi-layer structure. It can be understood that industrial components may be, for example but not limited to, pipes, brackets, casings and the like.

An embodiment of the present application also provides an industrial product, including the above-mentioned industrial parts. Understandably, industrial products may be, for example but not limited to, microwave components, waveguides, enclosures, heat sinks, radars, and the like.

The following are specific examples.

Example 1

A method for manufacturing an aluminum product with a multilayer structure, comprising the steps of:

Step 1: Provide two metal base materials made of aluminum alloy, which are called the first base metal and the second base metal in turn, and the two surfaces to be welded opposite the first base metal and the second base metal are respectively the second A welding surface and a second welding surface.

Step 2: Coating a simple silicon layer with a thickness of 20 μm on the first welding surface by evaporation process, and the flatness of the first welding surface is 0.02 mm.

Step 3: The functional structures are respectively processed on the surfaces of the two base metals, and the functional structures processed on the first welding surface and the second welding surface are mutually symmetrical structures.

Step 4: The first welding surface and the second welding surface are attached to each other, and the two metal base materials are stacked, and the silicon element layer is between the first welding surface and the second welding surface.

Step 5: Vacuum brazing the two stacked metal base materials, the temperature of vacuum brazing is 700°C, and the vacuum degree is < ^10-3 Pa.

Example 2

A method for manufacturing an aluminum product with a multilayer structure, comprising the steps of:

Step 1: Provide two metal base materials made of aluminum alloy, which are called the first base metal and the second base metal in turn, and the two surfaces to be welded opposite the first base metal and the second base metal are respectively the second A welding surface and a second welding surface.

Step 2: Plating a single silicon layer with a total thickness of 80 μm on the first welding surface by sputtering process, and the flatness of the first welding surface is 0.08 mm.

Step 3: The functional structures are respectively processed on the surfaces of the two base metals, and the functional structures processed on the first welding surface and the second welding surface are mutually symmetrical structures.

Step 4: The first welding surface and the second welding surface are attached to each other, and the two metal base materials are stacked, and the silicon element layer is between the first welding surface and the second welding surface.

Step 5: Vacuum brazing the two stacked metal base materials, the temperature of the vacuum brazing is 500°C, and the vacuum degree is < ^10-3 Pa.

Example 3

A method for manufacturing an aluminum product with a multilayer structure, comprising the steps of:

Step 1: Provide three metal base materials made of aluminum alloy, which are called the first metal base material, the second metal base material and the third metal base material in turn, and the first metal base material and the second metal base material are opposite to each other. The surfaces to be welded are respectively the first welded surface and the second welded surface, and the two surfaces to be welded opposite to the second base metal and the third base metal are respectively the third welded surface and the fourth welded surface.

Step 2: Plating a single silicon layer with a total thickness of 20 μm on the first welding surface by a sputtering process, and the flatness of the first welding surface is 0.02 mm. A single silicon layer with a total thickness of 30 μm is plated on the fourth welding surface by a sputtering process, and the flatness of the fourth welding surface is 0.02 mm.

Step 3: The functional structures processed on the surfaces of the three metal base materials respectively, and the functional structures processed on the first welding surface and the second welding surface are mutually symmetrical structures, and the functional structures processed on the third welding surface and the fourth welding surface The functional structures processed above are mutually symmetrical structures.

Step 4: The first welding surface and the second welding surface are relatively attached, the third welding surface and the fourth welding surface are relatively attached, and the three metal base materials are arranged according to the first metal base material, the second metal base material, and the third base metal. The metal base materials are stacked sequentially, and there are single silicon layers between the first welding surface and the second welding surface, and between the third welding surface and the fourth welding surface.

Step 5: Vacuum brazing the three stacked metal base materials, the temperature of vacuum brazing is 600°C, and the vacuum degree is < ^10-3 Pa.

Comparative example 1

A method for manufacturing an aluminum product with a multilayer structure, comprising the steps of:

Step 1: Provide two metal base materials made of aluminum alloy, which are called the first base metal and the second base metal in turn, and the two surfaces to be welded opposite the first base metal and the second base metal are respectively the second A welding surface and a second welding surface.

Step 2: Process functional structures on the surfaces of the two base metals and reserve solder grooves, and the functional structures processed on the first welding surface and the second welding surface are mutually symmetrical structures.

Step 3: Deoxidize the surface of the two base metals.

Step 4: Apply solder paste with a total thickness of 80 μm in the reserved solder tank.

Step 5: The first welding surface and the second welding surface are attached to each other and the two base metals are stacked.

Step 6: Vacuum brazing the two stacked metal base materials, the temperature of vacuum brazing is 500° C., and the vacuum degree is < ^10-3 Pa.

Comparative example 2

A method for manufacturing an aluminum product with a multilayer structure, comprising the steps of:

Step 1: Provide two metal base materials made of aluminum alloy, which are called the first base metal and the second base metal in turn, and the two surfaces to be welded opposite the first base metal and the second base metal are respectively the second A welding surface and a second welding surface.

Step 2: Process functional structures on the surfaces of the two base metals and reserve solder grooves, and the functional structures processed on the first welding surface and the second welding surface are mutually symmetrical structures.

Step 3: Deoxidize the surface of the two base metals.

Step 4: Place a custom-made solder piece with a thickness of 80μm in the reserved solder groove and position it.

Step 5: The first welding surface and the second welding surface are attached to each other and the two base metals are stacked.

Step 6: Vacuum brazing the two stacked metal base materials, the temperature of vacuum brazing is 500° C., and the vacuum degree is < ^10-3 Pa.

The welding rate, deformation rate and tensile strength performance tests were carried out on the aluminum products with multi-layer structure produced in Examples 1 to 3 and Comparative Examples 1 to 2, and the test results are shown in Table 1 below.

The test method of the welding rate is: use the aluminum products with multi-layer structure produced in Examples 1 to 3 and Comparative Examples 1 to 2 to prepare metallographic samples of welded joints, and observe the microscopic samples under a metallographic microscope. organize. Use the matching metallographic analysis software to measure the total length of the weld and the length of the unwelded part, and calculate the welding rate according to the following formula:

w=(L ₀ -L ₁ )/L0×100%

Where w is the welding rate, L ₀ is the total length of the weld, and L ₁ is the length of the unwelded part.

The test method of deformation rate is: the size of the weldment will change after welding, and the deformation in the thickness direction is generally used as one of the indicators to measure the welding quality. The measuring tool adopted is a vernier caliper. Before welding, the metal base metal to be welded is made into a sample, and its thickness is measured at multiple different positions, and the average value is taken as the initial thickness; similarly, examples 1 to 1 will be used. 3 and comparative examples 1 to 2, the aluminum products with multi-layer structure obtained after welding are made into welded joint samples, and the thicknesses of multiple positions of the post-welded samples are measured with a vernier caliper as the post-weld thickness. The difference in thickness after welding is the deformation of the welded joint. Calculate the deformation rate of the welded joint according to the following formula:

δ=(δ ₀ -δ ₁ )/δ ₀ ×100%

Among them, δ is the deformation rate in the thickness direction, δ ₀ is the average thickness before welding, and δ ₁ is the average thickness after welding.

The test method for tensile strength (welding strength) is: use a universal testing machine for testing.

Table 1. Performance test results of aluminum products with multilayer structure

Weld rate (%) Deformation rate (%) Tensile strength (MPa) Example 1 92 0.2% 112.4 Example 2 94 0.5% 137.3 Example 3 91 0.1% 107.6 Comparative example 1 75 5.3% 92.1 Comparative example 2 80 3.7% 87.5

It can be seen from Table 1 above that the aluminum products with multi-layer structure produced in Examples 1 to 3 have a higher welding rate and lower deformation rate than Comparative Examples 1 to 2, and the tensile strength is the welding strength. Higher, higher yield rate of finished products.

The technical features of the above embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be It is considered to be within the range described in this specification.

The above examples only express several implementation modes of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the scope of the invention patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the inventive concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims (10)

1. A manufacturing method of an aluminum product with a multilayer structure is characterized by comprising the following steps:

providing a plurality of metal base metals made of aluminum or aluminum alloy;

stacking a plurality of metal base materials according to a preset sequence, wherein the surfaces to be welded of the adjacent metal base materials are relatively attached, and at least one surface of each of the two opposite surfaces to be welded is covered with a silicon single layer in advance;

and performing vacuum brazing on the plurality of metal base materials which are stacked.

2. The method for manufacturing an aluminum product with a multilayer structure as recited in claim 1, wherein the silicon single layer is coated on the surface to be welded by evaporation or sputtering.

3. The method of manufacturing an aluminum product having a multilayer structure according to claim 1, wherein the thickness of the silicon single layer between two surfaces to be welded opposed in adjacent metal base materials satisfies at least one of the following conditions:

(1) The total thickness is 5-1000 μm;

(2) The thickness of each silicon single layer is 1-1.5 times of the flatness of the surface to be welded covered with the silicon single layer.

4. The method for manufacturing an aluminum product having a multilayer structure according to any one of claims 1 to 3, further comprising the steps of:

and directly processing a functional structure on the surface of the metal base material which is not covered with the silicon single layer and/or processing a functional structure penetrating through the silicon single layer to the metal base material on the surface covered with the silicon single layer.

5. The method according to claim 4, wherein the functional structures on the two opposite surfaces to be welded of the adjacent metal base materials are symmetrical structures;

optionally, one of the two opposite surfaces to be welded is coated with a silicon single layer, and the other surface is not coated with the silicon single layer.

6. The method according to claim 4, wherein the functional structures on the two opposite surfaces to be welded of the adjacent metal base materials are mutually asymmetric structures;

optionally, the two opposite surfaces to be welded are covered with silicon single substance layers, and the thickness of each silicon single substance layer is reduced relative to the thickness of only one silicon single substance layer in the adjacent metal base materials.

7. The method of claim 4, wherein the functional structure comprises at least one of a channel, a groove, and a hole site.

8. The method for producing an aluminum product having a multilayer structure according to any one of claims 1 to 3 and 5 to 7, wherein the condition of vacuum brazing satisfies at least one of the following conditions:

(1) The temperature of vacuum brazing is 500-700 ℃;

(2) Vacuum degree of vacuum brazing is less than 10 ^﹣3 Pa。

9. The aluminum product with the multilayer structure is characterized by comprising a metal mother material layer and a welding layer, wherein the metal mother material layer comprises aluminum or aluminum alloy, and the welding layer comprises a silicon simple substance;

the number of layers of the metal parent material layers is multiple, and the adjacent metal parent material layers are connected through the welding layer.

10. The aluminum product having a multilayer structure according to claim 9, which is produced by the method for producing an aluminum product having a multilayer structure according to any one of claims 1 to 8.

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