CN115500002A - Flexible stretchable circuit, preparation method thereof and electronic equipment - Google Patents
Flexible stretchable circuit, preparation method thereof and electronic equipment Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
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- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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Abstract
Description
技术领域technical field
本申请涉及柔性电子技术领域,尤其是涉及一种柔性可拉伸电路及其制备方法、电子设备。The present application relates to the technical field of flexible electronics, in particular to a flexible and stretchable circuit, its preparation method, and electronic equipment.
背景技术Background technique
随着科技的不断进步,人们对健康越来越重视,除了在医院内治疗等传统医疗模式,家庭理疗等新兴的健康理疗模式逐渐发展起来,对家庭可穿戴类理疗产品的要求也越来越高,越来越多样化。LED光疗产品是家庭可穿戴理疗产品中重要的一类,随着光疗的医学原理及适用症不断被发现,产品也逐步向智能化、小型化、柔性化等方向发展。With the continuous advancement of science and technology, people pay more and more attention to health. In addition to traditional medical models such as treatment in hospitals, emerging health physiotherapy models such as family physiotherapy have gradually developed, and the requirements for home wearable physiotherapy products are also increasing. High and increasingly diverse. LED phototherapy products are an important category of home wearable physiotherapy products. As the medical principles and applicable diseases of phototherapy are continuously discovered, the products are gradually developing in the direction of intelligence, miniaturization, and flexibility.
在LED可穿戴光疗产品的制造过程中,柔性可拉伸电路是最重要的技术组成部分,也是实现产品小型化、柔性化急需解决的技术问题。目前,柔性可穿戴电路主要使用的是FPC电路板,其能在较大尺寸范围内实现柔性弯曲,但是难以实现可拉伸功能,且当产品尺寸较小时,其弯曲回复能力较差。新型的柔性电路制备方法,如3D打印、喷墨打印等,利用导电银浆、液态金属等作为导电材料,能够实现电路弯曲可拉伸,但是其电导率较差,受限于材料等因素难以实现良好的导电性,且在拉伸时电阻明显增大,对元器件的正常工作造成影响。In the manufacturing process of LED wearable phototherapy products, the flexible and stretchable circuit is the most important technical component, and it is also a technical problem that needs to be solved urgently to realize the miniaturization and flexibility of the product. At present, flexible wearable circuits mainly use FPC circuit boards, which can achieve flexible bending in a large size range, but it is difficult to achieve stretchable functions, and when the product size is small, its bending recovery ability is poor. The new flexible circuit preparation methods, such as 3D printing, inkjet printing, etc., use conductive silver paste, liquid metal, etc. Good electrical conductivity is achieved, and the resistance increases significantly when stretched, which affects the normal operation of components.
发明内容Contents of the invention
为了实现小尺寸电路在弯曲拉伸时电阻保持稳定,本申请提供一种柔性可拉伸电路及其制备方法、电子设备。In order to keep the resistance of the small-sized circuit stable when it is bent and stretched, the present application provides a flexible and stretchable circuit, a preparation method thereof, and an electronic device.
本申请提供的一种柔性可拉伸电路及其制备方法、电子设备采用如下的技术方案:A flexible and stretchable circuit provided by the application, its preparation method, and electronic equipment adopt the following technical solutions:
第一方面,一种柔性可拉伸电路,包括:In the first aspect, a flexible and stretchable circuit includes:
柔性可拉伸衬底;Flexible stretchable substrate;
导线单元,所述导线单元包括中间导线、均与所述中间导线连接的正极导线和负极导线,所述中间导线包括多个均呈蛇形设置的第一导线和多个均呈蛇形设置的第二导线,多个所述第一导线均沿第一方向延伸且在第二方向上间隔设置,多个所述第二导线均沿第二方向延伸且在第一方向上间隔设置,所述第一导线和所述第二导线交叉且连接围合成多个阵列分布的空白区域,多个所述第一导线间断形成第一连接点和第二连接点,所述第一连接点和第二连接点之间为连接区域;A wire unit, the wire unit includes an intermediate wire, a positive electrode wire and a negative electrode wire connected to the intermediate wire, and the intermediate wire includes a plurality of first wires all arranged in a serpentine shape and a plurality of first wires all arranged in a serpentine shape A plurality of the first conducting wires extend along the first direction and are arranged at intervals in the second direction, and a plurality of the second conducting wires extend along the second direction and are arranged at intervals in the first direction, the The first wire and the second wire intersect and are connected to form a plurality of blank areas distributed in arrays, and a plurality of the first wires are interrupted to form a first connection point and a second connection point, and the first connection point and the second Between the connection points is the connection area;
多个元器件,所述元器件与所述连接区域一一对应,所述元器件的正负极与所述第一连接点、第二连接点一一对应且连接;以及,a plurality of components, the components are in one-to-one correspondence with the connection area, and the positive and negative poles of the components are in one-to-one correspondence with the first connection point and the second connection point and are connected; and,
封装体,设置于所述柔性可拉伸衬底上,所述导线单元和各所述元器件包覆于所述封装体内,所述封装体的材质为柔性可拉伸材质。The package is arranged on the flexible and stretchable substrate, the wire unit and each of the components are covered in the package, and the material of the package is a flexible and stretchable material.
通过采用上述技术方案,将第一导线和第二导线设置为蛇形,通过第一导线和第二导线的局部微小变形可获得较大的累计变形量,能够实现电路在小尺寸范围内的柔性弯曲可拉伸,且在拉伸时,第一导线和/或第二导线拉伸变形以具备较长的走线长度,但横截面积不发生变化,使得电路电阻阻值可保持稳定,能够实现小尺寸电路在弯曲拉伸时的稳定发光。By adopting the above technical solution, the first wire and the second wire are arranged in a serpentine shape, and a large cumulative deformation can be obtained through the local small deformation of the first wire and the second wire, which can realize the flexibility of the circuit in a small size range Bending can be stretched, and when stretched, the first wire and/or the second wire is stretched and deformed to have a longer trace length, but the cross-sectional area does not change, so that the resistance value of the circuit can remain stable, which can Realize the stable light emission of small-sized circuits when they are bent and stretched.
其中,第一导线间断形成与元器件连接的连接区域,第二导线保持连续不间断,使得电路在第二方向拉伸变形时,拉伸变形可快速传递至第二导线的各个部位,且在第二方向拉伸变形时,可减小对第一导线与元器件的连接点的拉扯,从而降低电路损坏的几率。Wherein, the first wire is discontinuous to form a connection area connected with components, and the second wire remains continuous and uninterrupted, so that when the circuit is stretched and deformed in the second direction, the stretching deformation can be quickly transmitted to various parts of the second wire, and in When stretching and deforming in the second direction, the pull on the connection point between the first wire and the component can be reduced, thereby reducing the probability of circuit damage.
优选的,各所述第一导线间断的端部朝背离所述柔性可拉伸衬底的方向弯折形成弯折部,再朝与所述柔性拉伸衬底平行的方向弯折形成支撑部,所述元器件与所述支撑部连接。Preferably, the discontinuous ends of each of the first wires are bent in a direction away from the flexible stretchable substrate to form a bent portion, and then bent in a direction parallel to the flexible stretchable substrate to form a support portion , the component is connected to the support part.
通过采用上述技术方案,弯折部被封装层包裹,可提高支撑部对元器件的支撑能力,便于元器件与支撑部的焊接。元器件与支撑部连接,粘附在柔性可拉伸衬底上的第一导线部分的宽度或横截面积可根据电路所需阻值设置,不需要考虑是否便于与元器件焊接。通过设置弯折部,在第一方向对电路拉伸变形时,可减小对支撑部与元器件的连接点的拉扯,从而降低电路损坏的几率。By adopting the above technical solution, the bent portion is wrapped by the encapsulation layer, which can improve the supporting ability of the supporting portion to the components, and facilitate the welding of the components and the supporting portion. The components are connected to the supporting part, and the width or cross-sectional area of the first wire part adhered to the flexible and stretchable substrate can be set according to the resistance value required by the circuit, regardless of whether it is convenient to weld with the components. By arranging the bending part, when the circuit is stretched and deformed in the first direction, the pull on the connection point between the supporting part and the component can be reduced, thereby reducing the probability of circuit damage.
优选的,每相邻两个所述第二导线之间的所述第一导线均间断形成有一所述连接区域。Preferably, the first wires between every two adjacent second wires are intermittently formed with a connection area.
通过采用上述技术方案,可增加元器件安装的数量。By adopting the above technical solution, the number of installed components can be increased.
优选的,所述元器件为LED芯片。Preferably, the components are LED chips.
通过采用上述技术方案,LED芯片可发出一定波长的可见光,起到治疗作用;每相邻两个第二导线之间的第一导线均间断形成有一连接区域。可增加LED安装的数量,增大出光功率,提高治疗效果。By adopting the above technical scheme, the LED chip can emit visible light of a certain wavelength to play a therapeutic effect; the first wires between every two adjacent second wires are intermittently formed with a connection area. The number of LED installations can be increased, the light output power can be increased, and the therapeutic effect can be improved.
优选的,所述第一导线和所述第二导线的横截面积自中部向两端呈渐大设置。Preferably, the cross-sectional area of the first wire and the second wire is gradually increased from the middle to both ends.
通过采用上述技术方案,第一导线和所述第二导线的横截面积越小,越容易变形,从而使得第一导线和第二导线中部较端部容易变形,尽量平衡第一导线和第二导线各个部位的拉伸变形量,使元器件均匀分布;元器件为LED芯片,实现均匀的出光量,避免电路拉伸后局部出光强度过强或过弱。By adopting the above technical solution, the smaller the cross-sectional area of the first wire and the second wire is, the easier it is to deform, so that the middle part of the first wire and the second wire is easier to deform than the end, and try to balance the first wire and the second wire. The tensile deformation of each part of the wire makes the components evenly distributed; the components are LED chips to achieve uniform light output and avoid local light output intensity being too strong or too weak after the circuit is stretched.
优选的,所述正极导线和所述负极导线均呈蛇形且沿所述第一方向延伸,所述正极导线、所述中间导线和所述负极导线在所述第二方向依次间隔,多个所述第二导线交替地与所述正极导线、所述负极导线连接。Preferably, both the positive lead wire and the negative lead lead are serpentine and extend along the first direction, the positive lead wire, the intermediate lead wire and the negative lead lead are sequentially spaced apart in the second direction, a plurality of The second lead is alternately connected to the positive lead and the negative lead.
通过采用上述技术方案,各个元器件位于相邻两个第二导线之间,使得各个元器件的正负极均与第二导线连通,每相邻两个第二导线中,其中一第二导线与正极导线连接,另一第二导线与负极导线连接,使得各个元器件直接与正极导线、负极导线连接,从而各个元器件之间并联而互不影响,避免某一元器件损坏影响其他元器件的工作。元器件为LED芯片时,根据各LED芯片是否正常出光,便于对电路中的故障进行快速检修。By adopting the above-mentioned technical scheme, each component is located between two adjacent second wires, so that the positive and negative poles of each component are connected to the second wire, and in every two adjacent second wires, one of the second wires It is connected to the positive wire, and the other second wire is connected to the negative wire, so that each component is directly connected to the positive wire and the negative wire, so that the components are connected in parallel without affecting each other, and avoid damage to one component affecting other components. Work. When the components are LED chips, according to whether each LED chip emits light normally, it is convenient to quickly check and repair the faults in the circuit.
优选的,所述正极导线和所述负极导线的横截面积自中部向两端呈渐大设置。Preferably, the cross-sectional area of the positive electrode wire and the negative electrode wire increases gradually from the middle to both ends.
通过采用上述技术方案,正极导线和负极导线的横截面积越小,越容易变形,从而使得正极导线和负极导线中部较端部容易变形,可尽量平衡柔性可拉伸衬底各个部位的拉伸变形量,使各元器件与导线单元的连接点受到的拉扯较均匀,避免某一元器件发生的变形过大而容易损坏。同时使元器件均匀分布,元器件为LED芯片,实现均匀的出光量,避免电路拉伸后局部出光强度过强或过弱。By adopting the above technical solution, the smaller the cross-sectional area of the positive and negative leads, the easier it is to deform, so that the middle part of the positive and negative leads is easier to deform than the end, and the stretching of each part of the flexible and stretchable substrate can be balanced as much as possible. The amount of deformation, so that the connection points of each component and the wire unit are pulled more evenly, so as to avoid excessive deformation of a certain component and easy damage. At the same time, the components are evenly distributed, and the components are LED chips to achieve uniform light output and avoid local light output intensity being too strong or too weak after the circuit is stretched.
优选的,所述导线单元呈一体成型设置。Preferably, the wire unit is integrally formed.
通过采用上述技术方案,将导电板进行切割,便于对导线单元进行加工生产,保证整个导线单元的完整性,从而保证导线单元各个位置的导电性,可以生产各个部分的宽度或横截面积相同的导线单元,也可以根据实际需求对导线单元各个部分的宽度或横截面积进行控制。By adopting the above technical scheme, the conductive plate is cut to facilitate the processing and production of the wire unit, to ensure the integrity of the entire wire unit, thereby ensuring the conductivity of each position of the wire unit, and to produce the same width or cross-sectional area of each part. The wire unit can also control the width or cross-sectional area of each part of the wire unit according to actual needs.
第二方面,本申请还提供一种柔性可拉伸电路的制备方法,包括以下步骤:In the second aspect, the present application also provides a method for preparing a flexible and stretchable circuit, comprising the following steps:
S1:制备导线单元,所述导线单元包括中间导线、均与所述中间导线连接的正极导线和负极导线,所述中间导线包括多个均呈蛇形设置的第一导线和多个均呈蛇形设置的第二导线,多个所述第一导线均沿第一方向延伸且在第二方向上间隔设置,多个所述第二导线均沿第二方向延伸且在第一方向上间隔设置,所述第一导线和所述第二导线交叉且连接围合成多个阵列分布的空白区域,多个所述第一导线间断形成第一连接点和第二连接点,所述第一连接点和第二连接点之间为连接区域;以及,S1: Prepare a wire unit, the wire unit includes an intermediate wire, a positive electrode wire and a negative electrode wire connected to the intermediate wire, and the intermediate wire includes a plurality of first wires all arranged in a serpentine shape and a plurality of serpentine wires. A plurality of second conducting wires arranged in a shape, a plurality of the first conducting wires all extend along the first direction and are arranged at intervals in the second direction, and a plurality of the second conducting wires all extend along the second direction and are arranged at intervals in the first direction , the first wires and the second wires intersect and are connected to form a plurality of blank areas distributed in arrays, a plurality of the first wires are interrupted to form a first connection point and a second connection point, and the first connection point and the second connection point is a connection region; and,
S2:提供柔性可拉伸衬底,将所述导线单元粘附于所述柔性可拉伸衬底上;将各元器件贴装于各所述连接区域,将所述元器件的正负极与所述第一连接点、第二连接点一一对应且进行焊接;采用柔性可拉伸材料对所述导线单元和所述元器件进行封装,形成位于所述柔性可拉伸衬底上、且包覆所述导线单元和所述元器件的封装体。S2: Provide a flexible and stretchable substrate, adhere the wire unit to the flexible and stretchable substrate; attach each component to each of the connection areas, connect the positive and negative electrodes of the component to One-to-one correspondence with the first connection point and the second connection point and welding; use a flexible stretchable material to package the wire unit and the components to form a flexible stretchable substrate on the flexible stretchable substrate, And wrapping the package body of the wire unit and the components.
通过采用上述技术方案,将第一导线和第二导线设置为蛇形,通过第一导线和第二导线的局部微小变形可获得较大的累计变形量,能够实现电路在小尺寸范围内的柔性弯曲可拉伸,且在拉伸时,第一导线和/或第二导线拉伸变形以具备较长的走线长度,但横截面积不发生变化,使得电路电阻阻值可保持稳定,能够实现小尺寸电路在弯曲拉伸时的稳定发光。By adopting the above technical solution, the first wire and the second wire are arranged in a serpentine shape, and a large cumulative deformation can be obtained through the local small deformation of the first wire and the second wire, which can realize the flexibility of the circuit in a small size range Bending can be stretched, and when stretched, the first wire and/or the second wire is stretched and deformed to have a longer trace length, but the cross-sectional area does not change, so that the resistance value of the circuit can remain stable, which can Realize the stable light emission of small-sized circuits when they are bent and stretched.
其中,第一导线间断形成与元器件连接的连接区域,第二导线保持连续不间断,使得电路在第二方向拉伸变形时,拉伸变形可快速传递至第二导线的各个部位,且在第二方向拉伸变形时,可减小对第一导线与元器件的连接点的拉扯,从而降低电路损坏的几率。Wherein, the first wire is discontinuous to form a connection area connected with components, and the second wire remains continuous and uninterrupted, so that when the circuit is stretched and deformed in the second direction, the stretching deformation can be quickly transmitted to various parts of the second wire, and in When stretching and deforming in the second direction, the pull on the connection point between the first wire and the component can be reduced, thereby reducing the probability of circuit damage.
优选的,步骤S1中,制备导线单元的步骤为:提供导电板,对所述导电板按照预设图形进行切割形成导线单元。Preferably, in step S1, the step of preparing the wire unit is: providing a conductive plate, and cutting the conductive plate according to a preset pattern to form the wire unit.
通过采用上述技术方案,将导电板进行切割,便于对导线单元进行加工生产,保证整个导线单元的完整性,从而保证导线单元各个位置的导电性,可以生产各个部分的宽度或横截面积相同的导线单元,也可以根据实际需求对导线单元各个部分的宽度或横截面积进行控制。By adopting the above technical scheme, the conductive plate is cut to facilitate the processing and production of the wire unit, to ensure the integrity of the entire wire unit, thereby ensuring the conductivity of each position of the wire unit, and to produce the same width or cross-sectional area of each part. The wire unit can also control the width or cross-sectional area of each part of the wire unit according to actual needs.
优选的,步骤S1中,对所述导电板进行切割,使所述第一连接点和所述第二连接点朝相背的方向分别延伸形成延伸片,将所述延伸片朝背离所述柔性可拉伸衬底的方向弯折形成弯折部,再朝与所述柔性拉伸衬底平行的方向弯折形成支撑部;Preferably, in step S1, the conductive plate is cut so that the first connection point and the second connection point respectively extend in opposite directions to form an extension piece, and the extension piece faces away from the flexible The stretchable substrate is bent in a direction to form a bent portion, and then bent in a direction parallel to the flexible stretched substrate to form a support portion;
步骤S2中,将所述导线单元粘附于所述柔性可拉伸衬底上之后,对所述弯折部进行封装,形成位于所述柔性可拉伸衬底上、包覆所述弯折部且露出所述支撑部的第一封装层;将所述元器件贴装于所述支撑部,对所述元器件和所述支撑部进行焊接;对所述支撑部和所述元器件进行封装,形成位于所述第一封装层上的第二封装层。In step S2, after the wire unit is adhered to the flexible and stretchable substrate, the bent portion is packaged to form a flexible stretchable substrate that covers the bent portion. part and expose the first packaging layer of the support part; attach the component to the support part, weld the component and the support part; perform welding on the support part and the component encapsulating to form a second encapsulation layer on the first encapsulation layer.
通过采用上述技术方案,弯折部被第一封装层包裹,可提高支撑部对元器件的支撑能力,便于元器件与支撑部的焊接。元器件与支撑部连接,粘附在柔性可拉伸衬底上的第一导线部分的宽度或横截面积可根据电路所需阻值设置,不需要考虑是否便于与元器件焊接。通过设置弯折部,在第一方向对电路拉伸变形时,可减小对支撑部与元器件的连接点的拉扯,从而降低电路损坏的几率。By adopting the above technical solution, the bent part is wrapped by the first encapsulation layer, which can improve the supporting ability of the supporting part to the component, and facilitate the welding of the component and the supporting part. The components are connected to the supporting part, and the width or cross-sectional area of the first wire part adhered to the flexible and stretchable substrate can be set according to the resistance value required by the circuit, regardless of whether it is convenient to weld with the components. By arranging the bending part, when the circuit is stretched and deformed in the first direction, the pull on the connection point between the supporting part and the component can be reduced, thereby reducing the probability of circuit damage.
优选的,步骤S1中,对所述导电板进行切割,使所述正极导线和所述负极导线均呈蛇形且沿所述第一方向延伸,所述正极导线、所述中间导线和所述负极导线在所述第二方向依次间隔,多个所述第二导线交替地与所述正极导线、所述负极导线连接。Preferably, in step S1, the conductive plate is cut so that the positive wire and the negative wire are serpentine and extend along the first direction, and the positive wire, the intermediate wire and the The negative lead wires are spaced sequentially in the second direction, and a plurality of the second lead wires are alternately connected to the positive lead wires and the negative lead wires.
通过采用上述技术方案,各个元器件位于相邻两个第二导线之间,使得各个元器件的正负极均与第二导线连通,每相邻两个第二导线中,其中一第二导线与正极导线连接,另一第二导线与负极导线连接,使得各个元器件直接与正极导线、负极导线连接,从而各个元器件之间并联而互不影响,避免某一元器件损坏影响其他元器件的工作。元器件为LED芯片时,根据各元器件是否正常出光,便于对电路中的故障进行快速检修。By adopting the above-mentioned technical scheme, each component is located between two adjacent second wires, so that the positive and negative poles of each component are connected to the second wire, and in every two adjacent second wires, one of the second wires It is connected to the positive wire, and the other second wire is connected to the negative wire, so that each component is directly connected to the positive wire and the negative wire, so that the components are connected in parallel without affecting each other, and avoid damage to one component affecting other components. Work. When the components are LED chips, it is convenient to quickly check and repair the faults in the circuit according to whether each component emits light normally.
第三方面,本申请还提供一种电子设备,包括如上任一项所述的柔性可拉伸电路。In a third aspect, the present application also provides an electronic device, including the flexible and stretchable circuit described in any one of the above items.
通过采用上述技术方案,将第一导线和第二导线设置为蛇形,通过第一导线和第二导线的局部微小变形可获得较大的累计变形量,能够实现电路在小尺寸范围内的柔性弯曲可拉伸,且在拉伸时,第一导线和/或第二导线拉伸变形以具备较长的走线长度,但横截面积不发生变化,使得电路电阻阻值可保持稳定,能够实现小尺寸电路在弯曲拉伸时的稳定发光。By adopting the above technical solution, the first wire and the second wire are arranged in a serpentine shape, and a large cumulative deformation can be obtained through the local small deformation of the first wire and the second wire, which can realize the flexibility of the circuit in a small size range Bending can be stretched, and when stretched, the first wire and/or the second wire is stretched and deformed to have a longer trace length, but the cross-sectional area does not change, so that the resistance value of the circuit can remain stable, which can Realize the stable light emission of small-sized circuits when they are bent and stretched.
综上所述,本申请包括以下至少一种有益技术效果:In summary, the present application includes at least one of the following beneficial technical effects:
1、将第一导线和第二导线设置为蛇形,通过第一导线和第二导线的局部微小变形可获得较大的累计变形量,能够实现电路在小尺寸范围内的柔性弯曲可拉伸,且在拉伸时,第一导线和/或第二导线拉伸变形以具备较长的走线长度,但横截面积不发生变化,使得电路电阻阻值可保持稳定,能够实现小尺寸电路在弯曲拉伸时的稳定发光。1. The first wire and the second wire are set in a serpentine shape, and a large cumulative deformation can be obtained through the local slight deformation of the first wire and the second wire, which can realize the flexible bending and stretching of the circuit in a small size range , and when stretched, the first wire and/or the second wire is stretched and deformed to have a longer trace length, but the cross-sectional area does not change, so that the resistance value of the circuit can be kept stable, and a small-sized circuit can be realized Steady glow when bent and stretched.
2、第一导线间断形成与元器件连接的连接区域,第二导线保持连续不间断,使得电路在第二方向拉伸变形时,拉伸变形可快速传递至第二导线的各个部位,且在第二方向拉伸变形时,可减小对第一导线与元器件的连接点的拉扯,从而降低电路损坏的几率。2. The first wire is interrupted to form a connection area connected to the component, and the second wire remains continuous and uninterrupted, so that when the circuit is stretched and deformed in the second direction, the stretching deformation can be quickly transmitted to various parts of the second wire, and in When stretching and deforming in the second direction, the pull on the connection point between the first wire and the component can be reduced, thereby reducing the probability of circuit damage.
3、元器件为LED芯片,LED芯片可发出一定波长的可见光,起到治疗作用;每相邻两个第二导线之间的第一导线均间断形成有一连接区域。可增加LED安装的数量,增大出光功率,提高治疗效果。3. The components are LED chips, and the LED chips can emit visible light of a certain wavelength to play a therapeutic effect; every first wire between two adjacent second wires is intermittently formed with a connection area. The number of LED installations can be increased, the light output power can be increased, and the therapeutic effect can be improved.
附图说明Description of drawings
图1是本申请实施例1中柔性可拉伸电路(隐去元器件和封装体)的俯视图;Figure 1 is a top view of the flexible and stretchable circuit (components and packages are hidden) in Example 1 of the present application;
图2是本申请实施例1中柔性可拉伸电路(隐去封装体)的俯视图;Figure 2 is a top view of the flexible and stretchable circuit (with the package hidden) in Example 1 of the present application;
图3是本申请实施例1中柔性可拉伸电路的剖面结构示意图;Fig. 3 is a schematic cross-sectional structure diagram of the flexible and stretchable circuit in Example 1 of the present application;
图4是图3中A处的局部放大示意图;Fig. 4 is a partially enlarged schematic diagram of place A in Fig. 3;
图5是本申请实施例2中柔性可拉伸电路的剖面结构示意图;Fig. 5 is a schematic cross-sectional structure diagram of a flexible and stretchable circuit in Example 2 of the present application;
图6是本申请实施例3中柔性可拉伸电路的剖面结构示意图;Fig. 6 is a schematic cross-sectional structure diagram of the flexible and stretchable circuit in Example 3 of the present application;
图7是本申请实施例5中柔性可拉伸电路的剖面结构示意图;Fig. 7 is a schematic cross-sectional structure diagram of the flexible and stretchable circuit in Example 5 of the present application;
图8是图7中B处的局部放大示意图;Fig. 8 is a partially enlarged schematic diagram of place B in Fig. 7;
图9是本申请实施例6中导线单元的结构示意图;Fig. 9 is a schematic structural view of the wire unit in Embodiment 6 of the present application;
图10是图9中C处的局部放大示意图;Fig. 10 is a partially enlarged schematic diagram of place C in Fig. 9;
图11是本申请实施例8中柔性可拉伸电路的剖面结构示意图。FIG. 11 is a schematic cross-sectional structure diagram of the flexible and stretchable circuit in Embodiment 8 of the present application.
附图标记说明:1、柔性可拉伸衬底;2、导线单元;21、中间导线;211、第一导线;211a、第一连接点;211b、第二连接点;212、第二导线;213、空白区域;214、连接区域;215、弯折部;216、支撑部;217、延伸片;22、正极导线;23、负极导线;3、元器件;4、封装体;41、第一封装层;42、第二封装层;5、织布;51、硬化区域。Explanation of reference numerals: 1. flexible and stretchable substrate; 2. wire unit; 21. middle wire; 211. first wire; 211a. first connection point; 211b. second connection point; 212. second wire; 213. Blank area; 214. Connection area; 215. Bending part; 216. Supporting part; 217. Extension sheet; 22. Positive lead; 23. Negative lead; 3. Components; 4. Package; 41. First encapsulation layer; 42, second encapsulation layer; 5, fabric; 51, hardened area.
具体实施方式detailed description
以下结合附图1-10对本申请作进一步详细说明。The present application will be described in further detail below in conjunction with accompanying drawings 1-10.
本申请实施例提供一种柔性可拉伸电路和电子设备,电子设备包括柔性可拉伸电路,电子设备可以穿戴在手指手腕上,用于治疗关节炎等;可以穿戴在肚子上,用于治疗妊娠纹等;可以穿戴在脖子上,用于治疗颈纹等,电子设备也可以是其他需要弯曲拉伸的设备,在此不做限制。本申请的创新点在于柔性可拉伸电路,以下对柔性可拉伸电路进行具体描述。Embodiments of the present application provide a flexible and stretchable circuit and an electronic device. The electronic device includes a flexible and stretchable circuit. The electronic device can be worn on the fingers and wrists for treating arthritis, etc.; it can be worn on the stomach for treating Stretch marks, etc.; it can be worn on the neck to treat neck lines, etc. Electronic devices can also be other devices that need to be bent and stretched, and there is no limitation here. The innovation of the present application lies in the flexible and stretchable circuit, and the flexible and stretchable circuit will be described in detail below.
实施例1Example 1
本实施例公开一种柔性可拉伸电路,柔性可拉伸电路包括柔性可拉伸衬底1、导线单元2、多个元器件3和封装体4。This embodiment discloses a flexible and stretchable circuit. The flexible and stretchable circuit includes a flexible and
参照图1,柔性可拉伸衬底1为片状结构,可以为长方形、正方形或其他形状,材质为弹性聚合物材料,具有柔性可拉伸且不导电的性能,聚合物材料可以为但不限于聚二甲基硅氧烷PDMS、聚氨酯PU、热塑性聚氨酯TPU、热塑性硫化橡胶TPV、硅胶等。Referring to Fig. 1, the flexible and
导线单元2包括中间导线21、均与中间导线21连接的正极导线22和负极导线23。正极导线22和中间导线21的连接点可以为一个或多个,正极导线22用于与其他电路的正极连接;负极导线23和中间导线21的连接点可以为一个或多个,负极导线23用于与其他电路的负极连接,从而实现电路导通。The
由于电子设备一般是在常温下使用,导线单元2的材质可以为常温下具有导电性的固态材料,可以为金属、柔性石墨等,金属可以为但不限于金、银、铝、铜等。本实施例中,导线单元2为一体成型设置,对一个整块的导电板按照导线单元2所需的形状进行切割,可得到一体成型的导线单元2,便于对导线单元2进行加工生产,保证整个导线单元2的完整性,从而保证导线单元2各个位置的导电性;同时可以生产各个部分的宽度或横截面积相同的导线单元2,也可以根据实际需求对导线单元2各个部分的宽度或横截面积进行控制。Since electronic equipment is generally used at room temperature, the material of the
本实施例中,导线单元2的材质为铜片,铜片的导电性较好且价格较低,可降低生产成本,铜片的硬度较差,便于切割。In this embodiment, the
中间导线21包括多个均呈蛇形设置的第一导线211和多个均呈蛇形设置的第二导线212,多个第一导线211均沿第一方向延伸且在第二方向上间隔设置,多个第二导线212均沿第二方向延伸且在第一方向上间隔设置,第一导线211和第二导线212交叉且连接围合成多个阵列分布的空白区域213。The
参照图1,多个第一导线211间断形成第一连接点211a和第二连接点211b,第一连接点211a和第二连接点211b之间为连接区域214。参照图2,元器件3与连接区域214一一对应,元器件3的正负极与第一连接点211a、第二连接点211b一一对应且连接,在一可选实施例中,第一连接点211a和第二连接点211b可以呈方形设置,便于与元器件3的连接。Referring to FIG. 1 , a plurality of
参照图3和图4,封装体4设置于柔性可拉伸衬底1上,导线单元2和各元器件3包覆于封装体4内,导线单元2可与其他电路连通后封装于封装体4内。封装体4的材质为柔性可拉伸材质,材质为弹性聚合物材料,自身具有柔性可拉伸且不导电的性能,聚合物材料可以为但不限于聚二甲基硅氧烷PDMS、聚氨酯PU、热塑性聚氨酯TPU、热塑性硫化橡胶TPV、硅胶等。本实施例中,柔性可拉伸衬底1和封装体4的材质均为聚二甲基硅氧烷PDMS。Referring to Fig. 3 and Fig. 4, the
将第一导线211和第二导线212设置为蛇形,在第一方向或第二方向上拉伸柔性可拉伸衬底1,通过第一导线211或第二导线212的局部微小变形可获得较大的累计变形量,能够实现电路在小尺寸范围内的柔性弯曲可拉伸。在拉伸时,第一导线211和/或第二导线212拉伸变形以具备较长的走线长度,但横截面积不发生变化,使得电路电阻阻值可保持稳定,能够实现小尺寸电路在弯曲拉伸时元器件的正常工作。The
其中,第一导线211间断形成与元器件3连接的连接区域214,第二导线212保持连续不间断,使得电路在第二方向拉伸变形时,拉伸变形可快速传递至第二导线212的各个部位,且在第二方向拉伸变形时,可减小对第一导线211与元器件3的连接点的拉扯,从而降低电路损坏的几率。Wherein, the
第一方向和第二方向之间的夹角可以为锐角或直角。本实施例中,第一方向和第二方向垂直,在第二方向拉伸电路时,可减小第一导线211的拉伸量,减少对元器件3的连接造成的影响。The included angle between the first direction and the second direction may be an acute angle or a right angle. In this embodiment, the first direction is perpendicular to the second direction, and when the circuit is stretched in the second direction, the stretching amount of the
参照图2,每相邻两个第二导线212之间的第一导线211可以在多个点间断,连接有多个元器件3;也可以不间断,不与元器件3连接。本实施例中,每相邻两个第二导线212之间的第一导线211均间断形成有一连接区域214,各连接区域214均连接有一元器件3,可增加元器件3安装的数量。元器件3可以为任意元器件3,本实施例中,元器件3均为LED芯片,LED芯片可发出一定波长的可见光,起到治疗作用,增加LED芯片的数量,可增大出光功率,提高电子设备的治疗效果。Referring to FIG. 2 , the
实施例2Example 2
参照图5,实施例2与实施例1的不同之处在于,正极导线22和负极导线23均呈蛇形且沿第一方向延伸,正极导线22、中间导线21和负极导线23在第二方向依次间隔,多个第二导线212交替地与正极导线22、负极导线23连接。Referring to FIG. 5 , the difference between
各个元器件3位于相邻两个第二导线212之间,使得各个元器件3的正负极均与第二导线212连通,每相邻两个第二导线212中,其中一第二导线212与正极导线22连接,另一第二导线212与负极导线23连接,使得各个元器件3直接与正极导线22、负极导线23连接,从而各个元器件3之间并联而互不影响,避免某一元器件3损坏影响其他元器件3的正常工作。元器件3为LED芯片,根据各LED芯片是否正常出光,便于对电路中的故障进行快速检修。Each
实施例3Example 3
参照图6,实施例3与实施例2的不同之处在于,第一方向和第二方向之间的夹角为锐角,当在第二方向或第一方向对电路进行拉伸时,可使第一导线211和第二导线212同时发生拉伸变形,增大电路的面积,从而增大治疗面积。当对电路进行拉伸,需要电路在第一方向和第二方向的宽度均增大时,将第一方向和第二方向之间的夹角设置为锐角,可以简化对电路的拉伸操作,同时实现电路在两个方向上的拉伸。Referring to Figure 6, the difference between
实施例4Example 4
实施例4与实施例2的不同之处在于,正极导线22、负极导线23、第一导线211和第二导线212的横截面积自中部向两端均呈渐大设置。可以理解的,正极导线22、负极导线23、第一导线211和第二导线212的横截面积越小,越容易变形,从而使得正极导线22、负极导线23、第一导线211和第二导线212中部较端部容易变形,可尽量平衡正极导线22、负极导线23、第一导线211和第二导线212各个部位的拉伸变形量,使各元器件3与导线单元2的连接点受到的拉扯较均匀,避免某一元器件3发生的变形过大而容易损坏。同时使元器件3均匀分布,元器件3为LED芯片,实现均匀的出光量,避免电路拉伸后局部出光强度过强或过弱。The difference between
实施例5Example 5
参照图7和图8,实施例5与实施例2的不同之处在于,各第一导线211间断的端部朝背离柔性可拉伸衬底1的方向弯折形成弯折部215,再朝与柔性拉伸衬底平行的方向弯折形成支撑部216,元器件3与支撑部216连接。弯折部215被封装体4包裹,可提高支撑部216对元器件3的支撑能力,便于元器件3与支撑部216的焊接。元器件3与支撑部216连接,粘附在柔性可拉伸衬底1上的第一导线211部分的宽度或横截面积可根据电路所需阻值设置,不需要考虑是否便于与元器件3焊接。通过设置弯折部215,在第一方向对电路拉伸变形时,可减小对支撑部216与元器件3的连接点的拉扯,从而降低电路损坏的几率。7 and 8, the difference between
实施例6Example 6
参照图9和图10,实施例6与实施例2的不同之处在于,柔性可拉伸衬底1背对导线单元2的一侧固定有织布5,织布5与弯折部215和支撑部216对应的位置为硬化区域51,可以通过滴固化胶等方式对织布5进行硬处理,拉伸电路时,织布5的硬化区域51由于没有弹性,使得与织布5硬化区域51对应的柔性可拉伸衬底1部分不能被拉伸,可减小对弯折部215和支撑部216的拉扯,从而使元器件3与导线单元2的连接处不会受到拉伸的影响,从而降低电路损坏的几率。同时设置有织布5可增强整个电路的结构强度,织布5的弹性有助于整个电路在拉伸后的回弹。Referring to Fig. 9 and Fig. 10, the difference between Embodiment 6 and
实施例7Example 7
本实施例提供一种柔性可拉伸电路的制备方法,包括以下步骤:This embodiment provides a method for preparing a flexible and stretchable circuit, comprising the following steps:
S1:制备导线单元2,导线单元2包括中间导线21、均与中间导线21连接的正极导线22和负极导线23,中间导线21包括多个均呈蛇形设置的第一导线211和多个均呈蛇形设置的第二导线212,多个第一导线211均沿第一方向延伸且在第二方向上间隔设置,多个第二导线212均沿第二方向延伸且在第一方向上间隔设置,第一导线211和第二导线212交叉且连接围合成多个阵列分布的空白区域213,至少一个第一导线211间断形成第一连接点211a和第二连接点211b,第一连接点211a和第二连接点211b之间为连接区域214。S1: prepare the
在一可选实施例中,可通过对多个导电线弯折和焊接的方式制得导线单元2。本实施例中,制备导线单元2的步骤为:提供导电板,对导电板按照预设图形即导线单元2的图形进行切割形成导线单元2。对导电板进行切割形成的导线单元2为一体成型设置。导电板的材质为具有导电性的固态材料,可以为金属、柔性石墨等,金属可以为但不限于金、银、铝、铜等。本实施例中,导电板为铜片,铜片厚度尺寸为70微米,利用激光将铜片切割出设计好的导线单元2图形。In an optional embodiment, the
通过切割可以对导线单元2各个部分的宽度进行控制,也可以对导线单元2各个部分的厚度进行控制。如果导电板的厚度是均匀的,通过控制导线单元2各个部分的宽度,即可控制各个部分的横截面积。The width of each part of the
导线单元2的图形可以为多种,在一可选实施例中,正极导线22和负极导线23均呈蛇形且沿第一方向延伸,正极导线22、中间导线21和负极导线23在第二方向依次间隔,多个第二导线212交替地与正极导线22、负极导线23连接。第一导线211和第二导线212之间的角度可以为锐角或直角。The pattern of the
S2:提供柔性可拉伸衬底1,柔性可拉伸衬底1为片状结构,材质为弹性聚合物材料,具有柔性可拉伸且不导电的性能,聚合物材料可以为但不限于聚二甲基硅氧烷PDMS、聚氨酯PU、热塑性聚氨酯TPU、热塑性硫化橡胶TPV、硅胶等。S2: Provide a flexible and
本实施例中,将体积比例为20:1的PDMS预混液与固化液进行混合,并进行机械搅拌,搅拌速度为800r/min,搅拌时间为10min,搅拌均匀后真空脱气泡;通过流延法对脱泡后的PDMS进行成膜,在基板上制备厚度为2mm的PDMS基底;将制备的PDMS基底放入鼓风干燥箱进行固化,固化温度为95℃,固化时间为180min。In this example, the PDMS premixed solution with a volume ratio of 20:1 is mixed with the solidified solution, and mechanically stirred at a stirring speed of 800r/min, and the stirring time is 10min. After uniform stirring, vacuum degassing; The defoamed PDMS was formed into a film, and a PDMS substrate with a thickness of 2mm was prepared on the substrate; the prepared PDMS substrate was put into a blast drying oven for curing, the curing temperature was 95°C, and the curing time was 180min.
将导线单元2粘附于柔性可拉伸衬底1上,具体的,将制作好的导线单元2在清洁的桌面上摆放好,将PDMS基底倒扣在导线单元2上,PDMS表面的粘性可将整个导线单元2牢固的粘附于其表面。Adhere the
将各元器件3贴装于各连接区域214,将元器件3的正负极与第一连接点211a、第二连接点211b一一对应且进行焊接。具体的,元器件3为LED芯片,将黏附了导线单元2的PDMS基底放好,用贴片机在导线单元2的连接区域214贴上LED芯片,然后回流焊将LED芯片牢固地焊接在导线单元2上。Each
采用柔性可拉伸材料对导线单元2和元器件3进行封装,形成位于柔性可拉伸衬底1上、且包覆导线单元2和元器件3的封装体4。将焊接好的电路转移到真空等离子体清洗机中,对PDMS及电路表面进行清洗处理;将清洗处理后的电路放到模具中,利用硅胶进行封装,封装厚度为5mm。The
本实施例提供的柔性可拉伸电路的制备方法,可用于制作上述实施例1-4提供的柔性可拉伸电路。The preparation method of the flexible and stretchable circuit provided in this embodiment can be used to make the flexible and stretchable circuit provided in the above-mentioned embodiments 1-4.
实施例8Example 8
参照图11,实施例8与实施例7的不同之处在于,步骤S1中,对导电板进行切割,使第一连接点211a和第二连接点211b朝相背的方向分别延伸形成延伸片217,将延伸片217朝背离柔性可拉伸衬底1的方向弯折形成弯折部215,再朝与柔性拉伸衬底平行的方向弯折形成支撑部216。Referring to FIG. 11 , the difference between embodiment 8 and embodiment 7 is that in step S1, the conductive plate is cut so that the
步骤S2中,将导线单元2粘附于柔性可拉伸衬底1上之后,对弯折部215进行封装,形成位于柔性可拉伸衬底1上、包覆弯折部215且露出支撑部216的第一封装层41;将元器件3贴装于支撑部216,对元器件3和支撑部216进行焊接;对支撑部216和元器件3进行封装,形成位于第二封装层42上的第二封装层42(参照图8)。In step S2, after the
弯折部215被第一封装层41包裹,可提高支撑部216对元器件3的支撑能力,便于元器件3与支撑部216的焊接。元器件3与支撑部216连接,粘附在柔性可拉伸衬底1上的第一导线211部分的宽度或横截面积可根据电路所需阻值设置,不需要考虑是否便于与元器件3焊接。通过设置弯折部215,在第一方向对电路拉伸变形时,可减小对支撑部216与元器件3的连接点的拉扯,从而降低电路损坏的几率。The
本实施例提供的柔性可拉伸电路的制备方法,可用于制作上述实施例5提供给的柔性可拉伸电路。The preparation method of the flexible and stretchable circuit provided in this embodiment can be used to make the flexible and stretchable circuit provided in the above-mentioned
实施例9Example 9
实施例9与实施例7的不同之处在于,步骤S2中,将体积比例为10:1的PDMS预混液与固化液进行混合,并进行机械搅拌,搅拌速度为500r/min,搅拌时间为15min,搅拌均匀后真空脱气泡;通过旋涂机对脱泡后的PDMS进行旋涂,在基板上旋涂厚度为0.2mm的PDMS基底;将旋涂后的PDMS包括基底放入鼓风干燥箱进行固化,固化温度为105℃,固化时间为30min;利用PDMS进行封装,封装厚度为3mm。The difference between Example 9 and Example 7 is that in step S2, the PDMS premix solution with a volume ratio of 10:1 is mixed with the solidified solution, and mechanically stirred at a stirring speed of 500 r/min for 15 minutes , after stirring evenly, vacuum defoaming; Spin-coat the degassed PDMS by a spin coater, and spin-coat a PDMS substrate with a thickness of 0.2mm on the substrate; put the spin-coated PDMS including the substrate into a blast drying oven For curing, the curing temperature is 105°C, and the curing time is 30 minutes; PDMS is used for packaging, and the packaging thickness is 3mm.
以上均为本申请的较佳实施例,并非依此限制本申请的保护范围,故:凡依本申请的结构、形状、原理所做的等效变化,均应涵盖于本申请的保护范围之内。All of the above are preferred embodiments of the application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made according to the structure, shape, and principle of the application should be covered by the protection scope of the application. Inside.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116506769A (en) * | 2023-04-23 | 2023-07-28 | 北京梦之墨科技有限公司 | A low-rigidity conductive structure and electronic device |
| CN117184405A (en) * | 2023-10-10 | 2023-12-08 | 中国航空制造技术研究院 | Superelastic flexible structure, assembly tooling and preparation method of superelastic flexible structure |
| WO2024192785A1 (en) * | 2023-03-22 | 2024-09-26 | 大连理工大学 | Flexible led dot matrix screen having no image distortion under large stretching amount |
| CN120702321A (en) * | 2025-08-27 | 2025-09-26 | 浪潮电子信息产业股份有限公司 | Method for determining warpage of circuit board and electronic device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011112931A1 (en) * | 2010-03-12 | 2011-09-15 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| CN105324841A (en) * | 2013-02-06 | 2016-02-10 | 伊利诺伊大学评议会 | Self-similar and fractal design for stretchable electronics |
| CN107126630A (en) * | 2017-04-26 | 2017-09-05 | 中国科学院力学研究所 | A kind of stretchable flexible infrared therapeutic apparatus |
| CN110367977A (en) * | 2019-06-26 | 2019-10-25 | 上海交通大学 | A kind of photoelectricity integrates stretchable flexible nerve electrode and preparation method |
| WO2020133229A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市柔宇科技有限公司 | Flexible module for flexible electronic device |
| CN113697759A (en) * | 2021-07-09 | 2021-11-26 | 中国电子科技集团公司第十三研究所 | MEMS inertial sensor based on flexible substrate and preparation method |
| CN114335941A (en) * | 2021-12-27 | 2022-04-12 | 电子科技大学 | Flexible band-pass filter of stretching |
| CN114384274A (en) * | 2021-12-23 | 2022-04-22 | 北京航空航天大学宁波创新研究院 | Wireless acceleration sensor based on double-layer stretchable flexible circuit and preparation method |
| CN114567966A (en) * | 2022-03-01 | 2022-05-31 | 清华大学 | Flexible stretchable circuit and method of manufacturing the same |
-
2022
- 2022-10-25 CN CN202211313182.9A patent/CN115500002A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011112931A1 (en) * | 2010-03-12 | 2011-09-15 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| CN105324841A (en) * | 2013-02-06 | 2016-02-10 | 伊利诺伊大学评议会 | Self-similar and fractal design for stretchable electronics |
| CN107126630A (en) * | 2017-04-26 | 2017-09-05 | 中国科学院力学研究所 | A kind of stretchable flexible infrared therapeutic apparatus |
| WO2020133229A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市柔宇科技有限公司 | Flexible module for flexible electronic device |
| CN110367977A (en) * | 2019-06-26 | 2019-10-25 | 上海交通大学 | A kind of photoelectricity integrates stretchable flexible nerve electrode and preparation method |
| CN113697759A (en) * | 2021-07-09 | 2021-11-26 | 中国电子科技集团公司第十三研究所 | MEMS inertial sensor based on flexible substrate and preparation method |
| CN114384274A (en) * | 2021-12-23 | 2022-04-22 | 北京航空航天大学宁波创新研究院 | Wireless acceleration sensor based on double-layer stretchable flexible circuit and preparation method |
| CN114335941A (en) * | 2021-12-27 | 2022-04-12 | 电子科技大学 | Flexible band-pass filter of stretching |
| CN114567966A (en) * | 2022-03-01 | 2022-05-31 | 清华大学 | Flexible stretchable circuit and method of manufacturing the same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024192785A1 (en) * | 2023-03-22 | 2024-09-26 | 大连理工大学 | Flexible led dot matrix screen having no image distortion under large stretching amount |
| CN116506769A (en) * | 2023-04-23 | 2023-07-28 | 北京梦之墨科技有限公司 | A low-rigidity conductive structure and electronic device |
| CN117184405A (en) * | 2023-10-10 | 2023-12-08 | 中国航空制造技术研究院 | Superelastic flexible structure, assembly tooling and preparation method of superelastic flexible structure |
| CN120702321A (en) * | 2025-08-27 | 2025-09-26 | 浪潮电子信息产业股份有限公司 | Method for determining warpage of circuit board and electronic device |
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Country or region after: China Address after: 100000 East Side of 1st Floor, Building 1, No. 3 Yuncheng Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Applicant after: Beijing Chuangyingguang Medical Technology Co.,Ltd. Address before: 102600 east side, 1st floor, building 1, No.3 Yuncheng street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Applicant before: BEIJING TRUWIN OPTOELECTRONIC MEDICAL CO.,LTD. Country or region before: China |