CN115480452A - A suction cup assembly, exposure device and photolithography system - Google Patents
A suction cup assembly, exposure device and photolithography system Download PDFInfo
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- CN115480452A CN115480452A CN202110605073.3A CN202110605073A CN115480452A CN 115480452 A CN115480452 A CN 115480452A CN 202110605073 A CN202110605073 A CN 202110605073A CN 115480452 A CN115480452 A CN 115480452A
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- 238000000206 photolithography Methods 0.000 title claims description 8
- 238000001179 sorption measurement Methods 0.000 claims abstract description 319
- 238000007789 sealing Methods 0.000 claims abstract description 171
- 239000000758 substrate Substances 0.000 claims abstract description 160
- 238000007667 floating Methods 0.000 claims description 96
- 238000009434 installation Methods 0.000 claims description 83
- 238000005188 flotation Methods 0.000 claims description 73
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- 239000002184 metal Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 13
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- 238000012545 processing Methods 0.000 description 18
- 238000001459 lithography Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B47/00—Suction cups for attaching purposes; Equivalent means using adhesives
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
技术领域technical field
本发明涉及光刻技术领域,尤其涉及一种吸盘组件、曝光装置及光刻系统The present invention relates to the technical field of lithography, in particular to a chuck assembly, an exposure device and a lithography system
背景技术Background technique
在光刻中,曝光台用于将掩模板上的电路图形经过光学投影系统进行投影曝光,使电路图形以一定放大或缩小的倍率投影于制造集成电路的硅片上。在曝光进行之前,通常采用交接机构对硅片进行吸取并放置在曝光台的吸盘上,使吸盘对硅片进行真空吸附,以使硅片固定在在曝光台上,以防止硅片在曝光过程中产生移动。In lithography, the exposure table is used to project and expose the circuit pattern on the mask plate through an optical projection system, so that the circuit pattern is projected on the silicon wafer for manufacturing integrated circuits at a certain magnification or reduction ratio. Before the exposure, the silicon wafer is usually picked up by a transfer mechanism and placed on the suction cup of the exposure table, so that the suction cup can vacuum absorb the silicon wafer to fix the silicon wafer on the exposure table to prevent the silicon wafer from being exposed during the exposure process. generate movement.
随着集成电路制造行业技术的不断发展,硅片处理工艺多种多样,使得经常会有硅片产生较大的翘曲变形。现有的曝光装置在采用吸盘对翘曲硅片吸附时,存在吸附效率低、吸附效果差且吸附后硅片平整度不高等问题,影响硅片曝光的稳定性和曝光的重量。With the continuous development of technology in the integrated circuit manufacturing industry, there are various silicon wafer processing techniques, which often cause large warping deformation of silicon wafers. When the existing exposure device adopts the suction cup to absorb the warped silicon wafer, there are problems such as low adsorption efficiency, poor adsorption effect and low flatness of the silicon wafer after adsorption, which affects the stability of the exposure of the silicon wafer and the weight of the exposure.
发明内容Contents of the invention
本发明的目的在于提供一种吸附装置,提高吸附装置对翘曲基底的吸附能力,提高基底吸附稳定性和可靠性。The purpose of the present invention is to provide an adsorption device, which can improve the adsorption capacity of the adsorption device for warped substrates, and improve the stability and reliability of substrate adsorption.
本发明的又一目的在于提供一种曝光装置,提高基底曝光稳定性和基底曝光质量。Another object of the present invention is to provide an exposure device that improves the stability and quality of substrate exposure.
本发明的另一目的在于提供一种光刻系统,提高光刻稳定性和光刻质量。Another object of the present invention is to provide a photolithography system to improve photolithography stability and photolithography quality.
为实现上述目的,本发明采用下述技术方案:To achieve the above object, the present invention adopts the following technical solutions:
一种吸盘组件,包括:A suction cup assembly, comprising:
吸盘,所述吸盘的基底吸附面具有若干个与所述吸盘同心设置的基底吸附区,每个所述基底吸附区均包括主吸附区,所述主吸附区的外径小于对应尺寸的基底的外径,至少最外侧的所述基底吸附区包括位于所述主吸附区外侧的边缘吸附区;A suction cup, the substrate adsorption surface of the suction cup has several substrate adsorption regions concentrically arranged with the suction cup, each of the substrate adsorption regions includes a main adsorption region, and the outer diameter of the main adsorption region is smaller than that of the substrate of the corresponding size. Outer diameter, at least the outermost said substrate adsorption zone includes an edge adsorption zone located outside said main adsorption zone;
第一密封件,每个所述主吸附区的边缘均围设有所述第一密封件,所述第一密封件的下端密封嵌设于所述吸盘,所述第一密封件的上端能够弹性凸出所述基底吸附面;The first sealing member, the edge of each of the main adsorption areas is surrounded by the first sealing member, the lower end of the first sealing member is sealingly embedded in the suction cup, and the upper end of the first sealing member can Elastically protruding from the adsorption surface of the substrate;
第二密封件,环绕所述边缘吸附区的外边缘设置,所述第二密封件的下端密封嵌设于所述吸盘内,所述第二密封件的上端能够弹性凸出所述基底吸附面,所述第一密封件能够凸出所述基底吸附面的高度大于所述第二密封件能够凸出所述基底吸附面的高度。The second sealing member is arranged around the outer edge of the edge adsorption area, the lower end of the second sealing member is sealingly embedded in the suction cup, and the upper end of the second sealing member can elastically protrude from the adsorption surface of the base The height at which the first sealing member can protrude from the substrate adsorption surface is greater than the height at which the second sealing member can protrude from the substrate adsorption surface.
作为一种吸盘组件的优选技术方案,所述第一密封件能够凸出所述基底吸附面的最大高度高度为3mm~5mm,所述第二密封件能够凸出所述基底吸附面的最大高度为0.1mm~0.5mm。As a preferred technical solution of the suction cup assembly, the maximum height of the first sealing member that can protrude from the adsorption surface of the substrate is 3 mm to 5 mm, and the maximum height that the second sealing member can protrude from the adsorption surface of the substrate 0.1 mm to 0.5 mm.
作为一种吸盘组件的优选技术方案,所述基底吸附面开设有第一密封槽和第二密封槽,所述第一密封槽与所述第一密封件一一对应设置,所述第二密封槽与所述第二密封件一一对应设置,所述第一密封件的下端嵌设于所述第一密封槽内,所述第二密封件的下端嵌设于所述第二密封槽内,所述第一密封槽的槽深和槽宽分别大于所述第二密封槽的槽深和槽宽。As a preferred technical solution of the suction cup assembly, the adsorption surface of the base is provided with a first sealing groove and a second sealing groove, the first sealing groove is provided in one-to-one correspondence with the first sealing member, and the second sealing groove The grooves are provided in one-to-one correspondence with the second sealing elements, the lower end of the first sealing element is embedded in the first sealing groove, and the lower end of the second sealing element is embedded in the second sealing groove , the groove depth and groove width of the first sealing groove are respectively greater than the groove depth and groove width of the second sealing groove.
作为一种吸盘组件的优选技术方案,所述第一密封件包括密封主体和卡接部,所述第一密封槽包括连通的容纳槽部和安装槽部,所述安装槽部位于所述容纳槽部的下方,且所述安装槽部的槽宽从其槽底至槽口逐渐增大,所述卡接部卡设于所述安装槽部中,所述密封主体能够完全容纳于所述容纳槽部中。As a preferred technical solution of the suction cup assembly, the first sealing member includes a sealing body and a clamping portion, and the first sealing groove includes a receiving groove portion and an installation groove portion connected to each other, and the installation groove portion is located on the receiving groove portion Below the groove, and the groove width of the installation groove gradually increases from the bottom of the groove to the notch, the clamping part is clamped in the installation groove, and the sealing body can be completely accommodated in the in the receiving tank.
作为一种吸盘组件的优选技术方案,所述密封主体的横截面为长条环形,所述长条环形的长度方向与所述吸盘的厚度方向一致;或As a preferred technical solution of the suction cup assembly, the cross section of the sealing body is a strip ring, and the length direction of the strip ring is consistent with the thickness direction of the suction cup; or
所述密封主体的横截面为折线段形,所述折线段形的末端折线段沿远离所述卡接部的方向向远离所述吸盘中心的方向倾斜;或The cross-section of the sealing body is in the shape of a broken line segment, and the broken line segment at the end of the broken line segment is inclined in a direction away from the clamping part and in a direction away from the center of the suction cup; or
所述密封主体的横截面为三角环形,所述三角环形的一侧边与所述卡接部连接。The cross section of the sealing body is a triangular ring, and one side of the triangular ring is connected to the clamping portion.
作为一种吸盘组件的优选技术方案,所述主吸附区内同心且间隔设置有多个环形的主吸附凹槽,所述边缘吸附区内同心且间隔设置有多个环形的边缘吸附凹槽,所述主吸附凹槽和所述边缘吸附凹槽均能够与气源装置连通,相邻两个边缘吸附凹槽之间的间距小于相邻两个主吸附凹槽之间的间距。As a preferred technical solution of the suction cup assembly, a plurality of annular main adsorption grooves are concentrically and spaced in the main adsorption area, and a plurality of annular edge adsorption grooves are concentrically and spaced in the edge adsorption area, Both the main adsorption groove and the edge adsorption groove can communicate with the air source device, and the distance between two adjacent edge adsorption grooves is smaller than the distance between two adjacent main adsorption grooves.
作为一种吸盘组件的优选技术方案,所述主吸附凹槽和所述边缘吸附凹槽能够单独连通所述气源装置连通。As a preferred technical solution of the suction cup assembly, the main suction groove and the edge suction groove can be independently communicated with the air source device.
作为一种吸盘组件的优选技术方案,所述吸盘、所述第一密封件及所述第二密封件均由静电耗散材料制成;和/或As a preferred technical solution of the suction cup assembly, the suction cup, the first seal and the second seal are all made of static dissipative materials; and/or
所述吸盘内嵌设有静电导电柱,所述静电导电柱的上端与所述基底吸附面平齐,所述静电导电柱的下端接地。The suction cup is embedded with an electrostatic conductive column, the upper end of the electrostatic conductive column is flush with the adsorption surface of the substrate, and the lower end of the electrostatic conductive column is grounded.
一种曝光装置,包括吸盘座和如上所述的吸盘组件,所述吸盘组件设置于所述吸盘座上。An exposure device, comprising a suction cup base and the above suction cup assembly, the suction cup assembly is arranged on the suction cup base.
作为一种曝光装置的优选技术方案,所述吸盘内嵌设有静电导电柱,所述静电导电柱的上端面与所述基底吸附面平齐;As a preferred technical solution of the exposure device, the suction cup is embedded with an electrostatic conductive column, and the upper end surface of the electrostatic conductive column is flush with the adsorption surface of the substrate;
所述吸盘座上设置有静电引导结构及接地结构,所述吸盘座由导体材料制成,所述静电引导结构与所述静电导电柱的下端抵接,以将静电由静电导电柱引导至接地结构。An electrostatic guiding structure and a grounding structure are provided on the suction cup base, the suction cup base is made of conductive material, and the electrostatic guiding structure abuts against the lower end of the electrostatic conductive column to guide the static electricity from the electrostatic conductive column to the ground structure.
作为一种曝光装置的优选技术方案,所述静电引导结构包括导电件和弹性件,所述弹性件的下端与所述吸盘座固定,所述导电件支承于弹性件上端,以使所述导电件能够弹性凸出于所述吸盘座的上表面并与所述静电导电柱的下端抵接。As a preferred technical solution of the exposure device, the electrostatic guiding structure includes a conductive member and an elastic member, the lower end of the elastic member is fixed to the suction cup seat, and the conductive member is supported on the upper end of the elastic member, so that the conductive member The piece can elastically protrude from the upper surface of the suction cup seat and abut against the lower end of the static electricity conductive column.
作为一种曝光装置的优选技术方案,所述导电件为导电球。As a preferred technical solution of the exposure device, the conductive member is a conductive ball.
作为一种曝光装置的优选技术方案,所述静电引导结构还包括限位件,所述限位件用于限制所述导电件凸出所述吸盘座上表面的最大高度。As a preferred technical solution of the exposure device, the static electricity guiding structure further includes a limiting member, and the limiting member is used to limit the maximum height of the conductive member protruding from the upper surface of the suction cup seat.
作为一种曝光装置的优选技术方案,所述吸盘于最内侧的所述主吸附区内开设有吸附孔,所述吸附孔沿所述吸盘的厚度方向贯通所述吸盘;所述曝光装置还包括用于所述基底交接的交接机构,所述交接机构包括:As a preferred technical solution of the exposure device, the suction cup is provided with an adsorption hole in the innermost main adsorption area, and the suction hole penetrates the suction cup along the thickness direction of the suction cup; the exposure device also includes A handover mechanism for the handover of the substrate, the handover mechanism includes:
吸附柱,其与所述基底吸附面垂直,所述吸附柱的上端能伸入所述吸附孔中并能相对所述吸附孔沿垂直于所述基底吸附面的方向运动,所述吸附柱内开设有交接气道,所述交接气道的上端贯穿所述吸附柱的上端面,所述交接气道与气源装置连通;An adsorption column, which is perpendicular to the adsorption surface of the substrate, the upper end of the adsorption column can extend into the adsorption hole and move relative to the adsorption hole in a direction perpendicular to the adsorption surface of the substrate, and the inside of the adsorption column A handover airway is provided, the upper end of the handover airway runs through the upper end surface of the adsorption column, and the handover airway communicates with the gas source device;
吸嘴,设置在所述吸附柱的上端且与所述交接气道连通,所述吸嘴的外表面能与所述吸附孔的内壁密封贴合,且所述吸嘴的上端高于所述吸附柱的上端面。The suction nozzle is arranged on the upper end of the adsorption column and communicates with the transfer air passage, the outer surface of the suction nozzle can be sealed and fitted with the inner wall of the adsorption hole, and the upper end of the suction nozzle is higher than the The upper end surface of the adsorption column.
作为一种曝光装置的优选技术方案,所述吸嘴及所述吸附柱均由静电耗散材料制成,所述交接机构上设置有由导体材料制成的导体结构,所述吸附柱与所述导体结构连接,所述导体结构接地。As a preferred technical solution of the exposure device, the suction nozzle and the adsorption column are both made of static dissipative materials, the transfer mechanism is provided with a conductor structure made of conductive material, the adsorption column and the connected to the conductor structure, and the conductor structure is grounded.
作为一种曝光装置的优选技术方案,所述吸嘴的开口周缘向外翻转形成有折边部。As a preferred technical solution of the exposure device, the periphery of the opening of the suction nozzle is turned outwards to form a folded edge.
作为一种曝光装置的优选技术方案,所述曝光装置还包括上平板,所述吸盘座转动设置于所述上平板上,所述吸盘座的内侧同轴设置有气浮轴承,所述气浮轴承的内圈与所述上平板可拆卸连接,所述气浮轴承的外圈与所述吸盘座连接。As a preferred technical solution of the exposure device, the exposure device also includes an upper plate, the suction cup base is rotatably arranged on the upper plate, and an air bearing is coaxially arranged on the inner side of the suction cup base. The inner ring of the bearing is detachably connected with the upper plate, and the outer ring of the air bearing is connected with the suction cup seat.
作为一种曝光装置的优选技术方案,所述气浮轴承的外圈与所述吸盘座的内侧壁之间通过水平设置的簧片连接。As a preferred technical solution of the exposure device, the outer ring of the air bearing is connected to the inner side wall of the suction cup base through a horizontally arranged reed.
作为一种曝光装置的优选技术方案,所述吸盘座的外侧壁可拆卸连接有气浮件,所述气浮件沿所述吸盘座的周向均匀间隔设置有多个,所述气浮件的下端面与所述吸盘座的下端面平齐或所述气浮件的下端面凸出所述吸盘座的下端面,所述气浮件能够气浮支承于所述上平板上。As a preferred technical solution of the exposure device, the outer wall of the suction cup seat is detachably connected with an air floating member, and a plurality of air floating members are evenly spaced along the circumferential direction of the suction cup seat, and the air floating member The lower end surface of the suction cup seat is flush with the lower end surface of the suction cup seat or the lower end surface of the air floating member protrudes from the lower end surface of the suction cup seat, and the air floating member can be supported on the upper plate by air floating.
作为一种曝光装置的优选技术方案,所述吸盘座的外侧壁凸设有气浮安装部,所述气浮安装部与所述气浮件一一对应设置,所述气浮安装部与所述气浮件螺纹连接,以通过旋拧所述气浮件调节所述气浮件下端面凸出所述吸盘座下端面的高度。As a preferred technical solution of the exposure device, the outer wall of the suction cup base is protruded with an air-floating installation part, and the air-floating installation part is provided in one-to-one correspondence with the air-floating member, and the air-floating installation part and the air-floating installation part The air floating part is threadedly connected to adjust the height of the lower end surface of the air floating part protruding from the lower end surface of the suction cup seat by screwing the air floating part.
作为一种曝光装置的优选技术方案,所述吸盘座的下表面设有气浮分气气道,所述吸盘座外侧壁上开设有连通所述气浮分气气道的气浮充气口,所述气浮件内开设有气浮气道,所述气浮件的下表面开设有气浮孔,所述气浮气道的一端与所述气浮孔连通,每个所述气浮件的所述气浮气道均与所述气浮分气气道连通。As a preferred technical solution of the exposure device, the lower surface of the suction cup seat is provided with an air flotation gas distribution channel, and the outer wall of the suction cup seat is provided with an air flotation inflation port communicating with the air flotation gas distribution channel, An air flotation channel is opened in the air flotation member, an air flotation hole is opened on the lower surface of the air flotation member, one end of the air flotation channel communicates with the air flotation hole, and each of the air flotation members The air flotation channels are all in communication with the air flotation distribution channels.
作为一种曝光装置的优选技术方案,所述曝光装置还包括垂向预载结构,所述垂向预载结构用于在所述吸盘座和所述上平板之间施加垂向预载力,每个所述气浮件沿所述吸盘座周向方向的相对两侧均设置有所述垂向预载结构。As a preferred technical solution of the exposure device, the exposure device further includes a vertical preload structure, and the vertical preload structure is used to apply a vertical preload force between the suction cup seat and the upper plate, The vertical preload structures are provided on opposite sides of each of the air floating elements along the circumferential direction of the suction cup seat.
作为一种曝光装置的优选技术方案,所述垂向预载结构包括磁预载件,所述磁预载件包括磁石,所述上平板包括上平板本体和嵌设于所述上平板本体上的金属支撑板,所述磁石与所述吸盘座可拆卸连接,且所述磁石正对设置于所述金属支撑板的上方。As a preferred technical solution of the exposure device, the vertical preload structure includes a magnetic preload member, the magnetic preload member includes a magnet, and the upper plate includes an upper plate body and is embedded on the upper plate body. The metal support plate, the magnet is detachably connected to the suction cup seat, and the magnet is arranged directly above the metal support plate.
作为一种曝光装置的优选技术方案,所述金属支撑板与所述气浮件一一对应设置,且所述气浮件能够气浮支撑于所述金属支撑板上。As a preferred technical solution of the exposure device, the metal support plate is provided in one-to-one correspondence with the air-floating elements, and the air-floating elements can be air-supported on the metal supporting plate.
作为一种曝光装置的优选技术方案,所述磁预载件还包括安装筒,所述安装筒的下端面开设有磁石安装槽,所述磁石嵌设于所述磁石安装槽中,所述安装筒与所述吸盘座可拆卸连接,且所述安装筒由隔磁材料制成。As a preferred technical solution of the exposure device, the magnetic preloader also includes a mounting cylinder, the lower end surface of the mounting cylinder is provided with a magnet mounting groove, the magnet is embedded in the magnet mounting groove, and the mounting The cylinder is detachably connected to the suction cup seat, and the installation cylinder is made of magnetic isolation material.
一种光刻系统,包括如上所述的曝光装置。A photolithography system includes the above-mentioned exposure device.
本发明的有益效果在于:The beneficial effects of the present invention are:
本发明提供的吸盘组件,通过在每个主吸附区设置第一密封件,当气源装置对第一密封件内侧的主吸附区进行抽真空时,能够实现对对应尺寸基底的主体区域的吸附;通过在最外侧的主吸附区的外侧设置边缘吸附区和第二密封件,能够实现对对应尺寸基底的边缘的吸附,从而保证基底整体能够处于平整状态,能够有效实现对翘曲基底的吸附,且在基底吸附过程中对基底进行平整,提高后续基底加工质量。In the suction cup assembly provided by the present invention, by setting the first sealing member in each main adsorption area, when the air source device vacuumizes the main adsorption area inside the first sealing member, it can realize the adsorption of the main body area of the substrate of the corresponding size ;By setting the edge adsorption area and the second seal on the outside of the outermost main adsorption area, the adsorption to the edge of the substrate of the corresponding size can be realized, so as to ensure that the substrate as a whole can be in a flat state, and can effectively realize the adsorption of the warped substrate , and the substrate is flattened during the substrate adsorption process to improve the quality of subsequent substrate processing.
本发明提供的曝光装置,通过采用上述的吸盘组件,提高了曝光装置对翘曲基底的吸附能力,扩大的曝光装置对基底的适用性,提高了曝光稳定性和曝光质量。The exposure device provided by the present invention, by adopting the above-mentioned sucker assembly, improves the adsorption capacity of the exposure device on warped substrates, expands the applicability of the exposure device to the substrate, and improves exposure stability and exposure quality.
本发明提供的光刻系统,通过采用上述的曝光装置,提高了光刻设备对基底的适用性和翘曲容忍度,提高了光刻稳定性和光刻质量。The lithography system provided by the present invention improves the applicability and warpage tolerance of the lithography equipment to the substrate by using the above-mentioned exposure device, and improves the lithography stability and lithography quality.
附图说明Description of drawings
图1为本发明实施例一提供的曝光装置的结构示意图;FIG. 1 is a schematic structural view of an exposure device provided in Embodiment 1 of the present invention;
图2为本发明实施例一提供的曝光装置的部分结构示意图;FIG. 2 is a partial structural schematic diagram of the exposure device provided by Embodiment 1 of the present invention;
图3为图2中I处的局部放大图;Fig. 3 is the local enlargement figure of I place in Fig. 2;
图4为本发明实施例一提供的曝光装置的剖视图;4 is a cross-sectional view of the exposure device provided by Embodiment 1 of the present invention;
图5是图4中J处的局部放大图;Fig. 5 is a partial enlarged view of J in Fig. 4;
图6是图4中K处的局部放大图;Fig. 6 is a partial enlarged view at K in Fig. 4;
图7是图4中L处的局部放大图;Fig. 7 is a partial enlarged view of L place in Fig. 4;
图8为本发明实施例一提供的气浮固定部处的剖视图;Fig. 8 is a cross-sectional view of the air flotation fixing part provided by Embodiment 1 of the present invention;
图9为本发明实施例一提供的吸盘座的背面结构示意图;Fig. 9 is a schematic diagram of the back structure of the suction cup holder provided by Embodiment 1 of the present invention;
图10为本发明实施例一提供的吸盘座的正面结构示意图;Fig. 10 is a schematic view of the front structure of the suction cup seat provided by Embodiment 1 of the present invention;
图11为本发明实施例一提供的曝光装置的部分剖视图;FIG. 11 is a partial cross-sectional view of the exposure device provided by Embodiment 1 of the present invention;
图12为本发明实施例一提供的吸盘组件的结构示意图;Fig. 12 is a schematic structural view of the suction cup assembly provided by Embodiment 1 of the present invention;
图13为图12中M处的局部放大图;Figure 13 is a partial enlarged view at M in Figure 12;
图14为本发明实施例一提供的吸盘组件的剖视图;Fig. 14 is a cross-sectional view of the suction cup assembly provided by Embodiment 1 of the present invention;
图15为图14中N处的局部放大图;Figure 15 is a partial enlarged view at N in Figure 14;
图16为本发明实施例一提供的静电引导结构的剖视图;Fig. 16 is a cross-sectional view of the electrostatic guiding structure provided by Embodiment 1 of the present invention;
图17为本发明实施例一提供的交接机构的结构示意图;Fig. 17 is a schematic structural diagram of the transfer mechanism provided by Embodiment 1 of the present invention;
图18为本发明实施例二提供的吸盘组件的部分结构剖视图;Fig. 18 is a partial structural sectional view of the suction cup assembly provided by
图19是本发明实施例三提供的吸盘组件的部分结构剖视图。Fig. 19 is a partial structural sectional view of the suction cup assembly provided by the third embodiment of the present invention.
图中标记如下:The markings in the figure are as follows:
100、吸附装置;200、曝光台;300、基底;100. Adsorption device; 200. Exposure platform; 300. Base;
1、吸盘组件;11、吸盘;111、主吸附区;1111、主吸附凹槽;1112、主连通凹槽;1113、主气孔;112、边缘吸附区;1121、边缘吸附凹槽;1122、边缘连通凹槽;1123、边缘气孔;1124、通气孔;1125、边缘吸附气道;113、第一密封槽;114、第二密封槽;115、吸附孔;12、第一密封件;121、密封主体;122、卡接部;13、第二密封件;14、静电导电柱;1, suction cup assembly; 11, suction cup; 111, main adsorption area; 1111, main adsorption groove; 1112, main connecting groove; 1113, main air hole; 112, edge adsorption area; 1121, edge adsorption groove; 1122, edge Connecting groove; 1123, edge air hole; 1124, ventilation hole; 1125, edge adsorption airway; 113, first sealing groove; 114, second sealing groove; 115, adsorption hole; 12, first sealing member; 121, sealing Main body; 122, clamping part; 13, second sealing member; 14, electrostatic conductive column;
2、交接机构;21、底座;22、垂向运动组件;23、托板;24、吸附柱;241、交接气道;25、吸嘴;251、折边部;2. Handover mechanism; 21. Base; 22. Vertical movement component; 23. Support plate; 24. Adsorption column; 241. Handover airway; 25. Suction nozzle; 251. Flange part;
3、上平板组件;31、上平板;311、上平板本体;312、金属支撑板;32、Rz导向组件;321、固定导向座;322、气浮导向座;3221、外连接凸台;33、簧片;34、气浮件;341、连接部;342、气浮部;35、磁预载件;351、安装筒;3511、限位部;352、磁石;36、锁紧螺母;3. Upper plate assembly; 31. Upper plate; 311. Upper plate body; 312. Metal support plate; 32. Rz guide assembly; 321. Fixed guide seat; 322. Air bearing guide seat; 3221. External connection boss; 33 , Reed; 34, Air Floating Part; 341, Connecting Part; 342, Air Floating Part; 35, Magnetic Preloading Part; 351, Mounting Tube; 3511, Limiting Part;
4、吸盘座组件;41、吸盘座;411、主体盘部;412、内连接凸台;413、气浮安装部;4131、安装孔;4132、容纳槽;4133、气浮供气气道;4134、转接气道;414、气浮分气凹槽;415、接头容纳槽;416、吸盘吸附凹槽;417、吸盘吸附气道;418、真空气道;4181、真空分气气道;4182、径向气道;4183、轴向气道;419、安装槽;4191、第一槽部;4192、第二槽部;4110、限位槽;4111、主槽部;4112、延伸槽部;42、气浮分气组件;421、气浮充气接头;422、分气接头;423、分气总接头;424、转接接头;425、供气接头;426、堵头;43、定位柱;44、静电引导结构;441、导电球;442、弹性件;443、限位件;4431、环部;4432、耳板部;4443、限位孔;45、上封板;46、接地结构;4. Suction cup seat assembly; 41. Suction cup seat; 411. Main body plate; 412. Inner connection boss; 413. Air flotation installation part; 4131. Installation hole; 4132. Accommodating groove; 4134, transfer airway; 414, air flotation gas distribution groove; 415, joint accommodation groove; 416, suction cup adsorption groove; 417, suction cup adsorption airway; 418, vacuum airway; 4181, vacuum gas distribution airway; 4182, radial airway; 4183, axial airway; 419, installation groove; 4191, first groove; 4192, second groove; 4110, limit groove; 4111, main groove; 4112, extension groove ; 42, air flotation gas distribution assembly; 421, air flotation inflation joint; 422, gas distribution joint; 423, gas distribution main joint; 424, adapter joint; 425, air supply joint; 426, plug; ;44, electrostatic guiding structure; 441, conductive ball; 442, elastic piece; 443, limit piece; 4431, ring part; 4432, ear plate part; 4443, limit hole; 45, upper sealing plate; 46, grounding structure ;
5、气足;6、垂向调节机构;7、支撑组件;8、导气组件。5. Air foot; 6. Vertical adjustment mechanism; 7. Support component; 8. Air guide component.
具体实施方式detailed description
下面结合附图和实施例对本发明作进一步的详细说明。可以理解的是,此处所描述的具体实施例仅仅用于解释本发明,而非对本发明的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本发明相关的部分而非全部结构。The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
在本发明的描述中,除非另有明确的规定和限定,术语“相连”、“连接”、“固定”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.
在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
在本实施例的描述中,术语“上”、“下”、“右”、等方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述和简化操作,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅仅用于在描述上加以区分,并没有特殊的含义。In the description of this embodiment, the terms "up", "down", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operations, rather than indicating Or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the invention. In addition, the terms "first" and "second" are only used to distinguish in description, and have no special meaning.
如图1所示,本实施例提供了一种曝光装置,其主要用于光刻设备中,对硅片基底、玻璃基底等基底300进行光刻曝光处理,以使基底300上形成集成电路所需的电路图形。曝光装置主要包括曝光台200和吸附装置100,吸附装置100用于交接和吸取待曝光的基底300,并将基底300固定在曝光台200上,保证曝光的稳定性和基底300曝光质量;曝光台200用于对基底300实现各向粗调和微调,完成对基底300的调平调焦后,对基底300进行光学曝光处理。As shown in FIG. 1 , this embodiment provides an exposure device, which is mainly used in photolithography equipment to perform photolithography exposure treatment on
为方便对曝光装置的结构描述,以图1所示方向为例构建XYZ坐标系,其中,XY平面平行于曝光装置的吸附面,Z方向与XY平面平行,,且X、Y和Z满足右手法则。In order to facilitate the description of the structure of the exposure device, an XYZ coordinate system is constructed taking the direction shown in Figure 1 as an example, where the XY plane is parallel to the adsorption surface of the exposure device, the Z direction is parallel to the XY plane, and X, Y and Z satisfy the right-hand law.
如图1和2所示,具体地,曝光台200包括固定基座(未示出)、气足5、垂向调节机构6、Rz调节机构、支撑组件7、上平板组件3和吸盘座组件4。固定基座用于固定和支撑整个曝光装置,气足5水平设置在固定基座上,用于对放置在曝光台200上的基底300进行X向和Y向的大行程的粗动调节,从而保证基底300与光学系统正对设置并实现对基底300的扫描性曝光处理。气足5与固定基座之间设置有X向粗动调节机构和Y向粗动调节机构,以分别实现对气足5在X向和Y向的粗动调节。在本实施例中,固定基座和气足5的设置以及采用X向粗动调节机构和Y向粗动调节机构实现气足5在X向和Y向的粗动调节为本领域的常规技术手段,本实施例不再进行赘述。As shown in Figures 1 and 2, specifically, the exposure table 200 includes a fixed base (not shown), an
上平板组件3包括上平板31,吸盘座组件4设置于上平板31上,上平板31位于气足5的上方,且与气足5平行且间隔设置,上平板31与气足5之间设置有垂向调节机构6和支撑组件7,且为实现Rz向的转动调节,上平板31上设置有Rz调节机构(未示出),垂向调节机构6、支撑组件7及Rz调节机构的设置可以参考专利CN201820746378.X中的相关描述或参考现有技术进行设置,此非本发明的重点,本实施例不再进行赘述。The
吸盘座组件4包括吸盘座41,吸盘组件1能够吸附于吸盘座41的上表面。优选地,如图2和5所示所示,为提高吸盘座41绕Z轴转动的运动精度,上平板31上还设置有Rz导向组件32。在本实施例中,Rz导向组件32设置于吸盘座41的内侧,包括与吸盘座41同轴设置的固定导向座321和气浮导向座322,固定导向座321与上平板31可拆卸连接,气浮导向座322套设在固定导向座321的外侧并与吸盘座41的内侧壁连接。气浮导向座322的内侧面和下端面均设置有气浮孔,气浮导向座322内侧面的气浮孔用于在气浮导向座322和固定导向座321之间通入正压气体以使气浮导向座322和固定导向座321之间形成气膜,气浮导向座322下端面的气浮孔用于向气浮导向座322和上平板31之间通入正压气体,以使气浮导向座322和上平板31之间形成气膜,降低气浮导向座322相对固定导向座321转动时的摩擦,提高气浮导向座322转动精度。The suction
在本实施例中,Rz导向组件32为气浮轴承,气浮轴承的内圈为固定导向座321,气浮轴承的外圈为气浮导向座322。由于气浮轴承为现有成熟产品,采用气浮轴承作为Rz导向组件32,能够有效降低设计和加工成本。In this embodiment, the Rz guide assembly 32 is an air bearing, the inner ring of the air bearing is a fixed
优选地,吸盘座41的内侧壁与气浮导向座322之间采用水平设置的簧片33连接,且簧片33沿气浮导向座322的周向间隔设置有多个。簧片33用于解耦气浮垂向与水平倾斜引起的压迫气膜问题,同时为气浮导向座322提供垂向支撑。Preferably, the inner side wall of the
优选地,簧片33呈与XY平面平行的片状结构,以简化簧片33的结构。为方便簧片33与气浮导向座322的连接,气浮导向座322的外侧壁向外凸设有外连接凸台3221,吸盘座41的内侧设置有内连接凸台412,内连接凸台412及外连接凸台3221均与簧片33一一对应设置,簧片33的两端分别搭设于内连接凸台412和外连接凸台3221的上表面,簧片33与内连接凸台412及外连接凸台3221均通过螺纹件连接。Preferably, the
为提高吸盘座41绕Rz转动调节的精度和速度,吸盘座41与上平板31通过气浮支撑结构气浮连接,以使吸盘座41能够选择性地气浮支承于上平板31上。具体地,吸盘座41包括环状的主体盘部411和凸设于主体盘部411外侧壁的气浮安装部413,气浮安装部413沿吸盘座41的周向间隔设置有多个,每个气浮安装部413上均连接有气浮件34,气浮件34的下表面能够与上平板31抵接,且气浮件34能够气浮支承于上平板31上。In order to improve the accuracy and speed of the rotation adjustment of the
通过在吸盘座41的外侧壁上连接气浮件34,可以通过气浮件34带动吸盘座41气浮支撑于上平板31上,从而避免在吸盘座41底部开设气浮孔进行气浮支撑结构的设置,能够简化吸盘座41的结构;同时,由于气浮件34沿吸盘座41的周向间隔设置有多个,相比于直接在吸盘座41与上平板31之间形成气膜,能够有效降低气膜形成所需气压和气量,节省成本。优选地,气浮安装部413和气浮件34沿吸盘座41的周向均匀间隔设置有多个,以提高吸盘座41受力平稳性。By connecting the
如图2、图6及图8所示,为方便气浮件34在气浮安装部413上的安装,气浮安装部413开设有连通的安装孔4131和容纳槽4132,容纳槽4132贯通气浮安装部413的下表面及远离主体盘部411的一侧壁。气浮件34包括气浮部342和连接部341,气浮部342的上端面与连接部341连接,连接部341穿设于安装孔4131中并与气浮安装部413可拆卸连接,气浮部342位于容纳槽4132中,且气浮部342远离主体盘部411的一侧设置有供气接头425,气浮部342的底面开设有气浮孔,内部设置有气浮气道。该种设置,在方便气浮件34与气浮安装部413连接的同时,方便供气接头425的设置。As shown in Figure 2, Figure 6 and Figure 8, in order to facilitate the installation of the
进一步地,安装孔4131和连接部341均呈圆柱状,安装孔4131的内壁开设有内螺纹,连接部341的外部开设有外螺纹,气浮安装部413与连接部341通过内螺纹和外螺纹螺纹连接。优选地,连接部341的上端旋拧有锁紧螺母36,锁紧螺母36的下表面与气浮安装部413贴合,以锁紧气浮安装部413和连接部341,提高吸盘座41与气浮件34的连接稳定性。Furthermore, both the mounting
优选地,气浮部342的直径大于连接部341的直径,以增大气浮作用面积。进一步地,容纳槽4132的槽深大于气浮部342沿吸盘座41厚度方向上的尺寸,以使能够通过旋拧气浮件34,调节气浮件34相对吸盘座41在Z方向上的安装位置,从而调节气浮件34的下表面凸出吸盘座41的下表面的高度。在本实施例中,优选地,气浮件34的下表面与吸盘座41的下端面平齐或气浮件34的下表面凸出吸盘座41的下表面,以降低吸盘座41的气浮抬升难度。Preferably, the diameter of the
如图2和图9所示,优选地,为保证各个气浮件34处的气体压强一致性,各个气浮件34通过气浮分气组件42连通。具体地,吸盘座41内部设置有气浮分气气道,吸盘座41外侧壁开设有连通气浮分气气道的气浮充气口,气浮充气口处设置有气浮充气接头421,用于向气浮分气气道通入正压气体。气浮件34内部开设有气浮气道且气浮件34的底部开设有气浮孔,气浮气道的一端与气浮孔连通,每个气浮件34的气浮气道的另一端均与气浮分气气道连通。该种设置,通过向气浮分气气道充入正压气体,并通过气浮分气气道向各个气浮件34内通入正压气体,能够有效保证各个气浮件34内部气压一致。As shown in FIG. 2 and FIG. 9 , preferably, in order to ensure the consistency of gas pressure at each air-floating
为方便气浮分气气道的设置,吸盘座41的下表面开设有气浮分气凹槽414,吸盘座41的下表面对应每个气浮安装部413均开设有接头容纳槽415,多个接头容纳槽415通过气浮分气凹槽414依次连通。每个接头容纳槽415内设置有分气接头422;气浮分气凹槽414内设置有分气气管,分气气管的两端分别与相邻两个接头容纳槽415内的分气接头422连通,分气气管和分气接头422内形成的气道即为气浮分气气道;多个分气接头422中,至少一个分气接头422连通气浮充气口。气浮件34上设置有与气浮气道连通的供气接头425,每个气浮安装部413上均开设有转接气道4134,转接气道4134的一端贯通气浮安装部413远离主体盘部411的一侧壁并密封连接有转接接头424,转接气道4134的另一端与对应处的分气接头422连通,且转接接头424与供气接头425通过管路连通。In order to facilitate the setting of the air flotation air distribution channel, the lower surface of the
上述设置,当通过气浮充气口向分气接头422内供气时,气体通过分气接头422和分气气管供给至各个分气接头422处,再通过分气接头422供给至气浮安装部413上的转接气道4134,并经由转接接头424、供气接头425、气浮气道流向气浮件34的气浮孔。With the above setting, when the gas is supplied to the gas distribution joint 422 through the air flotation charging port, the gas is supplied to each gas distribution joint 422 through the
优选地,每个气浮安装部413上均开设有气浮供气气道4133,气浮供气气道4133的一端贯通气浮安装部413远离主体盘部411的一侧壁并形成气浮充气口,气浮供气气道4133的另一端连通接头容纳槽415。在实际使用时,选择性地在其中一个气浮充气口处设置气浮充气接头421,并在该气浮供气气道4133对应的接头容纳槽415中设置与气浮供气气道4133连通的分气总接头423,分气总接头423与该接头容纳槽415中的分气接头422通过气管连通,使其他气浮供气气道4133的两端采用堵头426进行封堵。该种设置,能够提高吸盘座41的使用灵活性,可以根据空间布局合理选择适合的气浮充气口与气源装置连通。Preferably, each air
优选地,吸盘座41的底面设置有下封板,下封板盖设于气浮分气凹槽414的槽口处并封闭气浮分气凹槽414的下侧槽口。下封板的设置,能够避免设置于气浮分气凹槽414中的分气气管外露,提高吸盘座41的整体性,避免分气气管脱离气浮分气凹槽414,且有利于分气气管的密封。优选地,下封板呈弧形结构,且覆盖所有气浮分气凹槽414,以简化下封板的结构。Preferably, the bottom surface of the
为方便下封板的安装,吸盘座41地面开设有下封槽,下封槽设置于气浮分气凹槽414的槽口处,且下封槽的槽宽大于气浮分气凹槽414的槽宽,下封板嵌设于下封槽中。In order to facilitate the installation of the lower sealing plate, a lower sealing groove is provided on the ground of the
进一步地,上平板组件3还包括垂向预载结构,垂向预载结构用于在吸盘座41和上平板31之间施加垂向预载力。在本实施例中,垂向预载结构采用磁预载的方式实现吸盘座41与上平板31之间的预载。在其他实施例中,垂向预载结构还可以采用气浮预载的方式实现吸盘座41与上平板31之间的预载。优选地,每个气浮件34沿吸盘座41周向方向的相对两侧均设置有垂向预载结构,以提高吸盘座41气浮支撑时的稳定性和受力平衡性。Further, the
垂向预载结构包括磁预载件35,磁预载件35包括磁石351,上平板31包括上平板本体311和嵌设于上平板本体311上的金属支撑板312,磁石351与吸盘座41可拆卸连接,且磁石351正对设置于金属支撑板312的上方。The vertical preload structure includes a
优选地,金属支撑板312与气浮件34一一对应设置,且气浮件34能够气浮支撑于金属支撑板312上。该种设置,能够使同一气浮件34两侧的磁预载件35共用金属支撑板312,简化上平板31的加工和组装。Preferably, the
优选地,金属支撑板312的上表面凸出上平板31的上表面,和/或,气浮件34的下表面凸出吸盘座41的下表面,由此可以使吸盘座41下表面与上平板31之间始终具有间隙,吸盘座41仅通过气浮件34支承于上平板31上,能够减小气浮作用的范围,提高气浮作用精度。在本实施例中,气浮件34的下表面凸出吸盘座41的下表面且金属支撑板312的上表面凸出上平板31本体的上表面。且优选地,金属支撑板312上表面凸出上平板31上表面的高度小于2mm,以提高曝光台200垂向结构紧凑性。Preferably, the upper surface of the
磁石352安装在气浮安装部413上,以简化磁石352的安装结构,提高结构紧凑性。气浮安装部413上开设有安装腔,安装腔至少贯通气浮安装部413的下端面,磁石352设置于气浮安装腔中。进一步地,磁预载件35还包括安装筒351,安装筒351的下端面开设有磁石安装槽,磁石352嵌设在磁石安装槽中,安装筒351的设置,有利于提高磁石352在气浮安装部413上的安装稳定性和便利性,简化磁石352的加工。The
进一步地,安装腔为圆柱形腔体,且安装腔的上端开口处沿径向延伸有限位凹槽。安装筒351包括圆柱形的筒体,筒体的上端沿径向向外延伸有限位部3511,限位部3511嵌设于限位凹槽中。限位部3511和限位凹槽的设置,能够防止磁预载件35相对气浮安装部413转动以及限制磁预载件35相对气浮安装部413向下运动,提高磁预载件35的安装稳定性。优选地,限位凹槽相对安装腔镜像设置有两个,限位部3511与限位凹槽对应设置。Further, the installation cavity is a cylindrical cavity, and the opening of the upper end of the installation cavity extends radially with a limiting groove. The
优选地,安装筒351采用隔磁材料制成,以对磁石352的磁力线进行汇聚,增强磁石352与金属支撑板312之间的磁吸力,同时,减小磁石352对曝光台200上其他金属件的影响。进一步地,磁石352的下表面与气浮安装部413的下表面平齐,以避免磁石352直接与金属支撑板312接触而造成磁石352与金属支撑板312中的磁吸力过大,进而导致气浮件34气浮所需气压压力较大的问题。Preferably, the mounting
在实施例中,气浮安装部413沿吸盘座41的周向均匀间隔设置有三个,气浮支撑组件7与气浮安装部413一一对应设置。在其他实施例中,气浮安装部413的个数可以根据需求自行设置。In the embodiment, three air-floating
如图10和图11所示,吸附装置100包括吸盘组件1,吸盘组件1设置在吸盘座41上,用于对吸附和承载基底300。吸盘座41座采用真空吸附的方式固定或释放吸盘组件1,以实现吸盘组件1在吸盘座41上的取放以及稳定放置。为实现吸盘座41对吸盘组件1的吸附,吸盘座41的上表面开设有吸盘吸附凹槽416,吸盘座41内部开设有吸盘吸附气道417,吸盘吸附气道417的一端与吸盘吸附凹槽416连通,另一端贯通吸盘座41的外侧壁并形成外接气口,外接气口处密封设置有连接气源核装置的气管接头。As shown in FIG. 10 and FIG. 11 , the
当吸盘组件1放置在吸盘座41上后,吸盘组件1下表面与吸盘座41上表面抵接,气源装置通过气管接头及吸盘吸附气道417对吸盘吸附凹槽416内的空气进行抽真空,从而使吸盘吸附凹槽416内形成真空状态,使吸盘组件1在负压作用下吸附在吸盘座41上。After the suction cup assembly 1 is placed on the
如图2所示,为实现吸盘组件1在吸盘座41上的安装定位,优选地,吸盘座41和吸盘组件1中的一个设置有定位柱43,另一个设置有定位槽,定位柱43插设于定位槽中。为简化安装和加工,在本实施例中,吸盘座41的上端设置定位柱43,吸盘组件1的下表面开设有定位槽,定位柱43凸出吸盘座41的上表面。优选地,定位柱43沿吸盘座41的周向间隔设置有至少两个,以提高定位准确性。As shown in Figure 2, in order to realize the installation and positioning of the suction cup assembly 1 on the
优选地,定位柱43为圆柱形结构,且其上端的外径逐渐减小,以形成用于导向的圆锥形头部,方便定位柱43插入定位槽中。进一步,定位槽为沿吸盘组件1径向延伸的长条槽,且定位槽的槽宽等于定位柱43的直径,定位槽的长度大于定位柱43的直径。该种设置,可以在第一个定位柱43插入对应的定位槽后,定位柱43能够在定位槽中活动,从而方便另一定位柱43插入对应的定位槽中,降低定位难度。在本实施例中,定位柱43设置有两个,且两个定位柱43不在吸盘座41的同一直径上,即两个定位槽的延伸方向不在同一直线上,避免吸盘组件1相对吸盘座41沿径向晃动。Preferably, the
如图12-图15所示,吸盘组件1包括吸盘11,吸盘11为圆盘状结构,以适用于现有通用的硅片或玻璃晶圆等基底300形状。为使吸盘11对基底300进行真空吸附,吸盘11朝向吸盘座41的下表面为固定吸附面,固定吸附面与吸盘座41的上表面抵接,吸盘11远离吸盘座41的上表面为基底吸附面,用于对基底300进行吸附。As shown in FIGS. 12-15 , the suction cup assembly 1 includes a
吸盘11的基底吸附面具有若干个与吸盘11同心设置的基底吸附区,每个基底吸附区均包括主吸附区111,主吸附区111的外径小于对应尺寸的基底300的外径,且至少最外侧的基底吸附区包括位于主吸附区111外侧的边缘吸附区112。The substrate adsorption surface of the
吸盘组件1还包括第一密封件12和第二密封件13,且每个主吸附区111的边缘处均环绕设置有第一密封件12,第二密封件13环绕边缘吸附区112的外侧边缘设置,且第一密封件12和第二密封件13的下端均嵌设于吸盘11内部,第一密封件12和第二密封件13的上端均能够弹性凸出基底吸附面,且第一密封件12能够凸出基底吸附面的高度大于所述第二密封件13能够凸出基底吸附面的高度。The suction cup assembly 1 also includes a
本实施例提供的吸盘组件1,通过设置能够弹性凸出基底吸附面的第一密封件12和第二密封件13,当第一密封件12和第二密封件13未与基底300接触时,第一密封件12和第二密封件13的上端高出基底吸附面;当基底300吸附至吸盘11上时,第一密封件12和第二密封件13内陷于吸盘11内部,且其上端面与基底吸附面平齐。The suction cup assembly 1 provided in this embodiment is provided with the first sealing
通过在吸盘11的基底吸附面上设置第一密封件12,当吸盘11对翘曲的基底300进行吸附时,由于第一密封件12的上端面凸出基底吸附面,第一密封件12的上端面首先与基底300下表面接触;由于第一密封件12具有弹性,第一密封件12在基底300的重力作用下会发生局部变形,以使第一密封件12上端形状与基底300底面相适配。当对主吸附区111进行抽真空处理时,基底300在真空负压作用下向下运动,进一步挤压第一密封件12,使第一密封件12上周缘与基底300完全贴合,主吸附区111内形成封闭的真空吸附腔,不会发生真空泄漏,提高对基底300的吸附能力和吸附效果;当主吸附区111内达到真空状态时,第一密封件12在挤压作用下因弹性变形缩回至吸盘11内,基底300下表面与基底吸附面接触,且基底300在真空负压作用下与基底吸附面紧密贴合,由基底300的主体部分由翘曲状态变为平整状态,进一步提高基底300与吸盘11之间的吸附力,使基底300稳定牢固地吸附在吸盘11上。By arranging the first sealing
通过设置第二密封件13,当基底300的主体部分被主吸附区111吸附至与基底吸附面抵接时,基底300的边缘在边缘吸附区112的负压作用下向下运动至与第二密封件13的上端抵接,从而使边缘吸附区112形成密封的真空吸附腔,增强对基底300边缘吸附的作用,随着边缘吸附区112的真空度增大,基底300抵压第二密封件13,使第二密封件13缩回至吸盘11内,基底300的边缘区域与基底吸附面抵接。By setting the second sealing
即,本实施例提供的吸盘组件1,通过在每个主吸附区111设置第一密封件12,当气源装置对第一密封件12内侧的主吸附区111进行抽真空时,能够实现对对应尺寸基底300的主体区域的吸附;通过在最外侧的主吸附区111的外侧设置边缘吸附区112和第二密封件13,能够实现对对应尺寸基底300的边缘的吸附,从而保证基底300整体能够处于平整状态,能够有效实现对翘曲基底300的吸附,且在基底300吸附过程中对基底300进行平整,提高后续基底300加工质量。That is, the suction cup assembly 1 provided in this embodiment, by setting the first sealing
为提高对基底300的吸附效果,每个主吸附区111内同心且间隔设置有多个环形的主吸附凹槽1111,边缘吸附区112内同心且间隔设置有多个环形的边缘吸附凹槽1121,主吸附凹槽1111和边缘吸附凹槽1121均能够与气源装置连通,以实现对主吸附凹槽1111和边缘吸附凹槽1121的抽真空。优选地,所有主吸附凹槽1111的槽宽相等,且相邻两个主吸附凹槽1111之间的间距相等;所有边缘吸附凹槽1121的槽宽相等,且相邻两个边缘吸附凹槽1121的间距相等,以提高吸盘11的加工便利性。In order to improve the adsorption effect on the
优选地,相邻两个边缘吸附凹槽1121之间的间距小于相邻两个主吸附凹槽1111之间的间距,由此,能够提高边缘吸附区112中边缘吸附凹槽1121的密集程度,从而在同等气压作用下,能够增强边缘吸附凹槽1121对基底300的吸附能力,有效提升基底300的边缘被吸附的平整性。优选地,相邻两个边缘吸附凹槽1121之间的间距小于相邻两个主吸附凹槽1111之间的间距的一半。Preferably, the distance between two adjacent
主吸附凹槽1111的宽度优选为2mm~5mm,相邻两个主吸附凹槽1111的间距优选为0.5mm~1.5mm。边缘吸附凹槽1121的宽度优选为0.5mm~2mm,相邻两个边缘吸附凹槽1121的间距优选为0.5mm~1.5mm。The width of the
进一步地,边缘吸附区112的径向宽度为5mm~30mm,以避免边缘吸附区112过大造成对基底300边缘的吸附能力减弱。但可以理解的是,边缘吸附区112的径向宽度可以根据边缘吸附区112的外径进行确定,当边缘吸附区112的外径越大时,边缘吸附区112的径向宽度可以越大。Further, the radial width of the
为使吸盘11适用于不同尺寸的基底300的吸附,如适用于8寸和12寸的基底300吸附,在本实施例中,主吸附区111至少设置有两个。优选地,每个主吸附区111对应的主吸附凹槽1111能够单独与气源装置连通,以实现对每个主吸附区111的单独抽真空控制,从而能够在使吸盘11适用于不同尺寸的基底300的吸附的同时,也能够在吸附较小尺寸的基底300时,仅对该尺寸基底300覆盖的主吸附区111进行抽真空处理,降低能源损耗。In order to make the
进一步地,边缘吸附区112内的边缘吸附凹槽1121可以单独连通气源装置,以使在基底300主体部分被主吸附区111吸附完成后,再对边缘吸附区112进行抽真空,提高对基底300边缘吸附的效果的同时,降低成本。Further, the
具体地,在本实施例中,吸盘11包括圆形的第一主吸附区和位于第一吸附区外侧的第二主吸附区,第二主吸附区的外侧设置有边缘吸附区112,第一吸附区的最大外径略小于8寸硅片基底300相适配,边缘吸附区112的最大外径与12寸基底300相适配。当需要对8寸基底300进行曝光时,使第一主吸附区的主吸附凹槽1111与真空源连通,当需要对12寸的基底300进行曝光时,先使第一主吸附区和第二主吸附区的主吸附凹槽1111均与气源核装置连通以对12寸基底300的主体部分进行吸附,然后再对边缘吸附区112的边缘吸附凹槽1121进行抽真空,实现对12寸基底300的边缘吸附。在其他实施例中,主吸附区111的个数还可以为三个或多个,每个主吸附区111的尺寸可以根据需要适用的基底300的尺寸进行确定,本实施例不做具体限制。Specifically, in this embodiment, the
在本实施例中,优选地,每个主吸附区111内的主吸附凹槽1111相互连通,简化吸附凹槽111与真空源的连接。具体地,在每个主吸附区111内,沿吸盘11的径向开设有主连通凹槽1112,主连通凹槽1112沿径向贯通该主吸附区111内的每个主吸附凹槽1111,使每个主吸附凹槽1111均与该主连通凹槽1112连通,从而使同一主吸附区111内的每个主吸附凹槽1111均连通。优选地,主连通凹槽1112的槽底与主吸附凹槽1111的槽底平齐,方便主吸附凹槽1111和主连通凹槽1112的加工。In this embodiment, preferably, the
更为优选地,主连通凹槽1112沿吸盘11的周向设置有多个,以提高真空腔在主吸附区111扩展的速度和一致性。相邻两个主吸附区111的主连通凹槽1112在吸盘11的周向上错位设置,有利于为不同主吸附区111的划分定位,另一方面防止相邻两个主吸附区111之间相互导通,降低主吸附区111的真空度。More preferably, there are multiple
进一步地,每个边缘吸附区112内的边缘吸附凹槽1121相互连通。具体地,在每个边缘吸附区112内,沿吸盘11的径向开设有边缘连通凹槽1122,边缘连通凹槽1122的设置可以参考主连通凹槽1112的设置,此处不再赘述。且优选地,边缘连通凹槽1122与主连通凹槽1112在吸盘11的周向上错位设置。Further, the
如图10-图15所示,为实现对主吸附区111和边缘吸附区112的抽真空,主吸附区111内开设主气孔1113,且吸盘11对应边缘吸附区112开设有边缘气孔1123。吸盘座41内部对应边缘吸附区112和每个主吸附区111分别开设有真空气道418,主气孔1113和边缘气孔1123的下端与对应的真空气道418的一端连通,主气孔1113的上端贯通主连通凹槽1112的槽底,边缘气孔1123的上端与边缘连通凹槽1122的槽底连通,真空气道418的另一端能够与气源装置连通。As shown in Figures 10-15, in order to vacuumize the
优选地,每个吸附区(包括主吸附区111和边缘吸附区112)对应的气孔(包括主气孔1113和边缘气孔1123)均沿吸盘11的周向间隔设置有多个,以提高抽真空速度和真空扩展一致性。优选地,每个主吸附区111内的主气孔1113与主连通凹槽1112一一对应设置。Preferably, each air hole (including the
由于每个吸附区对应的气孔在吸盘11的周向间隔设置有多个,优选地,每个真空气道418均包括环绕吸盘座41设置的真空分气气道4181和沿吸盘座41径向设置的径向气道4182,每个径向气道4182连通有向上延伸的两个轴向气道4183,其中一个轴向气道4183贯通对应的真空分气气道4181的槽底,另一个轴向气道4183贯通吸盘座41的上表面并与对应的气孔正对连通。每个真空分气气道4181连通的径向气道4182的个数和位置与对应吸附区的连通凹槽(包括主连通凹槽1112和边缘连通凹槽1122)的个数和位置一一对应。该种设置,能够保证同一吸附区内各个气孔处抽真空的压力一致性,提高基底300的吸附稳定性和受力平衡性。Since the air holes corresponding to each adsorption area are arranged at intervals in the circumferential direction of the
为方便吸盘座41的加工,每个径向气道4182均贯通吸盘座41的外壁面,且与同一真空分气气道4181连通的多个径向气道4182中的一个径向气道4182连接有导气组件8,其余径向气道4182的末端通过堵头封堵。气源装置通过导气组件8对真空气道418进行抽真空,导气组件8的设置可以参考专利申请CN201820746378.X中的设置,此处不再赘述。In order to facilitate the processing of the
优选地,所有真空分气气道4181均位于吸盘吸附凹槽416的外侧,且两个轴向气道4183中,位于外侧的轴向气道4183与真空分气气道4181连通,有利于吸盘座41的加工。由于最外侧的边缘吸附区112位于吸盘11的外侧,为方便边缘吸附区112与对应真空气道418的连通,吸盘11内沿径向开设有边缘吸附气道1125,边缘吸附气道1125的内端连通边缘气孔1123,每个边缘连通凹槽1122槽底均开设有通气孔1124,通气孔1124的下端与边缘吸附气道1125连通。通过设置边缘吸附气道1125,能够改变边缘气孔1123在吸盘11径向上的位置,从而能够根据吸盘11的加工情况,选择边缘气孔1123的开设位置。优选地,通气孔1124沿边缘吸附气道1125的径向间隔设置有多个。Preferably, all the vacuum
如图15所示,为方便第一密封件12的安装,基底吸附面上开设有第一密封槽113,第一密封槽113与第一密封件12一一对应设置,且第一密封件12的下端嵌设于第一密封槽113中。为方便第二密封件13的安装,基底吸附面上开设有第二密封槽114,第二密封槽114与第二密封件13一一对应设置,第二密封件13的下端嵌设于第二密封槽114中。As shown in Figure 15, in order to facilitate the installation of the first sealing
在本实施例中,第一密封槽113包括沿吸盘11厚度方向连通的安装槽部和容纳槽部,安装槽部位于容纳槽部的下方,且安装槽部的槽宽小于容纳槽部的槽宽。第一密封件12的下端卡设在安装槽部内,且当第一密封件12被压缩变形时,第一密封件12的上端容纳于容纳槽部中。采用卡接的方式,能够方便第一密封件12的安装和拆卸,简化吸盘11的加工。在其他实施例中,第一密封件12在第一密封槽113内的连接也可以是螺纹连接等其他可拆卸的连接方式。In this embodiment, the
为了提高第一密封件12在第一密封槽113内的安装稳定性,在本实施例中,优选地,安装槽部的槽宽沿其槽底至其槽口逐渐减小,且安装槽部槽口的宽度小于第一密封件12下端的宽度,使收缩的槽口增强对第一密封件12下端的卡紧作用,使第一密封件12与安装槽部过盈连接,提高连接紧密性和稳定性。更为优选地,在本实施例中,安装槽部为燕尾槽,方便加工进一步优选地,容纳槽部的横截面为矩形,容纳槽部的槽宽大于安装槽部的槽宽,提高对第一密封件12的容纳能力,且便于第一密封槽113的加工。In order to improve the installation stability of the first sealing
优选地,第一密封件12包括密封主体121和连接于密封主体121下端的卡接部122,卡接部122的横截面形状与安装槽部的横截面形状相适配。在本实施例中,密封主体121的截面呈长条环状结构,且长条环状结构的长度方向与吸盘11的厚度方向一致,以增强第一密封件12的形变能力。Preferably, the first sealing
第二密封槽114的横街面为矩形,且第二密封槽114的槽深小于第一密封槽113的槽深,第二密封槽114的槽宽小于安装槽部的槽宽。第二密封件13优选为O型密封圈,且第二密封件13的沿吸盘11径向方向和轴向方向的尺寸均小于第一密封件12在对应方向上的尺寸。通过将第二密封件13的截面尺寸设置呈小于第一密封件12的截面尺寸,能够避免第二密封件13的设置干扰主吸附区111对基底300的吸附。The lateral surface of the
优选地,第一密封件12能够凸出基底吸附面的最大高度高度为3mm~5mm,第二密封件13能够凸出基底吸附面的最大高度为0.1mm~0.5mm,该种设置,能够在实现对基底300吸附,保证第一密封件12的变形能力的同时,避免第二密封件13凸出基底吸附面过高而影响主吸附区111对基底300主体部分的吸附。Preferably, the maximum height of the first sealing
在本实施例中,第一密封件12和第二密封件13优选由硅橡胶制成,具有较好的支撑强度、变形能力和密封性能。在其他实施例中,第一密封件12和第二密封件13还可以由其他材质制成,如氟橡胶等,只要满足第一密封件12和第二密封件13的硬度不能太硬,以免影响基底300吸附可靠性,同时不能太软,以免基底300吸附完毕之后第一密封件12上端面粘接在硅片上,影响基底300的交接可靠性以及硅片的污染的材质均可,且第一密封件12的硬度优选为45~55绍尔硬度。第二密封件13可采用普通的密封圈结构。In this embodiment, the first sealing
如图2、图3和图16所示,优选地,为将基底300交接过程中因摩擦产生的静电引导出去,曝光装置还包括静电引导组件。具体地,静电引导组件包括嵌设在吸盘11内部的静电导电柱14,静电导电柱14的上端面与基底吸附面平齐,以使静电导电柱14能够与基底300接触,静电导电柱14的下端接地。As shown in FIG. 2 , FIG. 3 and FIG. 16 , preferably, in order to guide away the static electricity generated by friction during the transfer process of the
为方便对静电导电柱14进行接地处理,静电引导组件还包括设置于吸盘座41上的静电引导结构44,吸盘座41采用导体材料制成,吸盘座41设置有接地结构,静电引导结构44与静电导电柱14的下端抵接,以将静电由静电导电柱14引导至接地结构,降低静电对基底300交接和加工的影响。In order to facilitate the grounding treatment of the electrostatic
优选地,静电引导结构44包括导电件和弹性件442,弹性件442的下端与吸盘座41固定,导电件的上端支承于弹性件442的上端,以使导电件能够弹性凸出吸盘座41的上表面并与静电导电柱14的下端连接。通过设置弹性件442,能够保证导电件与静电导电柱14的接触可靠性,避免因加工或安装误差导致的导电件与静电导电柱14无法接触的问题产生。Preferably, the
进一步地,静电导电柱14呈倒“T”型结构,吸盘11上开设有插孔,插孔的形状与静电导电柱14的形状相适配。采用倒“T”型结构的静电导电柱14,能够实现静电导电柱14在吸盘11上的安装定位和限位,防止静电导电柱14沿吸盘11周向向上窜出。Further, the static
进一步地,导电件为导电球441,静电导电柱14的下表面为平面,由此,可以使静电导电柱14与导电件的接触始终为点接触,有利于将基底300上的静电仅由静电导电柱14引导至导电球441。在其他实施例中,导电件还可以其他形状的结构,如锥形等。Further, the conductive member is a
为方便静电引导结构44的安装,吸盘座41的上表面开设有安装槽419,弹性件442和导电球441均设置于安装槽419中,且导电球441能够通过安装槽419的槽口向上凸出吸盘座41的上表面。优选地,安装槽419包括上下连通的第一槽部4191和第二槽部4192,第一槽部4191的直径大于第二槽部4192的直径。弹性件442部分容置于第二槽部4192中,且与第二槽部4192的槽底抵接,导电球441容置于第一槽部4191中且第一槽部4191的直径略大于导电球441的直径。In order to facilitate the installation of the
为防止导电球441向上窜出而脱离安装槽419,静电引导结构44还包括限位件443,限位件443用于限制导电球441向上凸出吸盘座41上端面的最大高度。In order to prevent the
在本实施例中,限位件443安装于安装槽419的槽口处,且呈与XY平面平行的板状结构,限位件443沿Z方向贯通开设有圆形的限位孔4443,限位孔4443的孔径小于导电球441的直径,导电球441部分穿设于限位孔4443中且上部通过限位孔4443凸出吸盘座41的上表面。In this embodiment, the limiting
优选地,限位件443包括呈圆环状的环部4431和沿环部4431的径向向外延伸的耳板部4432,环部4431的内圈形成上述的限位孔4443。安装槽419的槽口处连通有限位槽4110,限位槽4110包括连通的主槽部4111和延伸槽部4112,主槽部4111的截面呈圆形,且主槽部4111的直径略大于环部4431的外形,且安装槽419贯通主槽部4111的槽底。环部4431位于主槽部4111内,耳板部4432位于延伸槽部4112内,且耳板部4432与延伸槽部4112的槽底可拆卸连接。Preferably, the limiting
优选地,限位件443的厚度小于限位槽4110的槽深,以使限位件443内陷于吸盘座41内,避免限位件443与静电导电柱14接触而影响导电球441的静电引导效果。进一步地,耳板部4432沿环部4431的周向间隔设置有多个,延伸槽部4112与耳板部4432一一对应设置,以提高限位件443与吸盘座41的连接可靠性。Preferably, the thickness of the limiting
在本实施例中,限位件443由静电耗散材料制成,导电球441和弹性件442均由导体材料制成。In this embodiment, the limiting
如图2、图7及图17所示,吸附装置100还包括交接机构22,交接机构22用于交接基底300,将待曝光的基底300吸取至吸盘组件11上,或将曝光完成的基底300从吸盘11上移除,实现基底300曝光与前序或后续工序的交接。As shown in Fig. 2, Fig. 7 and Fig. 17, the
交接机构22包括底座21、托板23、垂向运动组件22和吸附组件。底座21用于支撑固定交接机构22,托板23设置在底座21上方,并通过垂向运动组件22与底座21连接,使托板23在垂向运动组件22的带动下沿垂直吸盘11的方向运动,以带动吸附组件沿垂直吸盘11的方向运动。The
吸盘11于最内侧的主吸附区111内开设有吸附孔114,吸附孔114沿吸盘11的厚度方向贯通吸盘11。吸附组件沿垂直于吸盘11的方向设置,其包括竖直设置的吸附柱24以及设置于吸附柱24的顶端的吸嘴25,吸附柱24的下端与托板23连接。吸附柱24与基底吸附面垂直,吸附柱24的上端能伸入吸附孔114中并能相对吸附孔114沿垂直于基底吸附面的方向运动,吸附柱24内开设有交接气道241,交接气道241的上端贯穿吸附柱24的上端面,交接气道241通过托板23与气源装置连通;吸嘴25设置在吸附柱24的上端且与交接气道241连通,吸嘴25的外表面能与吸附孔114的内壁密封贴合,且吸嘴25的上端高于吸附柱24的上端面。The
本实施例提供的交接机构2的结构以及交接机构2与吸盘11的对接结构基本与专利申请CN201820746378.X中的结构相同,仅吸嘴25和吸附柱24的设置存在差异,本实施例不再对交接机构2中与专利申请CN201820746378.X中相同的结构进行赘述。The structure of the
在本实施例中,吸嘴25的上端边缘向外翻折形成有折边部251,折边部251的设置,能够更好地使吸嘴25与吸附孔115的边缘贴合,对吸附孔115进行密封,从而增强吸附气密性。In this embodiment, the upper edge of the
优选地,在本实施例中,吸嘴25和吸附柱24均采用静电耗散材料制成,托板23以及底座21均采用导体材料制成,以使托板23和底座21形成导体结构,底座21进行接地处理。该种设置,能够在基底300交接过程中,将由摩擦产生的静电顺利引导出去,避免因为静电引发安全或者其他问题。Preferably, in this embodiment, both the
本实施例还提供一种光刻系统,包括上述的曝光装置,且本实施例提供的光刻系统,通过采用上述的曝光装置,提高了光刻设备对基底的适用性和翘曲容忍度,提高了光刻稳定性和光刻质量。This embodiment also provides a lithography system, including the exposure device described above, and the lithography system provided by this embodiment, by using the exposure device above, improves the applicability and warpage tolerance of the lithography equipment to the substrate, Improved photolithographic stability and photolithographic quality.
实施例二Embodiment two
如图18所示,本实施例二提供了一种曝光装置,包括曝光台200和吸附装置100,与实施例一相比,本实施例二提供的曝光装置与实施例一基本相同,不同之处在于吸盘组件11中的第一密封件12结构形式不同,本实施例仅对与实施例一不同的结构进行描述,不再对与实施例一相同的结构进行赘述。As shown in FIG. 18, the second embodiment provides an exposure device, including an exposure table 200 and an
在本实施例中,密封主体121的横截面为三角环形,三角环形的一侧边与卡接部122连接。该种设置,能够增强密封主体121的形变能力。优选地,三角环形的壁厚为0.2mm~0.5mm。In this embodiment, the cross section of the sealing
本实施例还提供一种光刻系统,包括上述的曝光装置,且本实施例提供的光刻系统,通过采用上述的曝光装置,提高了光刻设备对基底的适用性和翘曲容忍度,提高了光刻稳定性和光刻质量。This embodiment also provides a lithography system, including the exposure device described above, and the lithography system provided by this embodiment, by using the exposure device above, improves the applicability and warpage tolerance of the lithography equipment to the substrate, Improved photolithographic stability and photolithographic quality.
实施例三Embodiment Three
如图19所示,本实施例提供了一种曝光装置,且与实施例一相比,本实施例二提供的曝光装置与实施例一基本相同,不同之处在于吸盘组件11中的第一密封件12结构形式不同,本实施例仅对与实施例一不同的结构进行描述,不再对与实施例一相同的结构进行赘述。As shown in Figure 19, this embodiment provides an exposure device, and compared with Embodiment 1, the exposure device provided by this
在本实施例中,密封主体121的横截面优选为沿第一密封件12轴向方向延伸的折线形。即密封主体121包括多个依次相连的折线板部1211,在第一密封件12未受挤压时,相邻两个折线板部1211之间的夹角为60°~100°,且相邻两个折线板部1211采用圆弧过渡连接。该种第一密封件12结构,在第一密封件12受到挤压作用力时,相邻两个折线板部1211相互靠近,变形能力较强,能够减小基底300完全吸附所用的真空吸附压力大小。In this embodiment, the cross-section of the sealing
在本实施例中,密封主体121包括三个折线板部1211,且单个折线板部1211的板厚为0.3~0.5mm。在其他实施例中,密封主体121可以包括两个、四个或更多个折线板部1211,且折线板部1211的个数以及折线板部1211的板厚可以根据第一密封件12所需的变形能力自行设计。In this embodiment, the sealing
在本实施例中,优选地,位于第一密封件12最上端的折线板部1211在远离卡接部122的方向上沿第一密封件12的中心向外延伸,以使第一密封件12上端形成锥形开口,有利于提高基底300与第一密封件12的接触紧密性,防止真空泄漏。In this embodiment, preferably, the folded
本实施例还提供一种光刻系统,包括上述的曝光装置,且本实施例提供的光刻系统,通过采用上述的曝光装置,提高了光刻设备对基底的适用性和翘曲容忍度,提高了光刻稳定性和光刻质量。This embodiment also provides a lithography system, including the exposure device described above, and the lithography system provided by this embodiment, by using the exposure device above, improves the applicability and warpage tolerance of the lithography equipment to the substrate, Improved photolithographic stability and photolithographic quality.
实施例四Embodiment Four
本实施例提供了一种基底吸附方法,其采用实施例一、实施例二或实施例三中的吸附装置对基底300进行吸附。This embodiment provides a substrate adsorption method, which uses the adsorption device in Embodiment 1,
本实施例提供的基底吸附方法包括步骤:The substrate adsorption method provided in this embodiment comprises steps:
步骤S101:吸附柱24向上运动,使吸嘴25伸出基底吸附面;Step S101: the
步骤S102:基底传输机械手将基底300移动至交接机构2上,并使基底300与吸嘴25接触;Step S102: the substrate transfer robot moves the
步骤S103:对交接气道241进行抽真空,使吸嘴25吸附基底300;Step S103: Vacuum the
步骤S104:对交接气道241进行持续抽真空,基底300挤压吸嘴25,使吸嘴25变形,基底300与吸附柱24上端面接触,吸附柱24对基底300进行二次吸附;Step S104: Continuously evacuate the
步骤S105:基底传输机械手退回;Step S105: the substrate transfer manipulator returns;
步骤S106:吸附柱24带动基底300向下运动,直至基底300与第一密封件12接触,对主吸附区111进行抽真空,使吸盘11、吸附柱24和吸嘴25同时对基底300进行吸附;Step S106: The
步骤S107:吸附柱24带动基底300继续向下运动,以使基底300、第一密封件12与吸盘11形成密封吸附腔;Step S107: the
步骤S108:吸附柱24继续带动基底300向下运动,直至吸嘴25落入吸附孔115最低处后,吸附柱24停止运动,且停止对交接气道241的抽真空;Step S108: the
步骤S109:继续对吸盘11主吸附区抽真空,直至第一密封件12完全压入第一密封槽113中,且基底300主体区域被吸盘11完全吸附;Step S109: continue to vacuumize the main adsorption area of the
步骤S110:停止对主吸附区111进行抽真空后,对边缘吸附区112进行抽真空处理,直至第二密封件13完全缩回至第二密封槽114中。Step S110 : After stopping the vacuuming of the
注意,上述仅为本发明的较佳实施例及所运用技术原理。本领域技术人员会理解,本发明不限于这里所述的特定实施例,对本领域技术人员来说能够进行各种明显的变化、重新调整和替代而不会脱离本发明的保护范围。因此,虽然通过以上实施例对本发明进行了较为详细的说明,但是本发明不仅仅限于以上实施例,在不脱离本发明构思的情况下,还可以包括更多其他等效实施例,而本发明的范围由所附的权利要求范围决定。Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention, and the present invention The scope is determined by the scope of the appended claims.
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