CN115458512A - Encapsulation structure and encapsulation method thereof - Google Patents

Abstract

The invention provides a packaging structure and a packaging method, wherein the packaging structure comprises: a package base comprising a first interconnect structure; the elastic supporting piece is covered on one side of the packaging base and comprises a plurality of through holes, and the first interconnection structure is exposed out of the through holes; the photosensitive chip is arranged on one side, away from the packaging base, of the elastic supporting piece and is electrically connected with the first interconnection structure through the through holes; and the external plastic package layer is used for plastically packaging the photosensitive chip and the elastic support piece on the package base, the external plastic package layer comprises a hollow area, and the photosensitive area of the photosensitive chip is exposed from the hollow area. The elastic support of the elastic support piece for the photosensitive chip is used for dispersing external force applied to the photosensitive chip in the process of injection molding and packaging of the photosensitive chip, and the problem of pressure damage is solved.

Description

Encapsulation structure and encapsulation method thereof

technical field

The invention belongs to the technical field of semiconductor packaging, in particular to a packaging structure and a packaging method thereof.

Background technique

A photosensitive chip is an electronic device that can sense external light and convert it into electrical signals. Taking CMOS (CMOS Image Sensor, CIS) chips as an example, they are widely used in camera and video recording systems such as smartphones, security systems, and auto-driving cars. The CIS chip is usually manufactured using a semiconductor manufacturing process, and then a package structure is formed by performing a series of packaging processes on the CIS chip.

However, most of the existing CIS chips are packaged by injection molding during the processing and production process. For the CIS chips packaged by this packaging method, the ejector pins of the plastic packaging mold are in direct contact with the chip, and the ejector pins are easy to cause damage. The glass sheet is crushed under pressure, and the molding compound overflows, thereby causing the disadvantages of low chip yield and high packaging cost. Therefore, the effect of packaging the CIS chip is poor.

In addition, the packaging structure of the existing CIS chip is relatively large, which does not conform to the trend of thinner and thinner design of electronic equipment.

In view of this, it is necessary to optimize and improve the above packaging process to overcome the problems of fragile chips, low yield and poor packaging effect caused by the existing injection molding packaging.

Contents of the invention

The problem to be solved by the present invention is how to improve the problems of low packaging yield and poor package effect caused by easily broken pieces of photosensitive chips and overflow of plastic packaging materials in the existing injection molding packaging process, and at the same time, meet the trend of small-volume packaging of photosensitive chips.

In order to solve the above problems, the technical solution of the present invention provides a packaging structure, the packaging structure includes: a packaging base, the packaging base includes a first interconnection structure; an elastic support member, the elastic support member covers the On one side of the packaging base, the elastic support includes a plurality of through holes, the first interconnection structure is exposed from the plurality of through holes; a photosensitive chip, the photosensitive chip is mounted on the elastic support On the side away from the packaging base, the photosensitive chip is electrically connected to the first interconnection structure through the plurality of through holes; and an outer plastic sealing layer, the outer plastic sealing layer encapsulates the photosensitive chip and the elastic The supporting member is on the packaging base, the outer plastic sealing layer includes a hollow area, and the photosensitive area of the photosensitive chip is exposed from the hollow area.

As an optional technical solution, the packaging base includes: a substrate; an active chip disposed on one side of the substrate and electrically connected to the substrate; a transfer layer, the transfer layer The connection layer is arranged between the first interconnection structure and the active chip, the transfer layer includes a plurality of conductive columns, and the opposite ends of each conductive column are respectively electrically connected to the first interconnection structure and the active chip.

As an optional technical solution, the first interconnection structure is a redistribution layer, and the redistribution layer includes a plurality of first connection pads, and the plurality of first connection pads correspond to the plurality of through holes one by one.

As an optional technical solution, the packaging base further includes an inner plastic sealing layer, and the inner plastic sealing layer plastic seals the active chip and the transfer layer onto the substrate; wherein, the rewiring layer is disposed on On the inner plastic sealing layer, the plurality of second connection pads on the rewiring layer are electrically connected to one end exposed from the inner plastic sealing layer, and the plurality of second connection pads and the plurality of The first connection pads are located on opposite side surfaces of the redistribution layer.

As an optional technical solution, the packaging base further includes an intermediate molding layer, and the intermediate molding layer molds the rewiring layer and the inner molding layer onto the substrate; wherein, the plurality of first connection pads It is exposed from the side of the middle plastic sealing layer away from the substrate.

As an optional technical solution, the elastic supporting member is disposed above the intermediate plastic sealing layer, and at least a part of the elastic supporting member is not in direct contact with the intermediate plastic sealing layer.

As an optional technical solution, the elastic supporting member includes a side wall protruding toward the substrate, the side wall is located outside the middle plastic encapsulation layer, and an edge of the side wall is fixedly connected to the substrate.

As an optional technical solution, a second interconnection structure is provided on the surface of the active chip facing the transfer layer, and the second interconnection structure is electrically connected to the opposite end of each via column. .

As an optional technical solution, a transparent isolation layer is further included, and the transparent isolation layer covers at least the photosensitive area.

The present invention also provides a packaging method for photosensitive chip packaging, the packaging method comprising:

preparing a package base, the package base including a first interconnection structure;

Assembling an elastic support to one side of the packaging base, the elastic support includes a plurality of through holes;

attaching the photosensitive chip to the side of the elastic support away from the package base, and bonding the photosensitive chip and the first interconnection structure;

Forming a transparent isolation layer on one side of the photosensitive area of the photosensitive chip to obtain a unit to be plastic-encapsulated;

A plastic sealing mold is provided, the plastic sealing mold includes an upper mold, a lower mold and a ejector rod adapted to each other, the upper mold and the lower mold jointly define a plastic sealing cavity, and the ejector pin is at least partially located in the plastic sealing cavity;

Loading the unit to be molded into the molded cavity, the ejector pin contacts the transparent isolation layer and is opposite to the photosensitive area;

providing a molding compound and injecting it into the molding cavity to form an outer molding layer for molding the photosensitive chip and the elastic support frame to the packaging base;

The plastic encapsulation mold is removed, the outer plastic encapsulation layer forms a hollow part on one side of the photosensitive area, and the photosensitive area is located in the hollow part, so as to obtain the packaging structure of the photosensitive chip.

As an optional technical solution, the method further includes: coating a transparent adhesive layer on one side of the photosensitive area to form the transparent isolation layer.

As an optional technical solution, the step of preparing the package base further includes: providing a substrate and an active chip; attaching the active chip to the substrate, and bonding the active chip and the substrate to carry out electrical connection; forming a second interconnection structure on the active chip; providing a transfer layer, the transfer layer is flip-chip bonded on the second interconnection structure; providing a plastic encapsulant to form the The active chip, the second interconnection structure, and the transfer layer are plastic-sealed to the inner plastic layer on the substrate; the first interconnection structure is fabricated on the inner plastic layer, and the first interconnection The structure is electrically connected to the transfer layer; a molding compound is provided to form an intermediate molding layer for molding the first interconnection structure onto the substrate to obtain the packaging base; wherein the transfer layer It includes a plurality of conducting columns, and opposite ends of each conducting column are electrically connected to the second interconnection structure and the first interconnection structure respectively.

Compared with the prior art, the present invention provides a packaging structure and a packaging method. An elastic support is covered on the package base, and the elastic support is used to provide a mounting area for the photosensitive chip, and the through hole on the elastic support is used to The design realizes the electrical connection between the package base and the photosensitive chip. Among them, the elastic support of the photosensitive chip by the elastic support is used to disperse the external force applied to the photosensitive chip in the injection molding process of packaging the photosensitive chip, overcome the problems of crushing and debris, and have a significant beneficial effect on improving the packaging yield. In addition, the various components in the package base are stacked and arranged on the substrate, therefore, the package volume of the package structure can be effectively reduced, which conforms to the trend of package miniaturization and integration.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

FIG. 1 is a schematic side view of a packaging structure provided in an implementation of the present invention.

FIG. 2 is a schematic side view of the manufacturing process of the package base in FIG. 1 .

FIG. 3 is a schematic side view of the connection between the elastic support member and the package base in FIG. 1 .

FIG. 4 is a schematic side view of the photosensitive chip in FIG. 1 attached to the elastic support.

FIG. 5 is a schematic side view of plastically encapsulating the photosensitive chip and the elastic supporting member on the package base in FIG. 1 .

FIG. 6 is a flowchart of a packaging method provided in another embodiment of the present invention.

detailed description

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

As shown in FIG. 1 , one of the objectives of the present invention is to provide a package structure 100, which includes a package base, an elastic support 20, a photosensitive chip 30 and an external plastic packaging layer 40, wherein the package base includes a first interconnection Structure 11; the elastic support member 20 is covered on one side of the package base, the elastic support member includes a plurality of through holes 21, and the first interconnection structure 11 is exposed from the plurality of through holes 21; the photosensitive chip is arranged on the elastic support member 20 away from the package One side of the base, and the photosensitive chip 20 is electrically connected to the first interconnection structure 11 through several through holes 21; the outer plastic sealing layer 40 plastically seals the photosensitive chip 30 and the elastic support member 20 to the packaging base, and the outer plastic sealing layer 40 includes The hollow area 41 , the photosensitive area 31 of the photosensitive chip 30 is exposed from the hollow area 41 .

In the packaging structure 100 provided by the present invention, during the plastic sealing process of the outer plastic sealing layer 40, the photosensitive chip 30 is elastically supported by the elastic support member 20 to offset the pressure exerted by the plastic sealing mold on the photosensitive chip 30, which can effectively prevent the photosensitive chip 30 from crushed.

As shown in FIG. 1 , there is a gap S between the elastic support member 20 and the package base, and the gap S is used to buffer the pressure exerted by the plastic sealing mold on the photosensitive chip 30 , thereby effectively overcoming the pressure damage of the photosensitive chip 30 and preventing the chip from breaking. .

In a preferred embodiment, the elastic supporting member 20 is, for example, a plastic cover or the like.

In a preferred embodiment, at least a partial area of the elastic supporting member 20 is not in contact with the package base, thereby defining a gap between the elastic support member 20 and the package base for providing a cushioning effect.

As shown in Figures 1 and 2, the package base includes a stacked substrate 10, an active chip 12, a transfer layer 13, and a first interconnection structure 11, and the active chip 12 is attached to the substrate 10 through a mounting material. On the side surface, the metal wire 122 is electrically connected to the substrate 10; the transfer layer 13 is arranged between the first interconnection structure 11 and the active chip 12, and the transfer layer 13 includes a plurality of conductive columns 131, each of which is connected Two opposite ends of the column 131 are electrically connected to the first interconnection structure 11 and the active chip 12 respectively.

In this embodiment, a second interconnection structure 121 is provided on the surface of the active chip 12 close to the transfer layer 13. The second interconnection structure 121 is, for example, a plurality of tin pillars formed by stencil printing. Each tin pillar The other end opposite to each corresponding conducting column 131 is electrically connected. Preferably, the size of the several tin pillars is, for example, 60-80 microns.

In addition, in other embodiments of the present invention, the second interconnection structure may also be a rewiring layer formed on the active chip, and the electrical connection is realized between the rewiring layer and the transfer layer.

Furthermore, the transfer layer 13 is, for example, a TSV (Through-Silicon Via) silicon transfer board, and the plurality of conductive columns 131 are, for example, metal columns embedded in the silicon substrate. The metal columns are preferably copper columns, and the opposite ends of the copper columns are Expose from the two opposite surfaces of the silicon substrate to realize electrical connection with the first interconnection structure 11 and the second interconnection structure 121, and input the photoelectric signal in the photosensitive chip 30 into the active chip 12, after processing Afterwards, it is output outside through the substrate 10 .

In this embodiment, the silicon interposer is flip-chip bonded to the second interconnection structure 121 .

In a preferred embodiment, the photosensitive chip 30 may specifically be a CIS chip for converting the sensed light signal into an electrical signal. The active chip 12 may specifically include a digital signal processing (Digital Signal Process, DSP) chip for processing the electrical signal converted by the photosensitive chip 30 .

Continuing to refer to FIG. 1 and FIG. 2, the first interconnection structure 11 of the package base is, for example, a rewiring layer, and the rewiring layer is laminated on the top of the transfer layer 13, and the rewiring layer includes, for example, multiple layers of alternately arranged metal layers and layers The interlayer dielectric layer, any adjacent metal layer is electrically connected through the via hole on the interlayer dielectric layer.

In this embodiment, the two opposite surfaces of the rewiring layer respectively include a plurality of first connection pads 111 and a plurality of second connection pads 112, wherein the plurality of first connection pads 111 correspond to the plurality of through holes 21, and are formed from the plurality of through holes 21. The hole 21 is exposed; the plurality of second connection pads 112 corresponds to one end of the plurality of conducting columns 131 . The first connection pad 111 and the second connection pad 112 are, for example, metal pads such as copper pads, tin balls, and tin pillars.

The rewiring layer is formed on the surface of the inner plastic sealing layer 14 of the package base away from the substrate 10. The inner plastic sealing layer 14 is used to plastic seal the transfer layer 13, the active chip 12 to the substrate 10, and the inner plastic sealing layer 14 is the rewiring layer. The production provides a platform. The internal plastic encapsulation layer 14 includes an opening 141 corresponding to the via 131 of the transfer layer 13 , and the via 131 is exposed from the opening 141 and is electrically connected to the second connection pad 112 in the redistribution layer.

In addition, the substrate 10, the active chip 12, the transfer layer 13 and the first interconnection structure are sequentially stacked in the package base, which can be used to reduce the package volume, thereby meeting the requirements of package miniaturization and integration.

Continuing to refer to FIG. 1 and FIG. 2 , an intermediate plastic sealing layer 15 is also included above the rewiring layer, and the middle plastic sealing layer 15 is used to mold the rewiring layer to the inner plastic sealing layer 14 to improve the stability of the package base, so that the rewiring layer and the The electrical connection stability between the transfer layers 13 is improved.

As shown in FIG. 3 , the fixed connection of the elastic support 20 to the substrate 10 includes: reserving a groove 101 on the substrate 10, and coating the glue in the groove 101; The edge part is inserted into the groove 101 , and the adhesive is cured to realize the fixed connection between the elastic support member 20 and the substrate 10 .

Wherein, the side wall 22 of the elastic supporting member 20 is surrounded by the outside of the middle plastic sealing layer 15, and is not in contact with the middle plastic sealing layer 15; contact; thereby forming a gap S between the elastic support and the package base. Wherein, the side wall 22 is disposed around the periphery of the top wall 23 , and the top wall 23 is opposite to the redistribution layer.

In other embodiments of the present invention, a gap is preferably formed between the top wall of the elastic support and the rewiring layer. The main reason is that the photosensitive chip 30 is arranged above the top wall 23 corresponding to the rewiring layer (as shown in FIG. 4 ). 5), when the gap is located below the corresponding photosensitive area 31, the force of the push rod 600 can be better buffered to avoid the problems of crushing and fragmentation.

Continuing to refer to FIG. 3 , there is a protruding shoulder at the junction between the edge of the top wall 23 and the side wall 22 . The surface of the shoulder is higher than the surface of the top wall 23 . Wherein, several through holes 21 are formed on the top wall 23, located in the above-mentioned chip loading area.

As shown in FIG. 4 , loading the photosensitive chip 30 into the above-mentioned loading area includes that the photosensitive chip 30 is mounted on the top wall 23 through the mounting material, and the photosensitive chip 30 is connected to the first interconnection structure 11 by wire bonding. , wherein one end of the metal wire 33 is electrically connected to the pin on the photosensitive chip 30 , and the other end of the metal wire 33 is electrically connected to the first connection pad 111 on the first interconnection structure through the corresponding through hole 21 .

It should be noted that, in other embodiments of the present invention, the photosensitive chip can also be electrically connected to the first interconnection structure through other structures, for example, another rewiring layer is formed between the photosensitive chip and the top wall, and the rewiring layer pair The through hole includes a plurality of tin pillars, and the plurality of tin pillars pass through the through hole and are electrically connected to the first interconnection structure, and then the other side of the wiring layer is electrically connected to the photosensitive chip.

Continuing to refer to FIG. 4 , the side of the photosensitive chip 30 away from the substrate 10 includes a photosensitive area 31 , and the top of the photosensitive area 31 is covered with a transparent isolation layer 32 . The transparent isolation layer 32 is used to prevent the photosensitive area 31 from being directly exposed to the external environment, which affects the product life. The transparent isolation layer 32 may be transparent glue or other transparent films.

As shown in FIG. 1, FIG. 4 and FIG. 5, forming an external plastic sealing layer 40 on the outside of the photosensitive chip 30 and the elastic support member 20 includes:

The unit to be molded including the package base, the elastic support 20 and the photosensitive chip 30 is placed in the mold cavity 500 of the mold, wherein the mold cavity 500 is located between the upper mold 300 and the lower mold 200, and the unit to be molded is, for example, carried on On the side of the lower mold 200, the ejector pin 600 is used to provide a pushing force to the molding cavity 500, push the molding compound 400 into the molding chamber 500, and cover the elastic support member 20 and the photosensitive chip 30, wherein the ejector pin 600 contacts The transparent isolation layer 32 above the photosensitive chip 30 is used to form a hollow portion 41 in the outer plastic layer 40 formed by curing the molding compound 400 . The photosensitive area 31 is located in the hollow portion 41 and exposed to receive external light.

It can be seen from FIG. 5 that when the ejector pin 600 pushes the mold compound 400 and moves toward the mold cavity 500, the force exerted on the photosensitive chip 30 by the movement of the mold compound 400 and the force exerted by the ejector pin 600 in contact with the photosensitive chip 30 can pass through The deformation of the elastic support 20 below it is used for buffering. Preferably, the gap S between the elastic support 20 and the packaging base is used for buffering and absorption, so as to effectively relieve the external force on the photosensitive chip 30 and overcome the problems of crushing and debris. There is an obvious beneficial effect in improving the packaging yield.

As shown in FIG. 6 , the present invention also provides a packaging method 1000 suitable for the packaging of photosensitive chips, which is used to effectively reduce chip damage and achieve the technical effect of small-volume packaging.

Packaging method 1000 includes:

Prepare a packaging base, the packaging base includes a first interconnection structure;

Assembling the elastic support to one side of the packaging base, the elastic support includes a plurality of through holes;

Mounting the photosensitive chip to the side of the elastic support away from the package base, bonding the photosensitive chip and the first interconnection structure;

A transparent isolation layer is formed on the side of the photosensitive area of the photosensitive chip to obtain a unit to be plastic-encapsulated;

A plastic sealing mold is provided, the plastic sealing mold includes an upper mold, a lower mold and a ejector rod adapted to each other, the upper mold and the lower mold jointly define a plastic sealing cavity, and the ejector pin is at least partially located in the plastic sealing cavity;

Loading the unit to be molded into the molded cavity, the ejector pin contacts the transparent isolation layer and is opposite to the photosensitive area;

providing a molding compound and injecting it into the molding cavity to form an outer molding layer for molding the photosensitive chip and the elastic support frame to the packaging base; and

The plastic encapsulation mold is removed, the outer plastic encapsulation layer forms a hollow part on one side of the photosensitive area, and the photosensitive area is located in the hollow part, so as to obtain the packaging structure of the photosensitive chip.

In a preferred embodiment, the transparent isolation layer is formed by coating a transparent adhesive layer on one side of the photosensitive region.

In a preferred embodiment, the step of preparing the package base further includes: providing a substrate and an active chip; attaching the active chip to the substrate, bonding the active chip and the substrate for electrical connection; A second interconnection structure is formed on the chip; a transfer layer is provided, and the transfer layer is flip-chip bonded on the second interconnection structure; a plastic encapsulant is provided to form the active chip, the second interconnection structure and the transfer layer. An internal plastic sealing layer on the substrate; a first interconnection structure is fabricated on the internal plastic sealing layer, and the first interconnection structure is electrically connected to the transfer layer; a plastic sealing compound is provided to form a plastic sealing of the first interconnection structure on the substrate The middle plastic sealing layer is used to make the packaging base; wherein, the transfer layer includes a plurality of conducting columns, and the opposite ends of each conducting column are respectively electrically connected to the second interconnection structure and the first interconnection structure.

To sum up, the present invention provides a packaging structure and packaging method. An elastic support is provided on the package base, and the elastic support is used to provide a mounting area for the photosensitive chip, and the through-hole design on the elastic support is used to realize the The electrical connection between the seat and the photosensitive chip. Among them, the elastic support of the photosensitive chip by the elastic support is used to disperse the external force applied to the photosensitive chip in the injection molding process of packaging the photosensitive chip, overcome the problems of crushing and debris, and have a significant beneficial effect on improving the packaging yield. In addition, the various components in the package base are stacked and arranged on the substrate, therefore, the package volume of the package structure can be effectively reduced, which conforms to the trend of package miniaturization and integration. The present invention has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as there is no conflict with each other. It must be pointed out that the present invention can also have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these Corresponding changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (12)

1. A package structure, characterized in that, the package structure comprises: a package base including a first interconnect structure; an elastic support member, the elastic support member is covered on one side of the packaging base, the elastic support member includes a plurality of through holes, and the first interconnection structure is exposed from the plurality of through holes; A photosensitive chip, the photosensitive chip is arranged on the side of the elastic support away from the package base, and the photosensitive chip is electrically connected to the first interconnection structure through the plurality of through holes; and An outer plastic sealing layer, the outer plastic sealing layer plastic-seals the photosensitive chip and the elastic support member on the packaging base, the outer plastic sealing layer includes a hollowed out area, and the photosensitive area of the photosensitive chip is formed from the hollowed out area exposed. 2. The package structure according to claim 1, wherein the package base comprises: Substrate; an active chip, the active chip is disposed on one side surface of the substrate and is electrically connected to the substrate; A transfer layer, the transfer layer is arranged between the first interconnection structure and the active chip, the transfer layer includes a plurality of conduction columns, and the opposite ends of each conduction column are respectively electrically connected to each other. Connecting the first interconnection structure and the active chip. 3. The packaging structure according to claim 2, wherein the first interconnection structure is a rewiring layer, and the rewiring layer includes a plurality of first connection pads, and the plurality of first connection pads and the Several through holes correspond to each other. 4. The packaging structure according to claim 3, wherein the packaging base further comprises an inner plastic sealing layer, and the inner plastic sealing layer plastic seals the active chip and the transfer layer onto the substrate; Wherein, the rewiring layer is disposed on the inner plastic sealing layer, and the plurality of second connection pads on the rewiring layer are electrically connected to one end exposed from the inner plastic sealing layer. The plurality of second connection pads and the plurality of first connection pads are located on opposite side surfaces of the redistribution layer. 5. The package structure according to claim 4, wherein the package base further comprises an intermediate plastic sealing layer, and the intermediate plastic sealing layer plastic seals the rewiring layer and the inner plastic sealing layer onto the substrate; Wherein, the plurality of first connection pads are exposed from a side of the middle plastic encapsulation layer away from the substrate. 6 . The packaging structure according to claim 5 , wherein the elastic support is disposed above the intermediate plastic encapsulation layer, and at least a part of the elastic support is not in direct contact with the intermediate plastic encapsulation layer. 7. The packaging structure according to claim 6, wherein the elastic supporting member comprises a side wall protruding toward the substrate, the side wall is located outside the middle plastic sealing layer, and the side wall of the side wall The edge is fixedly connected with the base plate. 8. The packaging structure according to claim 2, wherein a second interconnection structure is provided on the surface of the active chip facing the transition layer, and the second interconnection structure and each lead The opposite end of the through post is electrically connected. 9 . The packaging structure according to claim 1 , further comprising a transparent isolation layer, the transparent isolation layer covering at least the photosensitive area. 10. A packaging method for photosensitive chip packaging, characterized in that the packaging method comprises: preparing a package base, the package base including a first interconnection structure; Assembling an elastic support to one side of the packaging base, the elastic support includes a plurality of through holes; attaching the photosensitive chip to the side of the elastic support away from the package base, and bonding the photosensitive chip and the first interconnection structure; Forming a transparent isolation layer on one side of the photosensitive area of the photosensitive chip to obtain a unit to be plastic-encapsulated; A plastic sealing mold is provided, the plastic sealing mold includes an upper mold, a lower mold and a ejector rod adapted to each other, the upper mold and the lower mold jointly define a plastic sealing cavity, and the ejector pin is at least partially located in the plastic sealing cavity; Loading the unit to be molded into the molded cavity, the ejector pin contacts the transparent isolation layer and is opposite to the photosensitive area; providing a molding compound and injecting it into the molding cavity to form an outer molding layer for molding the photosensitive chip and the elastic support frame to the packaging base; The plastic encapsulation mold is removed, and the outer plastic encapsulation layer forms a hollow part on one side of the photosensitive area, and the photosensitive area is located in the hollow part, so as to obtain the packaging structure of the photosensitive chip. 11. The packaging method according to claim 10, further comprising: Applying a transparent adhesive layer to one side of the photosensitive area to form the transparent isolation layer. 12. The packaging method according to claim 10, wherein the step of preparing the packaging base further comprises: Provide substrates and active chips; Mounting the active chip on the substrate, bonding the active chip to the substrate for electrical connection; forming a second interconnect structure on the active chip; providing a transfer layer, and flip-chip bonding the transfer layer on the second interconnection structure; providing a molding compound to form an inner molding layer for molding the active chip, the second interconnection structure, and the transfer layer onto the substrate; Fabricating the first interconnection structure on the inner plastic encapsulation layer, the first interconnection structure is electrically connected to the transition layer; providing a molding compound to form an intermediate molding layer for molding the first interconnection structure onto the substrate to obtain the packaging base; Wherein, the transfer layer includes a plurality of conducting columns, and opposite ends of each conducting column are electrically connected to the second interconnection structure and the first interconnection structure respectively.

Images