[go: up one dir, main page]

CN115446407B - Brazing method of high-volume-fraction SiCp/Al-based composite material and AlN ceramic - Google Patents

Brazing method of high-volume-fraction SiCp/Al-based composite material and AlN ceramic Download PDF

Info

Publication number
CN115446407B
CN115446407B CN202211075729.6A CN202211075729A CN115446407B CN 115446407 B CN115446407 B CN 115446407B CN 202211075729 A CN202211075729 A CN 202211075729A CN 115446407 B CN115446407 B CN 115446407B
Authority
CN
China
Prior art keywords
brazing
based composite
composite material
sicp
aln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202211075729.6A
Other languages
Chinese (zh)
Other versions
CN115446407A (en
Inventor
李文文
陈波
李思思
邹文江
冯洪亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AECC Beijing Institute of Aeronautical Materials
Original Assignee
AECC Beijing Institute of Aeronautical Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AECC Beijing Institute of Aeronautical Materials filed Critical AECC Beijing Institute of Aeronautical Materials
Priority to CN202211075729.6A priority Critical patent/CN115446407B/en
Publication of CN115446407A publication Critical patent/CN115446407A/en
Application granted granted Critical
Publication of CN115446407B publication Critical patent/CN115446407B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/085Cooling, heat sink or heat shielding means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

本发明涉及一种高体积分数SiCp/Al基复合材料与AlN陶瓷的钎焊方法,包括:首先在AlN陶瓷表面利用AgCuTi活性钎料进行金属化;然后利用AlCuSi或AluSiMg钎料将AlN陶瓷金属化表面与SiCp/Al基复合材料进行真空加压钎焊连接,实现高体积分数SiCp/Al基复合材料与AlN陶瓷的异质连接。本发明解决了现有的高体积分数SiCp/Al基复合材料焊接质量差、表面金属化工艺复杂的问题,可满足大功率电子封装领域高体积分数SiCp/Al基复合材料与AlN陶瓷的钎焊需求。

The present invention relates to a brazing method of a high volume fraction SiCp/Al-based composite material and AlN ceramics, comprising: firstly, metallizing the AlN ceramic surface with AgCuTi active brazing filler metal; then vacuum pressurizing brazing the AlN ceramic metallized surface with the SiCp/Al-based composite material with AlCuSi or AluSiMg brazing filler metal, thereby achieving heterogeneous connection of the high volume fraction SiCp/Al-based composite material and the AlN ceramic. The present invention solves the problems of poor welding quality and complex surface metallization process of the existing high volume fraction SiCp/Al-based composite material, and can meet the brazing requirements of high volume fraction SiCp/Al-based composite materials and AlN ceramics in the field of high-power electronic packaging.

Description

一种高体积分数SiCp/Al基复合材料与AlN陶瓷的钎焊方法A brazing method for high volume fraction SiCp/Al-based composite material and AlN ceramics

技术领域Technical Field

本发明属于陶瓷/铝基复合材料异种材料连接技术领域,涉及一种高体积分数碳化硅颗粒增强铝基复合材料(SiCp/Al基复合材料)与氮化铝(AlN)陶瓷的钎焊方法。The invention belongs to the technical field of ceramic/aluminum-based composite material dissimilar material connection, and relates to a brazing method for a high volume fraction silicon carbide particle reinforced aluminum-based composite material (SiCp/Al-based composite material) and aluminum nitride (AlN) ceramic.

背景技术Background Art

高体积分数(本领域中一般认为体积分数在55%以上,更进一步地在55%-70%范围即为高体积分数)碳化硅颗粒增强铝基复合材料(SiCp/Al基复合材料)以其低膨胀系数、高热导率和低密度等优异性能,在航空航天光电控制系统精密零部件以及微电子封装器件的制造中有重要应用。氮化铝(AlN)陶瓷凭借其导热系数高、介电常数低,热膨胀系数与芯片相匹配等特点,常被用作高密度、大功率电子封装的散热基板。因此,在电子封装领域,高体积分数碳化硅颗粒增强铝基复合材料与氮化铝陶瓷的连接有特定的应用需求。High volume fraction (in this field, it is generally considered that the volume fraction is above 55%, and further in the range of 55%-70% is a high volume fraction) silicon carbide particle reinforced aluminum-based composite materials (SiCp/Al-based composite materials) have important applications in the manufacture of precision parts for aerospace optoelectronic control systems and microelectronic packaging devices due to their excellent properties such as low expansion coefficient, high thermal conductivity and low density. Aluminum nitride (AlN) ceramics are often used as heat dissipation substrates for high-density, high-power electronic packaging due to their high thermal conductivity, low dielectric constant, and thermal expansion coefficient matching the chip. Therefore, in the field of electronic packaging, there are specific application requirements for the connection of high volume fraction silicon carbide particle reinforced aluminum-based composite materials and aluminum nitride ceramics.

目前,钎焊普通低体积分数(一般低于20%)颗粒增强铝基复合材料基本上沿用钎焊铝合金的钎料或者将其表面金属化后再进行钎焊。但常规铝合金钎料对高体积分数颗粒增强铝基复合材料并不适用,表面金属化也不能获得很好的钎焊性能。这是因为:(1)高体积分数的SiC颗粒增强铝基复合材料,会在复合材料表面裸露大量的SiC颗粒,而SiC颗粒很难被常规金属钎料所润湿;(2)铝基复合材料表面存在的氧化膜,同样导致润湿性差。因此,对于高体积分数的SiC颗粒增强铝基复合材料,尤其当SiC体积分数比较大时(一般大于50%),此种材料的钎焊非常困难。At present, the brazing of ordinary low volume fraction (generally less than 20%) particle reinforced aluminum-based composite materials basically uses the brazing filler metal of aluminum alloy or metallizes the surface before brazing. However, conventional aluminum alloy brazing filler metals are not suitable for high volume fraction particle reinforced aluminum-based composite materials, and surface metallization cannot obtain good brazing performance. This is because: (1) High volume fraction SiC particle reinforced aluminum-based composite materials will expose a large number of SiC particles on the surface of the composite material, and SiC particles are difficult to be wetted by conventional metal brazing fillers; (2) The oxide film on the surface of the aluminum-based composite material also leads to poor wettability. Therefore, for high volume fraction SiC particle reinforced aluminum-based composite materials, especially when the SiC volume fraction is relatively large (generally greater than 50%), the brazing of this material is very difficult.

针对高体积分数的SiC颗粒增强铝基复合材料,很大一部分研究工作集中在软钎焊领域,雷玉珍等(焊接,2016(3):14-17)采用Sn3.0Ag0.7Cu钎料对表面电镀后的增强相体积分数为45%的SiCp/2024Al复合材料和表面化学镀铜后的SiC陶瓷在260℃下进行软钎焊,被焊材料表面镀铜后,润湿性良好,断裂部位发生在铝基复合材料与电镀铜结合处。A large part of the research work on aluminum-based composites reinforced with high volume fraction SiC particles has been concentrated in the field of soft soldering. Lei Yuzhen et al. (Welding, 2016(3): 14-17) used Sn3.0Ag0.7Cu solder to solder SiCp/2024Al composites with a volume fraction of 45% of the reinforcing phase after surface electroplating and SiC ceramics after surface chemical copper plating at 260°C. After copper plating on the surface of the welded materials, the wettability was good and the fracture occurred at the junction of the aluminum-based composite material and the electroplated copper.

由于润湿性差,多数研究工作都包括钎焊时表面处理技术,陶瓷的预金属化方法即表面金属化方法有物理气相沉积(PVD)、化学气相沉积工艺(CVD)、热喷涂法,化学沉积法、超声波法和等离子注入法等,但工艺复杂,限制了产业化应用。Due to poor wettability, most research work includes surface treatment technology during brazing. The pre-metallization method of ceramics, that is, the surface metallization method, includes physical vapor deposition (PVD), chemical vapor deposition (CVD), thermal spraying, chemical deposition, ultrasonic method and plasma implantation, etc. However, the process is complicated, which limits its industrial application.

超声波辅助钎焊方法,通过超声波振动,去除表面氧化膜,在大气环境下不使用钎剂实现对陶瓷的润湿(张洋,高体积分数SiC颗粒增强铝基复合材料的超声波钎焊,焊接,2008,(8)29-31)。The ultrasonic assisted brazing method uses ultrasonic vibration to remove the surface oxide film and achieves wetting of ceramics in an atmospheric environment without using a brazing flux (Zhang Yang, Ultrasonic brazing of high volume fraction SiC particle reinforced aluminum matrix composites, Welding, 2008, (8) 29-31).

加压真空钎焊,牛济泰等(Vacuum brazing of aluminium metal matrixcomposite(55vol%SiCp/A356)using aluminium-based filler alloy,MaterialsScience and Engineering B,2012,177:1707-1711)研究了含55%体积分数SiC颗粒的铝基复合材料的真空钎焊,通过施加压力以及在钎料中添加Mg、Ti、Ni等元素提高钎焊性能。Pressurized vacuum brazing. Niu Jitai et al. (Vacuum brazing of aluminium metal matrix composite (55 vol% SiCp/A356) using aluminium-based filler alloy, Materials Science and Engineering B, 2012, 177: 1707-1711) studied the vacuum brazing of aluminium-based composite materials containing 55 volume% SiC particles, and improved the brazing performance by applying pressure and adding elements such as Mg, Ti, and Ni to the brazing filler.

而活性元素钎焊法,在钎料合金中加入活性元素如Ti、Zr、Hf、Nb、Cr、Mg、V等,通过化学反应使陶瓷表面产生分解,形成反应层,可以被金属润湿,这种钎焊方法工艺简单,成本低、焊接应力小,是目前应用前景十分广阔的方法。王鹏等(高体积比SiCp/6063Al复合材料的铝基钎料制备及钎焊工艺研究,材料导报B:研究篇,2017,31:69-90)采用快速甩带技术制备了(Al-10Si-20Cu-0.05Ce)-1Ti急冷箔状钎料,并对60%体积分数的SiCp/6063Al复合材料进行真空钎焊实验,在590℃保温30min钎焊规范下获得剪切强度为112.6MPa。The active element brazing method adds active elements such as Ti, Zr, Hf, Nb, Cr, Mg, V, etc. to the brazing alloy, decomposes the ceramic surface through chemical reaction, forms a reaction layer, and can be wetted by metal. This brazing method is simple in process, low in cost, and has low welding stress. It is a method with broad application prospects. Wang Peng et al. (Preparation and brazing process of aluminum-based brazing material for high volume ratio SiCp/6063Al composite material, Materials Guide B: Research, 2017, 31: 69-90) prepared (Al-10Si-20Cu-0.05Ce)-1Ti quenched foil brazing material by fast stripping technology, and carried out vacuum brazing experiments on SiCp/6063Al composite material with a volume fraction of 60%, and obtained a shear strength of 112.6MPa under the brazing specification of 590℃ insulation for 30min.

关于AlN陶瓷钎焊,专利和文献资料多集中在氮化铝覆铜板、氮化铝与铜之间的界面结合问题,多数是通过对AlN陶瓷表面金属化处理来提高与铜基板的结合强度,如专利一种氮化铝陶瓷覆铜基板及其制备方法(CN201010141328.7)提供了一种氮化铝陶瓷覆铜基板的制备方法,先通过磁控溅射的方法在氮化铝陶瓷基片上形成金属混合物镀层然后进行高温烧结形成的金属改性层有效改善氮化铝与铜箔的良好敷接。Regarding AlN ceramic brazing, patents and literature are mostly focused on the interface bonding problems between aluminum nitride copper-clad boards and aluminum nitride and copper. Most of them improve the bonding strength with the copper substrate by metallizing the surface of AlN ceramics. For example, the patent "An aluminum nitride ceramic copper-clad substrate and its preparation method" (CN201010141328.7) provides a preparation method for an aluminum nitride ceramic copper-clad substrate. A metal mixture coating is first formed on an aluminum nitride ceramic substrate by magnetron sputtering, and then a metal modified layer is formed by high-temperature sintering to effectively improve the good bonding between aluminum nitride and copper foil.

针对高体积分数SiC颗粒增强的铝基复合材料与AlN陶瓷的异种材料钎焊,目前没有相关报道和公开专利,但可以想象,高体积分数SiC颗粒增强的铝基复合材料自身的钎焊润湿性已经很差,AlN陶瓷材料的润湿性也很差,同时与铝基复合材料的物理化学性质差异又很大,同时实现这两种难焊材料的界面冶金结合,是十分困难的。There are currently no relevant reports or published patents on the brazing of dissimilar materials between aluminum-based composites reinforced with high volume fraction SiC particles and AlN ceramics. However, it is conceivable that the brazing wettability of aluminum-based composites reinforced with high volume fraction SiC particles is already very poor, and the wettability of AlN ceramic materials is also very poor. At the same time, the physical and chemical properties of aluminum-based composites are very different. It is very difficult to achieve interfacial metallurgical bonding of these two difficult-to-weld materials at the same time.

发明内容Summary of the invention

鉴于现有技术的上述情况,本发明的目的是提供一种高体积分数SiCp/Al基复合材料与AlN陶瓷的钎焊方法,以解决现有的高体积分数SiCp/Al基复合材料焊接质量差、表面金属化工艺复杂的问题,形成高体积分数SiCp/Al基复合材料与AlN陶瓷的高性能钎焊连接。In view of the above situation of the prior art, the purpose of the present invention is to provide a brazing method for a high volume fraction SiCp/Al-based composite material and an AlN ceramic, so as to solve the problems of poor welding quality and complex surface metallization process of the existing high volume fraction SiCp/Al-based composite material, and form a high-performance brazing connection between the high volume fraction SiCp/Al-based composite material and the AlN ceramic.

本发明的目的是通过以下技术措施来实现的:The purpose of the present invention is achieved through the following technical measures:

一种高体积分数SiCp/Al基复合材料与AlN陶瓷的钎焊方法,是采用活性钎料金属化+加压钎焊组合方法实现,首先在AlN陶瓷表面利用AgCuTi活性钎料进行金属化,然后利用AlCuSi钎料将AlN陶瓷金属化表面与SiCp/Al基复合材料进行真空加压钎焊连接,实现高体积分数SiCp/Al基复合材料与AlN陶瓷的异质连接。A brazing method for a high volume fraction SiCp/Al-based composite material and AlN ceramics is achieved by adopting a combined method of active brazing filler metallization + pressure brazing. First, the AlN ceramic surface is metallized using AgCuTi active brazing filler metal, and then the AlN ceramic metallized surface and the SiCp/Al-based composite material are vacuum pressure brazed using AlCuSi brazing filler metal, thereby achieving heterogeneous connection between the high volume fraction SiCp/Al-based composite material and the AlN ceramic.

具体步骤为先将待焊的AlN陶瓷表面在800#~1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;将AgCuTi钎料箔带贴合在AlN陶瓷待焊表面,使AgCuTi钎料箔带完全铺满AlN陶瓷待焊表面,且厚度一致,AgCuTi钎料箔带的厚度优选为30μm~50μm,如果厚度高于该范围则会导致预金属化的陶瓷基板变形,而如果厚度低于该范围,则金属化层容易出现缺陷,同时钎料箔带制备难度大,另外所述AgCuTi钎料的成分可以为Ag-(20~40%)Cu-(1~8%)Ti(其中的百分数为质量百分数)。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为840℃~900℃,该温度与钎料成分相对应,钎料选定后,钎焊最佳温度范围即确定,保温时间为10min以上,优选为10min~30min,如果保温时间过长,则反应时间过长,钎料与陶瓷表面的反应过于强烈,将降低AlN与铝基复合材料的接头强度,以不高于5℃/min的冷却速率冷却至400℃以下,随炉冷却至室温。AgCuTi钎料合金与AlN陶瓷发生界面反应形成冶金结合,从而实现氮化铝陶瓷高结合强度的表面金属化;将待焊的SiCp/Al基复合材料表面在800#~1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;将厚度为50μm~150μm的AlCuSi或AlSiMg钎料箔带夹持在AlN金属化表面和SiCp/Al基复合材料之间,所述AlCuSi或AlSiMg钎料箔带的厚度优选为50μm~150μm,如果钎料箔带厚度太厚,则焊后接头残余应力过大,容易导致开裂,而太薄则容易造成因焊料缺失导致的缺陷。将装配好的试样放入真空扩散炉内,保温温度为560℃~600℃,加压保温,保温时间为5min以上,优选为5min~20min,压力优选为为1MPa~2MPa,保温结束后以不高于5℃/min的冷却速率冷却至300℃以下,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。The specific steps are as follows: firstly, the surface of the AlN ceramic to be welded is polished on 800#-1000# sandpaper, and then ultrasonically cleaned in an acetone solution; the AgCuTi solder foil is attached to the surface of the AlN ceramic to be welded, so that the AgCuTi solder foil completely covers the surface of the AlN ceramic to be welded, and the thickness is uniform. The thickness of the AgCuTi solder foil is preferably 30μm-50μm. If the thickness is higher than this range, the pre-metallized ceramic substrate will be deformed. If the thickness is lower than this range, defects are likely to occur in the metallized layer, and the preparation of the solder foil is difficult. In addition, the composition of the AgCuTi solder can be Ag-(20-40%)Cu-(1-8%)Ti (wherein the percentage is mass percentage). Then put the assembled AlN ceramic into a vacuum brazing furnace with a holding temperature of 840°C to 900°C, which corresponds to the composition of the brazing material. After the brazing material is selected, the optimal temperature range for brazing is determined. The holding time is more than 10 minutes, preferably 10 minutes to 30 minutes. If the holding time is too long, the reaction time is too long, and the reaction between the brazing material and the ceramic surface is too strong, which will reduce the joint strength of the AlN and aluminum-based composite materials. Cool to below 400°C at a cooling rate not higher than 5°C/min, and cool to room temperature with the furnace. The AgCuTi solder alloy reacts with the AlN ceramic to form a metallurgical bond, thereby achieving surface metallization of the aluminum nitride ceramic with high bonding strength; the surface of the SiCp/Al-based composite material to be welded is polished on 800#~1000# sandpaper, and is ultrasonically cleaned in an acetone solution; an AlCuSi or AlSiMg solder foil with a thickness of 50μm~150μm is clamped between the AlN metallized surface and the SiCp/Al-based composite material, and the thickness of the AlCuSi or AlSiMg solder foil is preferably 50μm~150μm. If the solder foil is too thick, the residual stress of the joint after welding is too large, which is easy to cause cracking, while if it is too thin, it is easy to cause defects caused by the lack of solder. The assembled sample is placed in a vacuum diffusion furnace with a holding temperature of 560°C to 600°C and pressurized for holding for more than 5 minutes, preferably 5 minutes to 20 minutes, and a pressure of 1MPa to 2MPa. After the holding is completed, it is cooled to below 300°C at a cooling rate not higher than 5°C/min, and then cooled to room temperature with the furnace to obtain a brazing joint of the SiCp/Al-based composite material and the AlN ceramic.

本发明解决了现有的高体积分数SiCp/Al基复合材料焊接质量差、表面金属化工艺复杂的问题,可满足大功率电子封装领域高体积分数SiCp/Al基复合材料与AlN陶瓷的钎焊需求。The present invention solves the problems of poor welding quality and complex surface metallization process of existing high volume fraction SiCp/Al-based composite materials, and can meet the brazing requirements of high volume fraction SiCp/Al-based composite materials and AlN ceramics in the field of high-power electronic packaging.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1是按照本发明的实施例1获得的SiCp/Al基复合材料与AlN陶瓷的钎焊接头的电镜照片图。FIG. 1 is an electron microscope photograph of a brazed joint between a SiCp/Al-based composite material and an AlN ceramic obtained in Example 1 of the present invention.

具体实施方式DETAILED DESCRIPTION

为了更清楚地理解本发明的目的、技术方案及优点,以下结合附图及实施例,对本发明进行进一步详细说明。In order to more clearly understand the purpose, technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

本发明的一种高体积分数碳化硅颗粒增强铝基复合材料与氮化铝陶瓷的钎焊方法,是采用活性钎料金属化+加压钎焊组合方法实现,具体步骤为先将待焊的AlN表面在800#~1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;将厚度为30μm~50μm的商用AgCuTi钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷待焊表面,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为840℃~900℃,保温时间为10min~30min,以不高于5℃/min的冷却速率冷却至400℃以下,随炉冷却至室温。AgCuTi钎料合金与AlN陶瓷发生界面反应形成冶金结合,从而实现AlN陶瓷高结合强度的表面金属化;将待焊的SiCp/Al基复合材料表面在800#~1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;将厚度为50μm~150μm的AlCuSi或AlSiMg钎料箔带夹持在AlN金属化表面和SiCp/Al基复合材料之间。将装配好的试样放入真空扩散炉内,保温温度为560℃~600℃,保温时间为5min~20min,压力为1MPa~2MPa,保温结束后以不高于5℃/min的冷却速率冷却至300℃以下,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。The brazing method of a high volume fraction silicon carbide particle reinforced aluminum-based composite material and aluminum nitride ceramic of the present invention is realized by a combined method of active brazing filler metallization + pressure brazing, and the specific steps are firstly polishing the AlN surface to be welded on 800#~1000# sandpaper, and ultrasonically cleaning it in an acetone solution; attaching a commercial AgCuTi brazing filler foil with a thickness of 30μm~50μm to the surface of the AlN ceramic to be welded, so that the brazing filler foil completely covers the surface of the AlN ceramic to be welded, and the thickness is consistent. Then, the assembled AlN ceramic is placed in a vacuum brazing furnace, the holding temperature is 840℃~900℃, the holding time is 10min~30min, and it is cooled to below 400℃ at a cooling rate not higher than 5℃/min, and then cooled to room temperature with the furnace. AgCuTi solder alloy reacts with AlN ceramics to form metallurgical bonding, thereby achieving surface metallization of AlN ceramics with high bonding strength; the surface of the SiCp/Al-based composite material to be welded is polished on 800#~1000# sandpaper and ultrasonically cleaned in acetone solution; AlCuSi or AlSiMg solder foil with a thickness of 50μm~150μm is clamped between the AlN metallized surface and the SiCp/Al-based composite material. The assembled sample is placed in a vacuum diffusion furnace with a holding temperature of 560℃~600℃, a holding time of 5min~20min, and a pressure of 1MPa~2MPa. After the holding is completed, it is cooled to below 300℃ at a cooling rate not higher than 5℃/min, and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

实施例1:Embodiment 1:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为60%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 60%.

(1)将待焊的AlN陶瓷表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN ceramic surface to be welded on 1000# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为30μm的Cusil-ABA(Ag-35.25Cu-1.75Ti(质量分数,%)钎料箔带贴合在AlN待焊表面,使钎料箔带完全铺满AlN陶瓷待焊表面,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为880℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃以下,随炉冷却至室温;(2) A 30 μm thick Cusil-ABA (Ag-35.25Cu-1.75Ti (mass fraction, %) brazing foil is attached to the AlN surface to be welded, so that the brazing foil completely covers the AlN ceramic surface to be welded and has a uniform thickness. Then the assembled AlN ceramic is placed in a vacuum brazing furnace at a holding temperature of 880°C for 10 min, cooled to below 400°C at a cooling rate of no more than 5°C/min, and then cooled to room temperature along with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为100μm的钎料牌号为B-Al67CuSi的钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为570℃,保温时间为10min,施加1.5MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃以下,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing foil with a thickness of 100 μm and a brazing grade of B-Al67CuSi is clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material, and the assembled sample is placed in a vacuum diffusion furnace with a holding temperature of 570°C for 10 min and a pressure of 1.5 MPa. After the holding is completed, it is cooled to below 300°C at a cooling rate of 5°C/min, and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

本实施例获得的SiCp/Al基复合材料与AlN陶瓷的钎焊接头的电镜照片如图1所示,后续各个实施例获得的SiCp/Al基复合材料与AlN陶瓷的钎焊接头的电镜照片与本实施例类似,不再图示。The electron microscope photograph of the brazed joint of the SiCp/Al-based composite material and AlN ceramic obtained in this embodiment is shown in Figure 1. The electron microscope photographs of the brazed joint of the SiCp/Al-based composite material and AlN ceramic obtained in subsequent embodiments are similar to those in this embodiment and are not shown in the figure again.

实施例2:Embodiment 2:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为60%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 60%.

(1)将待焊的AlN表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN surface to be welded on 1000# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为30μm的Ticusil(Ag-26.7Cu-4.5Ti(质量分数,%)钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷待焊表面,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为880℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃以下,随炉冷却至室温;(2) A 30 μm thick Ticusil (Ag-26.7Cu-4.5Ti (mass fraction, %) brazing foil is attached to the surface of the AlN ceramic to be welded, so that the brazing foil completely covers the surface of the AlN ceramic to be welded and the thickness is consistent. Then the assembled AlN ceramic is placed in a vacuum brazing furnace with a holding temperature of 880°C for 10 min, cooled to below 400°C at a cooling rate of no more than 5°C/min, and then cooled to room temperature along with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为100μm的钎料牌号为B-Al86CuSi钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为570℃,保温时间为10min,施加1.5MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃后,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing material foil with a thickness of 100 μm and a grade of B-Al86CuSi is clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material. The assembled sample is placed in a vacuum diffusion furnace with a holding temperature of 570°C for 10 min and a pressure of 1.5 MPa. After the holding is completed, it is cooled to 300°C at a cooling rate of 5°C/min and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

实施例3:Embodiment 3:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为65%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 65%.

(1)将待焊的AlN表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN surface to be welded on 1000# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为50μm的Cusil-ABA(Ag-35.25Cu-1.75Ti(质量分数,%)钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷待焊表面,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为890℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃后,随炉冷却至室温;(2) A 50 μm thick Cusil-ABA (Ag-35.25Cu-1.75Ti (mass fraction, %) brazing foil is attached to the surface of the AlN ceramic to be welded, so that the brazing foil completely covers the surface of the AlN ceramic to be welded and the thickness is consistent. Then the assembled AlN ceramic is placed in a vacuum brazing furnace with a holding temperature of 890°C for 10 min, cooled to 400°C at a cooling rate of no more than 5°C/min, and then cooled to room temperature with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为100μm的钎料牌号为B-Al86SiMg钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为570℃,保温时间为10min,施加2.0MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃后,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing material foil with a thickness of 100 μm and a grade of B-Al86SiMg was clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material. The assembled sample was placed in a vacuum diffusion furnace with a holding temperature of 570°C for 10 min and a pressure of 2.0 MPa. After the holding temperature was completed, it was cooled to 300°C at a cooling rate of 5°C/min and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

实施例4:Embodiment 4:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为65%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 65%.

(1)将待焊的AlN表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN surface to be welded on 1000# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为50μm的Ticusil(Ag-26.7Cu-4.5Ti(质量分数,%)钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷待焊表面,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为890℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃后,随炉冷却至室温;(2) A 50 μm thick Ticusil (Ag-26.7Cu-4.5Ti (mass fraction, %) brazing foil is attached to the surface of the AlN ceramic to be welded, so that the brazing foil completely covers the surface of the AlN ceramic to be welded and the thickness is consistent. Then the assembled AlN ceramic is placed in a vacuum brazing furnace with a holding temperature of 890°C for 10 min, cooled to 400°C at a cooling rate of no more than 5°C/min, and then cooled to room temperature with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为100μm的钎料牌号为B-Al88SiMg钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为570℃,保温时间为10min,施加2.0MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃后,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing material foil with a thickness of 100 μm and a grade of B-Al88SiMg was clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material. The assembled sample was placed in a vacuum diffusion furnace with a holding temperature of 570°C for 10 min and a pressure of 2.0 MPa. After the holding temperature was completed, it was cooled to 300°C at a cooling rate of 5°C/min and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

实施例5:Embodiment 5:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为70%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 70%.

(1)将待焊的AlN表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN surface to be welded on 1000# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为30μm的Cusil-ABA(Ag-35.25Cu-1.75Ti(质量分数,%)钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷待焊表面,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为880℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃后,随炉冷却至室温;(2) A 30 μm thick Cusil-ABA (Ag-35.25Cu-1.75Ti (mass fraction, %) brazing foil is attached to the surface of the AlN ceramic to be welded, so that the brazing foil completely covers the surface of the AlN ceramic to be welded and the thickness is consistent. Then the assembled AlN ceramic is placed in a vacuum brazing furnace with a holding temperature of 880°C for 10 min, cooled to 400°C at a cooling rate of no more than 5°C/min, and then cooled to room temperature with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为120μm的钎料牌号为B-Al67CuSi钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为580℃,保温时间为10min,施加2.0MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃后,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing material foil with a thickness of 120 μm and a grade of B-Al67CuSi is clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material. The assembled sample is placed in a vacuum diffusion furnace with a holding temperature of 580°C for 10 min and a pressure of 2.0 MPa. After the holding is completed, it is cooled to 300°C at a cooling rate of 5°C/min and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

实施例6:Embodiment 6:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为70%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 70%.

(1)将待焊的AlN表面在800#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN surface to be welded on 800# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为30μm的Ticusil(Ag-26.7Cu-4.5Ti(质量分数,%)钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为880℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃后,随炉冷却至室温;(2) A 30 μm thick Ticusil (Ag-26.7Cu-4.5Ti (mass fraction, %) brazing foil is attached to the surface of the AlN ceramic to be welded, so that the brazing foil is completely covered with the AlN ceramic and the thickness is consistent. Then the assembled AlN ceramic is placed in a vacuum brazing furnace at a holding temperature of 880°C for 10 min, cooled to 400°C at a cooling rate of no more than 5°C/min, and then cooled to room temperature along with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为120μm的钎料牌号为B-Al86CuSi钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为580℃,保温时间为10min,施加2.0MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃后,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing material foil with a thickness of 120 μm and a grade of B-Al86CuSi is clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material. The assembled sample is placed in a vacuum diffusion furnace with a holding temperature of 580°C for 10 min and a pressure of 2.0 MPa. After the holding is completed, it is cooled to 300°C at a cooling rate of 5°C/min and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

实施例7:Embodiment 7:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为55%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 55%.

(1)将待焊的AlN表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN surface to be welded on 1000# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为50μm的Cusil-ABA(Ag-35.25Cu-1.75Ti(质量分数,%)钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为900℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃后,随炉冷却至室温;(2) A 50 μm thick Cusil-ABA (Ag-35.25Cu-1.75Ti (mass fraction, %) brazing foil is attached to the surface of the AlN ceramic to be welded, so that the brazing foil is completely covered with the AlN ceramic and the thickness is consistent. Then the assembled AlN ceramic is placed in a vacuum brazing furnace at a holding temperature of 900 °C for 10 min, cooled to 400 °C at a cooling rate of no more than 5 °C/min, and then cooled to room temperature with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为80μm的钎料牌号为B-Al67CuSi钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为570℃,保温时间为10min,施加1.5MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃后,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing material foil with a thickness of 80 μm and a grade of B-Al67CuSi is clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material. The assembled sample is placed in a vacuum diffusion furnace with a holding temperature of 570°C for 10 min and a pressure of 1.5 MPa. After the holding is completed, it is cooled to 300°C at a cooling rate of 5°C/min and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

实施例8:Embodiment 8:

本实施方式所述的高体积分数的SiCp/Al基复合材料中SiC陶瓷颗粒的体积分数为55%。The volume fraction of SiC ceramic particles in the high volume fraction SiCp/Al-based composite material described in this embodiment is 55%.

(1)将待焊的AlN表面在800#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(1) Polish the AlN surface to be welded on 800# sandpaper and clean it by ultrasonic cleaning in acetone solution;

(2)将厚度为50μm的Ticusil(Ag-26.7Cu-4.5Ti(质量分数,%)钎料箔带贴合在AlN陶瓷待焊表面,使钎料箔带完全铺满AlN陶瓷,且厚度一致。然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为900℃,保温时间为10min,以不高于5℃/min的冷却速率冷却至400℃后,随炉冷却至室温;(2) A 50 μm thick Ticusil (Ag-26.7Cu-4.5Ti (mass fraction, %) brazing foil is attached to the surface of the AlN ceramic to be welded, so that the brazing foil is completely covered with the AlN ceramic and the thickness is consistent. Then the assembled AlN ceramic is placed in a vacuum brazing furnace at a holding temperature of 900 °C for 10 min, cooled to 400 °C at a cooling rate of no more than 5 °C/min, and then cooled to room temperature along with the furnace;

(3)将待焊的SiCp/Al基复合材料表面在1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净;(3) The surface of the SiCp/Al-based composite material to be welded was polished on 1000# sandpaper and then ultrasonically cleaned in acetone solution;

(4)将厚度为80μm的钎料牌号为B-Al86SiMg钎料箔夹持在AlN陶瓷金属化表面和SiCp/Al基复合材料之间,将装配好的试样放入真空扩散炉内,保温温度为570℃,保温时间为10min,施加1.5MPa压力。保温结束后以5℃/min的冷却速率冷却至300℃后,随炉冷却至室温,获得SiCp/Al基复合材料与AlN陶瓷的钎焊接头。(4) A brazing material foil with a thickness of 80 μm and a grade of B-Al86SiMg was clamped between the metallized surface of the AlN ceramic and the SiCp/Al-based composite material. The assembled sample was placed in a vacuum diffusion furnace with a holding temperature of 570°C for 10 min and a pressure of 1.5 MPa. After the holding temperature was completed, it was cooled to 300°C at a cooling rate of 5°C/min and then cooled to room temperature with the furnace to obtain a brazed joint between the SiCp/Al-based composite material and the AlN ceramic.

与现有技术相比,本发明的方法具有以下优点:Compared with the prior art, the method of the present invention has the following advantages:

1.陶瓷表面金属化不需要化学镀、磁控溅射、离子注入等复杂的表面金属化工艺及价格高昂的金属化设备,仅需要一台真空钎焊炉,工艺易实现,成本低;1. Ceramic surface metallization does not require complex surface metallization processes such as chemical plating, magnetron sputtering, ion implantation, and expensive metallization equipment. It only requires a vacuum brazing furnace, which is easy to implement and low in cost.

2.AlN陶瓷表面的AgCuTi的金属化层与陶瓷基体之间冶金结合致密,连接面结合强度高,AgCu基体导热性好,能够良好解决低温钎料在陶瓷表面的润湿性差或不润湿的问题;2. The metallization layer of AgCuTi on the surface of AlN ceramics is closely metallurgically bonded to the ceramic matrix, the bonding strength of the connection surface is high, and the thermal conductivity of the AgCu matrix is good, which can effectively solve the problem of poor wettability or non-wetting of low-temperature solder on the ceramic surface;

3.选用了AlCuSi或AlSiMg钎料进行金属化的AlN与高体积分数碳化硅颗粒增强铝基复合材料进行钎焊,钎焊温度可低至560℃,该钎料在Al基钎料体系中熔点低,适用范围更广,同时相对较低的焊接温度对铝基复合材料基体性能影响更小。3. AlCuSi or AlSiMg brazing filler metallized AlN was brazed with high volume fraction silicon carbide particle reinforced aluminum-based composites. The brazing temperature can be as low as 560°C. This brazing filler metal has a low melting point in the Al-based brazing filler system and a wider range of applications. At the same time, the relatively low welding temperature has less effect on the performance of the aluminum-based composite matrix.

4.采用AlCuSi钎料进行金属化的AlN与高体积分数碳化硅颗粒增强铝基复合材料进行钎焊时,优选施加了小的压力(如上所述的1MPa~2MPa),在该压力的作用下可增加钎料与被焊材料的接触面积,对连接面的平整度要求下降,有效节省了陶瓷金属化表面磨平处理工序,工程应用时更具经济性、可操作性。4. When brazing AlN metallized with AlCuSi brazing filler metal and aluminum-based composite materials reinforced with high volume fraction silicon carbide particles, it is preferred to apply a small pressure (1MPa to 2MPa as mentioned above). Under the action of this pressure, the contact area between the brazing filler metal and the material to be welded can be increased, and the flatness requirements for the connection surface are reduced, which effectively saves the ceramic metallization surface grinding process, making it more economical and operable in engineering applications.

5.AlCuSi钎料中含有一定量的Cu元素,更利于AlN金属化层中的Ag、Cu与铝基复合材料中的Al基体之间产生良好冶金结合,避免反应过度。5. The AlCuSi solder contains a certain amount of Cu element, which is more conducive to the formation of good metallurgical bonding between the Ag and Cu in the AlN metallization layer and the Al matrix in the aluminum-based composite material, avoiding excessive reaction.

Claims (7)

1.一种高体积分数SiCp/Al基复合材料与AlN陶瓷的钎焊方法,包括:1. A brazing method for a high volume fraction SiCp/Al-based composite material and AlN ceramics, comprising: 首先在AlN陶瓷表面利用AgCuTi活性钎料进行金属化:将AgCuTi钎料箔带贴合在AlN陶瓷待焊表面,使AgCuTi钎料箔带完全铺满AlN陶瓷待焊表面且厚度一致,然后将装配好的AlN陶瓷放入真空钎焊炉内,保温温度为840℃~900℃,保温时间为10min~30min,以不高于5℃/min的冷却速率冷却至400℃以下后,随炉冷却至室温,其中所述AgCuTi钎料的成分为Ag-20~40%Cu-1~8%Ti,其中的百分数为质量百分数;Firstly, the AlN ceramic surface is metallized by using AgCuTi active brazing filler metal: the AgCuTi brazing filler metal foil is attached to the AlN ceramic surface to be welded, so that the AgCuTi brazing filler metal foil completely covers the AlN ceramic surface to be welded and has a uniform thickness, and then the assembled AlN ceramic is placed in a vacuum brazing furnace, the holding temperature is 840°C to 900°C, the holding time is 10min to 30min, and after cooling to below 400°C at a cooling rate not higher than 5°C/min, the AlN ceramic is cooled to room temperature along with the furnace, wherein the composition of the AgCuTi brazing filler metal is Ag-20-40%Cu-1-8%Ti, and the percentages are by mass percentage; 然后利用AlCuSi或AlSiMg钎料将AlN陶瓷金属化表面与SiCp/Al基复合材料进行真空加压钎焊连接,实现高体积分数SiCp/Al基复合材料与AlN陶瓷的异质连接。Then, the AlN ceramic metallized surface is connected to the SiCp/Al-based composite material by vacuum pressure brazing using AlCuSi or AlSiMg brazing filler metal, thereby realizing heterogeneous connection between the high volume fraction SiCp/Al-based composite material and the AlN ceramic. 2.按照权利要求1所述的钎焊方法,其中所述AgCuTi钎料箔带的厚度为30μm~50μm。2. The soldering method according to claim 1, wherein the thickness of the AgCuTi solder foil is 30 μm to 50 μm. 3.按照权利要求1所述的钎焊方法,还包括将待焊的AlN陶瓷表面在800#~1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净的预处理步骤。3. The brazing method according to claim 1 further comprises a pretreatment step of polishing the surface of the AlN ceramic to be welded on 800# to 1000# sandpaper and ultrasonically cleaning it in an acetone solution. 4.按照权利要求1所述的钎焊方法,其中所述利用AlCuSi或AlSiMg钎料将AlN陶瓷金属化表面与SiCp/Al基复合材料进行真空加压钎焊连接包括将AlCuSi或AlSiMg钎料箔带夹持在AlN金属化表面和SiCp/Al基复合材料之间,然后一起放入真空扩散炉内加压保温,保温温度为560℃~600℃,保温时间为5min~20min,保温结束后以不高于5℃/min的冷却速率冷却至300℃以下后,随炉冷却至室温。4. The brazing method according to claim 1, wherein the vacuum pressure brazing connection of the AlN ceramic metallized surface and the SiCp/Al-based composite material by using AlCuSi or AlSiMg brazing filler metal comprises clamping the AlCuSi or AlSiMg brazing filler metal foil between the AlN metallized surface and the SiCp/Al-based composite material, and then placing them together in a vacuum diffusion furnace for pressurization and insulation, the insulation temperature is 560°C to 600°C, the insulation time is 5min to 20min, and after the insulation is completed, cooling to below 300°C at a cooling rate not higher than 5°C/min, and then cooling to room temperature with the furnace. 5.按照权利要求4所述的钎焊方法,其中所述AlCuSi或AlSiMg钎料箔带的厚度为50μm~150μm。5. The brazing method according to claim 4, wherein the thickness of the AlCuSi or AlSiMg brazing material foil is 50 μm to 150 μm. 6.按照权利要求4所述的钎焊方法,其中加压保温时的压力为1MPa~2MPa。6. The brazing method according to claim 4, wherein the pressure during pressurization and heat preservation is 1 MPa to 2 MPa. 7.按照权利要求4所述的钎焊方法,还包括将待焊的SiCp/Al基复合材料表面在800#~1000#砂纸上打磨光亮,并在丙酮溶液中超声清洗干净的预处理步骤。7. The brazing method according to claim 4 further comprises a pretreatment step of polishing the surface of the SiCp/Al-based composite material to be welded on 800#-1000# sandpaper and ultrasonically cleaning it in an acetone solution.
CN202211075729.6A 2022-09-02 2022-09-02 Brazing method of high-volume-fraction SiCp/Al-based composite material and AlN ceramic Active CN115446407B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211075729.6A CN115446407B (en) 2022-09-02 2022-09-02 Brazing method of high-volume-fraction SiCp/Al-based composite material and AlN ceramic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211075729.6A CN115446407B (en) 2022-09-02 2022-09-02 Brazing method of high-volume-fraction SiCp/Al-based composite material and AlN ceramic

Publications (2)

Publication Number Publication Date
CN115446407A CN115446407A (en) 2022-12-09
CN115446407B true CN115446407B (en) 2024-10-29

Family

ID=84300962

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211075729.6A Active CN115446407B (en) 2022-09-02 2022-09-02 Brazing method of high-volume-fraction SiCp/Al-based composite material and AlN ceramic

Country Status (1)

Country Link
CN (1) CN115446407B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04170373A (en) * 1990-10-31 1992-06-18 Tanaka Kikinzoku Kogyo Kk Method for manufacturing AlN/Cu clad substrate
CN102009240A (en) * 2010-10-20 2011-04-13 北京科技大学 Method for connecting AlN (aluminum nitride) ceramics and SiC/Al composite material respectively plated with thin-film metal layer on surface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005260251A (en) * 1999-04-06 2005-09-22 Tokyo Electron Ltd Mounting stand, plasma processing apparatus, and manufacturing method for mounting stand
CN1228163C (en) * 2002-08-09 2005-11-23 中国科学院上海硅酸盐研究所 High-temp soldering method for aluminium nitride and copper
KR101070605B1 (en) * 2010-10-08 2011-10-06 (주)보부하이테크 Ceramic Heater for Semiconductor Wafer and Manufacturing Method Thereof
CN107256829A (en) * 2017-06-01 2017-10-17 合肥邦诺科技有限公司 A kind of method that utilization thin film technique prepares aluminium nitride copper-clad base plate
CN107363359A (en) * 2017-08-09 2017-11-21 北京工业大学 A kind of method of compound high-entropy alloy solder ceramic soldering and metal
CN114769774B (en) * 2022-05-10 2024-03-08 哈尔滨工业大学 Preparation method of ceramic aluminum-coated substrate for power device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04170373A (en) * 1990-10-31 1992-06-18 Tanaka Kikinzoku Kogyo Kk Method for manufacturing AlN/Cu clad substrate
CN102009240A (en) * 2010-10-20 2011-04-13 北京科技大学 Method for connecting AlN (aluminum nitride) ceramics and SiC/Al composite material respectively plated with thin-film metal layer on surface

Also Published As

Publication number Publication date
CN115446407A (en) 2022-12-09

Similar Documents

Publication Publication Date Title
KR101986860B1 (en) Heat dissipating component for semiconductor element
CN109136848B (en) Method for connecting aluminum nitride ceramic plate and metal based on PVD (physical vapor deposition) deposition method
CN109930125B (en) A kind of magnetron sputtering coating method of diamond-aluminum composite material
JPH0810710B2 (en) Method for manufacturing good thermal conductive substrate
EP1430007B1 (en) Brazeable matallizations for diamond components
JP2012117085A (en) Aluminum-diamond composite and method for producing the same
JP2001010874A (en) Production of composite material of inorganic material with metal containing aluminum and product related to the same
CN105418132A (en) Method for adopting aluminum or aluminum alloy to directly braze aluminum nitride ceramics
CN115626835A (en) Manufacturing method of ceramic-based copper-clad plate and product thereof
CN106944698A (en) The SiC ceramic and the direct method for welding of SiC ceramic reinforced aluminum matrix composites ultrasonic cryogenic being modified based on thermal oxide surface
CN115466131A (en) A method for metallizing the surface of aluminum nitride ceramics
JP2012158783A (en) Aluminum-diamond composite, and method for production thereof
CN106232845A (en) Aluminium gold hard rock system's complex and use its thermal component
CN111192831A (en) Surface metallization method for high-thermal-conductivity silicon nitride ceramic substrate and packaging substrate thereof
US7270885B1 (en) Method for brazing ceramic-containing bodies, and articles made thereby
JP6105262B2 (en) Aluminum-diamond composite heat dissipation parts
US6884511B1 (en) Method for brazing ceramic-containing bodies, and articles made thereby
CN119635073A (en) A composite solder sheet and a method for preparing an AMB ceramic copper-clad laminate
CN114029573B (en) Preparation method of ultrathin soft soldering modified layer on surface of graphene film
TWI283463B (en) Members for semiconductor device
JP5640569B2 (en) Power module substrate manufacturing method
CN115446407B (en) Brazing method of high-volume-fraction SiCp/Al-based composite material and AlN ceramic
TWI734528B (en) Composite substrate
CN105436643A (en) Direct aluminum or aluminum alloy brazing method for aluminum oxide ceramics
JP2013191640A (en) Substrate for power module and manufacturing method of the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant