CN115440643B - Wafer carrying device and method - Google Patents

Abstract

The invention discloses a wafer carrying device and method. The wafer carrying device includes: a cabinet, a base, and a lifting device; a turntable arranged on the lifting device; an extension turntable arranged on the turntable; a first driving device and a second driving device The devices are all arranged on the extension turntable; the first wafer pick-and-place plate and the second wafer pick-and-place plate are both slidingly connected with the extension turntable; the first drive device drives the first wafer pick-and-place plate to slide; the second drive The device drives the second wafer pick-and-place plate to slide; the first wafer pick-and-place plate is located under the second wafer pick-and-place plate. Since two wafer pick-and-place boards are set in the wafer carrying device, and the two wafer pick-and-place boards are independent of each other, the wafer to be inspected and the inspected wafer are respectively picked and placed, especially at the inspection position, through the second After the wafer pick-and-place board takes out the inspected wafer, the first wafer pick-and-place board can be used to put the wafer to be inspected immediately, which shortens the time for replacing the wafer and improves the carrying efficiency of the wafer.

Description

Wafer carrier device and method

technical field

The invention relates to the technical field of wafer manufacturing, in particular to a wafer carrying device and method.

Background technique

Wafers are made of high-purity, nearly defect-free single-crystal material with a purity of 99.9999999% (9N) or higher. Taking silicon wafer production as an example, silicon ingots are first sliced with a wafer saw (a type of wire saw). After slicing, chemical etching is performed to remove crystal damage from processing steps, saw marks and surface defects on the front and back sides of the wafer are removed by grinding, and finally polishing is performed to form the wafer.

The wafer test platform is an automatic detection motion platform used by chip manufacturers to detect the structure of the die on the wafer (Wafer). The size of mainstream wafers is developing from 8 inches to 12 inches, or even 18 inches. In the prior art, when replacing a wafer at the detection position of the wafer test platform, the wafer needs to be removed and put away first, and then another wafer is taken and placed at the detection position. This process takes a long time and causes the wafer Transport efficiency is low. At the same time, there is also the problem of high cost of the wafer carrying device.

Therefore, the prior art still needs to be improved and developed.

Contents of the invention

The technical problem to be solved by the present invention is to provide a wafer carrying device and method aiming at solving the problem of low wafer carrying efficiency in the prior art in view of the above defects of the prior art.

The technical solution adopted by the present invention to solve technical problems is as follows:

A wafer carrier, comprising:

Cabinet;

a base set on the cabinet;

a lifting device arranged on the base;

Turntable, set on the lifting device;

an extended turntable, arranged on the turntable;

The first driving device and the second driving device are both arranged on the extension turret;

The first wafer pick-and-place plate and the second wafer pick-and-place plate are both slidably connected to the extended turntable;

Wherein, the first driving device drives the first wafer pick-and-place plate to slide;

The second driving device drives the second wafer pick-and-place plate to slide;

The first wafer pick-and-place plate is located below the second wafer pick-and-place plate.

The wafer carrying device, wherein the turntable adopts a hollow rotating platform, and the extended turntable includes:

The cylinder is arranged on the hollow rotating platform;

an extension plate, arranged at one end of the cylinder away from the hollow rotating platform;

Wherein, both the first wafer pick-and-place plate and the second wafer pick-and-place plate slide along the length direction of the extension plate.

The wafer carrying device, wherein the first driving device includes:

The first belt drive is arranged on the extension plate, and the timing belt of the first belt drive is connected to the first wafer pick-and-place plate;

The outer transmission shaft is located in the barrel and connected with the driving pulley of the first belt drive;

a second belt drive, the driven wheel of the second belt drive is connected to the outer transmission shaft;

The first driving part is arranged outside the cylinder, and the output shaft of the first driving part is connected with the driving pulley of the second belt drive.

The wafer carrying device, wherein the second driving device includes:

The third belt drive is arranged on the extension plate, and the timing belt of the third belt drive is connected to the second wafer pick-and-place plate; the third belt drive is located on the first belt drive under the device;

The inner transmission shaft is located in the outer transmission shaft and connected with the driving wheel of the third belt drive; the inner transmission shaft is sleeved outside the outer transmission shaft;

A fourth belt drive, the driven wheel of the fourth belt drive is connected to the inner transmission shaft; the fourth belt drive is located above the second belt drive;

The second driving member is arranged outside the barrel, and the output shaft of the second driving member is connected with the driving pulley of the fourth belt drive.

The wafer carrying device, wherein the hollow rotating platform includes:

a bearing, the inner ring of the bearing is arranged on the lifting device;

A rotating drive member is arranged on the lifting device;

a first rotary gear connected to the output shaft of the rotary drive;

The second rotating gear is arranged on the outer ring of the bearing and meshes with the first rotating gear.

In the above-mentioned wafer carrying device, wherein, the inner drive shaft is extended to the inner ring of the bearing, and an abutment block is provided at the end of the inner drive shaft, and the abutment block is located in the inner ring of the bearing. inside the ring, and the abutting block abuts against the inner ring of the bearing.

Said wafer carrying device, wherein, said barrel is provided with a first through hole, said first drive member is located outside said barrel, and the drive pulley of said second belt drive is connected with said first drive connected to the output shaft of the component, the driven wheel of the second belt drive is set concentrically with the outer drive shaft and is located in the cylinder, and the timing belt of the second belt drive passes through the first through hole to surround the driving pulley and the driven pulley of the second belt drive;

The cylinder is provided with a second through hole, the second driving member is located outside the cylinder, the driving wheel of the fourth belt drive is connected to the output shaft of the second driving member, and the fourth The driven wheel of the belt drive is arranged concentrically with the inner drive shaft, and is located inside the barrel and outside the inner drive shaft, and the timing belt of the fourth belt drive passes through the second through hole to surround The driving wheel and the driven wheel of the fourth belt drive.

The wafer carrying device, wherein the lifting device adopts a screw moving table, and the screw moving table includes:

a screw driving part arranged on the base;

the screw rod is rotatably arranged on the base and connected with the output shaft of the screw drive member;

The slider is threadedly connected with the screw rod;

guide rails, arranged on the base;

Wherein, the slider is slidably connected with the guide rail.

The wafer carrying device, wherein the wafer carrying device further comprises:

The protective cover is arranged on the cabinet, and the protective cover has an opening.

A wafer carrying method, wherein, applied to the wafer carrying device as described in any one of the above, the wafer carrying method comprises the steps of:

Controlling the second wafer pick-and-place plate to take out the detected wafer from the detection position;

Controlling the first wafer pick-and-place plate to place the wafer to be detected into the detection position.

Beneficial effects: Since two wafer pick-and-place plates are set in the wafer carrying device of the present application, and the two wafer pick-and-place plates are independent of each other, the wafer to be detected and the detected wafer can be picked and placed respectively, especially at the detection position When it is on, after taking out the inspected wafer through the second wafer pick-and-place board, the first wafer pick-and-place board can be used to put the wafer to be tested immediately, which shortens the time for replacing the wafer and improves the carrying efficiency of the wafer. Moreover, the wafer carrying device of the present application has a simple structure and low cost.

Description of drawings

FIG. 1 is a first perspective view of a wafer inspection system in the present invention.

FIG. 2 is a second perspective view of the wafer inspection system in the present invention.

FIG. 3 is a first perspective view of the wafer carrying device in the present invention.

FIG. 4 is a cross-sectional view of the wafer carrying device in the present invention.

FIG. 5 is a second perspective view of the wafer carrying device in the present invention.

Explanation of reference signs:

10. Cabinet; 11. Protective cover; 20. Wafer detection platform; 30. Wafer carrying device; 31. Base; 32. Lifting device; 33. Turntable; Extension plate; 35, the first driving device; 351, the first belt drive; 352, the outer transmission shaft; 353, the second belt drive; 354, the first driving member; 36, the second driving device; 361, the third Belt drive; 362, inner transmission shaft; 363, fourth belt drive; 364, second drive member; 365, contact block; 37, first wafer pick-and-place plate; 38, second wafer pick-and-place plate ; 40. Wafer pre-adjustment device; 50. Wafer loading and unloading device.

Detailed ways

In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

Please refer to FIGS. 1-5 at the same time, the present invention provides some embodiments of a wafer carrying device 30 . The wafer carrier is used in the wafer inspection system. The wafer detection system includes a wafer carrying device 30 , a wafer detection platform 20 , a wafer pre-adjustment device 40 and a wafer loading and unloading device 50 . The wafer carrying device 30 is used for carrying the wafer between the wafer inspection platform 20 , the wafer pre-adjustment device 40 and the wafer loading and unloading device 50 .

As shown in Figures 1-4, the wafer carrying device 30 of the present invention includes:

Cabinet 10;

The base 31 is arranged on the cabinet 10;

The lifting device 32 is arranged on the base 31;

The turntable 33 is arranged on the lifting device 32;

An extended turntable 34 is arranged on the turntable 33;

The first driving device 35 and the second driving device 36 are both arranged on the extension turret 34;

The first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 are both slidably connected to the extension turret 34;

Wherein, the first driving device 35 drives the first wafer pick-and-place plate 37 to slide;

The second driving device 36 drives the second wafer pick-and-place plate 38 to slide;

The first wafer pick-and-place plate 37 is located below the second wafer pick-and-place plate 38 .

The wafer carrying device 30 refers to a device for carrying and transporting wafers. The wafer carrying device 30 is specifically used to transport wafers between wafer-related positions such as inspection positions and storage positions. The base 31 refers to a device for mounting various components in the wafer carrier 30 . The lifting device 32 refers to a device for moving along the Z-axis direction to transport wafers. The turntable 33 refers to a device for driving the extension turntable 34 to rotate. The extension carousel 34 is a device that extends outwards and can rotate. The extension carousel 34 extends outwards to facilitate the transportation of wafers to different devices (or wafer-related positions). The first driving device 35 refers to a device for driving the movement of the first wafer pick-and-place plate 37 . The second driving device 36 refers to a device for driving the movement of the second wafer pick-and-place plate 38 . The first wafer pick-and-place board 37 refers to a device for picking and placing the wafer to be inspected. The second wafer pick-and-place board 38 refers to a device for picking and placing the inspected wafer.

Since the wafer carrying device 30 of the present application is provided with two wafer pick-and-place plates, and the two wafer pick-and-place plates are independent of each other, they can pick and place the wafer to be inspected and the inspected wafer respectively, especially when they are at the inspection position. After taking out the detected wafer through the second wafer pick-and-place plate 38, the first wafer pick-and-place plate 37 can be used to put the wafer to be tested immediately, shortening the time for replacing the wafer and improving the carrying efficiency of the wafer. Moreover, the wafer carrying device of the present application has a simple structure and low cost, and the cost of the carrying device of the present invention is only 10-30% of the price of the market products.

Taking the vertical direction as the Z-axis direction, when picking and placing the wafer, it is necessary to lift the wafer vertically up to take out the wafer, and to place the wafer vertically down to place the wafer. Since the wafer carrying device 30 needs to transport wafers between various wafer-related positions, the wafer carrying device 30 needs to perform actions such as rotation, extension, and retraction, and the rotating movement is realized by rotating the extension turret 34 through the turntable 33 . The first wafer pick-and-place plate 37 is driven to slide on the extension carousel 34 by the first driving device 35, and the second wafer pick-and-place plate 38 is driven to slide on the extension carousel 34 by the second drive device 36, so as to realize the extension and the retraction action.

In order to reduce the volume of the wafer carrying device 30, the first wafer pick-and-place plate 37 is located below the second wafer pick-and-place plate 38, and after the second wafer pick-and-place plate 38 above takes out the detected wafer, it can The wafer to be inspected is directly placed on the first wafer pick-and-place plate 37 located below, which shortens the time interval for picking and placing the wafer.

The specific steps of transferring, picking and placing wafers are described below:

Before transferring and picking and placing wafers, ensure that the first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 are in the initial position, specifically, the first driving device 35 and the second driving device 36 can be controlled to drive respectively The first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 slide toward the turntable 33 to retract the first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 .

Control the turntable 33 to rotate the extension turntable 34 so that the first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 face the wafer to be transferred. Control the lifting device 32 to lower the turntable 33 so that the first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 are located on the side below the wafer to be transferred. The first driving device 35 is controlled to drive the first wafer pick-and-place plate 37 to slide away from the turntable 33, so that the first wafer pick-and-place plate 37 is located under the wafer to be transferred. Control the lifting device 32 to raise the turntable 33 so that the first wafer pick-and-place plate 37 holds up the wafer to be transferred. The first driving device 35 is controlled to drive the first wafer pick-and-place plate 37 to slide toward the turntable 33, so that the first wafer pick-and-place plate 37 carrying the wafer to be transferred is retracted. Control the turntable 33, and rotate the extension turret 34, so that the first wafer pick-and-place plate 37 carrying the wafer to be transferred faces the target position (which may be a detection position, a storage position, etc.) of the wafer to be transferred. The first driving device 35 is controlled to drive the first wafer pick-and-place plate 37 carrying the wafer to be transferred to slide away from the turntable 33 , so that the wafer to be transferred reaches the target position. Control the lifting device 32 to lower the turntable 33 so that the first wafer pick-and-place plate 37 is detached from carrying the wafer to be transferred. The first driving device 35 is controlled to drive the first wafer pick-and-place plate 37 to slide toward the turntable 33 , so that the first wafer pick-and-place plate 37 is retracted.

Of course, when the second driving device 36 is used to drive the second wafer pick-and-place plate 38, similar steps can be adopted. The second driving device 36 is controlled to drive the second wafer pick-and-place plate 38 to slide away from the turntable 33, so that the second wafer pick-and-place plate 38 is located under the wafer to be transferred. Control the lifting device 32 to raise the turntable 33 so that the second wafer pick-and-place plate 38 holds up the wafer to be transferred. The second driving device 36 is controlled to drive the second wafer pick-and-place plate 38 to slide toward the turntable 33, so that the second wafer pick-and-place plate 38 carrying the wafer to be transferred is retracted. Control the turntable 33, and rotate the extension turntable 34, so that the second wafer pick-and-place plate 38 carrying the wafer to be transferred faces the target position (which may be a storage position, etc.) of the wafer to be transferred. The second driving device 36 is controlled to drive the second wafer pick-and-place plate 38 carrying the wafer to be transferred to slide away from the turntable 33 , so that the wafer to be transferred reaches the target position. The lifting device 32 is controlled to lower the turntable 33 so that the second wafer pick-and-place plate 38 is detached from carrying the wafer to be transferred. The second driving device 36 is controlled to drive the second wafer pick-and-place plate 38 to slide toward the turntable 33 , so that the second wafer pick-and-place plate 38 is retracted.

In a preferred implementation of the embodiment of the present invention, as shown in FIG. 5 , the lifting device 32 adopts a screw moving table, and the screw moving table includes:

The screw driver is arranged on the base 31;

The screw rod is arranged on the base 31 for rotation, and is connected with the output shaft of the screw rod driver;

The slider is threadedly connected with the screw rod;

The guide rail is arranged on the base 31;

Wherein, the slider is slidably connected with the guide rail.

Specifically, the turntable 33 is arranged on the slider, the screw is arranged along the Z-axis direction (that is, the vertical direction), and two guide rails can be provided, and the two guide rails are located on both sides of the screw. When the screw driver drives the screw to rotate , the slider moves along the length direction of the screw rod (that is, the Z-axis direction) under the guidance of the guide rail, so that the turntable 33, the extension turntable 34, the first driving device 35, the second driving device 36, the first wafer The pick-and-place plate 37 and the second wafer pick-and-place plate 38 move along the Z-axis direction.

In a preferred implementation of the embodiment of the present invention, as shown in FIG. 5 , the turntable 33 adopts a hollow rotating platform. Specifically, the hollow rotating platform includes:

Bearing, the inner ring of the bearing is arranged on the lifting device 32;

The rotating drive part is arranged on the lifting device 32;

a first rotary gear connected to the output shaft of the rotary drive;

The second rotating gear is arranged on the outer ring of the bearing and meshes with the first rotating gear.

The hollow rotating platform refers to a device that forms a space in the middle and can rotate. The bearing refers to the device that supports the rotation of the rotating body. The rotating drive refers to the device that drives the first rotating gear to rotate. The rotating gear refers to the teeth on the rim that can be continuously meshed. As a device for transmitting motion and power, the first rotating gear rotates with the output shaft of the rotating drive and drives the second rotating gear to rotate. The bearing includes an inner ring and an outer ring, and a rolling element or a sliding element is arranged between the inner ring and the outer ring to form a rolling bearing or a sliding bearing respectively. A space is formed in the middle of the inner ring of the bearing.

Specifically, the inner ring of the bearing is arranged on the slider of the lifting device 32, the outer ring of the bearing is connected with the extension turntable 34, and the outer ring of the bearing rotates in the horizontal plane, thereby driving the extension turntable 34, the first driving device 35, the second Two driving devices 36, the first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 rotate in the horizontal plane, thereby the first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 can be made to face different The device picks and places wafers. Of course, the outer ring of the bearing is rotated instead of the inner ring of the bearing. The outer ring of the bearing is rotated so that the extension turret 34, the first driving device 35, the second driving device 36, and the first wafer are picked and placed. The rotation of the plate 37 and the second wafer pick-and-place plate 38 in the horizontal plane is more stable.

In a preferred implementation of the embodiment of the present invention, as shown in FIGS. 3-5 , the extension turret 34 includes:

cylinder 341, set on the hollow rotating platform;

The extension plate 342 is arranged on the end of the cylinder body 341 away from the hollow rotating platform;

Wherein, both the first wafer pick-and-place plate 37 and the second wafer pick-and-place plate 38 slide along the length direction of the extension plate 342 .

The cylinder body 341 is a hollow device with open ends, and the extension plate 342 is a device extending in a certain direction.

Specifically, the cylinder 341 is arranged on the outer ring of the bearing in the hollow rotating platform, and the cylinder 341 and the bearing are arranged concentrically. With the rotation of the cylinder 341, the extension plate 342 points to different directions, so that the first wafer can be picked and placed. The plate 37 and the second wafer pick and place plate 38 pick and place wafers towards different devices.

In a preferred implementation of the embodiment of the present invention, as shown in FIGS. 3-5 , the first driving device 35 includes:

The first belt drive 351 is arranged on the extension plate 342, and the timing belt of the first belt drive 351 is connected with the first wafer pick-and-place plate 37;

The outer transmission shaft 352 is located in the cylinder 341 and connected with the driving wheel of the first belt drive 351;

The second belt drive 353, the driven wheel of the second belt drive 353 is connected with the outer transmission shaft 352;

The first driving member 354 is disposed outside the cylinder body 341 , and the output shaft of the first driving member 354 is connected with the driving pulley of the second belt drive 353 .

A belt drive refers to a device that drives a belt to move through at least two wheels to transmit motion and power. Usually, a belt drive includes a driving wheel, a driven wheel and a belt, and the belt is wound around the driving wheel and the driven wheel. The outer transmission shaft 352 refers to a device located inside the barrel 341 for transmitting motion and power. The first driving member 354 refers to a device for driving the driving wheel in the second belt drive 353 to rotate.

Specifically, the cylinder 341 is provided with a first through hole, the first driving member 354 is located outside the cylinder 341, the driving wheel of the second belt drive 353 is connected to the output shaft of the first drive 354, and the second belt drive The driven wheel of 353 is arranged concentrically with the outer transmission shaft 352 and is located in the barrel 341 , and the timing belt of the second belt drive 353 passes through the first through hole to surround the driving wheel and the driven wheel of the second belt drive 353 .

Specifically, when the hollow rotating platform and the cylinder 341 are used, the hollow rotating platform and the cylinder 341 form an accommodation space, and the outer transmission shaft 352 can be placed in the accommodation space, and the outer ring of the bearing in the hollow rotating platform rotates without Affects the rotation of the outer transmission shaft 352. Bearings are arranged at the upper end and the lower end of the outer transmission shaft 352 , the inner ring of the bearing is fixed on the outer transmission shaft 352 , and the outer ring of the bearing is fixed to the cylindrical body 341 to further ensure the stable rotation of the outer transmission shaft 352 . The extension plate 342 is disposed on the top of the barrel 341 , and the barrel 341 plays a role of connecting and supporting the extension plate 342 .

In a preferred implementation of the embodiment of the present invention, as shown in FIGS. 3-5 , the second driving device 36 includes:

The third belt drive 361 is arranged on the extension plate 342, and the timing belt of the third belt drive 361 is connected with the second wafer pick-and-place plate 38; the third belt drive 361 is located at the Below the first belt drive 351;

The inner transmission shaft 362 is located in the outer transmission shaft 352 and connected with the driving wheel of the third belt drive 361;

A fourth belt drive 363, the driven wheel of the fourth belt drive 363 is connected to the inner transmission shaft 362; the fourth belt drive 363 is located above the second belt drive 353;

The second driving member 364 is disposed outside the cylinder body 341 , and the output shaft of the second driving member 364 is connected with the driving wheel of the fourth belt drive 363 .

The inner transmission shaft 362 refers to the device located inside the outer transmission shaft 352 for transmitting motion and power. The second driving member 364 refers to a device for driving the driving wheel in the fourth belt drive 363 to rotate.

Specifically, the cylinder body 341 is provided with a second through hole, the second drive member 364 is located outside the cylinder body 341, the driving wheel of the fourth belt drive 363 is connected to the output shaft of the second drive member 364, and the fourth belt drive The driven wheel of 363 is arranged concentrically with the inner transmission shaft 362, and is located in the cylinder body 341 and outside the inner transmission shaft 362, and the timing belt of the fourth belt drive 363 passes through the second through hole to surround the fourth belt drive 363. Drive and driven wheels. The inner transmission shaft 362 is located inside the outer transmission shaft 352 , which can reduce the volume of the entire transmission shaft and ensure that the inner transmission shaft 362 will not deviate from the outer transmission shaft 352 . The inner transmission shaft 362 is extended to the inner ring of the bearing in the hollow rotary platform, and the end of the inner transmission shaft 362 is provided with an abutment block 365, which is located in the inner ring of the bearing in the hollow rotary platform, and the abutment block 365 It abuts against the inner ring of the bearing in the hollow rotating platform, so that the rotation of the inner drive shaft 362 is more stable without deviation.

In a preferred implementation of the embodiment of the present invention, as shown in FIG. 1, the wafer carrying device 30 further includes:

The protective cover 11 is arranged on the cabinet 10, and the protective cover 11 has an opening.

Specifically, the wafer carrying device 30 is located in the protective cover 11 , in order to prevent external environmental factors from affecting the transportation of the wafers, the protective cover 11 is provided on the cabinet 10 , and the protective cover 11 covers the wafer carrying device 30 inside.

Based on the wafer carrying device in any one of the above embodiments, the present invention also provides an embodiment of a wafer carrying method.

The wafer carrying method of the present invention comprises the steps of:

S10. Control the second wafer pick-and-place board to take out the inspected wafer from the inspection position.

S20. Control the first wafer picking and placing board to put the wafer to be detected into the detection position

Specifically, since the first wafer pick-and-place plate is located below the second wafer pick-and-place plate, when controlling the second wafer pick-and-place plate to take out the detected wafer from the detection position, it is necessary to use a lifting device to lift the second wafer pick-and-place plate The inspected wafers on the wafer pick-and-place plate and the second wafer pick-and-place plate are lifted to take out the inspected wafers, and of course the first wafer pick-and-place plate and the first wafer pick-and-place plate are also lifted. Wafers to be inspected, then only need to extend the first wafer pick-and-place plate, and put down the wafers to be inspected to put the wafers to be inspected into the inspection position, which further shortens the lifting time of the lifting device, and also shortens the Wafer replacement time is reduced.

It should be understood that the application of the present invention is not limited to the above examples, and those skilled in the art can make improvements or transformations according to the above descriptions, and all these improvements and transformations should belong to the protection scope of the appended claims of the present invention.

Claims (7)

1. A wafer carrying device, characterized in that, comprising: Cabinet; a base set on the cabinet; a lifting device arranged on the base; Turntable, set on the lifting device; an extended turntable, arranged on the turntable; The first driving device and the second driving device are both arranged on the extension turret; The first wafer pick-and-place plate and the second wafer pick-and-place plate are both slidably connected to the extended turntable; Wherein, the first driving device drives the first wafer pick-and-place plate to slide; The second driving device drives the second wafer pick-and-place plate to slide; The first wafer pick-and-place plate is located below the second wafer pick-and-place plate; The turntable adopts a hollow rotating platform, and the extended turntable includes: The cylinder is arranged on the hollow rotating platform; an extension plate, arranged at one end of the cylinder away from the hollow rotating platform; Wherein, both the first wafer pick-and-place plate and the second wafer pick-and-place plate slide along the length direction of the extension plate; The first driving device includes: The first belt drive is arranged on the extension plate, and the timing belt of the first belt drive is connected to the first wafer pick-and-place plate; The outer transmission shaft is located in the barrel and connected with the driving pulley of the first belt drive; a second belt drive, the driven wheel of the second belt drive is connected to the outer transmission shaft; The first driving part is arranged outside the cylinder, and the output shaft of the first driving part is connected with the driving wheel of the second belt drive; The second driving device includes: The third belt drive is arranged on the extension plate, and the timing belt of the third belt drive is connected to the second wafer pick-and-place plate; the third belt drive is located on the first belt drive under the device; The inner transmission shaft is located in the outer transmission shaft and connected with the driving wheel of the third belt drive; the inner transmission shaft is sleeved outside the outer transmission shaft; A fourth belt drive, the driven wheel of the fourth belt drive is connected to the inner transmission shaft; the fourth belt drive is located above the second belt drive; The second driving member is arranged outside the barrel, and the output shaft of the second driving member is connected with the driving pulley of the fourth belt drive. 2. The wafer carrying device according to claim 1, wherein the hollow rotating platform comprises: a bearing, the inner ring of the bearing is arranged on the lifting device; A rotating drive member is arranged on the lifting device; a first rotary gear connected to the output shaft of the rotary drive; The second rotating gear is arranged on the outer ring of the bearing and meshes with the first rotating gear. 3. The wafer carrying device according to claim 2, wherein the inner transmission shaft extends from the inner ring of the bearing, and an abutment block is provided at the end of the inner transmission shaft, and the abutment The connecting block is located in the inner ring of the bearing, and the abutting block abuts against the inner ring of the bearing. 4. The wafer carrying device according to claim 1, wherein a first through hole is provided on the cylinder body, the first driving member is located outside the cylinder body, and the second belt drive The driving wheel is connected to the output shaft of the first driving member, the driven wheel of the second belt drive is arranged concentrically with the outer drive shaft, and is located in the cylinder, and the timing belt of the second belt drive passing through the first through hole to surround a driving pulley and a driven pulley of the second belt drive; The cylinder is provided with a second through hole, the second driving member is located outside the cylinder, the driving wheel of the fourth belt drive is connected to the output shaft of the second driving member, and the fourth The driven wheel of the belt drive is arranged concentrically with the inner drive shaft, and is located inside the barrel and outside the inner drive shaft, and the timing belt of the fourth belt drive passes through the second through hole to surround The driving wheel and the driven wheel of the fourth belt drive. 5. The wafer carrying device according to claim 1, wherein the lifting device adopts a screw moving table, and the screw moving table includes: a screw driving part arranged on the base; the screw rod is rotatably arranged on the base and connected with the output shaft of the screw drive member; The slider is threadedly connected with the screw rod; guide rails, arranged on the base; Wherein, the slider is slidably connected with the guide rail. 6. The wafer carrying device according to any one of claims 1-5, wherein the wafer carrying device further comprises: The protective cover is arranged on the cabinet, and the protective cover has an opening. 7. A wafer carrying method, characterized in that it is applied to the wafer carrying device described in any one of claims 1 to 6, and the wafer carrying method comprises the steps of: Controlling the second wafer pick-and-place plate to take out the detected wafer from the detection position; Controlling the first wafer pick-and-place plate to place the wafer to be detected into the detection position.

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