CN115432919A - A glass laser cutting method for etching and splitting - Google Patents

Abstract

The invention relates to the technical field of glass processing, in particular to an etching and splitting method for glass laser cutting. The method comprises the following steps: s1, planning cutting tracks of a plurality of micropores on a glass substrate, and cutting the glass substrate along the tracks by laser; s2, soaking the glass substrate containing the glass cutting seam in a fluorine-free solution, and corroding the glass waste in the micropores by the fluorine-free solution at a high temperature to finish the splitting. The method focuses the pulse laser inside the glass to enable the quality of the cut seam of the glass to change, then the whole glass substrate is soaked in the fluorine-free solution for soaking, the fluorine-free solution is used for corroding the quality part, the cut seam is widened until the glass waste is physically separated from the glass substrate, the damage to the surface of the glass is small, and the wall of the micropore hole is free of burrs and microcracks.

Description

A glass laser cutting method for etching and splitting

technical field

The invention relates to the technical field of glass processing, in particular to an etching split method for glass laser cutting.

Background technique

With the continuous improvement of glass processing technology, glass products are gradually developing towards fine processing, and the fields of application are becoming wider and wider. The processing of glass micropores is a refined processing method. Due to its unique composition, structure and characteristics, microporous glass has now developed into a new functional material with many uses. In the chemical industry, it can be used as a separation membrane for the separation of mixed gases or mixed liquids; it can also be used as a carrier for catalysts, various adsorbents and materials for gas-liquid concentration; in medicine, it can be used for medical purposes such as blood purification. Separation membrane; in biology, it can be used as a carrier for immobilized enzymes, so that the enzymes can maintain stable catalytic activity.

At present, the processing technology of microporous glass mainly adopts CNC engraving, and the existing problems mainly include: the smaller the micropore, the more difficult it is to process, the probability of glass hole chipping increases, and the yield rate is low; the cutting tool or abrasive tool is easy to wear, low efficiency, and cost High; the inner wall of the hole is rough, the slope of the hole is large, etc.

Contents of the invention

The invention provides an etching splitting method for laser cutting of glass, aiming at solving the problems existing in the existing processing of microporous glass.

The invention provides a glass laser cutting etching split method, comprising the following steps:

S1. Plan the cutting trajectory of multiple microholes on the glass substrate, and the laser cuts the glass substrate along the trajectory;

S2. Soak the glass substrate containing glass slits in a fluorine-free solution, and corrode the glass waste in the micropores with the fluorine-free solution at high temperature to complete the split.

As a further improvement of the present invention, the step S1 specifically includes:

According to the shape of the glass substrate, the number of required microholes, the size of the microholes, and the positional relationship of the microholes, the cutting track of the microholes is planned on the surface of the glass substrate, and the pulse laser walks along the cutting track and focuses on the The interior of the glass substrate, so that the interior of the glass substrate at the cutting track is qualitatively formed to form a slit.

As a further improvement of the present invention, the step S2 specifically includes:

The fluorine-free solution completely immerses the glass substrate containing the glass slit, the fluorine-free solution corrodes the textured slit to expand and widen the slit, and the glass waste is extruded out of the glass substrate to complete the split.

As a further improvement of the present invention, the laser in the step S1 is a picosecond infrared laser.

As a further improvement of the present invention, the fluorine-free solution in the step S2 includes an alkaline etching solution.

As a further improvement of the present invention, the formula ratio of the alkaline corrosion solution is 80-90% ultrapure water, 6-18% strong alkali solution, and no more than 4% weak alkali solution.

As a further improvement of the present invention, the temperature of the high temperature is above 90 degrees Celsius.

As a further improvement of the present invention, the glass substrate is made of silica glass.

The beneficial effects of the present invention are as follows: the pulsed laser is focused inside the glass to cause a qualitative change at the slit of the glass, and then the whole glass substrate is soaked in a fluorine-free solution, and the qualitative part is corroded by the fluorine-free solution, and the slit is Widen until the glass waste is physically separated from the glass substrate, the damage to the glass surface is small, and the walls of the micropores are free of burrs and microcracks.

Description of drawings

Fig. 1 is a flow chart of the glass laser cutting and eroding split method in the present invention.

detailed description

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

As shown in Fig. 1, a kind of glass laser cutting method for erosion splitting of the present invention comprises the following steps:

S1. Plan the cutting track of multiple microholes on the glass substrate, and the laser cuts the glass substrate along the track.

In step S1, specifically include:

According to the shape of the glass substrate, the number of required microholes, the size of the microholes, and the positional relationship of the microholes, the cutting track of the microholes is planned on the surface of the glass substrate, and the pulse laser walks along the cutting track and focuses on the The interior of the glass substrate, so that the interior of the glass substrate at the cutting track is qualitatively formed to form a slit.

During the trajectory design process, the cutting trajectory can also be drawn on the corresponding drawing first, and then the corresponding drawing is covered on the surface of the glass substrate. The laser captures the cutting trajectory on the drawing and walks on the glass substrate according to the trajectory. Focusing on the inside of the glass, it produces an "explosion" to vitrify, break down the glass substrate on the cutting track, and make all the glass substrates on the cutting track qualitative, that is, change the intermolecular structure of the glass substrate at the slit .

When the laser irradiates the slit, the laser has already cut through the glass substrate, causing chemical changes at the cutting track, but the glass waste in the microholes is not physically separated from the glass substrate, and the diameter of the laser spot is only 0.4um ~5um is not enough to separate the glass waste, and it needs to be separated by subsequent etching treatment of the kerf.

The laser to be irradiated is preferably a picosecond infrared laser with a wavelength of 1064 nm. Cutting glass with infrared picosecond laser in the 1064nm band can ensure no damage to the glass substrate, while improving cutting efficiency and reducing costs. If lasers with wavelengths higher than 1064nm are used, it is easy to burn the glass substrate directly, and the glass substrate cannot be cut; if lasers with wavelengths lower than 1064nm are used, such as green light or ultraviolet laser, the cutting efficiency is very low and the cost is high.

S2. Soak the glass substrate containing glass slits in a fluorine-free solution, and corrode the glass waste in the micropores with the fluorine-free solution at high temperature to complete the split. Splitting at high temperature can speed up the penetration of fluorine-free solution into the kerf and reduce the processing time. The immersion time of the fluorine-free solution is different according to the thickness of the glass, and the time can be different until the glass substrate is finally broken.

Step S2 specifically includes:

The fluorine-free solution completely immerses the glass substrate containing the glass slit, the fluorine-free solution corrodes the textured slit to expand and widen the slit, and the glass waste is extruded out of the glass substrate to complete the split.

Fluorine-free solutions include alkaline corrosion solutions, such as ultrapure water with a formula ratio of 80-90% for alkaline corrosion solutions, 6-18% strong alkali solutions, and no more than 4% weak alkali solutions. Strong alkali solutions contain hydrogen The metal compound solution of oxygen ion, the weak base solution is the metal compound solution containing carbonate ion or bicarbonate ion. When the glass is corroded at 90 degrees Celsius, the fluorine-free solution only corrodes the cutting cracks of the glass, not the glass surface, so that the qualitative waste in the slit is gradually reduced, and the slit is gradually widened, and finally the glass waste is separated from the glass substrate. Microporous glass is formed.

By soaking in fluorine-free solution, the endoplasmic glass waste in the slit can be corroded in a targeted manner without causing damage to the glass substrate itself. With the irradiation of picosecond infrared laser, the final formed glass micropore wall can be free of burrs and microcracks.

The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be assumed that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field of the present invention, without departing from the concept of the present invention, some simple deduction or replacement can be made, which should be regarded as belonging to the protection scope of the present invention.

Claims (8)

1. a method for eroding lobes of glass laser cutting, is characterized in that, comprises the following steps: S1. Plan the cutting trajectory of multiple microholes on the glass substrate, and the laser cuts the glass substrate along the trajectory; S2. Soak the glass substrate containing glass slits in a fluorine-free solution, and corrode the glass waste in the micropores with the fluorine-free solution at high temperature to complete the split. 2. The method for eroding and splitting glass laser cutting according to claim 1, characterized in that, in the step S1, specifically comprising: According to the shape of the glass substrate, the number of required microholes, the size of the microholes, and the positional relationship of the microholes, the cutting track of the microholes is planned on the surface of the glass substrate, and the pulse laser walks along the cutting track and focuses on the The interior of the glass substrate, so that the interior of the glass substrate at the cutting track is qualitatively formed to form a kerf. 3. The method for eroding and splitting glass by laser cutting according to claim 2, wherein said step S2 specifically comprises: The fluorine-free solution completely immerses the glass substrate containing the glass slit, the fluorine-free solution corrodes the textured slit to expand and widen the slit, and the glass waste is extruded out of the glass substrate to complete the split. 4. The method for etching and splitting glass by laser cutting according to claim 1, characterized in that, the laser in the step S1 is a picosecond infrared laser. 5 . The method for etching and splitting glass by laser cutting according to claim 1 , wherein the fluorine-free solution in the step S2 includes an alkaline etching solution. 5 . 6. according to claim 5, the erosion splitting method of laser cutting of glass is characterized in that, the formula ratio of the alkaline etching solution is 80-90% ultrapure water, 6-18% strong alkali solution, not more than 4% weak alkaline solution. 7. The method for etching and splitting glass laser cutting according to claim 1, characterized in that the temperature of the high temperature is above 90 degrees Celsius. 8 . The method for etching and splitting glass by laser cutting according to claim 1 , wherein the material of the glass substrate is silica glass.

Images