CN115424995B - Heat radiator - Google Patents
Heat radiator Download PDFInfo
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- CN115424995B CN115424995B CN202211373593.7A CN202211373593A CN115424995B CN 115424995 B CN115424995 B CN 115424995B CN 202211373593 A CN202211373593 A CN 202211373593A CN 115424995 B CN115424995 B CN 115424995B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of heat dissipation, in particular to a heat radiator, which comprises a heat radiation body, at least one heat radiation bent part and a heat pipe, wherein the heat radiation body comprises a first base plate and a first heat radiation fin; the heating end of the heat pipe is attached to the heat source, the flexible end is connected with the heat dissipation body and the heat dissipation bent part, and the condensation end extends into the heat dissipation bent part for heat dissipation; the heat dissipation bent part comprises a second heat dissipation fin; the radiator is provided with a first state and a second state, and under the action of external force, the heat dissipation bending part drives the flexible end to bend, and the first state is switched to the second state; when the air conditioner is in a first state and a second state, the extending directions of the first radiating fins and the second radiating fins are parallel, and the first radiating fins and the second radiating fins are mutually shielded in the front and back direction in the air inlet direction in the first state; in the second state, the two are not shielded. Because the heat can be rapidly taken away through the air inlet in the second state, the temperature cascade effect is broken; and the state of the radiator can be adjusted according to the requirement.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat radiator.
Background
As the power consumption of the chip is larger, the heat generated by the chip during operation is also larger. If the junction temperature of the chip is to be maintained within a normal range, a certain heat dissipation measure needs to be taken to rapidly transfer heat out, so as to ensure the normal operation of the chip.
The heat dissipation of the chip is usually performed by transferring heat from the chip to a heat sink through a heat pipe, and transferring the heat from the heat sink to the environment. Generally, when designing a heat sink, the condensing end of the heat pipe is close to the air inlet, and the heat source is far away from the condensing section, so that the condensing end is at the position where the air flows most quickly and the heat source is not in front of the condensing end, thereby helping the condensing end to rapidly reduce the temperature of the heat pipe. However, due to the existence of the temperature cascade effect, the flowing air transfers the heat of the condensation section backwards, so that the heat at the position of the heat source is accumulated, and the overall temperature is unbalanced; and once the radiator is designed and molded at present, the maximum heat-dissipating capacity of the radiator is fixed and unchangeable, and the heat-dissipating capacity can not be adjusted according to the demand.
Disclosure of Invention
Aiming at the technical problems, the technical scheme adopted by the invention is as follows:
a radiator comprises a radiating body, at least one radiating bent part and a heat pipe, wherein the radiating body comprises a first base plate and a first radiating fin, and the first base plate is provided with a heat pipe groove leading to the direction of a first heat source; the heat pipe comprises a heating end, a flexible end and a condensation end, the heating end penetrates through the groove of the heat pipe and is attached to the first heat source, the flexible end is connected with the heat dissipation body and the heat dissipation bent part, and the condensation end extends into the heat dissipation bent part for heat dissipation; the heat dissipation bent part comprises a second heat dissipation fin; the radiator is provided with a first state and a second state, and under the action of external force, the heat dissipation bending part drives the flexible end to bend, and the first state is switched to the second state; in the first state, the extending directions of the first radiating fins and the second radiating fins are parallel, and the first radiating fins and the second radiating fins are mutually shielded in the front and back direction in the air inlet direction; when the second state, the extending directions of the first radiating fins and the second radiating fins are parallel, and the first radiating fins and the second radiating fins are not shielded in the air inlet direction.
Compared with the prior art, the radiator provided by the invention has obvious beneficial effects, and by means of the technical scheme, the radiator provided by the invention can achieve considerable technical progress and practicability, has industrial wide utilization value, and at least has the following beneficial effects:
the invention provides a radiator, which is characterized in that a heat dissipation body and a heat dissipation bent part of the radiator are connected through a heat pipe, wherein the heat dissipation body comprises a first base plate and first heat dissipation fins, and the heat dissipation bent part comprises second heat dissipation fins; the heating end of the heat pipe is attached to a first heat source through a heating groove in the first substrate, and the condensing end of the heat pipe extends into the heat dissipation bent part; under the action of external force, the radiator is switched from a first state to a second state, in the second state, the extending directions of the first radiating fins and the second radiating fins are parallel, and the first radiating fins and the second radiating fins are not shielded in the air inlet direction, so that the heating part and the radiating part are separated, in the second state, heat can be taken away quickly through the inlet air of the air inlet respectively, and the temperature cascade effect is broken; and the user can adjust the state of the radiator according to the requirement.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat sink in a first state according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat sink in a second state according to an embodiment of the present invention;
FIG. 3 is a schematic view of a partial structure of a connection portion between the heat dissipation body and the heat dissipation bending portion;
FIG. 4 is a side view of the heat sink body shown in FIG. 1;
fig. 5 is a schematic partial structure view of the second heat dissipating fins in the heat dissipating bent portion;
FIG. 6 is a partial structural diagram of a support member in a heat pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, fig. 2 and fig. 3, a heat sink is shown, which includes a heat sink body 100, at least one heat dissipating bending portion 200 and a heat pipe 300, wherein the heat sink body 100 includes a first heat dissipating fin 110 and a first substrate 120, and the first substrate 120 has a heat pipe groove leading to a first heat source 400; the heat pipe 300 includes a heating end 310, a flexible end 320 and a condensing end 330, the heating end 310 passes through the heat pipe groove and is attached to the first heat source 400, the flexible end 320 is connected to the heat dissipating body 100 and the heat dissipating bent portion 200, and the condensing end 330 extends into the heat dissipating bent portion 200 for heat dissipation. The heat dissipating bending part 200 includes a second heat dissipating fin 210. The radiator has a first state and a second state, fig. 1 shows the radiator in the first state, fig. 2 shows the radiator in the second state, and the direction indicated by the arrow in fig. 1 and 2 is the air intake direction. In the first state, the extending directions of the first heat dissipation fins 110 and the second heat dissipation fins 210 are parallel, and the first heat dissipation fins 110 and the second heat dissipation fins 210 are shielded from each other in the front and back direction in the air inlet direction; in the second state, the extending directions of the first heat dissipation fins 110 and the second heat dissipation fins 210 are parallel, and the first heat dissipation fins 110 and the second heat dissipation fins 210 are not shielded in the air inlet direction; under the action of external force, the heat dissipation bending part 200 drives the flexible end 320 to bend, and the first state is switched to the second state.
It is understood that the heat sink is not included in the structure of the heat sink, and the heat source is the object of the heat sink to dissipate the heat.
Specifically, the first substrate is a substrate having a thermal conductive property. Optionally, the substrate is made of aluminum. Referring to fig. 4, the first heat dissipation fins 110 are vertically disposed on the first substrate 120, and the first heat dissipation fins are fins with thermal conductivity. Optionally, the first heat dissipation fin may also be made of aluminum. Alternatively, the first substrate 120 and the first heat dissipation fin 110 may be an integrally formed structure.
Specifically, one end of the heat pipe 300 attached to the first heat source 400 is a heating end 310, one end of the heat pipe away from the first heat source 400 is a condensation end 330, and the bendable portion for connecting the heating end 310 and the condensation end 330 is a flexible end 320. Specifically, the flexible end 320 has no resilience and a certain hardness, and can be bent and maintained at a certain angle under the action of an external force. Optionally, the flexible end 320 is a bellows, or a viton tube supported by a spring inside. Optionally, the corrugated tube is made of copper or copper alloy. It is understood that the heat pipe grooves and the first heat dissipation fins 110 provided on the first substrate 120 are located on two different sides of the first substrate 120, which are opposite to each other.
Further, one side of the heating end 310 close to the first heat source 400 is a plane, and the height of the plane is greater than or equal to the groove. The height of the groove is larger than or equal to that of the groove, the heating end can be attached to the first heat source, and the contact area between the heating end and the first heat source can be increased by taking the plane as one side of the heating end, so that more heat can be transferred by the heating end.
Optionally, the first heat source 400 is a chip. Optionally, the chip is a CPU processor, a GPU processor, an AI processor, or the like.
As a preferred embodiment, referring to fig. 1 and fig. 2 again, the heat sink includes two heat dissipating bent portions, namely a first heat dissipating bent portion 200 and a second heat dissipating bent portion 500, and the first heat dissipating bent portion 200 and the second heat dissipating bent portion 500 have different bending directions. Preferably, the bending directions of the first heat dissipation bending part and the second heat dissipation bending part are mirror-symmetric.
It should be noted that a heat conductive adhesive may be further disposed between the first heat source 400 and the heating end 310.
Specifically, the second heat dissipation fins comprise a plurality of parallel fins, and the fins are connected through a buckle connecting piece.
The heat pipe 300 connects the heat dissipating body 100 and the heat dissipating bent portion 200 of the heat sink, and the two portions connected by the heat pipe break the temperature cascade effect. Traditional design generally can be close to the air intake with the condensation end of heat pipe, and condensation end is kept away from again to first heat source, consequently when the radiator is a whole, because the existence of temperature cascade effect, the radiating fin's that is close to the air intake temperature can be given for the radiating fin who keeps away from the air intake, and then lead to keeping away from the radiating fin's of air intake temperature along with the time lapse more and more high, also be the temperature of first heat source can be higher and higher, but because the radiator that this embodiment provided has at least one heat dissipation portion of bending through the heat pipe connection, make the radiator divide into two parts, and then make heating part and radiating part separate, can be respectively through the quick heat of taking away of the air inlet of air intake under the second state, the temperature cascade effect has been broken.
As a preferred embodiment, the condensation end 330 penetrates all the second heat dissipation fins 210 to dissipate heat, and the penetration of the condensation end of the heat pipe through all the second heat dissipation fins enables the heat of the heat pipe to be transferred to each fin to improve the heat dissipation capability of the heat sink. It should be noted that, referring to fig. 3, the heating end 310 of the heat pipe extends along the heat dissipation groove of the first substrate 120, and after the end of the heat dissipation body extends out from the first substrate 120 through the flexible end 320 and extends into a distance along the second heat dissipation fin 210 of the heat dissipation bending portion, the end of the heat dissipation body vertically or at a certain angle passes through the through hole on the second heat dissipation fin 210. Extending a distance enables more uniform heat transfer to each second fin.
As a preferred embodiment, referring to fig. 5, the second heat dissipating fin 210 has a through hole through which the heat supplying pipe 300 passes, the edge of the through hole has a bending structure 211 attached to the heat supplying pipe 300, the bending structure 211 increases the contact area with the condensing end, so that the heat at the condensing end can be transferred to the heat dissipating fin through the bending structure, thereby improving the heat dissipating capability of the heat sink.
As a preferred embodiment, referring to fig. 1 again, the heat dissipating bent portion 200 is disposed at an end of the heat dissipating body 100 close to the air inlet, and an arrow in the figure indicates an air inlet direction. Referring to fig. 2 again, when the heat sink is in the second state, the first heat dissipating fins 110 and the second heat dissipating fins 210 are not shielded from each other in the air inlet direction, that is, the heat dissipating body 100 having the first heat dissipating fins and the heat dissipating bending portion 200 having the second heat dissipating fins are not shielded from each other, and the closer the heat dissipating bending portion 200 is to one end of the air inlet, the stronger the heat dissipating capability is.
As a preferred embodiment, referring to fig. 1 and fig. 2 again, the extending direction of the first heat dissipating fins 110 and the second heat dissipating fins 210 is parallel to the wind direction of the wind inlet, so that the resistance of the wind is reduced, and the heat can be better transferred from the surfaces of the heat dissipating fins to the environment. The direction of the arrow in the figure is the air inlet direction of the air inlet.
As a preferred embodiment, the heat-dissipating bent portion 200 has a second substrate and a groove is formed on the second substrate, the second heat-dissipating fin is vertically disposed on the second substrate, and the condensation end extends into the second substrate through the groove. And transferring the heat to the second heat dissipation fins through the second substrate for heat dissipation.
As a preferred embodiment, the second substrate is provided with a heat pipe groove leading to the second heat source, and the thermal resistance value of the second heat source is smaller than that of the first heat source. Because the thermal resistance value of the second heat source is smaller than that of the first heat source, the heat of the first heat source is radiated through the heat radiation space of the second heat source, the first heat source and the second heat source can be ensured to radiate heat quickly and work normally, and the purpose of balancing the heat radiation capability of the whole edition is achieved under the condition that the area of a radiator is not increased.
Specifically, a capillary structure for dissipating heat is provided in the heat pipe. Optionally, the capillary structure is a wire mesh, a bionic vein structure, or the like.
As a preferred embodiment, the capillary structure in the flexible end is a wire mesh. The silk screen structure can not suffer destruction because of buckling of flexible end, if adopt copper powder sintered structure, can lead to copper powder sintered structure to split when flexible end is buckled.
As a preferred embodiment, a plurality of grooves extending along the axial direction of the heat pipe are arranged on the inner wall of the heat pipe, and a wire mesh is filled in the heat pipe. The cooperation of the grooves and the wire mesh can further increase the heat dissipation capacity.
As a preferred embodiment, a copper powder sintered structure is adopted in the heating end and the condensation end, and a wire mesh structure is adopted in the flexible end, the length of the wire mesh structure in the axial direction of the heat pipe is larger than that of the flexible end, the wire mesh structure and the copper powder sintered structure have an overlapping area, and the copper powder in the overlapping area is bonded with the wire mesh to form an integral capillary structure. The copper powder bonding wire mesh is obtained, so that the copper powder in the overlapping area is heated, melted and solidified again to bond the wire mesh, and the copper powder in the heat pipe is sintered and the wire mesh forms an integral capillary structure.
In summary, the embodiment of the present invention provides a heat sink, in which a heat pipe is connected to a heat dissipating body and a heat dissipating bending portion of the heat sink, the heat dissipating body includes a first substrate and a first heat dissipating fin, and the heat dissipating bending portion includes a second heat dissipating fin; the heating end of the heat pipe is attached to the heat source through the heating groove in the first substrate, and the condensing end of the heat pipe extends into the heat dissipation bent part; under the action of external force, the radiator is switched from a first state to a second state, in the second state, the extending directions of the first radiating fins and the second radiating fins are parallel, and the first radiating fins and the second radiating fins are not shielded in the air inlet direction, so that the heating part and the radiating part are separated, in the second state, heat can be taken away quickly through the inlet air of the air inlet respectively, and the temperature cascade effect is broken; and the user can adjust the state of the radiator according to the requirement.
The heat sink provided by the first embodiment can not only break through the temperature cascade effect, but also enable the heat sink to be in the second state under the action of external force according to the size of the space allowed to be used, so as to obtain the maximum heat dissipation capacity, and achieve the purpose of flexibly setting the state of the heat sink according to the size of the space. However, the switching state of the heat sink needs to be driven by external force, so that the state switching is limited, and the purpose of adaptive adjustment cannot be achieved.
Example two
Referring to fig. 1, fig. 2 and fig. 3 again, a second embodiment also provides a heat sink with adaptive adjustment of heat dissipation, and unlike the first embodiment, the heat pipe includes a memory metal. Specifically, the heat sink includes a heat dissipating body 100, at least one heat dissipating bending portion 200 and a heat pipe 300, the heat dissipating body 100 includes a first heat dissipating fin 110 and a first substrate 120, and the first substrate 120 has a heat pipe groove leading to a direction of a first heat source 400; the heat pipe 300 is connected to the heat dissipating body 100 and the heat dissipating bending portion 200, the heat pipe 300 includes a heating end 310 and a condensing end 330, the heating end 310 passes through the heat pipe groove and is attached to the first heat source 400, and the condensing end 330 extends into the heat dissipating bending portion 200 for heat dissipation; the heat dissipating bending part 200 includes a second heat dissipating fin 210. Wherein heat pipe 300 comprises a memory metal. The radiator has a first state and a second state, when the temperature of the memory metal at the joint of the radiating body 100 and the radiating bent part 200 is greater than or equal to a temperature threshold value, the memory metal drives the heat pipe to be bent and switched to the second state, and when the temperature is less than the temperature threshold value, the memory metal drives the heat pipe to be restored to the first state; wherein the temperature threshold is less than a temperature warning value of the first heat source and greater than the ambient temperature; in the first state, the extending directions of the first heat dissipation fins 110 and the second heat dissipation fins 210 are parallel, and the first heat dissipation fins 110 and the second heat dissipation fins 210 are shielded from each other in the front and back direction in the air inlet direction; in the second state, the extending directions of the first and second heat dissipating fins 110 and 210 are parallel, and the first and second heat dissipating fins 110 and 210 are parallelThe second heat dissipating fins 210 are not shielded from each other in the air intake direction. For example, when the temperature received by the memory metal is T, and T is greater than the temperature threshold T 0 When the memory metal drives the heat pipe to bend, the heat dissipation bending part is driven to bend to a second state.
It should be noted that the memory metal is a memory metal with a two-way memory effect. In the training process, when the temperature is greater than or equal to the temperature threshold, the memory metal at the joint of the heat dissipation body 100 and the heat dissipation bending part 200 is placed in the second state, and when the temperature is less than the temperature threshold, the memory metal at the joint of the heat dissipation body 100 and the heat dissipation bending part 200 is placed in the first state, and the training is repeated, so that the memory metal has two-way memory. In practical application, the temperature is greater than or equal to the temperature threshold value, the memory metal is automatically switched to the second state, and when the temperature is less than the temperature threshold value, the memory metal is automatically switched to the first state.
Optionally, the memory metal is made of a TiNi-based shape memory alloy, a copper-based shape memory alloy, an iron-based shape memory alloy, or the like.
As a preferred embodiment, the temperature threshold is less than k1-k2 times the temperature alert value of the first heat source and greater than the ambient temperature. Optionally, the first heat source is a chip. When the first heat source is a chip, the temperature warning value is the chip junction temperature, and optionally, k1 is 75% and k2 is 85%. Preferably, the temperature threshold is less than 80% of the chip junction temperature and greater than ambient temperature. For example, when the chip junction temperature is 85 ℃, the memory metal is trained by the following steps: when the temperature is higher than 85 ℃, the memory metal is placed in a second state by using external force; when the temperature is lower than 85 ℃, the memory metal is placed in a first state by using external force; and repeating the training for a plurality of times. When the temperature of the heat source absorbed by the heating end is transferred to the connection between the heat dissipation body 100 and the heat dissipation bending part 200, a certain loss will be generated in the temperature, and the temperature at the connection is necessarily lower than the temperature of the heating end, that is, when the memory metal senses that the temperature is 80 ℃, the junction temperature of the chip may reach 85, so the set temperature threshold is lower than the junction temperature of the chip, and similarly, the set temperature threshold is lower than the warning value of the thermal suit.
Optionally, the whole heat pipe 300 is made of memory metal, or the heat pipe has a double-layer structure formed by copper and memory metal, or a double-layer structure formed by copper alloy and memory metal, or memory metal is used as a support.
As a preferred embodiment, referring to fig. 6, a support member 301 made of memory metal is embedded in the heat pipe 300, the support member 301 is attached to the heat pipe 300, and both ends of the heat pipe 300 are welded to the support member. The memory metal is used as the supporting member 301 to cooperate with the heat pipe 300, so that the amount of the memory metal can be further reduced and the cost can be reduced under the condition of ensuring the automatic switching state. Preferably, the support member is an arc-shaped structural member attached to the inner wall of the heat pipe, and the axial length of the support member is equal to the length of the heat pipe.
As a preferred embodiment, the heat pipe at the joint of the heat dissipation body and the heat dissipation bent part is made of memory metal. Optionally, the whole heat pipe at the joint is made of memory metal, or the joint is of a double-layer structure formed by copper and the memory metal, or the memory metal is used as a support. Wherein the supporting piece is attached to the flexible end, and the two ends of the flexible end are welded and connected with the memory metal. Preferably, the supporting piece is a section of arc-shaped structural piece attached to the inner wall of the flexible end, and the axial length of the supporting piece is equal to that of the flexible end.
In summary, the second embodiment provides a heat sink capable of adaptively adjusting heat dissipation, in which a memory metal is used at a connection portion between a heat dissipation body and a heat dissipation bending portion, when a temperature is greater than or equal to a temperature threshold, the memory metal drives a heat pipe to be bent and switched to a second state, and when the temperature is less than the temperature threshold, the memory metal drives the heat pipe to be restored to the first state, so as to achieve a purpose of automatically switching a working state according to a temperature of the heat pipe, and automatically switch to the second state when the temperature is higher, so as to enhance a heat dissipation capability of the heat sink.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for the purpose of illustration and is not intended to limit the scope of the invention. It will also be appreciated by those skilled in the art that various modifications may be made to the embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A radiator is characterized by comprising a radiating body, a heat pipe and at least one radiating bent part, wherein the radiating body comprises a first base plate and a first radiating fin, and the first base plate is provided with a heat pipe groove leading to the direction of a first heat source; the heat pipe comprises a heating end, a flexible end and a condensation end, the heating end penetrates through the groove of the heat pipe and is attached to the first heat source, the flexible end is connected with the heat dissipation body and the heat dissipation bent part, and the condensation end extends into the heat dissipation bent part for heat dissipation;
the heat dissipation bent part comprises a second heat dissipation fin;
the radiator is provided with a first state and a second state, and under the action of external force, the heat dissipation bent part drives the flexible end to bend, and the first state is switched to the second state; in the first state, the extending directions of the first radiating fins and the second radiating fins are parallel, and the first radiating fins and the second radiating fins are mutually shielded in the front and back direction in the air inlet direction; when the second state, the extending directions of the first radiating fins and the second radiating fins are parallel, and the first radiating fins and the second radiating fins are not shielded in the air inlet direction.
2. The heat sink according to claim 1, wherein the heat sink comprises two heat dissipation bent portions, wherein the two heat dissipation bent portions are a first heat dissipation bent portion and a second heat dissipation bent portion respectively, and the bending directions of the first heat dissipation bent portion and the second heat dissipation bent portion are different.
3. The heat sink as claimed in claim 1, wherein the second heat dissipating fin has a through hole for passing the heat pipe therethrough, and an edge of the through hole has a bent structure for fitting the heat pipe.
4. The heat sink of claim 1, wherein the heat-dissipating bent portion is disposed at an end of the heat-dissipating body close to the air inlet.
5. The heat sink as claimed in claim 1, wherein the first and second fins extend in a direction parallel to a wind direction of the inlet.
6. The heat sink as claimed in claim 1, wherein the heat dissipating bending portion has a second substrate and a groove is formed on the second substrate, and the condensation end extends into the second substrate through the groove.
7. The heat sink as claimed in claim 1, wherein the heat dissipating bending portion has a second substrate and the second substrate has a heat pipe groove therein leading to a second heat source, and a thermal resistance of the second heat source is smaller than a thermal resistance of the first heat source.
8. The heat sink of claim 1, wherein the heat pipe has a capillary structure therein for dissipating heat, and the capillary structure in the flexible end is a wire mesh.
9. The heat sink of claim 1, wherein a copper powder sintered structure is used in the heating end and the condensing end and a wire mesh structure is used in the flexible end, the wire mesh structure having a greater length in the axial direction of the heat pipe than the flexible end, the wire mesh structure and the copper powder sintered structure having an overlapping region, the copper powder in the overlapping region bonding the wire mesh to form an integral capillary structure.
10. The heat sink according to claim 1, wherein a plurality of grooves are formed on an inner wall of the heat pipe along an axial direction of the heat pipe, and a wire mesh is filled in the heat pipe.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211373593.7A CN115424995B (en) | 2022-11-04 | 2022-11-04 | Heat radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211373593.7A CN115424995B (en) | 2022-11-04 | 2022-11-04 | Heat radiator |
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| CN115424995B true CN115424995B (en) | 2023-01-06 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005260237A (en) * | 2004-03-11 | 2005-09-22 | Furukawa Electric Co Ltd:The | Module for cooling semiconductor element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080007915A1 (en) * | 2006-07-06 | 2008-01-10 | Chao-Chuan Chen | Heat sink device for a heat generating element |
| JP2016090080A (en) * | 2014-10-30 | 2016-05-23 | 富士通株式会社 | Cooling device and electronic device |
| US10595439B2 (en) * | 2018-06-25 | 2020-03-17 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005260237A (en) * | 2004-03-11 | 2005-09-22 | Furukawa Electric Co Ltd:The | Module for cooling semiconductor element |
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