CN115411175B - Magnetic assembly and packaging method thereof - Google Patents
Magnetic assembly and packaging method thereofInfo
- Publication number
- CN115411175B CN115411175B CN202110578524.9A CN202110578524A CN115411175B CN 115411175 B CN115411175 B CN 115411175B CN 202110578524 A CN202110578524 A CN 202110578524A CN 115411175 B CN115411175 B CN 115411175B
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- substrate
- shielding
- magnetic
- circuit board
- chip
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- H10W42/20—
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
本申请公开了一种磁性组件包括基板，基板引脚，位于所述基板上表面的芯片，电路板，屏蔽部件；所述电路板分布有线路以及位于所述线路两端的焊点，所述芯片和所述基板引脚通过所述焊点和所述线路连接，所述屏蔽部件为所述芯片提供磁屏蔽结构。可见，本申请中磁性组件的芯片和基板引脚通过焊点和线路连接，也即芯片和基板引脚通过电路板连接，由于电路板厚度薄，可以减小磁性组件的封装高度，并且，利用电路板代替金线，有效避免金线与屏蔽部件接触，发生短路，提升磁性组件的可靠性；另外，屏蔽部件可以贴在电路板上，还可以保证后续塑封的可靠性。此外，本申请还提供一种具有上述优点的磁性组件的封装方法。
This application discloses a magnetic component including a substrate, substrate pins, a chip located on the upper surface of the substrate, a circuit board, and a shielding component. The circuit board has distributed lines and solder joints located at both ends of the lines. The chip and the substrate pins are connected to the lines via the solder joints. The shielding component provides a magnetic shielding structure for the chip. As can be seen, in this application, the chip and substrate pins of the magnetic component are connected via solder joints and lines, that is, the chip and substrate pins are connected via a circuit board. Due to the thinness of the circuit board, the packaging height of the magnetic component can be reduced. Furthermore, using a circuit board instead of gold wires effectively avoids contact between the gold wires and the shielding component, preventing short circuits and improving the reliability of the magnetic component. In addition, the shielding component can be attached to the circuit board, ensuring the reliability of subsequent molding. Furthermore, this application also provides a packaging method for a magnetic component with the above advantages.
Description
Technical Field
The application relates to the technical field of chip packaging, in particular to a magnetic component and a packaging method thereof.
Background
Magnetic materials and magnetoresistive elements are widely used in memory and sensor applications, for example, magnetic random access memory (Magnetic Random Access Memory, abbreviated MRAM) for writing by magnetization reversal of the free layer in the magnetic tunnel junction. In order to avoid adverse effects of the external magnetic field on the performance of the magnetic component, it is important to magnetically shield the magnetic component.
At present, as shown in fig. 1, a schematic structure diagram of a magnetic shielding package of a magnetic assembly is shown in fig. 1, a chip 2 is fixed on a substrate 1, a chip 2 is connected with a substrate pin 3 through a gold wire 6, and because a magnetic shielding layer 5 is conductive, the gold wire 6 is in contact with the magnetic shielding layer 5 to cause a short circuit of the chip 2, a sufficient distance between the magnetic shielding layer 5 and the substrate 1 needs to be ensured, so that the height of the magnetic assembly is large, and due to the structural design of the gold wire 6 and the magnetic shielding layer 5, the package body 4 formed by plastic packaging materials is not fully filled during plastic packaging, so that the reliability of the magnetic assembly is reduced.
Therefore, how to solve the above technical problems should be of great interest to those skilled in the art.
Disclosure of Invention
The application aims to provide a magnetic component and a packaging method thereof, so as to reduce the packaging height of the magnetic component and improve the reliability of the magnetic component.
In order to solve the technical problems, the application provides a magnetic assembly, which comprises a substrate, substrate pins, a chip positioned on the upper surface of the substrate, a circuit board and a shielding component;
The circuit board is distributed with lines and welding spots positioned at two ends of the lines, the chip and the substrate pins are connected with the lines through the welding spots, and the shielding component provides a magnetic shielding structure for the chip.
Optionally, the shielding component is a shielding frame disposed above the chip and connected to the substrate;
the circuit board is provided with a magnetic shielding loop notch penetrating through the thickness, and the side wall of the shielding frame is connected with the substrate through the magnetic shielding loop notch so as to form the magnetic shielding structure for the chip.
Optionally, the shielding frame and the substrate are packaged in an SOP packaging mode.
Optionally, the shape of the shielding frame is an inverted U shape, and a side wall of the inverted U-shaped shielding frame is connected with the substrate.
Optionally, the substrate is provided with positioning marks for aligning the shielding frame.
Optionally, the circuit board is a flexible circuit film.
Optionally, the substrate comprises a non-magnetic shielding substrate main body and a magnetic shielding base plate positioned on the upper surface of the non-magnetic shielding substrate main body.
Optionally, the material of the shielding frame is a soft magnetic material with high saturation magnetization.
The application also provides a packaging method of the magnetic component, which comprises the following steps:
fixing the chip on the upper surface of the substrate;
wiring and welding spots are arranged on the circuit board;
welding two ends of the circuit on the circuit board on the chip and the substrate pins respectively through the welding points;
And arranging a shielding component to provide a magnetic shielding structure for the chip to obtain the magnetic assembly.
Optionally, when the shielding member is a shielding frame disposed above the chip and connected to the substrate, the disposing the shielding member to provide the magnetic shielding structure for the chip includes:
connecting the shielding frame with the substrate through a magnetic shielding loop notch positioned on the circuit board so as to form a magnetic shielding structure for the chip;
correspondingly, the step of arranging the circuit and the welding spots on the circuit board comprises the following steps:
and arranging the magnetic shielding loop notch penetrating through the thickness on the circuit board, and arranging the circuit and the welding spots on the circuit board, wherein the circuit comprises a non-direct connection circuit.
Optionally, when the substrate includes a non-magnetic shielding substrate body and a magnetic shielding pad plate located on an upper surface of the non-magnetic shielding substrate body, the fixing the chip on the upper surface of the substrate includes:
placing the magnetic shielding backing plate on the upper surface of the non-magnetic shielding substrate main body;
And fixing the chip on the upper surface of the magnetic shielding base plate.
Optionally, the disposing the magnetic shielding loop notch through the thickness on the circuit board includes:
And arranging the magnetic shielding loop notch penetrating through the thickness on the flexible circuit film.
Optionally, before the shielding frame is connected to the substrate through a magnetic shielding loop slot on the circuit board, the method further includes:
Manufacturing a positioning mark on the substrate;
Correspondingly, the connecting the shielding frame with the substrate through the magnetic shielding loop notch on the circuit board comprises the following steps:
the shielding frame is aligned with the substrate by means of the positioning marks and is connected with the substrate through a magnetic shielding loop notch on the circuit board.
The application provides a magnetic assembly, which comprises a substrate, substrate pins, a chip, a circuit board and a shielding component, wherein the chip is positioned on the upper surface of the substrate, the circuit board is distributed with circuits and welding spots positioned at two ends of the circuits, the chip and the substrate pins are connected with the circuits through the welding spots, and the shielding component provides a magnetic shielding structure for the chip.
The application discloses a magnetic component, which comprises a substrate, substrate pins, a chip, a circuit board, a shielding component and a circuit board, wherein the chip and the substrate pins are arranged on the upper surface of the substrate, the chip and the substrate pins are connected through welding spots and circuits, namely, the chip and the substrate pins are connected through the circuit board.
In addition, the application also provides a packaging method of the magnetic assembly with the advantages.
Drawings
For a clearer description of embodiments of the application or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained from them without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a prior art magnetic shielding package of a magnetic assembly;
FIG. 2 is a schematic top view of a gold wire connecting a chip to a substrate pin in the prior art;
FIG. 3 is a schematic cross-sectional view of a magnetic assembly according to an embodiment of the present application;
FIG. 4 is a schematic diagram of another magnetic component according to an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a substrate according to an embodiment of the present application;
Fig. 6 is a schematic view of a shielding frame according to an embodiment of the present application;
FIG. 7 is a schematic top view of a substrate and substrate pins according to the present application;
fig. 8 is a top view of a circuit board according to an embodiment of the present application;
FIG. 9 is a schematic top view of a substrate and substrate pins according to another embodiment of the present application;
Fig. 10 is a top view of another circuit board according to an embodiment of the present application;
FIG. 11 is a flowchart of a method for packaging a magnetic component according to an embodiment of the present application;
fig. 12 is a flowchart of another method for packaging a magnetic component according to an embodiment of the present application.
Detailed Description
In order to better understand the aspects of the present application, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
As described in the background art, at present, the chip in the magnetic assembly is connected with the substrate pin through the gold wire, because the magnetic shielding layer is conductive, the gold wire contacts with the magnetic shielding layer to cause a chip short circuit, so that a sufficient distance between the magnetic shielding layer and the substrate needs to be ensured to cause a larger height of the magnetic assembly, the structural design of the gold wire and the magnetic shielding layer can lead to insufficient filling of plastic packaging materials during plastic packaging to cause the reliability of the magnetic assembly to be reduced, and in order to avoid the short circuit, the gold wire between the chip and the pin leads to great limitation on the design of the side wall shielding structure of the magnetic assembly.
In view of this, the present application provides a magnetic assembly, please refer to fig. 3, fig. 3 is a schematic cross-sectional view of a magnetic assembly provided by the embodiment of the present application, which includes a substrate 1, substrate pins 3, a chip 2 located on the upper surface of the substrate 1, a circuit board 8, and a shielding component, wherein the circuit board 8 is distributed with wires and solder joints 9 located at two ends of the wires, the chip 2 and the substrate pins 3 are connected through the solder joints 9 and the wires, and the shielding component 7 provides a magnetic shielding structure for the chip 2.
The shielding member 7 is not particularly limited in the present application, as the case may be. For example, when it is required to shield the magnetic field in the parallel and perpendicular directions of the chip 2, the shielding member 7 is a shielding frame disposed above the chip 2 and connected to the substrate 1, wherein the circuit includes a non-direct connection circuit, the circuit board 8 is provided with a magnetic shielding circuit slot penetrating through the thickness, and the side wall of the shielding frame is connected to the substrate 1 through the magnetic shielding circuit slot to form the magnetic shielding structure for the chip 2. The shielding member 7 is a shielding frame in fig. 3. The reason for the arrangement of the non-direct connection line is that the magnetic shielding loop notch needs to be arranged on the circuit board 8, and the line needs to avoid the magnetic shielding loop notch, meanwhile, the arrangement of the non-direct connection line can also increase the width of the side wall of the shielding frame 7, reduce the difference between the width of the side wall and the width of the shielding frame 7, and improve the shielding efficiency. The purpose of the magnetic shielding circuit notch is to connect the shielding frame 7 with the substrate 1 to form a magnetic shielding structure for the chip 2. The shielding frame 7 cannot be in contact with the substrate pins 3 to avoid causing a short circuit. As can be seen from fig. 2, the gold wire 6 (shown in the dashed line frame) between the chip 2 and the pin in the existing magnetic component makes the design of the magnetic component sidewall shielding structure greatly limited, and the magnetic shielding circuit notch 13 is provided on the circuit board 8, so that the circuit on the circuit board 8 is also designable, thereby effectively avoiding short circuit and improving the reliability of the magnetic component.
When the magnetic field parallel to the direction of the chip 2 needs to be shielded, the shielding parts are provided with two shielding layers at two sides of the chip 2, wherein one shielding layer is located above the chip 2 by a certain distance, and the other shielding layer is located below the substrate 1, as shown in fig. 4.
The chip 2 is fixedly connected to the upper surface of the substrate 1, the circuit board 8 can be provided with circuits according to the needs, two ends of each circuit are respectively provided with a welding spot 9, and after the welding spots 9 are welded with the chip 2 and the substrate pins 3, the chip 2 and the substrate pins 3 are connected, namely, in the embodiment, the chip 2 and the substrate pins 3 are connected by the circuit board 8.
The shielding component is used for providing a magnetic shielding structure for the chip, so that the magnetic component can generate shielding effect on external magnetic fields.
The magnetic component further comprises a packaging body 4, the packaging body 4 is made of resin, the commonly used packaging materials are epoxy resin, the cost is low, the heat resistance is good, the mechanical strength is high, other types of resin can be selected, and the application is not limited in particular.
The kind of the circuit board 8 is not particularly limited in the present application, and may be set by itself. The circuit board 8 is, for example, a flexible circuit film or a printed circuit board. Wherein the printed circuit board is PCB (Printed Circuit Board). The thickness of the flexible circuit film, namely the flexible circuit board, is smaller than that of the printed circuit board, and the thickness of the magnetic component adopting the flexible circuit film is thinner. The thickness of the circuit board is preferably 100um or less.
It should be noted that the type of the chip 2 is not particularly limited in the present application, as the case may be. For example, the chip 2 may be a memory chip or a sensor chip.
The substrate 1 is not particularly limited in the present application, and may be set by itself. For example, the substrate 1 is an integrated magnetic shielding substrate, that is, the whole material of the substrate 1 is a magnetic shielding material, wherein the material of the substrate includes, but is not limited to, any one of silicon steel, pure iron, iron-nickel alloy, permalloy. Or the substrate 1 includes a non-magnetic shielding substrate body 11 and a magnetic shielding base plate 12 located on the upper surface of the non-magnetic shielding substrate body 11 as shown in fig. 5. Wherein the non-magnetic shielding substrate body 11 is formed of a material not having a magnetic shielding function, the material of the non-magnetic shielding substrate body may be copper, aluminum, or the like, and the magnetic shielding backing plate 12 is formed of a material having a magnetic shielding function, and the material of the magnetic shielding backing plate includes, but is not limited to, any one of silicon steel, pure iron, iron-nickel alloy, permalloy.
The magnetic component comprises a substrate 1, substrate pins 3, a chip 2, a circuit board 8 and a shielding component 7, wherein the chip 2 and the substrate pins 3 are positioned on the upper surface of the substrate 1, the chip 2 and the substrate pins 3 are connected through welding spots 9 and circuits, namely, the chip 2 and the substrate pins 3 are connected through the circuit board 8, and the thickness of the circuit board 8 is thin, so that the packaging height of the magnetic component can be reduced, and gold wires are replaced by the circuit board 8, so that the gold wires are effectively prevented from being in contact with the shielding component to cause short circuit, the reliability of the magnetic component is improved, and in addition, the shielding component can be attached to the circuit board, and the reliability of subsequent plastic packaging can be ensured.
On the basis of the above embodiment, when the shielding member is a shielding frame, in order to simplify the production process of the shielding member, it is preferable that the shielding frame is in an inverted U shape, and a side wall of the inverted U-shaped shielding frame is connected to the base plate, and the shielding frame includes a cover plate and a side wall extending downward relatively at a side portion of the cover plate, as shown in fig. 6. In other embodiments, the shielding frame may be rectangular with an opening, where the periphery of the circuit board is provided with magnetic shielding circuit slots.
Further, to facilitate connection between the shielding frame and the substrate, the substrate is provided with positioning marks for aligning the shielding frame. The positioning mark may be a groove, a small protrusion, or the like, and is not particularly limited in the present application.
On the basis of the above embodiments, in one embodiment of the present application, when the shielding component is a shielding frame, in order to promote the flexibility of packaging between the shielding component and the substrate, the shielding frame and the substrate are packaged in a SOP (Small Out-LINE PACKAGE, small outline package) packaging mode.
When the SOP package is adopted, the substrate pins 3 are distributed on both sides of the substrate 1, as shown in fig. 7, and the number of the substrate pins 3 is set according to the need, which is not limited by the present application. At this time, as shown in fig. 8, the circuit board 8 is distributed with non-direct connection lines 10, and the non-direct connection lines 10 extend toward the direction of the substrate pins. The position of the magnetic shielding circuit notch 13 is determined according to the shape of the shielding frame, and in fig. 8, the shielding frame is shown in an inverted U shape, and the side wall of the shielding frame is connected with the substrate through the magnetic shielding circuit notch.
On the basis of the above embodiment, in another embodiment of the present application, when the shielding component is a shielding frame, a QFP (Quad FLAT PACKAGE, square flat package) package form may be further used for packaging between the shielding frame and the substrate.
When QFP package is adopted, the substrate pins 3 are distributed around the substrate 1, as shown in fig. 9, and the number of the substrate pins 3 is set according to need, which is not limited by the present application. At this time, as shown in fig. 10, the circuit board 8 is distributed with non-direct connection lines 10, and the non-direct connection lines 10 extend to four directions where the substrate pins are located. The position of the magnetic shielding circuit notch 13 is determined according to the shape of the shielding frame, and in fig. 10, the shielding frame is shown in an inverted U shape, and the side wall of the shielding frame is connected with the substrate through the magnetic shielding circuit notch.
When the external magnetic field is large (the magnetic induction intensity is above 1000 gauss), the material of the shielding component is a soft magnetic material with high saturation magnetization in order to improve the shielding efficiency of the magnetic component.
The soft magnetic material with high saturation magnetization intensity can be silicon steel, pure iron, iron-nickel alloy, permalloy and the like, so that the shielding efficiency of the magnetic component can be improved by more than 70%. Wherein, high saturation magnetization refers to saturation magnetization >1.6T.
When the magnetic component shields the magnetic component from small external magnetic field and magnetic field generated by electromagnetic wave, other kinds of soft magnetic materials with saturation magnetization not greater than 1.6T can be selected as the material of the shielding frame 77 to generate shielding effect, such as low carbon steel, iron-aluminum alloy, and the like.
Referring to fig. 11, the present application further provides a method for packaging a magnetic component, including:
Step S101, fixing the chip on the upper surface of the substrate.
As an embodiment, when the substrate includes a non-magnetic shielding substrate body and a magnetic shielding pad plate located on an upper surface of the non-magnetic shielding substrate body, the fixing the chip on the upper surface of the substrate includes:
placing the magnetic shielding backing plate on the upper surface of the non-magnetic shielding substrate main body;
And fixing the chip on the upper surface of the magnetic shielding base plate.
It will be appreciated that when the substrate is an integrated magnetic shielding substrate, the chip may be directly secured to the upper surface of the substrate when the chip is connected to the substrate.
And S102, wiring and welding spots are arranged on the circuit board.
And step 103, welding the two ends of the circuit on the circuit board on the chip and the substrate pins respectively through the welding points.
One end of each circuit is connected with the chip through a welding spot, and the other end is connected with the pins of the substrate through the welding spot.
And step S104, arranging a shielding component to provide a magnetic shielding structure for the chip, so as to obtain the magnetic assembly.
It should be noted that after the shielding component is disposed, plastic packaging is further required, and the magnetic component is finally obtained by cutting and molding. The specific plastic packaging and rib cutting processes are well known to those skilled in the art, and the present application is not described in detail.
In order to improve the packaging efficiency of the magnetic components, batch packaging of a plurality of magnetic components can be performed simultaneously.
The magnetic component obtained by the packaging method of the magnetic component comprises a substrate, substrate pins, a chip, a circuit board, a shielding component and a circuit, wherein the chip, the circuit board and the shielding component are positioned on the upper surface of the substrate, the chip and the substrate pins are connected through welding spots and circuits, namely, the chip and the substrate pins are connected through the circuit board, the packaging height of the magnetic component can be reduced due to the fact that the thickness of the circuit board is thin, and gold wires are replaced by the circuit board, so that the influence of the gold wires on plastic packaging of plastic packaging materials is eliminated, and the reliability of the magnetic component is improved.
When the shielding member is a shielding frame disposed above the chip and connected to the substrate, referring to fig. 12, the method for packaging the magnetic assembly includes:
step S201, fixing the chip on the upper surface of the substrate.
And S202, arranging the magnetic shielding loop notch penetrating through the thickness on the circuit board, and arranging the circuit and the welding spots on the circuit board, wherein the circuit comprises a non-direct connection circuit.
It should be noted that the position of the notch of the magnetic shielding loop is not particularly limited in the application, so long as the arrangement of the circuit and the welding spot connected with the chip is not influenced.
When the circuit board is a flexible circuit film, the magnetic shielding loop notch penetrating through the thickness is arranged on the circuit board, and the magnetic shielding loop notch penetrating through the thickness is arranged on the flexible circuit film. When the circuit board is a printed circuit board, the step of arranging the magnetic shielding loop notch penetrating through the thickness on the circuit board comprises the step of arranging the magnetic shielding loop notch penetrating through the thickness on the printed circuit board.
And step 203, welding the two ends of the circuit on the circuit board on the chip and the substrate pins respectively through the welding points.
And S204, connecting the shielding frame with the substrate through a magnetic shielding loop notch on the circuit board so as to form a magnetic shielding structure for the chip, thereby obtaining the magnetic assembly.
Wherein the shielding frame is fixed on the substrate, and the shielding frame and the substrate can be connected by gluing or other modes.
The package form of the magnetic component is not particularly limited in the present application, as the case may be. For example, an SOP package, or a QFP package may be employed.
In order to facilitate connection between the shielding frame and the substrate, in one embodiment of the present application, before the shielding frame is connected to the substrate through the magnetic shielding loop notch on the circuit board, the method further includes:
Manufacturing a positioning mark on the substrate;
Correspondingly, the connecting the shielding frame with the substrate through the magnetic shielding loop notch on the circuit board comprises the following steps:
the shielding frame is aligned with the substrate by means of the positioning marks and is connected with the substrate through a magnetic shielding loop notch on the circuit board.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The magnetic component and the packaging method thereof provided by the application are described in detail above. The principles and embodiments of the present application have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present application and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.
Claims (9)
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