CN115397200B - Method for keeping temperature adaptability of terminal - Google Patents
Method for keeping temperature adaptability of terminal Download PDFInfo
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- CN115397200B CN115397200B CN202210986432.9A CN202210986432A CN115397200B CN 115397200 B CN115397200 B CN 115397200B CN 202210986432 A CN202210986432 A CN 202210986432A CN 115397200 B CN115397200 B CN 115397200B
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 115
- 230000017525 heat dissipation Effects 0.000 claims abstract description 112
- 239000011159 matrix material Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims description 90
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 62
- 229910021389 graphene Inorganic materials 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 23
- 238000009792 diffusion process Methods 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000010295 mobile communication Methods 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 21
- 230000005855 radiation Effects 0.000 description 7
- 238000005452 bending Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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Abstract
The invention discloses a method for keeping temperature adaptability of a terminal, and relates to the technical field of terminal heat dissipation; the terminal is subjected to temperature adaptability adjustment by utilizing the heating structure and the heat dissipation structure of the terminal, the terminal matrix and the screen are subjected to heat dissipation by utilizing the heat dissipation structure, the temperature information is analyzed by utilizing the heating structure, and the CPU device and the screen of the matrix are heated by utilizing the heating device under the low-temperature condition, so that the terminal temperature adaptability adjustment is realized.
Description
Technical Field
The invention discloses a method, relates to the technical field of terminal heat dissipation, and particularly relates to a method for keeping temperature adaptability of a terminal.
Background
Currently, terminal functions of mobile phones, tablet products or notebook products and the like of folding screen products are more and more powerful, and power consumption of CPU, bridge chips, chips and the like is also higher and higher. In the past, the terminal product mainly relies on the main board position matrix and the bottom cover to dissipate heat, and along with the increase of heat, the region has hardly met the heat dissipation requirement. In military mobile phones, flat products or notebooks, the operation at low temperature of-40 ℃ and even-45 ℃ is required, and problems can occur in low-temperature operation, such as the states of non-starting, slow operation and even stop frequently occur.
However, no perfect mode for adjusting the temperature of the terminal exists at present, so that the terminal can adapt to high-temperature heat dissipation and can ensure the working state at low temperature.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a method for keeping temperature adaptability of a terminal, which utilizes heat dissipation materials such as graphene and the like to realize the adaptability adjustment of high and low temperatures of a terminal product in a severe environment.
The specific scheme provided by the invention is as follows:
a method for keeping temperature adaptability of a terminal, which uses a heat dissipation structure and a heating structure of the terminal to adjust the temperature adaptability of the terminal,
The terminal comprises a screen and a matrix, the screen and the matrix are connected in a hinged manner, the heat dissipation structure comprises a chip heat conduction pipe, a chip heat dissipation piece, a heat dissipation material conduction piece, an eccentric heat pipe shaft and a graphene heat dissipation material layer, the heating structure comprises a chip heat conduction pipe, a temperature control chip, a screen temperature sensor, a device temperature sensor and a heating device,
And utilizing the heat dissipation structure to conduct matrix heat dissipation and screen heat dissipation, wherein the matrix heat dissipation is conducted: the heat generated by the CPU device of the terminal is conducted to the chip radiating piece and the radiating material conducting piece by using the chip conducting heat pipe on the substrate, the heat is conducted to the graphene radiating material layer by using the radiating material conducting piece, the eccentric heat pipe shaft is positioned at the joint of the screen and the substrate, and the graphene radiating material layer is tightly wound on the eccentric heat pipe shaft to perform heat axial diffusion; and (3) performing screen heat dissipation: the graphene heat dissipation material layer bypasses a part of the eccentric heat pipe shaft and is positioned between the screen and the terminal shell, so that heat conduction and diffusion of the screen are carried out;
And performing matrix heating and screen heating by using the heating structure, wherein matrix heating is performed: transmitting the collected CPU device temperature information to a temperature control chip through a device temperature sensor, analyzing according to the collected CPU device temperature information through the temperature control chip, controlling a heating device to heat according to an analysis result, and transmitting heat to the CPU device through a chip heat transmission pipe; screen heating is carried out: the acquired screen temperature information is transmitted to the temperature control chip through the screen temperature sensor, the temperature control chip analyzes according to the acquired screen temperature information, and the heating device is controlled to heat according to the analysis result and conduct heat to the screen through the graphene heat dissipation material layer and the eccentric heat pipe shaft.
Further, the method for maintaining temperature adaptability of the terminal includes the steps of:
judging whether the collected temperature information of the CPU device is lower than the starting temperature of the CPU device by the temperature control chip, if so, starting the heating device, conducting heat to the CPU device by the heating device by using the chip heat conducting pipe,
And acquiring the CPU device temperature information transmitted by the device temperature sensor in real time through the temperature control chip, and adjusting the heating device to heat according to the real-time CPU device temperature information.
Further, in the method for keeping temperature adaptability of the terminal, the screen heating includes:
judging whether the acquired screen temperature information is lower than the starting temperature of the screen through the temperature control chip, if so, starting the heating device, conducting heat to the screen through the heating device by utilizing the graphene heat dissipation material layer and the eccentric heat pipe shaft,
And acquiring screen temperature information transmitted by a screen temperature sensor in real time through a temperature control chip, and adjusting the heating device to heat according to the real-time screen temperature information.
Further, in the method for keeping temperature adaptability of the terminal, the graphene heat dissipation material layer is tightly wound around the eccentric heat pipe shaft, and the graphene heat dissipation material layer is clamped and fixed by using a torsion spring.
Further, in the method for keeping temperature adaptability of the terminal, the terminal is a notebook computer, a mobile communication device and a tablet computer.
The invention also provides a terminal for maintaining temperature adaptability, which utilizes a heat dissipation structure and a heating structure to adjust the temperature adaptability,
The terminal comprises a screen and a matrix, the screen and the matrix are connected in a hinged manner, the heat dissipation structure comprises a chip heat conduction pipe, a chip heat dissipation piece, a heat dissipation material conduction piece, an eccentric heat pipe shaft and a graphene heat dissipation material layer, the heating structure comprises a chip heat conduction pipe, a temperature control chip, a screen temperature sensor, a device temperature sensor and a heating device,
And utilizing the heat dissipation structure to conduct matrix heat dissipation and screen heat dissipation, wherein the matrix heat dissipation is conducted: the heat generated by the CPU device of the terminal is conducted to the chip radiating piece and the radiating material conducting piece by using the chip conducting heat pipe on the substrate, the heat is conducted to the graphene radiating material layer by using the radiating material conducting piece, the eccentric heat pipe shaft is positioned at the joint of the screen and the substrate, and the graphene radiating material layer is tightly wound on the eccentric heat pipe shaft to perform heat axial diffusion; and (3) performing screen heat dissipation: the graphene heat dissipation material layer bypasses a part of the eccentric heat pipe shaft and is positioned between the screen and the terminal shell, so that heat conduction and diffusion of the screen are carried out;
And performing matrix heating and screen heating by using the heating structure, wherein matrix heating is performed: transmitting the collected CPU device temperature information to a temperature control chip through a device temperature sensor, analyzing according to the collected CPU device temperature information through the temperature control chip, controlling a heating device to heat according to an analysis result, and transmitting heat to the CPU device through a chip heat transmission pipe; screen heating is carried out: the acquired screen temperature information is transmitted to the temperature control chip through the screen temperature sensor, the temperature control chip analyzes according to the acquired screen temperature information, and the heating device is controlled to heat according to the analysis result and conduct heat to the screen through the graphene heat dissipation material layer and the eccentric heat pipe shaft.
Further, said heating of the substrate in said terminal for maintaining temperature adaptability comprises:
judging whether the collected temperature information of the CPU device is lower than the starting temperature of the CPU device by the temperature control chip, if so, starting the heating device, conducting heat to the CPU device by the heating device by using the chip heat conducting pipe,
And acquiring the CPU device temperature information transmitted by the device temperature sensor in real time through the temperature control chip, and adjusting the heating device to heat according to the real-time CPU device temperature information.
Further, the screen heating in the terminal for maintaining temperature adaptability includes:
judging whether the acquired screen temperature information is lower than the starting temperature of the screen through the temperature control chip, if so, starting the heating device, conducting heat to the screen through the heating device by utilizing the graphene heat dissipation material layer and the eccentric heat pipe shaft,
And acquiring screen temperature information transmitted by a screen temperature sensor in real time through a temperature control chip, and adjusting the heating device to heat according to the real-time screen temperature information.
Further, in the terminal capable of keeping temperature adaptability, the graphene heat dissipation material layer is tightly wound on the eccentric heat pipe shaft and is clamped and fixed by the torsion spring.
Further, the terminal capable of keeping temperature adaptability is a notebook computer, a mobile communication device and a tablet computer.
The invention has the advantages that:
The invention provides a method for keeping temperature adaptability of a terminal, which utilizes a heating structure and a heat dissipation structure of the terminal to carry out temperature adaptability adjustment on the terminal, utilizes the heat dissipation structure to carry out heat dissipation on a terminal substrate and a screen, utilizes the heating structure to analyze temperature information, and utilizes a heating device to heat a CPU device and the screen of the substrate under the low-temperature condition so as to realize terminal temperature adaptability adjustment.
Drawings
FIG. 1 is a schematic side cross-sectional view of an embodiment of the present invention.
Fig. 2 is a schematic diagram of a motherboard matrix according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a liquid crystal display according to an embodiment of the invention.
Reference numerals illustrate: the heat dissipation device comprises a shell A1, a graphene heat dissipation material layer 2, a liquid crystal screen 3, a shell B4, a protective cover 5, an eccentric heat-pipe shaft 6, a shell C7, a chip heat dissipation piece 8, a flat plate heat dissipation material conduction piece 9, a chip heat conduction pipe 10, a main board 11, a temperature control chip 12, a high-temperature CPU device 13, a high-temperature device temperature sensor 14, a heat dissipation material internal heating device 15, a torsion spring 16, a liquid crystal screen temperature sensor 17 and a graphene heat dissipation material layer part 18 positioned at the position of the liquid crystal screen.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
The invention provides a method for keeping temperature adaptability of a terminal, which uses a heat dissipation structure and a heating structure of the terminal to adjust the temperature adaptability of the terminal,
The terminal comprises a screen and a matrix, the screen and the matrix are connected in a hinged manner, the heat dissipation structure comprises a chip heat conduction pipe, a chip heat dissipation piece, a heat dissipation material conduction piece, an eccentric heat pipe shaft and a graphene heat dissipation material layer, the heating structure comprises a chip heat conduction pipe, a temperature control chip, a screen temperature sensor, a device temperature sensor and a heating device,
And utilizing the heat dissipation structure to conduct matrix heat dissipation and screen heat dissipation, wherein the matrix heat dissipation is conducted: the heat generated by the CPU device of the terminal is conducted to the chip radiating piece and the radiating material conducting piece by using the chip conducting heat pipe on the substrate, the heat is conducted to the graphene radiating material layer by using the radiating material conducting piece, the eccentric heat pipe shaft is positioned at the joint of the screen and the substrate, and the graphene radiating material layer is tightly wound on the eccentric heat pipe shaft to perform heat axial diffusion; and (3) performing screen heat dissipation: the graphene heat dissipation material layer bypasses a part of the eccentric heat pipe shaft and is positioned between the screen and the terminal shell, so that heat conduction and diffusion of the screen are carried out;
And performing matrix heating and screen heating by using the heating structure, wherein matrix heating is performed: transmitting the collected CPU device temperature information to a temperature control chip through a device temperature sensor, analyzing according to the collected CPU device temperature information through the temperature control chip, controlling a heating device to heat according to an analysis result, and transmitting heat to the CPU device through a chip heat transmission pipe; screen heating is carried out: the acquired screen temperature information is transmitted to the temperature control chip through the screen temperature sensor, the temperature control chip analyzes according to the acquired screen temperature information, and the heating device is controlled to heat according to the analysis result and conduct heat to the screen through the graphene heat dissipation material layer and the eccentric heat pipe shaft.
According to the invention, the graphene heat dissipation material layer is utilized to realize heat dissipation in a screen fixing area; the auxiliary heat conduction of the graphene heat dissipation material layer is realized by utilizing the high-conduction eccentric heat pipe shaft, and the graphene heat dissipation material layer is prevented from being wrinkled and damaged in the rotating process by utilizing the eccentric heat pipe. The eccentric heat pipe shaft is utilized to realize that the bending angle of the graphene flat plate material is about 90 degrees, the material performance is ensured, and the scheme is utilized to realize that heat can efficiently pass through the hinge rotating position and rapidly and uniformly temperature to the screen and other areas. The heating circuit is utilized to solve the low-temperature working and heating requirements of the chip and the screen. The temperature sensor is utilized to monitor the temperature at any time, and the intelligent control of the heating circuit is realized by utilizing the main board temperature control chip.
In some embodiments of the present invention, the terminal may be a notebook computer, a mobile communication device, or a tablet computer. The notebook computer is taken as an example for description, but the method is not limited to the application of the notebook computer, and can be simultaneously applied to a folding screen mobile phone, a tablet or other fields with related requirements.
The terminal is a notebook computer, which comprises a liquid crystal screen 3 part, a base body part and a rotating shaft, wherein the liquid crystal screen 3 is hinged with the base body through the rotating shaft, the notebook computer also comprises an A shell 1, a B shell 4, a protective cover 5 and a C shell 7, referring to figures 1-3,
The heat radiation structure comprises a chip heat conduction pipe 10, a chip heat radiation piece 8, a heat radiation material conduction piece 9, an eccentric heat pipe shaft 6 and a graphene heat radiation material layer 2, the heating structure comprises a chip heat conduction pipe 10, a temperature control chip 12, a liquid crystal screen temperature sensor 17, a device temperature sensor 14 and a heating device 15,
When the matrix is heated, the CPU device 13 generates heat at the matrix part, the heat is simultaneously transmitted to the chip heat radiating piece 8 and the heat radiating material conducting piece 9 through the chip heat conducting pipe 10, the heat radiating material conducting piece 9 and the graphene heat radiating material layer 2 are attached and radiated, the graphene heat radiating material layer 2 is tightly wound on the eccentric heat pipe shaft 6 to conduct heat axial diffusion, the graphene heat radiating material layer 2 is clamped and fixed by the torsion spring 16, the liquid crystal screen 3 can rotate by 180 degrees, the graphene heat radiating material layer 2 is always tightly attached to the eccentric heat pipe shaft 6, the bending angle can be controlled to be about 90 degrees, the material performance is guaranteed to be good, and the heat transfer efficiency is high.
When the liquid crystal screen dissipates heat, after passing through the position of the rotating shaft, a liquid crystal screen temperature sensor 17 is installed on a graphene heat dissipation material layer part 18 between the liquid crystal screen 3 and the A shell 1, the temperature of the position of the liquid crystal screen is captured, a temperature control chip 12 is arranged near the central position of a CPU device 13, the highest temperature of the high-temperature device is captured, and meanwhile, the graphene heat dissipation material layer part 18 conducts and diffuses heat of the screen.
The B shell 4 and the protective cover 5 are used for fixing the liquid crystal screen and protecting the hinge part of the graphene heat-dissipating material layer 2. The main plate 11 is fixed to the C-case 7. When the matrix is heated, the temperature control chip 12 judges whether the acquired temperature information of the CPU device 13 is lower than the starting temperature of the CPU device 13, if the acquired temperature information is lower than the starting temperature, such as the environment temperature is too low, for example, -40 or-45 ℃, a heating device is started, the heating device 15 is used for conducting heat to the CPU device 13 by using the chip heat conducting pipe 10, the heating device can be positioned in the graphene heat radiating material layer 2,
Acquiring the temperature information of the CPU device 13 transmitted by the device temperature sensor 14 in real time through the temperature control chip 12, and adjusting the heating current of the heating device according to the temperature information of the CPU device 13 in real time;
After the heating device 15 in the graphene heat dissipation material layer 2 starts heating, part of heat is transferred to the high-temperature CPU device 13 by the chip heat conduction pipe 10 to heat the CPU; part of the heat radiation material can be transmitted to the graphene heat radiation material layer part 18 through the graphene heat radiation material layer 2 and the eccentric heat pipe shaft 6 to heat the inner shell of the liquid crystal display 3. When the CPU device 13 and the liquid crystal screen 3 reach the starting temperature, the temperature control chip 12 receives the instructions of the liquid crystal screen temperature sensor 17 and the device temperature sensor 14 and then transmits the instructions to the CPU, and the system is started. After the system is started stably, the temperature control chip 12 transmits an instruction to the heating device 15 in the graphene heat dissipation material layer 2, and heating is stopped, so that a heat dissipation system mode is entered.
According to the method, heat of the main board can be conducted to the liquid crystal screen fixing piece to dissipate heat, the eccentric heat pipe shaft 6 is utilized to assist the graphene heat dissipation material layer 2 to conduct heat transversely at the shaft position, heat transfer efficiency is greatly improved, the attaching force required by heat conduction of the graphene heat dissipation material layer 2 and the eccentric heat pipe shaft 6 can be ensured, and the situation that the graphene flat plate material is folded and damaged in the rotation process of the liquid crystal screen can be effectively ensured. The invention can meet the requirement that the bending angle of the material is controlled to be about 90 degrees within the 180-degree rotation angle of the liquid crystal screen, and ensures that the material has good performance and high heat transfer efficiency. The invention can utilize the high-temperature heat dissipation system, simultaneously solve the low-temperature work heating requirement of the chip and the liquid crystal screen, can utilize the temperature sensor to monitor the temperature of the liquid crystal screen and the chip at any time, and can utilize the temperature control chip to realize the intelligent regulation and control of the heating circuit.
The invention also provides a terminal for maintaining temperature adaptability, which utilizes a heat dissipation structure and a heating structure to adjust the temperature adaptability,
The terminal comprises a screen and a matrix, the screen and the matrix are connected in a hinged manner, the heat dissipation structure comprises a chip heat conduction pipe, a chip heat dissipation piece, a heat dissipation material conduction piece, an eccentric heat pipe shaft and a graphene heat dissipation material layer, the heating structure comprises a chip heat conduction pipe, a temperature control chip, a screen temperature sensor, a device temperature sensor and a heating device,
And utilizing the heat dissipation structure to conduct matrix heat dissipation and screen heat dissipation, wherein the matrix heat dissipation is conducted: the heat generated by the CPU device of the terminal is conducted to the chip radiating piece and the radiating material conducting piece by using the chip conducting heat pipe on the substrate, the heat is conducted to the graphene radiating material layer by using the radiating material conducting piece, the eccentric heat pipe shaft is positioned at the joint of the screen and the substrate, and the graphene radiating material layer is tightly wound on the eccentric heat pipe shaft to perform heat axial diffusion; and (3) performing screen heat dissipation: the graphene heat dissipation material layer bypasses a part of the eccentric heat pipe shaft and is positioned between the screen and the terminal shell, so that heat conduction and diffusion of the screen are carried out;
And performing matrix heating and screen heating by using the heating structure, wherein matrix heating is performed: transmitting the collected CPU device temperature information to a temperature control chip through a device temperature sensor, analyzing according to the collected CPU device temperature information through the temperature control chip, controlling a heating device to heat according to an analysis result, and transmitting heat to the CPU device through a chip heat transmission pipe; screen heating is carried out: the acquired screen temperature information is transmitted to the temperature control chip through the screen temperature sensor, the temperature control chip analyzes according to the acquired screen temperature information, and the heating device is controlled to heat according to the analysis result and conduct heat to the screen through the graphene heat dissipation material layer and the eccentric heat pipe shaft.
The content of the information interaction and the execution process between the components in the terminal is based on the same conception as the embodiment of the method of the present invention, and specific content can be referred to the description in the embodiment of the method of the present invention, which is not repeated here.
In the same way, the heating structure and the heat dissipation structure of the terminal can carry out temperature adaptability adjustment on the terminal, the heat dissipation structure is utilized to dissipate heat of the terminal substrate and the screen, the heating structure is utilized to analyze temperature information, and the heating device is utilized to heat the CPU device of the substrate and the screen under the low temperature condition, so that the terminal temperature adaptability adjustment is realized.
The above-described embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present invention, and are intended to be within the scope of the present invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. A method for keeping temperature adaptability of terminal is characterized in that the terminal is adjusted by utilizing a heat dissipation structure and a heating structure of the terminal,
The terminal comprises a screen and a matrix, the screen and the matrix are connected in a hinged manner, the heat dissipation structure comprises a chip heat conduction pipe, a chip heat dissipation piece, a heat dissipation material conduction piece, an eccentric heat pipe shaft and a graphene heat dissipation material layer, the heating structure comprises a chip heat conduction pipe, a temperature control chip, a screen temperature sensor, a device temperature sensor and a heating device,
And utilizing the heat dissipation structure to conduct matrix heat dissipation and screen heat dissipation, wherein the matrix heat dissipation is conducted: the heat generated by the CPU device of the terminal is conducted to the chip radiating piece and the radiating material conducting piece by using the chip conducting heat pipe on the substrate, the heat is conducted to the graphene radiating material layer by using the radiating material conducting piece, the eccentric heat pipe shaft is positioned at the joint of the screen and the substrate, and the graphene radiating material layer is tightly wound on the eccentric heat pipe shaft to perform heat axial diffusion; and (3) performing screen heat dissipation: a part of the graphene heat dissipation material layer which bypasses the eccentric heat pipe shaft is positioned between the screen and the terminal shell, so that heat conduction and diffusion of the screen are performed;
Heating the substrate and heating the screen by using the heating structure, wherein the substrate is heated: transmitting the collected CPU device temperature information to a temperature control chip through a device temperature sensor, analyzing according to the collected CPU device temperature information through the temperature control chip, controlling a heating device to heat according to an analysis result, and transmitting heat to the CPU device through a chip heat transmission pipe; screen heating is carried out: the acquired screen temperature information is transmitted to the temperature control chip through the screen temperature sensor, the temperature control chip analyzes according to the acquired screen temperature information, and the heating device is controlled to heat according to the analysis result and conduct heat to the screen through the graphene heat dissipation material layer and the eccentric heat pipe shaft.
2. A method of maintaining temperature flexibility in a terminal according to claim 1, wherein said performing substrate heating comprises:
judging whether the collected temperature information of the CPU device is lower than the starting temperature of the CPU device by the temperature control chip, if so, starting the heating device, conducting heat to the CPU device by the heating device by using the chip heat conducting pipe,
And acquiring the CPU device temperature information transmitted by the device temperature sensor in real time through the temperature control chip, and adjusting the heating device to heat according to the real-time CPU device temperature information.
3. A method of maintaining temperature adaptability of a terminal according to claim 1, characterized in that said performing screen heating comprises:
Judging whether the acquired screen temperature information is lower than the starting temperature of the screen through the temperature control chip, if so, starting the heating device, conducting heat to the screen through the heating device by utilizing the graphene heat dissipation material layer and the eccentric heat pipe shaft,
And acquiring screen temperature information transmitted by a screen temperature sensor in real time through a temperature control chip, and adjusting the heating device to heat according to the real-time screen temperature information.
4. A method of maintaining temperature adaptability of a terminal according to any one of claims 1-3, characterized in that the graphene heat dissipation material layer is tightly wound around an eccentric heat pipe shaft and clamped and fixed by a torsion spring.
5. A method of maintaining temperature adaptability of a terminal according to any one of claims 1-3, characterized in that the terminal is a notebook computer, a mobile communication device or a tablet computer.
6. A terminal for keeping temperature adaptability is characterized in that the terminal utilizes a heat dissipation structure and a heating structure to adjust the temperature adaptability,
The terminal comprises a screen and a matrix, the screen and the matrix are connected in a hinged manner, the heat dissipation structure comprises a chip heat conduction pipe, a chip heat dissipation piece, a heat dissipation material conduction piece, an eccentric heat pipe shaft and a graphene heat dissipation material layer, the heating structure comprises a chip heat conduction pipe, a temperature control chip, a screen temperature sensor, a device temperature sensor and a heating device,
And utilizing the heat dissipation structure to conduct matrix heat dissipation and screen heat dissipation, wherein the matrix heat dissipation is conducted: the heat generated by the CPU device of the terminal is conducted to the chip radiating piece and the radiating material conducting piece by using the chip conducting heat pipe on the substrate, the heat is conducted to the graphene radiating material layer by using the radiating material conducting piece, the eccentric heat pipe shaft is positioned at the joint of the screen and the substrate, and the graphene radiating material layer is tightly wound on the eccentric heat pipe shaft to perform heat axial diffusion; and (3) performing screen heat dissipation: a part of the graphene heat dissipation material layer which bypasses the eccentric heat pipe shaft is positioned between the screen and the terminal shell, so that heat conduction and diffusion of the screen are performed;
Heating the substrate and heating the screen by using the heating structure, wherein the substrate is heated: transmitting the collected CPU device temperature information to a temperature control chip through a device temperature sensor, analyzing according to the collected CPU device temperature information through the temperature control chip, controlling a heating device to heat according to an analysis result, and transmitting heat to the CPU device through a chip heat transmission pipe; screen heating is carried out: the acquired screen temperature information is transmitted to the temperature control chip through the screen temperature sensor, the temperature control chip analyzes according to the acquired screen temperature information, and the heating device is controlled to heat according to the analysis result and conduct heat to the screen through the graphene heat dissipation material layer and the eccentric heat pipe shaft.
7. A terminal for maintaining temperature flexibility as defined in claim 6, wherein said performing substrate heating comprises:
judging whether the collected temperature information of the CPU device is lower than the starting temperature of the CPU device by the temperature control chip, if so, starting the heating device, conducting heat to the CPU device by the heating device by using the chip heat conducting pipe,
And acquiring the CPU device temperature information transmitted by the device temperature sensor in real time through the temperature control chip, and adjusting the heating device to heat according to the real-time CPU device temperature information.
8. A terminal for maintaining temperature adaptability according to claim 6, wherein said performing screen heating comprises:
Judging whether the acquired screen temperature information is lower than the starting temperature of the screen through the temperature control chip, if so, starting the heating device, conducting heat to the screen through the heating device by utilizing the graphene heat dissipation material layer and the eccentric heat pipe shaft,
And acquiring screen temperature information transmitted by a screen temperature sensor in real time through a temperature control chip, and adjusting the heating device to heat according to the real-time screen temperature information.
9. A terminal for maintaining temperature adaptability according to any one of claims 6-8, characterized in that the graphene heat dissipation material layer is tightly wound around an eccentric heat pipe shaft and clamped and fixed by a torsion spring.
10. A terminal for maintaining temperature adaptability according to any one of claims 6-8, characterized in that the terminal is a notebook computer, a mobile communication device and a tablet computer.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826426A (en) * | 2014-03-10 | 2014-05-28 | 上海鼎为电子科技（集团）有限公司 | Mobile terminal and mobile terminal heat dissipating method |
| CN106535574A (en) * | 2016-11-30 | 2017-03-22 | 努比亚技术有限公司 | Mobile terminal heat radiation structure and mobile terminal |
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| JP3991395B2 (en) * | 1997-09-25 | 2007-10-17 | ソニー株式会社 | Electronics |
| US7656665B2 (en) * | 2008-06-16 | 2010-02-02 | Golden Sun News Techniques Co., Ltd. | Integrated heat-dissipating device for portable electronic product |
| JP5945047B1 (en) * | 2015-08-19 | 2016-07-05 | 株式会社フジクラ | Thermal diffusion plate for portable electronic devices |
| CN111913547A (en) * | 2020-08-10 | 2020-11-10 | 山东超越数控电子股份有限公司 | Method for achieving high-power-consumption fan-free uniform-temperature heat dissipation |
| CN215734356U (en) * | 2021-08-25 | 2022-02-01 | 深圳市华达丰电子有限公司 | Mobile phone motherboard with quick heat dissipation surface |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103826426A (en) * | 2014-03-10 | 2014-05-28 | 上海鼎为电子科技（集团）有限公司 | Mobile terminal and mobile terminal heat dissipating method |
| CN106535574A (en) * | 2016-11-30 | 2017-03-22 | 努比亚技术有限公司 | Mobile terminal heat radiation structure and mobile terminal |
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