CN115373492B - Heat abstractor for computer machine case - Google Patents

Abstract

The invention discloses a cooling device for a computer case, which comprises a case assembly, including a case, a case cover, a driving part, a rotating part and a first cooling part, the case cover is arranged on one side of the case, the driving part is arranged on the case, and the rotating part Rotationally connected to the inner top wall of the case, and cooperate with the driving part, the first cooling part is arranged on both sides of the rotating part; and the heat dissipation assembly is arranged in the case, including a mounting plate, a lifting part, a first transmission part, and a second transmission part and a second heat sink. The invention uses the cooling component to dissipate heat inside the chassis component, and can improve the heat dissipation efficiency when the temperature inside the chassis rises, maintain the temperature balance in the chassis, and greatly improve the service life of the internal electrical components.

Description

A cooling device for a computer case

technical field

The invention relates to the technical field of computer case heat dissipation, in particular to a heat dissipation device for a computer case.

Background technique

The chassis generally includes a shell, bracket, various switches on the panel, indicator lights, etc. The shell is made of steel plate and plastic, with high hardness, which mainly protects the internal components of the chassis. The bracket is mainly used to fix the main board, power supply and various components. Drive, the heat dissipation in the computer case in the prior art is generally only through the fan on the processor and the graphics card, and cooperates with the heat dissipation hole to achieve the heat dissipation effect, but when the power of the processor increases, the heat dissipation efficiency of the fan itself is limited. It will cause the internal temperature of the chassis to be high, which will easily cause damage to the electrical components in the chassis and greatly affect its service life.

Contents of the invention

The purpose of this section is to outline some aspects of embodiments of the invention and briefly describe some preferred embodiments. Some simplifications or omissions may be made in this section, as well as in the abstract and titles of this application, to avoid obscuring the purpose of this section, abstract and titles, and such simplifications or omissions should not be used to limit the scope of the invention.

In view of the above and/or problems existing in the heat dissipation of the existing computer case, the present invention is proposed.

Therefore, the problem to be solved by the present invention is that the heat dissipation in the computer case in the prior art is generally only through the fan on the processor and the graphics card, and cooperates with the cooling holes to achieve the heat dissipation effect, but when the power of the processor increases, its own The heat dissipation efficiency of the fan is limited, which will lead to high internal temperature of the chassis, which is easy to cause damage to the electrical components in the chassis, and greatly affects its service life.

In order to solve the above technical problems, the present invention provides the following technical solutions: a heat dissipation device for a computer case, which includes a case assembly and a heat dissipation assembly, including a case, a case cover, a driving part, a rotating part and a first heat dissipation part, the case The cover is arranged on one side of the case, the driving part is arranged on the case, the rotating part is rotatably connected to the inner top wall of the case, and cooperates with the driving part, and the first cooling part is arranged on the The two sides of the rotating part are arranged in the case, including a mounting plate, a lifting part, a first transmission part, a second transmission part and a second heat sink, the mounting plate is fixed on the inner wall of the case, and the lifting part The first transmission member is arranged on the top of the installation plate, the second transmission member is arranged on the bottom of the first transmission member, and the second heat sink is arranged on the installation plate. below the plate and cooperate with the second transmission member.

As a preferred solution of the cooling device for the computer case of the present invention, wherein: the driving member includes a driving motor, a driving rod and a worm, the driving motor is fixed on the outer top of the case, and the driving rod and the The output end of the driving motor is fixed, and the worm is fixed at the end of the driving rod and located in the casing.

As a preferred solution of the heat dissipation device for the computer case of the present invention, wherein: the rotating member includes a fixed shaft, a worm wheel and a connecting column, and the worm wheel is rotatably connected to the inner top wall of the case through the fixed shaft, and Engaged with the worm, the connecting column is fixed at the bottom of the worm wheel.

As a preferred solution of the heat dissipation device for a computer case in the present invention, wherein: the first heat dissipation element includes a connecting rod and a first fan, the connecting rod is hinged to both sides of the connecting column through a hinge seat, and the The first fan is fixed to the end of the connecting rod.

As a preferred solution of the cooling device for the computer case of the present invention, wherein: the lifting member includes a fixing tube, a slide bar, a first spring, a collar and a fixing ring, and the fixing tube is fixed on the top of the mounting plate On both sides, the sliding rod slides in the fixing tube, the two ends of the first spring are respectively fixed to the bottom end of the sliding rod and the inner wall of the fixing tube, the collar is sleeved on the connecting column, The fixing ring is fixed on the top of the collar.

As a preferred solution of the cooling device for the computer case of the present invention, wherein: the first transmission member includes a movable rod, a transmission rod and a fixed rod, the movable rod slides on the mounting plate, and the transmission rod It is fixed to the top of the movable rod, the fixed rod is fixed to both sides of the bottom of the collar, and the transmission rod is provided with a rotation groove, and the end of the fixed rod slides in the rotation groove.

As a preferred solution of the heat dissipation device for the computer case of the present invention, wherein: the first transmission part further includes a fixed ring, a temperature sensing package, a first electrode piece, a second electrode piece, an electromagnet and a limit block, The fixed ring is fixed on the movable rod, the temperature-sensing package is set on the fixed ring, the first electrode piece is set on the top of the temperature-sensing package, and the second electrode piece is set on the top of the temperature-sensing package. The bottom of the transmission rod, the electromagnet is fixed on the bottom end of the connecting column and the top end of the transmission rod, the limit block is fixed on the top end of the transmission rod, and the bottom end of the connecting column is provided with a Matching limit slot.

As a preferred solution of the heat dissipation device for the computer case of the present invention, wherein: the second transmission member includes a first ring, a first protrusion, a second ring, a second protrusion and a mounting rod, and the first The ring is fixed on the bottom end of the movable rod, the first protrusions are evenly distributed on the top of the first ring, the second ring is arranged under the mounting plate, and the second protrusions are evenly distributed on the top of the first ring. On one side of the second ring, the installation rod is fixed to the side of the second ring and is located below the first ring.

As a preferred solution of the heat dissipation device for the computer case of the present invention, wherein: the second heat dissipation member includes a second fan and a baffle, the second fan is fixed to the end of the installation rod, and the case cover A heat dissipation hole is opened on the top, and the baffle plate is rotatably connected to the outside of the case cover and is located outside the heat dissipation hole.

As a preferred solution of the heat dissipation device for the computer case of the present invention, wherein: the second heat dissipation element also includes a mounting pipe, a push rod, a second spring, a connecting ring and a trigger lever, and the mounting pipe is fixed on the The top wall of the heat dissipation hole, the ejector rod slides in the installation tube, the two ends of the second spring are respectively fixed to one end of the installation tube and the ejector rod, and the connecting ring is rotatably connected to the movable part through a bearing. On the rod, the trigger rod is fixed on the connecting ring, and a chute is opened in the push rod, and the trigger rod cooperates with the chute.

The beneficial effects of the present invention are: the present invention uses the heat dissipation component to dissipate heat inside the chassis assembly, and can improve the heat dissipation efficiency when the temperature inside the chassis rises, maintain the temperature balance in the chassis, and greatly improve the service life of its internal electrical components .

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort. in:

FIG. 1 is an overall structural diagram of a cooling device for a computer case.

FIG. 2 is a structural diagram of a heat dissipation component of a heat dissipation device for a computer case.

FIG. 3 is a cross-sectional view of a heat dissipation component of a heat dissipation device for a computer case.

FIG. 4 is an enlarged view of part A in FIG. 3 of the cooling device for a computer case.

FIG. 5 is an enlarged view of part B in FIG. 3 of the cooling device for a computer case.

FIG. 6 is a cross-sectional view from another perspective of the heat dissipation assembly of the heat dissipation device for the computer case.

FIG. 7 is an enlarged view of part C in FIG. 6 of the cooling device for a computer case.

FIG. 8 is an enlarged view of part D in FIG. 6 of the cooling device for a computer case.

FIG. 9 is another perspective view of the second cooling element of the cooling device for the computer case.

Detailed ways

In order to make the above objects, features and advantages of the present invention more obvious and comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

Second, "one embodiment" or "an embodiment" referred to herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. "In one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

Example 1

With reference to Fig. 1 and Fig. 2, be the first embodiment of the present invention, this embodiment provides a kind of cooling device for computer case, the cooling device for computer case comprises case assembly 100 and heat dissipation assembly 200, by heat dissipation assembly 200 to case assembly 100 internal cooling, greatly improving the cooling efficiency.

A cooling device for a computer case, which includes a case assembly 100, including a case 101, a case cover 102, a driver 103, a rotating part 104 and a first heat sink 105, the case cover 102 is arranged on one side of the case 101, and the driver 103 is provided On the case 101 , the rotating part 104 is rotatably connected to the inner top wall of the case 101 and cooperates with the driving part 103 . The first cooling part 105 is disposed on both sides of the rotating part 104 .

Both sides of the chassis 101 are provided with strip-shaped heat dissipation holes. In the initial state, the first heat dissipation element 105 is driven by the driving element 103 and the rotating element 104 to achieve a heat dissipation effect, and cooperates with the heat dissipation holes on both sides of the chassis 101. This is the first heat dissipation element. A method of cooling the computer under normal use.

Further, it also includes a heat dissipation assembly 200, which is arranged in the chassis 101, and includes a mounting plate 201, a lifter 202, a first transmission element 203, a second transmission element 204, and a second heat dissipation element 205, and the installation plate 201 is fixed on the inner wall of the chassis 101. , the lifting member 202 is arranged on the top of the installation plate 201, the first transmission member 203 is arranged on the installation plate 201, the second transmission member 204 is arranged on the bottom of the first transmission member 203, the second heat sink 205 is arranged under the installation plate 201, and Cooperate with the second transmission member 204 .

The mounting plate 201 has a rectangular shape and is fixed at the middle of the inner wall of the chassis 101. The lifting member 202 can move up and down. When it moves upward, the second heat sink 205 is driven by the rotating member 104, the first transmission member 203 and the second transmission member 204. It can further improve the heat dissipation efficiency inside the chassis 101. This is the second way of cooling the computer under overclocking or high-load work. Switching, the heat dissipation efficiency is better, and it has the effect of saving energy and reducing dust entering into the chassis 101 .

Example 2

With reference to Fig. 1～3, be the second embodiment of the present invention, this embodiment is based on last embodiment.

Specifically, the drive member 103 includes a drive motor 103a, a drive rod 103b and a worm 103c, the drive motor 103a is fixed on the top outside of the chassis 101, the drive rod 103b is fixed to the output end of the drive motor 103a, the worm 103c is fixed to the end of the drive rod 103b, and Located in the case 101.

Both sides of the drive motor 103a are fixed with mounting blocks, which are used to fix the drive motor 103a to prevent it from falling during use. The limit collar slides on the drive rod 103b, and one side of the limit collar is fixed to a limit. The positioning rod is used to limit the position of the driving rod 103b to prevent it from shifting during rotation, and the driving motor 103a drives the driving rod 103b and the worm 103c to rotate.

The rotating member 104 includes a fixed shaft 104a, a worm wheel 104b, and a connecting post 104c. The worm wheel 104b is rotatably connected to the inner top wall of the cabinet 101 through the fixed shaft 104a, and meshes with the worm 103c. The connecting post 104c is fixed at the bottom of the worm wheel 104b.

When the worm 103c rotates, it can drive the worm wheel 104b to rotate, so that the connecting post 104c follows the rotation of the worm wheel 104b.

The first heat sink 105 includes a connecting rod 105a and a first fan 105b, the connecting rod 105a is hinged to both sides of the connecting post 104c through a hinge seat, and the first fan 105b is fixed to the end of the connecting rod 105a.

The connecting rod 105a is on both sides of the connecting column 104c and can rotate. When the connecting column 104c rotates, the connecting rod 105a and the first fan 105b can follow it to rotate, thereby stirring the hot air in the cabinet 101 from multiple directions, making it It can more efficiently convert with external cold air, wherein the top of the first fan 105b has a replaceable battery for powering it. When the computer is turned on, the drive motor 103a can be turned on at the same time, and the battery will power the first fan 105b. Supplying power to make it rotate is an existing mature technology, and those skilled in the art can clearly understand this technical solution, so it will not be repeated here.

Example 3

Referring to Fig. 3 ~ 9, it is the third embodiment of the present invention, this embodiment is based on previous two embodiments.

Specifically, the lifting member 202 includes a fixed tube 202a, a sliding rod 202b, a first spring 202c, a collar 202d and a fixed ring 202e, the fixed tube 202a is fixed on both sides of the top of the mounting plate 201, and the sliding rod 202b slides in the fixed tube 202a, Both ends of the first spring 202c are respectively fixed to the bottom of the sliding rod 202b and the inner wall of the fixed pipe 202a, the collar 202d is sleeved on the connecting post 104c, and the fixing ring 202e is fixed to the top of the collar 202d.

The collar 202d can move up and down on the surface of the connecting column 104c, and drives the fixed ring 202e to move up and down. The top of the fixed ring 202e is in contact with the connecting rod 105a. When the fixed ring 202e moves upward, it can drive the connecting rod 105a and the first fan 105b upward. Rotate to adjust the fan angle of the first fan 105b. When the fixed ring 202e moves downward, the connecting rod 105a and the first fan 105b will deflect downward due to its own gravity, thereby making the fan angle of the first fan 105b The range is larger, and the flow of air in the chassis 101 is further stirred to make the heat dissipation effect better. The first spring 202c applies an upward thrust to the slide bar 202b and the collar 202d. In the first heat dissipation mode, the first spring 202c The thrust is the same as the gravity of the connecting rod 105a and the first fan 105b, so that it will not move up and down during the fanning process.

The first transmission member 203 includes a movable rod 203a, a transmission rod 203b and a fixed rod 203c. The movable rod 203a slides on the mounting plate 201, the transmission rod 203b is fixed to the top of the movable rod 203a, and the fixed rod 203c is fixed on both sides of the bottom of the collar 202d. The transmission rod 203b defines a rotation slot S, and the end of the fixed rod 203c slides in the rotation slot S. As shown in FIG.

The fixed rod 203c is L-shaped, one end of which is fixed to the collar 202d, and the other end slides in the rotating groove S. One side of the movable rod 203a is fixed with a limit bar. The top of the mounting plate 201 is provided with a groove along the movable rod 203a. When the rod 203a moves downward, the limiting bar can be inserted into the groove, thereby limiting the movable rod 203a, preventing it from rotating and affecting the stability of the fixed ring 202e. In the second heat dissipation state, when When the transmission rod 203b rotates, the two fixed rods 203c slide in the rotation slot S and can move up and down intermittently, thereby driving the fixed rod 203c and the fixed ring 202e to move up and down, so that the first fan 105b follows the rotation of the connecting rod 104c At the same time, it can move up and down to further agitate the flow of air in the chassis 101, so that the heat exchange efficiency with the outside air is higher.

The first transmission member 203 also includes a fixed ring 203d, a temperature sensing package 203e, a first electrode sheet 203f, a second electrode sheet 203g, an electromagnet 203h and a limit block 203i, the fixed ring 203d is fixed on the movable rod 203a, and the temperature sensing package 203e is set on the fixing ring 203d, the first electrode piece 203f is set on the top of the temperature sensing package 203e, the second electrode piece 203g is set on the bottom of the transmission rod 203b, and the electromagnet 203h is fixed on the bottom end of the connecting column 104c and the top end of the transmission rod 203b, limiting The positioning block 203i is fixed on the top of the transmission rod 203b, and the bottom end of the connecting column 104c is provided with a limiting groove M matching with the limiting block 203i.

The fixed ring 203d is a heat-conducting material, which can absorb the heat in the hot air moving upwards and conduct it upwards. The temperature-sensing package 203e has a material that can expand with heat and contract with cold. This is a prior art, and will not be repeated here. When the temperature in the chassis 101 is too high and the first heat dissipation state cannot meet the heat dissipation requirements, the temperature sensing package 203e will expand due to the heat and push the first electrode piece 203f to move upward, so that the first electrode piece The sheet 203f is in contact with the second electrode sheet 203g. At this time, the two electromagnets 203h are energized and attracted to each other, so that the transmission rod 203b moves upward until the limiting block 203i is inserted in the limiting groove M. How much is the limiting block 203i? and are evenly distributed on the top of the transmission rod 203b along the circumferential direction, so that the transmission rod 203b can follow the rotation of the connecting column 104c through the setting of the limit block 203i and the limit groove M, wherein the top of the fixed ring 203d is fixed with a mounting frame, the second An electrode piece 203f slides in the installation frame, thereby avoiding its offset during the up and down movement, and the working principles of the first electrode piece 203f, the second electrode piece 203g and the electromagnet 203h are all prior art, in I won't go into details here.

The second transmission member 204 includes a first ring 204a, a first protrusion 204b, a second ring 204c, a second protrusion 204d and a mounting rod 204e, the first ring 204a is fixed on the bottom end of the movable rod 203a, and the first protrusions 204b are Distributed on the top of the first ring 204a, the second ring 204c is arranged under the mounting plate 201, the second protrusions 204d are evenly distributed on one side of the second ring 204c, the mounting rod 204e is fixed to the side of the second ring 204c, and is located on the first ring 204a below.

When the movable rod 203a moves upwards, the first projection 204b and the second projection 204d are staggered, that is, the movable rod 203a and the first ring 204a can drive the second ring 204c and the installation rod 204e to rotate when the movable rod 203a is turned downward. When moving, the first projection 204b is separated from the second projection 204d, wherein, the limit ring and the limit rod are fixed on the installation rod 204e, which are used to limit it and prevent the installation rod 204e from being deflected during the rotation process. Move and so on.

The second heat sink 205 includes a second fan 205g and a baffle plate 205f. The second fan 205g is fixed to the end of the mounting rod 204e. A cooling hole K is provided on the case cover 102. The baffle plate 205f is rotatably connected to the outside of the case cover 102 and is located at The outside of the cooling hole K.

When the installation rod 204e rotates, it can drive the second fan 205g to rotate, and at the same time the baffle 205f is opened, and the second fan 205g blows air to the heat dissipation hole K. At this time, due to the Bernoulli principle, the second fan 205g will blow the air in the chassis 101 Due to the pressure, when the high temperature is blown outward, the external low temperature will enter the inside of the chassis 101 from other cooling holes, thereby greatly improving the heat dissipation efficiency in the chassis 101. The diameter of the hole K is larger than the diameter of the second fan 205g, so as to further improve the heat exchange efficiency. In the first heat dissipation mode, the baffle plate 205f blocks the heat dissipation hole K, so as to avoid excessive dust in the use of the chassis 101 into its interior.

The second heat sink 205 also includes a mounting tube 205a, a push rod 205b, a second spring 205c, a connecting ring 205d, and a trigger rod 205e. The mounting tube 205a is fixed on the inner top wall of the cooling hole K, and the push rod 205b slides in the mounting tube 205a. The two ends of the second spring 205c are respectively fixed with one end of the installation pipe 205a and the ejector rod 205b, the connecting ring 205d is rotatably connected to the movable rod 203a through a bearing, the trigger rod 205e is fixed on the connecting ring 205d, and a chute J is provided in the ejector rod 205b. , The trigger lever 205e cooperates with the chute J.

The trigger lever 205e is L-shaped, and the connecting ring 205d will not rotate with the movable rod 203a due to the setting of the bearing. position track, used to prevent the movable rod 203a from shifting in the process of moving up and down, the cooperation here is: when the movable rod 203a moves upwards, the trigger rod 205e moves with it, so that it breaks away from the chute J, this At the same time, the second spring 205c pulls the push rod 205b to move to the position of the baffle plate 205f until the baffle plate 205f is fully opened. When the movable rod 203a moves downward, the trigger rod 205e moves with it so that its bottom end is in the chute J slides inside, and drives the push rod 205b to move away from the baffle plate 205f. At this time, the baffle plate 205f will rotate downward due to its own gravity until the cooling hole K is blocked.

When in use, the device has two heat dissipation methods. The first heat dissipation method: under normal use, start the computer, and at the same time turn on the drive motor 103a and the first fan 105b, and drive the worm 103c through the drive motor 103a and the drive rod 103b. Rotate, and then drive the worm wheel 104b and the connecting column 104c to rotate through the worm 103c, so that the first fan 105b can continue to rotate during the process of blowing and dissipating heat, and then stir the hot air in the chassis 101 from multiple directions, so that it can be more efficient. Transition with cold outside air;

The second heat dissipation method: when the computer is overclocked or overloaded, the temperature in the chassis 101 will continue to rise at this time, and the hot air will move upwards, and the temperature sensing package 203e will expand under heat at this time, pushing the first electrode sheet 203f upwards move, so that the first electrode piece 203f is in contact with the second electrode piece 203g, at this time, the two electromagnets 203h are energized and attracted to each other, so that the transmission rod 203b moves upward until the limit block 203i is inserted in the limit groove M, and the transmission The rod 203b can follow the rotation of the connecting column 104c, and the trigger rod 205e is disengaged from the chute J at the same time. At this time, the second spring 205c pulls the push rod 205b to move to the position of the baffle plate 205f until the baffle plate 205f is fully opened, and then through two A fixed rod 203c moves up and down intermittently in the rotating slot S, thereby driving the fixed rod 203c and the fixed ring 202e to move up and down, so that the first fan 105b can move up and down while following the rotation of the connecting rod 104c, further agitating the inside of the chassis 101 The flow of air makes the heat exchange efficiency with the outside air higher. At the same time, the movable rod 203a and the first ring 204a can drive the second ring 204c and the installation rod 204e to rotate when they rotate, and then drive the second ring 204c through the installation rod 204e. The second fan 205g rotates, and the second fan 205g blows air to the heat dissipation hole K. At this time, due to the Bernoulli principle, the second fan 205g will blow the high temperature in the chassis 101 outward. Due to the pressure, the high temperature will be blown outward. While blowing, the external low temperature will enter the interior of the chassis 101 from other cooling holes, thereby greatly improving the heat dissipation efficiency in the chassis 101;

The device can properly adjust the heat dissipation intensity according to the temperature in the chassis 101 through the conversion of two heat dissipation methods, so while the heat dissipation effect is better, it has the characteristics of energy saving and environmental protection, and can prevent excessive dust from entering the chassis during daily use 101 inside.

It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention without limitation, although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be carried out Modifications or equivalent replacements without departing from the spirit and scope of the technical solution of the present invention shall be covered by the claims of the present invention.

Claims (5)

1. A cooling device for a computer case, characterized in that: comprising, The case assembly (100), including a case (101), a case cover (102), a driving part (103), a rotating part (104) and a first cooling part (105), the case cover (102) is arranged on the case (101), the driving part (103) is arranged on the chassis (101), the rotating part (104) is rotatably connected to the inner top wall of the chassis (101), and is connected with the driving part ( 103), the first cooling element (105) is arranged on both sides of the rotating element (104); and The heat dissipation assembly (200), arranged in the chassis (101), includes a mounting plate (201), a lifting member (202), a first transmission member (203), a second transmission member (204) and a second heat dissipation member ( 205), the installation plate (201) is fixed on the inner wall of the chassis (101), the lifting member (202) is arranged on the top of the installation plate (201), and the first transmission member (203) is arranged on the on the mounting plate (201), the second transmission member (204) is arranged at the bottom of the first transmission member (203), and the second heat sink (205) is arranged under the installation plate (201), And cooperate with the second transmission part (204), the lifting part (202) includes a fixed tube (202a), a slide rod (202b), a first spring (202c), a collar (202d) and a fixed ring (202e ), the fixed tube (202a) is fixed on both sides of the top of the mounting plate (201), the sliding rod (202b) slides in the fixed tube (202a), and the two ends of the first spring (202c) The bottom end of the sliding rod (202b) and the inner wall of the fixing pipe (202a) are respectively fixed, the collar (202d) is sleeved on the connecting column (104c), and the fixing ring (202e) is fixed on the top of said collar (202d); The driving member (103) includes a driving motor (103a), a driving rod (103b) and a worm (103c), the driving motor (103a) is fixed on the outer top of the chassis (101), and the driving rod (103b) fixed to the output end of the drive motor (103a), the worm (103c) is fixed to the end of the drive rod (103b) and located inside the chassis (101); The rotating member (104) includes a fixed shaft (104a), a worm wheel (104b) and a connecting column (104c), and the worm wheel (104b) is rotatably connected to the inner top of the chassis (101) through the fixed shaft (104a) wall, and engaged with the worm (103c), the connecting post (104c) is fixed at the bottom of the worm wheel (104b); The first transmission member (203) includes a movable rod (203a), a transmission rod (203b) and a fixed rod (203c), the movable rod (203a) slides on the installation plate (201), and the transmission rod (203b) is fixed to the top of the movable rod (203a), the fixed rod (203c) is fixed to both sides of the bottom of the collar (202d), the transmission rod (203b) is provided with a rotation slot (S), and the fixed The end of the rod (203c) slides in the rotation slot (S); The first transmission member (203) also includes a mounting ring (203d), a temperature sensing package (203e), a first electrode piece (203f), a second electrode piece (203g), an electromagnet (203h) and a limit block ( 203i), the installation ring (203d) is fixed on the movable rod (203a), the temperature sensing package (203e) is arranged on the installation ring (203d), and the first electrode sheet (203f) is arranged On the top of the temperature sensing package (203e), the second electrode sheet (203g) is arranged at the bottom of the transmission rod (203b), and the electromagnet (203h) is fixed at the bottom of the connecting column (104c) and The top end of the transmission rod (203b), the limit block (203i) is fixed on the top end of the transmission rod (203b), and the bottom end of the connecting column (104c) is provided with a hole that matches the limit block (203i). Limit slot (M). 2. The cooling device for a computer case according to claim 1, characterized in that: the first cooling element (105) includes a connecting rod (105a) and a first fan (105b), and the connecting rod (105a) passes through The hinge seat is hinged on both sides of the connecting column (104c), and the first fan (105b) is fixed to the end of the connecting rod (105a). 3. The cooling device for computer case according to claim 1 or 2, characterized in that: the second transmission member (204) comprises a first ring (204a), a first bump (204b), a second ring ( 204c), second bumps (204d) and installation rods (204d), the first ring (204a) is fixed on the bottom end of the movable rod (203a), and the first bumps (204b) are evenly distributed on the the top of the first ring (204a), the second ring (204c) is arranged under the mounting plate (201), and the second bumps (204d) are evenly distributed on one side of the second ring (204c) , the mounting rod (204d) is fixed to the side of the second ring (204c), and is located below the first ring (204a). 4. The cooling device for a computer case according to claim 3, characterized in that: the second cooling element (205) comprises a second fan (205f) and a baffle (205g), and the second fan (205f) It is fixed to the end of the installation rod (204d), and the case cover (102) is provided with cooling holes (K), and the baffle (205g) is rotatably connected to the outside of the case cover (102), and is located on the outside of the cooling holes (K) described above. 5. The heat dissipation device for computer case according to claim 4, characterized in that: the second heat dissipation element (205) further comprises a mounting pipe (205a), a push rod (205b), a second spring (205c), a connection Ring (205d) and trigger lever (205e), the installation tube (205a) is fixed on the inner top wall of the heat dissipation hole (K), and the ejector rod (205b) slides in the installation tube (205a), so Both ends of the second spring (205c) are respectively fixed to one end of the installation pipe (205a) and the push rod (205b), and the connecting ring (205d) is rotatably connected to the movable rod (203a) through a bearing, The trigger lever (205e) is fixed on the connecting ring (205d), and a chute (J) is opened in the push rod (205b), and the trigger lever (205e) cooperates with the chute (J) .