CN115356794A - Imprint curing equipment, manufacturing method and application of wafer-level micro-lens array - Google Patents

Abstract

The invention relates to imprint curing equipment for a wafer-level micro-lens array, a manufacturing method for the wafer-level micro-lens array and application of an editable UV curing light source in the field of nano imprinting.

Description

Imprinting and curing equipment, manufacturing method and application of wafer-level microlens array

technical field

The present invention relates to the field of nanoimprinting technology and the field of optical element manufacturing technology, in particular to an imprinting and curing device for wafer-level microlens arrays, a manufacturing method for wafer-level microlens arrays, and an editable UV curing light source in nanometer Applications in the field of embossing.

Background technique

Nanoimprint technology is a method for preparing nanoscale patterns, which has the advantages of simple process and low cost, and can be used in the preparation of semiconductor devices and the preparation of wafer-level microlens arrays. This technology is to imprint nanoscale patterns on UV glue through an imprinting mold, and then prepare semiconductor devices through curing and subsequent process steps.

In the prior art, a light source with a fixed wavelength is usually used to form a beam of fixed shape and size, and the UV glue within the irradiation range of the light source is cured at one time to form a microlens array manufactured in batches. UV glue is generally composed of single molecules or polymers, and is usually cured by ultraviolet light. Due to the material characteristics of nanoimprinting materials, the shrinkage rate is 1%-10%. In some cases, the shrinkage of UV glue causes a large loss of surface accuracy, especially in the case of large differences in product structure thickness. The loss of surface accuracy due to shrinkage will seriously affect the function and reliability of the product.

Contents of the invention

An object of the present invention is to provide an imprinting and curing device for wafer-level microlens arrays with controllable shrinkage, high surface precision, and high yield.

In order to achieve the above-mentioned purpose, the present invention provides an imprinting and curing device for a wafer-level microlens array, which includes an imprinting mold with a patterned microstructure, an editable UV curing light source, and a measurement module. The editable UV Curing light sources include:

UV lamps for emitting ultraviolet light;

Uniform light system, for uniformly irradiating the light emitted by the UV lamp on the digital micromirror chip;

The DLP projection module includes a programmable digital controller and a digital micromirror chip, and the DLP projection module is used to provide an illumination beam with adjustable light intensity, illumination pattern, illumination area and exposure time;

The measurement module is used to collect the shrinkage of the nanoimprint material, and the DLP projection module is configured to be able to adjust the light intensity of the irradiation beam, the irradiation pattern, and the irradiation pattern according to the shrinkage fed back by the measurement module. At least one parameter of area and exposure time.

Through the implementation of the above scheme, the present application realizes the digital control of the curing speed, curing energy, and curing depth of nanoimprinting to realize layer-by-layer curing and step-by-step curing. The shrinkage of the nano-imprint material can be controlled during the curing process, and the accuracy of the original model can be replicated to the maximum extent.

In one embodiment, the imprint curing device further includes a fixed platform, a pair of Z axes arranged along the optical axis, and a Z axis expansion and contraction compensation mechanism. The Z-axis telescopic compensation mechanism includes a driving motor and a pressure sensor, and the driving motor responds to feedback from the pressure sensor to adjust the height of the imprinting mold. Wherein, the pressure sensor is installed on the surface of one side of the imprinting mold close to the base, and the fixed end of the driving motor is installed on the fixed platform, and the movable end is fixedly connected to the imprinting mold, and the imprinting mold can be moved under the action of the driving motor. Move up and down along the optical axis.

In one embodiment, the measurement module collects the shrinkage of the nanoimprint material along the optical axis. In one embodiment, the measuring module is a distance meter installed on the top of the Z axis.

In one embodiment, the imprinting and curing equipment further includes a computer system, and the computer system is connected in communication with the measurement module, the DLP projection module and the Z-axis expansion compensation mechanism, and the computer system also includes A processor and a memory, a computer program is pre-stored in the memory, and the processor is configured to execute the computer program to realize: providing projection information to the DLP projection module to emit an illumination beam to make part of the curing the nanoimprint material; detecting the shrinkage of the nanoimprint material in the direction of the optical axis; adjusting the parameters of the projection information based on the shrinkage to ensure the shrinkage of the nanoimprint material Always less than or equal to the set shrinkage threshold, the parameters include one or more of light intensity, irradiation pattern, irradiation area and exposure time; multiple irradiations until the nanoimprint material is completely cured.

In one embodiment, the editable UV curing light source further includes an imaging system, and the imaging system is used for amplifying the light reflected by the digital micromirror chip before emitting it.

Another object of the present invention is to provide a method for manufacturing a wafer-level optical lens, which can realize controllable curing of the surface shape of the microlens and reduce curing defects.

In order to achieve the above object, the present invention provides a method for manufacturing a wafer-level microlens array, comprising the following steps:

1). Provide an imprint mold with a patterned microstructure, use the imprint mold to imprint the UV nanoimprint material coated on the transparent substrate, and the substrate is arranged perpendicular to an optical axis direction ;

2). Provide an editable UV curing light source;

3). Provide projection information, which includes the light intensity of the predetermined irradiation beam, irradiation pattern, irradiation area and exposure time information;

4). In response to the projection information, the editable UV curing light source gradually irradiates the UV nanoimprint material to gradually cure the UV nanoimprint material;

5). Separate the imprint mold from the UV nanoimprint material.

Further, the method also includes in step 3, collecting the shrinkage of the UV nanoimprint material in the direction of the optical axis in real time, and adjusting the projection information based on the shrinkage, so that the shrinkage The amount is always less than or equal to the set shrinkage threshold.

In one embodiment, when the shrinkage is greater than a predetermined shrinkage threshold, the parameters of the projection information are adjusted to reduce the curing speed of the UV nanoimprint material.

In one embodiment, when the shrinkage is greater than a predetermined shrinkage threshold, any one or two or more of light intensity, irradiation area and exposure time are reduced.

In one embodiment, in step 3, the gradual irradiation is to irradiate and cure the nanoimprint material layer by layer along the optical axis direction.

In one embodiment, in step 3, the gradual irradiation is to divide a plurality of regions on a plane perpendicular to the optical axis, and irradiate the nanoimprint material region by region.

In one embodiment, in step 3, the gradual irradiation is to irradiate several microstructures on the imprint mold in batches.

In one embodiment, in step 3, the irradiation area of the irradiation beam corresponding to each of the microstructures is gradually increased.

In one embodiment, in step 3, the irradiation beam corresponding to each of the microstructures is gradually irradiated from the center to the edge of each of the microstructures.

The present application also provides an application of an editable UV curing light source in the field of nanoimprinting. The editable UV curing light source is a DLP projection light source. Curing the nanoimprint material to achieve controlled shrinkage of the nanoimprint material.

In one embodiment, the curing speed and shrinkage of the nanoimprint material are adjusted by adjusting the irradiation area, irradiation intensity or irradiation pattern of the editable UV curing light source.

The advantage of this application is that, through the editable UV curing light source, the intensity, area, shape and other parameters of the irradiation beam can be adjusted to realize the controllable size, controllable pattern, controllable exposure time and controllable energy of the nanoimprint material curing process. At the same time, due to the gradual completion of the curing process, excessive material shrinkage will not occur, but while part of the material is curing, other parts of the nanoimprinting material still maintain fluidity, thereby filling the shrinkage part and making the overall shrinkage of the imprinted product The efficiency is reduced, and the accuracy of the original mold can be copied to the maximum extent, which is of great significance in the preparation process of the microlens array, avoiding the loss of surface accuracy caused by the imprinting process, reducing curing defects, increasing product reliability, and has a high repeatability.

Description of drawings

FIG. 1 is a schematic diagram of the optical path of the imprint curing equipment of the present application;

FIG. 2 is a schematic front view of changes in the curing area of the nanoimprint material;

Fig. 3 is a schematic top view of changes in the solidification area of the nanoimprint material;

Fig. 4 is a schematic structural view of curing a hybrid lens using conventional technology in Embodiment 1;

FIG. 5 is a schematic structural diagram of a hybrid lens obtained by using the manufacturing method of the present application in Embodiment 1;

Fig. 6 is a flow chart of the irradiation process for preparing a hybrid lens using the manufacturing method of the present application in Example 2.

Among them: 1. UV lamp; 2. Uniform light system; 3. Programmable digital controller; 4. Digital micromirror chip; 5. Imaging system; 6. Embossing mold; 7. Measurement module; 71. Fixed platform; 72 , Z axis; 8, nanoimprint material; 80, substrate; 81, first solidified layer; 82, second solidified layer; 83, third solidified layer; 91, uncontrolled boundary; 92, vacuum hole.

Detailed ways

In order to describe the technical content, structural features, goals and effects of the invention in detail, the technical solutions in the embodiments of the application will be described below in conjunction with the accompanying drawings in the embodiments of the application. Obviously, the described embodiments are only the present invention. Claim some of the examples, not all of them. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide detailed illustrations of various exemplary embodiments, or implementations, of the invention. However, various exemplary embodiments may be practiced without these specific details, or with one or more equivalent arrangements. Furthermore, the various exemplary embodiments may differ, but are not necessarily exhaustive. For example, the specific shape, configuration, and characteristics of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

Referring to FIG. 1 , an imprinting and curing device for a wafer-level microlens array includes an imprinting mold 6 with a patterned microstructure, an editable UV curing light source, a measurement module 7, a fixed platform 71, and a Z axis. The material of the substrate 80 to be processed is installed on the fixed platform 71, the substrate 80 is coated with the nanoimprint material 8, the imprint mold 6, the editable UV curing light source, and the measurement module 7 are arranged in sequence along the direction of the optical axis, usually the imprint mold perpendicular to the direction of the optical axis. Through the editable UV curing light source, the intensity, area, shape, exposure time and other parameters of the irradiation beam can be adjusted to realize the gradual curing of the curing process of the nano-imprinting material, so that the curing size, pattern and time of the nano-imprinting material can be controlled. Controllable, energy controllable.

Specifically, microstructures formed by several concave curved surfaces are usually formed on the molding module 6, and these concave curved surfaces are designed according to the surface shape of the microlens to be processed, and these microstructures are arranged in an array. When manufacturing hybrid lenses, these concave surfaces can also be composed of multiple surfaces with different curvatures. The forming module 6 is installed on a Z-axis telescopic compensation mechanism (the Z-axis direction is parallel to the optical axis direction), so that the forming module 6 can always adhere to the surface of the nanoimprint material under the condition of shrinkage.

The Z-axis telescopic compensation mechanism includes a driving motor installed on the fixed platform 71 and a pressure sensor installed on the lower surface of the forming module 6, and the forming mold 6 moves up and down relative to the Z-axis through the driving motor. A measuring module 7 is arranged on the top of the imprint curing equipment. The measurement module is used to measure the height change caused by the shrinkage of the nanoimprint material during the molding process of the molding module 6 , the faster the material shrinks, the greater the height change. The measured height data will be fed back to the computer system to adjust the curing parameters of the editable UV curing light source, so that the nanoimprint material can be cured at a uniform speed.

The editable UV curing light source of this application includes the following components.

UV lamp 1 is used to emit ultraviolet light, and the UV lamp can be an ultraviolet LED lamp or a UV lamp tube.

The uniform light system 2 is used to uniformly irradiate the light emitted by the UV lamp 1 on the digital micromirror chip. Optionally, the uniform light system is composed of a group of optical lenses.

The DLP projection module includes a programmable digital controller 3 and a digital micromirror chip 4 (DMD chip). The DLP projection module is used to provide an illumination beam with adjustable light intensity, adjustable illumination pattern and adjustable illumination area. The surface of the digital micromirror chip 4 has several mutually independent reflective micromirrors, which can divide the irradiation beam into countless small units, and each small unit can be independently and dynamically controlled, which can realize the controllable size of the nanoimprint material curing process , The projection pattern is controllable, the time is controllable, and the energy is controllable. The programmable digital controller 3 drives several reflective micromirrors to deflect in response to the external input digital signal, so that the irradiation intensity, irradiation area and irradiation pattern of the outgoing light can be changed. Optionally, the DLP projection module adopts TI's 1080P UV DMD product.

In one embodiment of the present application, the editable UV curing light source further includes an imaging system, which is used to amplify the light reflected by the digital micromirror chip and emit it.

Please continue to refer to FIG. 1 , the measurement module 7 is used to collect the shrinkage of the nanoimprint material 8 and feed back the shrinkage to the programmable digital controller 3 . The DLP projection module can adjust the light intensity of the irradiating beam, the irradiating pattern, the size of the irradiating area and the exposure time according to the amount of shrinkage fed back by the measuring module 7 . The intensity and time determine the exposure energy received by the glue. When the exposure energy locally received by the nanoimprint material 8 exceeds the critical exposure amount for material curing, the nanoimprint material will be cured.

In one embodiment of the present application, the measurement module 7 collects the shrinkage of the nanoimprint material 8 in the direction of the optical axis, and the measurement module 7 is specifically a high-precision distance meter.

In some other embodiments, the measurement module can also collect shrinkage of the nanoimprint material in a direction perpendicular to the optical axis, or simultaneously collect shrinkage in two directions along the optical axis and perpendicular to the optical axis.

In an embodiment of the present application, the imprinting and curing equipment of the present application further includes a computer system, which is respectively connected in communication with the measurement module 7, the DLP projection module and the Z-axis expansion compensation mechanism. The computer system also includes a processor and a memory in which computer programs are pre-stored. The processor is further configured to execute the computer program to:

Based on the projection signal, an irradiation beam is emitted to cure part of the nanoimprint material, and the switch and time of multiple reflective micromirrors are recorded in digital form in the projection signal;

Detect shrinkage of nanoimprinted materials;

Adjust the projection signal based on the amount of contraction, and change the parameters of the irradiation beam. The parameters include light intensity, exposure time, irradiation pattern, and irradiation area size; wherein, the irradiation pattern can be any shape such as a bar, a ring, a circle, a fan, or a rectangle;

Multiple irradiations are performed until the nanoimprint material is fully cured.

The shrinkage threshold is also pre-stored in the above-mentioned memory. When the real-time shrinkage fed back by the measurement module is greater than the shrinkage threshold, you can choose to reduce the light intensity of the irradiation beam, reduce the exposure time or reduce the irradiation area, or simultaneously reduce the light intensity, The exposure time and irradiation area can be reduced, and multiple parameters can also be adjusted comprehensively, so that the nanoimprint materials can be gradually cured in batches, layers, and partitions.

The working principle of the imprint curing equipment of this application is: the ultraviolet light emitted by the UV lamp is uniformly lighted by the uniform light system, so that the UV light is evenly distributed, and enters the DLP projection module, which switches and angles in real time. Adjustment, delay adjustment and other controls; so as to realize the real-time control of the pattern, light intensity and time of the irradiation beam. The measurement module can monitor the shrinkage of the nanoimprint material during the curing process in real time, and feed back the corresponding shrinkage amount to the DLP projection module to adjust the irradiation beam in real time to achieve closed-loop control.

In the manufacturing process of the microlens array, the imprinting and curing equipment of the present application can control the curing conditions of the nanoimprinting material more flexibly, control the surface shape of the lens more accurately, and realize the free-form surface by adjusting the irradiation beam. Processing greatly improves the scalability of the nanoimprint process, such as changing the exit shape of the irradiation beam to realize the partition curing of multiple microlenses; changing the energy of the irradiation beam to realize the partition control of the curing speed of multiple microlenses, etc. Wait.

The application also discloses a method for manufacturing a wafer-level microlens array, comprising the following steps:

1). Provide an imprinting mold with a patterned microstructure, and use the imprinting mold to imprint the UV nano-imprinting material coated on the transparent substrate 80;

2). Provide an editable UV curing light source, which can provide a UV irradiation beam with adjustable light intensity, irradiation pattern and irradiation area size;

2).Provide a projection information, the projection information includes the intensity information of the predetermined irradiation beam, exposure time, irradiation pattern and irradiation area information;

3). In response to the projection information, the editable UV curing light source gradually irradiates the UV nanoimprint material to gradually cure the UV nanoimprint material;

4). Separate the imprinting mold and UV nanoimprinting material.

In order to better control the surface shape of the microlens array, in the process of irradiating the nanoimprint material, the shrinkage of the UV nanoimprint material in the direction of the optical axis is also collected in real time, and the projection information is adjusted in real time based on the shrinkage, so that The shrinkage is always less than or equal to the set shrinkage threshold. The amount of shrinkage may be the amount of shrinkage along the direction of the optical axis, or the amount of shrinkage perpendicular to the direction of the optical axis, or include both the amount of shrinkage along the direction of the optical axis and the direction perpendicular to the optical axis.

In one embodiment of the present application, when the collected shrinkage is greater than the predetermined shrinkage threshold, the parameters of the projection information are automatically adjusted to reduce the curing speed of the UV nanoimprint material, such as lowering the light Intensity, reduced irradiated area, or reduced exposure time, or both reduced light intensity, reduced irradiated area, and reduced exposure time.

In step 3, the gradual irradiation is to irradiate and cure the nanoimprint material layer by layer along the optical axis direction. Referring to Figures 2 and 3, it is a simple application of the present application, in which only a schematic diagram of the curing process of one of the lens units in the microlens array is shown, Figure 2 is a front view of the curing process, and Figure 3 shows the nano A map of changes in the solidified area of the imprint material. The lens is made of polymer materials by embossing process, and is cured by layered and multiple irradiation with editable UV curing light source. Wherein, the substrate 80 is a transparent material such as glass or silicon substrate, and the nanoimprint material is irradiated for many times to form a first cured layer 81, a second cured layer 82, 83, and a third cured layer; the first cured layer 81 Partial shrinkage is formed after being cured. However, since there is still some uncured material on the top, the shrinkage part can be filled up. After multiple gradual curing, the nano-imprinted material is gradually cured, so that the surface properties of the lens can be controlled more precisely. , to achieve high-quality surface processing.

In other embodiments of the present application, the progressive irradiation can also be divided into multiple regions on a plane perpendicular to the optical axis, and irradiate the nanoimprint material region by region, and these regions can be circular, annular, strip-shaped or fan-shaped, etc. shape. In some embodiments, the progressive irradiation also steps the irradiation in a manner that is both layered and zoned. Alternatively, the progressive irradiation adopts batchwise irradiation of several microstructures.

Below in conjunction with two specific examples the manufacturing method of the present application is further described:

Embodiment 1, preparation has the wafer level microlens array of hybrid lens

Referring to Fig. 4, in the traditional scheme, the nano-imprint material 8 limits the UV glue on the glass substrate 80 through the imprint mold. Fix it on the platform 71 , and make the imprinting mold 6 cover the top of the glass base 80 downward. UV glue can be applied to one or both sides of the glass substrate. One-time curing by traditional UV light source, the shrinkage of the glue during the curing process is prone to appearance defects, such as vacuum holes 92 and uncontrolled borders 91, which seriously affect the yield and stability of the product.

The vacuum hole will affect the surface shape of the product, and then affect the function of the product. And the uncontrolled boundary at the edge can affect the assembly of the product. Under the reliability requirements such as high and low temperature impact, these appearance defects will cause problems such as cracking and delamination of the adhesive layer.

As shown in FIG. 5 , it is a schematic diagram of a microlens unit of a wafer-level microlens array processed by the manufacturing method of the present application, wherein the microlens is a hybrid lens, composed of a glass substrate 80 and a nanoimprint material 8, and the nanometer The imprinting material is UV glue. Manufactured by the imprint curing equipment of this application, the irradiation area and light intensity of the irradiation beam can be adjusted through the editable UV curing light source (for example, it is usually irradiated from the inside to the outside, or it can be set according to the shape of the lens), so as to ensure the nano-pressure in the curing area. There is no vacuum bubble in the printing material, and the edge is controllable, thereby improving reliability. The manufacturing process can adjust the feedback shrinkage through the measurement module to realize the automatic control of the whole process, which can meet the requirements of high yield and low cost. The embossing equipment and manufacturing method of the present application have more obvious advantages for large-size hybrid lenses, and can obtain hybrid lens products with controllable appearance quality.

Embodiment 2. In this embodiment, the manufacturing method of the present application is used to realize the control of the shape of the hybrid lens.

As shown in Figure 6, to manufacture a microlens array with a complex surface shape, when irradiating with an editable UV curing light source, firstly use a smaller area of irradiation beam to cure the center part of the surface shape, and the narrow beam can ensure that the surface is cured during the curing process. The Z-axis shrinkage rate is the smallest. With the change of the surface shape, the irradiation area is slowly increased. The slowed spot size is in a very thin area, which can control the shrinkage of the glue and avoid the problem of curing. During the curing process, the shrinkage of the glue can be continuously replenished from the outside world. During the curing process, the spot shape, energy size, and curing time of the editable UV curing light source are controlled according to the shrinkage change of the Z-axis shrinkage compensation and the real-time feedback of the measurement module, so as to ensure the accuracy of the surface shape.

The application also discloses the application of an editable UV curing light source in a nanoimprint curing device, that is, using a DLP projection light source to irradiate multiple times to gradually cure the nanoimprint material, so as to realize the controllable shrinkage of the nanoimprint material.

The editable UV curing light source can digitally control the curing speed, curing energy, and curing depth of nanoimprinted materials to achieve layer-by-layer curing and step-by-step curing, so that the shrinkage of nanoimprinted materials during the curing process can be controlled, and the maximum Copy the accuracy of the original mold, avoid the loss of surface accuracy caused by the imprinting process, reduce curing defects, and increase product reliability and repeatability.

The basic principles, main features and advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments. What are described in the above-mentioned embodiments and the description only illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will also have For various changes and improvements, the protection scope of the present invention is defined by the appended claims, description and their equivalents.

Claims (16)

1. An imprint curing apparatus for a wafer-level microlens array, comprising an imprint mold having a patterned microstructure, an editable UV curing light source, and a measurement module, wherein the editable UV curing light source comprises:

a UV lamp for emitting ultraviolet light;

the light homogenizing system is used for uniformly irradiating the light emitted by the UV lamp on the digital micro-mirror chip;

the DLP projection module comprises a programmable digital controller and a digital micro-mirror chip, and is used for providing an irradiation light beam with adjustable light intensity, irradiation pattern, irradiation area and exposure time;

the measurement module is used for collecting the shrinkage of the nanoimprint material, and the DLP projection module is configured to adjust at least one parameter of light intensity, irradiation pattern, irradiation area and exposure time of the irradiation light beam according to the shrinkage fed back by the measurement module.

2. The imprint-curing apparatus of claim 1, wherein: the imprinting and curing equipment further comprises a fixing platform and a Z-axis stretching compensation mechanism arranged on the fixing platform, and the imprinting mold is fixedly arranged on the Z-axis stretching compensation mechanism and can move along the direction of the optical axis.

3. The imprint-curing apparatus of claim 2, wherein: the measuring module collects shrinkage of the nano imprinting material in the optical axis direction.

4. The imprint-curing apparatus of claim 3, wherein: the imprint-curing apparatus further comprises a computer system communicatively coupled to the measurement module, the DLP projection module, and the Z-axis stretch compensation mechanism, respectively, the computer system further comprising a processor and a memory, the memory having a computer program pre-stored therein, the processor configured to execute the computer program to implement: providing projection information to the DLP projection module to emit an illumination beam to cure a portion of the nanoimprint material; detecting the shrinkage of the nano imprinting material in the optical axis direction; adjusting parameters of the projection information based on the shrinkage to ensure that the shrinkage of the nanoimprint lithography material is always less than or equal to a set shrinkage threshold, wherein the parameters comprise one or more than two of light intensity, irradiation pattern, irradiation area and exposure time; multiple irradiations are performed until the nanoimprint material is fully cured.

5. The imprint-curing apparatus of claim 1, wherein: the editable UV curing light source also comprises an imaging system, and the imaging system is used for amplifying the light reflected by the digital micro-mirror chip and then emitting the amplified light.

6. A method for manufacturing a wafer-level micro-lens array is characterized by comprising the following steps:

1) Providing an imprinting mold with a patterned microstructure, and imprinting the UV nano-imprinting material coated on a transparent substrate by using the imprinting mold, wherein the substrate is arranged in a direction vertical to an optical axis;

2) Providing an editable UV curing light source;

3) Providing projection information, wherein the projection information comprises light intensity, an irradiation pattern, an irradiation area and exposure time information of a preset irradiation light beam;

4) In response to the projection information, the editable UV curing light source progressively irradiates the UV nanoimprint material to gradually cure the UV nanoimprint material;

5) Separating the imprint mold from the UV nanoimprint material.

7. The manufacturing method according to claim 6, characterized in that: the method also comprises the steps of collecting the shrinkage of the UV nano-imprinting material in the optical axis direction in real time in step 3, and adjusting the projection information based on the shrinkage so that the shrinkage is always less than or equal to a set shrinkage threshold value.

8. The manufacturing method according to claim 7, characterized in that: and when the shrinkage is larger than a preset shrinkage threshold value, adjusting parameters of the projection information to reduce the curing speed of the UV nanoimprint material.

9. The manufacturing method according to claim 8, characterized in that: when the shrinkage is larger than the predetermined shrinkage threshold value, any one or more of the light intensity is reduced, the irradiation area is reduced and the exposure time is reduced.

10. The manufacturing method according to claim 7, characterized in that: in step 3, the step-wise irradiation is to irradiate and cure the nanoimprint material layer by layer along the optical axis direction.

11. The manufacturing method according to claim 7, characterized in that: in step 3, the progressive irradiation is to divide a plurality of regions on a plane perpendicular to an optical axis, and irradiate the nanoimprint material region by region.

12. The manufacturing method according to claim 7, characterized in that: in step 3, the progressive irradiation is batch irradiation of the plurality of microstructures on the imprint mold.

13. The manufacturing method according to claim 7, characterized in that: in step 3, the irradiation area of the irradiation beam corresponding to each of the microstructures is gradually increased.

14. The manufacturing method according to claim 13, characterized in that: in step 3, the irradiation light beam corresponding to each of the microstructures is gradually irradiated from the center to the edge of each of the microstructures.

15. The application of the editable UV curing light source in the nano-imprint curing equipment is characterized in that the editable UV curing light source is a DLP projection light source, and the application adopts the editable UV curing light source to gradually irradiate and cure the nano-imprint material step by step so as to realize the controllable shrinkage of the nano-imprint material.

16. Use according to claim 15, characterized in that: and adjusting the curing speed and shrinkage of the nano imprinting material by adjusting the irradiation area, irradiation intensity or exposure time of emergent light of the editable UV curing light source.

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