CN115347105A - Light-emitting device, preparation method thereof and backlight module - Google Patents

Abstract

The application discloses a light-emitting device, a preparation method thereof, and a backlight module. The light-emitting device includes a substrate, a light-emitting element, a package, and an optical structure; a reflective layer is arranged on the surface of the substrate; the light-emitting element is arranged on the substrate; the package is arranged on the substrate And cover the light-emitting part; the optical structure covers the package, the optical structure includes a first incident surface and a second incident surface in contact with the package, and the optical structure is used to reflect the light-emitting part irradiated to the first incident surface and the incident angle is smaller than the first angle Light rays, and light rays that irradiate the first incident surface and have an incident angle greater than or equal to the first angle through the light-emitting element; the optical structure is also used to reflect light that is irradiated by the light-emitting element to the second incident surface and has an incident angle greater than the second angle , and make the luminous element irradiate to the second incident surface and light rays whose incident angle is less than or equal to the second angle pass through. In the present application, the light emitting angle of the light is increased, and a larger light spot can be obtained, so that the backlight module can fully mix the light and ensure the luminous effect of the backlight module.

Description

Light-emitting device, manufacturing method thereof, and backlight module

technical field

The present application belongs to the field of display technology, and in particular relates to a light-emitting device, a preparation method thereof, and a backlight module.

Background technique

Television sets are an indispensable household appliance in people's daily life. With the continuous improvement of people's aesthetic needs, people's demand for ultra-thin TV sets is increasing.

In the related art, in order to meet the user's demand for ultra-thin TV sets, TV manufacturers often design the thickness of the backlight module to be reduced, especially the OD value of the backlight module (the distance between the diffuser plate and the light panel) As the OD value decreases, in order to make the backlight module emit light evenly, the LEDs need to be arranged more closely, that is, more LED light-emitting parts are required, which is not conducive to cost control.

Contents of the invention

Embodiments of the present application provide a light-emitting device, a manufacturing method thereof, and a backlight module, so as to increase the exit angle of light.

In the first aspect, the embodiment of the present application provides a light emitting device, including:

A substrate, the surface of the substrate is provided with a reflective layer;

A light emitting element is arranged on the substrate;

a package, disposed on the substrate and covering the light emitting element; and

An optical structure covering the package, the optical structure including a first incident surface and a second incident surface in contact with the package, the first incident surface is opposite to the substrate, and the second incident surface one end of which is connected to the first incident surface, and the other end is connected to the substrate, and the second incident surface is arranged around the package;

Wherein, the optical structure is used to reflect light rays irradiated by the light-emitting element on the first incident surface with an incident angle smaller than the first angle, and make the light-emitting element illuminate the first incident surface with an incident angle greater than or The light penetration equal to the first angle; the optical structure is also used to reflect the light irradiated by the light-emitting element to the second incident surface and the incident angle is greater than the second angle, and make the light-emitting element irradiate to the second incident surface The second incident surface and the light rays whose incident angle is less than or equal to the second angle pass through.

Optionally, the optical structure includes:

A first DBR film, the first DBR film is disposed on a side of the package away from the substrate, and a side of the first DBR film in contact with the package forms the first incident surface; and

A second DBR film, the second DBR film surrounds the outer peripheral wall of the package, and the side of the second DBR film in contact with the package forms the second incident surface.

Optionally, the first DBR film partially covers a side of the package away from the substrate.

Optionally, the first DBR film completely covers a side of the package away from the substrate.

Optionally, the first angle is 45°, and the first DBR film has a reflectivity greater than 90% for light rays that strike the first incident surface and have an incident angle less than 45°;

The second angle is 45°, and the second DBR film has a reflectivity of more than 90% for the light irradiated on the second incident surface with an incident angle greater than 45°.

Optionally, the reflection layer has a diffuse reflection structure.

In the second aspect, the embodiment of the present application also provides a method for manufacturing a light-emitting device, including:

providing a substrate;

fixing a plurality of light emitting elements on the substrate;

forming a plurality of encapsulations corresponding to the plurality of light-emitting elements on the substrate, each of the encapsulations covering the corresponding light-emitting elements;

An optical structure is formed on the surface of each package; the optical structure includes a first incident surface and a second incident surface in contact with the package, the first incident surface is arranged opposite to the substrate, and the first incident surface is arranged opposite to the substrate. One end of the two incident surfaces is connected to the first incident surface, the other end is connected to the substrate, and the second incident surface is arranged around the package; the optical structure is used to reflect the light from the light-emitting element to the Light rays with an incident angle smaller than the first angle on the first incident surface, and light rays with an incident angle greater than or equal to the first incident angle irradiated by the light-emitting element on the first incident surface to pass through; the optical structure It is also used to reflect the light irradiated by the light-emitting element on the second incident surface with an incident angle greater than the second angle, and make the light-emitting element irradiate on the second incident surface with an incident angle smaller than or equal to the second incident angle. Angle of light penetration.

Optionally, forming an optical structure on the surface of each package includes:

forming a second DBR film around each of said packages;

A first DBR film is formed on each of the packages.

In the third aspect, the embodiment of the present application also provides another light-emitting device, including:

A substrate, the surface of the substrate is provided with a reflective layer;

A light emitting element is arranged on the substrate;

a package, disposed on the substrate and covering the light emitting element; and

Optical structure, including:

The first optical structure covers the side of the package away from the substrate, the first optical structure is used to reflect the light irradiated by the light-emitting element and the incident angle is smaller than the first angle, and make the light-emitting element light rays impinging on itself with an incident angle greater than or equal to the first angle are transmitted; and

The second optical structure is connected to the substrate at one end and connected to the first optical structure at the other end, and the second optical structure is arranged around the package, and the second optical structure includes a plurality of microprisms, so The second optical structure is used for refracting the light irradiated by the light-emitting element to itself.

In a fourth aspect, the embodiment of the present application further provides a backlight module, including:

Backplane;

A light-emitting device is arranged on the backplane, and the light-emitting device is the light-emitting device as described in any one of the above-mentioned embodiments; and

The diffusion plate is disposed on a side of the light emitting device away from the back plate, and the diffusion plate is spaced apart from the light emitting device.

The light-emitting device of the embodiment of the present application can change the small-angle light into a large-angle light through the joint action of the optical structure and the reflective layer (with the normal line of the substrate as a reference), thereby increasing the light-emitting angle of the light, that is, a single light-emitting The component can emit a larger light spot. When the light-emitting device is applied to the backlight module, the backlight module can fully mix the light at a small mixing distance, so that the backlight module can emit light evenly and ensure the luminous effect of the backlight module. ; Moreover, since a single light-emitting element has a larger spot, the arrangement spacing of adjacent light-emitting elements on the substrate can be increased, which not only facilitates line arrangement and temperature control, but also reduces the number of light-emitting elements and reduces production costs .

Description of drawings

The technical solutions and beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application below in conjunction with the accompanying drawings.

FIG. 1 is a schematic structural diagram of an embodiment of a light emitting device provided in an embodiment of the present application.

FIG. 2 is a schematic diagram of an optical path state of the light emitting device in FIG. 1 .

FIG. 3 is a schematic diagram of another optical path state of the light emitting device in FIG. 1 .

Fig. 4 is a schematic structural diagram of another embodiment of a light emitting device provided by an embodiment of the present application.

FIG. 5 is a schematic diagram of an optical path state of the light emitting device in FIG. 4 .

FIG. 6 is a flowchart of a method for manufacturing a light-emitting device according to an embodiment of the present application.

FIG. 7 is a flow chart of specific steps in step 40 of the manufacturing method of the light emitting device in FIG. 6 .

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

In order to meet people's demand for ultra-thin TV sets, TV sets currently on the market are all developing in a thinner and lighter direction. In order to reduce the thickness of the TV, it is necessary to reduce the thickness of the backlight module, which leads to a decrease in the OD value of the light mixing distance (the distance between the lamp panel and the diffuser plate), making the light spots formed by the lamp beads smaller, resulting in Uneven light mixing affects the luminous effect of the backlight module. In order to ensure the uniform light emitted by the backlight module, the current method used by manufacturers is to reduce the arrangement distance between adjacent lamp beads on the light board, and it is necessary to increase The number of LED lamp beads leads to an increase in the production cost of the backlight module, and the larger the number of LED lamp beads, it is not convenient for the arrangement of the lines and the temperature control of the backlight module.

In order to solve the above problems, the embodiment of the present application provides a new light emitting device. Specifically, the light-emitting device is mainly used in display devices or equipment such as computers and televisions.

Please refer to FIG. 1 , in the embodiment of the present application, a light emitting device 10 includes a substrate 11 , a light emitting element 12 , a package 13 and an optical structure 14 .

The substrate 11 includes a base plate and a circuit structure disposed on the base plate, wherein the circuit structure may be printed on the base plate by a screen printing process, or may be formed on the base plate by a photolithography process. The substrate 11 can be a rigid circuit board or a flexible circuit board.

The substrate 11 may be strip-shaped, plate-shaped, or comb-shaped. The specific shape of the substrate 11 is not limited here.

The light-emitting element 12 is disposed on the substrate 11; understandably, the light-emitting element 12 is fixed on the substrate 11 and electrically connected to the circuit structure of the substrate 11. When the substrate 11 is energized, the light-emitting element 12 emits light.

In the embodiment of the present application, the light emitting element 12 is a Mini LED chip. The Mini LED chip can be fixed on the substrate 11 through a COB packaging process (ie, chip-on-board packaging technology), and be electrically connected to the substrate 11 .

The package 13 is disposed on the substrate 11 and covers the light emitting element 12 .

It can be understood that the material of the package 13 is a transparent material, so as to transmit the light emitted by the light emitting element 12 . Wherein, the material of the package 13 may be silica gel, PET (polyethylene terephthalate) and other materials.

It should be noted that since the light-emitting device 10 is applied to display devices such as computers and televisions, there are multiple light-emitting elements 12 , and a packaging element 13 is provided corresponding to each light-emitting element 12 . Since each light-emitting element 12 needs to be provided with an encapsulation 13 , in order to improve production efficiency, the encapsulation 13 can be molded on the substrate 11 through a molding process.

Wherein, the package 13 includes a first light-emitting surface (not marked) and a second light-emitting surface (not marked), the first light-emitting surface is arranged opposite to the substrate 11, one end of the second light-emitting surface is connected to the first light-emitting surface, and the second light-emitting surface The other end of the surface is connected to the substrate 11 , and the second light-emitting surface is arranged around the light-emitting element 12 .

The package 13 may have various shapes. For example, the package 13 may be in the shape of a prism or a cylinder, or in the shape of a truncated cone, or in the shape of a truncated prism. The specific shape of the package 13 is not limited here.

Since the light-emitting element 12 emits light outward at various angles, part of the light will irradiate the substrate 11 and cannot be used. In order to make full use of the light emitted by the light-emitting element 12, the surface of the substrate 11 is provided with a reflective layer 111. The reflective layer 111 is used to reflect and emit light. The light irradiated by the light-emitting element 12 to itself is used to make full use of the light emitted by the light-emitting element 12 to enhance the luminous brightness.

Wherein, the reflective layer 111 is capable of diffuse reflection.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the light-emitting device 10 further includes an optical structure 14 , the optical structure 14 covers the package 13 , and the optical structure 14 includes a first incident surface 143 and a second incident surface 144 in contact with the package 13 , The first incident surface 143 is disposed opposite to the substrate 11 , one end of the second incident surface 144 is connected to the first incident surface 143 , and the other end is connected to the substrate 11 , and the second incident surface 144 is disposed around the package 13 .

Wherein, the optical structure 14 is used to reflect the light irradiated by the light-emitting element 12 on the first incident surface 143 and the incident angle is smaller than the first angle, and to make the light irradiated by the light-emitting element 12 on the first incident surface 143 and the incident angle is greater than or equal to the first angle. light penetration; the optical structure 14 is also used to reflect the light that the light-emitting element 12 irradiates to the second incident surface 144 and whose incident angle is greater than the second angle, and to make the light-emitting element 12 irradiate to the second incident surface 144 with an incident angle less than or equal to Second angle of light penetration.

It should be noted that the optical structure 14 is used to reflect the light rays irradiated by the light-emitting element 12 onto the first incident surface 143 and the incident angle is smaller than the first angle, which means that the optical structure 14 is incident on the first incident surface 143. It has a high reflectivity and mainly plays a reflective role, rather than reflecting all the light in the angle range irradiated on the first incident surface 143, that is, most of the light in the angle range is reflected by the optical structure 14, and a small part of the light in the angle range The light in the angle range can still penetrate the optical structure 14; moreover, the light irradiated by the light-emitting element 12 to the first incident surface 143 can be the light directly irradiated by the light-emitting element 12 to the first incident surface 143, or it can be the light irradiated by the light-emitting element 12 The light is irradiated to the reflective layer 111 first, and then reflected by the reflective layer 111 to the first incident surface 143 .

Similarly, the optical structure 14 is also used to reflect the light irradiated by the light-emitting element 12 to the second incident surface 144 and the incident angle is greater than the second angle, which means that the optical structure 14 has the same effect on the light incident on the second incident surface 144 in this angle range. The higher reflectivity mainly plays a role of reflection, rather than reflecting all the light in this angle range irradiated to the second incident surface 144, that is, most of the light in this angle range is reflected by the optical structure 14, and a small part of the light in this angle range A range of light can still penetrate the optical structure 14; similarly, the light irradiated by the light-emitting element 12 to the second incident surface 144 can be the light directly irradiated by the light-emitting element 12 to the second incident surface 144, or it can be the light emitted by the light-emitting element 12 The light is first irradiated to the reflective layer 111 and then reflected to the second incident surface 144 by the reflective layer 111 .

Specifically, when the substrate 11 is energized, part of the light emitted by the light-emitting element 12 passes through the package 13 and irradiates to the first incident surface 143 and the second incident surface 144 of the optical structure 14, and part of the light irradiates to the reflective layer 111 and is reflected to the first incident surface 143 and the second incident surface 144 of the optical structure 14. An incident surface 143 or a second incident surface 144 .

As shown in FIG. 2, for the light rays incident on the first incident surface 143, the optical structure 14 reflects the light rays with an incident angle smaller than the first angle (such as light a), and passes the light rays with an incident angle greater than or equal to the first angle. (such as light b), where the light with an incident angle smaller than the first angle is reflected by the optical structure 14 and then reflected on the reflective layer 111 of the substrate 11. Since the reflective layer 111 can undergo diffuse reflection, the part of the light can be displayed in various forms. Angle is reflected, wherein there is a part of the incident angle of light reflected by the reflective layer 111 to the first incident surface 143 that is greater than or equal to the first angle (such as light a1), so that it can be emitted through the first incident surface 143 . It can be understood that, for the entire substrate 11 (with reference to the normal line of the substrate 11), light rays incident on the first incident surface 143 and having an incident angle smaller than the first angle are small-angle rays, and incident on the first incident surface 143 and The light with an incident angle greater than or equal to the first angle is a large-angle light, which is reflected twice by the optical structure 14 and the reflective layer 111 on the small-angle light, and part of the small-angle light can be changed into a large-angle light and emitted from the optical structure 14. Thereby increasing the light emitting angle of the light.

As shown in FIG. 3 , for the rays incident on the second incident surface 144, the optical structure 14 reflects the rays whose incident angle is greater than the second angle (such as light c, since the second incident surface 144 is perpendicular to the substrate 11, it hits the second incident surface 144 Light rays with two incident surfaces 144 and an incident angle greater than the second angle are mostly light rays reflected to the second incident surface 144 after the light-emitting element 12 irradiates the reflective layer 111), and light rays with an incident angle less than or equal to the second angle pass through ( Such as light d), wherein the light with an incident angle greater than the second angle is reflected by the optical structure 14 and then reflected to the first incident surface 143, at this time, the incident angle formed by this part of the light and the first incident surface 143 is smaller than the first angle, thus Reflected again by the optical structure 14 onto the reflective layer 111; due to the diffuse reflection of the reflective layer 111, this part of the light can be reflected at various angles, wherein there is part of the light that is reflected again by the reflective layer 111 to the first incident surface 143 and The angle of incidence it forms with the first incident surface 143 is greater than or equal to the first angle (such as light c1), so that it can be emitted through the first incident surface 143; there is another part of the light that is reflected again by the reflective layer 111 to the second incident surface 144 and the incident angle formed with the second incident surface 144 is less than or equal to the second angle (such as light c2 ), so that it can be emitted through the second incident surface 144 . It can be understood that, for the entire substrate 11 (with reference to the normal line of the substrate 11), light rays incident on the second incident surface 144 and having an incident angle greater than the second angle are small-angle rays, incident on the second incident surface 144 and The light rays whose incident angle is less than or equal to the second angle are large-angle light rays, which are reflected multiple times by the optical structure 14 and the reflective layer 111 on the small-angle light rays, and part of the small-angle light rays can be changed into large-angle light rays and emitted from the optical structure 14. Thereby increasing the light emitting angle of the light.

It should be noted that, as shown in FIG. 2 , for the small-angle light rays that first hit the first incident surface 143 and then reflect to the reflective layer 111 , after being reflected by the reflective layer 111 , some of the light rays are still reflected to the second incident surface. 144 and the included angle between it and the second incident surface 144 is less than or equal to the second angle (such as light a2), so that it can be emitted through the second incident surface 144, thereby also increasing the exit angle of the light.

In this way, the light-emitting device 10 of the embodiment of the present application can change the small-angle light into a large-angle light through the joint action of the optical structure 14 and the reflective layer 111 (with reference to the normal line of the substrate), thereby increasing the output of the light Angle, that is, a single light-emitting element 12 can emit a larger spot. When the light-emitting device 10 is applied to a backlight module, the backlight module can fully mix light at a small light mixing distance, so that the backlight module can emit light evenly. Ensure the luminous effect of the backlight module; moreover, since a single luminous element 12 has a larger light spot, the arrangement spacing of adjacent luminous elements 12 on the substrate 11 can be increased, which is not only convenient for line arrangement and temperature control, but also reduces The quantity of light-emitting elements 12 is reduced, and the production cost is reduced.

In the embodiment of the present application, please refer to FIG. 1 , the optical structure 14 includes a first DBR film 141 and a second DBR film 142 .

The first DBR film 141 is arranged on the side of the package 13 away from the substrate 11, and the first DBR film 141 is in contact with the package 13 to form the first incident surface 143; the second DBR film 142 surrounds the outer peripheral wall of the package 13, and the second A surface of the DBR film 142 in contact with the package 13 forms a second incident surface 144 .

Among them, the DBR film layer is a distributed Bragg reflector, which is formed by alternately stacking thin films with different refractive indices, and has a selective transmission effect on light rays at different angles in a certain wavelength band. By setting the first DBR film 141 and the second DBR film 142 to have different materials and refractive indices, the first DBR film 141 can reflect the light irradiated to the first incident surface 143 and the incident angle is smaller than the first angle, while the second DBR film The film 142 is capable of reflecting light irradiated to the second incident surface 144 and having a greater than the second angle.

Specifically, the first DBR film 141 and the second DBR film 142 are respectively coated on the first light-emitting surface and the second light-emitting surface of the package 13 through a coating process.

It can be understood that since the thickness of the first DBR film 141 and the second DBR film 142 is relatively thin, and their thickness does not exceed 0.1 mm, the embodiment of the present application coats the first DBR film 141 and the second DBR film 142 on the package 13 The surface, instead of being directly arranged on the outer surface of the light-emitting element 12, can enhance the adhesion between the first DBR film 141 and the second DBR film 142, and ensure that the first DBR film 141 and the second DBR film 142 are firmly connected.

In an embodiment of the present application, the first DBR film 141 partially covers the first incident surface 143 .

Wherein, the first DBR film 141 may be composed of a plurality of concentric rings arranged at intervals. Since the first DBR film 141 reflects most of the light that hits the first incident surface 143 and the incident angle is smaller than the first angle, it is easy to cause low brightness in the middle of the spot. By setting the first DBR film 141 as a plurality of concentric Circular rings, so that part of the light with an incident angle smaller than the first angle can penetrate through the gap between adjacent concentric rings, increasing the amount of light rays with an incident angle smaller than the first angle that penetrates from the first incident surface 143, and avoiding the brightness in the middle of the spot Relatively low brightness of the periphery of the spot forms dark shadows.

In another embodiment of the present application, the first DBR film 141 completely covers the first incident surface 143 .

It can be understood that by completely covering the first incident surface 143 with the first DBR film 141 , the molding of the first DBR film 141 can be facilitated and the production efficiency can be improved. At this time, in order to avoid lower brightness in the middle of the light spot, an incremental film (or coating) may be provided in the middle of the surface of the first DBR film 141 .

Specifically, in the embodiment of the present application, the first angle is 45°, and the first DBR film 141 has a reflectivity greater than 90% for light rays that irradiate the first incident surface 143 and the incident angle is less than 45°; the second angle is 45° °, the second DBR film 142 has a reflectivity greater than 90% for the light irradiated on the second incident surface 144 with an incident angle greater than 45°.

In order to enable diffuse reflection of light incident on the reflective layer 111 , in the embodiment of the present application, the reflective layer 111 has a diffuse reflective structure.

It can be understood that when the light-emitting element 12, the first DBR film 141 and the second DBR film 142 reflect the light to the reflective layer 111, the reflected light can be reflected in various angle directions through the reflection of the diffuse reflection structure, so that some of them are small Angle rays can reflect changes to large angle rays.

Wherein, the reflective layer 111 can be a reflective coating coated on the surface of the base plate, and the depressions or protrusions on the surface of the reflective coating form a diffuse reflection structure; the reflective layer 111 can also be a reflective sheet bonded to the surface of the base plate, and the reflective sheet is provided with Concave or protrude to form a diffuse reflective structure.

Please refer to FIG. 1 and FIG. 6 together. The embodiment of the present application also provides a method for manufacturing a light emitting device 10, including:

S10 : providing a substrate 11 .

The substrate 11 can be a rigid circuit board or a flexible circuit board; the substrate 11 includes a bottom plate and a circuit structure arranged on the bottom plate. Wherein, the shape of the substrate 11 may be a strip shape, a plate shape, or a comb shape, and the specific shape of the substrate 11 is not limited here.

Wherein, the surface of the substrate 11 is provided with a reflective layer 111, and the reflective layer 111 has a diffuse reflection structure, so that the reflective layer 111 can undergo diffuse reflection; wherein, the reflective layer 111 can be a reflective coating coated on the surface of the bottom plate, and the reflective coating surface The depressions or protrusions form a diffuse reflection structure; the reflective layer 111 can also be a reflective sheet bonded to the surface of the bottom plate, the reflective sheet is provided with an avoidance hole for the light-emitting element 12 to pass through, and the surface of the reflective sheet can be provided with depressions or protrusions. Form a diffuse reflective structure.

S20 : fixing a plurality of light emitting elements 12 on the substrate 11 .

Among them, the light-emitting part 12 is a MiniLED chip, and the MiniLED chip is fixed on the substrate 11 through the COB process (chip on board packaging technology), and is electrically connected with the circuit structure of the substrate 11. When the substrate 11 is powered on, the MiniLED chip emits light. light.

Wherein, the specific arrangement of the plurality of light-emitting elements 12 is correspondingly set according to the shape of the substrate 11, for example, when the shape of the substrate 11 is strip-shaped, the plurality of light-emitting elements 12 are arranged at intervals along the length direction of the substrate 11; When the shape is plate-like, a plurality of light-emitting elements 12 are arranged on the substrate 11 in a rectangular array.

S30: Form a plurality of encapsulations 13 corresponding to the plurality of light-emitting elements 12 on the substrate 11 , and each encapsulation 13 covers a corresponding light-emitting element 12 .

The material of the package 13 is a transparent material, so that the light emitted by the light emitting element 12 can pass through. Specifically, the material of the package 13 is silicone or PET.

When the light-emitting device 10 is applied to a large-size display device such as a television, since there are a large number of light-emitting elements 12, in order to improve production efficiency, a plurality of light-emitting elements 12 corresponding to the plurality of light-emitting elements 12 are molded on the substrate 11 using a molding process. Package 13.

Each package 13 includes a first light-emitting surface and a second light-emitting surface, the first light-emitting surface is opposite to the substrate 11, one end of the second light-emitting surface is connected to the first light-emitting surface, and the other end of the second light-emitting surface is connected to the substrate 11 , and the second light-emitting surface is arranged around the light-emitting element 12 , so that the package 13 completely covers the light-emitting element 12 , so that all the light emitted by the light-emitting element 12 is emitted through the package 13 .

The package 13 may have various shapes, for example, the package 13 may be in the shape of a prism or a cylinder, may also be in the shape of a truncated cone, or may be in the shape of a truncated prism.

S40: Form an optical structure 14 on the surface of each package 13; the optical structure 14 includes a first incident surface 143 and a second incident surface 144 in contact with the package 13, the first incident surface 143 is arranged opposite to the substrate 11, and the second incident surface One end of the surface 144 is connected to the first incident surface 143, the other end is connected to the substrate 11, and the second incident surface 144 is arranged around the package 13; the optical structure 14 is used to reflect the light-emitting element 12 to illuminate the first incident surface 143 and the incident angle Light rays with an angle smaller than the first angle, and light rays with an incident angle greater than or equal to the first incident angle irradiated by the light-emitting element 12 to the first incident surface 143 pass through; the optical structure 14 is also used to reflect the light-emitting element 12 to illuminate the second incident surface 144 and the incident angle is greater than the second angle, and the light emitting element 12 is irradiated to the second incident surface 144 and the incident angle is less than or equal to the second angle to pass through.

Specifically, please refer to FIG. 2, for the light rays incident on the first incident surface 143, the optical structure 14 reflects the light rays with an incident angle smaller than the first angle (such as light a), and the incident angle is greater than or equal to the first angle. The light rays penetrate (such as light b), wherein the light rays with an incident angle smaller than the first angle are reflected by the optical structure 14 and then reflected on the reflective layer 111 of the substrate 11. Since the reflective layer 111 can reflect diffusely, the part of the light rays can be It is reflected at various angles, and some of the light reflected by the reflective layer 111 to the first incident surface 143 has an incident angle greater than or equal to the first angle (such as light a1), so that it can be emitted through the first incident surface 143 . It can be understood that, for the entire substrate 11 (with reference to the normal line of the substrate 11), light rays incident on the first incident surface 143 and having an incident angle smaller than the first angle are small-angle rays, and incident on the first incident surface 143 and The light with an incident angle greater than or equal to the first angle is a large-angle light, which is reflected twice by the optical structure 14 and the reflective layer 111 on the small-angle light, and part of the small-angle light can be changed into a large-angle light and emitted from the optical structure 14. Thereby increasing the light emitting angle of the light.

Please refer to FIG. 3 , for the rays incident on the second incident surface 144, the optical structure 14 reflects the rays whose incident angle is larger than the second angle (such as light c, since the second incident surface 144 is perpendicular to the substrate 11, it hits the second incident surface 144 The incident surface 144 and the light rays whose incident angle is greater than the second angle are mostly the light rays reflected to the second incident surface 144 after the light-emitting element 12 irradiates the reflective layer 111), and the incident angles are less than or equal to the second angle. Light d), wherein the light with an incident angle greater than the second angle is reflected by the optical structure 14 and then reflected to the first incident surface 143, at this time, the incident angle formed by this part of the light and the first incident surface 143 is smaller than the first angle, thus being The optical structure 14 is reflected on the reflective layer 111 again; since the reflective layer 111 can reflect diffusely, the part of the light can be reflected at various angles, wherein some light is reflected to the first incident surface 143 again by the reflective layer 111 and its The incident angle formed with the first incident surface 143 is greater than or equal to the first angle (such as light c1), so that it can pass through the first incident surface 143; And the incident angle formed by it and the second incident surface 144 is smaller than or equal to the second angle (such as light c2 ), so that it can be emitted through the second incident surface 144 . It can be understood that, for the entire substrate 11 (with reference to the normal line of the substrate 11), light rays incident on the second incident surface 144 and having an incident angle greater than the second angle are small-angle rays, incident on the second incident surface 144 and The light rays whose incident angle is less than or equal to the second angle are large-angle light rays, which are reflected multiple times by the optical structure 14 and the reflective layer 111 on the small-angle light rays, and part of the small-angle light rays can be changed into large-angle light rays and emitted from the optical structure 14. Thereby increasing the light emitting angle of the light.

It should be noted that, for the small-angle light rays first incident on the first incident surface 143 and reflected to the reflective layer 111 through it, after being reflected by the reflective layer 111, some of the light rays are reflected to the second incident surface 144 and are related to the second incident surface 144. The included angle of the incident surface 144 is less than or equal to the second angle (such as the light a2 ), so that it can be emitted through the second incident surface 144 , thereby increasing the exit angle of the light.

In this way, in the manufacturing method of the light-emitting device provided in the embodiment of the present application, by setting the optical structure 14 to cover the package 13, the joint action of the optical structure 14 and the reflective layer 111 can change the small-angle light into a large-angle light (in order to The normal line of the substrate is used as a reference), thereby increasing the light emitting angle of the light, that is, a single light-emitting element 12 can emit a larger light spot, and when the light-emitting device 10 is applied to a backlight module, the backlight module can be used in a smaller The light is fully mixed at the light mixing distance, so that the backlight module emits light evenly and ensures the luminous effect of the backlight module; moreover, since a single light-emitting element 12 has a larger light spot, the distance between adjacent light-emitting elements 12 on the substrate 11 can be increased. The layout spacing not only facilitates circuit layout and temperature control, but also reduces the number of light-emitting elements 12 and reduces production costs.

Please refer to FIG. 7 , in the above method of manufacturing a light-emitting device, forming an optical structure 14 on the surface of each package 13 includes:

S41 : forming a second DBR film 142 around each package 13 .

Specifically, the second DBR film 142 is plated on the second light-emitting surface of the package 13 through a coating process, and the side of the second DBR film 142 in contact with the second light-emitting surface is the second incident surface 144 .

S42: forming a first DBR film 141 on each package 13 .

Specifically, the first DBR film 141 is coated on the first light-emitting surface of the package 13 through a coating process, and the surface of the first DBR film 141 in contact with the first light-emitting surface is the first incident surface 143 .

It can be understood that since the second DBR film 142 is arranged around the package 13, the second DBR film 142 is first coated on the second light-emitting surface of the package 13, and then the first DBR film 141 is coated on the first light-emitting surface of the package 13. The convenience of film coating can be improved, and at the same time, the fastness of connection between the first DBR film, the second DBR film and the package 13 can be ensured.

Please refer to FIG. 4 , in another embodiment of the present application, another light emitting device 10 is provided. In this embodiment, the light emitting device 10 includes a substrate 21 , a light emitting element 22 , a package 23 and an optical structure 24 .

The substrate 21 includes a base plate and a circuit structure disposed on the base plate, wherein the circuit structure may be printed on the base plate by a screen printing process, or may be formed on the base plate by a photolithography process. The substrate 21 can be a rigid circuit board or a flexible circuit board. The substrate 21 may be strip-shaped, plate-shaped, or comb-shaped, and the specific shape of the substrate 21 is not limited here.

The light-emitting element 22 is disposed on the substrate 21; understandably, the light-emitting element 22 is fixed on the substrate 21 and electrically connected to the circuit structure of the substrate 21. When the substrate 21 is energized, the light-emitting element 22 emits light.

The package 23 is disposed on the substrate 21 and covers the light emitting element 22 .

It can be understood that the material of the package 23 is a transparent material, so as to transmit the light emitted by the light emitting element 22 . Wherein, the material of the package 23 may be silica gel, PET (polyethylene terephthalate) and other materials.

It should be noted that since the light-emitting device is applied to display devices such as computers and televisions, there are multiple light-emitting elements 22 , and a packaging element 23 is provided corresponding to each light-emitting element 22 . Since each light-emitting element 22 needs to be provided with an encapsulation 23 , in order to improve production efficiency, the encapsulation 23 can be molded on the substrate 21 through a molding process.

Wherein, the package 23 includes a first light-emitting surface (not marked) and a second light-emitting surface (not marked), the first light-emitting surface is arranged opposite to the substrate 21, one end of the second light-emitting surface is connected to the first light-emitting surface, and the second light-emitting surface The other end of the surface is connected to the substrate 21 , and the second light-emitting surface is arranged around the light-emitting element 22 .

The package 23 may have various shapes. For example, the package 23 may be in the shape of a prism or a cylinder, or in the shape of a truncated cone, or in a shape of a truncated prism. The specific shape of the package 23 is not limited here.

Since the light-emitting element 22 emits light outward at various angles, part of the light will be irradiated on the substrate 21 and cannot be used. In order to make full use of the light emitted by the light-emitting element 22, the surface of the substrate 21 is provided with a reflective layer 211. The reflective layer 211 is used to reflect light. The light irradiated by the light-emitting element 22 to itself is used to make full use of the light emitted by the light-emitting element 22 to enhance the luminous brightness. Wherein, the reflective layer 211 can generate diffuse reflection.

Please refer to FIG. 5 , the optical structure 24 includes a first optical structure 241 and a second optical structure 242, the first optical structure 241 covers the side of the package 23 away from the substrate 21, the first optical structure 241 is used to reflect the light emitted by the light-emitting element 22 to The light itself and the incident angle is smaller than the first angle, and the light that makes the light-emitting element 22 illuminate itself and the incident angle is greater than or equal to the first angle penetrates; one end of the second optical structure 242 is connected to the substrate 21, and the other end is connected to the first optical structure 242. The structures 241 are connected, and the second optical structure 242 is arranged around the package 23 . The second optical structure 242 includes a plurality of microprisms 243 . The second optical structure 242 is used for refracting the light irradiated by the light-emitting element 22 to itself.

It should be noted that the first optical structure 241 is used to reflect the light rays irradiated by the light-emitting element 22 to itself and the incident angle is smaller than the first angle, which means that the first optical structure 241 has a relatively high performance for the light rays in the range of angles incident on itself. The reflectivity mainly plays a role of reflection, rather than reflecting all the light in this angle range irradiated on itself, that is, most of the light in this angle range is reflected by the first optical structure 241, while a small part of the light in this angle range can still be penetrate the first optical structure 241 .

Wherein, the first optical structure 241 may be a DBR reflective film (distributed Bragg reflector).

Specifically, when the substrate 21 is energized, part of the light emitted by the light-emitting element 22 passes through the package 23 and irradiates to the first optical structure 241 and the second optical structure 242, and part of the light irradiates to the reflective layer 211 and is reflected to the first optical structure 241. Or the second optical structure 242 .

As shown in FIG. 5, for the rays incident on the first optical structure 241, the first optical structure 241 reflects the rays whose incident angle is smaller than the first angle (such as light f), and reflects the rays whose incident angle is greater than or equal to the first angle. The light penetrates (such as light g), wherein the light with an incident angle smaller than the first angle is reflected by the optical structure 24 and then reflected on the reflective layer 211 of the substrate 21. Since the reflective layer 211 can undergo diffuse reflection, the part of the light can be Various angles are reflected, and the incidence angle of some light reflected by the reflective layer 211 to the first optical structure 241 is greater than or equal to the first angle (such as light f1 ), so that it can be emitted through the first optical structure 241 . It can be understood that, for the entire substrate 21 (with reference to the normal line of the substrate 21), light rays that strike the first optical structure 241 and whose incident angle is smaller than the first angle are small-angle light rays that strike the first optical structure 241 and The light with an incident angle greater than or equal to the first angle is a large-angle light, which is reflected twice by the first optical structure 241 and the reflective layer 211 on the small-angle light, and part of the small-angle light can be changed into a large-angle light from the first optical structure 241 and reflective layer 211. The structure 241 emits, thereby increasing the light emitting angle of the light.

For the light irradiated to the second optical structure 242 , since the second optical structure 242 includes a plurality of microprisms 243 , no matter the light (such as light h) directly irradiated by the light-emitting element 22 to the second optical structure 242 or through the reflective layer 211 For the light reflected to the second optical structure 242, the microprism 243 of the second optical structure 242 can refract these light outwards, thereby increasing the light exit angle of the light; The light at an angle, after being reflected by the first optical structure 241 to the reflective layer 211 and reflected again, part of the light is reflected to the second optical structure 242, and refracted outward by the microprism 243 of the second optical structure 242 (such as light f2 ), that is, through the joint cooperation of the first optical structure 241, the second optical structure 242 and the reflective layer 211, the small-angle light reflection originally incident on the first optical structure 241 is changed into a large-angle light emission from the second optical structure 242, Increased the exit angle of light.

In this way, in the light-emitting device 10 of this embodiment, the small-angle light is reflected by the first optical structure 241 (with the normal line of the substrate 21 as a reference), and the reflection of the small-angle light is changed into a large-angle light through the reflection of the reflective layer 211 It is emitted from the first optical structure 241, thereby increasing the light exit angle; the light emitted to the second optical structure 242 is also refracted outward by the multiple microprisms 243 of the second optical structure 242, which can also increase the light output angle. The light emitting angle of the light emitting device 10 increases the light emitting angle of the light through the joint cooperation of the first optical structure 241 and the second optical structure 242, so that a single light emitting element 22 emits a larger light spot, and the light emitting device 10 is applied to When the backlight module is used, the backlight module can fully mix the light at a small light mixing distance, so that the backlight module emits light evenly and ensures the luminous effect of the backlight module; Therefore, the arrangement spacing of adjacent light-emitting elements 22 on the substrate 21 can be increased, which not only facilitates circuit arrangement and temperature control, but also reduces the number of light-emitting elements 22 and reduces production costs.

The embodiment of the present application also provides a backlight module. In the embodiment of the present application, the backlight module includes a backplane, a light emitting device 10 and a diffusion plate; The specific structural composition of the device 10 will not be repeated here. The light emitting device 10 is disposed on the back plate, the diffusion plate is disposed on the side of the light emitting device 10 away from the back plate, and the diffusion plate and the light emitting device 10 are spaced apart.

Wherein, the backboard is used as a carrier to install and carry the light-emitting device 10. At the same time, the backboard is also used for heat dissipation to absorb the heat generated during the operation of the light-emitting device 10, so as to prevent the temperature of the light-emitting device 10 from being too high and affecting its normal operation. glow.

For a TV, usually its metal back shell is directly used as the back plate.

The diffuser plate has the function of diffusing light, so as to diffuse the light emitted by the light emitting device 10 so as to fully mix the light and make the light emitted by the backlight module uniform.

Since the light-emitting device 10 adopts the light-emitting device 10 based on the above-mentioned design concept, the light-emitting angle of light is increased, that is, a single light-emitting element 12 has a larger spot, and when the light-emitting device 10 is applied to a backlight module, the backlight module can The light is fully mixed at a small light mixing distance to ensure the luminous effect of the backlight module; moreover, since a single light-emitting element 12 has a larger light spot, the arrangement distance between adjacent light-emitting elements 12 can be increased, which is convenient for line arrangement. Cloth and temperature control, and reduce the number of light-emitting parts 12, thereby reducing production costs.

In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.

The light-emitting device provided by the embodiment of the present application, its preparation method, and the backlight module have been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present application. The description of the above embodiment is only for helping Understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as Limitations on this Application.

Claims (10)

1. A light-emitting device, comprising:

the surface of the substrate is provided with a reflecting layer;

the light-emitting piece is arranged on the substrate;

the packaging piece is arranged on the substrate and covers the light-emitting piece; and

the optical structure covers the packaging piece, the optical structure comprises a first incidence surface and a second incidence surface which are in contact with the packaging piece, the first incidence surface is arranged opposite to the substrate, one end of the second incidence surface is connected with the first incidence surface, the other end of the second incidence surface is connected with the substrate, and the second incidence surface is arranged around the packaging piece;

the optical structure is used for reflecting the light rays irradiated to the first incident surface by the light-emitting piece and having an incident angle smaller than a first angle, and enabling the light rays irradiated to the first incident surface by the light-emitting piece and having an incident angle larger than or equal to the first angle to penetrate through the optical structure; the optical structure is further used for reflecting the light rays which are irradiated to the second incident surface by the light-emitting piece and have the incident angle larger than a second angle, and enabling the light rays which are irradiated to the second incident surface by the light-emitting piece and have the incident angle smaller than or equal to the second angle to penetrate through the optical structure.

2. The light-emitting device of claim 1, wherein the optical structure comprises:

the first DBR film is arranged on one side, away from the substrate, of the packaging part, and the first incidence surface is formed on one surface, in contact with the packaging part, of the first DBR film; and

a second DBR film surrounding the package peripheral wall, the second DBR film forming the second plane of incidence with the side of the package in contact with the second plane of incidence.

3. The light-emitting device according to claim 2, wherein the first DBR film portion covers a side of the package member facing away from the substrate.

4. The light-emitting device according to claim 2, wherein the first DBR film completely covers a side of the package facing away from the substrate.

5. The light-emitting device according to claim 2, wherein the first angle is 45 °, and the reflectivity of the first DBR film to light rays incident on the first incident surface and having an incident angle of less than 45 ° is greater than 90%;

the second angle is 45 °, and the reflectivity of the second DBR film to light which is irradiated to the second incident surface and has an incident angle larger than 45 ° is larger than 90%.

6. The light-emitting device according to any one of claims 1 to 5, wherein the reflective layer has a diffuse reflection structure.

7. A method of making a light emitting device, comprising:

providing a substrate;

fixing a plurality of light emitting members on the substrate;

forming a plurality of packages on the substrate, wherein the packages correspond to the light-emitting pieces one by one, and each package covers the corresponding light-emitting piece;

forming an optical structure on the surface of each packaging piece; the optical structure comprises a first incidence surface and a second incidence surface which are in contact with the packaging piece, the first incidence surface is arranged opposite to the substrate, one end of the second incidence surface is connected with the first incidence surface, the other end of the second incidence surface is connected with the substrate, and the second incidence surface is arranged around the packaging piece; the optical structure is used for reflecting the light rays irradiated to the first incident surface by the light-emitting piece and having an incident angle smaller than a first angle, and enabling the light rays irradiated to the first incident surface by the light-emitting piece and having an incident angle larger than or equal to the first angle to penetrate through the optical structure; the optical structure is further used for reflecting the light rays which are irradiated to the second incident surface by the light-emitting piece and have the incident angle larger than a second angle, and enabling the light rays which are irradiated to the second incident surface by the light-emitting piece and have the incident angle smaller than or equal to the second angle to penetrate through the optical structure.

8. The method of claim 7, wherein the forming an optical structure on the surface of each package comprises:

forming a second DBR film around each of the packages;

a first DBR film is formed on each of the packages.

9. A light-emitting device, comprising:

the surface of the substrate is provided with a reflecting layer;

the light-emitting piece is arranged on the substrate;

the packaging piece is arranged on the substrate and covers the light-emitting piece; and

an optical structure comprising:

the first optical structure is used for reflecting the light rays irradiated to the first optical structure by the light-emitting piece and having an incidence angle smaller than a first angle, and enabling the light rays irradiated to the first optical structure by the light-emitting piece and having an incidence angle larger than or equal to the first angle to penetrate through the first optical structure; and

and one end of the second optical structure is connected with the substrate, the other end of the second optical structure is connected with the first optical structure, the second optical structure surrounds the packaging piece, the second optical structure comprises a plurality of microprisms, and the second optical structure is used for refracting light irradiated to the light of the light-emitting piece.

10. A backlight module, comprising:

a back plate;

a light emitting device disposed on the backplane, the light emitting device being the light emitting device of any one of claims 1 to 6 or the light emitting device of claim 9; and

and the diffusion plate is arranged on one side of the light-emitting device, which deviates from the back plate, and the diffusion plate and the light-emitting device are arranged at intervals.

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